[go: up one dir, main page]

WO2016061412A1 - Procédé de formation de faisceau active pour réseau de transducteurs ultrasonores piézoélectriques - Google Patents

Procédé de formation de faisceau active pour réseau de transducteurs ultrasonores piézoélectriques Download PDF

Info

Publication number
WO2016061412A1
WO2016061412A1 PCT/US2015/055827 US2015055827W WO2016061412A1 WO 2016061412 A1 WO2016061412 A1 WO 2016061412A1 US 2015055827 W US2015055827 W US 2015055827W WO 2016061412 A1 WO2016061412 A1 WO 2016061412A1
Authority
WO
WIPO (PCT)
Prior art keywords
pixel
cell
logic
array
mode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2015/055827
Other languages
English (en)
Inventor
Hao-Yen TANG
Yipeng Lu
Hrishikesh Vijaykumar PANCHAWAGH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/883,585 external-priority patent/US9995821B2/en
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Priority to CN201580055338.XA priority Critical patent/CN106794487B/zh
Priority to EP15787119.5A priority patent/EP3207497A1/fr
Publication of WO2016061412A1 publication Critical patent/WO2016061412A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/18—Methods or devices for transmitting, conducting or directing sound
    • G10K11/26—Sound-focusing or directing, e.g. scanning
    • G10K11/34—Sound-focusing or directing, e.g. scanning using electrical steering of transducer arrays, e.g. beam steering
    • G10K11/341—Circuits therefor
    • G10K11/346—Circuits therefor using phase variation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/20—Application to multi-element transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/50—Application to a particular transducer type
    • B06B2201/55—Piezoelectric transducer

Definitions

  • This disclosure relates to an array of piezoelectric ultrasonic transducers for imaging and liveness determination, and more particularly to techniques for active beam-forming of portions of the array as superpixels for 2-D beamforming. DESCRIPTION OF THE RELATED TECHNOLOGY
  • Thin film piezoelectric acoustic transducers are attractive candidates for numerous applications including biometric sensors such as fingerprint sensors, gesture detection, microphones and speakers, ultrasonic imaging, and chemical sensors.
  • biometric sensors such as fingerprint sensors, gesture detection, microphones and speakers, ultrasonic imaging, and chemical sensors.
  • Such transducers may include piezoelectric micromechanical ultrasonic transducers
  • PMUTs configured as a multilayer stack that includes a piezoelectric layer stack and a mechanical layer disposed over a cavity.
  • the piezoelectric layer stack may include a layer of piezoelectric material.
  • a respective upper and lower electrode layer may be disposed on or proximate to each of an upper and a lower surface of the piezoelectric layer.
  • the electrode layers may be patterned or unpatterned.
  • biometric sensors that include an array of PMUTs, each PMUT in the array corresponding to an individual pixel of a rendered image of, for example, a fingerprint.
  • the PMUTs may be actuated approximately simultaneously, a technique that may be referred to as plane wave excitation.
  • Figure 1 A illustrates an example of plane wave excitation in which each PMUT in an array 100 emits ultrasonic energy with substantially the same timing and phase of ultrasonic emissions originating from neighboring PMUTs.
  • the aggregate ultrasonic signal approximates a plane wave.
  • the acoustic pressure for such a plane wave is fairly uniform with respect to position across the PMUT array (Detail B).
  • a pixel array operating in a plane wave excitation and transmission mode has been shown to produce sufficient average acoustic pressure to provide a fingerprint image resolution on the order of 500 dpi (dots per inch).
  • One innovative aspect of the subject matter described in this disclosure relates to an apparatus that includes transceiver electronics and an array of pixels, each pixel including in-cell pixel logic and a piezoelectric micromechanical ultrasonic transducer (PMUT) element, each in-cell pixel logic being communicatively coupled with at least one adjacent pixel in the array, the transceiver electronics being communicatively coupled with the array and configured to operate the array in a selectable one of a first mode and a second mode. In the first mode, the array generates a substantially plane ultrasonic wave having a first acoustic pressure.
  • PMUT piezoelectric micromechanical ultrasonic transducer
  • the array In the second mode, the array generates, from at least one superpixel region, a focused beam having a second acoustic pressure that is substantially higher than the first acoustic pressure, each superpixel region including at least one inner pixel disposed in a central portion of the superpixel region and at least a first group of outer pixels disposed in an outer portion of the superpixel region.
  • the transceiver electronics is configured to operate the array by configuring at least one in-cell pixel logic.
  • the PMUT element may be disposed on a substrate, the substrate including thin-film transistor (TFT) circuitry.
  • TFT thin-film transistor
  • the TFT circuitry may be co-fabricated with the PMUT element.
  • the TFT circuitry may include the in-cell pixel logic.
  • configuring the at least one in-cell pixel logic may include, in the second mode, using a serial interface structure to clock in configuration information to each pixel and associate each pixel with a corresponding superpixel. In some examples, configuring the at least one in-cell pixel logic may include, in the second mode, designating each pixel as a center pixel or an outer pixel of the corresponding superpixel.
  • the in-cell pixel logic includes a 2-bit memory, a 2-bit decoder, and a 2-bit shift register.
  • the transceiver electronics may include at least one decoder configured to address and configure the in-cell pixel logic.
  • the at least one decoder may be configured to selectably designate each pixel as an inner pixel or an outer pixel of a corresponding superpixel.
  • the at least one decoder may be configured to selectably designate at least one pixel as an inner pixel.
  • each of the designated inner pixel and at least a second pixel adjacent to the designated inner pixel may include cell input interface logic and cell output interface logic; and the cell output interface logic of the designated inner pixel may be configured to send a wake -up signal to the cell input interface logic of the second pixel.
  • the cell input interface logic may be a seven input OR-gate configured to receive inputs from the decoder and from one or more adjacent pixels.
  • a non-transitory computer readable medium has software stored thereon, the software includes instructions for causing an apparatus to: operate an array of pixels, each pixel including in-cell pixel logic and a piezoelectric micromechanical ultrasonic transducer (PMUT) element, in a selectable one of a first mode and a second mode, each in-cell pixel logic being
  • a transceiver electronics is configured to operate the array by configuring at least one in-cell pixel logic.
  • operating the array In the first mode, operating the array generates a substantially plane ultrasonic wave having a first acoustic pressure.
  • operating the array In the second mode, operating the array generates, from at least one superpixel region, a focused beam having a second acoustic pressure that is substantially higher than the first acoustic pressure, each superpixel region including at least one inner pixel disposed in a central portion of the superpixel region and at least a first group of outer pixels disposed in an outer portion of the superpixel region.
  • configuring the at least one in-cell pixel logic may include, in the second mode, using a serial interface structure to clock in configuration information to each pixel and associate each pixel with a corresponding superpixel. In some examples, configuring the at least one in-cell pixel logic may include, in the second mode, designating each pixel as a center pixel or an outer pixel of the corresponding superpixel.
  • the transceiver electronics may include at least one decoder configured to address and configure the in-cell pixel logic. In some examples, the at least one decoder may be configured to selectably designate each pixel as an inner pixel or an outer pixel of a corresponding superpixel.
  • the at least one decoder may be configured to selectably designate at least one pixel as an inner pixel.
  • Each of the designated inner pixel and at least a second pixel adjacent to the designated inner pixel may include cell input interface logic and cell output interface logic.
  • the cell output interface logic of the designated inner pixel may be configured to send a wake -up signal to the cell input interface logic of at least the second pixel.
  • a method includes operating an array of pixels, each pixel including in-cell pixel logic and a piezoelectric micromechanical ultrasonic transducer (PMUT) element, in a selectable one of a first mode and a second mode, each in-cell pixel logic being communicatively coupled with at least one adjacent pixel in the array.
  • a transceiver electronics is configured to operate the array by configuring at least one in-cell pixel logic. In the first mode, operating the array generates a substantially plane ultrasonic wave having a first acoustic pressure.
  • the PMUT element may be disposed on a substrate, the substrate including thin-film transistor (TFT) circuitry co-fabricated with the PMUT element, the TFT circuitry including the in-cell pixel logic.
  • TFT thin-film transistor
  • configuring the at least one in-cell pixel logic may include, in the second mode, using a serial interface structure to clock in configuration information to each pixel and associate each pixel with a corresponding superpixel. In some examples, configuring the at least one in-cell pixel logic may include, in the second mode, designating each pixel as a center pixel or an outer pixel of the corresponding superpixel.
  • the transceiver electronics may include at least one decoder configured to address and configure the in-cell pixel logic. In some examples, the at least one decoder is configured to selectably designate each pixel as an inner pixel or an outer pixel of a corresponding superpixel.
  • the at least one decoder may be configured to selectably designate at least one pixel as an inner pixel; each of the designated inner pixel and at least a second pixel adjacent to the designated inner pixel may include cell input interface logic and cell output interface logic; and the cell output interface logic of the designated inner pixel may be configured to send a wake- up signal to the cell input interface logic of at least the second pixel.
  • an apparatus includes an array of pixels, each pixel including in-cell pixel logic and a piezoelectric micromechanical ultrasonic transducer (PMUT) element, each in-cell pixel logic being
  • the array In the first mode, the array generates a substantially plane ultrasonic wave having a first acoustic pressure. In the second mode, the array generates, from at least one superpixel region, a focused beam having a second acoustic pressure that is substantially higher than the first acoustic pressure, each superpixel region including at least one inner pixel disposed in a central portion of the superpixel region and at least a first group of outer pixels disposed in an outer portion of the superpixel region.
  • Figure 1 A illustrates an example of plane wave excitation.
  • Figures IB- ID illustrate cross-sectional views of various configurations of PMUT ultrasonic sensor arrays.
  • Figure 2 illustrates a PMUT array according to an implementation.
  • Figure 3 shows a portion of a PMUT array according to some
  • Figure 4 illustrates an example of beam forming for a superpixel region.
  • Figure 5 illustrates an example acoustic pressure map for a superpixel of PMUT elements operated in a beamforming mode.
  • Figure 6 illustrates a portion of an arrangement of pixels according to an implementation.
  • Figure 7 illustrates a serial interface structure that may be used to clock in beamforming configuration information to each pixel, according to an
  • Figure 8 illustrates another technique for operating an array of pixels by configuring in-cell pixel logic, according to an implementation.
  • Figure 9 illustrates additional details of operating an array of pixels by configuring in-cell pixel logic, according to an implementation.
  • Figure 10 illustrates an example of a process flow for operating an array of pixels in a selectable one of a first mode and a second mode.
  • the described implementations may be included in or associated with a variety of electronic devices such as, but not limited to: mobile telephones, multimedia Internet enabled cellular telephones, mobile television receivers, wireless devices, smartphones, Bluetooth® devices, personal data assistants (PDAs), wireless electronic mail receivers, hand-held or portable computers, netbooks, notebooks, smartbooks, tablets, handwriting digitizers, fingerprint detectors, printers, copiers, scanners, facsimile devices, global positioning system (GPS) receivers/navigators, cameras, digital media players (such as MP3 players), camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, electronic reading devices (e.g., e-readers), mobile health devices, computer monitors, auto displays (including odometer and speedometer displays, etc.), cockpit controls and/or displays, camera view displays (such as the display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, microwaves, refrigerator
  • teachings herein also may be used in applications such as, but not limited to, electronic switching devices, radio frequency filters, sensors, accelerometers, gyroscopes, motion-sensing devices, fingerprint sensing devices, gesture detection, magnetometers, inertial components for consumer electronics, parts of consumer electronics products, varactors, liquid crystal devices, electrophoretic devices, drive schemes, manufacturing processes and electronic test equipment.
  • electronic switching devices radio frequency filters
  • sensors accelerometers
  • gyroscopes motion-sensing devices
  • fingerprint sensing devices gesture detection
  • magnetometers magnetometers
  • inertial components for consumer electronics, parts of consumer electronics products, varactors, liquid crystal devices, electrophoretic devices, drive schemes, manufacturing processes and electronic test equipment.
  • the systems, methods and devices of the disclosure each have several innovative aspects, no single one of which is solely responsible for the desirable attributes disclosed herein.
  • the subject matter described in this disclosure can be implemented in a piezoelectric micromechanical ultrasonic transducer (PMUT) certain aspects of which have been described in United States Patent Application No. 14/569,280, filed on December 12, 2014 and entitled "MICROMECHANICAL ULTRASONIC TRANSDUCERS AND DISPLAY," and in United States Patent Application No. 14/569,256, filed on December 12, 2014 and entitled
  • PIEZOELECTRIC ULTRASONIC TRANSDUCER AND PROCESS each assigned to the assignee of the present invention and hereby incorporated by reference into the present application in its entirety for all purposes.
  • One innovative aspect of the subject matter described in this disclosure can be implemented by a PMUT array and associated electronics capable of performing, nearly simultaneously, both imaging of surface topography of a finger and imaging of subdermal tissue of the finger.
  • Finger surface topography may consist of ridges, valleys and minutia that are typically used by fingerprint matching algorithms.
  • Imaging of the subdermal tissue may provide additional three-dimensional (3-D) fingerprint information and may be used to provide additional security for authentication/verification. Further, 3-D fingerprint images may serve as a metric for finger liveness determination.
  • Liveness determination is important to verify that an imaged fingerprint is from a living human digit and not a synthetic, dismembered or cadaver human digit.
  • the presently disclosed techniques contemplate active beamforming techniques that enable a PMUT array to selectively switch between a first mode that provides high-resolution epidermal imaging, and a second mode that provides lower resolution and higher acoustic pressure appropriate for 3-D subdermal imaging and liveness determination of an object (purportedly a human finger of a live person) being imaged.
  • the second mode the "beamforming mode" of operation, transmission-side beam forming may produce a relatively high acoustic pressure, focused beam pattern operable to produce acoustic echoes from subsurface layers of an object being imaged.
  • the characteristic acoustic echoes from subcutaneous tissue (e.g., dermis or hypodermis) of a living human digit being difficult or impossible to spoof enable a high confidence determination of whether or not subsurface features of the object being imaged is consistent with living subcutaneous tissue.
  • a single apparatus may perform both fingerprint surface imaging and fingerprint 3-D imaging for additional security and liveness determination. Because the same PMUT array may be used for both fingerprint imaging and liveness determination, and each function may be performed within a few seconds or portion of a second, anti-spoofing protection may be provided for an existing ultrasonic fingerprint imaging system with little additional cost or user inconvenience.
  • the active beamforming techniques permit selection of a desirably high frame rate and high resolution.
  • One innovative aspect of the subject matter described in this disclosure may be implemented in an apparatus that includes a one- or two-dimensional array of piezoelectric micromechanical ultrasonic transducer (PMUT) elements positioned below, beside, with, on or above a backplane of a display or an ultrasonic fingerprint sensor array.
  • PMUT piezoelectric micromechanical ultrasonic transducer
  • the PMUT array may be configurable to operate in modes corresponding to multiple frequency ranges.
  • the PMUT array may be configurable to operate in a low-frequency mode corresponding to a low-frequency range (e.g., 50 kHz to 200 kHz) or in a high- frequency mode corresponding to a high-frequency range (e.g., 1 MHz to 25 MHz).
  • a low-frequency mode corresponding to a low-frequency range (e.g., 50 kHz to 200 kHz) or in a high- frequency mode corresponding to a high-frequency range (e.g., 1 MHz to 25 MHz).
  • an apparatus may be capable of imaging at relatively higher resolution. Accordingly, the apparatus may be capable of detecting touch, fingerprint, stylus, and biometric information from an object such as a finger placed on the surface of the display or sensor array.
  • Such a high-frequency mode may be referred to herein as a fingerprint sensor mode.
  • the apparatus When operating in the low-frequency mode, the apparatus may be capable of emitting sound waves that are capable of relatively greater penetration into air than when the apparatus is operating in the high-frequency mode.
  • Such lower-frequency sound waves may be transmitted through various overlying layers including a cover glass, a touchscreen, a display array, a backlight, a housing or enclosure, or other layers positioned between an ultrasonic transmitter and a display or sensor surface.
  • a port may be opened through one or more of the overlying layers to optimize acoustic coupling from the PMUT array into air.
  • the lower- frequency sound waves may be transmitted through the air above the display or sensor surface, reflected from one or more objects near the surface, transmitted through the air and back through the overlying layers, and detected by an ultrasonic receiver. Accordingly, when operating in the low- frequency mode, the apparatus may be capable of operating in a gesture detection mode, wherein free-space gestures near but not necessarily touching the display may be detected.
  • the PMUT array may be configurable to operate in a medium-frequency mode corresponding to a frequency range between the low-frequency range and the high-frequency range (e.g., about 200 kHz to about 1 MHz).
  • a medium-frequency mode corresponding to a frequency range between the low-frequency range and the high-frequency range (e.g., about 200 kHz to about 1 MHz).
  • the apparatus may be capable of providing touch sensor functionality, although with somewhat less resolution than the high-frequency mode.
  • the PMUT array may be addressable for wavefront beam forming, beam steering, receive-side beam forming, and/or selective readout of returned signals. For example, individual columns, rows, sensor pixels and/or groups of sensor pixels may be separately addressable.
  • a control system may control an array of transmitters to produce wavefronts of a particular shape, such as planar, circular or cylindrical wavefronts.
  • the control system may control the magnitude and/or phase of the array of transmitters to produce constructive or destructive interference in desired locations.
  • the control system may control the magnitude and/or phase of the array of transmitters to produce constructive interference in one or more locations in which a touch or gesture has been detected or is likely to be detected.
  • PMUT devices may be co-fabricated with thin- film transistor (TFT) circuitry or CMOS circuitry on the same substrate, which may be a silicon, glass or plastic substrate in some examples.
  • TFT substrate may include row and column addressing electronics, multiplexers, local amplification stages and control circuitry.
  • an interface circuit including a driver stage and a sense stage may be used to excite a PMUT device and detect responses from the same device.
  • a first PMUT device may serve as an acoustic or ultrasonic transmitter and a second PMUT device may serve as an acoustic or ultrasonic receiver.
  • different PMUT devices may be capable of low- and high-frequency operation (e.g.
  • the same PMUT device may be used for low- and high-frequency operation.
  • the PMUT may be fabricated using a silicon wafer with active silicon circuits fabricated in the silicon wafer.
  • the active silicon circuits may include electronics for the functioning of the PMUT or PMUT array.
  • the PMUT array may be configured as an ultrasonic sensor array.
  • Figures IB- ID illustrate cross-sectional views of various configurations of PMUT ultrasonic sensor arrays.
  • Figure IB depicts an ultrasonic sensor array 1100A with PMUTs as transmitting and receiving elements that may be used, for example, as an ultrasonic fingerprint sensor, an ultrasonic touchpad, or an ultrasonic imager.
  • PMUT sensor elements 1162 on a PMUT sensor array substrate 1160 may emit and detect ultrasonic waves. As illustrated, an ultrasonic wave 1164 may be transmitted from at least one PMUT sensor element 1162.
  • the ultrasonic wave 1164 may travel through an acoustic coupling medium 1165 and a platen 1190a towards an object 1102 such as a finger or a stylus positioned on an outer surface of the platen 1190a. A portion of the ultrasonic wave 1164 may be transmitted through the platen 1190a and into the object 1102, while a second portion is reflected from the surface of platen 1190a back towards the sensor element 1162. The amplitude of the reflected wave may depend in part on the acoustic properties of the object 1102. The reflected wave may be detected by the sensor elements 1162, from which an image of the object 1102 may be acquired.
  • An acoustic coupling medium 1165 such as an adhesive, gel, a compliant layer or other acoustic coupling material may be provided to improve coupling between an array of PMUT sensor elements 1162 disposed on the sensor array substrate 1160 and the platen 1190a.
  • the acoustic coupling medium 1165 may aid in the transmission of ultrasonic waves to and from the sensor elements 1162.
  • the platen 1190a may include, for example, a layer of glass, plastic, sapphire, metal, metal alloy, or other platen material.
  • An acoustic impedance matching layer (not shown) may be disposed on an outer surface of the platen 1190a.
  • the platen 1190a may include a coating (not shown) on the outer surface.
  • Figure 1C depicts an ultrasonic sensor and display array 1100B with PMUT sensor elements 1 162 and display pixels 1166 co-fabricated on a sensor and display substrate 1160.
  • the sensor elements 1162 and display pixels 1166 may be collocated in each cell of an array of cells.
  • the sensor element 1162 and the display pixel 1166 may be fabricated side -by-side within the same cell.
  • part or all of the sensor elements 1162 may be fabricated above or below the display pixel 1166.
  • Platen 1190b may be positioned over the sensor elements 1162 and the display pixels 1166 and may function as or include a cover lens or cover glass.
  • the cover glass may include one or more layers of materials such as glass, plastic or sapphire, and may include provisions for a capacitive touchscreen.
  • An acoustic impedance matching layer or coating (not shown) may be disposed on an outer surface of the platen 1190b.
  • Ultrasonic waves 1164 may be transmitted and received from one or more sensor elements 1162 to provide imaging capability for an object 1102 such as a stylus or a finger placed on the cover glass 1190b.
  • the cover glass 1190b is substantially transparent to allow optical light from the array of display pixels 1166 to be viewed by a user through the cover glass 1190b. The user may choose to touch a portion of the cover glass 1190b, and that touch may be detected by the ultrasonic sensor array.
  • Biometric information such as fingerprint information may be acquired, for example, when a user touches the surface of the cover glass 1190b.
  • An acoustic coupling medium 1165 such as an adhesive, gel, or other acoustic coupling material may be provided to improve acoustic, optical and mechanical coupling between the sensor array substrate 1160 and the cover glass.
  • the coupling medium 1165 may be a liquid crystal material that may serve as part of a liquid crystal display (LCD).
  • LCD implementations a backlight (not shown) may be optically coupled to the sensor and display substrate 1160.
  • the display pixels 1166 may be part of an amorphous light-emitting diode (AMOLED) display with light-emitting display pixels.
  • AMOLED amorphous light-emitting diode
  • the ultrasonic sensor and display array 1100B may be used for display purposes and for touch, stylus or fingerprint detection.
  • Figure ID depicts an ultrasonic sensor and display array 1 lOOC with a sensor array substrate 1160a positioned behind a display array substrate 1 160b.
  • An acoustic coupling medium 1165 a may be used to acoustically couple the sensor array substrate 1160a to the display array substrate 1160b.
  • An optical and acoustic coupling medium 1165b may be used to optically and acoustically couple the sensor array substrate 1160a and the display array substrate 1160b to a cover lens or cover glass 1190c, which may also serve as a platen for the detection of fingerprints.
  • An acoustic impedance matching layer or coating may be disposed on an outer surface of the platen 1190c.
  • Ultrasonic waves 1164 transmitted from one or more sensor elements 1162 may travel through the display array substrate 1160b and cover glass 1190c, reflect from an outer surface of the cover glass 1190c, and travel back towards the sensor array substrate 1160a where the reflected ultrasonic waves may be detected and image information acquired.
  • the ultrasonic sensor and display array 1 lOOC may be used for providing visual information to a user and for touch, stylus or fingerprint detection from the user.
  • a PMUT sensor array may be formed on the backside of the display array substrate 1160b.
  • the sensor array substrate 1160a with a PMUT sensor array may be attached to the backside of the display array substrate 1160b, with the backside of the sensor array substrate 1160a attached directly to the backside of the display array substrate 1160b, for example, with an adhesive layer or adhesive material (not shown).
  • Spoofing may include use of synthetic objects having a surface that mimics a human fingerprint's ridge and valley characteristics. Spoofing may also involve the use of real human digits, dismembered from a living or dead human victim.
  • FIG. 2 illustrates a PMUT array according to an implementation.
  • the PMUT array 200 includes 163 PMUT elements or PMUTs 201.
  • Each PMUT element 201 may correspond to or be referred to as a "pixel".
  • the PMUT array 200 includes an arrangement of alternating rows of pixels that are "staggered” such that PMUT elements in alternate rows are shifted by half a pitch distance between adjacent pixels within a row.
  • Such an arrangement may also be referred to as a "hexagonal lattice" by which is meant a honeycomb-like arrangement of pixels configured such that any pixel, other than an edge pixel, is adjacent to six neighboring pixels, rows of adjacent pixels being disposed along or parallel to one of three principle axes, each of the three principle axes being disposed at an
  • each pixel 201 in PMUT array 200 has been annotated with an integer number: 1, 2, 3 or 4.
  • Figure 3 shows a portion of PMUT array 200, according to some implementations. More particularly, the illustrated portion of PMUT array 200 that includes 121 pixels 201 that are disposed so as to form seven "superpixel" regions 250.
  • a superpixel may include a single center pixel and one or more rings of pixels that surround the center pixel, each pixel in a ring of pixels having a substantially equal distance from the center pixel.
  • each of seven hexagonal superpixel regions 250(i) includes a respective inner pixel (annotated by the integer ⁇ ') located proximate to a center of the superpixel region.
  • An inner pixel 1 may also be referred to as a "center pixel".
  • a single center pixel is disposed proximate to the center of each superpixel region.
  • first pixel set a first group or set of inner pixels that are disposed proximate to and equidistant from the center of each superpixel region.
  • Each superpixel region 250 also includes outer pixels disposed in an outer portion of the superpixel region 250.
  • each superpixel region 250 includes a second set or group of outer pixels (“second pixel set"), annotated by the integer '2'.
  • second pixel set annotated by the integer '2'.
  • Six outer pixels 2 are shown to be proximate to and substantially equidistant from each respective center pixel 1.
  • each superpixel region 250 also includes a third pixel set that includes outer pixels that are disposed on a boundary of each superpixel region. Pixels in the third pixel set, annotated by the integer '3', are disposed proximate to a center of each edge of the hexagonal superpixel region 250 and are substantially equidistant from the center pixel 1.
  • a fourth pixel set includes outer pixels annotated by the integer '4' that are disposed proximate to each corner of the hexagonal superpixel region 250, and are substantially equidistant from the center pixel 1.
  • outer pixels 3 are more distant from the center pixel 1 than outer pixels 2, and less distant from the center pixel 1 than outer pixels 4.
  • PMUT elements in a superpixel may be grouped according to their position from the center of the superpixel.
  • one or more sets or groups of outer pixels may be shared between adjacent superpixels.
  • pixels of the fourth pixel set may be shared between adjacent superpixels.
  • each PMUT element in each pixel set may be systematically coupled with transceiver electronics, such that the pixel sets may be separately actuated with a transmission signal having a controllable phase and/or time delay.
  • a transmission signal having a controllable phase and/or time delay.
  • this may be achieved by applying substantially the same delay to all groups of PMUT elements in the superpixel.
  • the time delay for each respective pixel set may be selected so that the acoustic pressure created by each superpixel is focused at a predetermined distance from the center pixel(s) using beamforming principles.
  • FIG. 4 illustrates an example of beam focusing or transmitter side beamforming for a superpixel region including pixel sets as described above.
  • time of flight and constructive interference between ultrasonic emissions from each group of PMUT elements within the superpixel may result in a focused, highly shaped, and relatively high intensity ultrasonic signal.
  • each pixel set may be supplied with a transmission signal having a predetermined time delay. The time delay for each pixel set may be selected so that the acoustic pressure created by each superpixel is focused at a predetermined location.
  • the ultrasonic emissions from a superpixel may be focused by first applying an excitation signal to the fourth pixel set; following a time delay, applying the excitation signal to the third pixel set;
  • Figure 5 illustrates an example acoustic pressure map for a superpixel of PMUT elements operated in a beamforming mode. It may be observed that the superpixel may generate a well-focused beam having relatively high acoustic pressure at a distance of interest along the thickness direction of the object being imaged.
  • the focused beam may have an acoustic pressure that is substantially higher (at least 2X higher) than the average acoustic pressure produced when operating in a plane wave excitation transmission mode.
  • the peak acoustic pressure is approximately six times greater than the average acoustic pressure produced when operating in a plane wave excitation and transmission mode (e.g., comparing Figure 5 with Figure 1 A, Detail B).
  • the distance of interest (which may correspond to a selected depth of focus) is determined by the spacing between pixel sets 250(1) through 250(4) and configurable time delays. By controlling the time delays between pixel sets 250(1) through 250(4) of the superpixel region 250, different depths of the finger tissue may be imaged to provide 3-D tissue imaging as well as liveness determination.
  • Each of the example superpixels 250(i) illustrated in Figure 3 may be characterized as including 19 pixels arranged along a hexagonal lattice. It should be noted that any number of alternative superpixel arrangements are contemplated by the present disclosure, provided only that the superpixel includes, as defined above, a plurality of pixels, including at least one inner pixel disposed in a central portion of a superpixel region, and one or more sets of outer pixels disposed in an outer portion of the superpixel region.
  • a "passive" array of superpixels may be contemplated, wherein each PMUT element within a group of PMUTs is hardwired in common to transceiver electronics, and actuated ("fired")
  • successive groups of PMUTs may be fired in a sequence controlled by the transceiver electronics so as to provide the desired phase/time delays to each respective group.
  • the size and relative spacing of each of the superpixels is fixed at the time of manufacture.
  • the spatial resolution of the PMUT array in the beamforming mode may also be fixed.
  • a serial interface structure may be used to clock in configuration information to each pixel and associate each pixel with a corresponding superpixel.
  • each superpixel 650 includes a center pixel (1), a first pixel set of six outer pixels (2), and a second pixel set of 12 outer pixels (3).
  • the second pixel set of 12 outer pixels (3) in Figure 6 includes pixel locations corresponding to both outer pixels (3) and outer pixels (4) as shown in Figures 2 and 3.
  • Any pixel in the array may be addressed by respective row decoder 661 and column decoder 662.
  • the row decoder 661 and the column decoder 662 may be a component of the transceiver electronics, for example, and may be configured to designate any individual pixel as a center pixel (1), an outer pixel (2), or an outer pixel (3).
  • Figure 7 illustrates a serial interface structure that may be used to clock in beamforming configuration information to each pixel, according to an
  • each of the 19 pixels 701 in a superpixel arrangement 750 may be addressed by column and row decoders 661 and 662 and designated as one of a center pixel (1), an outer pixel (2), or an outer pixel (3).
  • each pixel 701 may include a transmit electrode 711, in-cell pixel logic 721 and pass transistors SI, S2 and S3.
  • the transmit electrode 711 may be energized (e.g., the PMUT element is fired) at a selected one of delay times tl, t2 and t3, the selection being determined by the switch states of transistors SI, S2 and S3.
  • the switch states of transistors S 1 , S2 and S3 may be set by in-cell pixel logic 721.
  • the pixel logic 721 may include a 2-bit memory, a 2-bit decoder, and a 2-bit shift register.
  • the pixel logic 721 may be addressed and configured by the decoders 661 and 662, a process which may require two clock cycles. As a result, when the pixels are addressed as contemplated by the arrangement shown in Figure 7, approximately 38 clock cycles are required to configure all of the 19 pixels in the superpixel
  • logic 721 may set the respective switch states of each of transistors SI, S2, and S3 of the center pixel and the outer pixels in the superpixel so that each group of PMUT elements in the superpixel is fired only at a selected one of delay times tl, t2 and t3 that is appropriate for the designation.
  • outer pixels (3) may be fired at a shorter delay time tl
  • outer pixels (2) may be fired at an intermediate delay time t2
  • center pixel (1) may be fired at a longer delay time t3.
  • the designation of various pixels in the pixel array as a center pixel (1), outer pixel (2) or outer pixel (3) may be changed temporally in order, for example, to support scanning.
  • a high resolution scan of a focused beam of relatively high acoustic pressure may be performed across an entire area of the array or any part of the array area.
  • Figure 8 illustrates another technique for operating an array of pixels by configuring in-cell pixel logic, according to an implementation.
  • a center pixel (1) in a superpixel 850 is designated a center pixel (1) by, for example, a decoder disposed in the transceiver electronics.
  • each pixel 801 may include a transmit electrode 811, in-cell pixel logic 821, cell input interface logic 823, cell output interface logic 825, and pass transistors SI, S2 and S3 that receive signals from transceiver electronics 810.
  • the transmit electrode 811 may be energized (e.g., the PMUT element may be fired) at a selected one of delay times tl, t2 and t3, the selection being determined by the switch states of transistors SI, S2 and S3.
  • the switch states of transistors S 1 , S2 and S3 may be set by in-cell pixel logic 821.
  • the pixel logic 821 may include a 2-bit encoder and a 2-bit counter.
  • the logic 821 may process inputs from cell input interface logic 823.
  • cell input interface logic 823 may be a 7-input OR gate that receives inputs from (i) each of six adjacent cells and (ii) the decoder.
  • the inputs from any of six adjacent cells may be a "wake -up" signal 822, meaning that the adjacent cell is a center cell or has been awakened by a center cell.
  • FIG. 9 illustrates additional details of operating an array of pixels by configuring in-cell pixel logic, according to an implementation.
  • center pixel (1) receives a decoder selection signal, Step A
  • a first clock cycle starts by enabling a CLK signal and the superpixel center pixel (1) distributes a wake-up signal 924 to six adjacent cells, Step B.
  • Cells adjacent to center pixel (1) are each outer pixels (2).
  • an adjacent cell receives the wakeup signal it also starts to count at a second clock cycle and also distributes wakeup signals 925 to adjacent cells, Step C.
  • all the cells in the superpixel may be configured as one of a center pixel (1), an outer pixel (2) or an outer pixel (3).
  • firing transmit pulses, Step D may produce a well-focused beam of relatively high acoustic pressure.
  • outer pixels (3) may be fired at a shorter delay time tl
  • outer pixels (2) may be fired at an intermediate delay time t2
  • center pixel (1) may be fired at a longer delay time t3.
  • the designation of a pixel as a center pixel (1), outer pixel (2) or outer pixel (3) may be changed temporally in order, for example, to support scanning. As a result, a high resolution scan of a focused beam of relatively high acoustic pressure may be performed across an entire area of the array or any part of the array area.
  • the center pixel (1) and all outer pixels (2, 3, ...) may be set to have a logic state "00" stored in their respective in-cell pixel logic prior to the start of Step A.
  • a decoder selection signal may be sent from a row and/or a column decoder to a designated superpixel center pixel (1), loading a logic state "01" into the two-bit memory of the in-cell pixel logic associated with the superpixel center pixel (1).
  • the update of the in-cell memory may trigger a wake-up signal via the cell output interface logic to six adjacent cells (outer pixels (2)) that are adjacent to the center pixel (1).
  • the center pixel (1) may receive a second decoder selection signal.
  • a logic state "10" may be loaded into the in-cell memory of the center pixel (1) and a memory update signal may be sent to the six adjacent outer pixels (2) and a logic state "01 " may be loaded via the cell input interface logic into the in-cell memory of the adjacent outer pixels (2).
  • the update of the in-cell memory of the adjacent outer pixels (2) may trigger a wake-up signal to twelve adjacent outer pixels (3) that are adjacent to the six outer pixels (2).
  • the center pixel (1) may receive a third decoder selection signal.
  • a logic state "11" may be loaded into the in-cell memory of the center pixel (1) and a memory update signal may be sent to the six adjacent outer pixels (2), causing a logic state "10” to be loaded into the in-cell memory of the outer pixels (2) and causing a memory update signal to be sent to the twelve adjacent outer pixels (3) and a logic state "01 " to be loaded into the in-cell memory of the outer pixels (3).
  • the logic states "01", “10” and “11” stored in the in-cell memories of inner pixels (1), outer pixels (2) and outer pixels (3), respectively, may be decoded with an in-cell 2-bit decoder to turn on corresponding pass transistors SI, S2 or S3, which may gate or otherwise allow transmit signals with corresponding delay times to be passed on to one or more transmit electrodes of the in-cell PMUT, allowing the corresponding PMUTs of the superpixel to launch a focused ultrasonic wave.
  • a two-bit shift register may be used as the in-cell decoder to provide appropriate logic levels to turn on or off the corresponding pass transistors. Scanning an object may occur by resetting the in-cell pixel logic of the center pixel (1) and outer pixels (2, 3), then re-starting the process with a different pixel designated in the PMUT array to serve as the center pixel (1).
  • FIG 10 illustrates an example of a process flow for operating an array of pixels in a selectable one of a first mode and a second mode.
  • each pixel may include in-cell pixel logic and a piezoelectric
  • each in-cell pixel logic may be communicatively coupled with at least one adjacent pixel in the array and with transceiver electronics.
  • the transceiver electronics may be configured to operate the array by configuring at least one in-cell pixel logic.
  • method 1000 includes a step 1010 for selecting one of a first mode and a second mode of operating the PMUT array.
  • the method may proceed, at step 1020, to control a PMUT array with the transceiver electronics to generate a substantially plane ultrasonic wave. More particularly, in the first operating mode, the transceiver electronics may concurrently transmit signals to each PMUT in the array. The signals, being received at the input terminals substantially simultaneously, may cause the array to generate a substantially plane ultrasonic wave.
  • the method may proceed, at step 1030, to control a PMUT array with the transceiver electronics to generate from each superpixel region a focused beam of relatively higher acoustic pressure.
  • the transceiver electronics may operate the array by configuring at least one in-cell pixel logic.
  • the transceiver electronics may use a serial interface structure to clock in configuration information to each pixel and associate each pixel with a corresponding superpixel.
  • the transceiver electronics may designate at least one pixel as an inner pixel of a corresponding superpixel.
  • Each of the designated inner pixel and at least a second pixel adjacent to the designated inner pixel may include cell input interface logic and cell output interface logic.
  • the cell output interface logic of the designated inner pixel may be configured to send a wake -up signal to the cell input interface logic of the second pixel.
  • an arrangement including an array of piezoelectric ultrasonic transducers configured as superpixels, operable to selectively perform either fingerprint imaging (e.g. epidermal imaging) or subdermal imaging (e.g. for liveness detection), has been disclosed.
  • fingerprint imaging e.g. epidermal imaging
  • subdermal imaging e.g. for liveness detection
  • receive-side beamforming with the PMUT arrays may be accomplished with a pixel array as largely described above including a plurality of pixels, with each pixel including a piezoelectric micromechanical ultrasonic transducer (PMUT) element.
  • PMUT piezoelectric micromechanical ultrasonic transducer
  • Each PMUT element in the pixel array may be disposed on a substrate that includes thin-film transistor (TFT) or CMOS circuitry co- fabricated with the PMUT element.
  • the TFT or CMOS circuitry may include in-cell pixel logic element communicatively coupled with transceiver electronics.
  • the in- cell pixel logic may include a 2-bit memory, a 2-bit decoder, and a 2-bit shift register.
  • the transceiver electronics may include at least one decoder configured to address and configure the in-cell pixel logic.
  • the decoders may be configured to selectably designate each pixel as an inner pixel or an outer pixel of a corresponding superpixel.
  • the TFT or CMOS circuitry may include cell input interface logic, cell output interface logic and a plurality of pass transistors.
  • the transceiver electronics may include at least one decoder communicatively coupled with the TFT circuitry and configured to selectably designate at least one pixel as an inner pixel.
  • Each of the designated inner pixel and second pixels adjacent to the designated inner pixel may include cell input interface logic and cell output interface logic.
  • the cell output interface logic of the designated inner pixel may be configured to send a wake-up signal to the cell input interface logic of the second pixel.
  • the pass transistors may be configured to allow the acquisition of received ultrasonic signals by the PMUT element with in-cell acquisition circuitry, such as a peak detector (not shown), at a predetermined time tl , t2 or t3.
  • the predetermined times tl , t2 and t3 may be separated by time delays that allow acquisition of received signals according to beamforming principles.
  • the PMUT arrays may be operated in a non- beamformed mode (i.e. in a conventional mode) or in a receive-side beamforming mode.
  • the array of pixels each including in-cell pixel logic and a piezoelectric micromechanical ultrasonic transducer (PMUT) element, may be operated in a selectable one of a first receive mode and a second receive mode, with each in-cell pixel logic being communicatively coupled with at least one adjacent pixel in the array.
  • Transceiver electronics may be configured to operate the array by configuring at least one in-cell pixel logic in either the first receive mode or the second receive mode. In the first receive mode, the array may be operated to receive ultrasonic signals at a single point in time.
  • the array may be operated to receive ultrasonic signals at multiple points in time, allowing receive-side beamforming within a designated superpixel.
  • Each superpixel region may include at least one inner pixel disposed in a central portion of the superpixel region and at least a first group of outer pixels disposed in an outer portion of the superpixel region.
  • at least one in-cell pixel logic may be configured using a serial interface structure to clock in configuration information to each pixel and associate each pixel with a corresponding superpixel.
  • the in-cell pixel logic may include, in the second receive mode, designating each pixel as a center pixel or as an outer pixel of the corresponding superpixel.
  • the transceiver electronics may include one or more decoders that are configured to address and configure the in-cell pixel logic.
  • the decoders may be configured to selectably designate each pixel as an inner pixel or an outer pixel of the corresponding superpixel.
  • the decoders may be configured to selectably designate at least one pixel as an inner pixel, where each of the designated inner pixel and second pixels adjacent to the designated inner pixel include cell input interface logic and cell output interface logic.
  • the cell output interface logic of the designated inner pixel may be configured to send a wake-up signal to the cell input interface logic of the outer pixels.
  • the pass transistors may be configured to allow the acquisition of received ultrasonic signals at a predetermined time tl, t2 or t3 by in-cell acquisition circuitry, such as a peak detector.
  • the predetermined times tl, t2 and t3 may be separated by time delays that allow acquisition of received signals according to beamforming principles.
  • a phrase referring to "at least one of a list of items refers to any combination of those items, including single members.
  • "at least one of: a, b, or c” is intended to cover: a, b, c, a-b, a-c, b-c, and a-b-c.
  • the hardware and data processing apparatus used to implement the various illustrative logics, logical blocks, modules and circuits described in connection with the aspects disclosed herein may be implemented or performed with a general purpose single- or multi-chip processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein.
  • a general purpose processor may be a microprocessor or any conventional processor, controller, microcontroller, or state machine.
  • a processor also may be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
  • a processor also may be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
  • the functions described may be implemented in hardware, digital electronic circuitry, computer software, firmware, including the structures disclosed in this specification and their structural equivalents thereof, or in any combination thereof. Implementations of the subject matter described in this specification also can be implemented as one or more computer programs, i.e., one or more modules of computer program instructions, encoded on a computer storage media for execution by or to control the operation of data processing apparatus.
  • the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium, such as a non-transitory medium.
  • a computer-readable medium such as a non-transitory medium.
  • the processes of a method or algorithm disclosed herein may be implemented in a processor-executable software module which may reside on a computer-readable medium.
  • Computer-readable media include both computer storage media and communication media including any medium that can be enabled to transfer a computer program from one place to another. Storage media may be any available media that may be accessed by a computer.
  • non-transitory media may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that may be used to store desired program code in the form of instructions or data structures and that may be accessed by a computer. Also, any connection can be properly termed a computer-readable medium.
  • Disk and disc includes compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk, and blu-ray disc where disks usually reproduce data
  • drawings may schematically depict one more example processes in the form of a flow diagram. However, other operations that are not depicted can be incorporated in the example processes that are schematically illustrated. For example, one or more additional operations can be performed before, after, simultaneously, or between any of the illustrated operations. In certain circumstances, multitasking and parallel processing may be advantageous. Moreover, the separation of various system components in the implementations described above should not be understood as requiring such separation in all implementations, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products. Additionally, other implementations are within the scope of the following claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve desirable results.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

Un appareil comprend un réseau de pixels. Chaque pixel comprend une logique de pixel dans la cellule et un élément de transducteur à ultrasons micromécanique piézoélectrique (PMUT). Chaque logique de pixel dans la cellule est couplé pour une communication à au moins un pixel adjacent du réseau. Une électronique d'émetteur-récepteur peut commander le réseau dans un mode sélectionnable entre un premier mode et un second mode. Dans le premier mode, le réseau peut générer une onde ultrasonique sensiblement plane. Dans le second mode, à partir d'au moins une région de superpixel, le réseau peut générer un faisceau focalisé, de pression acoustique relativement élevée. Chaque région de superpixel comprend au moins un pixel interne placé dans une partie centrale de la région de superpixel et au moins un premier groupe de pixels externes placé dans une partie extérieure de la région de superpixel. L'électronique d'émetteur-récepteur peut être configurée pour commander le réseau en configurant au moins une logique de pixel dans la cellule.
PCT/US2015/055827 2014-10-15 2015-10-15 Procédé de formation de faisceau active pour réseau de transducteurs ultrasonores piézoélectriques Ceased WO2016061412A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201580055338.XA CN106794487B (zh) 2014-10-15 2015-10-15 用于压电超声换能器阵列的主动波束成形技术
EP15787119.5A EP3207497A1 (fr) 2014-10-15 2015-10-15 Procédé de formation de faisceau active pour réseau de transducteurs ultrasonores piézoélectriques

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US201462064416P 2014-10-15 2014-10-15
US201462064417P 2014-10-15 2014-10-15
US201462064418P 2014-10-15 2014-10-15
US62/064,417 2014-10-15
US62/064,416 2014-10-15
US62/064,418 2014-10-15
US201562241651P 2015-10-14 2015-10-14
US14/883,585 2015-10-14
US14/883,586 2015-10-14
US14/883,585 US9995821B2 (en) 2014-10-15 2015-10-14 Active beam-forming technique for piezoelectric ultrasonic transducer array
US14/883,583 2015-10-14
US62/241,651 2015-10-14
US14/883,586 US10139479B2 (en) 2014-10-15 2015-10-14 Superpixel array of piezoelectric ultrasonic transducers for 2-D beamforming
US14/883,583 US10001552B2 (en) 2014-10-15 2015-10-14 Three-port piezoelectric ultrasonic transducer

Publications (1)

Publication Number Publication Date
WO2016061412A1 true WO2016061412A1 (fr) 2016-04-21

Family

ID=54360586

Family Applications (3)

Application Number Title Priority Date Filing Date
PCT/US2015/055825 Ceased WO2016061410A1 (fr) 2014-10-15 2015-10-15 Transducteur ultrasonore piézoélectrique à trois orifices
PCT/US2015/055821 Ceased WO2016061406A1 (fr) 2014-10-15 2015-10-15 Mosaïque de superpixels de transducteurs piézoélectriques à ultrasons pour formation de faisceau 2d
PCT/US2015/055827 Ceased WO2016061412A1 (fr) 2014-10-15 2015-10-15 Procédé de formation de faisceau active pour réseau de transducteurs ultrasonores piézoélectriques

Family Applications Before (2)

Application Number Title Priority Date Filing Date
PCT/US2015/055825 Ceased WO2016061410A1 (fr) 2014-10-15 2015-10-15 Transducteur ultrasonore piézoélectrique à trois orifices
PCT/US2015/055821 Ceased WO2016061406A1 (fr) 2014-10-15 2015-10-15 Mosaïque de superpixels de transducteurs piézoélectriques à ultrasons pour formation de faisceau 2d

Country Status (1)

Country Link
WO (3) WO2016061410A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106293219A (zh) * 2016-08-03 2017-01-04 京东方科技集团股份有限公司 一种具有压力触控功能的装置及其控制方法
CN106530968A (zh) * 2016-12-27 2017-03-22 京东方科技集团股份有限公司 显示装置和显示装置的控制方法
WO2017192237A1 (fr) * 2016-05-06 2017-11-09 Qualcomm Incorporated Système de capteur ultrasonore bidirectionnel pour dispositifs biométriques
TWI613997B (zh) * 2016-06-27 2018-02-11 麥克思商務咨詢(深圳)有限公司 超聲波感測器
US9995821B2 (en) 2014-10-15 2018-06-12 Qualcomm Incorporated Active beam-forming technique for piezoelectric ultrasonic transducer array
US10497748B2 (en) 2015-10-14 2019-12-03 Qualcomm Incorporated Integrated piezoelectric micromechanical ultrasonic transducer pixel and array
CN109313890B (zh) * 2016-05-04 2023-12-22 应美盛公司 操作超声换能器的二维阵列

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10445547B2 (en) 2016-05-04 2019-10-15 Invensense, Inc. Device mountable packaging of ultrasonic transducers
US10315222B2 (en) 2016-05-04 2019-06-11 Invensense, Inc. Two-dimensional array of CMOS control elements
US11673165B2 (en) 2016-05-10 2023-06-13 Invensense, Inc. Ultrasonic transducer operable in a surface acoustic wave (SAW) mode
US10706835B2 (en) 2016-05-10 2020-07-07 Invensense, Inc. Transmit beamforming of a two-dimensional array of ultrasonic transducers
US10441975B2 (en) 2016-05-10 2019-10-15 Invensense, Inc. Supplemental sensor modes and systems for ultrasonic transducers
US10539539B2 (en) 2016-05-10 2020-01-21 Invensense, Inc. Operation of an ultrasonic sensor
US10562070B2 (en) * 2016-05-10 2020-02-18 Invensense, Inc. Receive operation of an ultrasonic sensor
US10452887B2 (en) * 2016-05-10 2019-10-22 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US11003884B2 (en) * 2016-06-16 2021-05-11 Qualcomm Incorporated Fingerprint sensor device and methods thereof
WO2018005525A1 (fr) * 2016-06-27 2018-01-04 Clean Energy Labs, Llc Systèmes de pompes à membranes conductrices d'électricité
JPWO2018155276A1 (ja) * 2017-02-24 2019-12-12 京セラ株式会社 超音波センサ
US11331075B2 (en) * 2017-03-09 2022-05-17 Kyocera Corporation Ultrasonic sensor and ultrasonic sensor device
US10474862B2 (en) 2017-06-01 2019-11-12 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US20180373913A1 (en) 2017-06-26 2018-12-27 Qualcomm Incorporated Ultrasonic fingerprint sensor for under-display applications
US10643052B2 (en) * 2017-06-28 2020-05-05 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US20190076114A1 (en) * 2017-09-13 2019-03-14 Qualcomm Incorporated System and method for energy transfer
US10725590B2 (en) 2017-09-29 2020-07-28 Qualcomm Incorporated Sliding range gate for large area ultrasonic sensor
WO2019109010A1 (fr) 2017-12-01 2019-06-06 Invensense, Inc. Suivi de fond noir
US10984209B2 (en) 2017-12-01 2021-04-20 Invensense, Inc. Darkfield modeling
US10997388B2 (en) 2017-12-01 2021-05-04 Invensense, Inc. Darkfield contamination detection
US11151355B2 (en) 2018-01-24 2021-10-19 Invensense, Inc. Generation of an estimated fingerprint
US10755067B2 (en) 2018-03-22 2020-08-25 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US10936843B2 (en) 2018-12-28 2021-03-02 Invensense, Inc. Segmented image acquisition
EP3972747A1 (fr) * 2019-05-20 2022-03-30 InvenSense, Inc. Transducteur ultrasonore à double couche
US11188735B2 (en) 2019-06-24 2021-11-30 Invensense, Inc. Fake finger detection using ridge features
US11216681B2 (en) 2019-06-25 2022-01-04 Invensense, Inc. Fake finger detection based on transient features
US11176345B2 (en) 2019-07-17 2021-11-16 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11216632B2 (en) 2019-07-17 2022-01-04 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11232549B2 (en) 2019-08-23 2022-01-25 Invensense, Inc. Adapting a quality threshold for a fingerprint image
US11392789B2 (en) 2019-10-21 2022-07-19 Invensense, Inc. Fingerprint authentication using a synthetic enrollment image
US11460957B2 (en) 2020-03-09 2022-10-04 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11243300B2 (en) 2020-03-10 2022-02-08 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor
US20230165559A1 (en) * 2020-04-03 2023-06-01 Stelect Pty. Ltd. Vessel measurement device and process
US11328165B2 (en) 2020-04-24 2022-05-10 Invensense, Inc. Pressure-based activation of fingerprint spoof detection
CN111678585B (zh) * 2020-06-18 2022-08-23 中北大学 一种高灵敏度的AlN压电水听器及其制备方法
US11995909B2 (en) 2020-07-17 2024-05-28 Tdk Corporation Multipath reflection correction
US12174295B2 (en) 2020-08-07 2024-12-24 Tdk Corporation Acoustic multipath correction
EP4247567B1 (fr) * 2020-11-19 2024-12-25 Katholieke Universiteit Leuven Une structure de transducteur ultrasonique
US11899143B2 (en) 2021-07-12 2024-02-13 Robert Bosch Gmbh Ultrasound sensor array for parking assist systems
US12256642B2 (en) 2021-07-12 2025-03-18 Robert Bosch Gmbh Ultrasound transducer with distributed cantilevers
US12150384B2 (en) 2021-07-12 2024-11-19 Robert Bosch Gmbh Ultrasound transducer with distributed cantilevers
US12416807B2 (en) 2021-08-20 2025-09-16 Tdk Corporation Retinal projection display system
US12260050B2 (en) 2021-08-25 2025-03-25 Tdk Corporation Differential receive at an ultrasonic transducer
US20240046691A1 (en) * 2022-08-03 2024-02-08 Qualcomm Incorporated Extended reality systems including ultrasound-based haptic systems

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736779B1 (en) * 1999-09-17 2004-05-18 Hitachi Medical Corporation Ultrasonic probe and ultrasonic diagnostic device comprising the same
US20050057284A1 (en) * 2003-03-06 2005-03-17 Wodnicki Robert Gideon Method and apparatus for controlling scanning of mosaic sensor array
US20080110266A1 (en) * 2006-11-10 2008-05-15 Penrith Corporation Transducer array imaging system
US20140219521A1 (en) * 2013-02-06 2014-08-07 Sonavation, Inc. Biometric sensing device for three dimensional imaging of subcutaneous structures embedded within finger tissue
US20140243676A1 (en) * 2013-02-28 2014-08-28 General Electric Company Delta delay approach for ultrasound beamforming on an asic

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3800270A (en) * 1972-07-12 1974-03-26 Johnson Service Co Piezoelectric acoustical transducer for transmitting and receiving
US4307613A (en) * 1979-06-14 1981-12-29 University Of Connecticut Electronically focused ultrasonic transmitter
US4523471A (en) * 1982-09-28 1985-06-18 Biosound, Inc. Composite transducer structure
JP2005045691A (ja) * 2003-07-24 2005-02-17 Taiyo Yuden Co Ltd 圧電振動装置
KR20130014619A (ko) * 2006-11-03 2013-02-07 리써치 트라이앵글 인스티튜트 굴곡 모드 압전 트랜스듀서를 사용하는 보강된 초음파 촬영 프로브
US7538477B2 (en) * 2006-11-27 2009-05-26 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Multi-layer transducers with annular contacts
CA2684788A1 (fr) * 2007-04-20 2009-02-05 Ultra-Scan Corporation Amelioration de fiabilite pour dispositif de reseau d'imagerie piezoelectrique
JP5754145B2 (ja) * 2011-01-25 2015-07-29 セイコーエプソン株式会社 超音波センサーおよび電子機器
US20120245408A1 (en) * 2011-03-22 2012-09-27 University Of Washington Through Its Center For Commercialization Methods and systems for improving actuator performance by reducing tensile stresses in piezoelectric thin films
US20130134838A1 (en) * 2011-11-28 2013-05-30 Qualcomm Mems Technologies, Inc. Piezoelectric mems transformer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736779B1 (en) * 1999-09-17 2004-05-18 Hitachi Medical Corporation Ultrasonic probe and ultrasonic diagnostic device comprising the same
US20050057284A1 (en) * 2003-03-06 2005-03-17 Wodnicki Robert Gideon Method and apparatus for controlling scanning of mosaic sensor array
US20080110266A1 (en) * 2006-11-10 2008-05-15 Penrith Corporation Transducer array imaging system
US20140219521A1 (en) * 2013-02-06 2014-08-07 Sonavation, Inc. Biometric sensing device for three dimensional imaging of subcutaneous structures embedded within finger tissue
US20140243676A1 (en) * 2013-02-28 2014-08-28 General Electric Company Delta delay approach for ultrasound beamforming on an asic

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9995821B2 (en) 2014-10-15 2018-06-12 Qualcomm Incorporated Active beam-forming technique for piezoelectric ultrasonic transducer array
US10001552B2 (en) 2014-10-15 2018-06-19 Qualcomm Incorporated Three-port piezoelectric ultrasonic transducer
US10139479B2 (en) 2014-10-15 2018-11-27 Qualcomm Incorporated Superpixel array of piezoelectric ultrasonic transducers for 2-D beamforming
US10497748B2 (en) 2015-10-14 2019-12-03 Qualcomm Incorporated Integrated piezoelectric micromechanical ultrasonic transducer pixel and array
CN109313890B (zh) * 2016-05-04 2023-12-22 应美盛公司 操作超声换能器的二维阵列
WO2017192237A1 (fr) * 2016-05-06 2017-11-09 Qualcomm Incorporated Système de capteur ultrasonore bidirectionnel pour dispositifs biométriques
TWI613997B (zh) * 2016-06-27 2018-02-11 麥克思商務咨詢(深圳)有限公司 超聲波感測器
CN106293219A (zh) * 2016-08-03 2017-01-04 京东方科技集团股份有限公司 一种具有压力触控功能的装置及其控制方法
CN106293219B (zh) * 2016-08-03 2019-09-06 京东方科技集团股份有限公司 一种具有压力触控功能的装置及其控制方法
WO2018120692A1 (fr) * 2016-12-27 2018-07-05 京东方科技集团股份有限公司 Dispositif d'affichage, et procédé de commande de dispositif d'affichage
CN106530968B (zh) * 2016-12-27 2019-09-20 京东方科技集团股份有限公司 显示装置和显示装置的控制方法
JP2020504341A (ja) * 2016-12-27 2020-02-06 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． 表示装置及び表示装置の制御方法
JP7122827B2 (ja) 2016-12-27 2022-08-22 京東方科技集團股▲ふん▼有限公司 表示装置及び表示装置の制御方法
CN106530968A (zh) * 2016-12-27 2017-03-22 京东方科技集团股份有限公司 显示装置和显示装置的控制方法

Also Published As

Publication number Publication date
WO2016061410A1 (fr) 2016-04-21
WO2016061406A1 (fr) 2016-04-21

Similar Documents

Publication Publication Date Title
US9995821B2 (en) Active beam-forming technique for piezoelectric ultrasonic transducer array
WO2016061412A1 (fr) Procédé de formation de faisceau active pour réseau de transducteurs ultrasonores piézoélectriques
EP3687707B1 (fr) Système et procédé de détection ultrasonore
US11580204B2 (en) Dual-frequency ultrasonic sensor system with frequency splitter
US9815087B2 (en) Micromechanical ultrasonic transducers and display
EP3990197B1 (fr) Réseau de capteurs à ultrasons
US11645865B2 (en) Randomized multi-fingerprint authentication
US12412416B2 (en) Apparatus and method for ultrasonic fingerprint and touch sensing
US11436857B1 (en) Ultrasonic sensor system with higher-frequency and lower-frequency areas
US11393239B2 (en) Multiple-frequency ultrasonic sensor system
KR20220016064A (ko) 수동 음향 지문 센서
US11348357B1 (en) Fingerprint sensor configured for avoidance of latent fingerprints

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15787119

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
REEP Request for entry into the european phase

Ref document number: 2015787119

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2015787119

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE