WO2016047815A1 - Capteur de pression différentielle - Google Patents
Capteur de pression différentielle Download PDFInfo
- Publication number
- WO2016047815A1 WO2016047815A1 PCT/KR2014/008782 KR2014008782W WO2016047815A1 WO 2016047815 A1 WO2016047815 A1 WO 2016047815A1 KR 2014008782 W KR2014008782 W KR 2014008782W WO 2016047815 A1 WO2016047815 A1 WO 2016047815A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chamber
- lead frame
- substrate
- sensor element
- sealing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL-COMBUSTION ENGINES
- F01N11/00—Monitoring or diagnostic devices for exhaust-gas treatment apparatus
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/06—Devices or apparatus for measuring differences of two or more fluid pressure values using electric or magnetic pressure-sensitive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/40—Engine management systems
Definitions
- the present invention relates to a differential pressure sensor used in an exhaust system aftertreatment device and the like.
- the exhaust system of the vehicle is equipped with an exhaust system aftertreatment device that physically collects, burns and removes particulate matter in the exhaust gas, and a low pressure exhaust gas recirculation cooler (LP EGR cooler) that cools the exhaust gas.
- LP EGR cooler low pressure exhaust gas recirculation cooler
- a differential pressure sensor is installed to measure the pressure difference between the front end and the rear end of the exhaust system aftertreatment device and the low pressure exhaust gas recirculation device cooler. If the exhaust system aftertreatment or the exhaust gas recirculator cooler fails, the differential pressure measured by the differential pressure sensor increases.
- Patent No. 1011098 discloses a differential pressure sensor having a housing including a first housing chamber, a second housing chamber, and a third housing chamber, wherein the first sealing part seals the third housing chamber with respect to the first housing chamber.
- a differential pressure sensor is disclosed in which a second sealing part arranged in an area where a first housing part, which is a body of the housing, and a second housing part, which is a cover, seals the first housing chamber from the second housing chamber.
- the differential pressure sensor reduces the bonding process since the second seal seals the housing outward and simultaneously seals the first housing chamber with the sensor element against the second housing chamber.
- Japanese Patent Laid-Open Publication No. 2013-0018570 includes an electronic module assembly each having a sensing element carrier element having a sensing element and an electronic module carrier element on which the electronic component is mounted, and a housing assembly for receiving the same.
- a sensor system is provided wherein an electrical connection is provided between the electronic module carrier element.
- Japanese Patent Laid-Open No. 2012-0062363 discloses a differential pressure sensor, wherein the differential pressure sensor includes a filter as a means for protecting the sensor chip from exhaust gas.
- a differential pressure sensor for achieving the above object includes a body and a cover, a housing having a first chamber, a second chamber and a third chamber separated from each other, and communicating with the first chamber.
- a second pressure channel communicating with the first pressure channel and the second chamber, the second pressure channel into which a gas having a higher pressure flows than the gas flowing into the first pressure channel, and the second chamber facing the second chamber and the third chamber.
- a substrate having a second surface parallel to one surface and a first surface thereof and facing the first chamber, wherein an electronic component is installed at a portion of the first surface facing the third chamber, the terminal having a terminal formed thereon;
- a sensor element disposed on the second surface of the substrate and disposed in the first chamber and generating an electrical signal according to a pressure difference between the first chamber and the second chamber; Extending into the third chamber, and an electrical signal of the sensor element
- the lead frame is configured to transmit the electronic device to an external device, a conductor connecting the terminal of the substrate and the lead frame in the third chamber to transmit the electrical signal of the sensor element to the lead frame, and the body and the cover are A first sealing part disposed in an area in contact with the second chamber and sealing the outside of the second chamber and the third chamber, and an area in contact with the substrate and the body to seal the first chamber with respect to the second chamber. And a third sealing part for sealing the third chamber with respect to the second chamber.
- the third sealing part may be disposed between the first surface and the cover of the substrate and may cross the first sealing part.
- the cover may be provided with a protrusion that separates the second chamber and the third chamber, and the third sealing part may be disposed between the protrusion and the first surface of the substrate.
- the electronic component may include a laminated ceramic capacitor, and the conductive wire may be an aluminum wire.
- the substrate is preferably a ceramic substrate.
- the lead frame includes a first lead frame, a second lead frame and a third lead frame electrically separated from each other, at least a portion of one end of the second lead frame and at least a portion of one end of the third lead frame. It is preferred that these are configured to cross each other.
- the differential pressure sensor according to the present invention has an advantage of easy assembly and simple structure.
- the sensor element is disposed in a chamber of low pressure with relatively low contamination, there is an advantage in that the life of the sensor element is increased.
- FIG. 1 and 2 are an exploded perspective view of an embodiment of a differential pressure sensor according to the present invention.
- FIG. 3 is a cross-sectional view of the differential pressure sensor shown in FIG.
- FIG. 4 is a view showing a part of the differential pressure sensor shown in FIG.
- 5 to 9 are views for explaining a method of assembling the differential pressure sensor shown in FIG.
- FIG. 1 and 2 is an exploded perspective view of an embodiment of a differential pressure sensor according to the present invention
- Figure 3 is a cross-sectional view of the differential pressure sensor shown in FIG. 1 to 3
- one embodiment of the differential pressure sensor according to the present invention includes a housing 10, a first pressure channel 24 and a second pressure channel 25, a substrate 30, and a sensor element 40.
- the housing 10 includes a body 20 and a cover 21. Cover 21 is fitted to the body 20 serves to seal the open top of the body 20 from the outside.
- the first chamber 11, the second chamber 12, and the third chamber 13 are formed inside the housing 10.
- the separating wall 14 formed at the center of the body 20 separates the second chamber 12 from the first chamber 11.
- the support part 15 is formed on the right side of the drawing of the first chamber 11 (see FIG. 3).
- One side of the body 20 is coupled to the nozzle-shaped first pressure channel 24 and the second pressure channel 25 side by side.
- the first pressure channel 24 may be connected to, for example, the rear end of the exhaust system aftertreatment device, and the second pressure channel 25 may be connected to the front end of the exhaust gas aftertreatment device.
- the first chamber 11 is in communication with the first pressure channel 24, and the second chamber 12 is in communication with the second pressure channel 25. Therefore, when the differential pressure between the first chamber 11 and the second chamber 12 is measured, the differential pressure between the front end and the rear end of the exhaust system aftertreatment device can be measured. Since the first chamber 11 is connected to the rear end of the exhaust system aftertreatment device, the pressure is relatively low and the pollution degree is low.
- the substrate 30 is disposed to cover the first chamber 11 inside the body 20.
- the substrate 30 is supported by the separating wall 14 and the support 15.
- the substrate 30 is provided with a sensor element 40, an electronic component 31 such as a laminated ceramic capacitor, a terminal 32, and the like.
- the sensor element 40 is provided on the lower surface of the substrate 30 in the drawing, and the electronic component 31 and the terminal 32 are provided on the upper surface of the substrate 30.
- the sensor element 40, the electronic component 31, and the terminal 32 may be electrically connected through a via hole (not shown) of the substrate 30.
- the sensor element 40 is installed on the lower surface of the substrate 30, and disposed inside the first chamber 11 having a low pollution rate, thereby minimizing damage to the sensor element 40 due to contamination. There is an advantage that the life of the sensor element 40 can be extended.
- the substrate 30 is preferably a ceramic substrate.
- the substrate 30 serves to support the sensor element 40 as well as to seal the first chamber 11 with respect to the second chamber 12 together with the second sealing part 80.
- An opening 33 is formed in the substrate 30, and the sensor element 40 is provided in a portion where the opening 33 is formed.
- the opening 33 is for transmitting the pressure of the second chamber 12 to the lower portion (the side in contact with the substrate) of the sensor element 40.
- a sensor element barrier 34 having a rectangular frame shape is disposed around the sensor element 40, and a gel 35 for protecting the sensor element 40 from harmful substances in exhaust gas is formed inside the sensor element barrier 34.
- the gel can be a fluoro silicone gel.
- the sensor element 40 may include, for example, a silicon-based semiconductor pressure sensor with a pressure sensitive membrane.
- the pressure of the second chamber 12 is transmitted to the lower portion of the sensor element 40 through the opening 33 of the substrate 30, and the pressure of the first chamber 11 is transferred to the gel 35 of the sensor element 40. Is passed through).
- the sensor element 40 generates an electric signal according to the pressure difference between the upper part and the lower part, and the electric signal is transmitted to the terminal 32 of the substrate 30 through the wiring formed on the substrate 30 and the electronic component 31. do.
- the right side of the body 20 is formed with a connector portion 16 for coupling with an external device, the connector portion 16 is provided with a lead frame 50.
- One end of the lead frame 50 extends into the housing 10, and the other end extends toward the outside of the housing 10.
- One end extending into the housing 10 of the lead frame 50 and the terminal 32 of the substrate 30 are electrically connected by the conductive wire 60.
- the conductive wire 60 is connected to the lead frame 50 and the terminal 32 by wire bonding.
- Conductor 60 may be an aluminum wire.
- the electrical signal of the sensor element 40 is transmitted to an external device capable of processing the electrical signal of the sensor element 40 through the lead frame 50.
- the lead frame 50 includes a first lead frame 51, a second lead frame 52, and a third lead frame 53 that are electrically separated from each other.
- the third lead frame 53 includes a third lead frame extension 531 extending in the direction of the second lead frame 52
- the second lead frame 52 includes the third lead frame.
- the second frame extension part 521 extends in the direction of the third lead frame 53 in parallel with the extension part 531.
- the opposite end 522 of the second frame extension 521 of the second lead frame 52 extends into the space between the second lead frame 52 and the first lead frame 51.
- This configuration is intended to prevent the conductor wires connecting the terminal 32 and the lead frame 50 from crossing each other regardless of a change in the pin map.
- the terminal 32 and the leaf frame 50 may be electrically connected to each other by adjusting only the length and the bonding position of the conductive wire 60.
- the first lead frame 51 is connected to the voltage input terminal, and the second lead frame 52 and the third lead frame 53 are connected to the voltage output terminal and ground, respectively.
- the middle terminal of the terminals 32 of the board is connected to the third lead frame extension 531 and the right terminal is connected to the second lead frame extension 521. Since the conductive wire 60 is connected to one end of the staggered, the conductive wire does not cross. If the conductors cross, they may be shorted.
- the terminal 32 of the board is the same as a general connection method.
- the middle terminal is connected to the second lead frame 52 and the right terminal is connected to the third lead frame 53.
- the first sealing part 70 for sealing the body 20 is disposed in an area where the body 20 and the cover 21 contact each other.
- the first sealing part 70 may be made of an adhesive bond.
- the first sealing part 70 is applied in the coupling groove 18 formed along the outer wall of the body 20.
- the first sealing part 70 has a generally rectangular shape.
- the second sealing part 80 is applied to a generally rectangular groove 16 formed on an upper surface of a structure forming a side wall of the first chamber 11 such as the separating wall 14 and the support part 15 of the body 20.
- the second sealing part 80 serves to seal the first chamber 11 with respect to the second chamber 12.
- the second sealing part 80 is installed on the lower surface of the substrate 30, and the pressure (pressure of the second chamber) of the upper surface of the substrate 30 is higher than the pressure of the lower surface of the substrate (pressure of the first chamber).
- the substrate 30 is in close contact with the first chamber 11 and a compressive force is applied to the second sealing portion 80.
- a compressive force is preferably applied.
- the third sealing part 90 serves to seal the third chamber 13 with respect to the second chamber 12. Inside the third chamber 13, electronic components 31 installed on the substrate 30, a terminal 32, a conductive wire 60, and a part of the lead frame 50 are disposed. Since the third chamber 13 is separated from the first chamber 11 and the second chamber 12, the electronic component 31, the terminal 32, the conductive wire 60 and the lead frame 50 are separated from the exhaust gas. Can be protected.
- the third sealing part 90 is applied between the protrusion 22 protruding toward the substrate 30 from the cover 21 and the upper surface of the substrate 30.
- the open top surface of the first chamber 11 is covered with the substrate 30 on which the sensor element 40 and the electronic components 31 are installed.
- the contact portion of the substrate 30 and the first chamber 11 is sealed by the second sealing portion 80.
- one end of the lead frame 50 and the terminal 32 of the substrate 30 are electrically connected through wire bonding.
- an adhesive constituting the first sealing part 70 is applied to the coupling groove 18 of the body 20, and the third sealing is performed on the upper surface of the substrate 30 and the guide 19.
- the adhesive constituting the portion 90 is applied.
- the cover 21 is inserted into the body 20 to seal the upper portion of the body 20, and the protrusion 22 of the cover 21 is inserted into the guide 19 to form the third chamber. (13) is sealed with respect to the 2nd chamber (12).
- the lower portion of the sensor element 40 is opened through the opening 33 of the substrate 30.
- the pressure of the second chamber 12 (second pressure channel) is transmitted, and the first chamber 11 (first pressure) is formed on the upper portion of the sensor element 40 through the gel 35 covering the sensor element 40. Channel) is transmitted.
- the sensor element 40 generates an electric signal according to the differential pressure.
- the electrical signal is transmitted to the terminal 32 of the substrate 30 through the wiring of the substrate 30 and the electronic component 31.
- the lead frame 50 is transmitted to the lead frame 50 through a conductive wire 60 that electrically connects the terminal 32 and the lead frame 50.
- the electrical signal transmitted to the lead frame 50 is transmitted to an external device connected to the connector portion 16 of the body 20.
- the external device measures the differential pressure to determine whether the exhaust system aftertreatment device is abnormal.
- housing 11 first chamber
- protrusion 24 first pressure channel
- lead frame 51 first lead frame
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
L'invention concerne un capteur de pression différentielle. Le capteur de pression différentielle, selon la présente invention, comprend : un boîtier comprenant un corps et un couvercle et ayant en son sein une première chambre, une deuxième chambre et une troisième chambre séparées les unes des autres ; un premier canal de pression communiquant avec la première chambre, et un second canal de pression communiquant avec la deuxième chambre et à travers lequel est introduit un gaz ayant une pression supérieure à celle d'un gaz introduit à travers le premier canal de pression ; un substrat ayant une première surface faisant face aux deuxième et troisième chambres et une seconde surface parallèle à la première surface et tournée vers la première chambre, dotée de pièces électroniques au niveau d'une partie de la première surface tournée vers la troisième chambre, et possédant une borne ; un élément capteur prévu sur la seconde surface du substrat, disposé à l'intérieur de la première chambre et générant un signal électrique en fonction d'une différence de pression entre la première chambre et la deuxième chambre ; un cadre de montage situé dans le logement, dont une extrémité s'étend à l'intérieur de la troisième chambre, et conçu de façon à délivrer le signal électrique de l'élément de capteur à un dispositif externe ; un fil conducteur pour connecter la borne du substrat et le cadre de montage à l'intérieur de la troisième chambre de manière à délivrer le signal électrique de l'élément capteur au cadre de montage ; une première partie d'étanchéité agencée dans une région dans laquelle le corps et le couvercle entrent en contact et scellant les deuxième et troisième chambres à partir de l'extérieur ; une deuxième partie d'étanchéité agencée dans une région dans laquelle le substrat et le corps entrent en contact et scellant la première chambre depuis la deuxième chambre ; et une troisième partie d'étanchéité pour sceller la troisième chambre depuis la deuxième chambre.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020177002731A KR101811185B1 (ko) | 2014-09-22 | 2014-09-22 | 차압센서 |
| PCT/KR2014/008782 WO2016047815A1 (fr) | 2014-09-22 | 2014-09-22 | Capteur de pression différentielle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/KR2014/008782 WO2016047815A1 (fr) | 2014-09-22 | 2014-09-22 | Capteur de pression différentielle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2016047815A1 true WO2016047815A1 (fr) | 2016-03-31 |
Family
ID=55581330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2014/008782 Ceased WO2016047815A1 (fr) | 2014-09-22 | 2014-09-22 | Capteur de pression différentielle |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101811185B1 (fr) |
| WO (1) | WO2016047815A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111664990A (zh) * | 2019-03-05 | 2020-09-15 | 硅微结构股份有限公司 | 无引线压力传感器 |
| US10975028B2 (en) | 2017-10-17 | 2021-04-13 | Sumitomo Chemical Company, Limited | Salt and photoresist composition containing the same |
| CN114354055A (zh) * | 2021-11-16 | 2022-04-15 | 凯晟动力技术(嘉兴)有限公司 | 一种高稳定性dpf/gpf压差传感器 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102839097B1 (ko) | 2024-08-26 | 2025-07-28 | 주식회사 유온테크 | IoT 집진기의 필터 감지용 차압센서 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000346737A (ja) * | 1999-06-02 | 2000-12-15 | Denso Corp | 圧力センサ |
| WO2007015435A1 (fr) * | 2005-08-01 | 2007-02-08 | Matsushita Electric Industrial Co., Ltd. | Dispositif semi-conducteur |
| JP2010145341A (ja) * | 2008-12-22 | 2010-07-01 | Nabtesco Corp | 圧力センサモジュール |
| US20110088480A1 (en) * | 2009-10-16 | 2011-04-21 | Silicon Micro Sensors Gmbh | Pressure sensor and use thereof in a fluid tank |
| KR20130018570A (ko) * | 2011-08-01 | 2013-02-25 | 센사타 테크놀로지스, 인크 | 차압 측정을 위한 센서 시스템 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10223357A1 (de) | 2002-05-25 | 2003-12-04 | Bosch Gmbh Robert | Vorrichtung zur Druckmessung |
| KR20120062363A (ko) | 2010-12-06 | 2012-06-14 | 현대자동차주식회사 | Lp-egr 쿨러 차압 센서 |
-
2014
- 2014-09-22 WO PCT/KR2014/008782 patent/WO2016047815A1/fr not_active Ceased
- 2014-09-22 KR KR1020177002731A patent/KR101811185B1/ko not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000346737A (ja) * | 1999-06-02 | 2000-12-15 | Denso Corp | 圧力センサ |
| WO2007015435A1 (fr) * | 2005-08-01 | 2007-02-08 | Matsushita Electric Industrial Co., Ltd. | Dispositif semi-conducteur |
| JP2010145341A (ja) * | 2008-12-22 | 2010-07-01 | Nabtesco Corp | 圧力センサモジュール |
| US20110088480A1 (en) * | 2009-10-16 | 2011-04-21 | Silicon Micro Sensors Gmbh | Pressure sensor and use thereof in a fluid tank |
| KR20130018570A (ko) * | 2011-08-01 | 2013-02-25 | 센사타 테크놀로지스, 인크 | 차압 측정을 위한 센서 시스템 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10975028B2 (en) | 2017-10-17 | 2021-04-13 | Sumitomo Chemical Company, Limited | Salt and photoresist composition containing the same |
| CN111664990A (zh) * | 2019-03-05 | 2020-09-15 | 硅微结构股份有限公司 | 无引线压力传感器 |
| CN114354055A (zh) * | 2021-11-16 | 2022-04-15 | 凯晟动力技术(嘉兴)有限公司 | 一种高稳定性dpf/gpf压差传感器 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170027339A (ko) | 2017-03-09 |
| KR101811185B1 (ko) | 2017-12-27 |
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