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WO2015129546A1 - Film de blindage électromagnétique, substrat imprimé flexible, substrat pour montage de composant électronique et procédé de recouvrement de composant électronique - Google Patents

Film de blindage électromagnétique, substrat imprimé flexible, substrat pour montage de composant électronique et procédé de recouvrement de composant électronique Download PDF

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Publication number
WO2015129546A1
WO2015129546A1 PCT/JP2015/054654 JP2015054654W WO2015129546A1 WO 2015129546 A1 WO2015129546 A1 WO 2015129546A1 JP 2015054654 W JP2015054654 W JP 2015054654W WO 2015129546 A1 WO2015129546 A1 WO 2015129546A1
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WIPO (PCT)
Prior art keywords
electromagnetic wave
layer
wave shielding
shielding film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/054654
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English (en)
Japanese (ja)
Inventor
明徳 橋本
雅彦 渡邊
白石　史広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014033732A external-priority patent/JP2015159214A/ja
Priority claimed from JP2014184019A external-priority patent/JP2016058565A/ja
Priority claimed from JP2014187193A external-priority patent/JP6497009B2/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of WO2015129546A1 publication Critical patent/WO2015129546A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2571/00—Protective equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Definitions

  • the present invention relates to an electromagnetic wave shielding film (hereinafter also referred to as an electromagnetic wave shielding film), a flexible printed circuit board, an electronic component mounting substrate, and an electronic component coating method. More specifically, the present invention relates to an electromagnetic wave shielding film in which no crack is generated even when Z-folding is performed, and a flexible printed board using the electromagnetic wave shielding film.
  • This application is filed in Japanese Patent Application No. 2014-33732 filed in Japan on February 25, 2014, Japanese Patent Application No. 2014-108082 filed in Japan on May 26, 2014, and in Japan on September 10, 2014. Claim priority based on Japanese Patent Application No. 2014-184019 filed and Japanese Patent Application No. 2014-187193 filed in Japan on September 16, 2014, the contents of which are incorporated herein by reference.
  • the mounted electronic device has an electromagnetic wave shielding film attached to the surface in order to reduce the influence of noise caused by electromagnetic waves.
  • an electromagnetic wave shielding film a film having a base material layer made of an insulating material and a metal layer laminated on one or both surfaces of the base material layer as described in Patent Documents 1 to 4. Have been used.
  • JP 2006-156946 A Japanese Patent Application Laid-Open No. 07-297592 Japanese Patent Laid-Open No. 06-224589 Japanese Patent Laid-Open No. 06-152182
  • the present invention can cope with the weight reduction and thinning of electronic parts such as flexible printed circuit boards, has excellent resistance to goby folds, and has excellent shape followability and adhesion even when affixed to the surface of uneven electronic parts. It is an object to provide an electromagnetic wave shielding film and a flexible printed circuit board.
  • the object of the present invention is to reduce the weight and thickness, and to use an electromagnetic wave shielding film capable of effectively blocking electromagnetic waves in a high frequency band as in the GHz order, and the electromagnetic wave shielding film.
  • An object of the present invention is to provide an electronic component mounting substrate in which an electronic component mounted on a substrate is covered with an electromagnetic wave shielding layer.
  • the object of the present invention is to increase the degree of freedom in designing the substrate, reduce the weight and reduce the thickness, and for an electronic component having a substrate with unevenness, an electromagnetic shielding film having good shape followability, Another object of the present invention is to provide a method for coating an electronic component using the electromagnetic wave shielding film.
  • Another object of the present invention is to increase the degree of freedom in designing the substrate and reduce the thickness, and between the electronic component having conductivity on the surface and the electromagnetic wave shielding layer with respect to the electronic component having the substrate with unevenness.
  • An object of the present invention is to provide a method of coating without conducting current.
  • the present inventors have conducted intensive studies to solve the above problems. As a result, at least a base material layer and an electromagnetic wave shielding layer are laminated in order, and the electromagnetic wave shielding layer is an electromagnetic wave shielding film formed from a composition having conductivity between both ends when Z-folding is performed. Found that the problem can be solved. As a result of further studies based on these findings, the present invention has been completed.
  • the present invention includes the following aspects.
  • the base material layer includes a laminate in which at least two layers are laminated.
  • the base material layer is a laminate in which a first layer, a second layer, and a third layer are sequentially laminated, and any one of [1] to [5] The electromagnetic wave shielding film of item.
  • the thickness T (A) of the first layer, the thickness T (C) of the second layer, and the thickness T (B) of the third layer satisfy the following formula (1):
  • a substrate on which an electronic component is mounted comprising the electromagnetic wave shielding film according to any one of [1] to [8] as an uneven covering member on the substrate, wherein the unevenness has a step of 1 mm or more.
  • a substrate comprising: [10] A flexible printed board comprising the electromagnetic wave shielding film according to any one of [1] to [8] as an electromagnetic wave shielding member.
  • the film for electromagnetic wave shielding according to [11] wherein the conductive polymer is polyaniline.
  • An electronic component mounting substrate having an electromagnetic wave shielding layer, The electronic component mounting substrate, wherein the electromagnetic wave shielding layer contains a conductive polymer and metal powder.
  • An electromagnetic wave shielding film used for covering unevenness on a substrate, An insulating layer and an electromagnetic wave shielding layer laminated on one surface side of the insulating layer; The film for electromagnetic wave shielding, wherein the film has a thickness of 8 ⁇ m or more and 50 ⁇ m or less.
  • the conductive polymer is at least one of polyethylene dioxythiophene / polystyrene sulfonate [PEDOT / PSS] and polyaniline.
  • the electromagnetic wave shielding film of the present invention can cope with the reduction in weight and thickness of electronic components, has excellent resistance to goby folding, and has excellent shape followability and adhesion even when applied to the surface of an electronic component having irregularities. . Moreover, since the electromagnetic wave shielding film of the present invention is used as an electromagnetic wave shielding layer on the surface of the flexible printed board of the present invention, it can cope with the reduction in weight and thickness of electronic parts, has excellent goby folding resistance, and has unevenness. Excellent adhesion between the surface of the flexible printed circuit board and the electromagnetic shielding layer.
  • the electromagnetic wave shielding film comprises a base material layer and an electromagnetic wave shielding layer containing a conductive polymer and metal powder as main materials, thereby reducing the weight of the electromagnetic wave shielding layer.
  • -It can be thinned and can effectively block electromagnetic waves in a high frequency band as in the GHz order.
  • the thickness of the electromagnetic wave shielding film is set to 8 ⁇ m or more and 50 ⁇ m or less, so that the degree of freedom in designing the substrate covered with the electromagnetic wave shielding film can be increased, and the weight and thickness can be reduced.
  • substrate covered with the film for electromagnetic wave shielding by setting the puncture intensity
  • FIG. 1 is a longitudinal cross-sectional view which shows 1st Embodiment of the electromagnetic wave shield film of this invention. It is a longitudinal cross-sectional view which shows 2nd Embodiment of the electromagnetic wave shield film of this invention. It is a longitudinal cross-sectional view which shows 3rd Embodiment of the electromagnetic wave shield film of this invention. It is a longitudinal cross-sectional view which shows 4th Embodiment of the electromagnetic wave shield film of this invention. It is a longitudinal cross-sectional view which shows 5th Embodiment of the electromagnetic wave shield film of this invention. It is a longitudinal cross-sectional view which shows 6th Embodiment of the electromagnetic wave shield film of this invention.
  • FIG. 1 ist Embodiment of the electromagnetic wave shield film of this invention. It is a longitudinal cross-sectional view which shows 2nd Embodiment of the electromagnetic wave shield film of this invention. It is a longitudinal cross-sectional view which shows 3rd Embodiment of the electromagnetic wave shield film of this invention. It is a
  • FIG. 7 is a longitudinal sectional view for explaining a method of coating an electronic component using the electromagnetic wave shielding film shown in FIGS. It is a longitudinal cross-sectional view which shows 7th Embodiment of the film for electromagnetic wave shields of this invention. It is a longitudinal cross-sectional view for demonstrating the coating method of an electronic component using the film for electromagnetic wave shields shown in FIG. It is a longitudinal cross-sectional view which shows 8th Embodiment of the film for electromagnetic wave shields of this invention. It is a longitudinal cross-sectional view which shows 9th Embodiment of the film for electromagnetic wave shields of this invention. It is a longitudinal cross-sectional view which shows 10th Embodiment of the film for electromagnetic wave shields of this invention.
  • the electromagnetic wave shielding film of this embodiment is formed by sequentially laminating at least a base material layer and an electromagnetic wave shielding layer, and the electromagnetic wave shielding layer is formed from a composition having conductivity between both ends when Z-folding is performed. It is characterized by that.
  • the base material layer functions as a protective film for the electromagnetic wave shielding layer, and as shown in FIG. 7, when the electromagnetic wave shielding layer 3 is attached to the surface of an uneven electronic component,
  • the blocking layer 3 has a good shape followability and a function of maintaining adhesion.
  • the base material layer is peeled off from the electromagnetic wave shielding layer after the electromagnetic wave shielding layer is attached to the surface of the electronic component having irregularities.
  • the electromagnetic wave shielding layer is in close contact with the surface of the electronic component having unevenness, and functions as an excellent electromagnetic wave shielding layer for the electronic component.
  • the electromagnetic wave shielding film of the present invention includes: First Embodiment, 2. Second embodiment, 3. Third embodiment, 4. 4. Fourth embodiment 5. a fifth embodiment; 6. Sixth embodiment, and Other embodiments are included.
  • First to sixth embodiments and other embodiments will be described in detail.
  • An electronic component coating method will also be described.
  • FIG. 1 is a longitudinal sectional view showing a first embodiment of an electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 1 may be referred to as “upper” and the lower side may be referred to as “lower” (hereinafter the same applies to FIGS. 2 to 17).
  • the base material layer 1 is composed of three layers of a first layer 11, a second layer 13, and a third layer 12, and these three layers are laminated in this order.
  • the electromagnetic wave shielding layer 3 is in contact with and laminated on the lower surface of the third layer 12.
  • an insulating layer 2 may be laminated on the lower surface of the electromagnetic wave shielding layer 3 as necessary.
  • the base material layer 1 will be described.
  • the base material layer 1 is formed on the electromagnetic wave shielding layer 3 when the electromagnetic wave shielding film 3 is pressed and coated on the unevenness 6 on the substrate 5. It has a good shape followability and a function to maintain adhesion.
  • the base material layer 1 is peeled off from the electromagnetic wave shielding layer after the electromagnetic wave shielding layer is attached to the surface of the unevenness 6 on the substrate 5.
  • the storage elastic modulus at 150 ° C. of the base material layer 1 is preferably 2.0E + 05 Pa or more and 5.0E + 08 Pa or less, more preferably 1.0E + 06 Pa or more and 3.0E + 08 Pa or less, and 3.0E + 06 Pa or more and 9.0E + 07 Pa or less. More preferably.
  • the base material layer is configured by appropriately setting the average linear expansion coefficient of each of the first layer 11, the second layer 13, and the third layer 12 constituting the base material layer 1.
  • the storage elastic modulus at 1 at 150 ° C. can be easily set within the above range.
  • the electromagnetic wave shielding film 100 When the electromagnetic wave shielding film 100 is coated by pressing the electromagnetic wave shielding layer 3 into the unevenness 6 on the substrate 5 by setting the storage elastic modulus at 150 ° C. of the base material layer 1 in the above range, the electromagnetic wave shielding layer 3 is good. Shape followability and adhesion can be maintained. Thereby, the electromagnetic wave shielding (blocking) property is improved.
  • the step of the unevenness 6 provided on the substrate 5 is 0.5 mm or more, and is further about 1.0 mm to 3.0 mm. Even if the separation distance of the convex portion 61 is 200 ⁇ m or less, and even as short as about 100 ⁇ m to 150 ⁇ m, the electromagnetic wave shielding layer 3 can maintain good shape followability and adhesiveness corresponding to the shape of the unevenness 6. Can be pushed in reliably.
  • the storage elastic modulus at 25 ° C. of the base material layer 1 is preferably 1.0E + 07 Pa or more and 1.0E + 10 or less Pa, and more preferably 5.0E + 08 Pa or more and 5.0E + 09 Pa or less. If it is the said range, the base material layer 1 will be solid before heating the electromagnetic wave shielding film 100, and can be made into semi-solid at the time of heating. Accordingly, the electromagnetic wave shielding film 100 can be attached without causing wrinkles, the workability when cutting to a specified size can be improved, and the electromagnetic wave shielding layer 3 is provided with the concave portion 62 having the concave and convex portions 6. It can be pushed in securely.
  • the base material layer 1 having the above storage elastic modulus range includes at least the first layer 11 and the third layer 12 made of a thermoplastic resin, and the electromagnetic wave shielding film 100 is heated in the pasting step. Even after being done, it is preferable that the storage elastic modulus at 25 ° C. maintain the above range. By carrying out like this, the base material layer 1 can be easily peeled from the electromagnetic wave shielding layer 3 in the peeling step.
  • the base material layer 1 can reduce the width of the change in the storage elastic modulus of the base material layer 1 due to the temperature change at the time of heating, and the temperature change even when the temperature condition at the time of heating is changed. Since the width of the change in the storage elastic modulus of the base material layer 1 due to the above can be kept as small as necessary, the electromagnetic wave shielding layer 3 can be reliably pushed into the recess 62.
  • the storage elastic modulus at 25 ° C., 120 ° C. and 150 ° C. of the base material layer 1 is, for example, stored at 25 to 200 ° C. using a dynamic viscoelasticity measuring device (“DMS6100” manufactured by Seiko Instruments Inc.).
  • the elastic modulus can be determined by measuring the elastic modulus at 25 ° C., 120 ° C., and 150 ° C. by measuring the elastic modulus at a temperature rising rate of 5 ° C./min and a frequency of 1 Hz in a tensile mode with a constant load of 49 mN.
  • the thickness T (A) of the first layer 11, the thickness T (C) of the second layer 13, and the thickness T (B) of the third layer 12 are expressed by the following relational expression.
  • 0.05 ⁇ T (C) / (T (A) + T (B)) ⁇ 10 (1) More preferably, the following relational expression is satisfied: 0.14 ⁇ T (C) / (T (A) + T (B)) ⁇ 4 (2) More preferably, the following relational expression is satisfied.
  • the total thickness T (F) of the base material layer 1 is not particularly limited, but is preferably 20 ⁇ m or more and 300 ⁇ m or less, more preferably 40 ⁇ m or more and 220 ⁇ m or less, and further preferably 70 ⁇ m or more and 160 ⁇ m or less. .
  • the total thickness T (F) of the base material layer 1 is thinner than 20 ⁇ m, the first layer 11 may be broken and the releasability of the base material layer 1 may be lowered, and is thicker than 300 ⁇ m. In such a case, the shape followability of the base material layer 1 may be lowered, and the shape followability of the electromagnetic wave blocking layer 3 may be lowered.
  • the first layer 11 constituting the base material layer 1 is formed by applying the electromagnetic wave shielding layer 3 to the unevenness 6 on the substrate 5 of the electronic component in the step of attaching the electromagnetic wave shielding film of FIG. It is a layer that makes it easy to release the pressing portion such as the vacuum pressure laminator and the base material layer 1 after being pushed in from above using a vacuum pressure laminator or the like. Moreover, it is for propagating the pressing force from a pressing part to the 2nd layer 13 side.
  • the constituent material of the first layer 11 is not particularly limited, and examples thereof include resins such as syndiotactic polystyrene, polymethylpentene, boribylene terephthalate, polypropylene, cyclic olefin polymer, and silicone. Among these, syndiotactic polystyrene is preferable. Since syndiotactic polystyrene has crystallinity, it has excellent releasability between the first layer 11 and a pressing part such as a vacuum pressure laminator, and is also excellent in heat resistance and shape followability. .
  • resins such as syndiotactic polystyrene, polymethylpentene, boribylene terephthalate, polypropylene, cyclic olefin polymer, and silicone. Among these, syndiotactic polystyrene is preferable. Since syndiotactic polystyrene has crystallinity, it has
  • syndiotactic polystyrene When syndiotactic polystyrene is used for the first layer 11, the content is not particularly limited, but is preferably 60% by mass or more, more preferably 70% by mass or more and 100% by mass or less, and 80 More preferably, it is at least 100% by mass. If the content of syndiotactic polystyrene is less than 60% by mass, the releasability of the first layer 11 may be lowered.
  • the first layer 11 may contain styrene elastomer, polyethylene, polypropylene or the like.
  • the thickness T (A) of the first layer 11 is not particularly limited, but is preferably 5 ⁇ m or more and 100 ⁇ m or less, more preferably 10 ⁇ m or more and 70 ⁇ m or less, and further preferably 20 ⁇ m or more and 50 ⁇ m or less. If the thickness of the first layer 11 is less than 5 ⁇ m, the first layer 11 may be broken and the releasability may be deteriorated. If the thickness is greater than 100 ⁇ m, the shape following property of the base material layer 1 is deteriorated and the electromagnetic wave blocking layer. There is a risk that the shape followability of No. 3 is lowered. T (A) is preferably in a range that satisfies the above relational expression (1).
  • the average linear expansion coefficient at 25 to 150 ° C. of the first layer 11 is preferably 40 ppm / ° C. or more and 1000 ppm / ° C. or less, and more preferably 80 ppm / ° C. or more and 700 ppm / ° C. or less.
  • the first layer 11 has excellent stretchability when the electromagnetic wave shielding film 100 is heated.
  • the shape followability with respect to the unevenness 6 of the blocking layer 3 can be improved more reliably.
  • the surface tension of the first layer 11 is preferably 20 mN / m or more and 40 mN / m or less, and more preferably 25 mN / m or more and 35 mN / m or less.
  • the first layer 11 has excellent performance of releasability, and therefore, after pressing using a vacuum pressure laminator or the like, The first layer 11 can be easily peeled from the part.
  • the third layer 12 constituting the base material layer 1 is a base material layer when the base material layer 1 is peeled from the electromagnetic wave shielding layer 3 after the electromagnetic wave shielding film is attached to an electronic component. 1 and the electromagnetic wave shielding layer 3 are provided with a peelable function. Moreover, according to the uneven
  • the material similar to the constituent material of said 1st layer 11 can be used.
  • syndiotactic polystyrene is preferred. Since syndiotactic polystyrene has crystallinity, it has excellent releasability between the third layer 12 and the electromagnetic wave shielding layer 3, and is also excellent in heat resistance and shape followability.
  • the third layer 12 may be the same as the resin constituting the first layer 11 or may be different.
  • the thickness T (B) of the third layer 12 is not particularly limited, but is preferably 5 ⁇ m to 100 ⁇ m, more preferably 10 ⁇ m to 70 ⁇ m, and still more preferably 20 ⁇ m to 50 ⁇ m.
  • the thickness of the third layer 12 may be the same as or different from the thickness of the first layer 11, but is preferably in a range that satisfies the above-described relational expression (1).
  • the average linear expansion coefficient at 25 to 150 ° C. of the third layer 12 is preferably 40 ppm / ° C. or more and 1000 ppm / ° C. or less, and more preferably 80 ppm / ° C. or more and 700 ppm / ° C. or less.
  • the third layer 12 has excellent stretchability when the electromagnetic wave shielding film 100 is heated.
  • the shape followability of the layer 12 and the shape followability of the electromagnetic wave shielding layer 3 with respect to the irregularities 6 can be improved more reliably.
  • the surface tension of the third layer 12 is preferably 20 mN / m or more and 40 mN / m or less, and more preferably 25 mN / m or more and 35 mN / m or less.
  • the third layer 12 has excellent releasability, so that the base material layer 1 after indentation using a vacuum pressure laminator or the like. And the electromagnetic wave shielding layer 3 can be reliably peeled off.
  • the second layer 13 constituting the base material layer 1 has a function as a cushion for pushing the electromagnetic wave shielding layer 3 into the unevenness 6 from above the base material layer 1 through the third layer 12, and the electromagnetic wave shielding layer 3. Has a function of uniformly pushing into the irregularities 6.
  • the electromagnetic wave blocking layer 3 can be pushed into the unevenness 6 with an excellent hermeticity without generating a void between the electromagnetic wave blocking layer 3 and the unevenness 6.
  • Examples of the constituent material of the second layer 13 include ⁇ -olefin polymers such as polyethylene and polypropylene, ⁇ -olefin copolymers containing ethylene, propylene, butene, pentene, hexene, methylpentene, and the like, polyethers Examples thereof include engineering plastics resins such as sulfone and polyphenylene sulfide, and these may be used alone or in combination.
  • an ⁇ -olefin copolymer a copolymer of an ⁇ -olefin such as ethylene and a (meth) acrylic acid ester, a copolymer of ethylene and vinyl acetate, ethylene and ( More preferred are copolymers with (meth) acrylic acid (EMMA) and partially ionized cross-linked products thereof.
  • the ⁇ -olefin copolymer is excellent in shape followability, and more flexible than the constituent material of the third layer 12, so that it surely provides a cushion function for pushing into the irregularities 6. Can do.
  • the thickness T (C) of the second layer 13 is preferably in a range that satisfies the above relational expression.
  • T (C) is preferably 10 ⁇ m or more and 100 ⁇ m or less, more preferably 20 ⁇ m or more and 80 ⁇ m or less, and further preferably 30 ⁇ m or more and 60 ⁇ m or less. If the thickness of the second layer 13 is less than 10 ⁇ m, the shape followability of the second layer 13 is insufficient, and the followability to the irregularities 6 may be insufficient in the thermocompression bonding process.
  • the average linear expansion coefficient at 25 to 150 ° C. of the second layer 13 is preferably 400 ppm / ° C. or more, and more preferably 800 ppm / ° C. or more.
  • the electromagnetic wave shielding film 100 can be stretched more excellently than the third layer 12 when heated. Thereby, the shape followability of the second layer 13 and the electromagnetic wave shielding layer 3 with respect to the irregularities 6 can be improved more reliably.
  • the electromagnetic wave shielding layer 3 is formed from a composition having conductivity between both ends when Z-folding is performed. As a result, the surface of the electronic component 4 having unevenness is closely adhered to the surface, and no cracks are generated even when Z-folded. Thus, an excellent function as an electromagnetic wave shielding layer of the electronic component 4 is exhibited.
  • the electromagnetic wave shielding layer 3 used in the electromagnetic wave shielding film of the present invention contains a conductive composition and a binder. Thereby, it can be set as the composition which has electroconductivity between the both ends, when Z-folding is performed.
  • the electromagnetic wave blocking layer 3 is not particularly limited except that it contains a conductive composition and a binder, and may block electromagnetic waves in any form.
  • the electromagnetic wave blocking layer 3 may be a reflective layer that blocks and shields electromagnetic waves by reflecting the electromagnetic waves incident on the electromagnetic wave blocking layers 3, or absorbs the electromagnetic waves incident on the electromagnetic wave blocking layer 3 to absorb the electromagnetic waves. It may be an absorbing layer that blocks and shields.
  • the reflective layer and the absorption layer may be laminated, or a layer made of a mixture of the substance constituting the reflection layer and the substance constituting the absorption layer.
  • the electromagnetic wave shielding layer 3 is a reflective layer
  • the conductive adhesive layer is preferably used as a reflective layer because it exhibits excellent electromagnetic shielding properties even when its film thickness (thickness) is set to be relatively thin.
  • the conductive adhesive layer contains a metal powder that is a conductive composition and a binder.
  • the metal powder include gold, silver, copper, silver-coated copper, and nickel. Among these, it is preferable to use silver because it has excellent electromagnetic shielding properties.
  • the binder is preferably composed mainly of an amorphous thermoplastic resin.
  • Amorphous thermoplastic resins include amorphous polyester resins; vinyl resins such as vinyl chloride-vinyl acetate copolymers, polyvinyl acetate, and polyvinyl chloride; acrylic resins such as polymethyl methacrylate; GPPS, etc. And polystyrene resins; polycarbonate resins such as bisphenol A type polycarbonate; Of these amorphous thermoplastic resins, amorphous polyester resins and vinyl resins are preferred from the viewpoint of adhesion between layers, adhesion with the base material layer and electronic components, heat resistance, shape followability, Amorphous polyester resins are particularly preferable from the viewpoint of excellent balance.
  • the amorphous polyester resin is not particularly limited as long as it is substantially amorphous, and includes various polyesters composed of a dicarboxylic acid component and a diol component.
  • dicarboxylic acid component examples include terephthalic acid, isophthalic acid, phthalic acid, 5-t-butylisophthalic acid, 4,4′-biphenyldicarboxylic acid, trans-3,3′-stilbene dicarboxylic acid, and trans-4,4.
  • diol component examples include ethylene glycol, diethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 2,2 -Dimethyl-1,3-propanediol, 1,6-hexanediol, 2-ethyl-2-methyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 1,8-octane Aliphatic acids such as diol, 2-ethyl-2-butyl-1,3-propanediol, 2-ethyl-2,4-dimethyl-1,3-hexanediol, 1,10-decanediol, polyethylene glycol, polypropylene glycol Diol; 1,2-cyclohexanedimethanol, 1,3-cyclohexanedim
  • amorphous polyester resins include oxycarboxylic acids such as p-oxybenzoic acid and p-oxyethoxybenzoic acid; monocarboxylic acids such as benzoic acid and benzoylbenzoic acid; and polyvalent acids such as trimellitic acid. It may contain structural units such as a carboxylic acid; a monohydric alcohol such as polyalkylene glycol monomethyl ether; a polyhydric alcohol such as glycerin, pentaerythritol, and trimethylolpropane.
  • the binder is preferably blended in an amount of 15% by mass to 55% by mass, and more preferably in an amount of 20% by mass to 50% by mass.
  • the blending amount of the binder is less than 15% by mass, the flexibility and the adhesion to the electronic device component may be lowered.
  • it exceeds 55% by mass the electromagnetic shielding property may be deteriorated. .
  • the conductive adhesive layer may further contain a flame retardant, a leveling agent, a viscosity modifier and the like in addition to the metal powder and the binder resin.
  • the thickness T (E1) of the reflective layer is not particularly limited, but is preferably 5 ⁇ m to 100 ⁇ m, more preferably 8 ⁇ m to 50 ⁇ m, and even more preferably 10 ⁇ m to 30 ⁇ m. . If the thickness of the reflective layer is less than 5 ⁇ m, the material for the reflective layer may have insufficient gobbling resistance and may break at the end of the mounted component. If it is thicker than 100 ⁇ m, Depending on the constituent material, etc., shape followability may be insufficient.
  • the thickness T (E1) is within this range, it is possible to exhibit excellent electromagnetic wave shielding properties, so that the thickness T (E1) of the reflective layer can be reduced, and the electromagnetic wave blocking layer 3 can be coated. It is possible to reduce the weight of the substrate 5 on which the electronic component 4 is mounted.
  • the absorbing layer constituting the electromagnetic wave shielding layer 3 is, for example, a conductive absorbing layer composed mainly of a conductive absorbing material containing metal powder or a conductive polymer material and a binder as a conductive composition, and a conductive composition. Consists of a dielectric material comprising a carbon material or a dielectric material containing a conductive polymer material and a binder as a main material, and a magnetic material containing a soft magnetic metal and a binder as a main material as a conductive composition. These may be used alone or in combination or in combination.
  • the conductive absorption layer absorbs electromagnetic waves by converting electromagnetic energy into thermal energy by the current flowing inside the material when an electric field is applied, and the dielectric absorption layer converts electromagnetic waves into thermal energy by dielectric loss.
  • the magnetic absorption layer absorbs electromagnetic waves by converting the energy of radio waves into heat and consuming them due to magnetic losses such as overcurrent loss, hysteresis loss, and magnetic resonance.
  • the absorption layer constituting the electromagnetic wave shielding layer 3 can be any of a conductive absorption layer, a dielectric absorption layer, and a magnetic absorption layer.
  • the conductive absorption layer, the dielectric absorption layer, and the magnetic absorption layer are preferably used as the absorption layer because they exhibit particularly excellent electromagnetic shielding properties even when the film thickness (thickness) is set to be relatively thin.
  • the film thickness can be set relatively easily and the weight can be reduced.
  • Examples of the conductive composition used for the conductive absorbing material include conductive polymers, metal oxides such as ATO, and conductive ceramics.
  • Examples of the conductive polymer include polyacetylene, polypyrrole, PEDOT (poly-ethylenedioxythiophene), PEDOT / PSS, polythiophene, polyaniline, poly (p-phenylene), polyfluorene, polycarbazole, polysilane, and derivatives thereof. These can be used alone or in combination of two or more.
  • Examples of the conductive composition used for the dielectric absorbing material include carbon-based materials and conductive polymers.
  • Examples of carbon-based materials include carbon nanotubes such as single-walled carbon nanotubes and multi-walled carbon nanotubes, carbon nanofibers, CN nanotubes, CN nanofibers, BcN nanotubes, BcN nanofibers, graphene, carbon microcoils, carbon nanocoils, Examples thereof include carbons such as carbon nanohorns and carbon nanoballs, and one or more of these can be used in combination.
  • Examples of the conductive polymer include the conductive polymers described above.
  • Examples of the conductive composition used for the magnetic absorbing material include iron, silicon steel, magnetic stainless steel (FeCrA1Si alloy), sendust (FeSiAl alloy), permalloy (FeNi alloy), silicon copper (FeCuSi alloy), FeSi alloy, and FeSiB. Examples thereof include soft magnetic metals such as (CuNb) alloys.
  • the binder used for the conductive absorbing material, dielectric absorbing material, and magnetic absorbing material is preferably based on the above amorphous thermoplastic resin, and the amorphous thermoplastic resin is an amorphous polyester resin. More preferably.
  • the blending amount of the binder is the same as the blending amount of the binder used in the reflective layer.
  • the thickness T (E2) of the absorbing layer is not particularly limited, but is preferably 1 ⁇ m or more and 100 ⁇ m or less, more preferably 2 ⁇ m or more and 80 ⁇ m or less, and further preferably 3 ⁇ m or more and 50 ⁇ m or less. If the thickness T (E2) of the absorbent layer is thinner than 1 ⁇ m, there is a risk of breaking at the end of the board-mounted component depending on the constituent material of the absorbent layer, and if thicker than 100 ⁇ m, the construction of the absorbent layer Depending on the material and the like, there is a risk that the shape followability is insufficient. By setting the thickness T (E2) in such a range, excellent electromagnetic shielding properties can be exhibited. Therefore, it is possible to reduce the thickness T (E2) of the absorption layer, and to cover with the electromagnetic wave blocking layer 3. It is possible to reduce the weight of the substrate 5 on which the electronic component 4 is mounted.
  • the storage elastic modulus at 150 ° C. of the electromagnetic wave shielding layer 3 is preferably 1.0E + 05 Pa or more and 1.0E + 09 Pa or less, and more preferably 5.0E + 05 Pa or more and 5.0E + 08 Pa or less.
  • the electromagnetic wave shielding layer 3 may be either a reflection layer or an absorption layer. However, when the electromagnetic wave shielding layer 3 has substantially the same electromagnetic wave shielding properties, it is preferably an absorption layer. In the absorption layer, the electromagnetic wave incident on the absorption layer is absorbed and blocked by converting it into thermal energy, and the electromagnetic wave disappears due to this absorption. It is possible to surely prevent such a disadvantage that an adverse effect such as a malfunction is exerted on other members not covered.
  • an insulating layer can be laminated on the upper surface and lower surface of the base material layer 1 or the lower surface of the electromagnetic wave shielding layer 3 as necessary.
  • FIG. 1 shows an example in which the insulating layer 2 is laminated on the lower surface of the electromagnetic wave shielding layer 3 and is in contact with the unevenness 6 of the substrate 5.
  • the insulating layer 2 is insulated from other members such as electronic components located on the opposite side of the substrate 5. It is important that the insulating layer 2 is not torn at the corners of the electronic component and that no cracks are generated even when Z-folding is performed.
  • the insulating layer 2 may be either a thermosetting insulating resin or a thermoplastic insulating resin, but is preferably a thermoplastic insulating resin. Since the thermoplastic insulating resin becomes a film excellent in flexibility, the insulating layer 2 can be surely followed in accordance with the shape of the irregularities 6 in the attaching step in the example of FIG. Further, since the thermoplastic insulating resin can be peeled off again from the substrate to be bonded when heated to its softening point temperature, it is particularly useful when repairing the substrate.
  • thermoplastic insulating resins examples include thermoplastic polyester resins, ⁇ -olefin resins, vinyl acetate resins, polyvinyl acetal resins, ethylene vinyl acetate resins, vinyl chloride resins, acrylic resins, polyamide resins, and cellulose. System resin, and the like. Among these, it is preferable to use a thermoplastic polyester resin or an ⁇ -olefin resin because it is excellent in adhesion to the substrate, flexibility, and chemical resistance.
  • the insulating layer 2 has a phenolic resin, a silicone resin, a urea resin, an acrylic resin, a polyester resin, a polyamide resin, and a polyimide resin as long as the performance such as heat resistance and bending resistance is not impaired. Etc. can be contained.
  • the thermoplastic insulating resin has a silane coupling agent, an antioxidant, a pigment, a dye, a tackifier resin, a plasticizer, an ultraviolet absorber, an antifoaming agent, as long as the adhesiveness and solder reflow resistance are not deteriorated. Leveling regulators, fillers, flame retardants and the like may be added.
  • the thickness T (D) of the insulating layer 2 is not particularly limited, but is preferably 3 ⁇ m or more and 50 ⁇ m or less, more preferably 4 ⁇ m or more and 30 ⁇ m or less, and further preferably 5 ⁇ m or more and 20 ⁇ m or less.
  • the thickness of the insulating layer 2 is less than 3 ⁇ m, the goblet resistance is insufficient, cracks are generated in the bent portion after thermocompression bonding to the irregularities 6, the film strength is reduced, and the electromagnetic wave shielding layer 3 is insulated. It is difficult to play a role as a support, and when the thickness is greater than 50 ⁇ m, shape followability may be insufficient. That is, by setting the thickness T (D) of the insulating layer 2 within the above range, the flexibility of the insulating layer 2 can be made excellent. Correspondingly, it can follow more reliably.
  • the average linear expansion coefficient at 25 to 150 ° C. of the insulating layer 2 is preferably 50 ppm / ° C. or more and 1000 ppm / ° C. or less, more preferably 100 ppm / ° C. or more and 700 ppm / ° C. or less.
  • the insulating layer 2 has excellent stretchability when the electromagnetic wave shielding film 100 is heated. Therefore, the insulating layer 2 and the electromagnetic wave blocking layer 3 The shape followability to the unevenness 6 can be improved more reliably.
  • the insulating layer 2 is not limited to a single layer as shown in FIG. It may be a laminate of two or more layers in which different ones of the above-described insulating films are laminated.
  • the electromagnetic wave shielding film 100 of the present invention may or may not be provided with an insulating layer as necessary. In the following second to sixth embodiments, no insulating layer is provided.
  • the electromagnetic wave shielding film 100 having the above-described configuration is such that the step of the unevenness 6 is 0.5 mm or more in the shape followability when the unevenness 6 is thermocompression bonded to the unevenness 6 at a temperature of 150 ° C., a pressure of 2 MPa, and a time of 5 minutes. Preferably, it is 0.8 mm or more, more preferably 1.0 mm or more.
  • the electromagnetic wave shielding film 100 of the present invention has excellent shape followability and adhesion to the unevenness 6 even when the unevenness 6 has a large step.
  • a printed wiring board in which a groove having a height difference of 0.2 mm, an interval of 0.2 mm and a required height is formed in a grid pattern on a printed wiring board (motherboard) having a length of 100 mm ⁇ width of 100 mm ⁇ height of 2 mm. create.
  • An electromagnetic wave shielding film is pressure-bonded to the printed wiring board under conditions of 150 ° C., 2 MPa, 5 minutes using a vacuum pressurizing laminator, and is attached to the printed wiring board.
  • the base material layer After sticking, the base material layer is peeled off from the electromagnetic wave shielding film, and it is determined whether or not there is a gap between the electromagnetic wave shielding layer attached to the printed wiring board and the groove on the printed wiring board. The presence of voids is observed with a microscope or microscope.
  • the base material layer 1 is composed of two layers, a second layer 13 and a third layer 12. Since it is the same as that of the electromagnetic wave shielding film 100 of 1st Embodiment shown in FIG. 1 except not including the 1st layer 11, it demonstrates centering on difference with 1st Embodiment.
  • the pressing portion such as a vacuum pressurizing laminator used when the electromagnetic wave shielding layer 3 is pushed into the unevenness 6 has a releasability from the second layer 13 so that the first part is provided.
  • the formation of the layer 11 can be omitted.
  • the degree of releasability of the contact surface where the second layer 13 and the pressing portion such as a vacuum pressure laminator come into contact can be expressed by the surface tension of the contact surface.
  • the surface tension of the contact surface is preferably 20 mN / m or more and 40 mN / m or less, and more preferably 25 mN / m or more and 35 mN / m or less.
  • the electromagnetic shielding film 100 of 2nd Embodiment can be used similarly to the electromagnetic shielding film 100 of 1st Embodiment, and the effect similar to the electromagnetic shielding film 100 of 1st Embodiment is acquired.
  • the base material layer 1 is composed of two layers, a first layer 11 and a second layer 13. Since it is the same as that of the electromagnetic wave shielding film 100 of 1st Embodiment shown in FIG. 1 except not including the 3rd layer 12, it demonstrates centering on difference with 1st Embodiment.
  • the base material layer 1 when the base material layer 1 is peeled from the electromagnetic wave shielding layer 3, the base material layer 1 is separated from the electromagnetic wave shielding layer 3 at the interface between the second layer 13 and the electromagnetic wave shielding layer 3. It is peeled off. In such peeling, the formation of the third layer 12 can be omitted because the electromagnetic wave shielding layer 3 has releasability from the second layer 13. The degree of releasability of the contact surface where the electromagnetic wave shielding layer 3 and the second layer 13 are in contact can be expressed by the surface tension of the contact surface.
  • the surface tension of the contact surface is preferably 20 mN / m or more and 40 mN / m or less, and more preferably 25 mN / m or more and 35 mN / m or less.
  • the contact surface has a surface tension in such a range, the second layer 13 can be reliably peeled from the electromagnetic wave shielding layer 3 after the electromagnetic wave shielding film 100 is pushed in by a pressing portion such as a vacuum pressure laminator.
  • the electromagnetic shielding film 100 of 3rd Embodiment can be used similarly to the electromagnetic shielding film 100 of 1st Embodiment, and the effect similar to the electromagnetic shielding film 100 of 1st Embodiment is acquired.
  • the base material layer 1 is composed of any one layer selected from the first layer 11, the second layer 13, or the third layer 12. .
  • the base material layer 1 is composed of any one layer selected from the first layer 11, the second layer 13, or the third layer 12. .
  • the base material layer 1 is composed of any one layer selected from the first layer 11, the second layer 13, or the third layer 12. .
  • the base material layer 1 is composed of any one layer selected from the first layer 11, the second layer 13, or the third layer 12.
  • the base material layer 1 is composed of any one layer selected from the first layer 11, the second layer 13, or the third layer 12.
  • any one of the first layer 11, the second layer 13, or the third layer 12 constituting the base material layer 1 is peeled off from the electromagnetic wave shielding layer 3.
  • the other two layers can be omitted.
  • the electromagnetic wave shielding film 100 of 4th Embodiment is uneven
  • FIG. The other two layers can be omitted by providing the pressing part such as a vacuum pressurizing laminator used when the electromagnetic wave shielding layer 3 is pushed in.
  • the degree of releasability of the electromagnetic wave shielding layer 3 and the contact surface in contact with any one of the first layer 11, the second layer 13, or the third layer 12 constituting the base material layer 1 is It can be expressed by the surface tension of the contact surface.
  • the surface tension of the contact surface is preferably 20 mN / m or more and 40 mN / m or less, and more preferably 25 mN / m or more and 35 mN / m or less.
  • the pressing portion can be reliably peeled off from the base material layer 1, and after pressing using a vacuum pressurization type laminator or the like, the electromagnetic wave shielding layer 3 to the base material layer 1 can be peeled off reliably.
  • the electromagnetic wave shielding film 100 of the fourth embodiment can be used in the same manner as the electromagnetic wave shielding film 100 of the first embodiment, and the same effect as the electromagnetic wave shielding film 100 of the first embodiment can be obtained.
  • the electromagnetic wave shielding film 100 of the fifth embodiment shown in FIG. 5 is composed of the absorption layer 31 and the reflective layer 32, whereas the electromagnetic wave shielding layer 3 of the first embodiment shown in FIG. It is comprised with the laminated body which consists of layers. The rest is the same as that of the electromagnetic wave shielding film 100 of the first embodiment, and therefore the description will focus on the differences from the first embodiment shown in FIG.
  • an absorption layer 31 and a reflective layer 32 are laminated in this order on the lower surface of the third layer 12 of the base material layer 1, and the reflective layer 32 is in close contact with the unevenness 6.
  • the electromagnetic wave shielding layer 3 is comprised by the laminated body which consists of the absorption layer 31 and the reflection layer 32, and can improve the electromagnetic wave shielding property by the electromagnetic wave shielding layer 3 more.
  • the storage elastic modulus at 150 ° C. of the absorbing layer 31 and the reflective layer 32 is preferably 1.0E + 05 Pa or more and 1.0E + 09 Pa or less, and more preferably 5.0E + 05 Pa or more and 5.0E + 08 Pa or less.
  • the reflection layer 32 of the electromagnetic wave shielding layer 3 corresponds to the shape of the unevenness 6 according to the pressing force from the base material layer 1. It can make it adhere more reliably.
  • the electromagnetic shielding film 100 of 5th Embodiment can be used similarly to the electromagnetic shielding film 100 of 1st Embodiment, and the effect similar to the electromagnetic shielding film 100 of 1st Embodiment is acquired.
  • the electromagnetic wave shielding film 100 of the sixth embodiment shown in FIG. 6 is the electromagnetic wave shielding film of the fifth embodiment except that the absorption layer 31 and the reflective layer 32 constituting the electromagnetic wave shielding layer 3 of the fifth embodiment are laminated in reverse. Since it is the same as 100, the difference from the fifth embodiment will be mainly described.
  • the electromagnetic wave shielding layer 3 of the sixth embodiment the reflective layer 32 and the absorbing layer 31 are laminated in this order on the lower surface of the third layer 12 of the base material layer 1, and the absorbing layer 31 is in close contact with the irregularities 6.
  • the electromagnetic wave shielding layer 3 is comprised by the laminated body which consists of the absorption layer 31 and the reflection layer 32, and can improve the electromagnetic wave shielding property by the electromagnetic wave shielding layer 3 more.
  • the storage elastic modulus at 150 ° C. of the absorption layer 31 and the reflection layer 32 of the electromagnetic wave shielding layer 3 is the same as in the case of the fifth embodiment.
  • the absorption layer 31 of the electromagnetic wave blocking layer 3 corresponds to the shape of the unevenness 6 according to the pressing force from the base material layer 1. It can make it adhere more reliably.
  • the electromagnetic shielding film 100 of 6th Embodiment can be used similarly to the electromagnetic shielding film 100 of 1st Embodiment, and the effect similar to the electromagnetic shielding film 100 of 1st Embodiment is acquired.
  • the fifth embodiment and the sixth embodiment are similar, when the two are compared, the fifth embodiment in which the reflective layer 32 is in direct contact with the unevenness 6 of the electronic component is preferable in terms of electromagnetic wave shielding.
  • the electromagnetic wave shielding layer 3 is composed of two layers of the reflection layer 32 and the absorption layer 31.
  • a multilayer structure having various reflection layers and various absorption layers can also be used.
  • each of the first layer, the second layer, and the third layer constituting the base material layer 1 is further 2
  • An embodiment in which the layer is a laminate of two or more layers, an embodiment in which the electromagnetic wave shielding layer is a laminate of three or more layers, an embodiment in which the insulating layer is a laminate of two or more layers, or any other functional layer is laminated.
  • Embodiments of the present invention include a laminate of a wide variety of layers.
  • FIGS. 7 is a longitudinal sectional view for explaining a method of coating an electronic component using the electromagnetic wave shielding film 100 of the present invention shown in FIGS. A method for coating an electronic component including the flexible printed circuit board of the present invention using the electromagnetic wave shielding film 100 of the first to sixth embodiments of the present invention will be described.
  • the electronic component coating method includes at least two steps of a pasting step and a peeling step.
  • the affixing step is a step of affixing the electromagnetic wave shielding film 100 to the unevenness 6 provided on the substrate 5 of the electronic component as shown in FIG.
  • the method for attaching is not particularly limited, and examples thereof include vacuum / pressure forming.
  • a peeling process is a process of peeling the base material layer 1 from the electromagnetic wave shielding layer 3 after a sticking process, as shown in FIG.7 (b).
  • the vacuum / pressure forming in the attaching step is a method in which the electromagnetic wave shielding film 100 is coated on the unevenness 6 on the substrate 5 with, for example, a vacuum pressure laminator.
  • a vacuum pressure laminator First, the surface of the substrate 5 where the irregularities 6 are formed and the surface of the electromagnetic wave shielding layer 3 are set facing each other in a vacuum atmosphere, and the electromagnetic wave shielding film 100 and the entire electronic component are heated and brought close to each other.
  • the pressure is uniformly applied from above the base material layer 1 using a vacuum pressurizing laminator. By pressurization, the base material layer 1 and the electromagnetic wave shielding layer 3 are deformed following the shape corresponding to the shape of the unevenness 6, and the electromagnetic wave shielding layer 3 is covered in a state of being pushed into the space of the unevenness 6.
  • the base material layer 1 since the storage elastic modulus in 150 degreeC of the base material layer 1 exists in the range of 2.0E + 05Pa or more and 5.0E + 08Pa or less, the base material layer 1 may exhibit the shape followability excellent with respect to the unevenness
  • the heating temperature may be a temperature at which the electromagnetic wave shielding layer 3 is pushed into and stuck to the unevenness 6, and is preferably 100 ° C. or higher and 200 ° C. or lower, more preferably 120 ° C. or higher and 180 ° C. or lower.
  • the pressure uniformly applied from above the base material layer 1 using a vacuum pressurizing laminator may be a pressure at which the electromagnetic wave blocking layer 3 is pushed into and stuck to the projections 6 and is 0.5 MPa or more and 5.0 MPa or less. Is preferable, and it is more preferable that it is 1.0 MPa or more and 30 MPa or less.
  • the application time is preferably 1 minute or more and 30 minutes or less, and more preferably 5 minutes or more and 15 minutes or less.
  • the electromagnetic wave shielding layer 3 can be reliably covered with the unevenness 6 in a pressed state. Moreover, the unevenness
  • the peeling process is a process of peeling the base material layer 1 from the electromagnetic wave shielding layer 3 after the sticking process, as shown in FIG.
  • manual peeling is preferable when the electromagnetic wave shielding film 100 is in a high temperature state.
  • the end of the base material layer 1 is first gripped, the base material layer 1 is peeled off from the gripped end, and then from this end to the center.
  • the base material layer 1 can be peeled from the electromagnetic wave shielding layer 3 by sequentially peeling the base material layer 1 to the other end.
  • the temperature at the time of peeling is preferably 180 ° C. or less, more preferably 150 ° C. or less, and further preferably 100 ° C. or less.
  • the base layer 1 After pasting the electromagnetic wave shielding film 100 of the present invention on the unevenness 6 of the electronic component by the pasting step and the subsequent peeling step, the base layer 1 is peeled off from the electromagnetic wave blocking layer 3 so that the electromagnetic wave blocking layer 3 is free from gaps.
  • the coated irregularities 6 can be obtained.
  • an electromagnetic wave shielding film can be provided as a covering member for a substrate on which an electronic component is mounted, particularly a substrate on which an electronic component having a step of 1 mm or more is mounted. Moreover, an electromagnetic wave shielding film can be provided as an electromagnetic wave shielding member with respect to a flexible printed circuit board.
  • the electromagnetic wave shielding film of the present embodiment comprises a base material layer and an electromagnetic wave shielding layer laminated on the base material layer and containing a conductive polymer and metal powder as main materials. To do.
  • the electromagnetic wave shielding layer can be reduced in weight and thickness, and can effectively block electromagnetic waves in a high frequency band as in the GHz order.
  • FIG. 8 is a longitudinal sectional view showing the first embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 8 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 includes a base material layer 1, an insulating layer 2, and an electromagnetic wave blocking layer 3, and the insulating layer 2 and the electromagnetic wave blocking layer 3 are The insulating layer 2 contacts the base material layer 1 from the lower surface (one surface) side of the base material layer 1 and is laminated in this order.
  • the base material layer 1 includes a first layer 11, a second layer 13, and a third layer 12, which are arranged in this order from the upper surface (the other surface) side of the base material layer 1. Are stacked.
  • the electronic component 4 is mounted (placed) on the substrate 5, and the unevenness 6 including the convex portions 61 and the concave portions 62 is formed on the substrate 5 by mounting the electronic component 4.
  • the case where 6 is covered with the electromagnetic wave shielding film 100 will be described.
  • Examples of the electronic component 4 mounted on the substrate 5 include an LCD driver IC mounted on a flexible circuit board (FPC), an IC + capacitor around the touch panel, or an electronic circuit board (motherboard).
  • the base material layer 1 covers the unevenness 6 by pressing the insulating layer 2 and the electromagnetic wave shielding layer 3 into the unevenness 6 on the substrate 5 using the electromagnetic wave shielding film 100 in the attaching step, the insulating layer 2 and the electromagnetic wave shielding layer 3 are pressed (embedded), and the insulating layer 2 and the electromagnetic wave shielding layer 3 function as a base material for improving the shape followability to the unevenness 6. Further, in the peeling step, the insulating layer 2 and the electromagnetic wave shielding layer 3 are pressed into the unevenness 6 and peeled from these.
  • the storage elastic modulus at 150 ° C. of the base material layer 1 is preferably 2.0E + 05 to 2.0E + 08 Pa, more preferably 1.0E + 06 to 1.0E + 08 Pa, and 3.0E + 06 to 6.0E + 07 Pa. More preferably.
  • the step in the unevenness 6 provided on the substrate 5 is 500 ⁇ m to 3.0 mm, preferably 1.0 to 3.0 mm. Even if the separation distance (pitch) between the protrusions 61 in the unevenness 6 is 100 ⁇ m to 200 ⁇ m, preferably 100 ⁇ m to 150 ⁇ m, the insulating layer 2 and the electromagnetic wave blocking layer 3 are uneven. 6 can be pushed in reliably in a state corresponding to the shape of 6.
  • the base material layer 1 preferably has a storage elastic modulus at 25 ° C. of 1.0E + 07 to 1.0E + 10 Pa, more preferably 5.0E + 08 to 5.0E + 09 Pa.
  • room temperature room temperature
  • the base material layer 1 is not liquid but solid before heating the electromagnetic shielding film 100.
  • the electromagnetic wave shielding film 100 When the electromagnetic wave shielding film 100 is heated, it may be semi-solid (gel). Therefore, when the base material layer 1 (electromagnetic wave shielding film 100) is attached to the substrate 5, the base material layer 1 can be attached to the substrate 5 without causing wrinkles or the like, and cut to a specified size.
  • the insulating layer 2 and the electromagnetic wave shielding layer 3 are surely pushed into the concave portion 62 of the concave and convex portion 6 with the base material layer 1 when pushed into the concave and convex portion 6 provided on the substrate 5.
  • the base material layer 1 having such storage elastic modulus characteristics is such that at least the first layer 11 and the third layer 12 are made of a thermoplastic resin, and even after the heating of the electromagnetic wave shielding film 100 in the attaching step, The storage elastic modulus at 25 ° C. is preferably maintained within the above range. Thereby, the base material layer 1 can be easily peeled from the insulating layer 2 in the peeling step.
  • the storage elastic modulus at 120 ° C. of the base material layer 1 is A [Pa] and the storage elastic modulus at 150 ° C. of the base material layer 1 is B [Pa], 0.02 ⁇ A / B ⁇ 1. It is preferable to satisfy the relationship of 00, and it is more preferable to satisfy the relationship of 0.02 ⁇ A / B ⁇ 0.50. It can be said that the base material layer 1 satisfying such a relationship has a small range of change in the storage elastic modulus of the base material layer 1 due to the temperature change during the heating. Therefore, even if the temperature condition at the time of heating is changed, the range of change in the storage elastic modulus of the base material layer 1 due to this temperature change can be kept to the minimum necessary. The base layer 1 can be pushed more reliably into the concave portion 62 of the concave and convex portion 6 of the layer 3.
  • the storage elastic modulus at the time of heating of the base material layer 1 functioning as a base material for improving the shape followability to the unevenness 6 of the insulating layer 2 and the electromagnetic wave shielding layer 3 within the above range.
  • the unevenness 6 on the substrate 5 is covered using the electromagnetic wave shielding film 100, the insulating layer 2 and the electromagnetic wave shielding layer 3 can be reliably pushed in a state corresponding to the shape of the unevenness 6.
  • the electromagnetic wave shielding (blocking) property to the substrate 5 provided with the unevenness 6 by the electromagnetic wave shielding layer 3 is provided. Will be improved.
  • the storage elastic modulus in 25 degreeC, 120 degreeC, and 150 degreeC of each layer can be calculated
  • the base material layer 1 includes a first layer 11, a second layer 13, and a third layer 12, which are from the upper surface (the other surface) side of the base material layer 1. These layers are laminated in this order, and as described above, the types and thicknesses of these layers 11 to 13 can be pressed so that the insulating layer 2 and the electromagnetic wave shielding layer 3 can be pressed in accordance with the shape of the irregularities 6. Etc. are appropriately combined.
  • the first layer 11 is a pressing force possessed by a vacuum pressure laminator or the like when the insulating layer 2 and the electromagnetic wave shielding layer 3 are pushed into the unevenness 6 on the substrate 5 using, for example, a vacuum pressure laminator or the like in the pasting step. This is to provide a function of releasability with the part. Moreover, it is for propagating the pressing force from a pressing part to the 2nd layer 13 side.
  • the constituent material of the first layer (first release layer) 11 is not particularly limited, and examples thereof include the same materials as those described in the first embodiment. Among these, it is preferable to use syndiotactic polystyrene. Thus, since polystyrene can be provided with crystallinity by using what has a syndiotactic structure as polystyrene, the mold release from the apparatus of the 1st layer 11 originates in this. Properties, heat resistance and shape followability can be improved.
  • the content thereof is not particularly limited, but is preferably 60% by weight or more, more preferably 70% by weight or more and 95% by weight or less. Further, it is preferably 80% by weight or more and 90% by weight or less.
  • content of syndiotactic polystyrene is less than the said lower limit, there exists a possibility that the releasability of the 1st layer 11 may fall.
  • content of syndiotactic polystyrene exceeds the said upper limit, there exists a possibility that the shape followability of the 1st layer 11 may become insufficient.
  • the first layer 11 may be composed of only syndiotactic polystyrene.
  • the first layer 11 may further contain a styrene elastomer, polyethylene, polypropylene, or the like in addition to the syndiotactic polystyrene.
  • the thickness T (A) of the first layer 11 is not particularly limited, but is preferably 5 ⁇ m or more and 100 ⁇ m or less, more preferably 10 ⁇ m or more and 70 ⁇ m or less, and further preferably 20 ⁇ m or more and 50 ⁇ m or less. is there.
  • the thickness of the 1st layer 11 is less than the said lower limit, the 1st layer 11 may fracture
  • the thickness of the 1st layer 11 exceeds the said upper limit, the shape followability of the base material layer 1 may fall, and there exists a possibility that the shape followability of the electromagnetic wave shielding layer 3 and the insulating layer 2 may fall.
  • the average linear expansion coefficient of the first layer 11 at 25 to 150 ° C. is preferably 50 to 1000 [ppm / ° C.], and more preferably 100 to 700 [ppm / ° C.].
  • the first layer 11 has excellent stretchability when the electromagnetic wave shielding film 100 is heated.
  • the shape followability with respect to the unevenness 6 of the layer 3 and the insulating layer 2 can be improved more reliably.
  • the average coefficient of linear expansion of each layer is, for example, a storage elastic modulus of 49 mN up to 25 to 200 ° C. using a thermomechanical analyzer (manufactured by Seiko Instruments Inc., “TMASS6100”).
  • the average linear expansion coefficient at 25 ° C. to 150 ° C. can be obtained by measuring at a heating rate of 5 ° C./min in a constant load tension mode.
  • the surface tension of the first layer 11 is preferably 20 to 40 [mN / m], and more preferably 25 to 35 [mN / m].
  • the first layer 11 having a surface tension within such a range can be said to have excellent releasability, and the first layer 11 is peeled from the pressing portion after being pressed using a vacuum pressure laminator or the like. Can be made.
  • the third layer 12 is formed by pressing the insulating layer 2 and the electromagnetic wave shielding layer 3 against the unevenness 6 on the substrate 5 using a vacuum pressure laminator or the like in the attaching step, and then in the peeling step.
  • the base layer 1 is provided with a peelable function.
  • substrate 5 it has the function of the tracking property which the 3rd layer 12 follows, and also has the function to propagate the pressing force from a press part on the insulating layer 2 side. is there.
  • the constituent material of the third layer (second release layer) 12 is not particularly limited, and examples thereof include the same materials as those described in the first embodiment. Among these, it is preferable to use syndiotactic polystyrene. Thus, since polystyrene can be provided with crystallinity by using what has a syndiotactic structure as polystyrene, it originates in this, and with the insulating layer 2 of the 3rd layer 12 The mold releasability, as well as the heat resistance and shape followability can be improved.
  • the content of the syndiotactic polystyrene in the third layer 12 is not particularly limited and may be composed only of syndiotactic polystyrene, but is preferably 60% by weight or more, and 70% by weight or more. 95% by weight or less, more preferably 80% by weight or more and 90% by weight or less.
  • content of syndiotactic polystyrene is less than the said lower limit, there exists a possibility that the mold release property of the 3rd layer 12 may fall.
  • content of a syndiotactic polystyrene exceeds the said upper limit, there exists a possibility that the shape followability of the 3rd layer 12 may become insufficient.
  • the third layer 12 may further contain a styrene elastomer, polyethylene, polypropylene, or the like in addition to the syndiotactic polystyrene. Further, the resin constituting the third layer 12 and the first layer 11 may be the same or different.
  • the thickness T (B) of the third layer 12 is not particularly limited, but is preferably 5 ⁇ m or more and 100 ⁇ m or less, more preferably 10 ⁇ m or more and 70 ⁇ m or less, and further preferably 20 ⁇ m or more and 50 ⁇ m or less. is there.
  • the thickness of the third layer 12 is less than the lower limit, the heat resistance is insufficient, the heat resistance of the base material layer is insufficient in the thermocompression bonding process, deformation occurs, and the electromagnetic wave shielding layer and the insulating layer are deformed. There is a fear.
  • the thickness of the 3rd layer 12 exceeds the said upper limit, the total thickness of the whole film for electromagnetic wave shielding becomes thick, there exists a possibility that workability
  • the thicknesses of the third layer 12 and the first layer 11 may be the same or different.
  • the average linear expansion coefficient of the third layer 12 at 25 to 150 ° C. is preferably 50 to 1000 [ppm / ° C.], and more preferably 100 to 700 [ppm / ° C.].
  • the third layer 12 has excellent stretchability when the electromagnetic wave shielding film 100 is heated.
  • the shape followability of the layer 12 and the electromagnetic wave shielding layer 3 and the insulating layer 2 with respect to the irregularities 6 can be improved more reliably.
  • the surface tension of the third layer 12 is preferably 20 to 40 [mN / m], and more preferably 25 to 35 [mN / m].
  • the third layer 12 having a surface tension within such a range can be said to have excellent releasability, and the base material layer 1 is peeled from the insulating layer 2 after being pushed in using a vacuum pressure laminator or the like. In doing so, the base material layer 1 can be reliably peeled off at the interface between the third layer 12 and the insulating layer 2.
  • the second layer 13 is a third layer when the insulating layer 2 and the electromagnetic wave shielding layer 3 are pressed into the unevenness 6 on the substrate 5 using the base material layer 1 as a pressing base material in the attaching step.
  • 12 has a cushioning function for pushing (embedding) 12 into the irregularities 6.
  • the second layer 13 has a function of causing the pushing force to uniformly act on the third layer 12 and further on the insulating layer 2 and the electromagnetic wave shielding layer 3 via the third layer 12.
  • the insulating layer 2 and the electromagnetic wave shielding layer 3 can be pushed into the irregularities 6 with excellent sealing properties without generating voids between the electromagnetic wave shielding layer 3 and the irregularities 6.
  • Examples of the constituent material of the second layer (cushion layer) 13 include the same materials as those described in the first embodiment, and these may be used alone or in combination. Among these, it is preferable to use an ⁇ -olefin copolymer. Specifically, a copolymer of ⁇ -olefin such as ethylene and (meth) acrylic acid ester, a copolymer of ethylene and vinyl acetate, a copolymer of ethylene and (meth) acrylic acid (EMMA), And a partial ion cross-linked product thereof.
  • ⁇ -olefin copolymer such as ethylene and (meth) acrylic acid ester, a copolymer of ethylene and vinyl acetate, a copolymer of ethylene and (meth) acrylic acid (EMMA), And a partial ion cross-linked product thereof.
  • the second layer 13 made of the constituent material has the The cushion function for pushing (embedding) the third layer 12 into the unevenness 6 can be surely provided.
  • the thickness T (C) of the second layer 13 is not particularly limited, but is preferably 10 ⁇ m or more and 100 ⁇ m or less, more preferably 20 ⁇ m or more and 80 ⁇ m or less, and further preferably 30 ⁇ m or more and 60 ⁇ m or less. is there.
  • the thickness of the second layer 13 is less than the lower limit value, the shape followability of the second layer 13 is insufficient, and the followability to the unevenness 6 may be insufficient in the thermocompression bonding step.
  • the thickness of the second layer 13 exceeds the upper limit value, the resin from the second layer 13 is increased in the thermocompression bonding process, and adheres to the hot platen of the crimping apparatus, thereby reducing workability. There is a risk of doing.
  • the average linear expansion coefficient of the second layer 13 at 25 to 150 ° C. is preferably 500 or more [ppm / ° C.], more preferably 1000 or more [ppm / ° C.].
  • the second layer 13 can be expanded and contracted more excellently than the third layer 12 when the electromagnetic wave shielding film 100 is heated. It can be made easy to have a property. Therefore, the shape followability of the second layer 13 and the electromagnetic wave shielding layer 3 and the insulating layer 2 with respect to the irregularities 6 can be improved more reliably.
  • the storage modulus at 150 ° C. of the base material layer 1 can be easily within the range of 2.0E + 05 to 2.0E + 08 Pa by appropriately setting the average linear expansion coefficient of each layer 11 to 13 within the above-mentioned range. Can be set to
  • the thickness T (A) of the first layer 11, the thickness T (B) of the third layer 12, and the thickness T (C) of the second layer 13 satisfy the following relational expression, for example.
  • 0.05 ⁇ T (C) / (T (A) + T (B)) ⁇ 10
  • the following relational expression is satisfied: 0.14 ⁇ T (C) / (T (A) + T (B)) ⁇ 4
  • the following relational expression is satisfied: 0.3 ⁇ T (C) / (T (A) + T (B)) ⁇ 1.5.
  • the shape follows. More improved.
  • the total thickness T (F) of the base material layer 1 is not particularly limited, but is preferably 20 ⁇ m or more and 300 ⁇ m or less, more preferably 40 ⁇ m or more and 220 ⁇ m or less, and further preferably 70 ⁇ m or more and 160 ⁇ m or less. It is.
  • the 1st layer 11 may fracture
  • the whole thickness of the base material layer 1 exceeds the said upper limit, there exists a possibility that the shape followability of the base material layer 1 may fall and the shape followability of the electromagnetic wave shielding layer 3 and the insulating layer 2 may fall.
  • the insulating layer 2 is provided in contact with the base material layer 1 (third layer 12), and is laminated in the order of the insulating layer 2 and the electromagnetic wave shielding layer 3 from the base material layer 1 side.
  • the electromagnetic wave shielding layer 3 comes into contact with the substrate 5 and the electronic component 4 by covering the unevenness 6 on the substrate 5 with the electromagnetic wave shielding film 100 including the insulating layer 2 and the electromagnetic wave shielding layer 3 laminated in this manner.
  • the electromagnetic wave shielding layer 3 and the insulating layer 2 are coated in this order from the substrate 5 side.
  • the insulating layer 2 covers the substrate 5 and the electronic component 4 via the electromagnetic wave shielding layer 3, whereby the substrate 5, the electronic component 4 and the electromagnetic wave shielding layer 3 are covered with the insulating layer. 2 to insulate from other members (such as electronic components) located on the opposite side of the substrate 5.
  • the insulating layer 2 examples include a thermosetting insulating resin or a thermoplastic insulating resin (insulating film). Among these, it is preferable to use an insulating resin having thermoplasticity. Since the insulating resin having thermoplasticity is a film having excellent flexibility, the insulating layer 2 and the electromagnetic waves are formed on the unevenness 6 on the substrate 5 by using the base material layer 1 as a pressing base material in the attaching step. When the blocking layer 3 is pushed in, the insulating layer 2 can be made to reliably follow the shape of the irregularities 6. In addition, an insulating resin having thermoplasticity is particularly useful when repairing a substrate because it can be re-peeled from the substrate to be bonded when heated to its softening point temperature.
  • thermoplastic polyester examples include thermoplastic polyester, ⁇ -olefin, vinyl acetate, polyvinyl acetal, ethylene vinyl acetate, vinyl chloride, acrylic, polyamide, and cellulose.
  • thermoplastic polyesters and ⁇ -olefins because they have excellent adhesion to the substrate, flexibility and chemical resistance.
  • the insulating resin having thermoplasticity is a phenolic resin, a silicone resin, a urea resin, an acrylic resin, a polyester resin, a polyamide resin, as long as the performance such as heat resistance and flex resistance is not impaired.
  • a polyimide resin or the like can be contained.
  • a silane coupling agent, an antioxidant, a pigment, a dye as long as the adhesiveness and solder reflow resistance are not deteriorated. You may add tackifying resin, a plasticizer, a ultraviolet absorber, an antifoamer, a leveling regulator, a filler, a flame retardant, etc.
  • the thickness T (D) of the insulating layer 2 is not particularly limited, but is preferably 3 ⁇ m or more and 50 ⁇ m or less, more preferably 4 ⁇ m or more and 30 ⁇ m or less, and further preferably 5 ⁇ m or more and 20 ⁇ m or less.
  • the thickness of the insulating layer 2 is less than the lower limit value, the resistance to goby folds is insufficient, cracks are generated at the bent portions after thermocompression bonding to the projections and depressions 6, the film strength decreases, and the conductive adhesive layer It is difficult to play a role as an insulating support. If the upper limit is exceeded, shape followability may be insufficient.
  • the insulating layer 2 can be made more flexible, and the base material layer 1 can be used as a base for pushing in the attaching step.
  • the insulating layer 2 and the electromagnetic wave shielding layer 3 are pushed into the unevenness 6 on the substrate 5 by using as a material, the insulating layer 2 can be made to follow more reliably corresponding to the shape of the unevenness 6.
  • the average linear expansion coefficient at 25 to 150 ° C. of the insulating layer 2 is preferably 50 to 1000 [ppm / ° C.], more preferably 100 to 700 [ppm / ° C.].
  • the insulating layer 2 has excellent stretchability when the electromagnetic wave shielding film 100 is heated.
  • the shape following property with respect to the unevenness 6 of the electromagnetic wave shielding layer 3 can be improved more reliably.
  • the insulating layer 2 may be a laminated body of two or more layers in which different ones of the above-described insulating films are laminated in addition to the one constituted by one layer. .
  • Electromagnetic wave blocking layer 3 Next, the electromagnetic wave blocking layer (blocking layer) 3 will be described.
  • the electromagnetic wave shielding layer 3 includes an electronic component 4 provided on the substrate 5, and other electronic components located on the opposite side of the substrate 5 (electronic component 4) via the electromagnetic wave shielding layer 3. It has a function of shielding (shielding) electromagnetic waves generated from one side.
  • a reflection layer that blocks (shields) the electromagnetic wave incident on the electromagnetic wave blocking layer and absorbs the electromagnetic wave incident on the electromagnetic wave blocking layer.
  • Absorbing layers that are blocked (shielded) by the above are known.
  • the absorption layer absorbs electromagnetic waves incident on the absorption layer and converts them into thermal energy.
  • the electromagnetic wave is extinguished by this absorption. Therefore, from the standpoint that it is possible to reliably prevent the reflected electromagnetic wave, such as the reflective layer, from adversely affecting the other members that are not covered with the electromagnetic wave blocking layer.
  • the layer is preferably composed of an absorbent layer.
  • the present inventor paid attention to an electromagnetic wave blocking layer containing a conductive polymer known as an electromagnetic wave blocking layer for blocking electromagnetic waves as a main material, and as a result of earnestly examining such an electromagnetic wave blocking layer, It has been found that by using the metal powder in combination, the electromagnetic wave shielding layer exerts a function as an absorbing layer without the electromagnetic wave shielding layer exerting a function as a reflective layer. That is, the electromagnetic wave shielding layer contains a conductive polymer and metal powder, so that the function as an absorption layer can be exhibited accurately, and electromagnetic waves can be absorbed by absorption of electromagnetic waves up to electromagnetic waves in the high frequency band as in the GHz order. The inventors have found that it can be effectively blocked, and have completed the present invention.
  • the conductive polymer of the present invention is not particularly limited, and examples thereof include the same as those mentioned in the first embodiment, and one or more of these can be used in combination. .
  • polyaniline is preferable. According to these, even if the electromagnetic wave blocking layer 3 is reduced in weight and thickness, it is possible to more reliably block electromagnetic waves in the high frequency band as in the GHz order.
  • the average value (average particle diameter) of the particle diameter is preferably 0.5 ⁇ m or more and 10 ⁇ m or less, and is 1.0 ⁇ m or more and 5.0 ⁇ m or less. Is more preferable.
  • the content of the conductive polymer in the electromagnetic wave shielding layer 3 is preferably 5 wt% or more and 50 wt% or less, and more preferably 8 wt% or more and 40 wt% or less. Within the above range, the electromagnetic wave shielding property and the film property are maintained, which is preferable.
  • the metal powder of this invention is not specifically limited, For example, it is gold, silver, silver coat copper, copper, nickel, etc. Among these, silver and silver coat copper are preferable from an electroconductive point.
  • the shape of the metal powder is not particularly limited, and examples thereof include a spherical shape, a needle shape, a dendritic shape, a scale shape, and a flake shape. Among these, the use of a scaly shape is preferable because the particles easily come into contact with each other and the conductivity is improved.
  • the scale-like shape may be a flat shape, and the planar shape is not particularly limited.
  • a scaly metal powder formed by crushing or crushing particles of various shapes is preferably used in terms of cost and productivity.
  • the scale-like metal powder preferably has an average thickness of 0.01 ⁇ m to 1 ⁇ m and an average particle size of 1 ⁇ m to 20 ⁇ m. Within the above range, the dispersibility and the orientation are good and the electromagnetic wave shielding property is maintained, which is preferable. In addition, the average particle diameter and average thickness of metal powder can be measured by a laser diffraction scattering method.
  • the content of the metal powder in the electromagnetic wave shielding layer 3 is preferably 40 wt% or more and 80 wt% or less, and more preferably 45 wt% or more and 75 wt% or less. Within the above range, the electromagnetic wave shielding property is maintained, which is preferable.
  • the electromagnetic wave shielding layer 3 may use a resin other than the conductive polymer and metal powder described above. That is, by forming a film of a conductive polymer, it may be formed into a film without containing components other than metal powder, but may be formed into a film using a binder resin.
  • binder resin An epoxy resin, a phenol resin, a polyester resin, a polyurethane resin, an acrylic resin, a melamine resin, a polyimide resin, a polyamideimide resin etc. can be used. It is preferable to use a polyester resin that can achieve both heat resistance and flexibility of the electromagnetic wave shielding layer 3.
  • polyester resin A commercially available polyester resin can be used as the polyester resin.
  • a thermoplastic saturated copolyester resin is used. Among them, those having an average molecular weight in the range of 2000 to 40000 can be preferably used.
  • the thickness T of the electromagnetic wave shielding layer 3 is not particularly limited, but is preferably 1 ⁇ m or more and 100 ⁇ m or less, more preferably 2 ⁇ m or more and 80 ⁇ m or less, and further preferably 3 ⁇ m or more and 50 ⁇ m or less.
  • the thickness of the electromagnetic wave shielding layer 3 is less than the lower limit value, depending on the constituent material of the electromagnetic wave shielding layer 3, there is a possibility of breaking at the end portion of the board mounted component.
  • the thickness of the electromagnetic wave shielding layer 3 exceeds the upper limit, the shape following property may be insufficient depending on the constituent material of the electromagnetic wave shielding layer 3 or the like.
  • the excellent electromagnetic wave shielding property can be exhibited even when the thickness T is within such a range, it is possible to reduce the thickness T of the electromagnetic wave shielding layer 3, and thus the insulating layer 2 and the electromagnetic wave on the substrate 5.
  • the weight reduction of the electronic component mounting board on which the electronic component 4 covered with the blocking layer 3 is mounted can be realized.
  • the electromagnetic wave shielding layer 3 as described above has an electromagnetic wave shielding property (absorbability) of 5 dB or more for shielding (shielding) an electromagnetic wave at a frequency of 0.2 to 10 GHz, measured using a microstrip line method (MSL method). Preferably, it is 6 dB or more, more preferably 7 dB or more.
  • MSL method the electromagnetic wave shielding property for blocking electromagnetic waves is measured as a value representing the absorbability (absorbing ability) blocking mainly by absorbing electromagnetic waves from the characteristics of the measurement method described below.
  • the electromagnetic wave shielding layer 3 having the electromagnetic wave shielding property (absorbing property) within the above range exhibits excellent electromagnetic wave shielding property by shielding (shielding) by absorbing the electromagnetic wave incident on the electromagnetic wave shielding layer 3. It can be said that the electromagnetic wave blocking layer (absorbing layer) 3 is capable of blocking even high frequency electromagnetic waves as in the GHz order.
  • the measurement using the MSL method is, for example, measuring the reflection component S11 and the transmission component S21 using a microstrip line having an impedance of 50 ⁇ and a network analyzer in accordance with IEC standard 62333-2.
  • the electromagnetic wave shielding property (absorbability) can be obtained by using the following formula (1) and the following formula (2).
  • Loss rate (P (loss) / P (in)) 1 ⁇ (S112 + S212) / 1 (1)
  • Electromagnetic shielding property (transmission attenuation factor) ⁇ 10 ⁇ log [10 ⁇ (S21 / 10) / ⁇ 1-10 ⁇ (S11 / 10) ⁇ ] (2)
  • the electromagnetic wave shielding layer 3 has an electromagnetic wave shielding property (absorbency + reflectivity) for shielding (shielding) electromagnetic waves at a frequency of 0.2 to 1 GHz measured using the KEC method developed at the Kansai Electronics Industry Promotion Center. It is preferably 25 dB or more, more preferably 35 dB or more, and even more preferably 40 dB or more.
  • the electromagnetic wave shielding property for blocking electromagnetic waves is based on the characteristics of the measuring method described below, and absorbs (absorbs) the light by absorbing the electromagnetic wave and reflects by blocking the electromagnetic wave. It is measured as a value obtained by adding the property (reflectivity).
  • the electromagnetic wave shielding property (absorbing property) measured using the MSL method is within the above range
  • the electromagnetic wave shielding property (absorbing property + reflecting property) measured using the KEC method is within the above range.
  • the electromagnetic wave shielding layer 3 exhibits excellent electromagnetic shielding properties by absorbing and reflecting the electromagnetic wave incident on the electromagnetic wave shielding layer 3 and blocking (shielding) it. Even electromagnetic waves can be reliably blocked.
  • the KEC method is a method for evaluating the shielding effect of electromagnetic waves generated in the near field separately for electric and magnetic fields, and measurement using this method is based on electromagnetic waves transmitted from a transmission antenna (transmission jig). Can be received by a receiving antenna (receiving jig) through an electromagnetic wave shielding layer 3 (measurement sample) in the form of a sheet.
  • an electromagnetic wave shielding layer is formed in the receiving antenna.
  • the electromagnetic wave that has passed through (transmitted) 3 is measured. That is, how much the transmitted electromagnetic wave (signal) is attenuated on the receiving antenna side by the electromagnetic wave shielding layer 3 is measured. Therefore, the electromagnetic wave shielding property for shielding (shielding) the electromagnetic wave is a reflection property for reflecting the electromagnetic wave. It is obtained in a state where both the absorption of electromagnetic waves and the absorption are combined.
  • the electromagnetic wave shielding layer 3 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, more preferably 5.0E + 05 to 5.0E + 08 Pa.
  • the storage elastic modulus within such a range, in the pasting step, after heating the electromagnetic wave shielding film 100, the insulating layer 2 and the electromagnetic wave are formed on the unevenness 6 on the substrate 5 by pressing force from the base material layer 1.
  • the electromagnetic wave blocking layer 3 can be deformed corresponding to the shape of the unevenness 6 according to the pressing force from the base material layer 1 when covering the unevenness 6. That is, the shape followability of the electromagnetic wave shielding layer 3 with respect to the unevenness 6 can be improved.
  • the electromagnetic wave shielding film 100 has shape conformability when thermocompression bonding is performed on the unevenness 6 formed by mounting the electronic component 4 on the substrate 5 at a temperature of 150 ° C., a pressure of 2 MPa, and a time of 5 minutes.
  • the thickness is preferably 500 ⁇ m or more, more preferably 800 ⁇ m or more, and still more preferably 1000 ⁇ m or more. That is, the electromagnetic wave shielding film 100 can preferably cover the unevenness 6 having a height of 500 ⁇ m or more, which is the difference in height between the upper surface of the convex portion 61 and the upper surface of the concave portion 62, and can cover a thickness of 800 ⁇ m or more.
  • the electromagnetic wave shielding film 100 that can be covered even with the unevenness 6 having a high height (a large level difference) has excellent shape followability, and the insulating layer 2 and the electromagnetic wave shielding layer 3 It is possible to cover the unevenness 6 with an excellent filling rate.
  • the said shape followability can be calculated
  • the electronic component covering method includes an attaching step of attaching the electromagnetic wave shielding film to the unevenness on the substrate so that the electromagnetic wave shielding layer or the insulating layer and the electronic component adhere to each other. And a peeling step of peeling the base material layer.
  • FIG. 9 is a longitudinal sectional view for explaining a method for coating an electronic component using the electromagnetic wave shielding film shown in FIG.
  • the affixing step is a step of affixing the electromagnetic wave shielding film 100 to the unevenness 6 provided on the substrate 5, for example, as shown in FIG.
  • the method for attaching is not particularly limited, and examples thereof include vacuum / pressure forming.
  • Vacuum / pressure forming is, for example, a method of covering the irregularities 6 on the substrate 5 with the electromagnetic wave shielding film 100 using a vacuum pressurizing laminator.
  • the substrate 5 is placed in a closed space that can be in a vacuum atmosphere.
  • the substrate 5 and the electromagnetic wave shielding film 100 are set in an overlapped state so that the surface on which the unevenness 6 is formed and the surface on the insulating layer 2 side of the electromagnetic wave shielding film 100 face each other, and thereafter
  • the closed space is placed in a vacuum atmosphere and then pressurized so that the electromagnetic wave shielding film 100 and the substrate 5 approach each other uniformly from the electromagnetic wave shielding film 100 side.
  • the base material layer 1 is a thing as the above-mentioned structure, the base material layer 1 exhibits the shape followability excellent with respect to the unevenness
  • the base layer 1 is deformed in accordance with the shape of the irregularities 6 by uniformly pressing from the electromagnetic wave shielding film 100 side while making the closed space under a vacuum atmosphere.
  • the insulating layer 2 and the electromagnetic wave shielding layer 3 located closer to the substrate 5 than the base material layer 1 are deformed corresponding to the shape of the irregularities 6. Accordingly, the unevenness 6 is covered with the insulating layer 2 and the electromagnetic wave shielding layer 3 in a state where the insulating layer 2 and the electromagnetic wave shielding layer 3 are pushed in corresponding to the shape of the unevenness 6.
  • the temperature for pasting is not particularly limited, but is preferably 100 ° C. or higher and 200 ° C. or lower, more preferably 120 ° C. or higher and 180 ° C. or lower.
  • the pressure to stick is not particularly limited, but is preferably 0.5 MPa or more and 5.0 MPa or less, more preferably 1.0 MPa or more and 3.0 MPa or less.
  • time to stick is not specifically limited, It is preferable that it is 1 minute or more and 30 minutes or less, More preferably, it is 5 minutes or more and 15 minutes or less.
  • the insulating layer 2 and the electromagnetic wave shielding layer 3 are pushed into the concave and convex portions 6 on the substrate 5, and the concave and convex portions 6 are formed by the insulating layer 2 and the electromagnetic wave shielding layer 3. It can be reliably coated.
  • the said peeling process is a process of peeling the base material layer 1 from the film 100 for electromagnetic wave shields after the said sticking process, for example, as shown in FIG.9 (b).
  • the shape of the electromagnetic wave shielding film 100 to be applied corresponds,
  • the unevenness 6 can be covered with the insulating layer 2 and the electromagnetic wave shielding layer 3. Therefore, the unevenness 6 to be covered can be selectively covered with the insulating layer 2 and the electromagnetic wave shielding layer 3 by appropriately setting the shape of the electromagnetic wave shielding film 100 corresponding to the shape of the unevenness 6 to be covered. . That is, the electromagnetic wave can be selectively shielded from the unevenness 6 by the insulating layer 2 and the electromagnetic wave shielding layer 3.
  • the method for peeling the base material layer 1 is not particularly limited. However, when the electromagnetic wave shielding film 100 after the vacuum pressure forming (the pasting step) is in a high temperature state, the base material layer 1 is stretched and resin Since the remainder etc. generate
  • the base material layer 1 is gripped, the base material layer 1 is peeled off from the insulating layer 2 from the gripped end portion, and then the central portion is cut from the end portion. Furthermore, the base material layer 1 is peeled from the insulating layer 2 by sequentially peeling the base material layer 1 to the other end.
  • the peeling temperature is preferably 180 ° C. or lower, more preferably 150 ° C. or lower, and further preferably 100 ° C. or lower.
  • the base material layer 1 (first layer 11, second layer 13, third layer 12) is formed from the upper surface side.
  • the layer configuration of 100 is not limited to this case, and may be, for example, the electromagnetic wave shielding film 100 having the layer configuration as shown in the eighth to eleventh embodiments as described below.
  • FIG. 10 is a longitudinal sectional view showing an eighth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 10 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 10 is the same as the electromagnetic wave shielding film 100 shown in FIG. 8 except that the formation of the first layer 11 included in the base material layer 1 is omitted.
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the second layer 13 and the third layer 12, the insulating layer 2, and the electromagnetic wave shielding layer 3 laminated in this order.
  • the laminated body is made.
  • the pressing portion of the vacuum pressurizing laminator or the like used when the insulating layer 2 and the electromagnetic wave shielding layer 3 are pressed into the unevenness 6 on the substrate 5 in the attaching step is the second layer. 13, so that the formation of the first layer 11 is omitted.
  • the degree of releasability of the contact surface in contact with the second layer 13 of the pressing portion can be expressed by the surface tension of the contact surface, and the surface tension of the contact surface is 20 to 40 mN / m. And more preferably 25 to 35 mN / m.
  • the contact surface has a surface tension within such a range, the pressing portion can be reliably peeled off from the second layer 13 after pressing using a vacuum pressurizing laminator or the like.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the seventh embodiment, and is similar to the electromagnetic wave shielding film 100 of the seventh embodiment. The effect is obtained.
  • FIG. 11 is a longitudinal sectional view showing a third embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 11 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 11 is the same as the electromagnetic wave shielding film 100 shown in FIG. 8 except that the formation of the third layer 12 included in the base material layer 1 is omitted.
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11 and the second layer 13, the insulating layer 2, and the electromagnetic wave shielding layer 3 laminated in this order.
  • the laminated body is made.
  • the base material layer 1 when the base material layer 1 is peeled from the insulating layer 2 in the peeling step, the base material layer 1 is separated from the insulating layer 2 at the interface between the second layer 13 and the insulating layer 2. It is peeled off. In such peeling, the insulating layer 2 has releasability from the second layer 13, whereby the formation of the third layer 12 is omitted.
  • the degree of releasability of the contact surface in contact with the second layer 13 of the insulating layer 2 can be expressed by the surface tension of the contact surface, and the surface tension of the contact surface is 20 to 40 mN / m. And more preferably 25 to 35 mN / m.
  • the contact surface has a surface tension within such a range, the second layer 13 can be reliably peeled off from the insulating layer 2 after being pressed using a vacuum pressure laminator or the like.
  • Examples of the insulating layer 2 having surface tension include thermoplastic polyester and ⁇ -olefin.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the seventh embodiment, and is similar to the electromagnetic wave shielding film 100 of the seventh embodiment. The effect is obtained.
  • FIG. 12 is a longitudinal sectional view showing a tenth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 12 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 12 is the same as the electromagnetic wave shielding film 100 shown in FIG. 8 except that the formation of the first layer 11 and the third layer 12 included in the base material layer 1 is omitted. It is the same.
  • the electromagnetic wave shielding film 100 forms a laminate in which the base material layer 1 composed of the second layer 13, the insulating layer 2, and the electromagnetic wave shielding layer 3 are laminated in this order. Yes.
  • the pressing portion of the vacuum pressurizing laminator or the like used when the insulating layer 2 and the electromagnetic wave shielding layer 3 are pressed into the unevenness 6 on the substrate 5 in the attaching step is the second layer. 13, so that the formation of the first layer 11 is omitted.
  • the peeling process when the base material layer 1 is peeled from the insulating layer 2, the base material layer 1 is peeled from the insulating layer 2 at the interface between the second layer 13 and the insulating layer 2. In such peeling, the insulating layer 2 has releasability from the second layer 13, whereby the formation of the third layer 12 is omitted.
  • the same resin as that described in the first embodiment can be used as the resin constituting the second layer 13 of the base material layer 1.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the seventh embodiment, and is similar to the electromagnetic wave shielding film 100 of the seventh embodiment. The effect is obtained.
  • FIG. 13 is a longitudinal sectional view showing an eleventh embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 13 is referred to as “upper” and the lower side is referred to as “lower”.
  • the formation of the third layer 12 included in the base material layer 1 is omitted, and the stacking order of the insulating layer 2 and the electromagnetic wave shielding layer 3 is reversed. This is the same as the electromagnetic wave shielding film 100 shown in FIG. 13
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11 and the second layer 13, the electromagnetic wave shielding layer 3, and the insulating layer 2 laminated in this order.
  • the laminated body is made.
  • the electromagnetic wave shielding film 100 having such a configuration, when the base material layer 1 is peeled from the electromagnetic wave shielding layer 3 in the peeling step, the base material layer 1 is shielded from electromagnetic waves at the interface between the second layer 13 and the electromagnetic wave shielding layer 3. Peel from layer 3. In such peeling, the electromagnetic wave shielding layer 3 has releasability from the second layer 13, and thus the formation of the third layer 12 is omitted.
  • the degree of releasability of the contact surface in contact with the second layer 13 of the electromagnetic wave shielding layer 3 can be expressed by the surface tension of the contact surface, and the surface tension of the contact surface is 20 to 40 mN / m is preferable, and 25 to 35 mN / m is more preferable.
  • the contact surface has a surface tension within such a range, the second layer 13 can be reliably peeled from the electromagnetic wave shielding layer 3 after being pressed using a vacuum pressurizing laminator or the like.
  • an electromagnetic wave shielding layer 3 having surface tension for example, a carbon allotrope or a conductive polymer dispersed in a thermosetting resin such as polyurethane can be used.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the seventh embodiment, and is similar to the electromagnetic wave shielding film 100 of the seventh embodiment. The effect is obtained.
  • FIG. 14 is a longitudinal sectional view showing a twelfth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 14 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 14 is the same as the electromagnetic wave shielding film 100 shown in FIG. 8 except that the stacking order of the insulating layer 2 and the electromagnetic wave shielding layer 3 is reversed.
  • the electromagnetic wave shielding film 100 includes the base material layer 1 including the first layer 11, the second layer 13, and the third layer 12, the electromagnetic wave shielding layer 3, and the insulating layer 2.
  • the laminated body is laminated in this order.
  • the insulating layer 2 comes into contact with the substrate 5 and the electronic component 4,
  • the insulating layer 2 and the electromagnetic wave shielding layer 3 are coated in this order from the substrate 5 side.
  • the insulating layer 2 covers the substrate 5 and the electronic component 4 in contact with them, whereby the substrate 5 and the electronic component 4 are covered via the insulating layer 2. It insulates from the electromagnetic wave shielding layer 3 and other members (electronic parts etc.) located on the opposite side.
  • the adjacent electronic components 4 can be reliably insulated by the insulating layer 2. it can.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the seventh embodiment, and is similar to the electromagnetic wave shielding film 100 of the seventh embodiment. The effect is obtained.
  • the insulating layer 2 demonstrated the case where one layer was laminated
  • an electromagnetic wave shielding layer One layer may be laminated as a separate layer on each of the upper surface and the lower surface of 3, or the formation thereof may be omitted.
  • unevenness is formed on the substrate by mounting the electronic component on the substrate, and the case where the unevenness is covered with the electromagnetic shielding film has been described.
  • the coating is not limited to such unevenness, and for example, it may be applied to a flat region provided in a housing or the like.
  • FIG. 15 is a longitudinal sectional view showing a thirteenth embodiment of the electromagnetic wave shielding film of the present invention.
  • the upper side in FIG. 15 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 shown in FIG. 15 is the same as the electromagnetic wave shielding film 100 shown in FIG. 13 except that the formation of the first layer 11 and the third layer 12 included in the base material layer 1 is omitted. It is the same.
  • the electromagnetic wave shielding film 100 forms a laminated body in which the base material layer 1 composed of the second layer 13, the electromagnetic wave shielding layer 3, and the insulating layer 2 are laminated in this order. Yes.
  • the pressing portion of the vacuum pressure laminator or the like used when the electromagnetic wave blocking layer 3 and the insulating layer 2 are pressed into the unevenness 6 on the substrate 5 in the attaching step is the second layer. 13, so that the formation of the first layer 11 is omitted.
  • the peeling step when peeling the base material layer 1 from the electromagnetic wave shielding layer 3, the base material layer 1 is peeled from the electromagnetic wave shielding layer 3 at the interface between the second layer 13 and the electromagnetic wave shielding layer 3.
  • the insulating layer 2 has releasability from the second layer 13, whereby the formation of the third layer 12 is omitted.
  • the same resin as that described in the first embodiment can be used as the resin constituting the second layer 13 of the base material layer 1.
  • the electromagnetic wave shielding film 100 of this embodiment having such a configuration can also be used in the same manner as the electromagnetic wave shielding film 100 of the seventh embodiment, and is similar to the electromagnetic wave shielding film 100 of the seventh embodiment. The effect is obtained.
  • the step of peeling the base material layer 1 from the electromagnetic wave shielding film 100 after the sticking step is included.
  • the protective layer may be used without peeling off.
  • the electromagnetic shielding film and the electronic component mounting substrate of the present invention have been described above, but the present invention is not limited to these.
  • the arbitrary configurations of the seventh to thirteenth embodiments can be combined.
  • the arbitrary layers which can exhibit the same function may be added to the film for electromagnetic wave shields of this invention, and the electronic component mounting substrate of this invention.
  • the electromagnetic wave shielding film of the present embodiment is an electromagnetic wave shielding film used for covering irregularities on a substrate, and is characterized in that the electromagnetic wave shielding film has a thickness of 8 ⁇ m or more and 50 ⁇ m or less.
  • the electromagnetic wave shielding film When such an electromagnetic wave shielding film is used to coat uneven surfaces on a substrate, the electromagnetic wave shielding film is pressed so that the electromagnetic wave shielding film and the substrate come close to each other at room temperature in the coating step. It can be pushed in while following the shape of the unevenness. As a result, the substrate provided with the unevenness can be reliably covered with the electromagnetic wave shielding layer, so that the electromagnetic wave shielding property of the substrate provided with the unevenness due to the electromagnetic wave shielding layer is improved.
  • FIG. 16 is a longitudinal cross-sectional view which shows 14th Embodiment of the film for electromagnetic wave shields of this invention.
  • the upper side in FIG. 16 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 includes a protective layer 201, an electromagnetic wave blocking layer 202, and an insulating layer 203.
  • the electromagnetic wave blocking layer 202 and the insulating layer 203 are formed of a protective layer. From the lower surface side of 201, the electromagnetic wave shielding layer 202 contacts the protective layer 201 and is laminated in this order.
  • the thickness of the electromagnetic wave shielding film 100 is 8 ⁇ m or more and 50 ⁇ m or less. By being 8 ⁇ m or more, a good film mechanical strength effect is exhibited. By being 50 ⁇ m or less, there is a good molding followability effect. That is, it is possible to achieve both of the above effects when the film thickness is 8 ⁇ m or more and 50 ⁇ m or less.
  • the thicknesses of the protective layer 201, the electromagnetic wave shielding layer 202, and the insulating layer 203 described later may be set as appropriate.
  • the electronic component 4 is mounted (placed) on the substrate 5, and the unevenness 6 including the convex portions 61 and the concave portions 62 is formed on the substrate 5 by mounting the electronic component 4.
  • the case where 6 is covered with the electromagnetic wave shielding film 100 will be described.
  • Examples of the electronic component 4 mounted on the substrate 5 include an LCD driver IC mounted on a flexible circuit board (FPC), an IC + capacitor around the touch panel, or an electronic circuit board (motherboard).
  • the protective layer 201 protects the electromagnetic wave shielding layer 202 when the electromagnetic wave shielding film is used, and protects the electromagnetic wave shielding layer 202 from deterioration due to oxygen in the air and damage of the electromagnetic wave shielding layer 202 due to physical contact. It is.
  • the protective layer 201 preferably has a storage elastic modulus at 25 ° C. of 2.0E + 02 Pa to 5.0E + 09 Pa, more preferably 2.0E + 03 Pa to 3.0E + 09 Pa.
  • room temperature room temperature
  • the protective layer 201 is attached to the substrate 5 when the protective layer 201 (electromagnetic wave shielding film 100) is attached to the substrate 5.
  • 5 can be affixed without causing wrinkles or the like, and the workability when cutting to a specified size is improved, and can be sufficiently pushed into the unevenness 6 provided on the substrate 5.
  • the storage elastic modulus at the time of heating of the protective layer 201 functioning as a base material for improving the shape followability to the unevenness 6 of the insulating layer 203 and the electromagnetic wave shielding layer 202 within the above range, Since the substrate 5 provided with the unevenness 6 can be reliably covered with the electromagnetic wave blocking layer 202, the electromagnetic wave shielding (blocking) property to the substrate 5 provided with the unevenness 6 by the electromagnetic wave blocking layer 202 is improved. It becomes.
  • the storage elastic modulus in 25 degreeC of each layer can be calculated
  • the constituent material of the protective layer 201 is not particularly limited.
  • resin materials such as polyethylene terephthalate, syndiotactic polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, polyethylene, acrylic polymer, cyclic olefin polymer, silicone, and Examples include thermoplastic elastomers such as styrenic elastomers and rubbers such as styrene butadiene rubber.
  • the protective layer 201 may be made of only polyethylene terephthalate or styrene butadiene rubber.
  • the protective layer 201 may further contain a thermoplastic elastomer, a thermoplastic resin, or the like in addition to the polyethylene terephthalate or the styrene butadiene rubber.
  • the total thickness T (F) of the protective layer 201 is not particularly limited, but is preferably 1 ⁇ m or more and 30 ⁇ m or less, and more preferably 3 ⁇ m or more and 20 ⁇ m or less.
  • the entire thickness of the protective layer 201 is less than the lower limit, there is a risk that deterioration resistance and physical contact resistance cannot be obtained.
  • the shape followability of the protective layer 201 may be reduced, and the shape followability of the electromagnetic wave shielding layer 202 and the insulating layer 203 may be reduced.
  • the protective layer 201 may be a single layer or a multilayer structure.
  • the position of the protective layer 201 is not particularly limited, but the protective layer 201 is preferably laminated on the opposite side of the insulating layer 203 with the electromagnetic wave shielding layer 202 interposed therebetween.
  • Electromagnetic wave blocking layer 202 Next, the electromagnetic wave blocking layer (blocking layer) 202 will be described.
  • the electromagnetic wave shielding layer 202 includes at least the electronic component 4 provided on the substrate 5 and other electronic components located on the opposite side of the substrate 5 (electronic component 4) via the electromagnetic wave shielding layer 202. It has a function of shielding (shielding) electromagnetic waves generated from one side.
  • a reflection layer that blocks (shields) the electromagnetic wave incident on the electromagnetic wave blocking layer and absorbs the electromagnetic wave incident on the electromagnetic wave blocking layer.
  • Absorbing layers that are shielded (shielded) by the above are known.
  • the absorption layer absorbs electromagnetic waves incident on the absorption layer and converts them into thermal energy.
  • the electromagnetic wave is extinguished by this absorption. Therefore, from the standpoint that it is possible to reliably prevent the reflected electromagnetic wave, such as the reflective layer, from adversely affecting the other members that are not covered with the electromagnetic wave blocking layer.
  • the layer is preferably composed of an absorbent layer.
  • the electromagnetic wave shielding layer 202 preferably contains a conductive polymer. Thereby, flexibility and electromagnetic wave shielding effect can be obtained at the same time.
  • the conductive polymer of the present invention is not particularly limited, and examples thereof include the same as those mentioned in the first embodiment, and one or more of these can be used in combination. .
  • polyaniline is preferable. According to these, even if the electromagnetic wave blocking layer 202 is reduced in weight and thickness, it is possible to more reliably block electromagnetic waves in the high frequency band as in the GHz order.
  • the average value (average particle diameter) of the particle diameter is preferably 0.5 ⁇ m or more and 10 ⁇ m or less, and is 1.0 ⁇ m or more and 5.0 ⁇ m or less. Is more preferable.
  • the content of the conductive polymer in the electromagnetic wave shielding layer 202 is preferably 5 wt% or more and 50 wt% or less, and more preferably 8 wt% or more and 40 wt% or less. Within the above range, the electromagnetic wave shielding property and the film property are maintained, which is preferable.
  • the electromagnetic wave shielding layer 202 preferably contains metal powder. Thereby, a high electromagnetic wave shielding effect can be obtained.
  • the metal powder of this invention is not specifically limited, For example, it is gold, silver, silver coat copper, copper, nickel, etc. Among these, silver and silver coat copper are preferable from an electroconductive point.
  • the shape of the metal powder is not particularly limited, and examples thereof include a spherical shape, a needle shape, a dendritic shape, a scale shape, and a flake shape. Among these, the use of a scaly shape is preferable because the particles easily come into contact with each other and the conductivity is improved.
  • the scale-like shape may be a flat shape, and the planar shape is not particularly limited.
  • a scaly metal powder formed by crushing or crushing particles of various shapes is preferably used in terms of cost and productivity.
  • the scale-like metal powder preferably has an average thickness of 0.01 ⁇ m to 1 ⁇ m and an average particle size of 1 ⁇ m to 20 ⁇ m. Within the above range, the dispersibility and the orientation are good and the electromagnetic wave shielding property is maintained, which is preferable. In addition, the average particle diameter and average thickness of metal powder can be measured by a laser diffraction scattering method.
  • the content of the metal powder in the electromagnetic wave shielding layer 202 is preferably 40 wt% or more and 80 wt% or less, and more preferably 45 wt% or more and 75 wt% or less. Within the above range, the electromagnetic wave shielding property is maintained, which is preferable.
  • the electromagnetic wave shielding layer 202 may use a resin other than the above-described conductive polymer and metal powder. That is, by forming a film of a conductive polymer, it may be formed into a film without containing components other than metal powder, but may be formed into a film using a binder resin.
  • binder resin An epoxy resin, a phenol resin, a polyester resin, a polyurethane resin, an acrylic resin, a melamine resin, a polyimide resin, a polyamideimide resin etc. can be used. It is preferable to use a polyester resin that can achieve both heat resistance and flexibility of the electromagnetic wave shielding layer 202.
  • polyester resin A commercially available polyester resin can be used as the polyester resin.
  • a thermoplastic saturated copolyester resin is used. Among them, those having an average molecular weight in the range of 2000 to 40000 can be preferably used.
  • the thickness T of the electromagnetic wave shielding layer 202 is not particularly limited, but is preferably 2 ⁇ m or more and 40 ⁇ m or less, and more preferably 3 ⁇ m or more and 25 ⁇ m or less.
  • the thickness of the electromagnetic wave shielding layer 202 is less than the lower limit, depending on the constituent material of the electromagnetic wave shielding layer 202, there is a possibility of breaking at the end of the board mounted component.
  • the thickness of the electromagnetic wave shielding layer 202 exceeds the upper limit, the shape following property may be insufficient depending on the constituent material of the electromagnetic wave shielding layer 202 or the like.
  • the excellent electromagnetic wave shielding property can be exhibited even with the thickness T within such a range, it is possible to reduce the thickness T of the electromagnetic wave shielding layer 202, and thus the insulating layer 203 and the electromagnetic wave on the substrate 5.
  • the weight reduction of the electronic component mounting board on which the electronic component 4 covered with the blocking layer 202 is mounted can be realized.
  • the electromagnetic wave shielding layer 202 as described above has an electromagnetic wave shielding property (absorbability) of 5 dB or more for shielding (shielding) an electromagnetic wave at a frequency of 0.2 to 10 GHz measured using a microstrip line method (MSL method). Preferably, it is 6 dB or more, more preferably 7 dB or more.
  • MSL method is the method described above in the seventh embodiment. Therefore, the electromagnetic wave shielding layer 202 having the electromagnetic wave shielding property (absorbability) within the above range exhibits excellent electromagnetic wave shielding properties by shielding (shielding) by absorbing the electromagnetic wave incident on the electromagnetic wave shielding layer 202. It can be said that the electromagnetic wave blocking layer (absorbing layer) 203 is capable of blocking high frequency band electromagnetic waves as in the GHz order.
  • the electromagnetic wave shielding layer 202 has an electromagnetic wave shielding property (absorbing property + reflective property) for shielding (shielding) electromagnetic waves at a frequency of 0.2 to 1 GHz measured using the KEC method developed at the Kansai Electronics Industry Promotion Center. It is preferably 25 dB or more, more preferably 35 dB or more, and even more preferably 40 dB or more.
  • the KEC method is the method described above in the seventh embodiment. Therefore, the electromagnetic wave shielding property (absorbing property) measured using the MSL method is within the above range, and the electromagnetic wave shielding property (absorbing property + reflecting property) measured using the KEC method is within the above range.
  • the electromagnetic wave blocking layer 202 exhibits excellent electromagnetic wave shielding properties by blocking (shielding) by absorbing and reflecting the electromagnetic wave incident on the electromagnetic wave blocking layer 202. Even electromagnetic waves can be reliably blocked.
  • the electromagnetic wave shielding layer 202 preferably has a storage elastic modulus at 25 ° C. of 1.0E + 05 to 1.0E + 09 Pa, and more preferably 5.0E + 05 to 5.0E + 08 Pa.
  • the storage elastic modulus within such a range, in the attaching step, after heating the electromagnetic wave shielding film 100, the insulating layer 203 and the electromagnetic wave shielding are formed on the irregularities 6 on the substrate 5 by pressing force from the protective layer 201.
  • the electromagnetic wave shielding layer 202 can be deformed corresponding to the shape of the unevenness 6 according to the pressing force from the protective layer 201 when the unevenness 6 is covered. That is, the shape followability of the electromagnetic wave shielding layer 202 with respect to the unevenness 6 can be improved.
  • the insulating layer 203 is provided in contact with the electromagnetic wave shielding layer 202, and the electromagnetic wave shielding layer 202 and the insulating layer 203 are laminated in this order from the protective layer 201 side.
  • the electromagnetic wave shielding film 100 laminated in this manner is used to cover the irregularities 6 on the substrate 5 so that the insulating layer 203 comes into contact with the substrate 5 and the electronic component 4, and the insulating layer 203,
  • the electromagnetic wave shielding layer 202 is coated in this order.
  • the insulating layer 203 examples include a thermosetting insulating resin or a thermoplastic insulating resin (insulating film). Among these, it is preferable to use an insulating resin having thermoplasticity. Since the insulating resin having thermoplasticity is a film having excellent flexibility, when the insulating layer 203 and the electromagnetic wave shielding layer 202 are pressed into the unevenness 6 on the substrate 5 in the attaching step, the insulating layer 203 is Corresponding to the shape of the irregularities 6 can be surely followed.
  • thermoplastic polyester examples include thermoplastic polyester, ⁇ -olefin, vinyl acetate, polyvinyl acetal, ethylene vinyl acetate, vinyl chloride, acrylic, polyamide, and cellulose.
  • acrylic resins or styrene elastomers are particularly preferable. That is, in consideration of thinning the electromagnetic wave shielding film 100, when the insulating layer 203 is thinned, the electromagnetic wave shielding layer 202 and the adhesion to the substrate become a problem. However, when an acrylic resin or a styrene-based elastomer is used as the insulating layer 203, the insulating layer 203 can be thinned and the electromagnetic wave shielding film 100 can be thinned because of sufficient adhesion. .
  • the insulating resin having thermoplasticity is a phenolic resin, a silicone resin, a urea resin, an acrylic resin, a polyester resin, a polyamide resin, as long as the performance such as heat resistance and flex resistance is not impaired.
  • a polyimide resin or the like can be contained.
  • a silane coupling agent, an antioxidant, a pigment, a dye as long as the adhesiveness and solder reflow resistance are not deteriorated. You may add tackifying resin, a plasticizer, a ultraviolet absorber, an antifoamer, a leveling regulator, a filler, a flame retardant, etc.
  • the thickness T (D) of the insulating layer 203 is not particularly limited, but is preferably 3 ⁇ m or more and 30 ⁇ m or less, and more preferably 5 ⁇ m or more and 25 ⁇ m or less.
  • the thickness of the insulating layer 203 is less than the lower limit value, the resistance to goby folds is insufficient, cracks occur at the bent portions after thermocompression bonding to the irregularities 6, the film strength is reduced, and the conductive adhesive layer It is difficult to play a role as an insulating support. If the upper limit is exceeded, shape followability may be insufficient.
  • the insulating layer 203 can be made more flexible, and the insulating layer 203 is shaped into the shape of the unevenness 6 in the pasting step. It can be made to follow more reliably corresponding to.
  • the average linear expansion coefficient of the insulating layer 203 at 25 to 150 ° C. is preferably 50 to 1000 [ppm / ° C.], and more preferably 100 to 700 [ppm / ° C.].
  • the insulating layer 203 has excellent stretchability when the electromagnetic wave shielding film 100 is heated.
  • the shape followability of the electromagnetic wave shielding layer 202 with respect to the irregularities 6 can be improved more reliably.
  • the insulating layer 203 may be a laminated body of two or more layers in which different ones of the above-described insulating films are laminated in addition to the one constituted by one layer. .
  • the method for coating an electronic component according to this embodiment is a pasting step in which the electromagnetic wave shielding film is stuck to the unevenness on the substrate so that the electromagnetic wave shielding layer or the insulating layer and the electronic component are bonded.
  • FIG. 17 is a longitudinal sectional view for explaining a method of coating an electronic component using the electromagnetic wave shielding film shown in FIG.
  • the affixing step is a step of affixing the electromagnetic wave shielding film 100 to the unevenness 6 provided on the substrate 5, for example, as shown in FIG.
  • the method for attaching is not particularly limited, and examples thereof include a press.
  • it is a method of covering the unevenness 6 on the substrate 5 with the electromagnetic wave shielding film 100 using a press machine.
  • the surface of the substrate 5 where the unevenness 6 is formed and the electromagnetic shielding film 100 The substrate 5 and the electromagnetic wave shielding film 100 are set so as to overlap each other so that the surface on the insulating layer 203 side faces, and then these are uniformly shielded from the electromagnetic wave shielding film 100 side at room temperature.
  • the film 100 and the substrate 5 are brought close to each other and then pressed.
  • the temperature for pasting is not particularly limited, but is preferably 0 ° C. or higher and 150 ° C. or lower, more preferably 10 ° C. or higher and 50 ° C. or lower.
  • the pressure to be applied is not particularly limited, but is preferably 0.01 MPa or more and 1 MPa or less, more preferably 0.05 MPa or more and 0.15 MPa or less.
  • the sticking time is not particularly limited, but is preferably 5 seconds or more and 60 seconds or less, more preferably 10 seconds or more and 30 seconds or less.
  • the irregularities 6 are formed by the insulating layer 203 and the electromagnetic wave shielding layer 202. It can be reliably coated.
  • the shape of the electromagnetic wave shielding film 100 to be applied corresponds,
  • the unevenness 6 can be covered with the insulating layer 203 and the electromagnetic wave shielding layer 202. Therefore, the unevenness 6 to be covered can be selectively covered with the insulating layer 203 and the electromagnetic wave shielding layer 202 by appropriately setting the shape of the electromagnetic wave shielding film 100 corresponding to the shape of the unevenness 6 to be covered. . That is, the selective electromagnetic wave shielding of the unevenness 6 by the insulating layer 203 and the electromagnetic wave shielding layer 202 becomes possible.
  • the electromagnetic wave shielding film 100 is formed by laminating a protective layer 201, an electromagnetic wave shielding layer 202, and an insulating layer 203 in this order from the upper surface side.
  • the layer configuration of the electromagnetic wave shielding film 100 is not limited to this case.
  • the arbitrary layers which can exhibit the same function may be added to the film for electromagnetic wave shields of this invention, and the electronic component mounting substrate of this invention.
  • the electromagnetic wave shielding film of the present embodiment includes an insulating layer and an electromagnetic wave shielding layer, and the piercing strength of the insulating layer measured by JIS Z 1707 is 0.9 N or more and 10.0 N or less. .
  • the electromagnetic wave shielding film When such an electromagnetic wave shielding film is applied to the uneven coating on the substrate, the electromagnetic wave shielding film can be applied without breaking the insulating layer of the electromagnetic wave shielding film. As a result, it is possible to shield the substrate from electromagnetic waves while preventing current conduction between the electronic component and the conductive electromagnetic wave shielding layer.
  • FIG. 16 is a longitudinal cross-sectional view which shows 15th Embodiment of the film for electromagnetic wave shielding of this embodiment.
  • the upper side in FIG. 16 is referred to as “upper” and the lower side is referred to as “lower”.
  • the electromagnetic wave shielding film 100 includes a protective layer 201, an electromagnetic wave shielding layer 202, and an insulating layer 203.
  • the electromagnetic wave shielding layer 202 and the insulating layer 203 are made of a base material. From the lower surface side of the layer 201, the electromagnetic wave shielding layer 202 contacts the base material layer 201 and is laminated in this order.
  • the electronic component 4 is mounted (placed) on the substrate 5, and the unevenness 6 including the convex portions 61 and the concave portions 62 is formed on the substrate 5 by mounting the electronic component 4.
  • the case where 6 is covered with the electromagnetic wave shielding film 100 will be described.
  • Examples of the electronic component 4 mounted on the substrate 5 include an LCD driver IC mounted on a flexible circuit board (FPC), an IC + capacitor around the touch panel, or an electronic circuit board (motherboard).
  • the protective layer 201 protects the electromagnetic wave shielding layer 202 when the electromagnetic wave shielding film is used, and protects the electromagnetic wave shielding layer 202 from deterioration due to oxygen in the air and damage of the electromagnetic wave shielding layer 202 due to physical contact. It is.
  • the protective layer 201 preferably has a storage elastic modulus at 25 ° C. of 2.0E + 02 Pa to 5.0E + 09 Pa, more preferably 2.0E + 03 Pa to 3.0E + 09 Pa.
  • room temperature room temperature
  • the protective layer 201 is attached to the substrate 5 when the protective layer 201 (electromagnetic wave shielding film 100) is attached to the substrate 5.
  • 5 can be affixed without causing wrinkles or the like, and the workability when cutting to a specified size is improved, and can be sufficiently pushed into the unevenness 6 provided on the substrate 5.
  • the storage elastic modulus in 25 degreeC, 120 degreeC, and 150 degreeC of each layer is the storage elastic modulus of each layer which should be measured, for example using a dynamic viscoelasticity measuring apparatus (the Seiko Instruments company make, "DMS6100"). Is measured at a heating rate of 5 ° C./min and a frequency of 1 Hz in a tensile mode with a constant load of 49 mN from 25 to 200 ° C., and the storage elastic modulus at 25 ° C., 120 ° C. and 150 ° C. is obtained by reading each. be able to.
  • a dynamic viscoelasticity measuring apparatus the Seiko Instruments company make, "DMS6100"
  • the constituent material of the protective layer 201 is not particularly limited, and for example, resin materials such as polyethylene terephthalate, styrene elastomer, polyethylene, syndiotactic polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, cyclic olefin polymer, and silicone. Is mentioned. Among these, it is preferable to use polyethylene terephthalate. By selecting polyethylene terephthalate as the resin, the protective layer 201 can be a thin film with excellent durability.
  • the protective layer 201 may be composed only of polyethylene terephthalate.
  • the protective layer 201 may further contain polycarbonate or the like in addition to the polyethylene terephthalate.
  • the total thickness T (F) of the protective layer 201 is not particularly limited, but is preferably 1 ⁇ m or more and 20 ⁇ m or less, more preferably 3 ⁇ m or more and 15 ⁇ m or less, and further preferably 5 ⁇ m or more and 10 ⁇ m or less. is there.
  • the total thickness of the protective layer 201 is less than the lower limit, the durability of the protective layer 201 may be reduced.
  • the total thickness of the protective layer 201 exceeds the said upper limit, the shape followability of the protective layer 201 may fall and it may become impossible to cover a board
  • the protective layer 201 may be a single layer or a multilayer structure.
  • the position of the protective layer 201 is not particularly limited, but the protective layer 201 is preferably laminated on the opposite side of the insulating layer 203 with the electromagnetic wave shielding layer 202 interposed therebetween.
  • Electromagnetic wave blocking layer 202 Next, the electromagnetic wave blocking layer (blocking layer) 202 will be described.
  • the electromagnetic wave shielding layer 202 includes at least the electronic component 4 provided on the substrate 5 and other electronic components located on the opposite side of the substrate 5 (electronic component 4) via the electromagnetic wave shielding layer 202. It has a function of shielding (shielding) electromagnetic waves generated from one side.
  • a reflection layer that blocks (shields) the electromagnetic wave incident on the electromagnetic wave blocking layer and absorbs the electromagnetic wave incident on the electromagnetic wave blocking layer.
  • Absorbing layers that are blocked (shielded) by the above are known.
  • the absorption layer absorbs electromagnetic waves incident on the absorption layer and converts them into thermal energy.
  • the electromagnetic wave is extinguished by this absorption. Therefore, from the standpoint that it is possible to reliably prevent the reflected electromagnetic wave, such as the reflective layer, from adversely affecting the other members that are not covered with the electromagnetic wave blocking layer.
  • the layer is preferably composed of an absorbent layer.
  • the electromagnetic wave shielding layer 202 preferably contains a conductive polymer. Thereby, flexibility and electromagnetic wave shielding effect can be obtained at the same time.
  • the conductive polymer of the present invention is not particularly limited, and examples thereof include the same as those mentioned in the first embodiment, and one or more of these can be used in combination. .
  • polyaniline is preferable. According to these, even if the electromagnetic wave blocking layer 202 is reduced in weight and thickness, it is possible to more reliably block electromagnetic waves in the high frequency band as in the GHz order.
  • the average value (average particle diameter) of the particle diameter is preferably 0.5 ⁇ m or more and 10 ⁇ m or less, and is 1.0 ⁇ m or more and 5.0 ⁇ m or less. Is more preferable.
  • the content of the conductive polymer in the electromagnetic wave shielding layer 202 is preferably 5 wt% or more and 50 wt% or less, and more preferably 8 wt% or more and 40 wt% or less. Within the above range, the electromagnetic wave shielding property and the film property are maintained, which is preferable.
  • the electromagnetic wave shielding layer 202 preferably contains metal powder. Thereby, a high electromagnetic wave shielding effect can be obtained.
  • the metal powder of this invention is not specifically limited, For example, it is gold, silver, silver coat copper, copper, nickel, etc. Among these, silver and silver coat copper are preferable from an electroconductive point.
  • the shape of the metal powder is not particularly limited, and examples thereof include a spherical shape, a needle shape, a dendritic shape, a scale shape, and a flake shape. Among these, the use of a scaly shape is preferable because the particles easily come into contact with each other and the conductivity is improved.
  • the scale-like shape may be a flat shape, and the planar shape is not particularly limited.
  • a scaly metal powder formed by crushing or crushing particles of various shapes is preferably used in terms of cost and productivity.
  • the scale-like metal powder preferably has an average thickness of 0.01 ⁇ m to 1 ⁇ m and an average particle size of 1 ⁇ m to 20 ⁇ m. Within the above range, the dispersibility and the orientation are good and the electromagnetic wave shielding property is maintained, which is preferable. In addition, the average particle diameter and average thickness of metal powder can be measured by a laser diffraction scattering method.
  • the content of the metal powder in the electromagnetic wave shielding layer 202 is preferably 40 wt% or more and 80 wt% or less, and more preferably 45 wt% or more and 75 wt% or less. Within the above range, the electromagnetic wave shielding property is maintained, which is preferable.
  • the electromagnetic wave shielding layer 202 may use a resin other than the above-described conductive polymer and metal powder. That is, by forming a film of a conductive polymer, it may be formed into a film without containing components other than metal powder, but may be formed into a film using a binder resin.
  • binder resin An epoxy resin, a phenol resin, a polyester resin, a polyurethane resin, an acrylic resin, a melamine resin, a polyimide resin, a polyamideimide resin etc. can be used. It is preferable to use a polyester resin that can achieve both heat resistance and flexibility of the electromagnetic wave shielding layer 202.
  • polyester resin A commercially available polyester resin can be used as the polyester resin.
  • a thermoplastic saturated copolyester resin is used. Among them, those having an average molecular weight in the range of 2000 to 40000 can be preferably used.
  • the thickness T of the electromagnetic wave shielding layer 202 is not particularly limited, but is preferably 1 ⁇ m or more and 100 ⁇ m or less, more preferably 2 ⁇ m or more and 90 ⁇ m or less, and further preferably 3 ⁇ m or more and 80 ⁇ m or less.
  • the thickness of the electromagnetic wave shielding layer 202 is less than the lower limit, depending on the constituent material of the electromagnetic wave shielding layer 202, there is a possibility of breaking at the end of the board mounted component.
  • the thickness of the electromagnetic wave shielding layer 202 exceeds the upper limit, the shape following property may be insufficient depending on the constituent material of the electromagnetic wave shielding layer 202 or the like.
  • the excellent electromagnetic wave shielding property can be exhibited even with the thickness T within such a range, it is possible to reduce the thickness T of the electromagnetic wave shielding layer 202, and thus the insulating layer 203 and the electromagnetic wave on the substrate 5.
  • the weight reduction of the electronic component mounting board on which the electronic component 4 covered with the blocking layer 202 is mounted can be realized.
  • the electromagnetic wave shielding layer 202 as described above has an electromagnetic wave shielding property (absorbability) of 5 dB or more for shielding (shielding) an electromagnetic wave at a frequency of 0.2 to 10 GHz measured using a microstrip line method (MSL method). Preferably, it is 6 dB or more, more preferably 7 dB or more.
  • MSL method is the method described above in the seventh embodiment. Therefore, the electromagnetic wave shielding layer 202 having the electromagnetic wave shielding property (absorbability) within the above range exhibits excellent electromagnetic wave shielding properties by shielding (shielding) by absorbing the electromagnetic wave incident on the electromagnetic wave shielding layer 202. It can be said that the electromagnetic wave blocking layer (absorbing layer) 202 does, and can reliably block electromagnetic waves in a high frequency band as in the GHz order.
  • the electromagnetic wave shielding layer 202 has an electromagnetic wave shielding property (absorbing property + reflective property) for shielding (shielding) electromagnetic waves at a frequency of 0.2 to 1 GHz measured using the KEC method developed at the Kansai Electronics Industry Promotion Center. It is preferably 25 dB or more, more preferably 35 dB or more, and even more preferably 40 dB or more.
  • the KEC method is the method described above in the seventh embodiment. Therefore, the electromagnetic wave shielding property (absorbing property) measured using the MSL method is within the above range, and the electromagnetic wave shielding property (absorbing property + reflecting property) measured using the KEC method is within the above range.
  • the electromagnetic wave blocking layer 202 exhibits excellent electromagnetic wave shielding properties by blocking (shielding) by absorbing and reflecting the electromagnetic wave incident on the electromagnetic wave blocking layer 202. Even electromagnetic waves can be reliably blocked.
  • the electromagnetic wave shielding layer 202 preferably has a storage elastic modulus at 150 ° C. of 1.0E + 05 to 1.0E + 09 Pa, more preferably 5.0E + 05 to 5.0E + 08 Pa.
  • the storage elastic modulus within such a range, in the pasting step, after heating the electromagnetic wave shielding film 100, the insulating layer 203 and the electromagnetic wave are formed on the unevenness 6 on the substrate 5 by the pressing force from the base material layer 201.
  • the electromagnetic wave blocking layer 2 can be deformed in accordance with the shape of the unevenness 6 according to the pressing force from the base material layer 201 when the unevenness 6 is covered. That is, the shape followability of the electromagnetic wave shielding layer 202 with respect to the unevenness 6 can be improved.
  • the insulating layer 203 is provided in contact with the electromagnetic wave shielding layer 202, and the electromagnetic wave shielding layer 202 and the insulating layer 203 are laminated in this order from the protective layer 201 side.
  • the electromagnetic wave shielding film 100 laminated in this manner is used to cover the irregularities 6 on the substrate 5 so that the insulating layer 203 comes into contact with the substrate 5 and the electronic component 4, and the insulating layer 203,
  • the electromagnetic wave shielding layer 202 is coated in this order.
  • the insulating layer 203 examples include a thermosetting insulating resin or a thermoplastic insulating resin (insulating film). Among these, it is preferable to use an insulating resin having thermoplasticity. Since the insulating resin having thermoplasticity is a film having excellent flexibility, in the sticking step, the insulating layer 203 and the electromagnetic wave shielding are provided against the unevenness 6 on the substrate 5 using the protective layer 201 as a base material for pressing. When the layer 202 is pushed in, the insulating layer 203 can surely follow the shape of the irregularities 6. In addition, an insulating resin having thermoplasticity is particularly useful when repairing a substrate because it can be re-peeled from the substrate to be bonded when heated to its softening point temperature.
  • thermoplastic polyester examples include thermoplastic polyester, ⁇ -olefin, vinyl acetate, polyvinyl acetal, ethylene vinyl acetate, vinyl chloride, acrylic, polyamide, and cellulose.
  • thermoplastic polyesters and ⁇ -olefins because they have excellent adhesion to the substrate, flexibility and chemical resistance.
  • the insulating resin having thermoplasticity is a phenolic resin, a silicone resin, a urea resin, an acrylic resin, a polyester resin, a polyamide resin, as long as the performance such as heat resistance and flex resistance is not impaired.
  • a polyimide resin or the like can be contained.
  • a silane coupling agent, an antioxidant, a pigment, a dye as long as the adhesiveness and solder reflow resistance are not deteriorated. You may add tackifying resin, a plasticizer, a ultraviolet absorber, an antifoamer, a leveling regulator, a filler, a flame retardant, etc.
  • the insulating layer 203 has a puncture strength measured by JIS Z 1707 of 0.9 N or more and 10.0 N or less.
  • the resin or additive of the insulating layer may be appropriately selected.
  • the resin or additive of the insulating layer may be appropriately selected.
  • the thickness T (D) of the insulating layer 203 is not particularly limited, but is preferably 3 ⁇ m or more and 50 ⁇ m or less, more preferably 4 ⁇ m or more and 40 ⁇ m or less, and further preferably 5 ⁇ m or more and 30 ⁇ m or less.
  • the thickness of the insulating layer 203 is less than the lower limit value, the resistance to goby folds is insufficient, cracks occur at the bent portions after thermocompression bonding to the irregularities 6, the film strength is reduced, and the conductive adhesive layer It is difficult to play a role as an insulating support. If the upper limit is exceeded, shape followability may be insufficient.
  • the insulating layer 203 can be made more flexible, and the insulating layer 203 is shaped into the shape of the unevenness 6 in the pasting step. It is possible to coat more reliably corresponding to the above.
  • the average linear expansion coefficient of the insulating layer 203 at 25 to 150 ° C. is preferably 50 to 1000 [ppm / ° C.], and more preferably 100 to 700 [ppm / ° C.].
  • the insulating layer 203 has excellent stretchability when the electromagnetic wave shielding film 100 is heated.
  • the shape followability of the electromagnetic wave shielding layer 202 with respect to the irregularities 6 can be improved more reliably.
  • the insulating layer 203 may be a laminated body of two or more layers in which different ones of the above-described insulating films are laminated in addition to the one constituted by one layer. .
  • the electromagnetic wave shielding film 100 has an adhesion strength with the polyimide film of 1 N / 25 mm or more and 100 N / 25 mm or less. Thereby, sufficient adhesive force with a flexible circuit board can be obtained.
  • the type and amount of the resin or additive of the insulating layer 203 located in the outermost layer may be appropriately set.
  • the covering method of the electronic component of this embodiment is a sticking process of sticking the electromagnetic wave shielding film on the unevenness on the substrate so that the electromagnetic wave shielding layer or the insulating layer and the electronic component are bonded.
  • FIG. 17 is a longitudinal sectional view for explaining a method of coating an electronic component using the electromagnetic wave shielding film shown in FIG.
  • the affixing step is a step of affixing the electromagnetic wave shielding film 100 to the unevenness 6 provided on the substrate 5, for example, as shown in FIG.
  • the method for attaching is not particularly limited, and examples thereof include a press.
  • it is a method of covering the unevenness 6 on the substrate 5 with the electromagnetic wave shielding film 100 using a press machine.
  • the surface of the substrate 5 where the unevenness 6 is formed and the electromagnetic shielding film 100 The substrate 5 and the electromagnetic wave shielding film 100 are set so as to overlap each other so that the surface on the insulating layer 203 side faces, and then these are uniformly shielded from the electromagnetic wave shielding film 100 side at room temperature.
  • the film 100 and the substrate 5 are brought close to each other and then pressed.
  • the temperature for pasting is not particularly limited, but is preferably 0 ° C. or higher and 150 ° C. or lower, more preferably 10 ° C. or higher and 50 ° C. or lower.
  • the pressure to be applied is not particularly limited, but is preferably 0.01 MPa or more and 1 MPa or less, more preferably 0.05 MPa or more and 0.15 MPa or less.
  • the sticking time is not particularly limited, but is preferably 5 seconds or more and 60 seconds or less, more preferably 10 seconds or more and 30 seconds or less.
  • the irregularities 6 are formed by the insulating layer 203 and the electromagnetic wave shielding layer 202. Can be coated.
  • the shape of the electromagnetic wave shielding film 100 to be applied corresponds,
  • the unevenness 6 can be covered with the insulating layer 203 and the electromagnetic wave shielding layer 202. Therefore, the unevenness 6 to be covered can be selectively covered with the insulating layer 203 and the electromagnetic wave shielding layer 202 by appropriately setting the shape of the electromagnetic wave shielding film 100 corresponding to the shape of the unevenness 6 to be covered. . That is, the selective electromagnetic wave shielding of the unevenness 6 by the insulating layer 203 and the electromagnetic wave shielding layer 202 becomes possible.
  • the electromagnetic wave shielding film 100 is formed by laminating a protective layer 201, an electromagnetic wave shielding layer 202, and an insulating layer 203 in this order from the upper surface side.
  • a protective layer 201 for example, a configuration without the protective layer 201 may be used.
  • the arbitrary layers which can exhibit the same function may be added to the film for electromagnetic wave shields of this invention, and the electronic component mounting substrate of this invention.
  • the linear expansion coefficients of the first layer, the second layer, and the third layer according to the present invention, the elastic modulus at 150 ° C. of the base material layer 1 according to the present invention, and the Z-fold of the electromagnetic wave shielding film of the present invention The following test methods evaluated the electroconductivity, the electromagnetic wave shielding property by the microstrip line method, and the electromagnetic wave shielding property by the KEC method.
  • the average linear expansion coefficient was measured using a thermal stress strain measuring device (EXSTAR TMA / SS6000, manufactured by SII Nano Technology). The composite was cut and set in an apparatus using a metal chuck, the load was 5 g, and measurement was performed in a tensile mode. Under a nitrogen atmosphere, the temperature was increased from 25 ° C. to 250 ° C. at a rate of 5 ° C. per minute and held for 10 minutes, and then decreased from 250 ° C. to 0 ° C. at a rate of 5 ° C. per minute. From the elongation obtained by the measurement, average linear expansion coefficients at 20 to 30 ° C. and 195 to 205 ° C. when the temperature was lowered were obtained, and are listed in Table 1 as average linear expansion coefficients at intermediate values in the respective ranges.
  • the elastic modulus at 150 ° C. was determined by using a dynamic viscoelasticity measuring device (“DMS6100” manufactured by Seiko Instruments Inc.), and measuring the elastic modulus of the layer to be measured from 25 to 200 ° C. with a constant load of 49 mN. The mode is measured at a heating rate of 5 ° C./min and a frequency of 1 Hz, and the storage elastic modulus at 150 ° C. is read.
  • DMS6100 dynamic viscoelasticity measuring device
  • Electromagnetic wave shielding by microstrip line method an electromagnetic shielding property for blocking electromagnetic waves at a frequency of 1 GHz and a frequency of 3 GHz was measured.
  • the electromagnetic wave shielding property by the microstrip line method is measured as a value representing the degree to which electromagnetic waves are blocked by absorption.
  • the electromagnetic wave shielding property at a frequency of 1 GHz is preferably 3 dB or more, more preferably 5 dB or more, and further preferably 7 dB or more.
  • the electromagnetic wave shielding property at a frequency of 3 GHz is preferably 5 dB or more, more preferably 10 dB or more, and further preferably 20 dB or more.
  • the electromagnetic shielding properties for blocking electromagnetic waves at a frequency of 1 GHz were measured using the KEC method developed at the Kansai Electronics Industry Promotion Center.
  • the electromagnetic wave shielding property according to the KEC method is measured as a value representing the degree of shielding of electromagnetic waves by absorption and reflection.
  • the electromagnetic wave shielding property (absorbency + reflectivity) at a frequency of 1 GHz is preferably 10 dB or more, and more preferably 15 dB or more. ⁇ : 15 dB or more ⁇ : less than 15 dB
  • Example 1 Syndiotactic polystyrene (trade name: Zalec S107, manufactured by Idemitsu Kosan Co., Ltd.) as the first layer, syndiotactic polystyrene (trade name: Zalec S107, manufactured by Idemitsu Kosan Co., Ltd.), and the second layer as the third layer As an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106), co-extrusion using a feed block and a multi-manifold die was performed, and three layers having the thicknesses shown in Table 1 were sequentially formed. A base material layer formed by lamination was manufactured.
  • the electromagnetic wave shielding layer uses polyaniline (manufactured by Regulus Co., Ltd.) as the conductive composition, uses an amorphous polyester resin (manufactured by Toyobo Co., Ltd., trade name: Byron 63SS) as the binder A, and the content of the binder A is 20% by mass. It mixed so that it might become.
  • An electromagnetic wave shielding film of the present invention was produced by coating the base material layer with an electromagnetic wave shielding layer. The electromagnetic wave shielding film was evaluated for the conductivity after Z-folding, the electromagnetic wave shielding property by the microstrip line method, and the electromagnetic wave shielding property by the KEC method. The evaluation results are shown in Table 1.
  • Example 2 An electromagnetic wave shielding film was produced and evaluated in the same manner as in Example 1 except that the content of the binder A in the electromagnetic wave shielding layer 3 was 30% by mass, 40% by mass, and 50% by mass, respectively. The evaluation results are shown in Table 1.
  • Example 6 An electromagnetic wave shielding film was produced and evaluated in the same manner as in Example 1 except that the content of binder A used in Example 1 was 0. The evaluation results are shown in Table 1.
  • the varnish was applied to a polyethylene terephthalate film (manufactured by Panac Co., Ltd., thickness 125 ⁇ m) with a comma coater and dried at 60 ° C. to obtain a film for evaluating electromagnetic shielding properties.
  • the electromagnetic wave shielding layer was 20 ⁇ m.
  • an ethylene-methyl acrylate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: ACRIFT WD106) was prepared.
  • a polyolefin emulsion (manufactured by Unitika Ltd., trade name: Arrow Base TC-4010) was prepared as a resin constituting the insulating layer.
  • the varnish prepared above was prepared as a resin constituting the electromagnetic wave shielding layer.
  • the syndiotactic polystyrene as a first layer, the syndiotactic polystyrene as a third layer, and the ethylene-methyl acrylate copolymer as a second layer are co-polymerized using a feed block and a multi-manifold die.
  • a film was formed by extrusion.
  • the base material layer was coated with the conductive varnish as an electromagnetic wave shielding layer and the polyolefin emulsion as an insulating layer in this order to produce an electromagnetic wave shielding film.
  • the total thickness of the electromagnetic wave shielding film of Example 5 is 160 ⁇ m, the thickness of the first layer is 30 ⁇ m, the thickness of the third layer is 30 ⁇ m, the thickness of the second layer is 60 ⁇ m, and the thickness of the insulating layer is The thickness of the electromagnetic wave shielding layer was 20 ⁇ m.
  • Example 6 Saturated copolymer polyester resin (manufactured by Toyobo Co., Ltd.) 50 parts by mass, polyaniline (manufactured by Regulus Co., Ltd. PANT) 10 parts by mass, scaly silver powder (manufactured by Fukuda Metal Foil Co., Ltd., Ag-XF average particle size 5 0.5 ⁇ m) Except for preparing 40 parts by mass and preparing the varnish, an electromagnetic wave shielding evaluation film was produced in the same manner as in Example 5, an electromagnetic shielding film was produced, and the electromagnetic shielding property was measured.
  • Example 7 Saturated copolymer polyester resin (manufactured by Toyobo Co., Ltd.) 25 parts by mass, polyaniline (manufactured by Regulus Co., Ltd., PANT) 5 parts by mass, scaly silver powder (manufactured by Fukuda Metal Foil Co., Ltd., Ag-XF average particle size 5) 0.5 ⁇ m) Except for preparing 70 parts by mass and preparing the varnish, an electromagnetic wave shielding evaluation film was produced, an electromagnetic shielding film was produced, and the electromagnetic shielding property was measured in the same manner as in Example 5.
  • Example 8 Saturated copolymer polyester resin (manufactured by Toyobo Co., Ltd.) 40 parts by mass, polyaniline (manufactured by Regulus Co., Ltd., PANT) 10 parts by mass, scaly silver powder (manufactured by Fukuda Metal Foil Co., Ltd., Ag-XF average particle size 5) 0.5 ⁇ m) Except for preparing 50 parts by mass and preparing a varnish, an electromagnetic wave shielding evaluation film was produced in the same manner as in Example 5, an electromagnetic wave shielding film was produced, and the electromagnetic shielding properties were measured.
  • Example 9 Saturated copolymer polyester resin (manufactured by Toyobo Co., Ltd.) 10 parts by mass, polyaniline (manufactured by Regulus Co., Ltd., PANT) 10 parts by mass, scaly silver powder (manufactured by Fukuda Metal Foil Co., Ltd., Ag-XF average particle size 5 0.5 ⁇ m) Except for preparing 80 parts by mass and preparing the varnish, an electromagnetic wave shielding evaluation film was produced in the same manner as in Example 5, an electromagnetic shielding film was produced, and the electromagnetic shielding property was measured.
  • Example 10 Saturated copolymer polyester resin (manufactured by Toyobo Co., Ltd.) 10 parts by mass, polyaniline (manufactured by Regulus Co., Ltd., PANT) 10 parts by mass, scaly silver powder (manufactured by Fukuda Metal Foil Co., Ltd., Ag-XF average particle size 5 0.5 ⁇ m) Except for preparing 80 parts by mass and preparing the varnish, an electromagnetic wave shielding evaluation film was produced in the same manner as in Example 5, an electromagnetic shielding film was produced, and the electromagnetic shielding property was measured.
  • Example 11 Saturated copolymer polyester resin (manufactured by Toyobo Co., Ltd.) 20 parts by mass, polyaniline (manufactured by Regulus Co., Ltd., PANT) 5 parts by mass, PEDOT / PSS (manufactured by Chukyo Yushi Co., Ltd. S-941), 5 parts by mass, scaly silver powder
  • a film for evaluating electromagnetic wave shielding properties was produced in the same manner as in Example 5 except that 70 parts by mass (Ag-XF average particle size 5.5 ⁇ m, manufactured by Fukuda Metal Foil Industry Co., Ltd.) was prepared, and varnish was prepared. A shielding film was produced, and the electromagnetic shielding properties were measured.
  • Example 12 Saturated copolymer polyester resin (manufactured by Toyobo Co., Ltd.) 20 parts by mass, polyaniline (manufactured by Regulus Co., Ltd., PANT) 10 parts by mass, agglomerated silver powder (manufactured by Mitsui Kinzoku Co., Ltd., ST-M average particle size 1.1 ⁇ m) Except for preparing 70 parts by mass and preparing the varnish, a film for evaluating electromagnetic shielding properties was produced in the same manner as in Example 5, an electromagnetic shielding film was produced, and the electromagnetic shielding properties were measured.
  • Example 13 Saturated copolymer polyester resin (manufactured by Toyobo Co., Ltd.) 20 parts by mass, polyaniline (manufactured by Regulus Co., Ltd. PANT) 10 parts by mass, silver-coated copper powder (manufactured by Fukuda Metal Foil Co., Ltd., FCC-2000 10% coat)
  • the film for evaluating electromagnetic wave shielding properties was produced in the same manner as in Example 5 except that the varnish was prepared except that the average particle diameter was 10 ⁇ m and the varnish was prepared, and an electromagnetic wave shielding film was produced, and the electromagnetic wave shielding properties were measured.
  • Examples 14 to 34 and Comparative Examples 10 to 13 below are as follows.
  • NeoFix5S2 Surface acrylic resin PET film made by Niei Kaiko Co., Ltd. 630RF Styrene butadiene rubber resin made by Fuji Chemical T4100 Toyobo Co., Ltd.
  • Example 14 ⁇ Manufacture of electromagnetic shielding film>
  • a styrene elastomer manufactured by Toagosei Co., Ltd., product number PPET1501SG30
  • the varnish prepared above was prepared as a resin constituting the electromagnetic wave shielding layer.
  • the varnish was coated on a polyethylene terephthalate film (manufactured by Teijin DuPont, A-314, thickness 38 ⁇ m) with a comma coater and laminated with the insulating layer.
  • a polyethylene terephthalate film manufactured by Teijin DuPont, A-314, thickness 38 ⁇ m was peeled off to produce an electromagnetic wave shielding film.
  • the total thickness of the electromagnetic wave shielding film of Example 14 was 49 ⁇ m, the thickness of the electromagnetic wave shielding layer was 24 ⁇ m, and the thickness of the insulating layer was 25 ⁇ m.
  • Examples 15 to 19, 24 to 27, 34, Comparative Examples 10, 11, and 13 An electromagnetic wave shielding film was produced in the same manner as in Example 14 using the raw materials shown in Tables 3 to 5.
  • Example 20 ⁇ Manufacture of electromagnetic shielding film>
  • a styrene butadiene rubber resin (630RF manufactured by Fuji Chemical Co., Ltd.) was prepared as a resin constituting the protective layer.
  • a styrene elastomer (manufactured by Toa Chemicals, product number PPET1501SG30) was prepared as a resin constituting the insulating layer.
  • the varnish prepared above was prepared as a resin constituting the electromagnetic wave shielding layer.
  • the varnish was coated on a polyethylene terephthalate film (manufactured by Teijin DuPont, A-314, thickness 38 ⁇ m) with a comma coater and laminated with the insulating layer.
  • a polyethylene terephthalate film manufactured by Teijin DuPont, A-314, thickness 38 ⁇ m was peeled off, and the protective layer was laminated on the peeled surface side to produce an electromagnetic wave shielding film.
  • the total thickness of the electromagnetic wave shielding film of Example 20 was 26 ⁇ m, the protective layer thickness was 15 ⁇ m, the electromagnetic wave shielding layer thickness was 6 ⁇ m, and the insulating layer thickness was 5 ⁇ m.
  • Example 21 to 23, 28 to 33, Comparative Example 12 An electromagnetic wave shielding film was produced in the same manner as in Example 20 using the raw materials shown in Tables 3 to 5.
  • ⁇ Adhesive strength> A sample obtained by bonding an electromagnetic wave shielding film to a polyimide film (manufactured by Kaneka Co., Ltd., product number Apical) for 20 seconds at 25 ° C. and 0.1 MPa is peeled off at a width of 25 mm and a peeling angle of 180 ° in accordance with JIS Z0237. The adhesion with the polyimide film was measured.
  • Electromagnetic wave shielding> Using the microstrip line method, the electromagnetic wave shielding properties for blocking electromagnetic waves at a frequency of 1 GHz were measured for the electromagnetic wave shielding films produced in the examples and comparative examples. Furthermore, the electromagnetic shielding property which interrupts
  • Example 35 ⁇ Preparation of varnish> Saturated copolymer polyester resin (manufactured by Toyobo Co., Ltd.) 20 parts by mass, polyaniline (manufactured by Regulus Co., Ltd., PANT) 10 parts by mass, scaly silver powder (manufactured by Fukuda Metal Foil Co., Ltd., Ag-XF301 average particle size 5) 0.5 ⁇ m) 70 parts by mass was dispersed in 20 parts of toluene, and uniformed by applying ultrasonic waves to prepare a varnish.
  • Saturated copolymer polyester resin manufactured by Toyobo Co., Ltd.
  • polyaniline manufactured by Regulus Co., Ltd., PANT
  • scaly silver powder manufactured by Fukuda Metal Foil Co., Ltd., Ag-XF301 average particle size 5
  • 0.5 ⁇ m 70 parts by mass was dispersed in 20 parts of toluene, and uniformed by applying ultrasonic waves to
  • the varnish was coated on a polyethylene terephthalate film (manufactured by Teijin DuPont, A-314, thickness 38 ⁇ m) with a comma coater and laminated with the insulating layer.
  • a polyethylene terephthalate film manufactured by Teijin DuPont, A-314, thickness 38 ⁇ m was peeled off, and the substrate layer was laminated on the peeled surface side to produce an electromagnetic wave shielding film.
  • the total thickness of the electromagnetic wave shielding film of Example 35 was 49 ⁇ m, the thickness of the base material layer was 9 ⁇ m, the thickness of the electromagnetic wave shielding layer was 20 ⁇ m, and the thickness of the insulating layer was 20 ⁇ m.
  • Example 36 An electromagnetic wave shielding film was produced in the same manner as in Example 35 except that a PET double-sided tape (manufactured by Nichiei Kako Co., Ltd., product number NeoFix 10 surface acrylic resin) was used as the resin constituting the insulating layer.
  • a PET double-sided tape manufactured by Nichiei Kako Co., Ltd., product number NeoFix 10 surface acrylic resin
  • Example 37 An electromagnetic wave shielding film was produced in the same manner as in Example 35 except that a PET double-sided tape (manufactured by Nichiei Kako Co., Ltd., product number NeoFix5S2 surface acrylic resin) was used as the resin constituting the insulating layer.
  • a PET double-sided tape manufactured by Nichiei Kako Co., Ltd., product number NeoFix5S2 surface acrylic resin
  • Example 38 An electromagnetic wave shielding film is produced in the same manner as in Example 35, except that a styrene elastomer (product number PPET-1501SG30 manufactured by Toagosei Co., Ltd.) is applied as a resin constituting the insulating layer with a thickness of 25 ⁇ m. did.
  • a styrene elastomer product number PPET-1501SG30 manufactured by Toagosei Co., Ltd.
  • Example 14 An electromagnetic wave shielding film was produced in the same manner as in Example 35 except that an acrylic resin (manufactured by Nichiei Kako Co., Ltd., product number MHM-GAW) was used as the resin constituting the insulating layer.
  • an acrylic resin manufactured by Nichiei Kako Co., Ltd., product number MHM-GAW
  • Adhesion with polyimide film >> A sample obtained by bonding an electromagnetic wave shielding film to a polyimide film (manufactured by Kaneka Co., Ltd., product number Apical) for 20 seconds at 25 ° C. and 0.1 MPa is peeled off at a width of 25 mm and a peeling angle of 180 ° in accordance with JIS Z0237. The adhesion with the polyimide film was measured.
  • the presence or absence of breakage was determined by checking the presence or absence of current between the metal part of the printed wiring board and the electromagnetic wave shielding layer using a tester. That is, it was determined that the current flowed was broken, and the current flowed was not broken.
  • Puncture strength >> (Preparation of piercing strength measurement film)
  • the resin film constituting the insulating layer was used as it was to obtain a piercing strength measurement film.
  • the film itself used for the insulating layer was pierced with a needle having a tip diameter of 1 mm at a piercing speed of 50 mm / min, and the strength when the needle penetrated the film was measured. The puncture strength was used.
  • the electromagnetic wave shielding film of the present invention is extremely useful industrially because it can cope with the reduction in weight and thickness of electronic components.
  • Electromagnetic wave shielding film 1 Base material layer 11 1st layer 12 3rd layer 13 2nd layer 2 Insulating layer 3 Electromagnetic wave shielding layer 31 Absorbing layer 32 Reflecting layer 4 Electronic component 5 Substrate 6 Concavity and convexity 61 Convex part 62 Concave part 201 Protection Layer 202 Electromagnetic wave shielding layer 203 Insulating layer

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  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

La présente invention porte sur un film de blindage électromagnétique, un substrat imprimé flexible, et analogues, qui sont appropriés pour réduire le poids et l'épaisseur de composants électroniques tels qu'un substrat imprimé flexible, et qui possèdent une excellente tolérance au pliage de jonction ainsi que d'excellentes propriétés d'adhérence et de suivi de forme même lorsqu'ils sont fixés à la surface d'un composant électronique avec une surface irrégulière. La présente invention porte également sur les éléments suivants : un film de blindage électromagnétique qui peut efficacement bloquer des ondes électromagnétiques à bande de fréquences élevée dans une bande de fréquence élevée de l'ordre du GHz ; et un substrat à montage de composant électronique dans lequel un composant électronique monté sur le substrat est recouvert avec une couche de blocage d'ondes électromagnétiques en utilisant un tel film de blindage électromagnétique.
PCT/JP2015/054654 2014-02-25 2015-02-19 Film de blindage électromagnétique, substrat imprimé flexible, substrat pour montage de composant électronique et procédé de recouvrement de composant électronique Ceased WO2015129546A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2014-033732 2014-02-25
JP2014033732A JP2015159214A (ja) 2014-02-25 2014-02-25 電磁波シールドフィルム及びフレキシブルプリント基板
JP2014108082 2014-05-26
JP2014-108082 2014-05-26
JP2014-184019 2014-09-10
JP2014184019A JP2016058565A (ja) 2014-09-10 2014-09-10 電磁波シールド用フィルム
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105398662A (zh) * 2015-11-12 2016-03-16 太仓市其盛化纤厂 防静电屏蔽袋
WO2019152762A1 (fr) 2018-02-01 2019-08-08 Henkel IP & Holding GmbH Procédé de blindage d'ensembles système en boîtier contre les interférences électromagnétiques
CN110769677A (zh) * 2018-07-27 2020-02-07 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN114292601A (zh) * 2021-12-10 2022-04-08 苏州益邦电子材料有限公司 一种吸波绝缘支撑式保护片及保护片卷料
CN116547140A (zh) * 2020-12-09 2023-08-04 Ｊｘ金属株式会社 电磁波屏蔽材料
DE102023111773A1 (de) * 2023-05-05 2024-11-07 Elringklinger Ag Schutzelement, Energieversorgungssystem, Kommunikationssystem und Kraftfahrzeug

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6407395B1 (ja) * 2017-12-01 2018-10-17 タツタ電線株式会社 電磁波シールドフィルム
JP6497477B1 (ja) * 2018-10-03 2019-04-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電子部品搭載基板
TWI832393B (zh) * 2022-08-24 2024-02-11 易鼎股份有限公司 電路板之導電凸塊結構及其製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008108099A1 (fr) * 2007-03-05 2008-09-12 Kyodo Giken Chemical Co., Ltd. Composition élastomère polymère conductrice de l'électricité et élément de protection contre les ondes électromagnétiques comprenant la composition
JP2009543931A (ja) * 2006-07-17 2009-12-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 金属組成物、熱画像形成ドナーおよびそれらから得られたパターン化多層組成物
JP2012186222A (ja) * 2011-03-03 2012-09-27 Nagase Chemtex Corp 成型用電磁波シールドシート及び電磁波シールド成型体
WO2014027672A1 (fr) * 2012-08-16 2014-02-20 住友ベークライト株式会社 Pellicule de blindage em et procédé permettant de couvrir un composant électronique
WO2015052742A1 (fr) * 2013-10-07 2015-04-16 出光興産株式会社 Stratifié absorbant le bruit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009543931A (ja) * 2006-07-17 2009-12-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 金属組成物、熱画像形成ドナーおよびそれらから得られたパターン化多層組成物
WO2008108099A1 (fr) * 2007-03-05 2008-09-12 Kyodo Giken Chemical Co., Ltd. Composition élastomère polymère conductrice de l'électricité et élément de protection contre les ondes électromagnétiques comprenant la composition
JP2012186222A (ja) * 2011-03-03 2012-09-27 Nagase Chemtex Corp 成型用電磁波シールドシート及び電磁波シールド成型体
WO2014027672A1 (fr) * 2012-08-16 2014-02-20 住友ベークライト株式会社 Pellicule de blindage em et procédé permettant de couvrir un composant électronique
WO2015052742A1 (fr) * 2013-10-07 2015-04-16 出光興産株式会社 Stratifié absorbant le bruit

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105398662A (zh) * 2015-11-12 2016-03-16 太仓市其盛化纤厂 防静电屏蔽袋
WO2019152762A1 (fr) 2018-02-01 2019-08-08 Henkel IP & Holding GmbH Procédé de blindage d'ensembles système en boîtier contre les interférences électromagnétiques
EP3747049A4 (fr) * 2018-02-01 2021-10-27 Henkel IP & Holding GmbH Procédé de blindage d'ensembles système en boîtier contre les interférences électromagnétiques
CN110769677A (zh) * 2018-07-27 2020-02-07 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN116547140A (zh) * 2020-12-09 2023-08-04 Ｊｘ金属株式会社 电磁波屏蔽材料
CN116547140B (zh) * 2020-12-09 2025-11-11 Ｊｘ金属株式会社 电磁波屏蔽材料
CN114292601A (zh) * 2021-12-10 2022-04-08 苏州益邦电子材料有限公司 一种吸波绝缘支撑式保护片及保护片卷料
DE102023111773A1 (de) * 2023-05-05 2024-11-07 Elringklinger Ag Schutzelement, Energieversorgungssystem, Kommunikationssystem und Kraftfahrzeug

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