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WO2015119366A1 - Terminal mobile - Google Patents

Terminal mobile Download PDF

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Publication number
WO2015119366A1
WO2015119366A1 PCT/KR2014/011764 KR2014011764W WO2015119366A1 WO 2015119366 A1 WO2015119366 A1 WO 2015119366A1 KR 2014011764 W KR2014011764 W KR 2014011764W WO 2015119366 A1 WO2015119366 A1 WO 2015119366A1
Authority
WO
WIPO (PCT)
Prior art keywords
mobile terminal
upper plate
vapor chamber
absorption layer
vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2014/011764
Other languages
English (en)
Inventor
Yongdae Kim
Youngjoo Yee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
LG Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Priority to EP14881717.4A priority Critical patent/EP3102901A4/fr
Priority to CN201480074641.XA priority patent/CN105940278A/zh
Priority to US15/114,699 priority patent/US20160341486A1/en
Publication of WO2015119366A1 publication Critical patent/WO2015119366A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Definitions

  • the present disclosure relates to a mobile terminal and, more particularly, to a mobile terminal in which an existing magnesium (Mg) frame is substituted with a vapor chamber that outwardly dissipates heat from a heating element within the mobile terminal.
  • Mg magnesium
  • a heat pipe serves to outwardly transmit heat from a heating element, among large components such as a PC server, a combined heat and power generator, and the like, to prevent overheating.
  • FIG. 1 is a view illustrating an operation principle of a general heat pipe 10.
  • the heat pipe 10 includes an exterior 11 formed of a material having excellent heat transmission performance and an absorption layer 12 formed on inner walls of the exterior 11.
  • a fluidic channel through which a working fluid 25 flows is formed within the absorption layer 12.
  • the heat pipe 10 serves to diffuse or transmit heat energy.
  • evaporation 22 occurs by heat 21 transmitted from a heating element 20 having a heat source
  • the evaporated steam 25 flows in a vapor channel 26
  • steam 23 is condensed in the vapor channel 26 and a condenser 40 and subsequently converted into a liquid 24 to flow in the absorption layer 12 (a liquid channel or wick).
  • the liquid 24 undergoes a circulation process in which, the liquid 24 is converted into vapor 22 in the heating element 30, and while passing through the vapor channel 26, the vapor 22 is deprived of heat in a condensing unit 40 so as to be changed to liquid 24, and the liquid 24 is returned to its initial position along the absorption layer 12.
  • the absorption layer 12 in which the condensed liquid flows may be formed of a materialidentical to that of the heat pipe 10. If the heat pipe 10 is formed of a heterogeneous material, a galvanic corrosion phenomenon may occur in an interface between a working fluid and the heat pipe 10 to degrade reliability of the heat pipe 10 as a heat dissipation element, significantly reducing thermal conductivity.
  • heat pipes are extensive in the industry, and in many cases, heat pipes are manufactured such that the absorption layer 12 is present in a cylindrical edge thereof.
  • a graphite sheet In order to dissipate heat from an AP chip used in a mobile terminal, conventionally, a graphite sheet is used. Also, in order to secure strength, a frame is formed of a metal such as magnesium, or the like, and assembled with a heating unit to provide a heat dissipation function. However, the graphite sheet itself has excellent heat dissipation characteristics, but due to the very low heat dissipation characteristics of the frame formed of a metal, the heat characteristics of the graphite and the frame are averaged, resulting in that a reduction in the heating of the AP chip is not greatly improved overall.
  • an existing heat pipe has excellent thermal conductivity, there is a limitation in the strength and thickness, and thus, the use of existing heat pipes is limited.
  • an aspect of the detailed description is to provide a vapor chamber capable of maintaining rigidity, while maintaining excellent thermal conductivity.
  • Another aspect of the detailed description is to provide a mobile terminal in which a heat dissipation module (graphite sheet + frame) is substituted with a single heat dissipation element, thus simplifying the structure.
  • a heat dissipation module graphite sheet + frame
  • Another aspect of the detailed description is to provide a mobile terminal in which a vapor chamber having excellent heat dissipation characteristics is used as a frame.
  • a mobile terminal may include: a front case; a rear case covering the opposite surface of the front case; and a frame supporting an electrical element formed between the front case and the rear case, wherein the frame includes: an upper plate; and a lower plate having a size corresponding to that of the upper plate and having at least a portion spaced apart from the upper plate to form a passage to allow fluid to flow therein, wherein the upper plate and the lower plate form a vapor chamber, at least one of the upper plate and the lower plate is formed by bonding dissimilar metals, and the passage includes an absorption layer in which a working fluid moves and a vapor channel formed on the absorption layer and allowing vapor evaporated from the absorption layer to move therein, and a fluidic channel in which the working fluid moves is formed within the absorption layer.
  • the absorption layer may be formed of a porous material, and a first metal among the dissimilar metals may be one or more selected from the group consisting of copper, aluminum, an aluminum alloy, nickel, a nickel alloy, titanium, and magnesium.
  • a second metal among the dissimilar metals may be stainless steel.
  • the first metal may form an appearance of the vapor chamber, and the second metal may be formed within thevapor chamber.
  • the first metal may have two or more layers formed by combining two or more selected from the group consisting of copper, aluminum, an aluminum alloy, nickel, a nickel alloy, titanium, and magnesium.
  • the upper plate may have a convex portion and a concave portion to form the passage, and the upper plate and the lower plate may be bonded by welding or diffusion bonding.
  • a heat dissipation element may be coupled to the concave portion, and the lower plate may have a flat plate shape.
  • the absorptionlayer may include a first layer formed by growing grains and a second layer formed on the first layer and including a plurality of acicular particles.
  • the vapor chamber may be coupled to the rear case or the front case.
  • the vapor chamber is advantageous in the aspect of thickness and rigidity, while maintaining excellent thermal conductivity, it can replace a heat dissipation sheet and a corresponding frame of a mobile terminal, simplifying the structure.
  • the vapor chamber can lower a heating temperature of a product according to high density integration and implement highly efficient product.
  • the structure of the ultra-slim vapor chamber serves as a heat pipe lowering a temperature of a heating portion by transmitting heat from the heating portion to a low-temperature region, and also serves as a frame for strengthening rigidity of a heat dissipation element by applying a clad metal formed by bonding dissimilar metals and fixing other components of the mobile terminal.
  • FIG. 1 is a view illustrating an operation principle of a related art heat pipe.
  • FIG. 2 is a plan view of a vapor chamber according to an exemplary embodiment of the present disclosure.
  • FIG. 3 is a cross-sectional view of the vapor chamber according to an exemplary embodiment of the present disclosure.
  • FIG. 4 is a view illustrating a process of manufacturing a vapor chamber according to an exemplary embodiment of the present disclosure.
  • FIG. 5 is an exploded perspective view of a mobile terminal using a vapor chamber according to an exemplary embodiment of the present disclosure.
  • FIG. 6 is a cross-sectional view of a mobile terminal using a vapor chamber according to an exemplary embodiment of the present disclosure.
  • FIG. 7 is a cross-sectional view taken along line B-B' of FIG. 3.
  • the present disclosure relates to a heat dissipation element, which also referred to as a chamber, as a type of heat pipe.
  • the present disclosure relates to an ultra-slim vapor chamber that can be applied to various products in the form of a heat pipe.
  • a material and a structure for complementing a degradation of rigidity according to the ultra-slim structure are provided.
  • the present disclosure relates to an ultra-slim vapor chamber 100 which solves a heating problem of a mobile terminal based on the excellent heat conductivity and an operational principle of an existing heat pipe and plays a role of a frame of an electronic component.
  • the mobile terminal described in the present disclosure may include a cellular phone, a smartphone, a notebook computer (or a laptop computer), a digital broadcasting terminal, a personal digital assistant (PDA), a portable multimedia player (PMP), a navigation device, a slate PC, a tablet PC, an ultrabook, a wearable device (e.g., a watch-type terminal such as smartwatch, a glass-type terminal such as smart glass, a head mounted display(HMD), and the like.
  • PDA personal digital assistant
  • PMP portable multimedia player
  • a navigation device e.g., a watch-type terminal such as smartwatch, a glass-type terminal such as smart glass, a head mounted display(HMD), and the like.
  • HMD head mounted display
  • copper (Cu) which has excellent thermal conductivity, relative to other metals, and is not chemically reacted with a working fluid (water) within the heat pipe, is used as a material to form an appearance of the vapor chamber 100.
  • copper (Cu) has high ductility as inherent properties, and thus, its application to mobile terminal fields that require rigidity and heat dissipation performance is very limited in spite of the excellent heat dissipation characteristics thereof.
  • the shortcomings are complemented, excellent heat dissipation characteristics and rigidity are secured, and the entire area of a mobile terminal is covered by a ultra-slim vapor chamber 100, thus obtaining aheat dissipation effect.
  • the ultra-slim vapor chamber 100 may be customized to be applied to mobile terminals having various structures.
  • FIG. 2 is a view illustrating a structure of the ultra-slim vapor chamber 100according to an exemplary embodiment of the present disclosure
  • FIG. 3 includes a partial plan view of the vapor chamber 100 of FIG. 2, a cross-sectional view taken along line A-A', and a partially enlarged view of a portion.
  • FIG. 7 is a cross-sectional view taken along line B-B' of FIG. 3.
  • the vapor chamber 100 includes an upper plate 111 and a lower plate 112 spaced apart from the upper plate 111 in at least a portion thereof, to form a passage 113 in which a fluid such as a liquid or vapor moves.
  • a fluid such as a liquid or vapor moves.
  • at least one of the upper plate 111 and the lower plate 112 is formed of a clad metal formed by bonding dissimilar metals.
  • the upper plate111 includes a convex portion 111c and concave portions 130 and 140 formed through pressing, or the like.
  • the passage 113 is formed by the convex portion 111c and the concave portions 130 and 140.
  • the passage 113 includes an absorption layer 113a in which a liquid is fixedly stored by capillary force, a fluidic channel in which a working fluid moves is formed within the absorption layer 113a, and a vapor-condensed fluid moves through the fluidic channel 113c.
  • the working fluid largely refers to a liquid.
  • a vapor channel 113b in which vapor evaporated from the absorption layer 113a moves is formed on the absorption layer 113a.
  • the absorption layer 113a and the vapor channel 113b are formed in the same space, and the vapor channel 113b is a channel in which a liquid (e.g., water) heated by a heating element is evaporated to become vapor and subsequently move to a condensing portion (e.g., one end portion of the vapor chamber).
  • a liquid e.g., water
  • the absorption layer 113a is formed of a porous material, preventing a fluid such as water from being leaked out. Namely, water is stored in the absorption layer 113a due to a capillary force phenomenon.
  • the absorption layer 113a includes a plurality of acicular particles and a working fluid moves between the plurality of acicular particles, namely, to pores.
  • the absorption layer 113a includes a first layer formed by grain growth and a second layer 1132 formed on the first layer 1131 and including a plurality of acicular particles.
  • the fluidic channel 113c in which a fluid is movable is formed betweenthe acicular particles.
  • the second layer 1132 is thicker than the first layer 1131, and preferably, the thickness of the second layer 1132 is ten times to 30 times that of the first layer 1131.
  • the first layer 1131 is an underlayer forming conditions facilitating formation of the second layer 1132 having a plurality of acicular particles.
  • the first layer 1131 is formed through an electroplating method in which a current having a DC waveform supplying a DC current in a reverse (-) direction.
  • the second layer 1132 has a plurality of acicular particles.
  • the second layer 1132 is also formed through the electroplating method, specifically, through a periodic reverse current plating performed by periodically changing a direction of an electriccurrent or by using a bipolar pulse current.
  • a length of the plurality of acicular particles forming the second layer 1132 in a longer direction ranges from 10 m to 50 m.
  • the second layer 1132 includes the acicular particles, specifically, acicular copper particles, and thus, the second layer 1132 has high porosity, compared with the related art absorption layer in the form of a groove or a mesh, or a sintered absorption layer.
  • a working fluid may smoothly move within the absorption layer 113a, relative to the related art, enhancing a heat-exchange rate or heat-exchange performance.
  • the vapor chamber 100 includes a path formation region 110 in which vapor or a liquid may flow and an edge 120 formed outside of the path formation region 110. Since the lower plate 112 has a flat plate shape, the vapor chamber 100 has a flat plate shape overall.
  • any one of the upper plate 111 and the lower plate 112 may be a clad metal, and in an exemplary embodiment of the present disclosure, both the upper plate 111 and the lower plate 112 are formed of a clad metal formed by bonding dissimilar metals.
  • the ultra-slim vapor chamber 100 is formed of a metal, and here, a clad metal formed by bonding dissimilar metals is used.
  • a structure of the clad metal may include copper (Cu) and stainless steel (SUS).
  • Cu copper
  • SUS stainless steel
  • various metals having high rigidity may also be used. Namely, composition of the clad metal may be altered according to requirements of specific application purposes to form the vapor chamber 100.
  • metals 111b and 112a exposed inwardly may be formed of oxygen-free copper (Cu) having high ductility and externalmetals 111a and 112b may be formed of materials having high rigidity such as stainless steels.
  • Cu oxygen-free copper
  • the metals 111a and 112b exposed to outside may be one or more selected from the group consisting of copper, aluminum, an aluminum alloy, nickel, a nickel alloy, titanium, and magnesium, or may be formed of two or more layers by combining these elements.
  • the metal 111a may be formed of only stainless steel or may have an aluminum alloy in the outermost portion. This may be the same for the metals 111b and 112a formed internally.
  • the metals 111a and 112b are described as stainless steel, but the present disclosure is not limited thereto and any metal may be used as long as it has rigidity equivalent to that of stainless steel.
  • the second metal may be formed of copper, aluminum, an aluminum alloy, nickel, a nickel alloy, titanium, magnesium, and the like, and the first metal may be formed of stainless steel.
  • the first metal may be formed of copper, aluminum, an aluminum alloy, nickel, a nickel alloy, titanium, magnesium, and thelike, and the second metal may be formed of stainless steel.
  • the lower plate 112 may simply be a flat clad metal, and the overall thickness of the vapor chamber 100 may be 0.5 mm.
  • a vapor inlet 150 may be provided in a portion of the edge 120 to allow a liquid (water) to be injected to the interior of the chamber 100 therethrough.
  • portions of the upper plate 111 and the lower plate 112 are in contact to form concave portions 130 and 140.
  • the concave portions 130 and 140 support the fluidic channel 113 and serve as a post maintaining rigidity of the structure to prevent bending due to external impact.
  • the concave portions 130 and 140 may be patterned through metal forming. As illustrated in FIGS. 2 and 3, thepath formation region 110 part protrudes to form a space, and the upper plate 111 and the lower plate 112 are formed of clad metal.
  • the concave portion 130 may be a rib, and the concave portion 140 may be a portion in which a heating element such as a CPU is fixed.
  • a path 113 having a corrugation shape may be formed.
  • the upper plate 111 and the lower plate 112 may be bonded through welding or diffusion bonding.
  • the fluid movement passage 113 is etched or a flow path pattern having a corrugation shape is formed by sheet metal working, or the like, to allow vapor to circulate between the upper plate 111 and the lower plate 112 after the evaporation in the heating unit.
  • a channel wall of the passage 113 serves as a support with respect to external force and rigiditycan be strengthened.
  • the upper plate 111 and the lower plate 112 including the vapor channel corrugation are bonded in a surface-to-surface manner without using a heterogeneous adhesive material.
  • the upper plate 111 and the lower plate 112 can be assembled through a bonding technique such as diffusion bonding, local welding, or the like, which fundamentally preventing a chemical reaction and corrosion between the fluid and the material.
  • a process of bonding the upper plate111 and the lower plate 112 by utilizing a laser welding technique, as well as the diffusion bonding may also be additionally performed.
  • FIG. 4 is a view illustrating a process of manufacturing the vapor chamber 100 according to an exemplary embodiment of the present disclosure.
  • the upper plate 111 formed as a clad metal please refer to FIG. 4A
  • a press tool 160 at high pressure so as to be processed to have an embossed structure (please refer to FIG. 4B) to have a shape corresponding to a curved surface160a of thepress tool 160.
  • an inner surface of the upper plate 111 has a shape corresponding to the curved surface 160a, and the convex portion111c protruding upwardly is formed.
  • FIG. 4C illustrates the ultra-slim vapor chamber 100 having high rigidity characteristics completed by bonding the upper plate 111 having the embossed structure with the concave portions 130 and 140 and the convex portion111c and the lower plate 112 having a flat structure through welding.
  • the lower plate 112 is also formed by bonding dissimilar metals 112a and 112b.
  • the metal 112a positioned within the vapor chamber 100 may be formed of the same material as that of the metal 111b positioned within the upper plate 111, and the metal 112b positioned outside of the vapor chamber 110 may be formed of the same material as that of the metal 111a positioned outside of the upper plate 111.
  • a hollow portion 117 (please refer to FIG. 4D) is formed by bonding the upper plate 111 and the lower plate 112, and the passage 113 may be provided in the hollow portion 117 (please refer to FIG. 4E).
  • the structureand manufacturing method capable of enhancing the rigidity characteristicsof the ultra-slim vapor chamber 100 are provided, a heating problem is solved, and a frame structure providing a function of protecting an electronic component of the mobile terminal from external force, and the like, is provided.
  • the structure of the vapor channel 110 of the ultra-slim vapor chamber 100 can be configured to have various shapes to provide an electrical ground plane as well as being a heat dissipation element.
  • FIG. 5 is an exploded perspective view of a mobile terminal using a vapor chamber according to an exemplary embodiment of the present disclosureas a frame of the mobile terminal
  • FIG. 6 is a cross-sectional view of a mobile terminal using a vapor chamber according to an exemplary embodiment of the present disclosure as a frame.
  • FIG. 6 may be a cross-sectional view of FIG. 5.
  • a mobile terminal 200 has a bar-type terminal body.
  • the present disclosure is not limited thereto and may be applied to a slide type mobile terminal, a folder type mobile terminal, or a swing type mobile terminal, and the like, in which two or more bodies are coupled to each other so as to perform a relative motion.
  • the mobile terminal described in the present disclosure may be applied to any portable electronic device having a camera and a flash, for instance, a portable phone, a smart phone, a notebook computer, a digital broadcasting terminal, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMO), etc.
  • PDAs Personal Digital Assistants
  • PMO Portable Multimedia Players
  • the terminal body may include a case (which may also be referred to as a casing, a housing, a cover, etc.) which forms the appearance of the mobile terminal.
  • the case may include a front case 201, a rear case 202 covering the opposite side of the front case 201, and a battery cover 203 for coupled to the rear case 202 to form a rear surface of the mobile terminal 200.
  • a space formed by the front case 201 and the rear case 202 may accommodate various electrical elements 260 such as an application processor (AP), or the like.
  • Such cases may be formed by injection-molding a synthetic resin, or may be formed using a metallic material such as stainless steel (STS) or titanium (Ti).
  • the electronic components such as the AP, or the like, generates a great amount of heat, and thus, heat of the electronic components need to be promptly dissipated to ensure a reliable operation without malfunction.
  • the mobile terminal200 includes a window 210 and a displaymodule 220 coupled to one surface of the front case 201.
  • the front case 201 and the rear case 202 form an appearance of the mobile terminal200, and a frame is formed to support electrical elements 260 between the front case 201 and the rear case 202.
  • the frame is an internal support structure of the mobile terminal 200.
  • the frame may be formed to support at least any one among the displaymodule 220, a camera module, an antenna device 242, or a printed circuit board (PCB) 250.
  • PCB printed circuit board
  • the frame is the foregoing vapor chamber 100, and a portion of the vapor chamber 100 may be exposed to outside of the terminal. Also, the vapor chamber 100 may form a portion of a sliding module connecting a terminal body and a display unit in a slide-type mobile terminal, rather than a bar-type terminal.
  • the PCB 250 is disposed between the vapor chamber 100 and the rear case 202 and the display module 220 is coupled to one surface of the vapor chamber 100.
  • the PCB 250 and the battery 250 may be disposed on the other surface of the vapor chamber 100, and the battery cover 203 may be coupled to the rear case 202 to cover the battery 230.
  • the window 210 is coupled to one surface of the front case 201.
  • a touch sensor (not shown) may be installed in the window 210.
  • the display module 220 is installed on a rear surface of the window 210.
  • a thin film transistor-liquid crystal display TFT-LCD is provided as an example of the display module 220, but the present disclosure is not limited thereto.
  • the display module 220 may be a liquid crystal display (LCD), an organic light emitting diode (OLED) display, a flexible display, a three-dimensional (3D) display, or the like.
  • LCD liquid crystal display
  • OLED organic light emitting diode
  • flexible display a three-dimensional (3D) display, or the like.
  • 3D three-dimensional
  • the PCB 250 may be formed on one surface of the vapor chamber 100, or it may also be installed below the display module 220. At least one electrical element 260 is installed on a lower surface of the PCB 250.
  • the rear case 202 may have a battery accommodation portion recessed to accommodate the battery 230.
  • a contact terminal may be formed on one surface of the battery accommodation portion and connected to the PCB 250 to allow the battery 230 to supply power to the terminal body.
  • the antenna device 242 may be formed on upper end or a lower end of the mobile terminal 200. Also, a plurality of terminal devices 242 may be formed and disposed at each end portion of the mobile terminal 200, and here, the antenna devices 242 may be formed to transmit and receive wireless signals having different frequency bands.
  • the vapor chamber 100 may be formed of a clad metal as described above in order to maintain sufficient rigidity even though it is formed to have a small thickness.
  • the vapor chamber 100 may operate as a ground.
  • the PCB 250 or the antenna device 242 may be ground-connected to the vapor chamber 100, and the vapor chamber 100 may operate as a ground of the PCB 250 or the antenna device 242.
  • the vapor chamber 100 may extend a ground of the mobile terminal 200.
  • the vapor chamber 100 and the rear case 202 may be coupled by a screw 270.
  • the PCB 250 may be disposed between the vapor chamber 100 and the screw 270.
  • the screw 270 may be exposed outwardly from the terminal body, such that static electricity within the terminal may be released outwardly.
  • the vapor chamber 100 operates as a ground
  • the ground of the terminal may extend by coupling the vapor chamber 100 and the screw 270.
  • the screw 270 may also be coupled to any other conductive member.
  • the rear case 202, the PCB 250, and the vapor chamber 100 may respectively have through holes 271, 272, and 273 in portions coupled to the screw 270.
  • the through holes 271, 272, and 273 may be formed on the edges of the terminal body or may be formed in a central region thereof.
  • the vapor chamber 100 is coupled to the rear case 202, but the present disclosure is not limited thereto and the vapor chamber 100 may also be coupled to the front case 201.
  • the vapor chamber 100, the PCB 250, and the rear case 202 are coupled by the screw 270, but the present disclosure is not limited thereto and the vapor chamber 100, the PCB 250, and the rear case 202 may also be coupled by a hook, an adhesive, or the like.
  • FIG. 6 is a cross-sectional view of the mobile terminal 200 having the vapor chamber 100.
  • the electrical element 260 a heating element, formed on the PCB 250 generates heat
  • heat 2252 may flow to the PCB 250 in contact with the electrical element 260, and the heat 2253 flowing along the PCB 250 may move toward the vapor chamber 100 and move along the vapor chamber so as to be dissipated outwardly.
  • a partial amount 2251 of the heat generated by the electrical element 260 may also be discharged outwardly through the PCB 250, the rear case 202, and the battery cover 203.
  • a movement path of the heat 225 within the vapor chamber 100 is similar to that described above. Namely, evaporation occurs due to the heat 225 transmitted from the electrical element 260, evaporated vapor flows in the vapor channel 113b, steam is condensed in the condensing unit so as to be converted into a liquid form, and the liquid may flow to the absorption layer 113a (liquid channel or wick).
  • the exemplary embodiment of the present disclosure may be utilized in a vapor chamber that transmits heat from a heat dissipation element to outside.
  • the embodiment of the invention may be applied to a mobile terminal using a vapor chamber that outwardly dissipates heat from a heating element within the mobile terminal.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un terminal mobile, qui comprend : une plaque supérieure ; et une plaque inférieure ayant une dimension correspondant à celle de la plaque supérieure et ayant au moins une partie espacée de la plaque supérieure pour former un passage pour permettre à un fluide de s'écouler en son sein, la plaque supérieure et la plaque inférieure formant une chambre à vapeur, au moins l'une de la plaque supérieure et la plaque inférieure est formée par liaison de différents matériaux, et le passage comprend une couche d'absorption dans laquelle se déplace un fluide de travail, et un canal de vapeur formé sur la couche d'absorption et permettant à la vapeur évaporée de la couche d'absorption de se déplacer en son sein, et un canal fluidique dans lequel se déplace le fluide de travail est formé à l'intérieur de la couche d'absorption.
PCT/KR2014/011764 2014-02-04 2014-12-03 Terminal mobile Ceased WO2015119366A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP14881717.4A EP3102901A4 (fr) 2014-02-04 2014-12-03 Terminal mobile
CN201480074641.XA CN105940278A (zh) 2014-02-04 2014-12-03 移动终端
US15/114,699 US20160341486A1 (en) 2014-02-04 2014-12-03 Mobile terminal

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0012712 2014-02-04
KR1020140012712A KR20150091905A (ko) 2014-02-04 2014-02-04 증기 챔버

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US20160341486A1 (en) 2016-11-24
CN105940278A (zh) 2016-09-14
EP3102901A4 (fr) 2017-10-18
KR20150091905A (ko) 2015-08-12

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