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WO2015199726A1 - Distribution de la chaleur de dispositifs informatiques - Google Patents

Distribution de la chaleur de dispositifs informatiques Download PDF

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Publication number
WO2015199726A1
WO2015199726A1 PCT/US2014/044615 US2014044615W WO2015199726A1 WO 2015199726 A1 WO2015199726 A1 WO 2015199726A1 US 2014044615 W US2014044615 W US 2014044615W WO 2015199726 A1 WO2015199726 A1 WO 2015199726A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
manifold
computing device
outer housing
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2014/044615
Other languages
English (en)
Inventor
David A. Moore
Robert Lee Crane
Richard Hunt HODGE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Priority to PCT/US2014/044615 priority Critical patent/WO2015199726A1/fr
Publication of WO2015199726A1 publication Critical patent/WO2015199726A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]

Definitions

  • Computing devices such as tablets, laptop computers, notebook computers, and the like, may allow users to perform computing functions, social media functions, gaming functions, and communicate via email, and the like, in a mobile environment
  • the users may hold or contact the computing devices, in operation, the computing devices may generate heat,
  • FIG. 1 is a block diagram illustrating a computing device according to an example.
  • FIG, 2 is a schematic view illustrating a computing device according to an example.
  • FIG. 3 is a cross-sectional view along line 3-3 illustrating the computing device of FIG. 2 according to an example.
  • FIG. 4 is a schematic view illustrating a fin layer in
  • FIG, 5 is a schematic view illustrating respective channels of the computing device of FIG. 2 according to an example.
  • FiG. 8 is a schematic view illustrating several fin channels of the computing device of FIG. 2 according to an example
  • FIG. 7 is a schematic view illustrating fluid flow paths through respective channels of the computing device of FiG. 2 according to an example.
  • FIG. 8 is a block diagram illustrating a tablet computing system according to an example.
  • F!G. 9 is a flowchart illustrating a method to redistribute heat of a computing; device according to an example.
  • Computing devices such as tablets, laptop computers, notebook computers, and the like, may allow users to perform computing functions, social media functions, gaming functions, and communicate via email, and the like, in a mobile environment.
  • the users may hold or contact the computing devices during its operation.
  • the computing devices may generate heat. That is, electronic components of the computing devices such as processors, and the like, may generate heat in processing information.
  • an increase in functionality, processing tasks, and processing speeds may increase an amount of heat generated by the electronic components and/or the amount and/or severity of hot spots on the product enclosure.
  • an increase in processing speed of the computing device may correlate to an increase in generated heat which results in an increase in a computing device surface temperature.
  • Increasing a surface temperature may reduce user comfort. Continued increases in surface temperatures may result in product safety concerns and a potential failure to meet government regulatory requirements. Designers often compromise to limit heat generation by limiting computing performance. One such approach is to use lower performance processors iimiting the capability of the device. Heat generation may reduce user comfort and/or limit computing performance. Thus, user comfort and user experience may be reduced due to the increased temperature and/or the amount and/or severity of hot spots on the respective product enclosures,
  • the performance of the computing device may be dynamically limited (e.g., throttling) in order to increase user comfort.
  • Throttling may also be applied to ensure chip temperature limits are not exceeded, or to reduce operating power when computing tasks do not require such operating power. Throttling may be accomplished dynamically by the systems BIOS firmware or other mechanism. That is, throttling reduces performance and, thus, may be undesirable. For example, if throttling is necessitated to control surface temperature and reduce user discomfort, it may negatively impact performance. Although, mechanical solutions may be used to reduc surface temperatures such as a remote heat exchange approach used in traditional notebooks, !n some designs, such a remote heat exchanger approach is unpractical due to the thickness of the design.
  • a computing device includes an input/output member, electronic components, a housing enclosure, and a pump.
  • the electronic components provide functionality of the computing device.
  • the housing enclosure includes at least one manifold layer, at least one fin layer, and at least one outer housing layer.
  • the plurality of layers may be laminated as thin sheets into a product enclosure such as a computing device shell to function as a radiator, in some examples, the laminated, product enclosure may provide cooling of the computing device without requiring fans and/or heat pipes.
  • At ieast one manifold layer includes a manifold output channel and a manifold input channel. At least one fin layer includes a plurality of fin channels in fluid communication with the manifold output channel and the manifold input channel.
  • the outer housing layer for example, in a form of a product enclosure, provides support for a user to hold and/or contact the computing device. That is, a user of the computing device may hold the exterior surface of the outer housing layer in order to interact and/or transport the computing device,
  • the pump is in fluid communication with the manifold output channel and the manifold input channel.
  • the pump provides fluid through the manifold output channel, the plurality of fin channels, and the manifold input channel to redistribute heat from the electronic components to the outer housing layer. For example, heat passes from the electronic components into the circulating fluid following the fluid flow passages and, is thus, distributed across the surface of the computing device. Consequently, the heat may leave the computing device evenly, and across a large surface area, resulting in reducing surface temperatures of the computing device.
  • the amount of hot spots on the product enclosures may be decreased and/or eliminated. Additionally, the temperature on the product enclosures may be reduced and/or maintained to provide comfort and a pleasant user experience to users holding and operating the computing devices, Aiso, the computing devices may have increased functionalit and speed while not reducing the comfort and pleasant user experience of the users. That is, the removal of even more heat from the computing device resulting in reducing and/or eliminating hot spots may allow for an increase in processing speed.
  • FIG. 1 is a block diagram illustrating a computing device according to an example.
  • a computing device 100 includes an input output member 10, electronic components 1 1 , a housing enclosure 12, and a pump 16.
  • the input/output member 10 may convey information.
  • the input output member 10 may include a display to output information processed by the electronic components 1 , for example, in a form of images such as text, graphics, and the like.
  • the display such as a touch screen may also input information to be processed by the electronic components 1 1.
  • the electronic components 1 1 provide functionality of the computing device 100.
  • the electronic components 1 1 may process and provide information to the display 10, and/or other components of the computing device 100.
  • the electronic components 1 may include processors, and the like,
  • the housing enclosure 12 includes at least one manifoid layer 13, at least one fin layer 14, and at least one outer housing layer 15.
  • the at least one manifold layer 13 includes a manifold output channel 13a and a manifold input channel 13b
  • the at least one fin layer 14 includes a plurality of fin channels 14a in fluid communication with the manifold output channel 13a and the manifold input channel 13b.
  • the at least one outer housing layer 15 provides support for a user to hold the computing device 100,
  • the outer housing layer 15 may be in the form of a product enclosure.
  • the pump 18 is in fluid communication: with the manifold output channel 3a and the manifold input channel 13b,
  • heat sinks may also communicate, for example, with the manifold output channel 13a to dissipate heat from the fluid.
  • the pump 16 may transport the fluid therein to the manifoid output channel 13a, and receive the fluid from the manifoid input channel 13b. That is, the pump 16 provides fluid through the manifold output channel 13a, the plurality of fin channels 14a, and the manifoid input channel 13b to redistribute heat from the electronic components 11 to the outer housing layer 15.
  • the outer housing layer 15 may transfer the heat from the fluid in the fin channels 14a to air or surfaces proximate to an external surface of the outer housing layer 15.
  • the outer housing layer 15 may provide support for a user to hold the computing system 100.
  • the outer housing iayer 15 may be in the form of a product enclosure, in some examples, the computing device 100 may include a tablet, mobile workstation such as a laptop computer, a notebook computer, and the tike.
  • FIG. 2 is a schematic view illustrating a computing device according to an example.
  • FIG. 3 is a cross-sectionai view along line 3-3 illustrating the computing device of FSG. 2 according to an example.
  • FSG, 4 is a schematic view illustrating a fin layer in communication with a manifoid layer of the computing device of FIG, 2 according to an example.
  • the computing device 200 may include the input/output member 10, the electronic
  • the housing enclosure 12 may include an outer housing iayer 15, a manifold layer 13, a fin Iayer 14, and an inner housing layer 35.
  • space 38 may existed between the input/output member 10 such as a display and an inner housing layer 35, for exampie, to enabie electrical components, batteries, and the like to be disposed therein.
  • each one of the outer housing iayer 15, the manifold layer 13, the fin layer 14, and the inner housing layer 35 may be formed of rigid sheets. Additionally, the outer housing Iayer 15, the manifoid Iayer 13, the fin layer 14, and the inner housing layer 35 may be laminated to each other. In some examples, the outer housing layer 15 may be formed of metal such as aluminum, and the like. In some examples, the respective layers 35, 13, 14, and 15 may adhere to each other through adhesive. For example, adhesive may be inserted between each one of the respective adjacent layers to form a laminated, housing enclosure. Thus, the laminated, housing enciosure may be in a form of a laminated, product enclosure such as a laminated, computing device shell.
  • the at least one manifoid iayer 13 includes a manifold output channel 13a and a manifoid input channel 13b
  • the at least one fin layer 14 includes a plurality of fin channels 14a in fluid communication with the manifoid input channel 13b and the manifold output channel 13a.
  • the respective channels 13a, 3b, and 14a may be formed by etching, molding, drilling, and the like.
  • the respective channels 13a, 13b, and 14a may communicate with each other, for example, by openings such as though-holes 39.
  • the outer housing !ayer 15 provides support for a user to hold the computing device 200.
  • the computing device 200 may include a tablet computing device in which a user can hoid an external surface of the outer housing iayer 15. in some examples, the user may grab the ends and/or edges of the outer housing iayer 15.
  • the fin channels 14a are arranged in a zigzag pattern proximate to an interna! surface of the outer housing layer 15 to redistribute heat from the electronic components 1 1 thereto.
  • the fin channels 14a may be adjacent to an internal surface of the outer housing iayer 15.
  • the zigzag pattern may correspond to fin channels 14a having sharp turns in alternating directions.
  • the flow of the fluid through various portions and/or segments of the respective fin channels 14a in a zigzag pattern may change its direction of travel from left to right, for example, to right to left, and the iike.
  • a fluid flow rate may be varied to maintain a temperature of an external surface of the outer housing layer 15 within a predetermined range, in some examples, the turns may be rounded and/or curved to promote efficient fluid flow.
  • the zigzag pattern of the fin channels 14a may be disposed in a broad area proximate to and expand across the inner surface of the outer housing Iayer 15.
  • FIG. 5 is a schematic view illustrating respective channels of the computing device of FIG. 2 according to an example.
  • FfG. 8 is a schematic view iilustrating several fin channels of the computing device of FIG. 2 according to an exampie.
  • FIG. 7 is a schematic view iilustrating fluid flow paths through respective channels of the computing device of FIG. 2 according to an example.
  • each one of the fin channels 14a include channel segments 14b such that the fluid flows through adjacent channel segments of a respective fin channel 14a in opposite directions dj and d a to each other.
  • the fluid may flow in a first direction 3 ⁇ 4 from a first side of the area of the zigzag pattern towards a second side of the area of the zigzag pattern in one of the adjacent channel segments of the respective fin channels 14a as illustrated in FIG, 5. Additionally, the fluid may flow in a second direction d 2 from the second side of the area of the zigzag pattern towards the first side of the area of the zigzag pattern in another one of the adjacent channel segments of the respective fin channels 14a as illustrated in FIG. 5.
  • each one of the respective fin channels 14a may include an initial channel segment 14 bif an intermediate channel segment 14 ⁇ ⁇ and a final channel segment 14 bf ,
  • a respective initial channel segment 14 bi of one fin channel 14 a 3 is positioned adjacent to a respective final channel segment 14 3 ⁇ 4f of another fin channel 14 a 2.
  • the initial channel segment 14 3 ⁇ 4 may receive the fluid from the manifold output channel 13a.
  • the intermediate channel segment 14 8f ⁇ may receive the fluid from the initial channel segment 143 ⁇ 4 and provide it to the final channel segment 14 3 ⁇ 4 .
  • the final channel segment 14 f may receive the fluid from the Intermediate channel segment 14 bm and provide it to the manifold input channel 13b.
  • the fluid in the initial channel segment 14 bi of a respective fin channel has a higher temperature than the fluid leaving the final channel segment 14 w of the respective fin channel. That is, the temperature of the fluid is lowered as the fluid proceeds and the heat dissipates along the respective fin channel.
  • the outer housing layer 15 is configured to transfer the heat from the fluid in the fin channels 14a to air or surfaces proximate to an external surface of the outer housing layer 15. in some examples, the temperature across the external surface of the outer housing layer 15 is uniform. Alternatively, in som examples, a temperature of the external surface of the outer housing layer 15 is maintained within a predetermined range during operation thereof.
  • the computing device 200 may also include a plurality of through-holes 39, a first flow path 78a, and a second flow path 78b.
  • the pump 16 is in fluid communication with the manifoid output channel 13a and the manifold input channel 13b.
  • the pum 18 provides fluid through the manifold output channel 13a, the plurality of fin channels 14a, and the manifoid input channei 13b to redistribute heat from the electronic components 11 to the outer housing layer 15.
  • heat sinks may also be used to efficiently convey heat from the electronic components 11 to the circulating fluid .
  • the pump 16 inciudes a piezoelectric pump disposed on the outer housing layer 15,
  • the plurality of through-holes 39 may provide fluid communication between the respective fin channels 14a, and each one of the manifold output channel 13a and the manifold input channel 13b.
  • the first flow path 78a of fluid extends from the pump 16, through the manifold output channei 13a, through one of the fin channels, and through the manifoid input channel 13b to the pump 16 corresponding to a first length.
  • the second flow path 78b of fluid extends from the pump 16, through the manifold output channel 13a, through another one of the fin channels, and through the manifold input channei 13b to the pump 16 corresponding to a second length which is about equal to the first length.
  • equal length flow paths 78a and 78b may assist in providing equally balanced flow rates, in some examples, the fluid is water and/o a water-based coolant.
  • FIG. 8 is a block diagram illustrating a tablet computing system according to an example.
  • a tablet computing system 800 includes a display 80, electronic components 11 , a housing enclosure 12, and a pump 16.
  • the display 80 may output information from the electronic components 11 , for example, in a form of images such as text, graphics, and the like.
  • the display 80 may also input information to be processed by the electronic components 1 1.
  • the display 80 may include a touch screen.
  • the electronic components 11 provide functionality of the tablet computing system 800,
  • the electronic components 11 may process and provide information to the display 80, and/or other components of the tablet computing system 800.
  • the housing enclosure 12 includes an inner housing layer 35, a manifold layer 13, a fin layer
  • the fin iayer 14 and the manifold layer 13 are disposed between the inner housing iayer 35 and the outer housing Iayer
  • the inner housing iayer 35, the manifold Iayer 13, the fin Iayer 14, and the outer housing layer 15 are laminated to each other to form a laminated, housing enclosure.
  • the housing enclosure 12 may include additional layers.
  • the laminated, housing enclosure may be in a form of a product enclosure such as an integrated, tablet shell.
  • the manifoid layer 13 includes a manifold output channel 13a and a manifoid input channel 13b.
  • the fin layer 14 includes a plurality of fin channels 14a in fluid communication with the manifold output channel 13a and the manifold input channel 13b.
  • the fin channels 14a are arranged in a zigzag pattern proximate to an interna! surface of the outer housing iayer 15.
  • the outer housing layer 15 provides support for a user to hold the tablet computing system 800.
  • the pump 16 is in fluid communication with the manifold output channel 13a and the manifold input channel 13b,
  • the pump 16 provides fluid through the manifold output channel 13a, the plurality of fin channels 14a, and the manifold input channel 13b to redistribute heat from the electronic components 11 to the outer housing iayer 15.
  • the outer housing iayer 15 is configured to transfer the heat from the fluid in the fin channels 14a to ai or surface proximate to an external surface of the outer housing iayer 15.
  • the tablet computing system 800 may also include a plurality of through-holes 39 to provide fluid communication between the respective fin channels 14a, and each one of the manifoid output channel 13a and the manifold input channel 13b.
  • heat sinks may also communicate, for example, with the manifoid output channel 13a to dissipate heat into the fluid.
  • FiG. 9 is a flowchart i!iustratirtg a method to redistribute heat of a computing device according to an example,
  • the modules, assemblies, and the like, previously discussed with respect to FIGS.1-8 may be used to implement the method of FIG, 9, Referring to FIG. 9, in block S910, fluid is pumped through respective flow paths of a plurality of channels extending through a plurality of layers of a housing enclosure of a computing device by a pump.
  • the plurality of layers may include a fin layer, a manifold layer, and through-holes therein.
  • the fin layer may include a plurality of fin channels in a zigzag pattern in an area proximate to the outer housing layer.
  • the zigzag pattern may correspond to fin channels having sharp turns in alternating directions, in some examples, the turns may be rounded and/or curved to promote efficient fluid flow.
  • each one of the fin channels include channel segments such that the fluid flows through adjacent channel segments of a respective fin channei in opposite directions to each other.
  • each one of the respective fin channels may include an initial channei segment, an intermediate channel segment, and a final channel segment such that a respective initial channel segment of one fin channel is positioned adjacent to a respective final channel segment of another fin channel.
  • the manifold layer may be laminated to the fin layer.
  • the manifold layer may include a manifold output channel and a manifold input channel.
  • the through-holes may provide fluid communication between the fin channels, and each on of the manifold output channel and the manifold input channel.
  • the method may also include providing lengths corresponding to the respective flow paths about equal to each other.
  • FIG. 9 illustrates architecture, functionality, and/or operation of examples of the present disclosure.
  • the flowchart of FIG. 9 illustrates a specific order of execution, the order of execution may differ from that which is depicted.
  • the order of execution of two or more blocks may be rearranged relative to the order illustrated.
  • two or more blocks illustrated in succession in FIG. 9 may be execuied concurrently or with partial concurrence. All such variations are within the scope of the present disclosure,

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif informatique, un système informatique de type tablette et un procédé. Le dispositif informatique, le système informatique de type tablette et un procédé comprennent un dispositif d'affichage, des composants électroniques, une pluralité de couches et une pompe. La pompe achemine un fluide à travers des canaux des couches afin de redistribuer la chaleur dégagée par les composants électroniques.
PCT/US2014/044615 2014-06-27 2014-06-27 Distribution de la chaleur de dispositifs informatiques Ceased WO2015199726A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2014/044615 WO2015199726A1 (fr) 2014-06-27 2014-06-27 Distribution de la chaleur de dispositifs informatiques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/044615 WO2015199726A1 (fr) 2014-06-27 2014-06-27 Distribution de la chaleur de dispositifs informatiques

Publications (1)

Publication Number Publication Date
WO2015199726A1 true WO2015199726A1 (fr) 2015-12-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2014/044615 Ceased WO2015199726A1 (fr) 2014-06-27 2014-06-27 Distribution de la chaleur de dispositifs informatiques

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040001310A1 (en) * 2002-06-27 2004-01-01 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
EP1564626A1 (fr) * 2004-02-16 2005-08-17 Hitachi, Ltd. Système de refroidissement par liquide et appareil électronique utilisant ce système
US20060039112A1 (en) * 2004-08-20 2006-02-23 Rintaro Minamitani Liquid cooling system and an electronic apparatus applying the same therein
US20130271913A1 (en) * 2011-12-13 2013-10-17 Mark MacDonald Techniques for computing device cooling using a self-pumping fluid
US20130301213A1 (en) * 2000-06-30 2013-11-14 Borys S. Senyk Method and an apparatus for cooling a computer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130301213A1 (en) * 2000-06-30 2013-11-14 Borys S. Senyk Method and an apparatus for cooling a computer
US20040001310A1 (en) * 2002-06-27 2004-01-01 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
EP1564626A1 (fr) * 2004-02-16 2005-08-17 Hitachi, Ltd. Système de refroidissement par liquide et appareil électronique utilisant ce système
US20060039112A1 (en) * 2004-08-20 2006-02-23 Rintaro Minamitani Liquid cooling system and an electronic apparatus applying the same therein
US20130271913A1 (en) * 2011-12-13 2013-10-17 Mark MacDonald Techniques for computing device cooling using a self-pumping fluid

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