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WO2015199128A1 - Dispositif électronique et son procédé de fabrication - Google Patents

Dispositif électronique et son procédé de fabrication Download PDF

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Publication number
WO2015199128A1
WO2015199128A1 PCT/JP2015/068194 JP2015068194W WO2015199128A1 WO 2015199128 A1 WO2015199128 A1 WO 2015199128A1 JP 2015068194 W JP2015068194 W JP 2015068194W WO 2015199128 A1 WO2015199128 A1 WO 2015199128A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
wiring
electronic device
layer
coating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/068194
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English (en)
Japanese (ja)
Inventor
健史 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2016529628A priority Critical patent/JP6601396B2/ja
Publication of WO2015199128A1 publication Critical patent/WO2015199128A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present invention relates to an electronic device whose shape is flexibly adapted to a place where a human body or an object moves or is curved, and a method for manufacturing the same.
  • This application claims priority based on Japanese Patent Application No. 2014-132162 for which it applied on June 27, 2014, and uses the content here.
  • vital information and physical information indicating individual life activity signs may be constantly monitored in the medical field.
  • the electronic device in order to always wear a desired electronic device on an individual's body and detect physical information, the electronic device needs to be flexible so that the subject can follow the movement of the body so that the subject can wear it without feeling uncomfortable. is there.
  • Patent Document 1 discloses a thin and flexible clothing pressure sensor that detects a clothing pressure using a strain gauge.
  • the clothing pressure sensor is used for solid pressure measurement of clothing clothing pressure.
  • the metal sheet is etched and bonded with a strain gauge, and the clothing pressure detection part with external lead wires attached is made of flexible material such as silicon rubber.
  • the housing is formed by integrally molding the material.
  • Patent Document 2 discloses a wearable self-supporting medical device having flexibility and conformality. Specifically, a wearable drug infusion device such as a patch pump replacing a conventional insulin pump is disclosed.
  • the installation place is limited in an apparatus in which a multifunctional device including a sensor, a memory, a microcomputer, an interface, a battery, and the like are integrally formed. Further, even if mounting components are integrated in order to reduce the area occupied by the device, there is a limit to downsizing, and the integration of mounting components may increase the thickness of the device and impair the ease of installation. is there.
  • the housing itself can be made thin by dispersing and mounting the mounting components on the wiring board, but since most of the mounting components are made of a rigid material, bending deformation Can not do it.
  • the wiring board is a flexible board (FPC: Flexible Printed Circuits)
  • FPC Flexible Printed Circuits
  • the tensile stress and compressive stress generated when the wiring board is bent increases in proportion to the distance in the thickness direction from the bending center.
  • the resin and the wiring board are in contact with each other or bonded together, so that the bending center is on the resin side or the wiring board side. Will move. In this case, the optimum bending center is shifted as viewed from the resin side or the wiring board side, and the bending deformation of the wiring board is hindered.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic device capable of reducing a tensile stress and a compressive stress to bend and deform with a small force and a manufacturing method thereof.
  • a part of a flexible wiring board, a flexible coating layer that covers the wiring board from the outside, and a coating layer and the wiring board are provided between the coating layer and the coating board.
  • the electronic device includes a sliding layer that allows relative displacement between the layer and the wiring board.
  • a wiring board having at least a part of flexibility is prepared, the wiring board is covered with a flexible coating layer from the outside, and a lubricant is provided between the coating layer and the wiring board.
  • a third aspect of the present invention at least a part of a flexible wiring board is prepared, a sliding layer that covers the wiring board from the outside is formed, and the wiring board covered with the sliding layer has flexibility. It is the manufacturing method of the electronic device covered with the coating layer.
  • the present invention is characterized in that a sliding layer that allows relative displacement between the wiring board and the coating layer is provided in the electronic device.
  • a sliding layer that allows relative displacement between the wiring board and the coating layer is provided in the electronic device.
  • FIG. 3 is a longitudinal sectional view taken along line II-II in FIG. 2. It is a side view which shows the state which curved the wiring board of the electronic device which concerns on Example 2.
  • FIG. 4 is a partially enlarged view of the vicinity of an electrode part in FIG. 3.
  • 6 is a longitudinal sectional view of a wiring board applied to an electronic apparatus according to Example 2.
  • FIG. It is a longitudinal cross-sectional view which shows the state which covered the wiring board with the sliding layer. It is a longitudinal cross-sectional view which shows the process of pinching
  • FIG. 9 is a flowchart illustrating a method for manufacturing an electronic apparatus according to a second embodiment. It is sectional drawing which shows the bending center and stress when a coating layer is curved alone. It is sectional drawing which shows the bending center and stress at the time of bending a wiring board independently. It is sectional drawing which shows the bending center and stress at the time of fixing and bending a wiring board and a coating layer. It is sectional drawing which shows the bending center and stress at the time of providing a sliding layer between a wiring board and a coating layer, and making it curve. 10 is a front view of a wiring board applied to an electronic device according to a modification of Example 2. FIG.
  • FIG. 16 is a front view showing a state in which the wiring board of FIG. 15 is curved. It is an enlarged view of the part which connects a board
  • FIG. 10 is an enlarged cross-sectional view of a second end portion of an electronic device according to a first modification of Example 3.
  • FIG. 10 is an enlarged cross-sectional view illustrating a state where an injection needle is inserted into an internal space of an electronic device according to a first modification example of Example 3.
  • 10 is an enlarged cross-sectional view showing a state after an injection needle is pulled out from an electronic apparatus according to a first modification of Example 3.
  • FIG. 12 is an enlarged cross-sectional view illustrating a state where a through hole of a coating layer is closed with a plug at a second end portion of an electronic device according to a second modification of Example 3. Will be described with reference to FIG.
  • FIG. 10 is an enlarged cross-sectional view showing a state in the middle of inserting an injection needle into a coating layer of an electronic device according to a third modification of Example 3.
  • FIG. It is an expanded sectional view showing the state where the injection needle was pulled out from the coating layer after injecting the lubricant into the coating layer of the electronic device according to the third modification of Example 3 to form the sliding layer 4.
  • It is a top view of the wiring board applied to the electronic device which concerns on Example 4 of this invention.
  • 6 is a plan view of a wiring board according to a first modification of Example 4.
  • FIG. 10 is a plan view of a wiring board according to a second modification of Example 4.
  • FIG. 10 is a plan view of a wiring board according to a third modification of Example 4.
  • FIG. 10 is a plan view of a wiring board according to a fourth modification of Example 4.
  • FIG. 10 is a front view of a wiring board according to a fourth modification of Example 4.
  • FIG. 10 is a front view of
  • FIG. 1 is a cross-sectional view of an electronic apparatus 1 according to Embodiment 1 of the present invention.
  • the electronic device 1 includes a wiring board 2, a covering layer 3, and a sliding layer 4. At least a part of the wiring board 2 has flexibility. That is, by applying an external force to the wiring board 2, at least a part thereof can be easily bent.
  • the covering layer 3 is formed of a flexible material such as a silicone resin or a low-hardness thermoplastic elastomer.
  • the covering layer 3 is formed sufficiently more flexibly than the wiring board 2.
  • the covering layer 3 is formed so as to cover the wiring board 2 from the outside.
  • the sliding layer 4 is disposed between the covering layer 3 and the wiring board 2.
  • the sliding layer 4 allows relative displacement between the covering layer 3 and the wiring board 2.
  • the sliding layer 4 reduces friction between the covering layer 3 and the wiring board 2, and enables the covering layer 3 to smoothly move in the direction along the front and back surfaces of the wiring board 2.
  • the sliding layer 4 is formed of an inert liquid or gel-like body mainly containing silicon, or a fluororesin.
  • the sliding layer 4 between the wiring board 2 and the coating layer 3 by providing the sliding layer 4 between the wiring board 2 and the coating layer 3, the inner surface of the coating layer 3 and the outer surface of the wiring board 2 are formed when the electronic device 1 is curved. Relative displacement is possible. Thereby, the tensile stress and compressive stress which act on the wiring board 2 and the coating layer 3 can be reduced, and the electronic device 1 can be curved smoothly. As a result, the flexibility of the electronic device 1 can be improved and curved and deformed with less force.
  • the electronic device 101 includes a wiring board 2, a covering layer 3, and a sliding layer 4.
  • FIG. 2 is a plan view of the electronic device 101.
  • FIG. 3 is a longitudinal sectional view taken along line II-II in FIG.
  • FIG. 4 is a side view showing a state in which the wiring board 2 of the electronic device 101 is bent.
  • the electronic device 101 according to the second embodiment is mounted on, for example, a human body and includes a detection unit (not shown) that detects the state of the human body.
  • the wiring board 2 includes a board part 5 and a wiring part 6.
  • the wiring board 2 includes a plurality of substrate portions 5 (specifically, five substrate portions 5).
  • the substrate part 5 is formed by laminating a metal wiring such as copper and an insulating member made of epoxy resin or the like. Therefore, the substrate part 5 itself does not have flexibility and does not bend easily.
  • Various mounting components 7 (for example, sensors, memories, microcomputers, interfaces, batteries, etc.) are mounted on the substrate unit 5.
  • the mounting component 7 is not flexible like the substrate portion 5. That is, by mounting the mounting component 7 on the board part 5, bending stress acting on the mounting component 7 can be reduced.
  • the electronic device 101 is formed by insert-molding the wiring board 2 with a flexible material, and the wiring board 2 can be bent as a multi-joint body.
  • the mounting component 7 may be coated with a hard resin or covered with a metal frame. In this case, since the mounting component 7 can be protected from external force, the connection reliability between the mounting component 7 and the board part 5 can be improved.
  • the substrate portions 5 are each formed in a rectangular plate shape. Among the five substrate portions 5 arranged on the wiring substrate 2, a battery 8 is mounted as a mounting component 7 on the central substrate portion 5.
  • FIG. 3 shows that the mounting component 7 is mounted on the surface of the board portion 5, the present invention is not limited to this.
  • the mounting component 7 may be mounted only on the back surface of the substrate unit 5 or may be mounted on the front and back surfaces of the substrate unit 5.
  • the wiring part 6 has flexibility and can be easily bent.
  • the wiring part 6 is formed so as to connect the adjacent substrate parts 5.
  • the wiring part 6 is formed by laminating a thin sheet-like insulating member (not shown) such as polyimide formed with a metal wiring (not shown) such as copper.
  • the wiring part 6 has a width dimension H1 smaller than a width dimension H2 of the board part 5.
  • the wiring part 6 is formed so that the width dimension gradually decreases toward the center position C1 (see FIG. 2) between the adjacent substrate parts 5.
  • the wiring portion 6 is formed in an arc shape in which both side portions in the width direction are recessed toward the center portion in the width direction.
  • the substrate portion 5 does not bend, but can be bent by the flexibility of the wiring portion 6.
  • the electrode portion 10 is omitted in FIG.
  • the sliding layer 4 is provided between the covering layer 3 and the wiring board 2. Specifically, the sliding layer 4 is provided between the mounting component 7 and the covering layer 3 at the place where the mounting component 7 of the wiring board 2 is mounted.
  • the sliding layer 4 is formed using an inert liquid or gel-like body mainly composed of silicon, a fluororesin having a low surface friction coefficient, or the like.
  • the sliding layer 4 is disposed so as to be in contact with the entire inner peripheral surface of the covering layer 3.
  • the sliding layer 4 can be formed on the wiring board 2 using a dip coater or a spray.
  • FIG. 5 is a partially enlarged view of FIG. 3 and shows the vicinity of the electrode portion 10 in the electronic apparatus 101 according to the second embodiment.
  • the wiring substrate 2 is provided with an electrode portion 10 for electrical connection with the outside of the covering layer 3.
  • the electrode portion 10 is formed on the substrate portion 10 at the extreme end.
  • the electrode part 10 is fixed to the covering layer 3 by an adhesive or the like.
  • An upper end portion 11 of the electrode portion 10 is exposed to the outside of the coating layer 3.
  • the electrode portion 10 extends in a direction intersecting with the longitudinal direction of the substrate portion 5.
  • the electrode unit 10 may be provided as necessary and may be omitted.
  • FIG. 6 is a longitudinal sectional view of the wiring board 2 applied to the electronic apparatus 101 according to the second embodiment.
  • FIG. 7 is a longitudinal sectional view showing a state in which the wiring board 2 is covered with the sliding layer 4.
  • FIG. 8 is a longitudinal sectional view showing a process of sandwiching the wiring board 2 between the upper coating layer 3a and the lower coating layer 3b.
  • FIG. 9 is a longitudinal sectional view showing a state in which the wiring board 2 is sealed with the coating layer 3.
  • FIG. 10 is a flowchart illustrating a method for manufacturing the electronic apparatus 101 according to the second embodiment.
  • the wiring board 2 shown in FIG. 6 is assembled (step S01). Further, the upper coating layer 3a and the lower coating layer 3b shown in FIG. 8 constituting the coating layer 3 are formed (step S02). Note that the order of assembly of the wiring board 2 and formation of the coating layer 3 is not limited to the order of steps S01 and S02.
  • the upper coating layer 3 a and the lower coating layer 3 b correspond to an upper part and a lower part obtained by dividing the coating layer 3 by a plane passing through the center in the thickness direction of the wiring board 2.
  • the upper coating layer 3 a includes a plurality of first recesses 13 for housing the mounting components 7.
  • the first recess 13 is formed following the shape of the mounted component 7 to be accommodated, and is formed in a space slightly larger than the mounted component 7. That is, the sliding layer 4 can be disposed in the gap between the inner surface of the first recess 13 and the mounting component 7.
  • a second concave portion 14 for accommodating the wiring portion 6 is formed between the adjacent first concave portions 13, a second concave portion 14 for accommodating the wiring portion 6 is formed.
  • the depth of the second recess 14 is sufficiently smaller than the depth of the first recess 13.
  • the second recess 14 is formed following the wiring portion 6 and is formed in a space slightly larger than the wiring portion 6.
  • the sliding layer 4 can be disposed in the gap between the inner surface of the second recess 14 and the wiring portion 6.
  • the lower coating layer 3 b includes a third recess 15.
  • the depth of the third recess 15 is approximately the same as that of the second recess 14. Thereby, a gap in which the sliding layer 4 can be disposed is formed also in the third recess 15.
  • the sliding layer 4 is formed so as to cover the outer surface of the wiring board 2 (step S03).
  • the wiring substrate 2 covered with the sliding layer 4 is sandwiched between the upper coating layer 3a and the lower coating layer 3b, and the outer edge portion 16a of the upper coating layer 3a and the outer edge portion 16b of the lower coating layer 3b.
  • the electrode part 10 is formed on the substrate part 5 on the extreme end side, the electrode part 10 and the coating layer 3 are bonded.
  • the wiring substrate 2 is sealed with the covering layer 3.
  • the size of the hatched portion indicates a change in stress.
  • the center of the coating layer 3 or the wiring board 2 in the thickness direction is bent. It becomes the center W. That is, the stress gradually increases in the symmetric direction from the bending center W of the coating layer 3 and the wiring substrate 2 toward both side portions in the thickness direction.
  • the wiring board 2 and the covering layer 3 are fixed as shown in FIG. 13, the bending center W is common to both, and when viewed from the wiring board 2, the bending center moves to the covering layer 3 side.
  • the bending center moves to the wiring board 2 side.
  • the bending center W is arranged at the boundary portion between the wiring board 2 and the covering layer 3. For this reason, the lower surface 18 of the wiring board 2 and the upper surface 17 of the covering layer 3 are separated from the bending center W, and the stress acting on the wiring board 2 and the covering layer 3 is increased.
  • the electronic device 101 according to the second embodiment includes the sliding layer 4 between the wiring board 2 and the coating layer 3.
  • the inner surface of the layer 3 and the outer surface of the wiring board 2 can be relatively displaced. Therefore, the electronic device 101 can be smoothly curved by reducing the tensile stress and the compressive stress acting on the wiring board 2 and the coating layer 3. As a result, the flexibility of the electronic device 101 can be improved and curved and deformed with a small force.
  • the wiring part 6 in which the mounting component 7 is not mounted among the wiring boards 2 is flexible, the wiring board 2 is curved as a whole even if the board part 5 on which the mounting component 7 is mounted is not curved. Can be made.
  • the wiring board 2 since the wiring board 2 is fixed to the coating layer 3 via the electrode portion 10, the wiring board 2 can be positioned with respect to the coating layer 3. As a result, the electronic device 101 can be bent stably. Further, since the electrode portion 10 extends in a direction intersecting with the longitudinal direction of the substrate portion 5, when the electronic device 101 is bent, a shearing force acts on the boundary portion between the electrode portion 10 and the coating layer 3. Can be prevented. As a result, the wiring board 2 and the coating layer 3 can be stably fixed.
  • the wiring substrate 2 covered with the sliding layer 4 is sandwiched between the upper coating layer 3a and the lower coating layer 3b, and the upper coating layer 3a and the lower coating layer 3b may be fixed to each other. Can be manufactured. As a result, the burden on the operator who manufactures the electronic device 101 can be reduced.
  • FIG. 15 is a front view of the wiring board 102 applied to the electronic device 101 according to the modification of the second embodiment.
  • FIG. 16 is a front view showing a state in which the wiring board 102 is bent.
  • FIG. 17 is an enlarged view of a portion where the substrate portion 5 and the wiring portion 6 are connected in the wiring substrate 102 of FIG.
  • FIG. 18 is an enlarged view of a portion where the substrate unit 5 and the wiring unit 6 are connected when the wiring substrate 102 is bent.
  • the wiring board 102 includes a board part 5 and a wiring part 6.
  • the wiring part 6 is formed continuously.
  • a mounting component 7 is mounted on the front surface 5 a of the substrate portion 5, and a part of the back surface 5 b opposite to the front surface 5 a is connected to the wiring portion 6.
  • the substrate unit 5 and the wiring unit 6 may be connected in part, and may be connected to the wiring unit 6 except for the central portion of the back surface 5b of the substrate unit 5.
  • the substrate unit 5 since the back surface 5b of the substrate unit 5 and the wiring unit 6 are partially connected in the wiring substrate 102, the substrate unit 5 does not prevent the entire wiring substrate 102 from being bent. Therefore, as shown in FIGS. 16 and 18, the entire wiring board 102 can be smoothly curved. As a result, the electronic device 101 can be bent and deformed with a small force.
  • the third embodiment is different from the above-described embodiment in that the sliding layer 4 is formed after the wiring substrate 2 is sealed with the covering layer 3 (that is, the step of covering the wiring substrate 2 with the covering layer 3). Therefore, in Example 3, the same part as the above-mentioned Example is attached
  • FIG. 19 is an enlarged cross-sectional view of the first end portion 25 of the electronic apparatus 201 according to the third embodiment.
  • FIG. 20 is an enlarged cross-sectional view of the second end portion 27 of the electronic apparatus 201 according to the third embodiment, and shows a state in which a lubricant that forms the sliding layer 4 is injected.
  • FIG. 21 is an enlarged cross-sectional view of the first end portion 25 of the electronic apparatus 201 according to the third embodiment, and shows a state where the injection needle 30 is inserted into the internal space.
  • FIG. 22 is an enlarged cross-sectional view of the first end portion 25 of the electronic apparatus 201 according to the third embodiment, and shows a state where the through hole 26 is filled with the filler 31 after the injection needle 30 is pulled out.
  • the electronic apparatus 201 communicates the internal space between the coating layer 3 and the wiring board 2 and the external space of the coating layer 3 at the first end 25 of the coating layer 3.
  • a through hole 26 is formed.
  • the through hole 26 is formed in the direction from the first end 25 of the coating layer 3 to the opposite side (that is, the second end 27).
  • a through hole 26 is also formed in the second end portion 27 of the coating layer 3.
  • a check valve 28 is provided on the inner peripheral surface of the covering layer 3 so that the liquid or the gel-like lubricant forming the sliding layer 4 does not leak to the outside from the through hole 26.
  • the check valve 28 is formed so that its end 29 can be elastically deformed from a closed position (see FIG. 19) where the through hole 26 is closed to an open position (see FIG. 21) where the through hole 26 is opened.
  • the check valve 28 is pressed by the injection needle 30 inserted into the through hole 26, the check valve 28 is displaced from the closed position to the open position.
  • the liquid or gel-like lubricant that forms the sliding layer 4 can be injected into the internal space between the wiring board 2 and the coating layer 3 via the injection needle 30.
  • the check valve 28 is displaced from the open position to the closed position by its elasticity.
  • the through hole 26 is closed by the end portion 29 of the check valve 28, and the lubricant can be prevented from temporarily leaking outside through the through hole 26.
  • the through-hole 26 after the injection needle 30 has been pulled out is filled with a filler 31 such as a modified silicon adhesive or silicon resin.
  • the sliding layer 4 is formed of a resin material having an extremely low hardness, the resin material can be prevented from leaking to the outside of the coating layer 3 by performing a curing process on the resin material.
  • the first modification of the third embodiment is different from the third embodiment in the structure related to prevention of leakage of the filler to the outside when the sliding layer 4 is formed. Therefore, in the 1st modification of Example 3, the same code
  • FIG. 23 is an enlarged cross-sectional view of the second end portion 27 of the electronic apparatus 201 according to the first modification of the third embodiment.
  • FIG. 24 is an enlarged cross-sectional view showing a state where the injection needle 30 is inserted into the internal space of the electronic apparatus 201.
  • FIG. 25 is an enlarged cross-sectional view showing a state after the injection needle 30 is pulled out from the electronic device 201.
  • a valve body 32 is integrally formed inside the through hole 26 in the coating layer 3 of the electronic device 201 according to the first modification of the third embodiment.
  • the valve body 32 is supported so that the upper part and the lower part of the through hole 26 can swing. Before the injection needle 30 is inserted, the valve body 32 closes the upper end portion and the lower end portion and closes the through hole 26.
  • the valve body 32 When the injection needle 30 is inserted into the through hole 26 of the coating layer 30, the valve body 32 is pressed by the injection needle 30 and swings toward the inside of the coating layer 3. Accordingly, the valve body 32 is in an open state in which the through hole 26 is opened, and the lubricant can be injected by the injection needle 30. Thereafter, as shown in FIG. 25, when the injection needle 30 is pulled out from the through hole 26, a lubricant such as a liquid forming the sliding layer 4 presses the valve body 32, and the valve body 32 closes the through hole 26. Return to the closed position. Accordingly, it is possible to prevent the lubricant such as the liquid forming the sliding layer 4 from leaking outside through the through hole 26.
  • Example 3 Compared with Example 3 and the first modified example, the second modified example is different in the structure for preventing leakage of the filler to the outside when the sliding layer 4 is formed. Therefore, the same parts as those in the third embodiment are denoted by the same reference numerals and the description thereof is omitted. 26 and 27, the wiring board 2 is not shown.
  • FIG. 26 is an enlarged cross-sectional view of the second end portion 27 of the coating layer 3 according to the second modification of the third embodiment, and shows a state after the operation of injecting the lubricant with the injection needle 30.
  • FIG. 27 is an enlarged cross-sectional view showing a state where the through hole 26 of the coating layer 3 is closed with the plug 33.
  • the second modification includes a plug 33 that closes the through hole 26 of the coating layer 3.
  • the plug 33 includes a main body portion 34 and a return portion 35.
  • the main body 34 has a diameter slightly larger than the diameter of the through hole 26.
  • the return portion 35 of the plug 33 has a surface extending radially outward from the main body portion 34, and the return portion 35 has a diameter sufficiently larger than that of the through hole 26. Therefore, when the plug 33 is inserted into the through hole 26 and the return portion 35 reaches the internal space of the coating layer 3, the return portion 35 is caught on the inner surface of the coating layer 3 around the through hole 26, and thus the plug 33. Is prevented from falling out of the through hole 26. As described above, it is possible to prevent the lubricant such as the liquid forming the sliding layer 4 from leaking outside through the through hole 26.
  • FIG. 28 is an enlarged cross-sectional view of the second end portion 27 of the electronic apparatus 201 according to the third modification of the third embodiment, and shows a state before the injection needle 30 is inserted into the coating layer 3.
  • FIG. 29 is an enlarged cross-sectional view showing a state in the middle of inserting the injection needle 30 into the coating layer 3 of the electronic device 201.
  • FIG. 30 is an enlarged cross-sectional view showing a state where the injection needle 30 is pulled out from the coating layer 3 after the lubricant is injected into the coating layer 3 of the electronic device 201 to form the sliding layer 4.
  • a cut 36 is formed instead of the through hole 26 in the second end portion 27 of the coating layer 3 of the electronic device 201.
  • the cut 36 is sealed by the tackiness of the flexible material forming the coating layer 3.
  • the injection needle 30 can be caused to enter the inner space of the coating layer 3 by spreading the cut 36 with the injection needle 30.
  • the cut 36 returns to the close contact state again. Therefore, it is possible to prevent a lubricant such as a liquid that forms the sliding layer 4 from leaking to the outside.
  • FIG. 31 is a plan view of the wiring board 2 according to the fourth embodiment of the present invention.
  • FIG. 32 is a plan view of the wiring board 2 according to a first modification of the fourth embodiment.
  • FIG. 33 is a plan view of the wiring board 2 according to a second modification of the fourth embodiment.
  • FIG. 34 is a plan view of the wiring board 2 according to a third modification of the fourth embodiment.
  • FIG. 35 is a plan view of the wiring board 2 according to a fourth modification of the fourth embodiment.
  • FIG. 36 is a front view of the wiring board 2 according to a fourth modification of the fourth embodiment.
  • the wiring board 2 includes a plurality of substrate parts 5 and a plurality of wiring parts 106.
  • the wiring part 106 has a surplus length. In other words, the entire length of the wiring portion 106 is longer than the gap between the adjacent substrate portions 5.
  • the wiring portion 106 shown in FIG. 31 has a surplus length that meanders in the width direction with respect to the longitudinal direction of the wiring substrate 2. Thereby, the wiring part 106 is easily deformed in the twisting direction.
  • the direction in which the wiring portion 106 meanders is not limited to the width direction of the wiring board 2.
  • the wiring part 106 may meander in the longitudinal direction of the wiring board 2.
  • the surplus length is formed by meandering the wiring portion 106, but the present invention is not limited to this.
  • the wiring part 106 may be formed obliquely with respect to the arrangement direction of the substrate parts 5. Further, as shown in FIG. 34, the wiring portions 106 may be alternately formed in an oblique direction. That is, the extending direction and angle of the wiring part 106 are not limited to a specific direction and angle.
  • the wiring portion 106 may meander in the thickness direction of the substrate portion 5.
  • the wiring board according to the above-described embodiments and modifications is provided with a substrate part having no flexibility and a wiring part having flexibility, the invention is not limited to this. If an electronic circuit can be mounted on the flexible portion of the wiring board, there is no need to provide a non-flexible substrate portion.
  • the wiring board may be configured by a flexible board (FPC). Even in this case, since the mounted component cannot be bent, it is only necessary to arrange the mounted component so as to be appropriately concentrated or dispersed on the wiring board.
  • the wiring board is composed of a board portion on which electronic components are mounted and a wiring portion having flexibility
  • the electronic device can be attached by adapting the shape to various objects. It can be applied to a wide range of applications.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

　La présente invention concerne un dispositif électronique (101) dont la forme s'adapte de manière flexible à des emplacements ou endroits incurvés où des personnes ou des objets se déplacent. Ledit dispositif est formé en moulant par insertion un substrat de câblage (2) dans un matériau flexible. Spécifiquement, le dispositif électronique (101) est pourvu du substrat de câblage (2), dont au moins une partie est flexible ; d'une couche de couverture flexible (3) pour recouvrir le substrat de câblage (2) à partir de l'extérieur ; et d'une couche à glissement (4) prévue entre la couche de couverture (3) et le substrat de câblage (2), la couche à glissement (4) permettant un déplacement relatif entre la couche de couverture (3) et le substrat de câblage (2). Le substrat de câblage (2) est composé d'une pluralité de parties à substrat (5) sur lesquelles des composants de montage (7) sont montés, et d'une partie à câblage flexible (6) pour lier les parties de substrat (5) ensemble. Il est ainsi possible que le dispositif électronique (101) soit plié en une courbe pour une utilisation en tant qu'unité à articulations multiples. La formation de la couche à glissement (4) réduit la contrainte de traction et la contrainte de compression, pour que le dispositif électronique (101) puisse être plié en une courbe avec une force minimale.
PCT/JP2015/068194 2014-06-27 2015-06-24 Dispositif électronique et son procédé de fabrication Ceased WO2015199128A1 (fr)

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JP2016529628A JP6601396B2 (ja) 2014-06-27 2015-06-24 電子機器およびその製造方法

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JP2014132162 2014-06-27
JP2014-132162 2014-06-27

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JP2019050166A (ja) * 2017-09-12 2019-03-28 日本電気株式会社 接続構造および接続方法および電子回路システム
WO2022092608A1 (fr) * 2020-11-02 2022-05-05 삼성전자 주식회사 Élément couvercle pliable et et dispositif électronique le comprenant
JP2023019058A (ja) * 2021-07-28 2023-02-09 デゾン・ジャパン株式会社 配線基板

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JP2023019058A (ja) * 2021-07-28 2023-02-09 デゾン・ジャパン株式会社 配線基板

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