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WO2015190873A1 - Siloxane polymer composition - Google Patents

Siloxane polymer composition Download PDF

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Publication number
WO2015190873A1
WO2015190873A1 PCT/KR2015/005950 KR2015005950W WO2015190873A1 WO 2015190873 A1 WO2015190873 A1 WO 2015190873A1 KR 2015005950 W KR2015005950 W KR 2015005950W WO 2015190873 A1 WO2015190873 A1 WO 2015190873A1
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Prior art keywords
weight
siloxane polymer
compound
polymer composition
interlayer insulating
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PCT/KR2015/005950
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French (fr)
Korean (ko)
Inventor
김삼민
장학순
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Chemtronics Co Ltd
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Chemtronics Co Ltd
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Priority to CN201580038134.5A priority Critical patent/CN106795287A/en
Publication of WO2015190873A1 publication Critical patent/WO2015190873A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/38Polysiloxanes modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes

Definitions

  • the present invention relates to a siloxane polymer composition, a cured film formed from the composition, and an interlayer insulating film, which are suitable as a material for forming a cured film such as an interlayer insulating film of a display device such as a liquid crystal display device (LCD) or an organic EL display device.
  • a siloxane polymer composition a siloxane polymer composition, a cured film formed from the composition, and an interlayer insulating film, which are suitable as a material for forming a cured film such as an interlayer insulating film of a display device such as a liquid crystal display device (LCD) or an organic EL display device.
  • LCD liquid crystal display device
  • organic EL display device organic EL display device
  • a color TFT liquid crystal display element or the like is created by overlapping a color filter substrate and a TFT array substrate.
  • an interlayer insulating film is formed in order to insulate between wirings generally arranged in a layer shape.
  • a positive radiation-sensitive composition is widely used in that there are few processes for obtaining the required pattern shape, and it is preferable to have sufficient flatness.
  • an input device for operating the device by pressing an on-screen display called a touch panel, a touch screen or a touch screen is used for an automatic teller machine such as a bank, a vending machine, a mobile phone, a portable information display terminal, or a digital audio player have.
  • a protective film is provided.
  • the protective film requires surface hardness such as adhesion to the wiring of the touch panel element and scratch resistance as a protective film.
  • the present inventors have made efforts to develop a siloxane-based polymer composition which can be used as a material of an interlayer insulating film having excellent heat resistance and transmittance while improving surface hardness.
  • the siloxane polymer composition is used, the present inventors have found that it is possible to form an interlayer insulating film capable of balancing the general required properties of heat resistance and transmittance while improving hardness, and completed the present invention.
  • An object of the present invention is to provide a method for forming a siloxane-based polymer composition, a cured film formed from the siloxane-based polymer composition, an interlayer insulating film, and an interlayer insulating film which can be used as a material of an interlayer insulating film having improved hardness and excellent heat resistance and transmittance.
  • the present invention provides a siloxane polymer obtained by hydrolytically condensing (A) (a1) a silane compound with (a2) benzyl alcohol or benzyl ether; (a1) The silane compound is a compound (a1) and a compound ( a2) 70% to 97% by weight of the total weight, (a2) benzyl alcohol or benzyl ether, wherein the siloxane polymer uses from 3% to 30% by weight of the total weight of compound (a1) and compound (a2), and (B) Provides the siloxane polymer composition containing a solvent.
  • the siloxane polymer of (A) component is a compound which has a siloxane bond obtained by hydrolytic condensation of (a1) a silane compound and (a2) benzyl alcohol or benzyl ether.
  • the said (a1) silane compound is a hydrolysable silane compound represented by following General formula (1).
  • R 1 in Formula 1 each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 20 carbon atoms.
  • the alkyl group include methyl group, ethyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, t-butyl group, n-hexyl group and n-decyl group.
  • the aryl group include phenyl group, tolyl group, naphthyl group and the like. However, some or all of the hydrogen atoms of these alkyl groups and aryl groups may be substituted.
  • R 2 in the formula (1) each independently indicate a hydrogen atom, any of acyl group, or an aryl group having 6 to 15 of the alkyl group having 1 to 6 carbon atoms, having 1 to 6 carbon atoms.
  • the alkyl group include methyl group, ethyl group, propyl group and butyl group.
  • the acyl group include an ethyl group, propionyl group, and butanoyl group.
  • Examples of the aryl group include a phenyl group, a naphthyl group, and the like. However, some or all of the hydrogen atoms of these alkyl groups and aryl groups may be substituted.
  • N in the said Formula (1) represents the integer of 0-3.
  • n 1, a trifunctional silane
  • Examples of the hydrolyzable silane compound according to the present invention represented by Chemical Formula 1 include tetramethoxy silane, tetraethoxy silane, tetraacetoxy silane, tetra phenoxy silane, methyl trimethoxy silane, methyl triethoxy silane, Ethyl tri-i-propoxy silane, methyl tributoxy silane, n-propyl trimethoxy silane, n-propyl triethoxy silane, n-butyl trimethoxy silane, n-butyl triethoxy silane, n-hexyl Trimethoxy silane, n-hexyl triethoxy silane, phenyl trimethoxy silane, phenyl triethoxy silane and the like. It is preferable to use trifunctional silane and tetrafunctional silane from a hardness viewpoint of a cured film among these hydrolyzable silane compounds.
  • the benzyl alcohol or benzyl ether (a2) is preferably a compound represented by the following formula (2).
  • R in Formula 2 is an alkyl group or hydrogen atom having 1 to 4 carbon atoms
  • R ' is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms
  • X is a hydrogen atom or an OH group
  • Y is a hydrogen atom, methyl or triple Orormethyl.
  • R is one of a hydrogen atom, methyl, ethyl, propyl, and n-butyl group
  • R ' is one of a hydrogen atom, methyl, ethyl and t-butyl.
  • hydrolyzable silane compound is usually hydrolyzed to produce a silanol group by heating in a temperature range of room temperature (about 25 ° C.) to about 100 ° C. in the absence of a catalyst and excess water. It refers to a compound having an existing group or a group capable of forming a siloxane condensate.
  • the siloxane monomer represented by Formula 1 and the benzyl alcohol or benzyl ether represented by Formula 2 may produce the (A) siloxane polymer of the present invention by hydrolysis and condensation polymerization, preferably (a1) silane 70 wt% to 97 wt% of the total weight of the compound (a1) and the compound (a2), and (a2) benzyl alcohol or benzyl ether, 3 wt% to 30 wt.% Of the total weight of the compound (a1) and the compound (a2).
  • hydrolysis and condensation polymerization can be made "(A) siloxane polymer".
  • (A) siloxane polymer was prepared by varying the weight ratio of (a1) and / or (a2).
  • the amount of the (a2) benzyl compound to be used exceeds 30% by weight, the transparency of the interlayer insulating film to be produced decreases, and when it is 3% by weight to 30% by weight, the interlayer insulating film having excellent hardness and transparency It was confirmed that manufacturing is possible. Therefore, it is preferable to use 70 to 97 weight% of siloxane monomer (a1) compounds, and 3 to 30 weight% of benzyl compounds (a2) at the time of preparation of (A) siloxane polymer.
  • the solvent which can be used for the said hydrolysis polymerization is not specifically limited. Usually, as long as it is a solvent used for a positive photosensitive composition, it can use without a restriction.
  • etheryuno is tetrahydrofuran
  • diethylene glycol is diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethylmethyl ether
  • ethers such as ethylene glycol monoalkyl ether acetate and propylene glycol monoalkyl ether acetate, ketones such as methyl ethyl ketone and various esters can be used.
  • toluene, xylene, etc. can be used as aromatic hydrocarbons.
  • water used for the hydrolysis condensation it is preferable to use water purified by a method such as reverse osmosis membrane treatment, ion exchange treatment, distillation or the like. By using such purified water, a side reaction can be suppressed and the reactivity of hydrolysis can be improved.
  • the amount of water to be used is preferably 0.1 to 3 moles, more preferably 0.3 to 2 moles, even more preferably 0.5 to 1.5 moles with respect to 1 mole of the total amount of the hydrolyzable groups of the hydrolyzable silane compound represented by the formula (1). Amount. By using this amount of water, the reaction rate of hydrolysis-condensation can be optimized.
  • the hydrolysis and condensation reaction of the (a) silane compound and the (a2) benzyl alcohol or benzyl ether for preparing the (A) siloxane polymer according to the present invention may be preferably performed under an acid catalyst.
  • the said catalyst is a Lewis acid, all can be used.
  • the Lewis acid any Lewis acid such as hydrochloric acid, sulfuric acid, nitric acid, formic acid, oxalic acid, acetic acid, trifluoro acetic acid, trifluoro sulfonic acid, toluene sulfonic acid, phosphoric acid and the like can be used.
  • reaction temperature and reaction time in hydrolysis condensation for production of the (A) siloxane polymer according to the present invention can be appropriately set.
  • Reaction temperature becomes like this.
  • Preferably it is 40-200 degreeC, More preferably, it is 50-150 degreeC.
  • the reaction time is preferably 30 minutes to 24 hours, more preferably 1 to 12 hours.
  • Hydrolysis condensation reaction can be performed efficiently under such reaction temperature and reaction time.
  • the hydrolyzable silane compound, water, and catalyst may be added to the reaction system at one time, and the reaction may be performed in one step.
  • the hydrolyzable silane compound, water, and catalyst may be added in several times in the reaction system.
  • the hydrolysis condensation reaction may be carried out in multiple stages. After the hydrolytic condensation reaction, water and the resulting alcohol can be removed from the reaction system by adding a dehydrating agent and then adding to the evaporation.
  • the molecular weight of the (A) siloxane polymer which is the hydrolysis-condensation product of the hydrolyzable silane compound which concerns on this invention is the number average molecular weight of polystyrene conversion using GPC (gel permeation chromatography) which used tetrahydrofuran for the mobile phase. It can be measured as. And it is preferable to make the number average molecular weight of a hydrolysis-condensation product into the value within the range of 1,000-40,000 normally. When the value of the number average molecular weight of a hydrolysis-condensation product is 1,000 or more, the film-forming property of the coating film of a positive radiation sensitive composition can be improved. On the other hand, by making the value of the number average molecular weight of a hydrolysis-condensation product into 40,000 or less, the radiation-sensitive fall of a positive radiation sensitive composition can be prevented.
  • (B) component is a solvent. Although it does not specifically limit, It is preferable to contain the alcohol solvent which is especially a protic solvent. By using an alcoholic solvent, each component can be dissolved or dispersed uniformly, thereby making it possible to improve the coatability of the composition solution to a large substrate, and also to apply coating stains (stripe-shaped stains, pin trace stains, mist stains). Etc.) can be suppressed and the film thickness uniformity can be further improved.
  • alcohol solvents examples include long-chain alkyl alcohols such as 1-hexanol, 1-octanol, 1-nonanol, 1-dodecanol, 1,6-hexanediol, and 1,8-octanediol; Aromatic alcohols such as benzyl alcohol; Ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; Propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; Diethylene glycol monoalkyl ethers such as diethylene glycol monomethyl ether and diethylene glycol monoethyl ether; Dipropylene glycol monoalkyl ethers such as
  • benzyl alcohol ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether are particularly preferable from the viewpoint of improving coating properties.
  • a component may be used individually by 1 type and may mix and use 2 or more types.
  • the usage-amount of (B) component becomes like this. Preferably it is 5 mass parts-300 mass parts, More preferably, it is 10 mass parts-200 mass parts with respect to 100 mass parts of (A) component.
  • coating property improvement with respect to a glass substrate etc. is attained, the generation
  • coating stain stripe-shaped stain, pin trace stain, fog stain, etc. is suppressed, and film thickness uniformity Can be further improved.
  • ethers diethylene glycol alkyl ethers, ethylene glycol alkyl ether acetates, propylene glycol monoalkyl ether propionates, aromatic hydrocarbons, ketones And esters.
  • ethers For example, tetrahydrofuran etc .
  • diethylene glycol alkyl ether For example, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, etc .
  • ethylene glycol alkyl ether acetates For example, methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monoethyl ether acetate, etc .
  • propylene glycol monoalkyl ether acetates For example, propylene glycol monomethyl ether acetate, a propylene glycol monoethyl ether acetate, a propylene glycol monopropyl ether acetate, a propylene glycol monobutyl ether acetate, etc .
  • propylene glycol monoalkyl ether propionates a propylene glycol mono
  • aromatic hydrocarbons For example, toluene, xylene, etc .
  • ketones for example, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 2-heptanone, 4-hydroxy-4-methyl-2-phene
  • esters for example, methyl acetate, ethyl acetate, propyl acetate, i-propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, 2-hydroxy-2- Ethyl methyl propionate, methyl hydroxyacetic acid, ethyl hydroxyacetic acid, hydroxyacetic acid butyl, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, 3-hydroxypropionic acid methyl, 3-hydroxypropionic acid, 3-hydroxypropionic acid Propyl, butyl 3-hydroxypropionate, methyl 2-hydroxy-3-methylbutanoic acid, methyl methoxyacetic acid, ethyl methoxyacetic acid, methoxyacetic acid propyl, methoxyacetic acid butyl, ethoxyacetic acid methyl, ethoxyacetic acid ethyl Propyl
  • the polysiloxane composition of this invention can contain the following component further.
  • ⁇ (C) component A thermal acid generator or a thermal base generator>
  • the thermal acid generator or the thermal base generator is an acidic active substance which acts as a catalyst in the hydrolytic condensation-curing reaction of the compound (a1) and the compound (a2) in preparing the (A) siloxane polymer according to the present invention. It is defined as a compound capable of releasing basic active substances.
  • the condensation reaction of the component in the heating process after image development of a positive radiation sensitive composition can be accelerated
  • a thermal acid generator or a thermal base generator of (C) component at the time of prebaking at comparatively low temperature (for example, 70-120 degreeC) in the coating film formation process of a positive radiation sensitive composition.
  • An ionic compound and a nonionic compound are contained in the thermal acid generator of (C) component.
  • an ionic compound it is preferable that heavy metal and no halogen ion are included.
  • the ionic thermosensitive acid generator include triphenylsulfonium, 1-dimethylthionaphthalene, 1-dimethylthio-4-hydroxynaphthalene, 1-dimethylthio-4,7-dihydroxynaphthalene and 4-hydroxy Phenyldimethylsulfonium, benzyl 4-hydroxyphenylmethylsulfonium, 2-methylbenzyl 4-hydroxyphenylmethylsulfonium, 2-methylbenzyl-4-acetylphenylmethylsulfonium, 2-methylbenzyl-4 Methane sulfonate, trifluoromethane sulfonate, camphor sulfonate, p-toluene sulfonate, hexafluoro phosphonate, etc., such
  • nonionic thermosensitive acid generator examples include halogen-containing compounds, diazomethane compounds, sulfone compounds, sulfonic acid ester compounds, carboxylic acid ester compounds, phosphate ester compounds, sulfonimide compounds, sulfone benzotriazole compounds, and the like. have.
  • halogen-containing compound a haloalkyl group containing hydrocarbon compound, a haloalkyl group containing heterocyclic compound, etc. are mentioned.
  • halogen-containing compounds examples include 1,1-bis (4-chlorophenyl) -2,2,2-trichloroethane, 2-phenyl-4,6-bis (trichloromethyl) -s-triazine, 2 -Naphthyl-4,6-bis (trichloromethyl) -s-triazine, etc. are mentioned.
  • diazomethane compounds include bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane and bis (p-tolylsulfonyl) dia Crude methane, bis (2,4-xyrylsulfonyl) diazomethane, bis (p-chlorophenylsulfonyl) diazomethane, tilsulfonyl-p-toluenesulfonyldiazomethane,
  • a sulfone compound the (beta) -keto sulfone compound, the (beta) -sulfonyl sulfone compound, a diaryl disulfone compound, etc. are mentioned.
  • a preferable sulfone compound 4-trisphenacyl sulfone, mesityl penacyl sulfone, bis (phenylsulfonyl) methane, 4-chlorophenyl- 4-methylphenyl disulfone compound, etc. are mentioned.
  • a sulfonic acid ester compound an alkyl sulfonic acid ester, a haloalkyl sulfonic acid ester, an aryl sulfonic acid ester, an imino sulfonate, etc. are mentioned.
  • Examples of the preferable sulfonic acid ester compound include benzointosylate, pyrogallol trimesylate, nitrobenzyl-9,10-diethoxyanthracene-2-sulfonate, 2,6-dinitrobenzylbenzenesulfonate, and the like.
  • a carboxylic acid ester compound carboxylic acid o-nitrobenzyl ester is mentioned.
  • thermal base generator of component (C) examples include transition metal complexes such as cobalt, orthonitrobenzylcarbamates, ⁇ , ⁇ -dimethyl-3,5-dimethoxybenzylcarbamates, acyloxyiminos, and the like. have.
  • transition metal complex examples include bromopentaammonium cobalt perchlorate, bromopentamethylamine cobalt perchlorate, bromopentapropylamine cobalt perchlorate, hexaammonia cobalt perchlorate, hexamethylamine cobalt perchlorate, hexapropylamine cobalt perchlorate Salts; and the like.
  • acyloxyiminos examples include propionylacetophenone oxime, propionylbenzophenone oxime, propionyl acetone oxime, butyryl acetophenone oxime, butyryl benzophenone oxime, butyryl acetone oxime, adipoyl acetophenone oxime, adipoylbenzo Phenone oxime, adipoyl acetone oxime, acroyl acetophenone oxime, acroyl benzophenone oxime, acroyl acetone oxime and the like.
  • thermosensitive base generator examples include 2-nitrobenzylcyclohexyl carbamate and O-carbamoylhydroxyamide.
  • the present invention is not limited thereto, and either the acid or the base may be used as the thermal acid generator or the thermal base generator of the component (C), one type may be used alone, or two or more types may be mixed and used.
  • the quantity in the case of using (C) component becomes like this.
  • it is 0.1 mass part-10 mass parts, More preferably, it is 1 mass part-5 mass parts with respect to 100 mass parts of (A) component.
  • the present invention provides a cured film formed of the polysiloxane composition of the present invention and a method of forming the cured film.
  • the cured film which concerns on this invention can be manufactured including the following process.
  • the substrate As a material of the substrate which can be used in the present invention, glass, silicon, quartz, resin, and the like can be used.
  • the solvent is removed and a coating film is formed.
  • a coating film In order to pattern a coating film, it exposes through the photomask which has a predetermined pattern. After exposure to light of a certain wavelength through the photomask, unnecessary portions are removed to form a pattern.
  • a developing solution used for a developing process aqueous alkali solution is preferable. Examples of the alkali used may include sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, tetramethyl ammonium hydroxide, tetraethyl ammonium hydroxide and the like.
  • the patterned thin film is heated to cure. Such postbaking is usually conducted for a certain time at 120 degrees or more and 250 degrees or less.
  • an interlayer insulating film for display elements having a fine pattern can be easily formed.
  • the interlayer insulation film thus formed is formed with an interlayer insulation film excellent in hardness, heat resistance, and transparency.
  • the "cured film” is a generic term for a thermoset formed by using the siloxane polymer composition, and examples of the cured film of the display element include a protective film, an interlayer insulating film, and the like.
  • the siloxane polymer composition which concerns on this invention can form the cured film excellent in transparency and scratch resistance, such a cured film can be applied to the technical use which requires high scratch resistance, etc. transparency,
  • a liquid crystal display element or a touch It can use suitably as a protective film, an interlayer insulation film, etc. of various devices, such as a panel.
  • the cured film formed from the polysiloxane composition of this invention is excellent in the surface hardness, heat resistance, and transparency characteristic with respect to a board
  • the present invention it is possible to provide a siloxane-based polymer composition which can be used as a material of an interlayer insulating film having improved hardness and excellent heat resistance and transmittance, a cured film formed from the siloxane-based polymer composition, an interlayer insulating film, and a method of forming the interlayer insulating film. . Therefore, the interlayer insulation film formed by this invention can be used suitably also for uses, such as a display film and a protective film of a touchscreen display element.
  • the weight average molecular weight (Mw) of the hydrolysis-condensation product of the hydrolyzable silane compound obtained from each synthesis example below was measured by the gel permeation chromatography (GPC) according to the following specification.
  • GPC-KF-801 Column: GPC-KF-801, GPC-KF-802, GPC-KF-803 and GPC-KF-804 (manufactured by Showa Denko KK)
  • 35 wt% of phenyltriethoxy silane, 35 wt% of methyltriethoxysilane, 25 wt% of tetraethoxysilane, and 5 wt% of 4,4'-isopropylidenebis (2,6-dihydroxymethylphenol) 50 parts by weight of a tetrahydrofuran solvent was added to a reactor equipped with a reflux condenser, and vigorously stirred, a solution in which 2% by weight of sulfuric acid was added to 20 parts by weight of ultrapure water was slowly added to the reactor. The reactor was refluxed for 12 hours and then cooled. After diluting the cooled reaction solution, GPC analysis was conducted to prepare a polymer having a polystyrene reduced weight average molecular weight of 3,500.
  • the siloxane polymer (Synthesis Examples 1 to 7, Comparative Examples 1 to 3) prepared above was spin-coated and then prebaked at 100 degrees for 3 minutes. After prebaking, the film thickness was obtained at about 4.0 microns. The coating film thus obtained was post-baked at 240 degrees for 1 hour. The pencil hardness of the cured film was measured using the pencil hardness meter. The measurement results are as shown in Table 1.
  • the cured coating film thickness was measured (T1) and the thickness (T2) obtained by further baking the coating film at 230 degrees for 1 hour was measured. [(T1-T2) / T2 x 100 (%) The thickness deviation before and after further baking was calculated as a percentage. When the thickness variation ratio is 3% or less, it can be said that heat resistance is excellent, and it is as shown in Table 1.
  • the cured film was obtained by heating at 230 degree
  • the glass substrate which has this cured film was measured at 400 nm using the spectrophotometer, and the result is shown in Table 1.

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Abstract

The present invention relates to: a siloxane polymer composition, which is suitable as a material for forming a hardened layer, such as an interlayer insulating film of a display device, such as a liquid crystal display (LCD) or organic EL display device; a hardened film formed of the composition; an interlayer insulating film; and a method for forming the interlayer insulating film. The present invention can provide: a siloxane-based polymer composition, which is usable as a material for an interlayer insulating film having improved hardness and excellent heat resistance and transmittance; a hardened film formed of the siloxane-based polymer composition; an interlayer insulating film; and a method for forming the interlayer insulating film. Therefore, the interlayer insulating film formed by the present invention is useful since the interlayer insulating film can be also appropriately used as a protective film of a display device or a touch panel display device, or the like.

Description

실록산 폴리머 조성물Siloxane polymer composition

본 발명은 액정 표시 소자(LCD)나 유기 EL 표시 소자 등의 표시 소자의 층간 절연막 등의 경화막을 형성하기 위한 재료로서 적합한, 실록산 폴리머 조성물, 그 조성물로부터 형성된 경화막 및 층간 절연막에 관한 것이다. The present invention relates to a siloxane polymer composition, a cured film formed from the composition, and an interlayer insulating film, which are suitable as a material for forming a cured film such as an interlayer insulating film of a display device such as a liquid crystal display device (LCD) or an organic EL display device.

컬러 TFT 액정 표시 소자 등은, 컬러 필터 기판과 TFT 어레이 기판을 서로 겹침으로써 작성된다. TFT 어레이 기판에 있어서는, 일반적으로 층 형상으로 배치되는 배선의 사이를 절연하기 위해 층간 절연막이 형성되어 있다. 층간 절연막을 형성하는 재료로서는, 필요로 하는 패턴 형상을 얻기 위한 공정수가 적고, 게다가 충분한 평탄성을 갖는 것이 바람직하다는 점에서, 포지티브형 감방사선성 조성물이 폭넓게 사용되고 있다. A color TFT liquid crystal display element or the like is created by overlapping a color filter substrate and a TFT array substrate. In a TFT array substrate, an interlayer insulating film is formed in order to insulate between wirings generally arranged in a layer shape. As the material for forming the interlayer insulating film, a positive radiation-sensitive composition is widely used in that there are few processes for obtaining the required pattern shape, and it is preferable to have sufficient flatness.

이러한, 층간 절연막 형성용 감방사선성 조성물의 성분으로서 아크릴계 수지가 주로 사용되고 있지만(일본공개특허공보 2001―354822호 참조), 최근에는 아크릴계 수지보다 내열성 및 투명성이 우수한 폴리실록산계 재료를 감방사선성 조성물의 성분으로서 이용하는 시도가 이루어지고 있다(일본공개특허공보 2006―178436호, 일본공개특허공보 2006―276598호, 일본공개특허공보 2006―293337호 참조). Although an acrylic resin is mainly used as a component of the radiation sensitive composition for forming an interlayer insulating film (see Japanese Patent Laid-Open No. 2001-354822), recently, a polysiloxane material having better heat resistance and transparency than an acrylic resin is selected from the radiation-sensitive composition. Attempts have been made to use it as a component (see Japanese Patent Laid-Open No. 2006-178436, Japanese Patent Laid-Open No. 2006-276598 and Japanese Patent Laid-Open No. 2006-293337).

한편, 은행 등 자동 현금 지불기, 자동 판매기, 휴대 전화, 휴대 정보표시 단말기, 디키털 오디오 플레이어 등에 터치 패널, 터치 스크린이나 터치 화면 등으로 불리는 화면상의 표시를 누름으로써 기기를 조작하는 입력 장치가 사용되고 있다. 터치 패널은 통상 손가락 등으로 직접 누르기 때문에, 보호막이 구비된다. 그 보호막에는 터치 패널 소자의 배선으로의 밀착성, 또한 보호막으로서의 내찰상성 등 표면 경도가 필요시 되고 있다. On the other hand, an input device for operating the device by pressing an on-screen display called a touch panel, a touch screen or a touch screen is used for an automatic teller machine such as a bank, a vending machine, a mobile phone, a portable information display terminal, or a digital audio player have. Since the touch panel is usually pressed directly with a finger or the like, a protective film is provided. The protective film requires surface hardness such as adhesion to the wiring of the touch panel element and scratch resistance as a protective film.

이에, 높은 내열성, 투명성 및 저유전성, 내에칭성, 경도, 및 높은 전압 유지율을 가지며 감광제와의 높은 상용성이 있는 폴리실록산계 포지티브형 감광성 조성물의 개발이 필요한 상황이다. Accordingly, there is a need for the development of a polysiloxane-based positive photosensitive composition having high heat resistance, transparency and low dielectric constant, etch resistance, hardness, and high voltage retention and having high compatibility with a photosensitive agent.

이러한 배경 하에 본 발명자들은, 표면 경도가 개선되면서도 내열성 및 투과율이 우수한 층간 절연막의 재료로 사용 가능한 실록산계 폴리머 조성물을 개발하고자 예의 노력한 결과, 본 발명에 따른 벤질 화합물을 일정 중량 이상 포함하도록 하여 제조된 실록산 폴리머 조성물을 사용하는 경우 경도가 개선되면서도 내열성 및 투과율이라는 일반적인 요구 특성도 균형 있게 충족시킬 수 있는 층간 절연막을 형성할 수 있음을 발견하고 본 발명을 완성하였다.Under these circumstances, the present inventors have made efforts to develop a siloxane-based polymer composition which can be used as a material of an interlayer insulating film having excellent heat resistance and transmittance while improving surface hardness. When the siloxane polymer composition is used, the present inventors have found that it is possible to form an interlayer insulating film capable of balancing the general required properties of heat resistance and transmittance while improving hardness, and completed the present invention.

본 발명의 목적은 경도가 개선되면서도 내열성 및 투과율이 우수한 층간 절연막의 재료로 사용 가능한 실록산계 폴리머 조성물, 상기 실록산계 폴리머 조성물로부터 형성된 경화막, 층간 절연막 및 층간 절연막의 형성방법을 제공하는 것이다. An object of the present invention is to provide a method for forming a siloxane-based polymer composition, a cured film formed from the siloxane-based polymer composition, an interlayer insulating film, and an interlayer insulating film which can be used as a material of an interlayer insulating film having improved hardness and excellent heat resistance and transmittance.

다른 식으로 정의되지 않는 한, 본 명세서에서 사용된 모든 기술적 및 과학적 용어들은 본 발명이 속하는 기술분야에서 숙련된 전문가에 의해서 통상적으로 이해되는 것과 동일한 의미를 갖는다. 일반적으로, 본 명세서에서 사용된 명명법은 본 기술분야에서 잘 알려져 있고 통상적으로 사용되는 것이다.Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In general, the nomenclature used herein is well known and commonly used in the art.

본 발명은 일 관점에서, (A) (a1) 실란 화합물과, (a2) 벤질 알코올 또는 벤질 에테르;를 가수분해 축합하여 얻어지는 실록산 폴리머로서, (a1) 실란 화합물은, 화합물 (a1) 및 화합물 (a2) 전체 중량 대비 70중량% 내지 97중량%, (a2) 벤질 알코올 또는 벤질 에테르는 화합물 (a1) 및 화합물 (a2) 전체 중량 대비 3중량% 내지 30중량%를 사용하는 것인 실록산 폴리머, 및 (B) 용제를 함유하는 실록산 폴리머 조성물을 제공한다In one aspect, the present invention provides a siloxane polymer obtained by hydrolytically condensing (A) (a1) a silane compound with (a2) benzyl alcohol or benzyl ether; (a1) The silane compound is a compound (a1) and a compound ( a2) 70% to 97% by weight of the total weight, (a2) benzyl alcohol or benzyl ether, wherein the siloxane polymer uses from 3% to 30% by weight of the total weight of compound (a1) and compound (a2), and (B) Provides the siloxane polymer composition containing a solvent.

<(A) 성분: 실록산 폴리머><(A) component: A siloxane polymer>

(A) 성분의 실록산 폴리머는 (a1) 실란 화합물과 (a2) 벤질 알코올 또는 벤질 에테르;를 가수분해 축합하여 얻어지는, 실록산 결합을 갖는 화합물이다. The siloxane polymer of (A) component is a compound which has a siloxane bond obtained by hydrolytic condensation of (a1) a silane compound and (a2) benzyl alcohol or benzyl ether.

상기 (a1) 실란 화합물은, 하기의 화학식 1로 표시되는 가수분해성 실란 화합물인 것이 바람직하다. It is preferable that the said (a1) silane compound is a hydrolysable silane compound represented by following General formula (1).

[화학식 1] [Formula 1]

(R1)n-Si-(OR2)4-n (R 1 ) n -Si- (OR 2 ) 4-n

상기 화학식 1의 R1은 각각 독립적으로 수소원자, 탄소수 1~10의 알킬기 또는 탄소수 6~20의 아릴기 중 어느 것을 나타낸다. 상기 알킬기의 예로는 메틸기, 에틸기, 에틸기, n-프로필기, i-프로필기, n-부틸기, t-부틸기, n-헥실기, n-데실기를 들 수 있다. 아릴기의 예로는 페닐기, 톨릴기, 나프틸기 등을 들 수 있다. 단, 이들 알킬기, 아릴기의 수소 원자의 일부 또는 전부가 치환되어 있어도 좋다.R 1 in Formula 1 each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 20 carbon atoms. Examples of the alkyl group include methyl group, ethyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, t-butyl group, n-hexyl group and n-decyl group. Examples of the aryl group include phenyl group, tolyl group, naphthyl group and the like. However, some or all of the hydrogen atoms of these alkyl groups and aryl groups may be substituted.

상기 화학식 1의 R2는, 각각 독립적으로 수소 원자, 탄소수 1~6의 알킬기, 탄소수 1~6의 아실기 또는 탄소수 6~15의 아릴기 중 어느 것을 나타낸다. 알킬기의 예로는 메틸기, 에틸기, 프로필기, 부틸기를 들수있다. 아실기의 예로는 에세틸기, 프로피오닐기, 부타노일기를 들수 있다. 아릴기의 예로는 페닐기, 나프틸기, 등을 들수 있다. 단, 이들 알킬기, 아릴기의 수소 원자의 일부 또는 전부가 치환되어 있어도 좋다. R 2 in the formula (1) each independently indicate a hydrogen atom, any of acyl group, or an aryl group having 6 to 15 of the alkyl group having 1 to 6 carbon atoms, having 1 to 6 carbon atoms. Examples of the alkyl group include methyl group, ethyl group, propyl group and butyl group. Examples of the acyl group include an ethyl group, propionyl group, and butanoyl group. Examples of the aryl group include a phenyl group, a naphthyl group, and the like. However, some or all of the hydrogen atoms of these alkyl groups and aryl groups may be substituted.

상기 화학식 1의 n은 0~3의 정수를 나타낸다. n=0인 경우는 4관능성 실란, n=1인 경우는 3관능성 실란, n=2인 경우는 2관능성 실란, n=3인 경우는 1관능성 실란이다.N in the said Formula (1) represents the integer of 0-3. When n = 0, it is a tetrafunctional silane, when n = 1, a trifunctional silane, when n = 2, a bifunctional silane, and when n = 3, it is a monofunctional silane.

상기 화학식 1로 표시되는 본 발명에 따른 가수 분해성 실란 화합물의 예로는, 테트라메톡시 실란, 테트라에톡시 실란, 테트라아세톡시 실란, 테트라 페녹시 실란, 메틸 트리메톡시 실란, 메틸 트리에톡시 실란, 에틸 트리-i-프로폭시 실란, 메틸 트리부톡시 실란, n-프로필 트리메톡시 실란, n-프로필 트리에톡시 실란, n-부틸 트리메톡시 실란, n-부틸 트리에톡시 실란, n-헥실 트리메톡시 실란, n-헥실 트리에톡시 실란, 페닐 트리메톡시 실란, 페닐 트리에톡시 실란 등이 있으며 이에 제한되지 않는다. 이들 가수 분해성 실란 화합물 중 경화막의 경도 관점에서는 3관능성 실란 및 4관능성 실란을 사용하는 것이 바람직하다. Examples of the hydrolyzable silane compound according to the present invention represented by Chemical Formula 1 include tetramethoxy silane, tetraethoxy silane, tetraacetoxy silane, tetra phenoxy silane, methyl trimethoxy silane, methyl triethoxy silane, Ethyl tri-i-propoxy silane, methyl tributoxy silane, n-propyl trimethoxy silane, n-propyl triethoxy silane, n-butyl trimethoxy silane, n-butyl triethoxy silane, n-hexyl Trimethoxy silane, n-hexyl triethoxy silane, phenyl trimethoxy silane, phenyl triethoxy silane and the like. It is preferable to use trifunctional silane and tetrafunctional silane from a hardness viewpoint of a cured film among these hydrolyzable silane compounds.

상기 (a2) 벤질 알코올 또는 벤질 에테르는 하기의 화학식 2로 표시되는 화합물인 것이 바람직하다. The benzyl alcohol or benzyl ether (a2) is preferably a compound represented by the following formula (2).

[화학식 2][Formula 2]

Figure PCTKR2015005950-appb-I000001
또는
Figure PCTKR2015005950-appb-I000002
Figure PCTKR2015005950-appb-I000001
or
Figure PCTKR2015005950-appb-I000002

[상기 화학식 2의 R은, 탄소수 1~4의 알킬기 또는 수소 원자이고, R'는 수소원자 또는 탄소수 1~10의 알킬기이며, X는 수소 원자나 OH기이며, Y는 수소원자, 메틸 또는 트리플로오르메틸이다.] [R in Formula 2 is an alkyl group or hydrogen atom having 1 to 4 carbon atoms, R 'is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, X is a hydrogen atom or an OH group, Y is a hydrogen atom, methyl or triple Orormethyl.]

화학식 2로 표시되는 벤질 화합물로서는, R은 수소 원자, 메틸, 에틸, 프로필, n-부틸기 중의 하나이며, R'는 수소 원자, 메틸, 에틸, t-부틸 중의 하나이다. 즉 1,2-벤젠디메탄올, 1,3-벤젠디메탄올, 1,4-벤젠디메탄올, 2,6-비스(히드록시메틸)-p-크레졸, 1,4-비스(메톡시메틸)벤젠, 4,4'-아이소프로필리덴비스 (2,6-디히드록시메틸페놀), 4,4-아이소프로필리덴비스 (2,6-디메톡시메틸페놀) 등의 벤질 화합물이며, 사용량은 전체 모노머 사용량의 3~30중량%이다. As the benzyl compound represented by the formula (2), R is one of a hydrogen atom, methyl, ethyl, propyl, and n-butyl group, and R 'is one of a hydrogen atom, methyl, ethyl and t-butyl. 1,2-benzenedimethanol, 1,3-benzenedimethanol, 1,4-benzenedimethanol, 2,6-bis (hydroxymethyl) -p-cresol, 1,4-bis (methoxymethyl) Benzyl compounds, such as benzene, 4,4'-isopropylidenebis (2,6-dihydroxymethylphenol), and 4,4-isopropylidenebis (2,6-dimethoxymethylphenol), and are used altogether It is 3-30 weight% of monomer usage.

본 발명에서 용어, "가수분해성 실란 화합물"이란 통상, 무촉매, 과잉의 물의 공존하, 실온(약 25℃) 내지 약 100℃의 온도 범위 내에서 가열함으로써, 가수분해하여 실란올기를 생성할 수 있는 기 또는 실록산 축합물을 형성할 수 있는 기를 갖는 화합물을 가리킨다.As used herein, the term “hydrolyzable silane compound” is usually hydrolyzed to produce a silanol group by heating in a temperature range of room temperature (about 25 ° C.) to about 100 ° C. in the absence of a catalyst and excess water. It refers to a compound having an existing group or a group capable of forming a siloxane condensate.

바람직하게는, 상기 화학식 1로 나타나는 실록산 모노머 및 화학식 2로 나타나는 벤질 알코올 또는 벤질 에테르는 가수분해 및 축합 중합에 의하여 본 발명의 (A)실록산 폴리머가 생성될 수 있는데, 바람직하게는 (a1) 실란 화합물을, 화합물 (a1) 및 화합물 (a2) 전체 중량 대비 70중량% 내지 97중량%, (a2) 벤질 알코올 또는 벤질 에테르는, 화합물 (a1) 및 화합물 (a2) 전체 중량 대비 3중량% 내지 30중량%를 가수분해 및 축합 중합하여 "(A)실록산 폴리머"를 제조할 수 있다. Preferably, the siloxane monomer represented by Formula 1 and the benzyl alcohol or benzyl ether represented by Formula 2 may produce the (A) siloxane polymer of the present invention by hydrolysis and condensation polymerization, preferably (a1) silane 70 wt% to 97 wt% of the total weight of the compound (a1) and the compound (a2), and (a2) benzyl alcohol or benzyl ether, 3 wt% to 30 wt.% Of the total weight of the compound (a1) and the compound (a2). By weight hydrolysis and condensation polymerization can be made "(A) siloxane polymer".

상기와 같이, (A)실록산 폴리머 제조시 사용되는 (a1) 및 (a2)의 사용량을 조절함으로써 우수한 경도 및 투명성이 있는 층간 절연막 제조가 가능한 실록산 폴리머를 제조할 수 있다. 본 발명의 일 실시예에서는 (a1) 및/또는 (a2)의 중량비를 달리하여 (A)실록산 폴리머를 제조하였다. 그 결과, (a2)벤질성 화합물의 사용량이 30중량%를 초과할 경우, 제조되는 층간 절연막의 투명성이 저하되며, 3중량% 내지 30중량%인 경우에는, 우수한 경도 및 투명성이 있는 층간 절연막의 제조가 가능하다는 것일 확인하였다. 따라서, (A)실록산 폴리머 제조시, 실록산 모노머 (a1) 화합물은 70중량% 내지 97중량%, 벤질성 화합물 (a2)는 3중량% 내지 30중량%를 사용하는 것이 바람직하다. As described above, by adjusting the amounts of (a1) and (a2) used in the production of the (A) siloxane polymer, a siloxane polymer capable of producing an interlayer insulating film having excellent hardness and transparency can be produced. In one embodiment of the present invention (A) siloxane polymer was prepared by varying the weight ratio of (a1) and / or (a2). As a result, when the amount of the (a2) benzyl compound to be used exceeds 30% by weight, the transparency of the interlayer insulating film to be produced decreases, and when it is 3% by weight to 30% by weight, the interlayer insulating film having excellent hardness and transparency It was confirmed that manufacturing is possible. Therefore, it is preferable to use 70 to 97 weight% of siloxane monomer (a1) compounds, and 3 to 30 weight% of benzyl compounds (a2) at the time of preparation of (A) siloxane polymer.

상기 가수 분해 중합에 사용할 수 있는 용제는 특별히 제한되지 않는다. 통상적으로 포지티브형 감광성 조성물에 사용되는 용제이면 제한없이 사용할 수 있다. 바람직하게는, 에테르류노는 테트라하이드로푸란, 디에틸렌글리콜류로서는 디에틸렌글리콜모노메틸 에테르, 디에틸렌글리콜 모노에틸 에테르, 디에틸렌글리콜 디메틸에테르, 디에틸렌글리콜 디에틸에테르, 디에틸렌글리콜 에틸메틸 에테르, 에테르아세테이트류로는 에틸렌글리콜 모노알킬에테르 아세테이트, 프로필렌글리콜 모노알킬에테르 아세테이트 등의 에테르류 등과 메틸에틸 케톤 등의 케톤류 및 다양한 에스테르류 등이 사용 가능하다. 또한 방향족 탄화수소류로는 톨루엔 및 자일렌 등을 사용할 수 있다. The solvent which can be used for the said hydrolysis polymerization is not specifically limited. Usually, as long as it is a solvent used for a positive photosensitive composition, it can use without a restriction. Preferably, etheryuno is tetrahydrofuran, diethylene glycol is diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethylmethyl ether, As the ether acetates, ethers such as ethylene glycol monoalkyl ether acetate and propylene glycol monoalkyl ether acetate, ketones such as methyl ethyl ketone and various esters can be used. Moreover, toluene, xylene, etc. can be used as aromatic hydrocarbons.

상기 가수 분해 축합에 이용되는 물은, 역침투막 처리, 이온 교환 처리, 증류 등의 방법에 의해 정제된 물을 사용하는 것이 바람직하다. 이러한 정제수를 이용함으로써, 부(副) 반응을 억제하여, 가수 분해의 반응성을 향상시킬 수 있다. 물의 사용량은, 상기 화학식 1로 나타나는 가수 분해성 실란 화합물의 가수 분해성 기의 합계량 1몰에 대하여, 바람직하게는 0.1∼3몰, 보다 바람직하게는 0.3∼2몰, 더욱 바람직하게는 0.5∼1.5몰의 양이다. 이러한 양의 물을 이용함으로써, 가수 분해ㅇ축합의 반응 속도를 최적화할 수 있다.As water used for the hydrolysis condensation, it is preferable to use water purified by a method such as reverse osmosis membrane treatment, ion exchange treatment, distillation or the like. By using such purified water, a side reaction can be suppressed and the reactivity of hydrolysis can be improved. The amount of water to be used is preferably 0.1 to 3 moles, more preferably 0.3 to 2 moles, even more preferably 0.5 to 1.5 moles with respect to 1 mole of the total amount of the hydrolyzable groups of the hydrolyzable silane compound represented by the formula (1). Amount. By using this amount of water, the reaction rate of hydrolysis-condensation can be optimized.

상기 본 발명에 따른 (A)실록산 폴리머 제조를 위한 (a1)실란 화합물 및 (a2)벤질 알코올 또는 벤질 에테르의 가수 분해 및 축합 반응은, 바람직하게는 산 촉매 하에서 수행될 수 있다. 상기 촉매는, 루이스 산이면 모두 사용 가능하다. 루이스 산으로서는, 염산, 황산, 질산, 포름산, 옥살산, 아세트산, 트리플로오르 아세트산, 트리플로오르 술폰산, 톨루엔 술폰산, 인산 등 모든 루이스산 등을 사용할 수 있다. The hydrolysis and condensation reaction of the (a) silane compound and the (a2) benzyl alcohol or benzyl ether for preparing the (A) siloxane polymer according to the present invention may be preferably performed under an acid catalyst. As long as the said catalyst is a Lewis acid, all can be used. As the Lewis acid, any Lewis acid such as hydrochloric acid, sulfuric acid, nitric acid, formic acid, oxalic acid, acetic acid, trifluoro acetic acid, trifluoro sulfonic acid, toluene sulfonic acid, phosphoric acid and the like can be used.

상기 본 발명에 따른 (A)실록산 폴리머 제조를 위한 가수 분해 축합에 있어서의 반응 온도 및 반응 시간은, 적절히 설정할 수 있다. 예를 들면, 하기의 조건을 채용할 수 있다. 반응 온도는, 바람직하게는 40∼200℃, 보다 바람직하게는 50∼150℃이다. 반응 시간은, 바람직하게는 30분∼24시간, 보다 바람직하게는 1∼12시간이다. 이러한 반응 온도 및 반응 시간 하에서 가수 분해 축합 반응을 효율적으로 행할 수 있다. 이 가수 분해 축합에 있어서는, 반응계 내에 가수 분해성 실란 화합물, 물 및 촉매를 한 번에 첨가하여 반응을 한 단계에서 수행할 수도 있고, 가수 분해성 실란 화합물, 물 및 촉매를, 수회로 나누어 반응계 내에 첨가함으로써, 가수 분해 축합 반응을 다단계로 수행할 수도 있다. 또한, 가수 분해 축합 반응의 후에는, 탈수제를 가하고, 이어서 이배퍼레이션에 가함으로써, 물 및 생성된 알코올을 반응계로부터 제거할 수 있다. The reaction temperature and reaction time in hydrolysis condensation for production of the (A) siloxane polymer according to the present invention can be appropriately set. For example, the following conditions can be adopted. Reaction temperature becomes like this. Preferably it is 40-200 degreeC, More preferably, it is 50-150 degreeC. The reaction time is preferably 30 minutes to 24 hours, more preferably 1 to 12 hours. Hydrolysis condensation reaction can be performed efficiently under such reaction temperature and reaction time. In this hydrolysis condensation, the hydrolyzable silane compound, water, and catalyst may be added to the reaction system at one time, and the reaction may be performed in one step. The hydrolyzable silane compound, water, and catalyst may be added in several times in the reaction system. The hydrolysis condensation reaction may be carried out in multiple stages. After the hydrolytic condensation reaction, water and the resulting alcohol can be removed from the reaction system by adding a dehydrating agent and then adding to the evaporation.

상기 본 발명에 따른 가수 분해성 실란 화합물의 가수 분해 축합물인 (A)실록산 폴리머의 분자량은, 이동상(相)에 테트라하이드로 푸란을 사용한 GPC(겔 투과 크로마토그래피)를 이용하여, 폴리스티렌 환산의 수 평균 분자량으로서 측정할 수 있다. 그리고, 가수 분해 축합물의 수 평균 분자량은, 통상 1,000∼40,000의 범위 내의 값으로 하는 것이 바람직하다. 가수 분해 축합물의 수 평균 분자량의 값을 1,000 이상으로 함으로써, 포지티브형 감방사선성 조성물의 도막의 성막성을 개선할 수 있다. 한편, 가수 분해 축합물의 수 평균 분자량의 값을 40,000 이하로 함으로써, 포지티브형 감방사선성 조성물의 감방사선성의 저하를 방지할 수 있다.The molecular weight of the (A) siloxane polymer which is the hydrolysis-condensation product of the hydrolyzable silane compound which concerns on this invention is the number average molecular weight of polystyrene conversion using GPC (gel permeation chromatography) which used tetrahydrofuran for the mobile phase. It can be measured as. And it is preferable to make the number average molecular weight of a hydrolysis-condensation product into the value within the range of 1,000-40,000 normally. When the value of the number average molecular weight of a hydrolysis-condensation product is 1,000 or more, the film-forming property of the coating film of a positive radiation sensitive composition can be improved. On the other hand, by making the value of the number average molecular weight of a hydrolysis-condensation product into 40,000 or less, the radiation-sensitive fall of a positive radiation sensitive composition can be prevented.

<(B) 성분: 용제><(B) component: A solvent>

(B) 성분은, 용제이다. 특별히 한정되지 않지만, 특히 프로톤성 용제인 알코올계 용제를 함유하는 것이 바람직하다. 알코올계 용제를 이용함으로써, 각 성분을 균일하게 용해 또는 분산할 수 있고, 이에 따라 조성물 용액의 대형 기판으로의 도공성 향상을 가능하게 하며, 또한 도포 얼룩(줄무늬 형상 얼룩, 핀 흔적 얼룩, 안개 얼룩 등)의 발생을 억제하여, 막두께 균일성을 보다 한층 향상할 수 있다.(B) component is a solvent. Although it does not specifically limit, It is preferable to contain the alcohol solvent which is especially a protic solvent. By using an alcoholic solvent, each component can be dissolved or dispersed uniformly, thereby making it possible to improve the coatability of the composition solution to a large substrate, and also to apply coating stains (stripe-shaped stains, pin trace stains, mist stains). Etc.) can be suppressed and the film thickness uniformity can be further improved.

이러한 알코올계 용제로서는, 1-헥산올, 1-옥탄올, 1-노난올, 1-도데칸올, 1,6-헥산디올, 1,8-옥탄디올 등의 장쇄 알킬알코올류; 벤질알코올 등의 방향족 알코올류; 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노에틸에테르, 에틸렌글리콜모노프로필에테르, 에틸렌글리콜모노부틸에테르 등의 에틸렌글리콜모노알킬에테르류; 프로필렌글리콜모노메틸에테르, 프로필렌글리콜모노에틸에테르, 프로필렌글리콜모노프로필에테르, 프로필렌글리콜모노부틸에테르 등의 프로필렌글리콜모노알킬에테르류; 디에틸렌글리콜모노메틸에테르, 디에틸렌글리콜모노에틸에테르 등의 디에틸렌글리콜모노알킬에테르류; 디프로필렌글리콜모노메틸에테르, 디프로필렌글리콜모노에틸에테르, 디프로필렌글리콜모노프로필에테르, 디프로필렌글리콜모노부틸에테르 등의 디프로필렌글리콜모노알킬에테르류 등을 들 수 있다. 이들 알코올계 용제는, 단독으로 또는 2종 이상 병용하여 사용할 수 있다. Examples of such alcohol solvents include long-chain alkyl alcohols such as 1-hexanol, 1-octanol, 1-nonanol, 1-dodecanol, 1,6-hexanediol, and 1,8-octanediol; Aromatic alcohols such as benzyl alcohol; Ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; Propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; Diethylene glycol monoalkyl ethers such as diethylene glycol monomethyl ether and diethylene glycol monoethyl ether; Dipropylene glycol monoalkyl ethers such as dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, and the like. These alcohol solvents can be used individually or in combination of 2 or more types.

이들 알코올계 용제 중, 특히 도공성 향상의 관점에서, 벤질알코올, 에틸렌글리콜모노프로필에테르, 에틸렌글리콜모노부틸에테르, 프로필렌글리콜모노메틸에테르, 프로필렌글리콜모노에틸에테르가 바람직하다.Among these alcohol solvents, benzyl alcohol, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether are particularly preferable from the viewpoint of improving coating properties.

(B)성분은, 1종을 단독으로 사용해도 좋고, 2종 이상을 혼합하여 사용해도 좋다.(B) A component may be used individually by 1 type and may mix and use 2 or more types.

(B) 성분의 사용량은, (A) 성분 100질량부에 대하여, 바람직하게는 5질량부 내지 300질량부, 더욱 바람직하게는 10질량부 내지 200질량부이다. (B) 성분의 사용량을 상기 범위 내로 함으로써, 유리 기판 등에 대한 도공성 향상을 가능하게 하고, 또한 도포 얼룩(줄무늬 형상 얼룩, 핀 흔적 얼룩, 안개 얼룩 등)의 발생을 억제하여, 막두께 균일성을 더욱 향상할 수 있다.The usage-amount of (B) component becomes like this. Preferably it is 5 mass parts-300 mass parts, More preferably, it is 10 mass parts-200 mass parts with respect to 100 mass parts of (A) component. By making the usage-amount of (B) component into the said range, coating property improvement with respect to a glass substrate etc. is attained, the generation | occurrence | production of application | coating stain (stripe-shaped stain, pin trace stain, fog stain, etc.) is suppressed, and film thickness uniformity Can be further improved.

본 발명에 있어서는, 알코올계 용제와 함께, 기타 용제, 예를 들면 에테르류, 디에틸렌글리콜알킬에테르류, 에틸렌글리콜알킬에테르아세테이트류, 프로필렌글리콜모노알킬에테르프로피오네이트류, 방향족 탄화 수소류, 케톤류, 에스테르류 등을 들 수 있다.In the present invention, along with the alcohol solvent, other solvents, for example, ethers, diethylene glycol alkyl ethers, ethylene glycol alkyl ether acetates, propylene glycol monoalkyl ether propionates, aromatic hydrocarbons, ketones And esters.

알코올계 용제 이외의 용제로서는, 다음의 것을 들 수 있다.As a solvent other than the alcohol solvent, the following may be mentioned.

에테르류로서, 예를 들면 테트라하이드로푸란 등; 디에틸렌글리콜알킬에테르류로서, 예를 들면 디에틸렌글리콜디메틸에테르, 디에틸렌글리콜디에틸에테르, 디에틸렌글리콜에틸메틸에테르 등; 에틸렌글리콜알킬에테르아세테이트류로서, 예를 들면 메틸셀로솔브아세테이트, 에틸셀로솔브아세테이트, 에틸렌글리콜모노부틸에테르아세테이트, 에틸렌글리콜모노에틸에테르아세테이트 등; 프로필렌글리콜모노알킬에테르아세테이트류로서, 예를 들면 프로필렌글리콜모노메틸에테르아세테이트, 프로필렌글리콜모노에틸에테르아세테이트, 프로필렌글리콜모노프로필에테르아세테이트, 프로필렌글리콜모노부틸에테르아세테이트 등; 프로필렌글리콜모노알킬에테르프로피오네이트류로서, 예를 들면 프로필렌글리콜모노메틸에테르프로피오네이트, 프로필렌글리콜모노에틸에테르프로피오네이트, 프로필렌글리콜모노프로필에테르프로피오네이트, 프로필렌글리콜모노부틸에테르프로피오네이트 등; 방향족 탄화 수소류로서, 예를 들면 톨루엔, 자일렌 등; 케톤류로서, 예를 들면 메틸에틸케톤, 메틸이소부틸케톤, 사이클로헥산온, 2-헵탄온, 4-하이드록시-4-메틸-2-펜As ethers, For example, tetrahydrofuran etc .; As diethylene glycol alkyl ether, For example, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, etc .; As ethylene glycol alkyl ether acetates, For example, methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monoethyl ether acetate, etc .; As propylene glycol monoalkyl ether acetates, For example, propylene glycol monomethyl ether acetate, a propylene glycol monoethyl ether acetate, a propylene glycol monopropyl ether acetate, a propylene glycol monobutyl ether acetate, etc .; As propylene glycol monoalkyl ether propionates, a propylene glycol monomethyl ether propionate, a propylene glycol monoethyl ether propionate, a propylene glycol monopropyl ether propionate, a propylene glycol monobutyl ether propionate, etc. are mentioned, for example. ; As aromatic hydrocarbons, For example, toluene, xylene, etc .; As ketones, for example, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 2-heptanone, 4-hydroxy-4-methyl-2-phene

탄온 등; 에스테르류로서, 예를 들면, 아세트산 메틸, 아세트산 에틸, 아세트산 프로필, 아세트산 i-프로필, 아세트산 부틸, 2-하이드록시프로피온산 에틸, 2-하이드록시-2-메틸프로피온산 메틸, 2-하이드록시-2-메틸프로피온산 에틸, 하이드록시아세트산 메틸, 하이드록시아세트산 에틸, 하이드록시아세트산 부틸, 락트산 메틸, 락트산 에틸, 락트산 프로필, 락트산 부틸, 3-하이드록시프로피온산 메틸, 3-하이드록시프로피온산 에틸, 3-하이드록시프로피온산 프로필, 3-하이드록시프로피온산 부틸, 2-하이드록시-3-메틸부탄산 메틸, 메톡시아세트산 메틸, 메톡시아세트산 에틸, 메톡시아세트산 프로필, 메톡시아세트산 부틸, 에톡시아세트산 메틸, 에톡시아세트산 에틸, 에톡시아세트산 프로필, 에톡시아세트산 부틸, 프로폭시아세트산 메틸, 프로폭시아세트산 에틸, 프로폭시아세트산 프로필, 프로폭시아세트산 부틸, 부톡시아세트산 메틸, 부톡시아세트산 에틸, 부톡시아세트산 프로필, 부톡시아세트산 부틸, 2-메톡시프로피온산 메틸, 2-메톡시프로피온산 에틸, 2-메톡시프로피온산 프로필, 2-메톡시프로피온산 부틸, 2-에톡시프로피온산 메틸, 2-에톡시프로피온산 에틸 등을 각각 들 수 있다. 이들 용제는, 단독으로 또는 2종 이상을 혼합하여 이용할 수 있다.Tan temperature and the like; As esters, for example, methyl acetate, ethyl acetate, propyl acetate, i-propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, 2-hydroxy-2- Ethyl methyl propionate, methyl hydroxyacetic acid, ethyl hydroxyacetic acid, hydroxyacetic acid butyl, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, 3-hydroxypropionic acid methyl, 3-hydroxypropionic acid, 3-hydroxypropionic acid Propyl, butyl 3-hydroxypropionate, methyl 2-hydroxy-3-methylbutanoic acid, methyl methoxyacetic acid, ethyl methoxyacetic acid, methoxyacetic acid propyl, methoxyacetic acid butyl, ethoxyacetic acid methyl, ethoxyacetic acid ethyl Propyl ethoxyacetic acid, butyl ethoxyacetic acid, methyl propoxyacetate, ethyl propoxyacetate, Lopoxyacetic acid propyl, butyl propoxyacetic acid, methyl butoxyacetic acid, ethyl butoxyacetate, butoxyacetic acid propyl, butyl butoxyacetic acid, 2-methoxypropionate methyl, 2-methoxypropionic acid propyl, 2-methoxypropionic acid propyl And butyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, and the like. These solvents can be used individually or in mixture of 2 or more types.

본 발명의 폴리실록산 조성물은, 추가로 다음의 성분을 함유할 수 있다. The polysiloxane composition of this invention can contain the following component further.

<(C)성분: 열산 발생제 또는 열염기 발생제><(C) component: A thermal acid generator or a thermal base generator>

열산 발생제 또는 열염기 발생제는, 본 발명에 따른 (A)실록산 폴리머를 제조함에 있어서, (a1)화합물과 (a2)화합물의 가수 분해 축합ㅇ경화 반응시의 촉매로서 작용하는 산성 활성 물질 또는 염기성 활성 물질을 방출할 수 있는 화합물로 정의된다. 이러한 (C)성분의 화합물을 이용함으로써, 포지티브형 감방사선성 조성물의 현상 후의 가열 공정에 있어서의 성분의 축합 반응이 촉진될 수 있어, 표면 경도 및 내열성이 우수한 층간 절연막을 형성할 수 있다. 또한, (C)성분의 열산 발생제 또는 열염기 발생제로서는, 포지티브형 감방사선성 조성물의 도막 형성 공정에 있어서의 비교적 저온(예를 들면 70∼120℃)의 프리베이킹 (pre-baking) 시에는 산성 활성 물질 또는 염기성 활성 물질을 방출하지 않고, 현상 후의 가열 공정에 있어서의 비교적 고온(예를 들면 120∼250℃)의 포스트베이킹 (post-baking) 시에 산성 활성 물질 또는 염기성 활성 물질을 방출하는 성질을 갖는 것이 바람직하다.The thermal acid generator or the thermal base generator is an acidic active substance which acts as a catalyst in the hydrolytic condensation-curing reaction of the compound (a1) and the compound (a2) in preparing the (A) siloxane polymer according to the present invention. It is defined as a compound capable of releasing basic active substances. By using the compound of (C) component, the condensation reaction of the component in the heating process after image development of a positive radiation sensitive composition can be accelerated | stimulated, and the interlayer insulation film excellent in surface hardness and heat resistance can be formed. In addition, as a thermal acid generator or a thermal base generator of (C) component, at the time of prebaking at comparatively low temperature (for example, 70-120 degreeC) in the coating film formation process of a positive radiation sensitive composition. Does not release the acidic active substance or the basic active substance, but releases the acidic active substance or the basic active substance upon post-baking at a relatively high temperature (for example, 120 to 250 ° C.) in a heating step after development. It is preferable to have the property to make.

(C)성분의 열산 발생제에는, 이온성 화합물 및 비이온성 화합물이 포함된다. 이온성 화합물로서는, 중금속, 할로겐 이온을 포함하지 않는 것이 바람직하다. 이온성의 감열성 산 발생제의 예로서는, 트리페닐술포늄, 1―디메틸티오나프탈렌, 1―디메틸티오―4―하이드록시나프탈렌, 1―디메틸티오―4,7―디하이드록시나프탈렌, 4―하이드록시페닐디메틸술포늄, 벤질―4―하이드록시페닐메틸술포늄, 2―메틸벤질―4―하이드록시페닐메틸술포늄, 2―메틸벤질―4―아세틸페닐메틸술포늄, 2―메틸벤질―4―벤조일옥시페닐메틸술포늄 등의 메탄술폰산염, 트리플루오로메탄술폰산염, 캄퍼술폰산염, p―톨루엔술폰산염, 헥사플루오로포스폰산염 등을 들 수 있다. 비이온성의 감열성 산 발생제의 예로서는, 할로겐 함유 화합물, 디아조메탄 화합물, 술폰 화합물, 술폰산 에스테르 화합물, 카본산 에스테르 화합물, 인산 에스테르 화합물, 술폰이미드 화합물, 술폰벤조트리아졸 화합물 등을 들 수 있다. 할로겐 함유 화합물의 예로서는, 할로알킬기 함유 탄화 수소 화합물, 할로알킬기 함유 헤테로 환상 화합물 등을 들 수 있다. 바람직한 할로겐 함유 화합물의 예로서는, 1,1―비스(4―클로로페닐)―2,2,2―트리클로로에탄, 2―페닐―4,6―비스(트리클로로메틸)―s―트리아진, 2―나프틸―4,6―비스(트리클로로메틸)―s―트리아진 등을 들 수 있다. 디아조메탄 화합물의 예로서는, 비스(트리플루오로메틸술포닐)디아조메탄, 비스(사이클로헥실술포닐)디아조메탄, 비스(페닐술포닐)디아조메탄, 비스(p―톨릴술포닐)디아조메탄, 비스(2,4―크시릴술포닐)디아조메탄, 비스(p―클로로페닐술포닐)디아조메탄, 틸술포닐―p―톨루엔술포닐디아조메탄,An ionic compound and a nonionic compound are contained in the thermal acid generator of (C) component. As an ionic compound, it is preferable that heavy metal and no halogen ion are included. Examples of the ionic thermosensitive acid generator include triphenylsulfonium, 1-dimethylthionaphthalene, 1-dimethylthio-4-hydroxynaphthalene, 1-dimethylthio-4,7-dihydroxynaphthalene and 4-hydroxy Phenyldimethylsulfonium, benzyl 4-hydroxyphenylmethylsulfonium, 2-methylbenzyl 4-hydroxyphenylmethylsulfonium, 2-methylbenzyl-4-acetylphenylmethylsulfonium, 2-methylbenzyl-4 Methane sulfonate, trifluoromethane sulfonate, camphor sulfonate, p-toluene sulfonate, hexafluoro phosphonate, etc., such as benzoyloxyphenyl methyl sulfonium, are mentioned. Examples of the nonionic thermosensitive acid generator include halogen-containing compounds, diazomethane compounds, sulfone compounds, sulfonic acid ester compounds, carboxylic acid ester compounds, phosphate ester compounds, sulfonimide compounds, sulfone benzotriazole compounds, and the like. have. As an example of a halogen containing compound, a haloalkyl group containing hydrocarbon compound, a haloalkyl group containing heterocyclic compound, etc. are mentioned. Examples of preferred halogen-containing compounds include 1,1-bis (4-chlorophenyl) -2,2,2-trichloroethane, 2-phenyl-4,6-bis (trichloromethyl) -s-triazine, 2 -Naphthyl-4,6-bis (trichloromethyl) -s-triazine, etc. are mentioned. Examples of diazomethane compounds include bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane and bis (p-tolylsulfonyl) dia Crude methane, bis (2,4-xyrylsulfonyl) diazomethane, bis (p-chlorophenylsulfonyl) diazomethane, tilsulfonyl-p-toluenesulfonyldiazomethane,

사이클로헥실술포닐(1,1―디메틸에틸술포닐)디아조메탄, 스(1,1―디메틸에틸술포닐)디아조메탄, 페닐술포닐(벤조일)디아조메탄 등을 들 수 있다. 술폰 화합물의 예로서는, β―케토술폰 화합물, β―술포닐술폰 화합물, 디아릴디술폰 화합물 등을 들 수 있다. 바람직한 술폰 화합물의 예로서는, 4―트리스펜아실술폰, 메시틸펜아실술폰, 비스(페닐술포닐)메탄, 4―클로로페닐―4―메틸페닐디술폰 화합물 등을 들 수 있다. 술폰산 에스테르 화합물의 예로서는, 알킬술폰산 에스테르, 할로알킬술폰산 에스테르, 아릴술폰산 에스테르, 이미노술포네이트 등을 들 수 있다. 바람직한 술폰산 에스테르 화합물의 예로서는, 벤조인토실레이트, 피로갈롤트리메실레이트, 니트로벤질―9,10―디에톡시안트라센―2―술포네이트, 2,6―디니트로벤질벤젠술포네이트 등을 들 수 있다. 카본산 에스테르 화합물의 예로서는, 카본산 o―니트로벤질에스테르를 들 수 있다. Cyclohexylsulfonyl (1,1-dimethylethylsulfonyl) diazomethane, s (1,1-dimethylethylsulfonyl) diazomethane, phenylsulfonyl (benzoyl) diazomethane, and the like. As an example of a sulfone compound, the (beta) -keto sulfone compound, the (beta) -sulfonyl sulfone compound, a diaryl disulfone compound, etc. are mentioned. As an example of a preferable sulfone compound, 4-trisphenacyl sulfone, mesityl penacyl sulfone, bis (phenylsulfonyl) methane, 4-chlorophenyl- 4-methylphenyl disulfone compound, etc. are mentioned. As an example of a sulfonic acid ester compound, an alkyl sulfonic acid ester, a haloalkyl sulfonic acid ester, an aryl sulfonic acid ester, an imino sulfonate, etc. are mentioned. Examples of the preferable sulfonic acid ester compound include benzointosylate, pyrogallol trimesylate, nitrobenzyl-9,10-diethoxyanthracene-2-sulfonate, 2,6-dinitrobenzylbenzenesulfonate, and the like. As an example of a carboxylic acid ester compound, carboxylic acid o-nitrobenzyl ester is mentioned.

(C)성분의 열염기 발생제의 예로서는, 코발트 등 천이 금속 착체, 오르토니트로벤질카바메이트류, α,α―디메틸―3,5―디메톡시벤질카바메이트류, 아실옥시이미노류 등을 들 수 있다. 천이 금속 착체의 예로서는, 브로모펜타암모니아코발트 과염소산염, 브로모펜타메틸아민코발트 과염소산염, 브로모펜타프로필아민코발트 과염소산염, 헥사암모니아코발트 과염소산염, 헥사메틸아민코발트 과염소산염, 헥사프로필아민코발트 과염소산염 등을 들 수 있다. 아실옥시이미노류의 예로서는, 프로피오닐아세토페논옥심, 프로피오닐벤조페논옥심, 프로피오닐아세톤옥심, 부티릴아세토페논옥심, 부티릴벤조페논옥심, 부티릴아세톤옥심, 아디포일아세토페논옥심, 아디포일벤조페논옥심, 아디포일아세톤옥심, 아크로일아세토페논옥심, 아크로일벤조페논옥심, 아크로일아세톤옥심 등을 들 수 있다. 감열성 염기 발생제의 그 외의 예로서는, 2―니트로벤질사이클로헥실카바메이트, O―카바모일하이드록시아미드를 들 수 있다. Examples of the thermal base generator of component (C) include transition metal complexes such as cobalt, orthonitrobenzylcarbamates, α, α-dimethyl-3,5-dimethoxybenzylcarbamates, acyloxyiminos, and the like. have. Examples of the transition metal complex include bromopentaammonium cobalt perchlorate, bromopentamethylamine cobalt perchlorate, bromopentapropylamine cobalt perchlorate, hexaammonia cobalt perchlorate, hexamethylamine cobalt perchlorate, hexapropylamine cobalt perchlorate Salts; and the like. Examples of acyloxyiminos include propionylacetophenone oxime, propionylbenzophenone oxime, propionyl acetone oxime, butyryl acetophenone oxime, butyryl benzophenone oxime, butyryl acetone oxime, adipoyl acetophenone oxime, adipoylbenzo Phenone oxime, adipoyl acetone oxime, acroyl acetophenone oxime, acroyl benzophenone oxime, acroyl acetone oxime and the like. Other examples of the thermosensitive base generator include 2-nitrobenzylcyclohexyl carbamate and O-carbamoylhydroxyamide.

그러나, 이에 제한되지 않으며 (C)성분의 열산 발생제 또는 열염기 발생제는, 산 혹은 염기 중 어느 것이 사용되며, 1종을 단독으로 사용해도 좋고, 2종 이상을 혼합하여 사용해도 좋다. (C)성분을 사용하는 경우의 양은, (A)성분 100질량부에 대하여, 바람직하게는 0.1질량부∼10질량부, 더욱 바람직하게는 1질량부∼5질량부이다. (C)성분의 사용량을 0.1질량부∼10질량부로 함으로써, 포지티브형 감방사선성 조성물의 방사선 감도를 최적화하여, 투명성을 유지하면서 표면 경도가 높은 층간 절연막을 형성할 수 있다.However, the present invention is not limited thereto, and either the acid or the base may be used as the thermal acid generator or the thermal base generator of the component (C), one type may be used alone, or two or more types may be mixed and used. The quantity in the case of using (C) component becomes like this. Preferably it is 0.1 mass part-10 mass parts, More preferably, it is 1 mass part-5 mass parts with respect to 100 mass parts of (A) component. By setting the usage-amount of (C) component to 0.1 mass part-10 mass parts, the interlayer insulation film with high surface hardness can be formed, optimizing the radiation sensitivity of a positive radiation sensitive composition, and maintaining transparency.

<경화막의 형성><Formation of Curing Film>

본 발명은 다른 관점에서, 본 발명의 폴리실록산 조성물로 형성되는 경화막 및 상기 경화막을 형성하는 방법을 제공한다. In another aspect, the present invention provides a cured film formed of the polysiloxane composition of the present invention and a method of forming the cured film.

본 발명에 따른 경화막은 하기의 공정을 포함하여 제조될 수 있다. The cured film which concerns on this invention can be manufactured including the following process.

(1) 기판에 본 발명의 폴리실록산 조성물을 원하는 두께로 코팅하는 코팅 공정,(1) a coating step of coating the substrate with the desired thickness of the polysiloxane composition of the present invention,

(2) 공정 (1)에서 도포된 코팅 기판을 프리베이킹하는 공정, (2) a step of prebaking the coated substrate applied in step (1),

(3) 공정 (2)에서 프리베이킹한 코팅 도막을 노광 및 현상하는 공정, (3) Process of exposing and developing coating coating film prebaked in process (2),

(4) 공정 (3)에서 현상된 도막을 포스트 베이킹하는 공정.(4) The process of post-baking the coating film developed by process (3).

본 발명에서 사용할 수 있는 기판의 재료로는 유리, 실리콘, 석영, 및 수지 등이 가능하다. 도포된 기판을 프리베이킹함으로써, 용제가 제거되며 도막이 형성된다. 도막에 패턴을 하기 위해서는 소정의 패턴을 갖는 포토마스크를 통하여 노광한다. 포토마스크를 통하여 어느 파장의 빛으로 노광한 후 불필요한 부분을 제거하여 패턴을 형성한다. 현상 공정에 사용되는 현상액으로는 알칼리 수용액이 바람직하다. 사용되는 알칼리 예로서는 수산화 나트륨, 수산화 칼륨, 탄산 나트륨, 암모니아, 테트라메틸 암모늄하이드록사이드, 테트라에틸 암모늄하이드록사이드 등이 사용될 수 있다. 현상이 완료된 후 패턴화된 박막을 가열하여 경화를 시키게 된다. 이러한 포스트베이킹은 보통 120도 이상 250도 이하에서 일정시간 진행된다. As a material of the substrate which can be used in the present invention, glass, silicon, quartz, resin, and the like can be used. By prebaking the applied substrate, the solvent is removed and a coating film is formed. In order to pattern a coating film, it exposes through the photomask which has a predetermined pattern. After exposure to light of a certain wavelength through the photomask, unnecessary portions are removed to form a pattern. As a developing solution used for a developing process, aqueous alkali solution is preferable. Examples of the alkali used may include sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, tetramethyl ammonium hydroxide, tetraethyl ammonium hydroxide and the like. After the development is completed, the patterned thin film is heated to cure. Such postbaking is usually conducted for a certain time at 120 degrees or more and 250 degrees or less.

감광성 조성물을 사용하여, 코팅, 프리베이크, 노광, 현상, 가열에 의해 패턴을 형성함으로써, 용이하게 미세 패턴을 갖는 표시소자용 층간 절연막을 형성할 수 있다. 또한 이렇게 형성된 층간 절연막은 경도, 내열성, 및 투명성이 우수한 층간 절연막이 형성된다. By using a photosensitive composition, by forming a pattern by coating, prebaking, exposure, development, and heating, an interlayer insulating film for display elements having a fine pattern can be easily formed. In addition, the interlayer insulation film thus formed is formed with an interlayer insulation film excellent in hardness, heat resistance, and transparency.

본 발명에서, "경화막"은 당해 실록산 폴리머 조성물을 이용하여 형성되는 열경화물의 총칭으로, 표시 소자의 경화막으로서는, 보호막, 층간 절연막 등을 들 수 있다.In the present invention, the "cured film" is a generic term for a thermoset formed by using the siloxane polymer composition, and examples of the cured film of the display element include a protective film, an interlayer insulating film, and the like.

본 발명에 따른 실록산 폴리머 조성물은, 투명성, 내찰상성이 우수한 경화막을 형성 가능한 점에서, 이러한 경화막은 높은 내찰상성 등이나 투명성을 요하는 기술 용도에 적용할 수 있어, 예를 들면 액정 표시 소자나 터치 패널 등의 각종 디바이스의 보호막, 층간 절연막 등으로서 적합하게 이용할 수 있다.Since the siloxane polymer composition which concerns on this invention can form the cured film excellent in transparency and scratch resistance, such a cured film can be applied to the technical use which requires high scratch resistance, etc. transparency, For example, a liquid crystal display element or a touch It can use suitably as a protective film, an interlayer insulation film, etc. of various devices, such as a panel.

경화막(보호막 또는 층간 절연막)Cured film (protective film or interlayer insulation film)

상기와 같이 본 발명의 폴리실록산 조성물로 형성된 경화막은, 하기의 실시예로부터도 명백해지듯이, 기판에 대한 표면 경도, 내열성, 투명성 특성이 우수하다. 그 때문에, 당해 경화막은, 액정 표시 소자의 터치 패널 등의 표시 소자용으로서 적합하게 이용될 수 있다. As mentioned above, the cured film formed from the polysiloxane composition of this invention is excellent in the surface hardness, heat resistance, and transparency characteristic with respect to a board | substrate, as also apparent from the following Example. Therefore, the said cured film can be used suitably for display elements, such as a touch panel of a liquid crystal display element.

본 발명에 의하면, 경도가 개선되면서도 내열성 및 투과율이 우수한 층간 절연막의 재료로 사용 가능한 실록산계 폴리머 조성물, 상기 실록산계 폴리머 조성물로부터 형성된 경화막, 층간 절연막, 그 층간 절연막의 형성방법을 제공할 수 있다. 따라서, 본 발명에 의하여 형성된 층간 절연막은 표시 소자용, 터치 패널 표시 소자의 보호막 등의 용도로도 적합하게 이용할 수 있다.According to the present invention, it is possible to provide a siloxane-based polymer composition which can be used as a material of an interlayer insulating film having improved hardness and excellent heat resistance and transmittance, a cured film formed from the siloxane-based polymer composition, an interlayer insulating film, and a method of forming the interlayer insulating film. . Therefore, the interlayer insulation film formed by this invention can be used suitably also for uses, such as a display film and a protective film of a touchscreen display element.

이하 첨부된 실시예를 들어 본 발명을 보다 상세히 설명한다. 그러나 이러한 실시예는 본 발명의 기술적 사상의 내용과 범위를 쉽게 설명하기 위한 예시일 뿐, 이에 의해 본 발명의 기술적 범위가 한정되거나 변경되는 것은 아니다. 또한, 이러한 예시에 기초하여 본 발명의 기술적 사상의 범위 안에서 다양한 변형과 변경이 가능함은 당업자에게는 당연할 것이다. Hereinafter, the present invention will be described in more detail with reference to the accompanying examples. However, such an embodiment is only an example for easily describing the content and scope of the technical idea of the present invention, whereby the technical scope of the present invention is not limited or changed. In addition, it will be apparent to those skilled in the art that various modifications and changes can be made within the scope of the present invention based on these examples.

(실시예)(Example)

이하에 합성예, 실시예를 나타내어, 본 발명을 더욱 구체적으로 설명하지만, 본 발명은 이하의 실시예에 한정되는 것은 아니다.Although a synthesis example and an Example are shown to the following and this invention is demonstrated to it further more concretely, this invention is not limited to a following example.

이하의 각 합성예로부터 얻어진 가수분해성 실란 화합물의 가수분해 축합물의 중량 평균 분자량(Mw)은, 하기의 사양에 따른 겔 투과 크로마토그래피(GPC)에 의해 측정했다.The weight average molecular weight (Mw) of the hydrolysis-condensation product of the hydrolyzable silane compound obtained from each synthesis example below was measured by the gel permeation chromatography (GPC) according to the following specification.

장치 : GPC Waters e2695Device: GPC Waters e2695

칼럼 : GPC-KF-801, GPC-KF-802, GPC-KF-803 및 GPC-KF-804(쇼와덴코 가부시키가이샤 제조)를 연결한 것Column: GPC-KF-801, GPC-KF-802, GPC-KF-803 and GPC-KF-804 (manufactured by Showa Denko KK)

이동상 : 테트라하이드로푸란Mobile phase: tetrahydrofuran

[A] 성분인 폴리실록산의 합성예Synthesis Example of Polysiloxane as Component [A]

합성예 1Synthesis Example 1

페닐트리에톡시 실란 25중량%, 메틸트리에톡시실란 35중량%, 테트라에톡시실란 25중량%, 4,4'-아이소프로필리덴비스(2,6-디히드록시메틸페놀) 15 중량%을 넣고 테트로히드로푸란 용매 50 중량부를 환류냉각기가 설치된 반응기에 넣고 격렬히 교반하면서, 초순수물 20중량부%에 2중량%의 황산을 첨가한 용액을 반응기에 천천히 첨가하였다. 반응기를 12시간 환류한 후 냉각하였다 냉각된 반응 용액을 희석하여 GPC 분석을 실시한 결과 폴리스티렌 환산 중량 평균 분자량이 5,000인 폴리머를 제조하였다. 25% by weight of phenyltriethoxy silane, 35% by weight of methyltriethoxysilane, 25% by weight of tetraethoxysilane, 15% by weight of 4,4'-isopropylidenebis (2,6-dihydroxymethylphenol) 50 parts by weight of a tetrahydrofuran solvent was added to a reactor equipped with a reflux condenser, and vigorously stirred, a solution in which 2% by weight of sulfuric acid was added to 20 parts by weight of ultrapure water was slowly added to the reactor. The reactor was refluxed for 12 hours and then cooled. After diluting the cooled reaction solution, a polymer having a polystyrene reduced weight average molecular weight of 5,000 was prepared.

합성예2Synthesis Example 2

페닐트리에톡시 실란 35중량%, 메틸트리에톡시실란 35중량%, 테트라에톡시실란 25중량%, 4,4'-아이소프로필리덴비스(2,6-디히드록시메틸페놀) 5 중량%을 넣고 테트로히드로푸란 용매 50 중량부를 환류냉각기가 설치된 반응기에 넣고 격렬히 교반하면서, 초순수물 20중량부%에 2중량%의 황산을 첨가한 용액을 반응기에 천천히 첨가하였다. 반응기를 12시간 환류한 후 냉각하였다 냉각된 반응 용액을 희석하여 GPC 분석을 실시한 결과 폴리스티렌 환산 중량 평균 분자량이 3,500인 폴리머를 제조하였다. 35 wt% of phenyltriethoxy silane, 35 wt% of methyltriethoxysilane, 25 wt% of tetraethoxysilane, and 5 wt% of 4,4'-isopropylidenebis (2,6-dihydroxymethylphenol) 50 parts by weight of a tetrahydrofuran solvent was added to a reactor equipped with a reflux condenser, and vigorously stirred, a solution in which 2% by weight of sulfuric acid was added to 20 parts by weight of ultrapure water was slowly added to the reactor. The reactor was refluxed for 12 hours and then cooled. After diluting the cooled reaction solution, GPC analysis was conducted to prepare a polymer having a polystyrene reduced weight average molecular weight of 3,500.

합성예 3Synthesis Example 3

페닐트리에톡시 실란 35중량%, 메틸트리에톡시실란 35중량%, 테트라에톡시실란 25중량%, 1,4-비스(메톡시메틸)벤젠 5 중량%을 넣고 테트로히드로푸란 용매 50 중량부를 환류냉각기가 설치된 반응기에 넣고 격렬히 교반하면서, 초순수물 20중량부%에 2중량%의 황산을 첨가한 용액을 반응기에 천천히 첨가하였다. 반응기를 12시간 환류한 후 냉각하였다 냉각된 반응 용액을 희석하여 GPC 분석을 실시한 결과 폴리스티렌 환산 중량 평균 분자량이 7,500인 폴리머를 제조하였다. Add 35 wt% of phenyltriethoxy silane, 35 wt% of methyltriethoxysilane, 25 wt% of tetraethoxysilane, 5 wt% of 1,4-bis (methoxymethyl) benzene, and 50 wt parts of a tetrahydrofuran solvent. Into a reactor equipped with a reflux condenser, while vigorously stirring, a solution in which 2% by weight of sulfuric acid was added to 20 parts by weight of ultrapure water was slowly added to the reactor. The reactor was refluxed for 12 hours and then cooled. After diluting the cooled reaction solution, a polymer having a polystyrene reduced weight average molecular weight of 7,500 was prepared.

합성예 4Synthesis Example 4

페닐트리에톡시 실란 30중량%, 메틸트리에톡시실란 35중량%, 테트라에톡시실란 25중량%, 1,4-비스(메톡시메틸)벤젠 10 중량%을 넣고 테트로히드로푸란 용매 50 중량부를 환류냉각기가 설치된 반응기에 넣고 격렬히 교반하면서, 초순수물 20중량부%에 2중량%의 황산을 첨가한 용액을 반응기에 천천히 첨가하였다. 반응기를 12시간 환류한 후 냉각하였다 냉각된 반응 용액을 희석하여 GPC 분석을 실시한 결과 폴리스티렌 환산 중량 평균 분자량이 13,000인 폴리머를 제조하였다. 30 wt% of phenyltriethoxy silane, 35 wt% of methyltriethoxysilane, 25 wt% of tetraethoxysilane, 10 wt% of 1,4-bis (methoxymethyl) benzene, and 50 wt parts of a tetrahydrofuran solvent Into a reactor equipped with a reflux condenser, while vigorously stirring, a solution in which 2% by weight of sulfuric acid was added to 20 parts by weight of ultrapure water was slowly added to the reactor. The reactor was refluxed for 12 hours and then cooled. The cooled reaction solution was diluted to perform GPC analysis to prepare a polymer having a polystyrene reduced weight average molecular weight of 13,000.

합성예 5Synthesis Example 5

페닐트리에톡시 실란 25중량%, 메틸트리에톡시실란 35중량%, 테트라에톡시실란 25중량%, 1,4-벤젠디메탄올 15 중량%을 넣고 테트로히드로푸란 용매 50 중량부를 환류냉각기가 설치된 반응기에 넣고 격렬히 교반하면서, 초순수물 20중량부%에 2중량%의 황산을 첨가한 용액을 반응기에 천천히 첨가하였다. 반응기를 12시간 환류한 후 냉각하였다 냉각된 반응 용액을 희석하여 GPC 분석을 실시한 결과 폴리스티렌 환산 중량 평균 분자량이 5,900인 폴리머를 제조하였다.25% by weight of phenyltriethoxy silane, 35% by weight of methyltriethoxysilane, 25% by weight of tetraethoxysilane, 15% by weight of 1,4-benzenedimethanol and 50 parts by weight of a tetrahydrofuran solvent were installed with a reflux condenser. Into the reactor, while vigorously stirring, a solution in which 2% by weight of sulfuric acid was added to 20 parts by weight of ultrapure water was slowly added to the reactor. The reactor was refluxed for 12 hours and then cooled. After diluting the cooled reaction solution, a polymer having a polystyrene reduced weight average molecular weight of 5,900 was prepared.

합성예 6Synthesis Example 6

페닐트리에톡시 실란 25중량%, 메틸트리에톡시실란 35중량%, 테트라에톡시실란 25중량%, 2,6-비스(히드록시메틸)-p-크레졸 15 중량%을 넣고 테트로히드로푸란 용매 50 중량부를 환류냉각기가 설치된 반응기에 넣고 격렬히 교반하면서, 초순수물 20중량부%에 2중량%의 황산을 첨가한 용액을 반응기에 천천히 첨가하였다. 반응기를 12시간 환류한 후 냉각하였다 냉각된 반응 용액을 희석하여 GPC 분석을 실시한 결과 폴리스티렌 환산 중량 평균 분자량이 7,400인 폴리머를 제조하였다.25% by weight of phenyltriethoxy silane, 35% by weight of methyltriethoxysilane, 25% by weight of tetraethoxysilane, 15% by weight of 2,6-bis (hydroxymethyl) -p-cresol, followed by a tetrahydrofuran solvent 50 parts by weight of the reactor was installed with a reflux condenser, while stirring vigorously, a solution in which 2% by weight of sulfuric acid was added to 20 parts by weight of ultrapure water was slowly added to the reactor. The reactor was refluxed for 12 hours and then cooled. After diluting the cooled reaction solution, a polymer having a polystyrene reduced weight average molecular weight of 7,400 was prepared.

합성예 7Synthesis Example 7

페닐트리에톡시 실란 25중량%, 메틸트리에톡시실란 35중량%, 테트라에톡시실란 25중량%, 1,2-벤젠디메탄올 15 중량%을 넣고 테트로히드로푸란 용매 50 중량부를 환류냉각기가 설치된 반응기에 넣고 격렬히 교반하면서, 초순수물 20중량부%에 2중량%의 황산을 첨가한 용액을 반응기에 천천히 첨가하였다. 반응기를 12시간 환류한 후 냉각하였다 냉각된 반응 용액을 희석하여 GPC 분석을 실시한 결과 폴리스티렌 환산 중량 평균 분자량이 6, 500인 폴리머를 제조하였다.25% by weight of phenyltriethoxy silane, 35% by weight of methyltriethoxysilane, 25% by weight of tetraethoxysilane and 15% by weight of 1,2-benzenedimethanol were added and 50 parts by weight of a tetrahydrofuran solvent was installed with a reflux condenser. Into the reactor, while vigorously stirring, a solution in which 2% by weight of sulfuric acid was added to 20 parts by weight of ultrapure water was slowly added to the reactor. The reactor was refluxed for 12 hours and then cooled. After diluting the cooled reaction solution, a polymer having a polystyrene reduced weight average molecular weight of 6, 500 was prepared.

비교예 1Comparative Example 1

페닐트리에톡시 실란 29중량%, 메틸트리에톡시실란 42중량%, 테트라에톡시실란 29중량%을 넣고 테트로히드로푸란 용매 50 중량부를 환류냉각기가 설치된 반응기에 넣고 격렬히 교반하면서, 초순수물 20중량부%에 2중량%의 황산을 첨가한 용액을 반응기에 천천히 첨가하였다. 반응기를 12시간 환류한 후 냉각하였다 냉각된 반응 용액을 희석하여 GPC 분석을 실시한 결과 폴리스티렌 환산 중량 평균 분자량이 6,100인 폴리머를 제조하였다. Add 29 wt% of phenyltriethoxy silane, 42 wt% of methyltriethoxysilane, 29 wt% of tetraethoxysilane, and add 50 wt parts of a tetrahydrofuran solvent to a reactor equipped with a reflux condenser and stir vigorously, 20 wt% of ultrapure water. A solution of 2% by weight sulfuric acid was added slowly to the reactor. The reactor was refluxed for 12 hours and then cooled. After diluting the cooled reaction solution, a polymer having a polystyrene reduced weight average molecular weight of 6,100 was prepared.

비교예 2Comparative Example 2

페닐트리에톡시 실란 25중량%, 메틸트리에톡시실란 35중량%, 테트라에톡시실란 25중량%, 4,4'-아이소프로필리덴비스(2,6-디히드록시메틸페놀) 2 중량%을 넣고 테트로히드로푸란 용매 50 중량부를 환류냉각기가 설치된 반응기에 넣고 격렬히 교반하면서, 초순수물 20중량부%에 2중량%의 황산을 첨가한 용액을 반응기에 천천히 첨가하였다. 반응기를 12시간 환류한 후 냉각하였다 냉각된 반응 용액을 희석하여 GPC 분석을 실시한 결과 폴리스티렌 환산 중량 평균 분자량이 6, 300인 폴리머를 제조하였다. 25% by weight of phenyltriethoxy silane, 35% by weight of methyltriethoxysilane, 25% by weight of tetraethoxysilane, 2% by weight of 4,4'-isopropylidenebis (2,6-dihydroxymethylphenol) 50 parts by weight of a tetrahydrofuran solvent was added to a reactor equipped with a reflux condenser, and vigorously stirred, a solution in which 2% by weight of sulfuric acid was added to 20 parts by weight of ultrapure water was slowly added to the reactor. The reactor was refluxed for 12 hours and then cooled. After diluting the cooled reaction solution, GPC analysis was conducted to prepare a polymer having a polystyrene reduced weight average molecular weight of 6,300.

비교예 3Comparative Example 3

페닐트리에톡시 실란 25중량%, 메틸트리에톡시실란 35중량%, 테트라에톡시실란 25중량%, 4,4'-아이소프로필리덴비스(2,6-디히드록시메틸페놀) 45 중량%을 넣고 테트로히드로푸란 용매 50 중량부를 환류냉각기가 설치된 반응기에 넣고 격렬히 교반하면서, 초순수물 20중량부%에 2중량%의 황산을 첨가한 용액을 반응기에 천천히 첨가하였다. 반응기를 12시간 환류한 후 냉각하였다 냉각된 반응 용액을 희석하여 GPC 분석을 실시한 결과 폴리스티렌 환산 중량 평균 분자량이 6, 800인 폴리머를 제조하였다. 25% by weight of phenyltriethoxy silane, 35% by weight of methyltriethoxysilane, 25% by weight of tetraethoxysilane, 45% by weight of 4,4'-isopropylidenebis (2,6-dihydroxymethylphenol) 50 parts by weight of a tetrahydrofuran solvent was added to a reactor equipped with a reflux condenser, and vigorously stirred, a solution in which 2% by weight of sulfuric acid was added to 20 parts by weight of ultrapure water was slowly added to the reactor. The reactor was refluxed for 12 hours and then cooled. The cooled reaction solution was diluted and subjected to GPC analysis to prepare a polymer having a polystyrene reduced weight average molecular weight of 6,800.

본 발명의 실록산계 폴리머 조성물을 이용하여 형성한 층간 절연막의 각종 물성을 평가하였다. Various physical properties of the interlayer insulating film formed using the siloxane polymer composition of the present invention were evaluated.

[연필경도 측정][Pencil hardness measurement]

실리콘 기판상에, 상기 제조한 실록산계 폴리머(합성예 1 내지 7, 비교예 1 내지 3)를 스핀 코팅 한 후 100도에서 3분간 프리베이킹을 실시하였다. 프리베이킹 한 후 도막 두께는 약 4.0 마이크로로 얻어졌다. 이렇게 얻어진 도막을 240도에서 1시간 포스트 베이킹을 실시하였다. 연필 경도계를 사용하여 경화막의 연필 경도를 측정하였다. 측정 결과는 표 1에 나타낸 바와 같다. On the silicon substrate, the siloxane polymer (Synthesis Examples 1 to 7, Comparative Examples 1 to 3) prepared above was spin-coated and then prebaked at 100 degrees for 3 minutes. After prebaking, the film thickness was obtained at about 4.0 microns. The coating film thus obtained was post-baked at 240 degrees for 1 hour. The pencil hardness of the cured film was measured using the pencil hardness meter. The measurement results are as shown in Table 1.

[내열성 평가] [Heat resistance evaluation]

연필 경도를 측정하기 위해 경화된 도막 두께를 측정하고(T1) 이 도막을 추가로 230도에서 1시간 추가 베이킹하여 얻어진 두께(T2)를 측정하였다. [(T1-T2)/T2 x 100(%)로 추가 베이킹 전 후의 두께 편차를 백분율로 계산하였다. 두께 편차율이 3%이내이면 내열성이 우수하다고 할 수 있으며, 표 1에 나타낸 바와 같다. In order to measure the pencil hardness, the cured coating film thickness was measured (T1) and the thickness (T2) obtained by further baking the coating film at 230 degrees for 1 hour was measured. [(T1-T2) / T2 x 100 (%) The thickness deviation before and after further baking was calculated as a percentage. When the thickness variation ratio is 3% or less, it can be said that heat resistance is excellent, and it is as shown in Table 1.

[투과율 평가][Transmittance Evaluation]

유리 기판상에 코팅하여 도막을 형성한 후에 230도에서 1시간 동안 가열함으로서 경화막을 얻었다. 이 경화막을 갖는 유리 기판을 분광 광도계를 이용하여 400 nm에서 측정하였으며, 그 결과를 표 1에 나타냈다. After coating on a glass substrate to form a coating film, the cured film was obtained by heating at 230 degree | times for 1 hour. The glass substrate which has this cured film was measured at 400 nm using the spectrophotometer, and the result is shown in Table 1.

표 1 합성 예 비교예 1 2 3 4 5 6 7 1 2 3 경도 5H 6H 5H 5H 6H 5H 5H 3H 3H 5H 내열성 1.5 1.6 1.4 1.4 1.5 1.3 1.3 2.1 1.9 1.3 투과율 95 96 95 95 96 96 95 96 95 93 Table 1 Synthesis Example Comparative example One 2 3 4 5 6 7 One 2 3 Hardness 5H 6H 5H 5H 6H 5H 5H 3H 3H 5H Heat resistance 1.5 1.6 1.4 1.4 1.5 1.3 1.3 2.1 1.9 1.3 Transmittance 95 96 95 95 96 96 95 96 95 93

이상의 설명으로부터, 본 발명이 속하는 기술분야의 당업자는 본 발명이 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 이와 관련하여, 이상에서 기술한 실시 예들은 모든 면에서 예시적인 것이며 한정적인 것이 아닌 것으로서 이해해야만 한다. 본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허 청구범위의 의미 및 범위 그리고 그 등가 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.From the above description, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. In this regard, the embodiments described above are to be understood in all respects as illustrative and not restrictive. The scope of the present invention should be construed that all changes or modifications derived from the meaning and scope of the following claims and equivalent concepts rather than the detailed description are included in the scope of the present invention.

Claims (6)

(A) (a1) 실란 화합물과, (a2) 벤질 알코올 또는 벤질 에테르;를 가수분해 축합하여 얻어지는 실록산 폴리머로서, (a1) 실란 화합물은, 화합물 (a1) 및 화합물 (a2) 전체 중량 대비 70중량% 내지 97중량%, (a2) 벤질 알코올 또는 벤질 에테르는 화합물 (a1) 및 화합물 (a2) 전체 중량 대비 3중량% 내지 30중량%를 사용하는 것인 실록산 폴리머, 및A siloxane polymer obtained by hydrolytically condensing (A) (a1) a silane compound with (a2) benzyl alcohol or benzyl ether, wherein the (a1) silane compound is 70% by weight of the total weight of compound (a1) and compound (a2) % To 97% by weight, (a2) benzyl alcohol or benzyl ether, wherein the siloxane polymer uses from 3% to 30% by weight relative to the total weight of compound (a1) and compound (a2), and (B) 용제(B) solvent 를 함유하는 실록산 폴리머 조성물. A siloxane polymer composition containing. 제1항에 있어서, The method of claim 1, (A) 실록산 폴리머는, (A) siloxane polymer, (a1) 하기 화학식 1로 표시되는 실란 화합물과, (a1) a silane compound represented by the following formula (1), (a2) 하기 화학식 2로 표시되는 벤질 알코올 또는 벤질 에테르의 가수 분해축합물인, 실록산 폴리머 조성물: (a2) A siloxane polymer composition which is a hydrolysis condensate of benzyl alcohol or benzyl ether represented by the following formula (2): [화학식 1] [Formula 1] (R1)n-Si-(OR2)4-n (R 1 ) n -Si- (OR 2 ) 4-n (식 중, R1은 각각 독립적으로 수소원자, 탄소수 1~10의 알킬기 또는 탄소수 6~20의 아릴기 중 어느 것을 나타내고; R2는, 각각 독립적으로, 수소 원자, 탄소수 1~6의 알킬기, 탄소수 1~6의 아실기 또는 탄소수 6~15의 아릴기 중 어느 것을 나타내고; n은 0~3의 경우를 나타냄. 단, 이들 알킬기, 아릴기의 수소 원자의 일부 또는 전부가 치환되어 있어도 좋음)(In formula, R <1> respectively independently represents a hydrogen atom, a C1-C10 alkyl group, or a C6-C20 aryl group; R <2> respectively independently represents a hydrogen atom and a C1-C6 alkyl group, Which represents an acyl group having 1 to 6 carbon atoms or an aryl group having 6 to 15 carbon atoms; n represents a case where 0 to 3. However, some or all of the hydrogen atoms of these alkyl groups and aryl groups may be substituted). [화학식 2] [Formula 2]
Figure PCTKR2015005950-appb-I000003
또는
Figure PCTKR2015005950-appb-I000004
Figure PCTKR2015005950-appb-I000003
or
Figure PCTKR2015005950-appb-I000004
(식 중, R은 탄소수 1~4의 알킬기 또는 수소 원자이고, R'는 수소원자 또는 탄소수 1~10의 알킬기이며, X는 수소 원자나 OH기이며, Y는 수소원자, 메틸 또는 트리플로오르메틸을 나타냄)(Wherein R is an alkyl group having 1 to 4 carbon atoms or a hydrogen atom, R 'is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, X is a hydrogen atom or an OH group, and Y is a hydrogen atom, methyl or trifluoro) Represents methyl)
제1항 또는 제2항에 있어서, (C) 열산 발생제 또는 열염기 발생제를 추가로 함유하는 실록산 폴리머 조성물. The siloxane polymer composition according to claim 1 or 2, further comprising (C) a thermal acid generator or a thermal base generator. 제1항 또는 제2항에 있어서, (A) 실록산 폴리머는 폴리스티렌 환산 중량 평균 분자량이 1,000 이상 40,000 이하인 것인 실록산 폴리머 조성물. The siloxane polymer composition according to claim 1 or 2, wherein the (A) siloxane polymer has a polystyrene reduced weight average molecular weight of 1,000 or more and 40,000 or less. 제1항 내지 제4항 중 어느 한 항에 기재된 실록산 폴리머 조성물로 형성되는 경화막.The cured film formed from the siloxane polymer composition of any one of Claims 1-4. 제5항에 있어서, 상기 경화막은 표시 소자의 층간 절연막인 것인 경화막.The cured film of claim 5, wherein the cured film is an interlayer insulating film of a display element.
PCT/KR2015/005950 2014-06-12 2015-06-12 Siloxane polymer composition Ceased WO2015190873A1 (en)

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