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WO2015183021A1 - Light-emitting diode lighting device - Google Patents

Light-emitting diode lighting device Download PDF

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Publication number
WO2015183021A1
WO2015183021A1 PCT/KR2015/005373 KR2015005373W WO2015183021A1 WO 2015183021 A1 WO2015183021 A1 WO 2015183021A1 KR 2015005373 W KR2015005373 W KR 2015005373W WO 2015183021 A1 WO2015183021 A1 WO 2015183021A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
heat
control chip
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/005373
Other languages
French (fr)
Korean (ko)
Inventor
박태관
김정두
강기태
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seoul Semiconductor Co Ltd
Original Assignee
Seoul Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020150073590A external-priority patent/KR20150138040A/en
Application filed by Seoul Semiconductor Co Ltd filed Critical Seoul Semiconductor Co Ltd
Publication of WO2015183021A1 publication Critical patent/WO2015183021A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks

Definitions

  • the present invention relates to a light emitting diode illumination device, and more particularly to a light emitting diode illumination device capable of effectively dissipating heat generated by the light emitting diode illumination device.
  • incandescent lamps have been widely used for indoor or outdoor lighting in buildings for a long time.
  • incandescent lamps have disadvantages such as short lifespan, poor durability, limited color selection range of light and low energy efficiency.
  • LEDs Light emitting diodes
  • Korean Patent Publication No. 2014-0005455 (The heat dissipation structure of the LED bulb, published date: 2014.01.15, prior art) is a technology related to the heat dissipation structure of the LED lighting device.
  • a light emitting diode lighting device is used in addition to a light emitting diode such as an AC driving IC for driving an AC light emitting diode which is directly driven by AC, an electronic component that generates heat is used.
  • the light emitting diode lighting apparatus as in the prior art has a problem that only heat generated from the light emitting diode is to be radiated.
  • An object of the present invention is to provide a light emitting diode lighting device for radiating heat generated from an electronic component mounted such as a light emitting diode as well as heat generated from a light emitting diode.
  • a light emitting diode lighting apparatus comprising: a housing having an accommodation space therein; A heat sink coupled to the housing and dissipating conducted heat; A substrate provided on the heat sink; A light emitting diode mounted on the substrate and emitting light by an applied electric power; A control chip mounted on the substrate and controlling driving of the light emitting diode; And a heat bridge in contact with an upper surface of the control chip and transferring heat generated from the control chip to the heat sink.
  • the heat bridge may be bent such that one side is in contact with the upper surface of the control chip, the other side is in contact with the heat sink.
  • a hole through which the heat bridge may pass may be formed in the substrate so that the heat bridge contacts the heat sink.
  • the plurality of light emitting diodes may be mounted, and the plurality of light emitting diodes may be mounted along the edge shape of the substrate, and the control chip may be mounted on the substrate so as to be surrounded by the plurality of light emitting diodes.
  • the heat bridge may include a first contact portion in contact with an upper surface of the control chip and a second contact portion in contact with the heat sink, and the first contact portion and the second contact portion may have a step.
  • the heat sink may be formed larger than the substrate, and the heat bridge may contact a position where the heat sink is exposed.
  • the substrate is formed to have a length in one direction
  • the plurality of light emitting diodes, the plurality of light emitting diodes are arranged in the longitudinal direction of the substrate
  • the control chip is mounted on one side in the longitudinal direction of the substrate Can be.
  • a coupling groove for coupling the other side of the heat bridge may be formed on the side surface of the heat sink, and the heat bridge may be bent in a 'c' shape.
  • the heat bridge may be formed to completely cover the upper surface of the control chip.
  • the light emitting diode may be an AC light emitting diode capable of AC driving
  • the control chip may be an AC driving control chip for driving the AC light emitting diode.
  • the terminal may further include a terminal for receiving power from an external power source, and the terminal may be formed on an outer surface of the housing.
  • the LED lighting apparatus of the present invention transfers the heat generated from the LED and the control chip to the heat sink through the substrate to dissipate heat and at the same time install a heat bridge on the upper surface of the control chip, the heat bridge Since heat is transferred to the heat sink, the heat generated from the control chip can be more effectively radiated.
  • FIG. 1 is a perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.
  • FIG 3 is a cross-sectional view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.
  • FIG. 4 is a diagram illustrating a path through which heat generated from a control chip of the LED lighting apparatus according to an embodiment of the present invention is transferred to the heat sink 130.
  • FIG. 5 is a view showing a light emitting diode lighting apparatus according to another embodiment of the present invention.
  • FIG. 6 is a view showing that the heat bridge of the LED lighting apparatus according to another embodiment of the present invention is installed.
  • FIG. 1 is a perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention
  • Figure 2 is an exploded perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention
  • 3 is a cross-sectional view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.
  • the LED lighting apparatus 100 of the present invention includes a housing 110, a substrate 120, a heat sink 130, a light emitting diode 140, a control chip 150, and a heat bridge 160.
  • the housing 110 is provided with a socket base at a lower portion thereof, and a receiving space having an open upper portion thereof is formed therein.
  • a circuit board including a protection circuit capable of controlling power supplied from the outside or protecting the light emitting diode 140 is accommodated in the accommodation space of the housing 110, and a heat sink 130 is inserted therein.
  • the substrate 120 is disposed on the housing 110, and the light emitting diode 140 and the control chip 150 are mounted.
  • the substrate 120 of the present invention is formed in a circular shape, a hole is formed to be screwed to the heat sink 130.
  • the substrate 120 has a through hole through which the heat bridge 160 can penetrate near the mounting position of the control chip 150.
  • the heat sink 130 is formed in a cylindrical shape, the diameter of the heat sink is reduced toward the bottom to be inserted into the receiving space of the housing 110.
  • the upper surface of the heat sink 130 is formed with a screw groove so that the substrate 120 and the heat bridge 160 can be screwed. Since the substrate 120 is coupled to the upper surface of the heat sink 130, heat generated from the light emitting diode 140 and the control chip 150 is transferred to the heat sink 130 through the substrate 120 to radiate heat. do.
  • the heat sink 130 and the heat bridge 160 may be coupled using heat conduction bonding, not screw coupling.
  • the heat sink 130 may use any metal having high thermal conductivity for heat dissipation performance, and may be made of metal such as aluminum or aluminum alloy in consideration of cost.
  • a plurality of light emitting diodes 140 are mounted on the substrate 120, and in one embodiment of the present invention, a plurality of light emitting diodes 140 are mounted in a circular shape along the edge of the substrate 120.
  • the light emitting diode 140 according to an embodiment of the present invention uses a light emitting diode 140 that operates in an AC direct drive method.
  • the control chip 150 is mounted on the substrate 120, and omits a conventional power supply device including an SMPS or PSU and integrates a circuit for driving the AC LED 140 in an AC direct connection type. Therefore, like a conventional lighting device, it is possible to omit a device for converting alternating current into direct current or a power supply device having a large volume and weight, thereby reducing the size of the light emitting diode lighting device (100).
  • Heat generated while the power is applied to the light emitting diode 140 and the control chip 150 is basically transferred to the heat sink 130 through the substrate 120 to radiate heat.
  • the heat bridge 160 is installed on the control chip 150.
  • the heat bridge 160 is provided to additionally transfer heat generated from the control chip 150 to the heat sink 130.
  • one side of the heat bridge 160 is provided in contact with the top surface of the control chip 150, and the other side contacts the heat sink 130 by passing through a through hole formed in the substrate 120.
  • a terminal formed on the outside of the housing and configured to transfer power supplied from the outside to the substrate side may be further provided.
  • the heat bridge 160 has one side and the other side due to a height difference between the top surface of the control chip 150 and the top surface of the heat sink 130 exposed through the through hole of the substrate 120. It is formed stepped.
  • the through hole formed in the substrate 120 is formed to have a size corresponding to the size of the heat bridge 160 so that the other side of the heat bridge 160 can pass therethrough.
  • the heat bridge 160 is inserted into the through hole of the substrate 120, and one side of the heat bridge 160 contacts the top surface of the control chip 150 while covering the control chip 150.
  • the heat bridge 160 may partially cover the top surface of the control chip 150 or may completely cover the top surface of the control chip 150.
  • the heat bridge 160 is fixed by screwing in the state in which the heat bridge 160 is inserted into the through hole of the substrate 120.
  • heat dissipation grease or the like may be applied to an upper surface of the control chip 150 as necessary.
  • the heat bridge 160 may use any metal having high thermal conductivity for heat dissipation performance, and may be made of metal such as aluminum or aluminum alloy in consideration of cost.
  • a cap for spreading the light emitted from the light emitting diodes 140 may be further provided to cover the open upper surface of the housing 110.
  • the cap may be formed in a hemispherical shape, and is made of a synthetic resin of a light transmitting material such as polycarbonate material.
  • FIG. 4 is a diagram illustrating a path through which heat generated from a control chip of the LED lighting apparatus according to an embodiment of the present invention is transferred to the heat sink 130.
  • Heat generated from the control chip 150 is transferred to the heat sink 130 through the substrate 120 to the bottom and heat sink 130 through the heat bridge 160 to the top, as shown in FIG. It is moved in the direction of delivery. Therefore, the heat generated from the control chip 150 can be discharged more efficiently. Furthermore, since the heat bridge 160 is made of the same material as the heat sink 130, heat dissipation of the control chip 150 is more effectively performed.
  • FIG. 5 is a view showing a light emitting diode lighting apparatus according to another embodiment of the present invention.
  • the LED lighting apparatus 200 includes a housing 210, a substrate 220, a heat sink 230, a light emitting diode 240, a control chip 250, and a heat bridge 260. Include.
  • the housing 210 has a circular hollow and is formed in a shape extending in one direction.
  • the housing 210 may be partially or entirely formed in a transparent or translucent manner so that light emitted from the light emitting diode 140 may be emitted in a circular cross section.
  • the substrate 220 and the heat sink 230 may be inserted in the longitudinal direction of the housing 210 in the hollow of the housing 210.
  • the substrate 220 is formed to extend in one direction so as to be inserted into the hollow of the housing 210, and the light emitting diode 240 and the control chip 250 are mounted on one surface thereof.
  • a conductive pattern may be formed on the mounting surface of the substrate 220 such that power supplied from the outside may be supplied to the light emitting diode 240 and the control chip 250.
  • the substrate 220 may be a metal core PCB (MCPCB) based on metal having high thermal conductivity, but is not limited thereto.
  • the heat sink 230 is installed below the substrate 220, and is formed to extend in one direction like the substrate 220. In this case, the heat sink 230 may be formed to be longer than the substrate 220 by a predetermined distance.
  • a structure in which the heat sink 230 is inserted into the housing 210 will be described. However, the heat sink 230 may not be installed inside the housing 210 and may be exposed to the outside. That is, the heat sink 230 and the housing 210 may have a structure that is coupled to each other by a coupling protrusion or a coupling groove.
  • a plurality of light emitting diodes 240 may be mounted on one surface of the substrate 220, and in another embodiment of the present invention, the light emitting diodes 240 may be mounted along the length direction of the substrate 220.
  • the control chip 250 may be mounted on one side of the substrate 220, and supply the light emitting diode 240 by supplying an AC power supplied from the outside to the light emitting diode 240 which may be driven in alternating current by an AC direct connection type. Can be driven.
  • heat generated from the light emitting diode 240 and the control chip 250 is transferred to the heat sink 230 through the substrate 220, and more efficiently radiate heat generated from the control chip 250.
  • a heat bridge 260 is further provided.
  • the heat bridge 260 is formed to cover the upper portion of the control chip 250 to be in contact with the upper portion of the control chip 250, and is provided to transfer the heat of the control chip 250 to the heat sink 230. Accordingly, the heat bridge 260 is formed in a shape bent to form a step, as in one embodiment, one side of the heat bridge 260 is in contact with the top of the control chip 250, the other side is the heat May contact the sink 230. The step formed in the heat bridge 260 is due to the step between the top surface of the control chip 250 and the top surface of the heat sink 230.
  • the other side of the heat bridge 260 may be formed to be longer than the substrate 220 to contact the exposed heat sink 230, and the heat bridge 260 and the heat sink 230 may be bonded to each other by screwing or heat conducting. Can be combined using.
  • a through hole is formed in the substrate 220 may be in contact with the heat bridge 260 and the heat sink 230 through the through hole.
  • 6 (a) and 6 (b) are a perspective view and a cross-sectional view respectively showing that the heat bridge of the light emitting diode lighting apparatus according to another embodiment of the present invention is installed.
  • the LED lighting apparatus includes a housing 310, a substrate 320, a heat sink 330, a light emitting diode 340, a control chip 350, and a heat bridge 360. .
  • a housing 310 a substrate 320
  • a heat sink 330 a heat sink 330
  • a light emitting diode 340 a control chip 350
  • a heat bridge 360 a heat bridge 360
  • the heat bridge 360 is coupled to the heat sink 330, and the heat bridge 360 covers an upper portion of the control chip 350 mounted on the substrate 320. It may be formed in a shape bent in a 'c' shape to be in direct contact with the heat sink 330 in a covered state. One side of the heat bridge 360 is bent and extended to the heat sink 330 in the state covering the top of the control chip 350, and then bent again to contact the heat sink 330, the other side and the heat sink 330 Can be contacted.
  • the other end of the heat bridge 360 is in contact with the heat sink 330.
  • a separate configuration is not added for coupling between the heat bridge 360 and the heat sink 330, and the heat sink has a structure such as a clip due to the elasticity of the heat bridge 360.
  • 330 may be combined.
  • a coupling groove 331 may be formed at one side of the heat sink 330 such that the heat bridge 360 is coupled thereto. Accordingly, the heat bridge 360 may be coupled to the heat sink 330 by being caught by the coupling groove 331 formed in the upper portion of the control chip 350 and the heat sink 330.
  • the heat bridge 360 when the heat bridge 360 is bonded to the heat sink 330 using an adhesive material, as described above, the heat bridge 360 and the heat sink are not formed in the heat sink 330. 330 may be combined.
  • control chip 160 heat bridge

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to a light-emitting diode lighting device. The light-emitting diode lighting device according to one embodiment of the present invention may comprise: a housing in which a receiving space is formed; a heat sink which is coupled to the housing and irradiates conducted heat; a substrate installed on the heat sink; a light-emitting diode which is mounted on the substrate and emits light by applied electric power; a control chip which is mounted on the substrate and controls drive of the light-emitting diode; and a heat bridge which is adjacent to the upper surface of the control chip and transfers heat generated in the control chip to the heat sink. According to the present invention, the light-emitting diode lighting device of the present invention has an effect of more effectively irradiating the heat generated in the control chip because the heat is transferred to the heat sink via the heat bridge due to the heat bridge being installed on the upper surface of the control chip and, at the same time, the heat is irradiated by transferring the heat generated in the light-emitting diode and the control chip via the substrate to the heat sink.

Description

발광 다이오드 조명 장치LED lighting device

본 발명은 발광 다이오드 조명 장치에 관한 것으로, 더욱 상세하게는 발광 다이오드 조명 장치에서 발생하는 열을 효과적으로 방출할 수 있는 발광 다이오드 조명 장치에 관한 것이다.The present invention relates to a light emitting diode illumination device, and more particularly to a light emitting diode illumination device capable of effectively dissipating heat generated by the light emitting diode illumination device.

오랜 기간 동안 백열등이라 칭해지는 벌브(bulb) 형태의 램프는 건축물의 실내공간 또는 옥외 조명장치로 널리 이용되어 왔다. 하지만, 백열등은 짧은 수명, 열악한 내구성, 광의 제한된 컬러 선택 범위 및 낮은 에너지 효율과 같은 단점이 있다.Bulb-type lamps, called incandescent lamps, have been widely used for indoor or outdoor lighting in buildings for a long time. However, incandescent lamps have disadvantages such as short lifespan, poor durability, limited color selection range of light and low energy efficiency.

최근 산업통상자원부는 단계적으로 백열등을 퇴출시켜 왔으며, 올해부터는 국내 시장에서 일부 백열등의 생산과 수입이 중단되었다. 생산 및 수입이 중단된 백열등은 에너지 효율이 좋은 발광 다이오드 조명 장치로 대체될 수 있다. 발광 다이오드(LED: light emitting diode)는 높은 발광 효율과 긴 수명, 그리고 낮은 소비전력의 장점을 갖는 친환경적인 제품이다.Recently, the Ministry of Trade, Industry and Energy has phased out incandescent lamps in stages. Incandescent lamps, which have been discontinued in production and import, can be replaced with energy-efficient LED lighting devices. Light emitting diodes (LEDs) are environmentally friendly products with the advantages of high luminous efficiency, long life and low power consumption.

이런 발광 다이오드 조명 장치는 방열문제에 대한 해결이 중요하다. 이를 위해 대한민국 공개특허 제2014-0005455호(엘이디 전구의 방열구조, 공개일: 2014.01.15, 선행문헌)는 발광 다이오드 조명 장치의 방열구조에 관한 기술이다. The light emitting diode lighting device is important to solve the heat dissipation problem. To this end, Korean Patent Publication No. 2014-0005455 (The heat dissipation structure of the LED bulb, published date: 2014.01.15, prior art) is a technology related to the heat dissipation structure of the LED lighting device.

최근의 발광 다이오드 조명 장치는 교류에서 직접 구동하는 교류용 발광 다이오드를 구동시키기 위한 교류구동 IC 등 발광 다이오드 외에도 열이 발생하는 전자부품이 이용되고 있다. 하지만, 선행문헌과 같은 발광 다이오드 조명 장치는 발광 다이오드에서 발생하는 열만 방열하고자 하는 문제가 있다.Recently, a light emitting diode lighting device is used in addition to a light emitting diode such as an AC driving IC for driving an AC light emitting diode which is directly driven by AC, an electronic component that generates heat is used. However, the light emitting diode lighting apparatus as in the prior art has a problem that only heat generated from the light emitting diode is to be radiated.

상기와 같이, 교류구동을 위한 IC를 이용하는 경우, 인가된 전력에 의해 교류구동 IC에서 상당히 높은 열이 발생한다. 이러한 교류구동 IC를 발광 다이오드와 함께 동일한 기판에 설치하면, 교류구동 IC에서 발생된 열이 발광 다이오드에서 발생된 열보다 높을 수 있어 발광 다이오드에서의 열이 효과적으로 방열되지 못하고 역전도되어 발광 다이오드에 영향을 줄 수 있는 문제가 있다.As described above, in the case of using an IC for alternating current driving, considerably high heat is generated in the alternating current driving IC by the applied electric power. If the AC driver IC is installed on the same substrate together with the light emitting diode, the heat generated by the AC driver IC may be higher than that generated by the light emitting diode. There is a problem that can give.

본 발명이 해결하고자 하는 과제는, 발광 다이오드에서 발생되는 열뿐만 아니라 발광 다이오드와 같이 실장된 전자부품에서 발생되는 열을 방열하기 위한 발광 다이오드 조명 장치를 제공하는 것이다.SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting diode lighting device for radiating heat generated from an electronic component mounted such as a light emitting diode as well as heat generated from a light emitting diode.

본 발명의 일 실시예에 따른 발광 다이오드 조명 장치는, 내부에 수용공간이 형성된 하우징; 상기 하우징과 결합되고, 전도된 열을 방열하는 히트싱크; 상기 히트싱크 상에 설치된 기판; 상기 기판 상에 실장되고, 인가된 전력에 의해 빛을 발광하는 발광 다이오드; 상기 기판 상에 실장되며, 상기 발광 다이오드의 구동을 제어하는 제어칩; 및 상기 제어칩 상면에 접하고, 상기 제어칩에서 발생된 열을 상기 히트싱크로 전달하는 히트브리지를 포함할 수 있다.According to an embodiment of the present invention, there is provided a light emitting diode lighting apparatus comprising: a housing having an accommodation space therein; A heat sink coupled to the housing and dissipating conducted heat; A substrate provided on the heat sink; A light emitting diode mounted on the substrate and emitting light by an applied electric power; A control chip mounted on the substrate and controlling driving of the light emitting diode; And a heat bridge in contact with an upper surface of the control chip and transferring heat generated from the control chip to the heat sink.

상기 히트브리지는 일 측이 상기 제어칩 상면에 접하고, 타 측이 상기 히트싱크에 접하도록 절곡될 수 있다.The heat bridge may be bent such that one side is in contact with the upper surface of the control chip, the other side is in contact with the heat sink.

이때, 상기 기판은 상기 히트브리지가 상기 히트싱크에 접하도록 상기 히트브리지가 관통할 수 있는 홀이 형성될 수 있다. 그리고 상기 발광 다이오드는 다수 개이고, 상기 다수의 발광 다이오드는 상기 기판의 테두리 형상을 따라 배치되게 실장되고, 상기 제어칩은 상기 다수의 발광 다이오드에 의해 둘러싸이도록 상기 기판에 실장될 수 있다.In this case, a hole through which the heat bridge may pass may be formed in the substrate so that the heat bridge contacts the heat sink. The plurality of light emitting diodes may be mounted, and the plurality of light emitting diodes may be mounted along the edge shape of the substrate, and the control chip may be mounted on the substrate so as to be surrounded by the plurality of light emitting diodes.

또한, 상기 히트브리지는 상기 제어칩의 상면에 접하는 제1 접면부와 상기 히트싱크에 접하는 제2 접면부를 포함하고, 상기 제1 접면부와 제2 접면부는 단차가 형성될 수 있다.In addition, the heat bridge may include a first contact portion in contact with an upper surface of the control chip and a second contact portion in contact with the heat sink, and the first contact portion and the second contact portion may have a step.

그리고 상기 히트싱크는 상기 기판보다 크게 형성되고, 상기 히트브리지는 상기 히트싱크가 노출된 위치에 접할 수 있다. 이때, 상기 기판은 일 방향의 길이를 가지도록 형성되며, 상기 발광 다이오드는 다수 개이고, 상기 다수의 발광 다이오드는 상기 기판의 길이 방향으로 배치되며, 상기 제어칩은 상기 기판의 길이방향 일 측에 실장될 수 있다.The heat sink may be formed larger than the substrate, and the heat bridge may contact a position where the heat sink is exposed. At this time, the substrate is formed to have a length in one direction, the plurality of light emitting diodes, the plurality of light emitting diodes are arranged in the longitudinal direction of the substrate, the control chip is mounted on one side in the longitudinal direction of the substrate Can be.

또한, 상기 히트싱크의 측면에는 상기 히트브리지의 타 측이 결합되기 위한 결합홈이 형성될 수 있고, 상기 히트브리지는 'ㄷ'자 형상으로 절곡될 수 있다.In addition, a coupling groove for coupling the other side of the heat bridge may be formed on the side surface of the heat sink, and the heat bridge may be bent in a 'c' shape.

이때, 상기 히트브리지는 상기 제어칩의 상면을 완전히 덮도록 형성될 수 있다.In this case, the heat bridge may be formed to completely cover the upper surface of the control chip.

그리고 상기 발광 다이오드는 교류 구동이 가능한 교류용 발광 다이오드일 수 있으며, 상기 제어칩은 상기 교류용 발광 다이오드를 구동시키기 위한 교류구동 제어칩일 수 있다.The light emitting diode may be an AC light emitting diode capable of AC driving, and the control chip may be an AC driving control chip for driving the AC light emitting diode.

한편, 외부 전원에서 전력을 공급받기 위한 단자를 더 포함할 수 있고, 상기 단자는 상기 하우징의 외면에 형성될 수 있다.Meanwhile, the terminal may further include a terminal for receiving power from an external power source, and the terminal may be formed on an outer surface of the housing.

본 발명에 의하면, 본 발명의 발광 다이오드 조명 장치는 기판을 통해 발광 다이오드 및 제어칩에서 발생된 열을 히트싱크로 전달하여 열을 방열함과 동시에 제어칩의 상면에 히트브리지를 설치하여, 히트브리지를 통해 히트싱크로 열을 전달하기 때문에 제어칩에서 발생되는 열을 더욱 효과적으로 방열할 수 있는 효과가 있다.According to the present invention, the LED lighting apparatus of the present invention transfers the heat generated from the LED and the control chip to the heat sink through the substrate to dissipate heat and at the same time install a heat bridge on the upper surface of the control chip, the heat bridge Since heat is transferred to the heat sink, the heat generated from the control chip can be more effectively radiated.

도 1은 본 발명의 일 실시예에 따른 발광 다이오드 조명 장치를 도시한 사시도이다.1 is a perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.

도 2는 본 발명의 일 실시예에 따른 발광 다이오드 조명 장치를 도시한 분해 사시도이다.2 is an exploded perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.

도 3은 본 발명의 일 실시예에 따른 발광 다이오드 조명 장치를 도시한 단면도이다.3 is a cross-sectional view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.

도 4는 본 발명의 일 실시예에 따른 발광 다이오드 조명 장치의 제어칩에서 발생된 열이 히트싱크(130)로 전달되는 경로를 도시한 도면이다.4 is a diagram illustrating a path through which heat generated from a control chip of the LED lighting apparatus according to an embodiment of the present invention is transferred to the heat sink 130.

도 5는 본 발명의 다른 실시예에 따른 발광 다이오드 조명 장치를 도시한 도면이다.5 is a view showing a light emitting diode lighting apparatus according to another embodiment of the present invention.

도 6은 본 발명의 또 다른 실시예에 따른 발광 다이오드 조명 장치의 히트브리지가 설치된 것을 도시한 도면이다.6 is a view showing that the heat bridge of the LED lighting apparatus according to another embodiment of the present invention is installed.

본 발명의 바람직한 실시예에 대하여 첨부된 도면을 참조하여 더 구체적으로 설명한다.Preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

도 1은 본 발명의 일 실시예에 따른 발광 다이오드 조명 장치를 도시한 사시도이고, 도 2는 본 발명의 일 실시예에 따른 발광 다이오드 조명 장치를 도시한 분해 사시도이다. 도 3은 본 발명의 일 실시예에 따른 발광 다이오드 조명 장치를 도시한 단면도이다.1 is a perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention, Figure 2 is an exploded perspective view showing a light emitting diode lighting apparatus according to an embodiment of the present invention. 3 is a cross-sectional view showing a light emitting diode lighting apparatus according to an embodiment of the present invention.

본 발명의 발광 다이오드 조명 장치(100)는 하우징(110), 기판(120), 히트싱크(130), 발광 다이오드(140), 제어칩(150) 및 히트브리지(160)를 포함한다. The LED lighting apparatus 100 of the present invention includes a housing 110, a substrate 120, a heat sink 130, a light emitting diode 140, a control chip 150, and a heat bridge 160.

하우징(110)은 하부에 소켓 베이스가 구비되고, 내부에 상부가 개방된 수용공간이 형성된다. 하우징(110)의 수용공간에는 외부에서 공급된 전력을 제어하거나 발광 다이오드(140)를 보호할 수 있는 보호회로가 포함된 회로기판이 수용되고, 히트싱크(130)가 삽입된다.The housing 110 is provided with a socket base at a lower portion thereof, and a receiving space having an open upper portion thereof is formed therein. A circuit board including a protection circuit capable of controlling power supplied from the outside or protecting the light emitting diode 140 is accommodated in the accommodation space of the housing 110, and a heat sink 130 is inserted therein.

기판(120)은 하우징(110)의 상부에 배치되고, 발광 다이오드(140)와 제어칩(150)이 실장된다. 본 발명의 기판(120)은 원형으로 형성되고, 히트싱크(130)에 나사 결합될 수 있게 홀이 형성된다. 그리고 기판(120)은 제어칩(150) 실장 위치 근처에 히트브리지(160)가 관통할 수 있는 관통홀을 가진다.The substrate 120 is disposed on the housing 110, and the light emitting diode 140 and the control chip 150 are mounted. The substrate 120 of the present invention is formed in a circular shape, a hole is formed to be screwed to the heat sink 130. The substrate 120 has a through hole through which the heat bridge 160 can penetrate near the mounting position of the control chip 150.

히트싱크(130)는 원통형상으로 형성되고, 하우징(110)의 수용공간에 삽입될 수 있게 하부로 갈수록 직경이 줄어들게 형성된다. 히트싱크(130)의 상부면에는 기판(120) 및 히트브리지(160)가 나사 결합될 수 있도록 나사홈이 형성된다. 히트싱크(130)의 상면에 기판(120)이 접한 상태로 결합되므로, 발광 다이오드(140) 및 제어칩(150)에서 발생된 열이 기판(120)을 통해 히트싱크(130)로 전달되어 방열된다.The heat sink 130 is formed in a cylindrical shape, the diameter of the heat sink is reduced toward the bottom to be inserted into the receiving space of the housing 110. The upper surface of the heat sink 130 is formed with a screw groove so that the substrate 120 and the heat bridge 160 can be screwed. Since the substrate 120 is coupled to the upper surface of the heat sink 130, heat generated from the light emitting diode 140 and the control chip 150 is transferred to the heat sink 130 through the substrate 120 to radiate heat. do.

이때, 히트싱크(130)와 히트브리지(160)의 결합은 나사 결합이 아닌 열전도 접착 등을 이용하여 결합될 수도 있다.In this case, the heat sink 130 and the heat bridge 160 may be coupled using heat conduction bonding, not screw coupling.

히트싱크(130)는 방열성능을 위해 열전도율이 높은 금속제는 어떤 것이든지 이용할 수 있으며, 비용 등을 고려하여 알루미늄이나 알루미늄 합금 등의 금속으로 제조될 수 있다.The heat sink 130 may use any metal having high thermal conductivity for heat dissipation performance, and may be made of metal such as aluminum or aluminum alloy in consideration of cost.

발광 다이오드(140)는 다수 개가 기판(120)에 실장되며, 본 발명의 일 실시예에서 다수 개의 발광 다이오드(140)는 기판(120)의 테두리를 따라 원형으로 배치되어 실장된다. 또한, 본 발명의 일 실시예에 따른 발광 다이오드(140)는 교류 직결 구동방식으로 동작되는 발광 다이오드(140)가 이용된다.A plurality of light emitting diodes 140 are mounted on the substrate 120, and in one embodiment of the present invention, a plurality of light emitting diodes 140 are mounted in a circular shape along the edge of the substrate 120. In addition, the light emitting diode 140 according to an embodiment of the present invention uses a light emitting diode 140 that operates in an AC direct drive method.

제어칩(150)은 기판(120)에 실장되며, 기존의 SMPS나 PSU 등을 포함한 전원 공급장치를 생략하고 교류 직결형으로 교류용 발광 다이오드(140)를 구동시키는 회로가 집적된 것이다. 따라서 기존의 조명 장치와 같이, 교류를 직류로 변환하기 위한 장치나 부피 및 무게가 무거운 전원공급장치를 전부 생략할 수 있어, 발광 다이오드 조명 장치(100)의 크기를 줄일 수 있다.The control chip 150 is mounted on the substrate 120, and omits a conventional power supply device including an SMPS or PSU and integrates a circuit for driving the AC LED 140 in an AC direct connection type. Therefore, like a conventional lighting device, it is possible to omit a device for converting alternating current into direct current or a power supply device having a large volume and weight, thereby reducing the size of the light emitting diode lighting device (100).

발광 다이오드(140)와 제어칩(150)에 전원이 인가됨에 따라 동작하면서 발생된 열은 기본적으로 기판(120)을 통해 하부의 히트싱크(130)로 전달되어 방열된다. 제어칩(150)에서 발생된 열을 더욱 효율적으로 방열하기 위해 제어칩(150) 상부에 히트브리지(160)를 설치한다.Heat generated while the power is applied to the light emitting diode 140 and the control chip 150 is basically transferred to the heat sink 130 through the substrate 120 to radiate heat. In order to more efficiently dissipate heat generated from the control chip 150, the heat bridge 160 is installed on the control chip 150.

히트브리지(160)는 제어칩(150)에서 발생된 열을 추가적으로 히트싱크(130)로 전달하기 위해 구비된다. 이를 위해 히트브리지(160)는 일 측은 제어칩(150)의 상면에 접한 상태로 구비되고, 타 측은 기판(120)에 형성된 관통홀을 관통하여 히트싱크(130)에 접한다.The heat bridge 160 is provided to additionally transfer heat generated from the control chip 150 to the heat sink 130. To this end, one side of the heat bridge 160 is provided in contact with the top surface of the control chip 150, and the other side contacts the heat sink 130 by passing through a through hole formed in the substrate 120.

또한, 하우징의 외부에 형성되어, 외부에서 공급된 전원을 기판 측으로 전달하기 위한 단자가 더 구비될 수 있다.In addition, a terminal formed on the outside of the housing and configured to transfer power supplied from the outside to the substrate side may be further provided.

도 3에 도시된 바와 같이, 히트브리지(160)는 제어칩(150)의 상면과 기판(120)의 관통홀을 통해 노출된 히트싱크(130)의 상면의 높이차로 인해 일 측과 타 측이 단차지게 형성된다.As shown in FIG. 3, the heat bridge 160 has one side and the other side due to a height difference between the top surface of the control chip 150 and the top surface of the heat sink 130 exposed through the through hole of the substrate 120. It is formed stepped.

기판(120)에 형성된 관통홀은 히트브리지(160)의 타 측이 관통할 수 있도록 히트브리지(160)의 크기에 대응되는 크기로 형성된다. 그리고 히트브리지(160)가 기판(120)의 관통홀에 삽입되고, 일 측은 제어칩(150)을 덮으면서 제어칩(150) 상면에 접한다. 히트브리지(160)는 제어칩(150)의 상면을 부분적으로 덮을 수도 있고, 완전히 덮을 수도 있다. 히트브리지(160)와 제어칩(150)의 접촉 면적이 넓을수록 방열 효과가 증가된다. 히트브리지(160)가 기판(120)의 관통홀에 삽입된 상태에서 나사결합으로 히트브리지(160)가 고정된다. 또한, 필요에 따라 제어칩(150)의 상면에 방열 그리스 등이 도포될 수 있다.The through hole formed in the substrate 120 is formed to have a size corresponding to the size of the heat bridge 160 so that the other side of the heat bridge 160 can pass therethrough. The heat bridge 160 is inserted into the through hole of the substrate 120, and one side of the heat bridge 160 contacts the top surface of the control chip 150 while covering the control chip 150. The heat bridge 160 may partially cover the top surface of the control chip 150 or may completely cover the top surface of the control chip 150. As the contact area between the heat bridge 160 and the control chip 150 increases, the heat dissipation effect is increased. The heat bridge 160 is fixed by screwing in the state in which the heat bridge 160 is inserted into the through hole of the substrate 120. In addition, heat dissipation grease or the like may be applied to an upper surface of the control chip 150 as necessary.

히트브리지(160)는 히트싱크(130)와 마찬가지로 방열성능을 위해 열전도율이 높은 금속제는 어떤 것이든지 이용할 수 있으며, 비용 등을 고려하여 알루미늄이나 알루미늄 합금 등의 금속으로 제조될 수 있다.Like the heat sink 130, the heat bridge 160 may use any metal having high thermal conductivity for heat dissipation performance, and may be made of metal such as aluminum or aluminum alloy in consideration of cost.

그리고 본 발명의 일 실시예에서 도면에 도시하지 않았으나, 하우징(110)의 개방된 상면을 덮어 발광 다이오드(140)에서 방출된 빛을 확산하기 위한 캡이 더 구비될 수 있다. 캡은 반구형으로 형성될 수 있으며, 폴리카보네이트 소재 등 투광소재의 합성수지로 제조된다.Although not shown in the drawing in one embodiment of the present invention, a cap for spreading the light emitted from the light emitting diodes 140 may be further provided to cover the open upper surface of the housing 110. The cap may be formed in a hemispherical shape, and is made of a synthetic resin of a light transmitting material such as polycarbonate material.

도 4는 본 발명의 일 실시예에 따른 발광 다이오드 조명 장치의 제어칩에서 발생된 열이 히트싱크(130)로 전달되는 경로를 도시한 도면이다.4 is a diagram illustrating a path through which heat generated from a control chip of the LED lighting apparatus according to an embodiment of the present invention is transferred to the heat sink 130.

제어칩(150)에서 발생된 열은 도 4에 도시된 바와 같이, 하부로 기판(120)을 통해 히트싱크(130)로 전달되는 방향과 상부로 히트브리지(160)를 통해 히트싱크(130)로 전달되는 방향으로 이동된다. 그러므로 제어칩(150)에서 발생된 열을 더욱 효율적으로 방출할 수 있다. 더욱이, 히트브리지(160)는 히트싱크(130)와 동일한 소재로 제조되므로, 제어칩(150)의 방열이 보다 효과적으로 이루어진다.Heat generated from the control chip 150 is transferred to the heat sink 130 through the substrate 120 to the bottom and heat sink 130 through the heat bridge 160 to the top, as shown in FIG. It is moved in the direction of delivery. Therefore, the heat generated from the control chip 150 can be discharged more efficiently. Furthermore, since the heat bridge 160 is made of the same material as the heat sink 130, heat dissipation of the control chip 150 is more effectively performed.

도 5는 본 발명의 다른 실시예에 따른 발광 다이오드 조명 장치를 도시한 도면이다.5 is a view showing a light emitting diode lighting apparatus according to another embodiment of the present invention.

본 발명의 다른 실시예에 따른 발광 다이오드 조명 장치(200)는 하우징(210), 기판(220), 히트싱크(230), 발광 다이오드(240), 제어칩(250) 및 히트브리지(260)를 포함한다.The LED lighting apparatus 200 according to another embodiment of the present invention includes a housing 210, a substrate 220, a heat sink 230, a light emitting diode 240, a control chip 250, and a heat bridge 260. Include.

본 발명의 일 실시예에서는 벌브 타입의 발광 다이오드 조명 장치(100)에 대해 설명하였지만, 본 발명의 다른 실시예는 일 실시예에서와는 달리, 형광등 타입의 발광 다이오드 조명 장치(200)에 대해 설명한다. 즉, 본 발명에 따른 발광 다이오드 조명 장치는 조명 장치 타입에 상관없이 적용할 수 있다. 그리고 본 발명의 다른 실시예에 대해 설명하면서 일 실시예에서와 동일한 설명은 생략한다.Although one embodiment of the present invention has been described with respect to the bulb-type LED lighting device 100, another embodiment of the present invention will be described with respect to the fluorescent lamp type LED lighting device 200, unlike in the embodiment. That is, the LED lighting apparatus according to the present invention can be applied regardless of the lighting apparatus type. And while explaining the other embodiment of the present invention, the same description as in the embodiment is omitted.

도 5를 참조하면, 하우징(210)은 원형의 중공을 가지고, 일 방향으로 길게 연장된 형상으로 형성된다. 그리고 하우징(210)은 원형 형상의 단면 중 발광 다이오드(140)에서 발광된 빛이 방출될 수 있도록 일부 또는 전체가 투명 또는 반투명으로 형성될 수 있다. 하우징(210)의 중공에 기판(220) 및 히트싱크(230)가 하우징(210)의 길이방향으로 삽입될 수 있다.Referring to FIG. 5, the housing 210 has a circular hollow and is formed in a shape extending in one direction. In addition, the housing 210 may be partially or entirely formed in a transparent or translucent manner so that light emitted from the light emitting diode 140 may be emitted in a circular cross section. The substrate 220 and the heat sink 230 may be inserted in the longitudinal direction of the housing 210 in the hollow of the housing 210.

기판(220)은 하우징(210)의 중공에 삽입될 수 있도록 일 방향으로 길게 연장되어 형성되고, 일면에 발광 다이오드(240)와 제어칩(250)이 실장된다. 또한, 기판(220)의 실장면에는 외부에서 공급된 전원이 발광 다이오드(240) 및 제어칩(250)에 공급될 수 있도록 도전 패턴이 형성될 수 있다. 그리고 기판(220)은 열전도성이 높은 금속을 기반으로 하는 MCPCB(metal core PCB)가 이용될 수 있으나, 이에 한정되지는 않는다.The substrate 220 is formed to extend in one direction so as to be inserted into the hollow of the housing 210, and the light emitting diode 240 and the control chip 250 are mounted on one surface thereof. In addition, a conductive pattern may be formed on the mounting surface of the substrate 220 such that power supplied from the outside may be supplied to the light emitting diode 240 and the control chip 250. The substrate 220 may be a metal core PCB (MCPCB) based on metal having high thermal conductivity, but is not limited thereto.

히트싱크(230)는 기판(220)의 하부에 설치되고, 기판(220)과 같이 일 방향으로 길게 연장되어 형성된다. 이때, 히트싱크(230)는 기판(220)보다 일정 거리만큼 길게 형성될 수 있다. 본 발명의 다른 실시예에서 히트싱크(230)가 하우징(210)에 삽입되는 구조에 대해 설명하지만, 히트싱크(230)는 하우징(210) 내부에 설치되지 않고, 외부로 노출될 수도 있다. 즉, 히트싱크(230)와 하우징(210)은 결합돌기나 결합홈 등에 의해 서로 결합되는 구조일 수도 있다.The heat sink 230 is installed below the substrate 220, and is formed to extend in one direction like the substrate 220. In this case, the heat sink 230 may be formed to be longer than the substrate 220 by a predetermined distance. In another exemplary embodiment of the present invention, a structure in which the heat sink 230 is inserted into the housing 210 will be described. However, the heat sink 230 may not be installed inside the housing 210 and may be exposed to the outside. That is, the heat sink 230 and the housing 210 may have a structure that is coupled to each other by a coupling protrusion or a coupling groove.

발광 다이오드(240)는 다수 개가 기판(220)의 일면 실장되고, 본 발명의 다른 실시예에서 발광 다이오드(240)는 기판(220)의 길이 방향을 따라 실장될 수 있다.A plurality of light emitting diodes 240 may be mounted on one surface of the substrate 220, and in another embodiment of the present invention, the light emitting diodes 240 may be mounted along the length direction of the substrate 220.

제어칩(250)은 기판(220)의 일 측에 실장될 수 있고, 외부에서 공급된 교류전원을 교류 직결형으로 교류로 구동할 수 있는 발광 다이오드(240)에 공급하여 발광 다이오드(240)를 구동시킬 수 있다.The control chip 250 may be mounted on one side of the substrate 220, and supply the light emitting diode 240 by supplying an AC power supplied from the outside to the light emitting diode 240 which may be driven in alternating current by an AC direct connection type. Can be driven.

상기와 같이, 발광 다이오드(240)와 제어칩(250)에서 발생된 열은 기판(220)을 통해 히트싱크(230)로 전달되고, 제어칩(250)에서 발생된 열을 보다 효율적으로 방열하기 위해 제어칩(250) 상부를 덮을 수 있는 히트브리지(260)가 추가로 구비된다.As described above, heat generated from the light emitting diode 240 and the control chip 250 is transferred to the heat sink 230 through the substrate 220, and more efficiently radiate heat generated from the control chip 250. In order to cover the top of the control chip 250, a heat bridge 260 is further provided.

히트브리지(260)는 제어칩(250)의 상부를 덮어 제어칩(250) 상부와 접하도록 형성되고, 제어칩(250)의 열을 히트싱크(230)로 전달하기 위해 구비된다. 그에 따라 히트브리지(260)는 일 실시예에서와 같이, 단차가 형성되도록 절곡된 형상으로 형성되고, 히트브리지(260)의 일 측은 제어칩(250)의 상부에 접촉하고, 반대 측인 타 측은 히트싱크(230)에 접촉할 수 있다. 히트브리지(260)에 단차가 형성된 것은 제어칩(250)의 상면과 히트싱크(230)의 상면의 단차에 기인한 것이다.The heat bridge 260 is formed to cover the upper portion of the control chip 250 to be in contact with the upper portion of the control chip 250, and is provided to transfer the heat of the control chip 250 to the heat sink 230. Accordingly, the heat bridge 260 is formed in a shape bent to form a step, as in one embodiment, one side of the heat bridge 260 is in contact with the top of the control chip 250, the other side is the heat May contact the sink 230. The step formed in the heat bridge 260 is due to the step between the top surface of the control chip 250 and the top surface of the heat sink 230.

이때, 히트브리지(260)의 타 측은 기판(220)보다 길게 형성되어 노출된 히트싱크(230)에 접촉될 수 있으며, 히트브리지(260)와 히트싱크(230)는 나사 결합이나 열전도 접착 등을 이용하여 결합될 수 있다. 여기서, 본 발명의 일 실시예에서와 같이, 기판(220)에 관통홀이 형성되어 관통홀을 통해 히트브리지(260)와 히트싱크(230)가 접촉될 수도 있다.In this case, the other side of the heat bridge 260 may be formed to be longer than the substrate 220 to contact the exposed heat sink 230, and the heat bridge 260 and the heat sink 230 may be bonded to each other by screwing or heat conducting. Can be combined using. Here, as in one embodiment of the present invention, a through hole is formed in the substrate 220 may be in contact with the heat bridge 260 and the heat sink 230 through the through hole.

도 6의 (a) 및 도 6의 (b)는 본 발명의 또 다른 실시예에 따른 발광 다이오드 조명 장치의 히트브리지가 설치된 것을 각각 도시한 사시도 및 단면도이다.6 (a) and 6 (b) are a perspective view and a cross-sectional view respectively showing that the heat bridge of the light emitting diode lighting apparatus according to another embodiment of the present invention is installed.

본 발명의 또 다른 실시예에 따른 발광 다이오드 조명 장치는 하우징(310), 기판(320), 히트싱크(330), 발광 다이오드(340), 제어칩(350) 및 히트브리지(360)를 포함한다. 본 발명의 또 다른 실시예에 대해 설명하면서 일 실시예나 다른 실시예에서와 동일한 설명은 생략한다.The LED lighting apparatus according to another embodiment of the present invention includes a housing 310, a substrate 320, a heat sink 330, a light emitting diode 340, a control chip 350, and a heat bridge 360. . In the following description of another embodiment of the present invention, the same description as in one embodiment or another embodiment is omitted.

도 6의 (a)를 참조하면, 히트브리지(360)가 히트싱크(330)에 결합된 것을 도시한 것으로, 히트브리지(360)는 기판(320)에 실장된 제어칩(350)의 상부를 덮은 상태에서 히트싱크(330)와 직접 접촉되기 위해 'ㄷ'자 형상으로 절곡된 형상으로 형성될 수 있다. 히트브리지(360)의 일 측은 제어칩(350) 상부를 덮은 상태에서 히트싱크(330) 측으로 절곡되어 연장된 다음, 히트싱크(330)와 접촉되도록 다시 절곡되어 타 측이 히트싱크(330)와 접촉될 수 있다.Referring to FIG. 6A, the heat bridge 360 is coupled to the heat sink 330, and the heat bridge 360 covers an upper portion of the control chip 350 mounted on the substrate 320. It may be formed in a shape bent in a 'c' shape to be in direct contact with the heat sink 330 in a covered state. One side of the heat bridge 360 is bent and extended to the heat sink 330 in the state covering the top of the control chip 350, and then bent again to contact the heat sink 330, the other side and the heat sink 330 Can be contacted.

도 6의 (b)에 도시된 바와 같이, 히트브리지(360)의 타 측 단은 히트싱크(330)에 접촉된다. 그리고 본 발명의 또 다른 실시예에서 히트브리지(360)와 히트싱크(330) 간의 결합을 위해 별도의 구성이 추가되지 않고, 히트브리지(360)가 가지는 탄성에 의해 클립과 같은 구조로 히트싱크(330)와 결합될 수 있다. 이를 위해 히트싱크(330)의 일 측면에는 히트브리지(360)가 결합되도록 결합홈(331)이 형성될 수 있다. 그에 따라 히트브리지(360)는 제어칩(350) 상부와 히트싱크(330)에 형성된 결합홈(331)에 걸려 히트싱크(330)에 결합될 수 있다.As shown in FIG. 6B, the other end of the heat bridge 360 is in contact with the heat sink 330. In addition, in another embodiment of the present invention, a separate configuration is not added for coupling between the heat bridge 360 and the heat sink 330, and the heat sink has a structure such as a clip due to the elasticity of the heat bridge 360. 330 may be combined. To this end, a coupling groove 331 may be formed at one side of the heat sink 330 such that the heat bridge 360 is coupled thereto. Accordingly, the heat bridge 360 may be coupled to the heat sink 330 by being caught by the coupling groove 331 formed in the upper portion of the control chip 350 and the heat sink 330.

여기서, 히트브리지(360)를 접착물질을 이용하여 히트싱크(330)에 결합시키는 경우에는 상기에서 설명한 바와 같이 히트싱크(330)에 결합홈이 형성되지 않은 상태에서 히트브리지(360)와 히트싱크(330)가 결합될 수도 있다.Here, when the heat bridge 360 is bonded to the heat sink 330 using an adhesive material, as described above, the heat bridge 360 and the heat sink are not formed in the heat sink 330. 330 may be combined.

위에서 설명한 바와 같이 본 발명에 대한 구체적인 설명은 첨부된 도면을 참조한 실시예에 의해서 이루어졌지만, 상술한 실시예는 본 발명의 바람직한 예를 들어 설명하였을 뿐이므로, 본 발명이 상기 실시예에만 국한되는 것으로 이해돼서는 안 되며, 본 발명의 권리범위는 후술하는 청구범위 및 그 등가개념으로 이해되어야 할 것이다.As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings. However, since the above-described embodiments have only been described by way of example, the present invention is limited to the above embodiments. It should not be understood, the scope of the present invention will be understood by the claims and equivalent concepts described below.

* 부호의 설명* Explanation of the sign

100: 발광 다이오드 조명 장치100: light emitting diode lighting device

110: 하우징 120: 기판110: housing 120: substrate

130: 히트싱크 140: 발광 다이오드130: heat sink 140: light emitting diode

150: 제어칩 160: 히트브리지150: control chip 160: heat bridge

Claims (14)

내부에 수용공간이 형성된 하우징;A housing in which an accommodation space is formed; 상기 하우징과 결합되고, 전도된 열을 방열하는 히트싱크;A heat sink coupled to the housing and dissipating conducted heat; 상기 히트싱크 상에 설치된 기판;A substrate provided on the heat sink; 상기 기판 상에 실장되고, 인가된 전력에 의해 빛을 발광하는 발광 다이오드;A light emitting diode mounted on the substrate and emitting light by an applied electric power; 상기 기판 상에 실장되며, 상기 발광 다이오드의 구동을 제어하는 제어칩; 및A control chip mounted on the substrate and controlling driving of the light emitting diode; And 상기 제어칩 상면에 접하고, 상기 제어칩에서 발생된 열을 상기 히트싱크로 전달하는 히트브리지를 포함하는 발광 다이오드 조명 장치.And a heat bridge in contact with an upper surface of the control chip and transferring heat generated from the control chip to the heat sink. 청구항 1에 있어서,The method according to claim 1, 상기 히트브리지는 일 측이 상기 제어칩 상면에 접하고, 타 측이 상기 히트싱크에 접하도록 절곡된 발광 다이오드 조명 장치.And the heat bridge is bent such that one side is in contact with the top surface of the control chip and the other side is in contact with the heat sink. 청구항 2에 있어서,The method according to claim 2, 상기 기판은 상기 히트브리지가 상기 히트싱크에 접하도록 상기 히트브리지가 관통할 수 있는 홀이 형성된 발광 다이오드 조명 장치.The substrate is a light emitting diode illumination device formed with a hole through which the heat bridge penetrates the heat bridge in contact with the heat sink. 청구항 3에 있어서,The method according to claim 3, 상기 발광 다이오드는 다수 개이고, 상기 다수의 발광 다이오드는 상기 기판의 테두리 형상을 따라 배치되게 실장되고,The plurality of light emitting diodes are mounted, the plurality of light emitting diodes are mounted to be arranged along the edge shape of the substrate, 상기 제어칩은 상기 다수의 발광 다이오드에 의해 둘러싸이도록 상기 기판에 실장된 발광 다이오드 조명 장치.And the control chip is mounted on the substrate to be surrounded by the plurality of light emitting diodes. 청구항 2에 있어서,The method according to claim 2, 상기 히트브리지는 상기 제어칩의 상면에 접하는 제1 접면부와 상기 히트싱크에 접하는 제2 접면부를 포함하고,The heat bridge includes a first contact portion in contact with the top surface of the control chip and a second contact portion in contact with the heat sink, 상기 제1 접면부와 제2 접면부는 단차가 형성된 발광 다이오드 조명 장치.And a first step portion and a second contact portion having a stepped portion. 청구항 2에 있어서,The method according to claim 2, 상기 히트싱크는 상기 기판보다 크게 형성되고,The heat sink is formed larger than the substrate, 상기 히트브리지는 상기 히트싱크가 노출된 위치에 접하는 발광 다이오드 조명 장치.The heat bridge is a light emitting diode illumination device in contact with the position where the heat sink is exposed. 청구항 6에 있어서,The method according to claim 6, 상기 기판은 일 방향의 길이를 가지도록 형성되며,The substrate is formed to have a length in one direction, 상기 발광 다이오드는 다수 개이고, 상기 다수의 발광 다이오드는 상기 기판의 길이 방향으로 배치되며,The plurality of light emitting diodes, the plurality of light emitting diodes are arranged in the longitudinal direction of the substrate, 상기 제어칩은 상기 기판의 길이방향 일 측에 실장된 발광 다이오드 조명 장치.The control chip is a light emitting diode lighting device mounted on one side in the longitudinal direction of the substrate. 청구항 2에 있어서,The method according to claim 2, 상기 히트싱크의 측면에는 상기 히트브리지의 타 측이 결합되기 위한 결합홈이 형성된 발광 다이오드 조명 장치.LED lighting device is formed on the side of the heat sink is coupled groove for coupling the other side of the heat bridge. 청구항 8에 있어서,The method according to claim 8, 상기 히트브리지는 'ㄷ'자 형상으로 절곡된 발광 다이오드 조명 장치.The heat bridge is a light emitting diode illumination device bent in a '' 'shape. 청구항 1에 있어서,The method according to claim 1, 상기 히트브리지는 상기 제어칩의 상면을 완전히 덮도록 형성된 발광 다이오드 조명 장치.The heat bridge is a light emitting diode illumination device formed to completely cover the upper surface of the control chip. 청구항 1에 있어서,The method according to claim 1, 상기 발광 다이오드는 교류 구동이 가능한 교류용 발광 다이오드인 발광 다이오드 조명 장치.The light emitting diode is a light emitting diode illumination device that is an AC light emitting diode capable of AC drive. 청구항 11에 있어서,The method according to claim 11, 상기 제어칩은 상기 교류용 발광 다이오드를 구동시키기 위한 교류구동 제어칩인 발광 다이오드 조명 장치.The control chip is a light emitting diode lighting device is an AC drive control chip for driving the AC light emitting diode. 청구항 1에 있어서,The method according to claim 1, 외부 전원에서 전력을 공급받기 위한 단자를 더 포함하는 발광 다이오드 조명 장치.LED lighting device further comprising a terminal for receiving power from an external power source. 청구항 13에 있어서,The method according to claim 13, 상기 단자는 상기 하우징의 외면에 형성된 발광 다이오드 조명 장치.The terminal is a light emitting diode illumination device formed on the outer surface of the housing.
PCT/KR2015/005373 2014-05-30 2015-05-28 Light-emitting diode lighting device Ceased WO2015183021A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2014-0066539 2014-05-30
KR20140066539 2014-05-30
KR1020150073590A KR20150138040A (en) 2014-05-30 2015-05-27 Light emitting diode illumination apparatus
KR10-2015-0073590 2015-05-27

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030096585A1 (en) * 2001-11-16 2003-05-22 Alcatel Radiocommunications device including a heat dissipation system
US20080298066A1 (en) * 2004-04-15 2008-12-04 Koninklijke Philips Electronics, N.V. Lamp Unit
KR20100033142A (en) * 2008-09-19 2010-03-29 화우테크놀러지 주식회사 Heat discharge structure for led lamp
US20110181851A1 (en) * 2008-09-19 2011-07-28 Carl Zeiss Smt Gmbh Temperature-control device for an optical assembly
KR20120086394A (en) * 2011-01-26 2012-08-03 이정훈 Led module and lighting assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030096585A1 (en) * 2001-11-16 2003-05-22 Alcatel Radiocommunications device including a heat dissipation system
US20080298066A1 (en) * 2004-04-15 2008-12-04 Koninklijke Philips Electronics, N.V. Lamp Unit
KR20100033142A (en) * 2008-09-19 2010-03-29 화우테크놀러지 주식회사 Heat discharge structure for led lamp
US20110181851A1 (en) * 2008-09-19 2011-07-28 Carl Zeiss Smt Gmbh Temperature-control device for an optical assembly
KR20120086394A (en) * 2011-01-26 2012-08-03 이정훈 Led module and lighting assembly

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