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WO2015178617A1 - Cutting tool insert - Google Patents

Cutting tool insert Download PDF

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Publication number
WO2015178617A1
WO2015178617A1 PCT/KR2015/004775 KR2015004775W WO2015178617A1 WO 2015178617 A1 WO2015178617 A1 WO 2015178617A1 KR 2015004775 W KR2015004775 W KR 2015004775W WO 2015178617 A1 WO2015178617 A1 WO 2015178617A1
Authority
WO
WIPO (PCT)
Prior art keywords
support
support substrate
cutting tool
central support
tool insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/004775
Other languages
French (fr)
Korean (ko)
Inventor
고영호
박희섭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iljin Diamond Co Ltd
Original Assignee
Iljin Diamond Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Diamond Co Ltd filed Critical Iljin Diamond Co Ltd
Priority to US15/324,261 priority Critical patent/US20170145753A1/en
Publication of WO2015178617A1 publication Critical patent/WO2015178617A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • EFIXED CONSTRUCTIONS
    • E21EARTH OR ROCK DRILLING; MINING
    • E21BEARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B10/00Drill bits
    • E21B10/46Drill bits characterised by wear resisting parts, e.g. diamond inserts
    • E21B10/56Button-type inserts
    • E21B10/567Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
    • E21B10/573Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element
    • E21B10/5735Interface between the substrate and the cutting element
    • EFIXED CONSTRUCTIONS
    • E21EARTH OR ROCK DRILLING; MINING
    • E21BEARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B10/00Drill bits
    • E21B10/46Drill bits characterised by wear resisting parts, e.g. diamond inserts
    • EFIXED CONSTRUCTIONS
    • E21EARTH OR ROCK DRILLING; MINING
    • E21BEARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B10/00Drill bits
    • E21B10/46Drill bits characterised by wear resisting parts, e.g. diamond inserts
    • E21B10/56Button-type inserts
    • E21B10/567Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
    • E21B10/573Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B27/00Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14Cutting tools of which the bits or tips or cutting inserts are of special material
    • B23B27/18Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing
    • B23B27/20Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing with diamond bits or cutting inserts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B29/00Holders for non-rotary cutting tools; Boring bars or boring heads; Accessories for tool holders
    • B23B29/04Tool holders for a single cutting tool
    • B23B29/043Tool holders for a single cutting tool with cutting-off, grooving or profile cutting tools, i.e. blade- or disc-like main cutting parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P5/00Setting gems or the like on metal parts, e.g. diamonds on tools
    • EFIXED CONSTRUCTIONS
    • E21EARTH OR ROCK DRILLING; MINING
    • E21BEARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B10/00Drill bits
    • E21B10/02Core bits

Definitions

  • the present invention relates to a cutting tool insert.
  • Inserts for cutting tools are used to carry out excavation work to cut rock or rock existing in the ground coupled to a tool assembly used in oil drilling work or cutting work, or to cut metal or other members.
  • a plurality of inserts for cutting tools are typically used attached to the cutting tool.
  • the cutting tool insert may include a columnar supporting substrate and a cutting layer formed of an ultra hard layer or the like formed at one end of the supporting substrate to perform a cutting function.
  • the cutting layer can then comprise a polycrystalline diamond compact, which is generally sintered under high temperature and high pressure conditions in which the diamond particles are crystallographically or thermodynamically stable.
  • the present invention proposes a cutting tool insert capable of reducing residual stress generated in a polycrystalline diamond compact.
  • the support substrate extending in the first direction; And a cutting layer coupled to one surface of the support substrate and supported by the support substrate, wherein one side of the support substrate is provided with a ridge raised in the first direction.
  • the ridge may include a central support portion protruded from the center in the first direction, and a peripheral support portion protruded in the first direction between the central support portion and an outer circumferential surface of the support substrate.
  • the support substrate may have a cylindrical shape extending in the first direction, and the central support portion may have a diameter D2 smaller than the diameter D1 of the support substrate.
  • the circumferential support portion may be gradually raised from the outer circumferential surface of the support substrate toward the central support portion.
  • the inclination ⁇ of the circumferential supporter may be 20 ° or less based on the second direction perpendicular to the first direction.
  • the central support may be gradually raised toward the center from the peripheral support.
  • the radius of curvature r of the central support may be 37.5 mm or less.
  • the radius of curvature r of the circumferential support may be 37.5 mm or less.
  • the ratio of the area of the central support to the area of the ridge may be 0.45 to 0.8.
  • the upper surface of the central support may be surface treated to have an uneven structure.
  • the uneven structure may be formed in a left-right symmetrical structure with respect to the center of the upper surface of the central support.
  • FIG. 1 is a perspective view of a cutting tool insert according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of a cutting tool insert according to an embodiment of the present invention.
  • FIG. 3 is a sectional view taken along the line AA of FIG. 1.
  • FIG. 4 is a diagram illustrating residual stresses at the top and sides of the cutting layer according to the inclination angle of the circumferential support part according to the exemplary embodiment of the present invention.
  • FIG. 5 is a diagram illustrating residual stresses at the top and sides of the cutting layer according to the radius of curvature of the central support part according to the exemplary embodiment of the present invention.
  • FIG. 6 is a diagram showing the maximum residual stress according to the ratio of the area of the central support to the ridge area.
  • 7A, 7B, and 7C are plan views, front views, and cross-sectional views, respectively, of a support substrate 110 'according to another embodiment of the present invention.
  • the support substrate extending in the first direction; And a cutting layer coupled to one surface of the support substrate and supported by the support substrate, wherein one side of the support substrate is provided with a ridge raised in the first direction.
  • FIG. 1 shows a perspective view of a cutting tool insert 100 according to one embodiment of the invention
  • FIG. 2 shows an exploded perspective view, respectively.
  • FIG. 3 is a cross-sectional view taken along line AA of FIG. 1.
  • the cutting tool insert 100 includes a support substrate 110 and a cutting layer 120.
  • the support substrate 110 may be formed in a columnar shape, for example, may be formed in a cylindrical shape extending in the first direction.
  • the first direction may mean an upward direction of the support substrate 110, as shown in FIGS. 1 to 3.
  • the support substrate 110 may be formed of a carbide alloy including tungsten (W), tantalum (Ta), vanadium (V), and titanium (Ti).
  • cobalt (Co) may be used as a binder to facilitate sintered body bonding.
  • Iron (Fe), nickel (Ni) and the like can be used.
  • the support substrate 110 may include a cobalt-based tungsten carbide (WC-Co) alloy, and the sintering process may be performed by placing a cobalt-based tungsten carbide material in a mold for sintering to form the support substrate.
  • WC-Co cobalt-based tungsten carbide
  • the cutting layer 120 is formed on the upper surface of the support substrate 110.
  • the cutting layer 120 is formed on the upper surface of the support substrate 110, but may be formed on the lower surface of the support substrate 110 according to the viewing direction.
  • Cutting layer 120 may include a base material 122 and diamond particles 124.
  • the base material 122 may contain cobalt-based tungsten carbide (WC-Co), and the diamond particles 124 may be made of polycrystalline diamond (PCD).
  • WC-Co cobalt-based tungsten carbide
  • PCD polycrystalline diamond
  • a sintering method may be used to form the cutting layer 120 on the upper surface of the support substrate 110.
  • the sintering process according to an embodiment of the present invention will be described in more detail.
  • the material for forming the cutting layer 120 is put in a constant mold in powder form.
  • cobalt-based tungsten carbide (WC-Co) powder for forming the base material 122 and polycrystalline diamond particles for forming the diamond particles 124 are added thereto.
  • the volume ratio of the diamond particles 124 in the cutting layer 120 may be 1/2 to 4/5. If the volume ratio of the diamond particles 124 is less than 1/2, the cutting efficiency is reduced. In addition, when the volume ratio of the diamond particles 124 exceeds 4/5, the amount of the base material 122 interposed between the diamond particles 124 is reduced, which is the diamond particles 124 and the base material 122. The weakening of the bonding force between the diamond particles 124 is easily separated from the cutting layer 120. Therefore, the volume ratio of the diamond particles 124 is preferably 1/2 to 4/5.
  • the base material 122 and the diamond particles 124 are evenly distributed using a ball mill, an attention mill, or the like.
  • the support substrate 110 is placed in the mold into which the powders are placed, and the upper surface of the support substrate 110 faces the powder so that the cutting layer 120 may be coupled to the upper surface of the support substrate 110.
  • the base material 122 is preferably distributed on the surface of the cutting layer 120 in contact with the upper surface of the support substrate 110.
  • the support substrate 110 may include a carbide-based alloy (eg, include cobalt-based tungsten carbide), and the base material 122 may also contain cobalt-based tungsten carbide, thereby supporting the support substrate (
  • the upper surface of the substrate 110 and the base material 122 contain the same components.
  • the bonding force between the upper surface of the support substrate 110 and the base material 122 is different, that is, the upper surface of the support substrate 110 and the diamond.
  • the binding force of the particles 124 may be improved.
  • the base material 122 may be distributed on the surface of the cutting layer 120 to be bonded to the upper surface of the supporting substrate 110 to improve the bonding force between the supporting substrate 110 and the cutting layer 120. Accordingly, durability of the cutting tool insert may be improved by preventing separation of the support substrate and the cutting layer.
  • the support substrate 110 and the cutting layer 120 are sintered at a high temperature and high pressure to be bonded.
  • the sintering treatment may be performed while maintaining the high temperature and high pressure to about 1300 to 1500 ° C and 5 to 7 GPa.
  • the mold containing the support substrate and the cutting layer may be sealed with a large cell, and the process may be performed. After the sintering process, the outer mold and the sealing cell may be removed and processed.
  • the cutting tool insert is accompanied by residual stress due to the characteristics of the sintering process performed at high temperature and high pressure. That is, residual stress occurs due to a difference in thermal coefficients of the support substrate 110 and the cutting layer 120.
  • This residual stress causes cracks in the support substrate and the cutting layer interface region and the inside, which causes the durability of the insert for the cutting tool.
  • the residual stress of the polycrystalline diamond compact that is, the cutting layer 120 may be reduced, which will be described below in more detail with reference to FIG. 3.
  • a raised portion 112 is formed on the upper surface of the support substrate 110 according to the embodiment of the present invention.
  • the ridge 112 may also be seen to be raised in the first direction.
  • the ridge 112 includes a central support 1121 protruded from the center to the top, and a circumferential support 1122 protruded upward between the central support 1121 and the outer circumferential surface of the support substrate 110. 1122 and central support 1121 are elevated toward the center.
  • the central support part 1121 is formed to have a diameter D2 smaller than the diameter D1 of the support substrate 110 to support the central portion of the cutting layer 120.
  • the upper surface of the central support part 1121 As an upper surface of the central support part 1121, an uneven structure for improving bonding strength with the cutting layer 120 may be applied.
  • the upper surface of the central support may be surface treated such that a plurality of fan-shaped grooves are formed along the circumference of the central support.
  • the concave-convex structure may have a left-right symmetrical structure with respect to the center of the upper surface of the central support so that the bonding force with the cutting layer 120 is evenly improved over the entire upper surface of the central support 1121.
  • the circumferential support part 1122 is formed to gradually rise from the outer circumferential surface of the support substrate 110 toward the central support part 1121 to support the circumferential portion of the cutting layer 120.
  • the peripheral support part 1122 has a shape in which the peripheral support is gradually raised, the peripheral support part 1122 is formed to be inclined, where the inclination ⁇ of the peripheral support part may be 20 ° or less.
  • FIG 4 illustrates residual stresses at the top and the outside of the cutting layer 120 according to the angle of inclination ⁇ of the circumferential support 1122 according to one embodiment of the invention.
  • the residual stresses are decreased by 23.56% and 38.03% at the upper and side portions when the inclination ⁇ is -10 °, and the inclination ⁇ is At -15 °, 29.32% and 49.58% decrease at the top and side, respectively, and when the inclination ⁇ is -20 °, 35.10% and 58.31% decrease at the top and side, respectively.
  • the circumferential support part 1122 is not formed flat, but is formed to be gradually raised from the outer circumferential surface of the support substrate 110 to the central support part 1121 so that the circumferential support part 1122 is inclined to 20 °.
  • residual stresses generated in the upper and side portions of the cutting layer 120 may be reduced to 35.10% and 58.31%, respectively.
  • the material for forming the cutting layer 120 is consumed accordingly, and the diffusion may not be properly performed during the sintering process. It is preferable that it is degrees or less.
  • the central support 1121 may also be formed to be gradually raised toward the center. That is, the central support part 1121 may be formed to be gradually raised from the peripheral support part 1122 toward the center to support the central portion of the cutting layer 120.
  • the central support portion 1121 has a shape of gradually rising, the central support portion 1121 has a predetermined curvature.
  • the radius of curvature r of the central support portion may be 37.5 mm or less.
  • FIG. 5 shows residual stresses at the top and the outside of the cutting layer 120 according to the radius of curvature r of the central support 1121 according to one embodiment of the invention.
  • the central support 1121 is not formed flat, but is formed to gradually rise from the circumferential support toward the center, whereby the radius of curvature r of the central support 1121 is formed to be 37.5 mm or less.
  • the residual stresses generated in the upper and side portions of the cutting layer 120 may be reduced by 28.8% and 47.32%, respectively.
  • the material for forming the cutting layer 120 is consumed as much, and the diffusion in the sintering process is not performed properly. It is preferable.
  • the center support part 1121 and the circumferential support part 1122 are divided for convenience of description, but the central support part and the circumferential support part are continuously formed so that one ridge 110 is formed on the upper surface of the support substrate 110.
  • the circumferential support portion 1122 may also have a radius of curvature r of 37.5 mm or less.
  • the central support 1121 has a curvature of 37.5 mm or less, and the circumferential support 1122 is formed at an angle of 20 ° or less, as described above, in order to reduce the residual stress of the cutting layer 120.
  • the ratio of the area of the central support 1121 to the total area can be derived.
  • the area of the central support portion 1121 to the total area of the ridge 110 may have a ratio of 0.45 ⁇ 0.8.
  • FIG. 6 shows the maximum residual stress (y-axis) according to the ratio of the area of the central support to the ridge area (x-axis). Referring to FIG. 6, the center ratio of the area of the central support is 0.45 to 0.8. As the area ratio of the support decreases, the maximum residual stress also tends to decrease.
  • the ratio is preferably 0.45 to 0.8.
  • a predetermined angle of inclination ⁇ is applied to the circumferential support part 1122, and at the same time, a predetermined radius of curvature according to an embodiment of the present invention is applied to the central support part 1121. r) is applied, but according to another embodiment of the present invention, as shown in FIG. 7, the support substrate 110 ′ in which the inclination is applied only to the circumferential support portion 1122 ′ may also be assumed.
  • FIG. 7 illustrates a plan view, a front view, and a cross-sectional view of a support substrate 110 ′ according to another embodiment of the present invention.
  • a base 112 ' can be formed, and the ridge 112' is raised from the center to the top between the central support 1121 'and the central support 1121' and the outer circumferential surface of the support substrate 110 '.
  • Raised peripheral support 1122 ′ Raised peripheral support 1122 ′.
  • the circumferential support portion 1122 ′ is formed to be gradually raised from the outer circumferential surface of the support substrate toward the central support portion, and the central support portion 1121 ′ may be formed in a flat shape instead of being raised from the circumferential support portion toward the center. .
  • the residual stress reduction effect due to the application of a predetermined radius of curvature r to the central support portion 1121 ′ cannot be expected, but the angle of inclination ⁇ according to the embodiment of the present invention is applied to the circumferential support portion 1122 ′. As it can be applied, the residual stress reduction effect can still be expected.
  • the upper surface of the central support portion 1121 ′ of the support substrate according to another embodiment of the present invention may be surface treated to have a concave-convex structure for improving the bonding force with the cutting layer 120.
  • a predetermined comb-tooth pattern may be formed on the upper surface of the central support part 1121 ′, and the comb-tooth pattern may have a left-right symmetrical structure with respect to the center of the upper surface of the central support part as illustrated in FIG. 7. .

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Geology (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Fluid Mechanics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)

Abstract

A cutting tool insert is disclosed. The disclosed cutting tool insert comprises: a supporting substrate extending in a first direction; and a cutting layer coupled to one surface of the supporting substrate and supported by the supporting substrate, wherein the one surface of the supporting substrate has an uplift part, which is uplifted in the first direction. The present invention can reduce a residual stress generated in a polycrystalline diamond compact.

Description

절삭 공구 인서트Cutting tool insert

본 발명은 절삭 공구 인서트에 관한 것이다.The present invention relates to a cutting tool insert.

절삭 공구용 인서트는 유정 굴착 작업 또는 절삭 작업 등에 사용되는 공구 조립체에 결합되어 지하에 존재하는 암반 등을 깎아내는 굴착 작업이나, 금속이나 기타 부재를 절삭하는 절삭 작업을 수행하는 데 사용된다. Inserts for cutting tools are used to carry out excavation work to cut rock or rock existing in the ground coupled to a tool assembly used in oil drilling work or cutting work, or to cut metal or other members.

절삭 공구용 인서트는 통상적으로 절삭 공구에 복수개가 부착되어 사용된다. A plurality of inserts for cutting tools are typically used attached to the cutting tool.

그리고, 절삭 공구용 인서트는 기둥 형상의 지지 기판 및 지지 기판의 일단부에 형성되어 절삭 기능을 하도록 초경질층 등으로 형성된 절삭층을 포함할 수 있다. The cutting tool insert may include a columnar supporting substrate and a cutting layer formed of an ultra hard layer or the like formed at one end of the supporting substrate to perform a cutting function.

이때, 절삭층은 다결정질 다이아몬드 컴팩트를 포함할 수 있는데, 다이아몬드 콤팩트는 일반적으로, 다이아몬드 입자가 결정학적 또는 열역학적으로 안정한 고온 및 고압 조건 하에 소결된다.The cutting layer can then comprise a polycrystalline diamond compact, which is generally sintered under high temperature and high pressure conditions in which the diamond particles are crystallographically or thermodynamically stable.

본 발명에서는 다결정 다이아몬드 컴팩트에 발생하는 잔류응력을 감소시킬 수 있는 절삭 공구 인서트를 제안하고자 한다.The present invention proposes a cutting tool insert capable of reducing residual stress generated in a polycrystalline diamond compact.

본 발명의 다른 목적들은 하기의 실시예를 통해 당업자에 의해 도출될 수 있을 것이다.Other objects of the present invention may be derived by those skilled in the art through the following examples.

본 발명의 바람직한 일 실시예에 따르면, 제1 방향으로 연장하는 지지 기판; 및 상기 지지 기판의 일면에 결합하여 상기 지지 기판에 의해 지지되는 절삭층;을 포함하되, 상기 지지 기판의 일면에는 상기 제1 방향으로 융기한 융기부가 형성되는 것을 특징으로 하는 절삭 공구 인서트가 제공된다. According to a preferred embodiment of the invention, the support substrate extending in the first direction; And a cutting layer coupled to one surface of the support substrate and supported by the support substrate, wherein one side of the support substrate is provided with a ridge raised in the first direction. .

상기 융기부는, 중앙에서 상기 제1 방향으로 융기한 중앙 지지부, 및 상기 중앙 지지부와 상기 지지 기판의 외주면 사이에서 상기 제1 방향으로 융기한 둘레 지지부를 포함할 수 있다. The ridge may include a central support portion protruded from the center in the first direction, and a peripheral support portion protruded in the first direction between the central support portion and an outer circumferential surface of the support substrate.

상기 지지 기판은 상기 제1 방향으로 연장하는 원기둥 형상을 가지며, 상기 중앙 지지부는 상기 지지 기판의 직경(D1)보다 작은 직경(D2)을 가질 수 있다. The support substrate may have a cylindrical shape extending in the first direction, and the central support portion may have a diameter D2 smaller than the diameter D1 of the support substrate.

상기 둘레 지지부는 상기 지지 기판의 외주면으로부터 상기 중앙 지지부로 갈수록 점진적으로 융기할 수 있다. The circumferential support portion may be gradually raised from the outer circumferential surface of the support substrate toward the central support portion.

상기 제1 방향에 수직하는 제2 방향을 기준으로 상기 둘레 지지부의 경사(α)는 20° 이하일 수 있다. The inclination α of the circumferential supporter may be 20 ° or less based on the second direction perpendicular to the first direction.

상기 중앙 지지부는 상기 둘레 지지부로부터 중앙으로 갈수록 점진적으로 융기할 수 있다. The central support may be gradually raised toward the center from the peripheral support.

상기 중앙 지지부의 곡률반경(r)은 37.5mm 이하일 수 있다. The radius of curvature r of the central support may be 37.5 mm or less.

상기 둘레 지지부의 곡률반경(r)은 37.5mm 이하일 수 있다. The radius of curvature r of the circumferential support may be 37.5 mm or less.

상기 융기부의 면적에 대한 상기 중앙 지지부의 면적의 비율은 0.45~0.8일 수 있다. The ratio of the area of the central support to the area of the ridge may be 0.45 to 0.8.

상기 중앙 지지부의 상면은 요철 구조를 갖도록 표면처리될 수 있다. The upper surface of the central support may be surface treated to have an uneven structure.

상기 요철 구조는 상기 중앙 지지부의 상면의 중심을 기준으로 좌우대칭구조로 형성될 수 있다. The uneven structure may be formed in a left-right symmetrical structure with respect to the center of the upper surface of the central support.

본 발명에 따르면, 다결정 다이아몬드 컴팩트에 발생하는 잔류응력을 감소시킬 수 있는 장점이 있다.According to the present invention, there is an advantage that can reduce the residual stress generated in the polycrystalline diamond compact.

도 1은 본 발명의 일 실시예에 따른 절삭 공구 인서트의 사시도를 도시하는 도면이다. 1 is a perspective view of a cutting tool insert according to an embodiment of the present invention.

도 2는 본 발명의 일 실시예에 따른 절삭 공구 인서트의 분해 사시도를 도시하는 도면이다. 2 is an exploded perspective view of a cutting tool insert according to an embodiment of the present invention.

도 3은 도 1의 AA선에 따른 단면도를 도시하는 도면이다. 3 is a sectional view taken along the line AA of FIG. 1.

도 4는 본 발명의 일 실시예에 따른 둘레 지지부의 경사 각도에 따른 절삭층의 상부와 측부에서의 잔류응력을 도시하는 도면이다. 4 is a diagram illustrating residual stresses at the top and sides of the cutting layer according to the inclination angle of the circumferential support part according to the exemplary embodiment of the present invention.

도 5는 본 발명의 일 실시예에 따른 중앙 지지부의 곡률반경에 따른 절삭층의 상부와 측부에서의 잔류응력을 도시하는 도면이다. FIG. 5 is a diagram illustrating residual stresses at the top and sides of the cutting layer according to the radius of curvature of the central support part according to the exemplary embodiment of the present invention.

도 6은 융기부 면적에 대한 중앙 지지부의 면적의 비율에 따른 최대 잔류응력을 도시하는 도면이다. 6 is a diagram showing the maximum residual stress according to the ratio of the area of the central support to the ridge area.

도 7a, 7b 및 7c는 본 발명의 다른 실시예에 따른 지지 기판(110')의 평면도, 정면도 및 단면도를 각각 도시하는 도면이다.7A, 7B, and 7C are plan views, front views, and cross-sectional views, respectively, of a support substrate 110 'according to another embodiment of the present invention.

본 발명의 바람직한 일 실시예에 따르면, 제1 방향으로 연장하는 지지 기판; 및 상기 지지 기판의 일면에 결합하여 상기 지지 기판에 의해 지지되는 절삭층;을 포함하되, 상기 지지 기판의 일면에는 상기 제1 방향으로 융기한 융기부가 형성되는 것을 특징으로 하는 절삭 공구 인서트가 제공된다. According to a preferred embodiment of the invention, the support substrate extending in the first direction; And a cutting layer coupled to one surface of the support substrate and supported by the support substrate, wherein one side of the support substrate is provided with a ridge raised in the first direction. .

본 발명은 다양한 변경을 가할 수 있고 여러 가지 실시예를 가질 수 있는 바, 특정 실시예들을 도면에 예시하고 상세한 설명에 상세하게 설명하고자 한다. 그러나, 이는 본 발명을 특정한 실시 형태에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물 내지 대체물을 포함하는 것으로 이해되어야 한다. 각 도면을 설명하면서 유사한 참조부호를 유사한 구성요소에 대해 사용하였다. As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements.

이하에서, 본 발명에 따른 실시예들을 첨부된 도면을 참조하여 상세하게 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 일 실시예에 따른 절삭 공구 인서트(100)의 사시도를, 도 2는 분해 사시도를 각각 도시한다. 1 shows a perspective view of a cutting tool insert 100 according to one embodiment of the invention, and FIG. 2 shows an exploded perspective view, respectively.

도 3은 도 1의 AA선에 따른 단면도를 도시한다. 3 is a cross-sectional view taken along line AA of FIG. 1.

도 1 내지 도 3에 도시된 바와 같이, 본 발명의 일 실시예에 따른 절삭 공구 인서트(100)는 지지 기판(110) 및 절삭층(120)을 포함한다. As shown in FIGS. 1 to 3, the cutting tool insert 100 according to an embodiment of the present invention includes a support substrate 110 and a cutting layer 120.

본 발명의 일 실시예에 따른 지지 기판(110)은 기둥 형상으로 형성될 수 있으며, 일례로, 제1 방향으로 연장하는 원기둥 형상으로 형성될 수 있다. 이때, 제1 방향은 도 1 내지 도 3에 도시된 바와 같이, 지지 기판(110)의 상방향을 의미할 수 있다. The support substrate 110 according to an embodiment of the present invention may be formed in a columnar shape, for example, may be formed in a cylindrical shape extending in the first direction. In this case, the first direction may mean an upward direction of the support substrate 110, as shown in FIGS. 1 to 3.

지지 기판(110)은 텅스텐(W), 탄탈(Ta), 바나듐(V), 티타늄(Ti)을 포함하는 탄화물 합금으로 형성될 수 있고, 이때, 소결체 결합을 용이하게 하기 위한 바인더로서 코발트(Co), 철(Fe), 니켈(Ni)등을 사용할 수 있다.The support substrate 110 may be formed of a carbide alloy including tungsten (W), tantalum (Ta), vanadium (V), and titanium (Ti). In this case, cobalt (Co) may be used as a binder to facilitate sintered body bonding. ), Iron (Fe), nickel (Ni) and the like can be used.

일례로, 지지 기판(110)은 코발트계 텅스텐 카바이드(WC-Co) 합금을 포함할 수 있고, 지지 기판을 형성하기 위한 소결 처리를 위하여, 코발트계 텅스텐 카바이드 물질을 틀에 넣고 소결 과정을 수행할 수 있다. For example, the support substrate 110 may include a cobalt-based tungsten carbide (WC-Co) alloy, and the sintering process may be performed by placing a cobalt-based tungsten carbide material in a mold for sintering to form the support substrate. Can be.

이러한 지지 기판(110)의 상면에는 절삭층(120)이 형성된다. The cutting layer 120 is formed on the upper surface of the support substrate 110.

본 발명에서는 설명의 편의를 위해, 지지 기판(110)의 상면에 절삭층(120)이 형성되는 것으로 가정하나, 보는 방향에 따라 지지 기판(110)의 하면에 형성될 수도 있다. In the present invention, for convenience of description, it is assumed that the cutting layer 120 is formed on the upper surface of the support substrate 110, but may be formed on the lower surface of the support substrate 110 according to the viewing direction.

본 발명의 일 실시예에 따른 절삭층(120)은 모재(122) 및 다이아몬드 입자(124)를 포함할 수 있다. Cutting layer 120 according to an embodiment of the present invention may include a base material 122 and diamond particles 124.

일례로, 모재(122)는 코발트 계열의 텅스텐 카바이드(WC-Co)를 함유할 수 있고, 다이아몬드 입자(124)는 다결정질 다이아몬드(polycrystalline diamond, PCD)로 이루어질 수 있다. For example, the base material 122 may contain cobalt-based tungsten carbide (WC-Co), and the diamond particles 124 may be made of polycrystalline diamond (PCD).

지지 기판(110)의 상면에 절삭층(120)을 형성하기 위하여 소결 방법을 이용할 수 있는 바, 본 발명의 일 실시예에 따른 소결 과정을 보다 상세하게 살펴본다. A sintering method may be used to form the cutting layer 120 on the upper surface of the support substrate 110. The sintering process according to an embodiment of the present invention will be described in more detail.

먼저, 절삭층(120)을 형성할 재료를 분말 형태로 일정한 틀에 넣는다. First, the material for forming the cutting layer 120 is put in a constant mold in powder form.

즉, 전술한 모재(122)를 형성하기 위한 코발트 계열의 텅스텐 카바이드(WC-Co) 분말과 다이아몬드 입자(124)를 형성하기 위한 다결정 다이아몬드 입자를 넣는다. That is, cobalt-based tungsten carbide (WC-Co) powder for forming the base material 122 and polycrystalline diamond particles for forming the diamond particles 124 are added thereto.

이때, 절삭층(120) 중 다이아몬드 입자(124)가 차지하는 부피비는 1/2 내지 4/5가 되도록 할 수 있다. 다이아몬드 입자(124)의 부피비가 1/2미만인 경우 절삭 효율이 감소하게 된다. 그리고, 다이아몬드 입자(124)의 부피비가 4/5를 초과하는 경우에는 다이아몬드 입자(124)들 사이에 개재하는 모재(122)의 양이 줄어들게 되고, 이는 다이아몬드 입자(124)들과 모재(122)간의 결합력을 약화시켜 절삭층(120)으로부터 다이아몬드 입자(124)의 이탈이 쉬워진다. 따라서, 다이아몬드 입자(124)의 부피비는 1/2 내지 4/5인 것이 바람직하다. In this case, the volume ratio of the diamond particles 124 in the cutting layer 120 may be 1/2 to 4/5. If the volume ratio of the diamond particles 124 is less than 1/2, the cutting efficiency is reduced. In addition, when the volume ratio of the diamond particles 124 exceeds 4/5, the amount of the base material 122 interposed between the diamond particles 124 is reduced, which is the diamond particles 124 and the base material 122. The weakening of the bonding force between the diamond particles 124 is easily separated from the cutting layer 120. Therefore, the volume ratio of the diamond particles 124 is preferably 1/2 to 4/5.

다음으로, 볼밀(ball mill), 어트리션밀(attrition mill) 등을 이용하여 모재(122)와 다이아몬드 입자(124)가 고르게 분포되도록 한다. Next, the base material 122 and the diamond particles 124 are evenly distributed using a ball mill, an attention mill, or the like.

그리고 나서, 이러한 분말들을 넣은 틀에 지지 기판(110)를 넣고, 지지 기판(110)의 상면에 절삭층(120)이 결합할 수 있도록, 지지 기판(110)의 상면이 분말을 향하도록 한다. Then, the support substrate 110 is placed in the mold into which the powders are placed, and the upper surface of the support substrate 110 faces the powder so that the cutting layer 120 may be coupled to the upper surface of the support substrate 110.

이때, 지지 기판(110)의 상면과 접하는 절삭층(120)의 면에는 모재(122)가 분포되는 것이 바람직하다. At this time, the base material 122 is preferably distributed on the surface of the cutting layer 120 in contact with the upper surface of the support substrate 110.

앞서 설명한 바와 같이, 지지 기판(110)은 탄화물 계열의 합금을 포함할 수 있고(일례로, 코발트 계열의 텅스텐 카바이드를 포함) 모재(122) 또한 코발트 계열의 텅스텐 카바이드를 함유할 수 있으므로 지지 기판(110)의 상면과 모재(122)는 서로 동일한 성분을 함유하게 되어, 결과적으로, 지지 기판(110)의 상면과 모재(122)의 결합력은 다른 부분, 즉, 지지 기판(110)의 상면과 다이아몬드 입자(124)의 결합력보다 향상될 수 있다. As described above, the support substrate 110 may include a carbide-based alloy (eg, include cobalt-based tungsten carbide), and the base material 122 may also contain cobalt-based tungsten carbide, thereby supporting the support substrate ( The upper surface of the substrate 110 and the base material 122 contain the same components. As a result, the bonding force between the upper surface of the support substrate 110 and the base material 122 is different, that is, the upper surface of the support substrate 110 and the diamond. The binding force of the particles 124 may be improved.

이때, 지지 기판(110)의 상면과 접합할 절삭층(120)의 면에 모재(122)만 분포되게 하여 지지 기판(110)와 절삭층(120)의 결합력을 향상시킬 수도 있다. 이에 따라, 지지 기판과 절삭층의 분리를 방지하여 절삭 공구 인서트의 내구성이 향상될 수 있다. At this time, only the base material 122 may be distributed on the surface of the cutting layer 120 to be bonded to the upper surface of the supporting substrate 110 to improve the bonding force between the supporting substrate 110 and the cutting layer 120. Accordingly, durability of the cutting tool insert may be improved by preventing separation of the support substrate and the cutting layer.

다음으로, 지지 기판(110)과 절삭층(120)이 결합되도록 고온 및 고압으로 소결한다. 일례로, 약 1300~1500℃, 5~7GPa까지 고온 고압을 유지하면서 소결 처리를 수행할 수 있다. Next, the support substrate 110 and the cutting layer 120 are sintered at a high temperature and high pressure to be bonded. For example, the sintering treatment may be performed while maintaining the high temperature and high pressure to about 1300 to 1500 ° C and 5 to 7 GPa.

이러한 고온 고압을 유지하기 위하여 상기한 지지 기판과 절삭층이 들어간 틀을 다시 커다란 셀로 밀봉하여 공정을 수행할 수 있고, 소결 공정을 거친 후 외곽의 틀, 밀봉 셀을 제거하고 가공하여 사용할 수 있다. In order to maintain such a high temperature and high pressure, the mold containing the support substrate and the cutting layer may be sealed with a large cell, and the process may be performed. After the sintering process, the outer mold and the sealing cell may be removed and processed.

상기와 같이 고온 및 고압으로 진행되는 소결 과정의 특성상 절삭 공구 인서트는 잔류 응력을 수반하게 된다. 즉, 지지 기판(110)과 절삭층(120)의 열팽창 계수(thermal coefficient)가 다름으로 인해 잔류응력(residual stress)이 발생하게 된다. As described above, the cutting tool insert is accompanied by residual stress due to the characteristics of the sintering process performed at high temperature and high pressure. That is, residual stress occurs due to a difference in thermal coefficients of the support substrate 110 and the cutting layer 120.

이러한 잔류응력은 지지 기판과 절삭층 계면 부위 및 내부에 크랙을 발생시켜 절삭 공구용 인서트의 내구성 저하를 유발한다. This residual stress causes cracks in the support substrate and the cutting layer interface region and the inside, which causes the durability of the insert for the cutting tool.

본 발명의 일 실시예에 따르면, 다결정 다이아몬드 컴팩트, 즉, 절삭층(120)의 잔류응력이 감소될 수 있는 바, 이하, 앞서 설명한 도 3을 참조하여 보다 상세하게 살펴본다. According to the exemplary embodiment of the present invention, the residual stress of the polycrystalline diamond compact, that is, the cutting layer 120 may be reduced, which will be described below in more detail with reference to FIG. 3.

도 3에 도시된 바와 같이, 본 발명의 일 실시예에 따른 지지 기판(110)의 상면에는 상부로 융기한 융기부(112)가 형성된다. 원기둥 형상의 지지 기판(110)이 제1 방향으로 연장하는 경우, 융기부(112)도 제1 방향으로 융기하는 것으로 볼 수 있다. As shown in FIG. 3, a raised portion 112 is formed on the upper surface of the support substrate 110 according to the embodiment of the present invention. When the cylindrical support substrate 110 extends in the first direction, the ridge 112 may also be seen to be raised in the first direction.

융기부(112)는 중앙에서 상부로 융기한 중앙 지지부(1121), 및 중앙 지지부(1121)와 지지 기판(110)의 외주면 사이에서 상부로 융기한 둘레 지지부(1122)를 포함하며, 둘레 지지부(1122)와 중앙 지지부(1121)는 중앙으로 갈수록 융기한다. The ridge 112 includes a central support 1121 protruded from the center to the top, and a circumferential support 1122 protruded upward between the central support 1121 and the outer circumferential surface of the support substrate 110. 1122 and central support 1121 are elevated toward the center.

먼저, 중앙 지지부(1121)는 지지 기판(110)의 직경(D1)보다 작은 직경(D2)를 갖도록 형성되어 절삭층(120)의 중앙 부분을 지지하게 된다. First, the central support part 1121 is formed to have a diameter D2 smaller than the diameter D1 of the support substrate 110 to support the central portion of the cutting layer 120.

이러한 중앙 지지부(1121)의 상면으로는 절삭층(120)과의 접합력 향상을 위한 요철 구조가 적용될 수 있다. 일례로, 도 3에 도시된 바와 같이, 부채꼴 형상의 홈이 중앙 지지부의 둘레를 따라 다수개 형성되도록 중앙 지지부의 상면은 표면처리될 수 있다. As an upper surface of the central support part 1121, an uneven structure for improving bonding strength with the cutting layer 120 may be applied. For example, as shown in FIG. 3, the upper surface of the central support may be surface treated such that a plurality of fan-shaped grooves are formed along the circumference of the central support.

이때, 중앙 지지부(1121)의 상면 전체에 걸쳐 절삭층(120)과의 접합력이 고르게 향상될 수 있도록 요철 구조는 중앙 지지부의 상면의 중심을 기준으로 좌우대칭구조를 가질 수 있다. At this time, the concave-convex structure may have a left-right symmetrical structure with respect to the center of the upper surface of the central support so that the bonding force with the cutting layer 120 is evenly improved over the entire upper surface of the central support 1121.

그리고, 둘레 지지부(1122)는 지지 기판(110)의 외주면으로부터 중앙 지지부(1121)로 갈수록 점진적으로 융기하도록 형성되어 절삭층(120)의 둘레 부분을 지지하게 된다. The circumferential support part 1122 is formed to gradually rise from the outer circumferential surface of the support substrate 110 toward the central support part 1121 to support the circumferential portion of the cutting layer 120.

둘레 지지부(1122)가 점진적으로 융기하는 형상을 가짐에 따라 둘레 지지부(1122)는 경사지게 형성되는데, 여기서, 둘레 지지부의 경사(α)는 20° 이하일 수 있다. As the peripheral support part 1122 has a shape in which the peripheral support is gradually raised, the peripheral support part 1122 is formed to be inclined, where the inclination α of the peripheral support part may be 20 ° or less.

도 4는 본 발명의 일 실시예에 따른 둘레 지지부(1122)의 경사(α) 각도에 따른 절삭층(120)의 상부(top)와 측부(outside)에서의 잔류응력을 도시한다. 4 illustrates residual stresses at the top and the outside of the cutting layer 120 according to the angle of inclination α of the circumferential support 1122 according to one embodiment of the invention.

도 4를 참조하면, 둘레 지지부(1122)가 플랫한 경우에 대비하여, 경사(α)가 -10°일 때 상부와 측부에서 각각 잔류응력이 23.56%, 38.03% 감소하고, 경사(α)가 -15°일 때 상부와 측부에서 각각 29.32%, 49.58% 감소하며, 경사(α)가 -20°일 때에는 상부와 측부에서 각각 35.10%, 58.31% 감소함을 확인할 수 있다. Referring to FIG. 4, in contrast to the case where the circumferential support part 1122 is flat, the residual stresses are decreased by 23.56% and 38.03% at the upper and side portions when the inclination α is -10 °, and the inclination α is At -15 °, 29.32% and 49.58% decrease at the top and side, respectively, and when the inclination α is -20 °, 35.10% and 58.31% decrease at the top and side, respectively.

즉, 둘레 지지부(1122)가 플랫하게 형성되는 것이 아니라, 지지 기판(110)의 외주면으로부터 중앙 지지부(1121)로 갈수록 점진적으로 융기하도록 형성되고, 이에 따라 둘레 지지부(1122)가 20°까지 경사지도록 형성되는 경우, 절삭층(120)의 상부와 측부에 발생하는 잔류응력이 각각 35.10%, 58.31%까지 감소할 수 있다. That is, the circumferential support part 1122 is not formed flat, but is formed to be gradually raised from the outer circumferential surface of the support substrate 110 to the central support part 1121 so that the circumferential support part 1122 is inclined to 20 °. When formed, residual stresses generated in the upper and side portions of the cutting layer 120 may be reduced to 35.10% and 58.31%, respectively.

반대로, 둘레 지지부(1122)가 지지 기판(110)의 외주면으로부터 중앙 지지부(1121)로 갈수록 점진적으로 침강하도록 형성되는 경우에는, 즉, 둘레 지지부(1122)가 중앙 지지부(1121)보다 높게 형성된 경우에는 플랫한 경우에 대비하여 잔류응력이 상부와 측부에서 각각 11%, 61.69% 증가하게 되므로, 바람직하지 않다. On the contrary, when the circumferential support part 1122 is formed to gradually settle from the outer circumferential surface of the support substrate 110 toward the central support part 1121, that is, when the circumferential support part 1122 is formed higher than the central support part 1121. It is not preferable because the residual stress increases 11% and 61.69% at the top and side, respectively, in preparation for the flat case.

한편, 둘레 지지부(1122)가 20°보다 더 큰 경사를 갖는 경우에는 그만큼 절삭층(120)을 형성하기 위한 재료가 많이 소모되고, 소결 과정에서 확산이 제대로 이루어지지 않는 문제가 발생할 수 있으므로, 20° 이하인 것이 바람직하다. On the other hand, when the circumferential support portion 1122 has an inclination larger than 20 °, the material for forming the cutting layer 120 is consumed accordingly, and the diffusion may not be properly performed during the sintering process. It is preferable that it is degrees or less.

본 발명의 일 실시예에 따르면, 중앙 지지부(1121) 또한 중앙으로 갈수록 점진적으로 융기하도록 형성될 수 있다. 즉, 중앙 지지부(1121)는 둘레 지지부(1122)로부터 중앙으로 갈수록 점진적으로 융기하도록 형성되어 절착층(120)의 중앙 부분을 지지할 수 있다. According to one embodiment of the present invention, the central support 1121 may also be formed to be gradually raised toward the center. That is, the central support part 1121 may be formed to be gradually raised from the peripheral support part 1122 toward the center to support the central portion of the cutting layer 120.

중앙 지지부(1121)가 점진적으로 융기하는 형상을 가짐에 따라 중앙 지지부(1121)는 소정의 곡률을 갖게 되는데, 이때, 중앙 지지부의 곡률반경(r)은 37.5mm 이하일 수 있다. As the central support portion 1121 has a shape of gradually rising, the central support portion 1121 has a predetermined curvature. In this case, the radius of curvature r of the central support portion may be 37.5 mm or less.

도 5는 본 발명의 일 실시예에 따른 중앙 지지부(1121)의 곡률반경(r)에 따른 절삭층(120)의 상부(top)와 측부(outside)에서의 잔류응력을 도시한다. FIG. 5 shows residual stresses at the top and the outside of the cutting layer 120 according to the radius of curvature r of the central support 1121 according to one embodiment of the invention.

도 5를 참조하면, 중앙 지지부(1121)가 플랫한 경우에 대비하여, 곡률반경(r)이 40mm일 때에는 상부와 측부에서 각각 잔류응력이 40.31%, 5.35% 증가하게 되나, 37.5mm가 될 때까지 잔류응력이 급격히 감소하여 곡률반경(r)이 30mm에 이르면 상부와 측부에서 잔류응력이 각각 28.8%, 47.32% 감소함을 확인할 수 있다. Referring to FIG. 5, when the central support portion 1121 is flat, when the radius of curvature r is 40 mm, the residual stresses are increased by 40.31% and 5.35% at the upper and side portions, respectively, but when 37.5 mm is obtained. As the residual stress decreases sharply until the radius of curvature r reaches 30 mm, the residual stress decreases 28.8% and 47.32% at the top and side, respectively.

즉, 중앙 지지부(1121)가 플랫하게 형성되는 것이 아니라, 둘레 지지부로부터 중앙으로 갈수록 점진적으로 융기하도록 형성되고, 이에 따라 중앙 지지부(1121)의 곡률반경(r)이 37.5mm 이하가 되도록 형성되는 경우, 절삭층(120)의 상부와 측부에 발생하는 잔류응력이 각각 28.8%, 47.32%까지 감소할 수 있다. That is, the central support 1121 is not formed flat, but is formed to gradually rise from the circumferential support toward the center, whereby the radius of curvature r of the central support 1121 is formed to be 37.5 mm or less. The residual stresses generated in the upper and side portions of the cutting layer 120 may be reduced by 28.8% and 47.32%, respectively.

중앙 지지부(1121)의 곡률반경(r)이 30mm보다 작은 경우에는 그만큼 절삭층(120)을 형성하기 위한 재료가 많이 소모되고, 소결 과정에서의 확산 또한 제대로 이루어지지 않는 문제가 발생하므로, 30mm 이상인 것이 바람직하다. If the radius of curvature r of the central support portion 1121 is smaller than 30 mm, the material for forming the cutting layer 120 is consumed as much, and the diffusion in the sintering process is not performed properly. It is preferable.

한편, 상기에서는 설명의 편의를 위해, 중앙 지지부(1121)와 둘레 지지부(1122)를 구분하였으나, 중앙 지지부와 둘레 지지부는 연속적으로 형성되어 지지 기판(110)의 상면에 하나의 융기부(110)를 형성하는 것으로서, 둘레 지지부(1122) 또한 곡률반경(r)이 37.5mm 이하일 수 있다. Meanwhile, in the above description, the center support part 1121 and the circumferential support part 1122 are divided for convenience of description, but the central support part and the circumferential support part are continuously formed so that one ridge 110 is formed on the upper surface of the support substrate 110. As to form, the circumferential support portion 1122 may also have a radius of curvature r of 37.5 mm or less.

절삭층(120)의 잔류응력을 감소시키기 위하여 앞서 설명한 바와 같이 중앙 지지부(1121)가 37.5mm 이하의 곡률을 갖고, 둘레 지지부(1122)는 20° 이하의 각도로 형성됨에 따라, 융기부(110) 전체 면적에 대한 중앙 지지부(1121)의 면적 비율이 도출될 수 있다. As described above, the central support 1121 has a curvature of 37.5 mm or less, and the circumferential support 1122 is formed at an angle of 20 ° or less, as described above, in order to reduce the residual stress of the cutting layer 120. ) The ratio of the area of the central support 1121 to the total area can be derived.

본 발명의 일 실시예에 따르면, 융기부(110) 전체 면적에 대한 중앙 지지부(1121)의 면적은 0.45~0.8의 비율을 가질 수 있다. According to one embodiment of the invention, the area of the central support portion 1121 to the total area of the ridge 110 may have a ratio of 0.45 ~ 0.8.

도 6은 융기부 면적에 대한 중앙 지지부의 면적의 비율(x축)에 따른 최대 잔류응력(y축)을 도시하며, 도 6을 참조하면, 중앙 지지부의 면적 비율이 0.45~0.8인 범위에서 중앙 지지부의 면적 비율이 감소함에 따라 최대 잔류응력도 감소하는 경향을 보인다. 6 shows the maximum residual stress (y-axis) according to the ratio of the area of the central support to the ridge area (x-axis). Referring to FIG. 6, the center ratio of the area of the central support is 0.45 to 0.8. As the area ratio of the support decreases, the maximum residual stress also tends to decrease.

이때, 융기부 면적에 대한 중앙 지지부의 면적 비율이 0.45 보다 낮은 경우에는 절삭층을 형성하기 위한 재료가 많이 소모되고, 소결 과정에서 확산이 제대로 이루어지지 않는 문제가 발생하며, 면적 비율이 0.8 보다 높은 경우에는 인서트 제작상 어려움이 있으므로, 그 비율은 0.45~0.8인 것이 바람직하다. In this case, when the area ratio of the central support to the ridge area is lower than 0.45, a lot of materials for forming the cutting layer are consumed, and diffusion does not occur properly during the sintering process, and the area ratio is higher than 0.8. In this case, since there is difficulty in manufacturing the insert, the ratio is preferably 0.45 to 0.8.

한편, 상기에서는 둘레 지지부(1122)에 본 발명의 일 실시예에 따른 소정의 경사(α) 각도가 적용되고, 이와 동시에 중앙 지지부(1121)에도 본 발명의 일 실시예에 따른 소정의 곡률반경(r)이 적용된 예를 중심으로 설명하였으나, 본 발명의 다른 실시예에 따르면, 도 7에 도시된 바와 같이, 둘레 지지부(1122')에만 경사가 적용된 지지 기판(110')도 상정할 수 있다. Meanwhile, in the above, a predetermined angle of inclination α according to an embodiment of the present invention is applied to the circumferential support part 1122, and at the same time, a predetermined radius of curvature according to an embodiment of the present invention is applied to the central support part 1121. r) is applied, but according to another embodiment of the present invention, as shown in FIG. 7, the support substrate 110 ′ in which the inclination is applied only to the circumferential support portion 1122 ′ may also be assumed.

도 7은 본 발명의 다른 실시예에 따른 지지 기판(110')의 평면도, 정면도 및 단면도를 도시하며, 도 7에 도시된 바와 같이, 지지 기판(110')의 상면에는 상부로 융기한 융기부(112')가 형성될 수 있고, 융기부(112')는 중앙에서 상부로 융기한 중앙 지지부(1121') 및 중앙 지지부(1121')와 지지 기판(110')의 외주면 사이에서 상부로 융기한 둘레 지지부(1122')를 포함할 수 있다. FIG. 7 illustrates a plan view, a front view, and a cross-sectional view of a support substrate 110 ′ according to another embodiment of the present invention. As shown in FIG. 7, a ridge raised upward on an upper surface of the support substrate 110 ′. A base 112 'can be formed, and the ridge 112' is raised from the center to the top between the central support 1121 'and the central support 1121' and the outer circumferential surface of the support substrate 110 '. Raised peripheral support 1122 ′.

이때, 둘레 지지부(1122')만 지지 기판의 외주면으로부터 중앙 지지부로 갈수록 점진적으로 융기되도록 형성되며, 중앙 지지부(1121')는 둘레 지지부로부터 중앙으로 갈수록 융기되는 형상이 아닌 평평한 형상으로 형성될 수 있다. At this time, only the circumferential support portion 1122 ′ is formed to be gradually raised from the outer circumferential surface of the support substrate toward the central support portion, and the central support portion 1121 ′ may be formed in a flat shape instead of being raised from the circumferential support portion toward the center. .

이 경우, 중앙 지지부(1121')에 소정의 곡률반경(r) 적용에 따른 잔류응력 감소효과까지는 기대할 수 없으나, 둘레 지지부(1122')에 본 발명의 일 실시예에 따른 경사(α) 각도가 적용될 수 있으므로, 여전히 잔류응력 감소효과를 기대할 수 있다. In this case, the residual stress reduction effect due to the application of a predetermined radius of curvature r to the central support portion 1121 ′ cannot be expected, but the angle of inclination α according to the embodiment of the present invention is applied to the circumferential support portion 1122 ′. As it can be applied, the residual stress reduction effect can still be expected.

한편, 본 발명의 다른 실시예에 따른 지지 기판의 중앙 지지부(1121')의 상면은 절삭층(120)과의 접합력 향상을 위한 요철 구조를 갖도록 표면처리될 수 있다. On the other hand, the upper surface of the central support portion 1121 ′ of the support substrate according to another embodiment of the present invention may be surface treated to have a concave-convex structure for improving the bonding force with the cutting layer 120.

표면처리에 의해 중앙 지지부(1121')의 상면에는 소정의 빗살 문양이 형성될 수 있고, 빗살 문양은 도 7에 도시된 바와 같이, 중앙 지지부의 상면의 중심을 기준으로 좌우 대칭 구조를 가질 수 있다. By the surface treatment, a predetermined comb-tooth pattern may be formed on the upper surface of the central support part 1121 ′, and the comb-tooth pattern may have a left-right symmetrical structure with respect to the center of the upper surface of the central support part as illustrated in FIG. 7. .

상기와 같이, 본 발명에 따르면, 다결정 다이아몬드를 포함하는 절삭층에 발생하는 잔류응력을 감소시킬 수 있는 장점이 있다.As described above, according to the present invention, there is an advantage that can reduce the residual stress generated in the cutting layer containing the polycrystalline diamond.

이상과 같이 본 발명에서는 구체적인 구성 요소 등과 같은 특정 사항들과 한정된 실시예 및 도면에 의해 설명되었으나 이는 본 발명의 보다 전반적인 이해를 돕기 위해서 제공된 것일 뿐, 본 발명은 상기의 실시예에 한정되는 것은 아니며, 본 발명이 속하는 분야에서 통상적인 지식을 가진 자라면 이러한 기재로부터 다양한 수정 및 변형이 가능하다. 따라서, 본 발명의 사상은 설명된 실시예에 국한되어 정해져서는 아니되며, 후술하는 특허청구범위뿐 아니라 이 특허청구범위와 균등하거나 등가적 변형이 있는 모든 것들은 본 발명 사상의 범주에 속한다고 할 것이다.In the present invention as described above has been described by the specific embodiments, such as specific components and limited embodiments and drawings, but this is provided to help a more general understanding of the present invention, the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations are possible from these descriptions. Therefore, the spirit of the present invention should not be limited to the described embodiments, and all the things that are equivalent to or equivalent to the claims as well as the following claims will belong to the scope of the present invention. .

Claims (11)

제1 방향으로 연장하는 지지 기판; 및 A support substrate extending in a first direction; And 상기 지지 기판의 일면에 결합하여 상기 지지 기판에 의해 지지되는 절삭층;을 포함하되, And a cutting layer coupled to one surface of the support substrate and supported by the support substrate. 상기 지지 기판의 일면에는 상기 제1 방향으로 융기한 융기부가 형성되는 것을 특징으로 하는 절삭 공구 인서트. Cutting tool insert, characterized in that formed on one surface of the support substrate is a ridge raised in the first direction. 제1항에 있어서, The method of claim 1, 상기 융기부는, 중앙에서 상기 제1 방향으로 융기한 중앙 지지부, 및 상기 중앙 지지부와 상기 지지 기판의 외주면 사이에서 상기 제1 방향으로 융기한 둘레 지지부를 포함하는 것을 특징으로 하는 절삭 공구 인서트. The ridge includes a central support portion raised from the center in the first direction, and a peripheral support portion raised in the first direction between the central support portion and an outer circumferential surface of the support substrate. 제2항에 있어서, The method of claim 2, 상기 지지 기판은 상기 제1 방향으로 연장하는 원기둥 형상을 가지며, The support substrate has a cylindrical shape extending in the first direction, 상기 중앙 지지부는 상기 지지 기판의 직경(D1)보다 작은 직경(D2)을 갖는 것을 특징으로 하는 절삭 공구 인서트. And the central support has a diameter (D2) less than the diameter (D1) of the support substrate. 제2항에 있어서, The method of claim 2, 상기 둘레 지지부는 상기 지지 기판의 외주면으로부터 상기 중앙 지지부로 갈수록 점진적으로 융기하는 것을 특징으로 하는 절삭 공구 인서트. The circumferential support portion is a cutting tool insert, characterized in that it is gradually raised from the outer peripheral surface of the support substrate toward the central support portion. 제4항에 있어서, The method of claim 4, wherein 상기 제1 방향에 수직하는 제2 방향을 기준으로 상기 둘레 지지부의 경사(α)는 20° 이하인 것을 특징으로 하는 절삭 공구 인서트. Cutting tool insert, characterized in that the inclination α of the circumferential support portion 20 ° or less with respect to the second direction perpendicular to the first direction. 제4항에 있어서, The method of claim 4, wherein 상기 중앙 지지부는 상기 둘레 지지부로부터 중앙으로 갈수록 점진적으로 융기하는 것을 특징으로 하는 절삭 공구 인서트. And the central support portion is gradually raised from the peripheral support portion toward the center. 제6항에 있어서, The method of claim 6, 상기 중앙 지지부의 곡률반경(r)은 37.5mm 이하인 것을 특징으로 하는 절삭 공구 인서트. The radius of curvature r of the central support is 37.5 mm or less cutting tool inserts. 제7항에 있어서, The method of claim 7, wherein 상기 둘레 지지부의 곡률반경(r)은 37.5mm 이하인 것을 특징으로 하는 절삭 공구 인서트.Cutting tool insert, characterized in that the radius of curvature r of the circumferential support is 37.5 mm or less. 제7항에 있어서, The method of claim 7, wherein 상기 융기부의 면적에 대한 상기 중앙 지지부의 면적의 비율은 0.45~0.8인 것을 특징으로 하는 절삭 공구 인서트. Cutting tool insert, characterized in that the ratio of the area of the central support portion to the area of the ridge is 0.45 ~ 0.8. 제6항에 있어서, The method of claim 6, 상기 중앙 지지부의 상면은 요철 구조를 갖도록 표면처리되는 것을 특징으로 하는 절삭 공구 인서트. The upper surface of the central support is a cutting tool insert, characterized in that the surface treatment to have a concave-convex structure. 제10항에 있어서, The method of claim 10, 상기 요철 구조는 상기 중앙 지지부의 상면의 중심을 기준으로 좌우대칭구조로 형성되는 것을 특징으로 하는 절삭 공구 인서트.The uneven structure is a cutting tool insert, characterized in that formed in a symmetrical structure with respect to the center of the upper surface of the central support.
PCT/KR2015/004775 2014-05-22 2015-05-13 Cutting tool insert Ceased WO2015178617A1 (en)

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JPH106228A (en) * 1996-03-06 1998-01-13 General Electric Co <Ge> Improved abrasive cutting element and drill bit
JP2000179275A (en) * 1998-12-12 2000-06-27 Boart Longyear Gmbh & Co Kg Hartmetallwerkzeugfabrik Cutting tool or crushing tool and cutting insert for it
KR20120116989A (en) * 2010-01-21 2012-10-23 유에스 신써틱 코포레이션 Polycrystalline diamond compacts, method of fabricating same, and various applications
KR20140033357A (en) * 2011-03-28 2014-03-18 다이아몬드 이노베이션즈, 인크. Cutting element having modified surface

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH106228A (en) * 1996-03-06 1998-01-13 General Electric Co <Ge> Improved abrasive cutting element and drill bit
JP2000179275A (en) * 1998-12-12 2000-06-27 Boart Longyear Gmbh & Co Kg Hartmetallwerkzeugfabrik Cutting tool or crushing tool and cutting insert for it
KR20120116989A (en) * 2010-01-21 2012-10-23 유에스 신써틱 코포레이션 Polycrystalline diamond compacts, method of fabricating same, and various applications
KR20140033357A (en) * 2011-03-28 2014-03-18 다이아몬드 이노베이션즈, 인크. Cutting element having modified surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023033697A1 (en) 2021-09-03 2023-03-09 IntuiCell AB A computer-implemented or hardware-implemented method for processing data, a computer program product, a data processing system and a first control unit therefor

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