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WO2015176194A1 - Welding process method for radiator - Google Patents

Welding process method for radiator Download PDF

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Publication number
WO2015176194A1
WO2015176194A1 PCT/CN2014/000519 CN2014000519W WO2015176194A1 WO 2015176194 A1 WO2015176194 A1 WO 2015176194A1 CN 2014000519 W CN2014000519 W CN 2014000519W WO 2015176194 A1 WO2015176194 A1 WO 2015176194A1
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WIPO (PCT)
Prior art keywords
aluminum
heat sink
pcb board
radiator
heat
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Ceased
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PCT/CN2014/000519
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French (fr)
Chinese (zh)
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SHENZHEN JUNRUI NENGDIAN TECHNOLOGY Co Ltd
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SHENZHEN JUNRUI NENGDIAN TECHNOLOGY Co Ltd
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Priority to PCT/CN2014/000519 priority Critical patent/WO2015176194A1/en
Publication of WO2015176194A1 publication Critical patent/WO2015176194A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling

Definitions

  • the invention relates to the field of heat dissipation, and in particular to a novel heat sink welding process method.
  • Heating element heat sensitive devices such as LEDs, semiconductor power tubes, etc., the heat generated by their own work If not resolved in time, high temperatures can cause the life of the body to fail.
  • Aluminum-based PCB board Contains insulation layer and electronic circuit, aluminum-based PCB board also has thermal conductivity:
  • Thermal paste a paste with a relatively high thermal conductivity for filling between the heating element and the heat sink Air gap
  • Fixing parts such as screws or fixing glue
  • the heating element and the aluminum-based PCB board are welded together by a solder medium such as tin, and then This whole is fixed on the heat sink by fixing parts such as screws or glue, or directly fixing the heating element Set on the radiator.
  • Thermal paste is added between the two to solve the gap between the two and the flatness of each other; More sensitive LED lamp beads or semiconductor devices, using existing fixed technology to derive less heat, LED lamp beads or semiconductor devices, these heaters have a relatively high temperature and a relatively short service life: or In order to achieve a lower temperature rise, the weight of the radiator used will be greatly increased, and the carbon consumption of the entire industrial chain will be increased. bigger.
  • the existing fixing method is a combination of a heating element and an aluminum substrate (or a heating element) by a screw or a glue. Pressed on the heat sink, there must be a thermal resistance layer of air or thermal paste in the middle, resulting in heat in the vertical direction The resistance is large, and the heat is exported less: at the same time, the lateral aluminum substrate cannot be connected to the heat sink, and there is no lateral heat conduction; Therefore, the overall amount of heat conduction in this way is small, causing a high temperature rise of the heating element.
  • the technical problem to be solved by the embodiments of the present invention is to provide a simple structure and a heat dissipation effect. Good new radiator welding process.
  • the novel heat sink welding process method is provided with a heating element and an aluminum-based PCB from top to bottom. And a heat sink, the heating element is welded to the aluminum-based PCB board by a solder medium tin to form a whole
  • the heat generating body and the aluminum-based PCB board are integrally assembled with the heat sink by welding.
  • the aluminum-based PCB board soldered with the heat sink in the process is provided with an LED light source and a semiconductor device Aluminum plate.
  • the heating element and the aluminum-based PCB board are welded to each other by a solder medium such as tin. Then fix the whole with the heat sink by welding: it will not damage the aluminum substrate during the welding process. Edge layer and electronic circuit and heating element; this embodiment changes the combination of heat generating body aluminum substrate and heat dissipation Combined method, the transverse thermal conductivity is strengthened by welding, if combined with the thermal conductivity of the uniform temperature plate At the same time, the vertical thermal conductivity is greatly increased, so that the temperature rise of the heating element can be greatly reduced. According to the actual As a result of the test, the temperature rise of the same heating element can be lowered by 20 degrees.
  • a solder medium such as tin
  • FIG. 1 is a schematic structural view of an embodiment of the present invention:
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1 of the embodiment of the present invention.
  • the new heat sink welding process method of the embodiment of the present invention is as shown in FIG. 1-2, from top to bottom.
  • the heating element 1, the aluminum-based PCB board 2, and the heat sink 3 are disposed, and the heating element 1 passes through the solder medium tin and the aluminum-based P
  • the board 2 is welded into a whole, and the heat generating body 1 and the aluminum-based PCB board 2 are integrally welded with the heat sink 3
  • the heat sink 3 includes a heat sink bottom plate 4, and the heat sink base plate 4 is provided with heat dissipation fins 5 on its upper surface.
  • the heating element and the aluminum-based PCB board are welded to each other by a solder medium such as tin. Then the whole is fixed by welding with the heat sink; it will not damage the aluminum substrate during the welding process. Edge layer and electronic circuit and heating element; this embodiment changes the combination of heat generating body aluminum substrate and heat dissipation Combined method, the transverse thermal conductivity is strengthened by welding, if combined with the thermal conductivity of the uniform temperature plate At the same time, the vertical thermal conductivity is greatly increased, so that the temperature rise of the heating element can be greatly reduced. According to the actual As a result of the test, the temperature rise of the same heating element can be lowered by 20 degrees.
  • a solder medium such as tin

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Disclosed is a welding process method for a radiator, in which a heating member, an aluminium-based PCB board and a radiator are provided in sequence from top to bottom, wherein the heating member and the aluminium-based PCB board are welded as a whole via a tin solder medium, and the whole is fixed with the radiator by means of welding. The heat dissipation effect is strengthened by means of welding, which changes the method for combining the combination of the heating member and the aluminium-based board with the radiator.

Description

一种新型散热器焊接工艺方法 Novel radiator welding process method 技术领域 Technical field

本发明涉及散热领域，尤其涉及新型散热器焊接工艺方法。 The invention relates to the field of heat dissipation, and in particular to a novel heat sink welding process method.

背景技术 Background technique

通常的散热结构分成几个部分： The usual heat dissipation structure is divided into several parts:

A.发热体：热的敏感器件如LED，半导体功率管等，自身工作所产生的热量 如果不及时排解，高温会导致本体的寿命衰竭。 A. Heating element: heat sensitive devices such as LEDs, semiconductor power tubes, etc., the heat generated by their own work If not resolved in time, high temperatures can cause the life of the body to fail.

B.铝基PCB板：含有绝缘层及电子线路，铝基PCB板同时还具备导热功能： B. Aluminum-based PCB board: Contains insulation layer and electronic circuit, aluminum-based PCB board also has thermal conductivity:

C.导热膏：具有比较高的导热系数的膏体，用于填补发热体和散热器之间 的空气间隙； C. Thermal paste: a paste with a relatively high thermal conductivity for filling between the heating element and the heat sink Air gap

D.散热器：具备较大散热面积的铝制体，通常有鳍片： D. Radiator: Aluminum body with a large heat dissipation area, usually with fins:

E.固定件：如螺丝或者固定胶； E. Fixing parts: such as screws or fixing glue;

通常，发热体和铝基PCB板是通过锡这种钎料介质焊接成一个整体，再把 这个整体通过固定件比如说螺丝或者胶固定在散热器上，或者把发热体直接固 定在散热器上。两者中间加入导热膏解决两者间隙以及相互的平整度；对温度 比较敏感的LED灯珠或者半导体器件，使用现有固定技术导出的热量比较少， LED灯珠或者半导体器件这些发热体的温度比较高，使用寿命相对比较短：或者 想要达到较低的温升，使用的散热器重量会大大增加，整体产业链的碳能消耗 比较大。 Usually, the heating element and the aluminum-based PCB board are welded together by a solder medium such as tin, and then This whole is fixed on the heat sink by fixing parts such as screws or glue, or directly fixing the heating element Set on the radiator. Thermal paste is added between the two to solve the gap between the two and the flatness of each other; More sensitive LED lamp beads or semiconductor devices, using existing fixed technology to derive less heat, LED lamp beads or semiconductor devices, these heaters have a relatively high temperature and a relatively short service life: or In order to achieve a lower temperature rise, the weight of the radiator used will be greatly increased, and the carbon consumption of the entire industrial chain will be increased. bigger.

现有固定方法是通过螺钉或者胶把发热体与铝基板的结合体(或者发热体) 压合在散热器上，中间必然存在空气或者导热膏的热阻层，导致在垂直方向热 阻大，热量导出少：同时在横向铝基板无法与散热器相连，不存在横向导热； 因此这种方式总体导热量很少，引起发热体温升较高。 The existing fixing method is a combination of a heating element and an aluminum substrate (or a heating element) by a screw or a glue. Pressed on the heat sink, there must be a thermal resistance layer of air or thermal paste in the middle, resulting in heat in the vertical direction The resistance is large, and the heat is exported less: at the same time, the lateral aluminum substrate cannot be connected to the heat sink, and there is no lateral heat conduction; Therefore, the overall amount of heat conduction in this way is small, causing a high temperature rise of the heating element.

发明内容 Summary of the invention

本发明实施例所要解决的技术问题在于，提供一种结构简单、散热效果更 佳的新型散热器焊接工艺方法。 The technical problem to be solved by the embodiments of the present invention is to provide a simple structure and a heat dissipation effect. Good new radiator welding process.

所述新型散热器焊接工艺方法，从上到下依次设置有发热体、铝基PCB

Figure PCTCN2014000519-appb-000001
以及散热器，所述发热体通过钎料介质锡与所述铝基PCB板焊接成一个整体
Figure PCTCN2014000519-appb-000002
所述发热体与铝基PCB板组成的整体与所述散热器通过焊接方式固定。 The novel heat sink welding process method is provided with a heating element and an aluminum-based PCB from top to bottom.
Figure PCTCN2014000519-appb-000001
And a heat sink, the heating element is welded to the aluminum-based PCB board by a solder medium tin to form a whole
Figure PCTCN2014000519-appb-000002
The heat generating body and the aluminum-based PCB board are integrally assembled with the heat sink by welding.

本工艺中与所述散热器焊接的铝基PCB板为带有LED光源和半导体器件

Figure PCTCN2014000519-appb-000003
铝基板。 The aluminum-based PCB board soldered with the heat sink in the process is provided with an LED light source and a semiconductor device
Figure PCTCN2014000519-appb-000003
Aluminum plate.

实施本发明实施例，具有如下有益效果： Embodiments of the present invention have the following beneficial effects:

本发明实施例发热体和铝基PCB板是通过锡这种钎料介质焊接成一个整

Figure PCTCN2014000519-appb-000004
再把这个整体通过焊接方式与散热器固定：焊接过程中不会损坏铝基板上的
Figure PCTCN2014000519-appb-000005
缘层和电子线路以及发热体；本实施例改变了发热体铝基板的结合体与散热
Figure PCTCN2014000519-appb-000006
结合的方法，通过焊接方式加强了横向导热率，如果再结合均温板的导热技
Figure PCTCN2014000519-appb-000007
同时大大增加了垂直导热率，因此发热体的温升可以大幅度降低。根据实际
Figure PCTCN2014000519-appb-000008
试的结果，相同发热体的温升可以下降20度。 In the embodiment of the invention, the heating element and the aluminum-based PCB board are welded to each other by a solder medium such as tin.
Figure PCTCN2014000519-appb-000004
Then fix the whole with the heat sink by welding: it will not damage the aluminum substrate during the welding process.
Figure PCTCN2014000519-appb-000005
Edge layer and electronic circuit and heating element; this embodiment changes the combination of heat generating body aluminum substrate and heat dissipation
Figure PCTCN2014000519-appb-000006
Combined method, the transverse thermal conductivity is strengthened by welding, if combined with the thermal conductivity of the uniform temperature plate
Figure PCTCN2014000519-appb-000007
At the same time, the vertical thermal conductivity is greatly increased, so that the temperature rise of the heating element can be greatly reduced. According to the actual
Figure PCTCN2014000519-appb-000008
As a result of the test, the temperature rise of the same heating element can be lowered by 20 degrees.

附图说明 DRAWINGS

图1是本发明实施例结构示意图： 1 is a schematic structural view of an embodiment of the present invention:

图2是本发明实施例图1中A-A剖视图。 Figure 2 is a cross-sectional view taken along line A-A of Figure 1 of the embodiment of the present invention.

具体实施方式 detailed description

为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发

Figure PCTCN2014000519-appb-000009
作进一步地详细描述。 In order to make the objects, technical solutions and advantages of the present invention more clear, the present invention will be described below with reference to the accompanying drawings.
Figure PCTCN2014000519-appb-000009
Further details are described.

本发明实施例新型散热器焊接工艺方法，如图1-2所示，从上到下依次

Figure PCTCN2014000519-appb-000010
置有发热体1、铝基PCB板2以及散热器3，发热体1通过钎料介质锡与铝基P
Figure PCTCN2014000519-appb-000011
板2焊接成一个整体，发热体1与铝基PCB板2组成的整体与散热器3焊接
Figure PCTCN2014000519-appb-000012
定：散热器3包括散热器底板4，散热器底板4上表面设置有散热鳍片5。 The new heat sink welding process method of the embodiment of the present invention is as shown in FIG. 1-2, from top to bottom.
Figure PCTCN2014000519-appb-000010
The heating element 1, the aluminum-based PCB board 2, and the heat sink 3 are disposed, and the heating element 1 passes through the solder medium tin and the aluminum-based P
Figure PCTCN2014000519-appb-000011
The board 2 is welded into a whole, and the heat generating body 1 and the aluminum-based PCB board 2 are integrally welded with the heat sink 3
Figure PCTCN2014000519-appb-000012
The heat sink 3 includes a heat sink bottom plate 4, and the heat sink base plate 4 is provided with heat dissipation fins 5 on its upper surface.

本发明实施例发热体和铝基PCB板是通过锡这种钎料介质焊接成一个整

Figure PCTCN2014000519-appb-000013
再把这个整体通过焊接方式与散热器固定；焊接过程中不会损坏铝基板上的
Figure PCTCN2014000519-appb-000014
缘层和电子线路以及发热体；本实施例改变了发热体铝基板的结合体与散热
Figure PCTCN2014000519-appb-000015
结合的方法，通过焊接方式加强了横向导热率，如果再结合均温板的导热技
Figure PCTCN2014000519-appb-000016
同时大大增加了垂直导热率，因此发热体的温升可以大幅度降低。根据实际
Figure PCTCN2014000519-appb-000017
试的结果，相同发热体的温升可以下降20度。 In the embodiment of the invention, the heating element and the aluminum-based PCB board are welded to each other by a solder medium such as tin.
Figure PCTCN2014000519-appb-000013
Then the whole is fixed by welding with the heat sink; it will not damage the aluminum substrate during the welding process.
Figure PCTCN2014000519-appb-000014
Edge layer and electronic circuit and heating element; this embodiment changes the combination of heat generating body aluminum substrate and heat dissipation
Figure PCTCN2014000519-appb-000015
Combined method, the transverse thermal conductivity is strengthened by welding, if combined with the thermal conductivity of the uniform temperature plate
Figure PCTCN2014000519-appb-000016
At the same time, the vertical thermal conductivity is greatly increased, so that the temperature rise of the heating element can be greatly reduced. According to the actual
Figure PCTCN2014000519-appb-000017
As a result of the test, the temperature rise of the same heating element can be lowered by 20 degrees.

以上所揭露的仅为本发明一种较佳实施例而已，当然不能以此来限定本发 明之权利范围，因此依本发明权利要求所作的等同变化，仍属本发明所涵盖的 范围。 What has been disclosed above is only a preferred embodiment of the present invention, and of course, the present invention cannot be limited thereto. The scope of the claims, therefore, equivalent changes made in accordance with the claims of the present invention are still covered by the present invention. range.

Claims (2)

一种新型散热器焊接工艺方法，其特征在于：从上到下依次设置有发热 体、铝基PCB板以及散热器，所述发热体通过钎料介质锡与所述铝基PCB板焊 接成一个整体，所述发热体与铝基PCB板组成的整体与所述散热器通过焊接方 式固定。 A novel heat sink welding process method characterized in that heat is arranged in order from top to bottom a body, an aluminum-based PCB board, and a heat sink, the heat generating body being soldered to the aluminum-based PCB board by a solder medium tin Connected as a whole, the heat generating body and the aluminum-based PCB board are integrally formed with the heat sink by welding Fixed. 根据权利要求1所述的新型散热器焊接工艺方法，基特征在于，本工艺中 与所述散热器焊接的铝基PCB板为带有LED光源和半导体器件的铝基板。 The novel heat sink welding process method according to claim 1, characterized in that in the process The aluminum-based PCB board soldered to the heat sink is an aluminum substrate with an LED light source and a semiconductor device.
PCT/CN2014/000519 2014-05-22 2014-05-22 Welding process method for radiator Ceased WO2015176194A1 (en)

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Application Number Priority Date Filing Date Title
PCT/CN2014/000519 WO2015176194A1 (en) 2014-05-22 2014-05-22 Welding process method for radiator

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021014002A1 (en) * 2019-07-25 2021-01-28 Abb Power Grids Switzerland Ag Arrangement of a power semiconductor module and a cooler
CN114175221A (en) * 2019-07-25 2022-03-11 日立能源瑞士股份公司 Power semiconductor module and method for forming the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011091227A (en) * 2009-10-23 2011-05-06 Siix Corp Method of mounting electronic component on circuit board
CN102072435A (en) * 2010-10-22 2011-05-25 中国计量学院 LED lamp module with functions of three-dimensional convection, metal conduction and pollution prevention
CN201918430U (en) * 2011-01-27 2011-08-03 深圳市德泽能源科技有限公司 Integral heat dissipation structure for LED substrate
CN202171161U (en) * 2010-10-22 2012-03-21 中国计量学院 LED (light emitting diode) lamp module with functions of three-dimensional convection, metal conduction and pollution prevention
CN103388770A (en) * 2013-08-12 2013-11-13 四川创境科技有限公司 Integrated light source radiating module of LED lamp and manufacturing method thereof
CN203349028U (en) * 2013-08-12 2013-12-18 四川创境科技有限公司 Integral light source heat-dissipating module of LED (Light Emitting Diode) lamp

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011091227A (en) * 2009-10-23 2011-05-06 Siix Corp Method of mounting electronic component on circuit board
CN102072435A (en) * 2010-10-22 2011-05-25 中国计量学院 LED lamp module with functions of three-dimensional convection, metal conduction and pollution prevention
CN202171161U (en) * 2010-10-22 2012-03-21 中国计量学院 LED (light emitting diode) lamp module with functions of three-dimensional convection, metal conduction and pollution prevention
CN201918430U (en) * 2011-01-27 2011-08-03 深圳市德泽能源科技有限公司 Integral heat dissipation structure for LED substrate
CN103388770A (en) * 2013-08-12 2013-11-13 四川创境科技有限公司 Integrated light source radiating module of LED lamp and manufacturing method thereof
CN203349028U (en) * 2013-08-12 2013-12-18 四川创境科技有限公司 Integral light source heat-dissipating module of LED (Light Emitting Diode) lamp

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021014002A1 (en) * 2019-07-25 2021-01-28 Abb Power Grids Switzerland Ag Arrangement of a power semiconductor module and a cooler
CN114175221A (en) * 2019-07-25 2022-03-11 日立能源瑞士股份公司 Power semiconductor module and method for forming the same
CN114175221B (en) * 2019-07-25 2022-10-28 日立能源瑞士股份公司 Power semiconductor module and method for forming the same
US11562911B2 (en) 2019-07-25 2023-01-24 Hitachi Energy Switzerland Ag Power semiconductor module and method of forming the same
US12068174B2 (en) 2019-07-25 2024-08-20 Hitachi Energy Ltd Arrangement of a power semiconductor module and a cooler

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