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WO2015169840A1 - Tampon d'impression et procédé de fabrication et d'utilisation d'un tampon d'impression - Google Patents

Tampon d'impression et procédé de fabrication et d'utilisation d'un tampon d'impression Download PDF

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Publication number
WO2015169840A1
WO2015169840A1 PCT/EP2015/059929 EP2015059929W WO2015169840A1 WO 2015169840 A1 WO2015169840 A1 WO 2015169840A1 EP 2015059929 W EP2015059929 W EP 2015059929W WO 2015169840 A1 WO2015169840 A1 WO 2015169840A1
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WO
WIPO (PCT)
Prior art keywords
carrier
stamp
layer
imprint
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/059929
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German (de)
English (en)
Inventor
Dietmar Lütke NOTARP
Mike Becker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NB TECHNOLOGIES GmbH
Original Assignee
NB TECHNOLOGIES GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NB TECHNOLOGIES GmbH filed Critical NB TECHNOLOGIES GmbH
Publication of WO2015169840A1 publication Critical patent/WO2015169840A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Definitions

  • the invention relates to an Imprintstkov, in particular in connection with
  • An imprint stamp has on its stamp page a three-dimensional surface structure as a stamp structure whose lateral extent defines the stamp surface and which can be transferred by various methods in an imprint material.
  • imprint material must be capable of deforming when the stamp surface is impressed and the structure of the impressionable three-dimensional surface
  • the stamp material in which the three-dimensional surface structure is produced as Imprintnegativ must have a certain hardness sufficient to cause the deformation optionally under pressure in Imprintmaterial.
  • the stamp structure must be sufficiently strong and resistant to multiple without damaging the surface structure of the stamp surface to be applicable.
  • the method of transferring the surface structure into an imprint material may vary depending on the imprint material.
  • the processes always have a contact with the imprint material that is more complete and uniformly distributed over the stamp surface.
  • inclusions of air bubbles are to be prevented, so that, for example, the contact between the stamp surface and imprint material takes place under vacuum or under an advancing angle or by means of deformable devices with soft materials such as silicone.
  • the stamp structure permanently transferred by the mere pressure on the imprint material.
  • a more precise and gentler process is based on liquid or highly viscous imprint materials that are not yet dimensionally stable in the phase of structural acceptance.
  • the stamp structure is then easy to depict in contact with the imprint material, but still has to be solidified in the imprint material.
  • these solidify with expulsion of solvents, entry of heat, removal of heat or UV radiation or in a combination or in a sequence thereof. This means that as a rule the imprint stamp is in contact with the imprint material and the impression must be maintained until the imprint material has been solidified by suitable means.
  • the process of demolding the stamp structure from the now solidified structure is Imprint material complicated by the adhesion forces.
  • a full-surface demolding in the direction of the surface normal or perpendicular direction to the surface is not regularly possible due to the large surface of the stamp structure, the airtight contact and the adhesion of the material is not easily possible. Rather, the demolding is facilitated when the stamp structure is lifted under a wedge angle of the imprint material, so that the demolding continues at a point starting time or place offset. For rigid punches without flexibility, this can be done with constant or increasing wedge angle. In the case of highly flexible punches, a strongly localized demolding behavior similar to the removal of stickers is possible.
  • Imprint Kunststoffes exist in the field of semiconductor manufacturing or production of optical components, wherein the smallest feature sizes of a stamp structure are less than 1 mm, ie in the range of micrometers, or less than ⁇ ⁇ amount, ie in the range of nanometers.
  • Typical substrate sizes are from 200mm to 300mm diameter in today's round wafer substrates.
  • nanoimprint processes are not limited to special formats, but can also be found for larger substrate sizes and any external geometries, for example for solar panels with areas of a few square meters.
  • the commonly used term of the imprint method and the imprint stamp is not limited to a specific length dimension, but includes the execution and application in
  • Micrometer and nanometer range in particular the nanoimprint method and a nanoimprint stamp.
  • Deformation is fundamental, as a lateral stretching of the stamp structure leads to deviations of the molded imprint structure, the positions to each other and the distances that prevent the function of the component or the Imprint Modell. This requirement is, inter alia, in competition with the material flexibility for air-free delivery of the stamp structure in the imprint material or the time and place staggered demolding with flexible punches.
  • Nanometer structures over distances of some 100mm to meters can be accurately and repeatably carried out.
  • the stamp structure must not stretch laterally during the solidification, so it must be distortion-proof or low distortion, and should have no or only a slight delay to earlier or later imprint processes with this Imprintstkov even with repeated use. Furthermore, it is an object of the invention that such Imprintstkov is simple and inexpensive to produce and can be used with simple means and low cost in a suitable Imprintmaschine.
  • the imprint stamp according to the invention has a laterally predominantly extensively extended carrier with an upper side and a lower side, wherein the carrier is elastically bendable without plastic deformation up to a minimum bending radius or a bending radius which is smaller than the minimum bending radius.
  • the smallest minimum bending radius, at which no plastic deformation may occur, results from the requirements for demolding, in which the carrier can be locally curved due to the time and place offset demolding.
  • metallic materials such as stainless steel, nickel or titanium, or warp resistant plastics or polymers that are designed as foil, sheet or fabric.
  • the lateral areal extent of the carrier is preferably present in one plane or in regions in one plane.
  • a lateral areal extent is understood to mean a predominantly two-dimensional extent of the carrier in a surface that is many times greater than the extent in the perpendicular direction to one of the surfaces of the carrier which corresponds to the thickness of the carrier.
  • the imprint stamp according to the invention has a layer stack with a layer of a stamp material or at least one layer of a stamp material and any number of further intermediate layers of the stamp material or
  • stamping layer Stemepelmaterials on the lower surface of the layer which forms the stamp side, in at least one region of the stamp side has a stamp surface, within the extent of the stamp side has a three-dimensional deformable in a deformable imprint material surface structure as a stamp structure.
  • This layer stack of the stamping layer is applied in the most uniform possible thickness on the underside of the carrier.
  • the stamping layer has an extent of at least the size of
  • stamp surface within which the three-dimensionally deformable surface structure is located.
  • the layer stack of the stamp material is connected on the stamp side opposite side, which forms the connecting side, at least over the extent of the stamp surface with the carrier at the bottom of the carrier.
  • the layer stack of the stamp material may comprise a single layer of a stamp material or at least one layer of stamp material and any number of further intermediate layers of the stamp material or intermediate layers of another intermediate material, for example, for connection to the support. Materials and layers of the layer stack are summarized for the Imprintstkov invention as a stamp material or layer of the stamp material understood, if another
  • the stamp page with the stamp surface forms the
  • Layer stack of the stamping layer is at least so firmly connected to the carrier that when using the Imprintstempel s during removal from an imprint of the
  • Layer stack of the stamp material at least in the region of the expansion of the stamp surface is not released from the carrier or the stamp material is not arbitrarily spatially separate from the carrier without deformation.
  • the layer stack of the stamp material is firmly connected to the underside of the carrier.
  • Suitable stamping material for the imprint stamp according to the invention are materials which have high elasticity or toughness and at the same time can assume a shape with high dimensional stability. This is particularly important when removing a stamp structure from an embossed imprint structure in an imprint material, wherein due to the adhesion forces high loads are exerted on the structures in the stamp material. It is advantageous if the stamp material can easily be elastically deformed and stretched without exceeding a strain limit such as R p , o, 2, and after the demolding process assumes its original shape. At the same time, the stamp material must have a sufficient hardness, so that the stamp structure can be transferred into an imprint material s, without the stamp structure thereby deformed to an undesirable extent. As stamp material for erfindungsmä H Imprint stamps are therefore suitable depending on the Imprintmaschine, imprint material, and its deformability polymers, elastomers, materials such as polydimethylsiloxane (PDMS) or silicone.
  • PDMS polydimethylsilox
  • the imprint stamp has a) a laterally predominantly flat extended carrier with an upper side and a lower side, b) a layer stack with a layer of a
  • Stamp material or with at least one layer of a stamp material and any number of further intermediate layers of the stamp material or
  • Stamping material on the lower surface of the layer, which forms the stamp page, in at least one region of the punch side has a stamp surface, within the extent of the stamp side has a three-dimensional deformable in a deformable imprint material surface structure, wherein the layer stack on the opposite side of the stamp page at least on Extension of the stamp surface is connected to the carrier at the bottom of the carrier, so that the stamp material without
  • Deformation is not spatially spaced from the carrier to be spaced, wherein the carrier is connected at the edge around its entire circumference with a frame, or the carrier is firmly connected at the edge around its entire circumference with a flexible clamping material, in a constant or variable distance to Carrier circumference revolving with a
  • connection to the carrier is carried out stress-free or under a tensile stress, so that the carrier is under a deflection of the carrier under a tensile stress, wherein the carrier is formed without deflection in a rest position,
  • deflection of the carrier from the rest position over the entire extent of the connected stamp surface of the amount may be the same size or within the extent of the connected stamp surface area may vary in size.
  • the carrier is connected at the edge around its entire circumference with a frame.
  • the carrier at the edge around its entire circumference with a flexible clamping material, preferably a fabric, fixedly connected, which is peripherally connected in a fixed or variable distance from the support circumference with a frame.
  • a flexible clamping material preferably a fabric
  • the peripheral connection of the carrier or of the flexible tensioning material to the frame is executed in one plane.
  • frame and the above-described arrangement of a connection with a frame includes any conceivable device which is suitable for the carrier or a flexible one Clamping material limited to a range around the entire circumference of the carrier or in a circumferential region at a distance from the support periphery in a plane to firmly connect, wherein at least the stamp surface remains unconnected.
  • Clamping material is attached only in a region of the circumference and wherein at least the region of the carrier with the stamp surface remains unconnected.
  • connection of the carrier or the flexible tensioning material, which is connected to the carrier, to the frame is tensionless or carried out under a tensile stress, so that when the carrier or the flexible tensioning material, the carrier is in a rest position and under a deflection of the carrier , For example, within the stamp surface, is subjected to a tensile stress, or when connected under tension, the carrier is at rest in a plane in rest position, the carrier is formed without deflection in its rest position.
  • connection means that the carrier is not under tension in its rest position and does not necessarily have to be in a rest position in its rest position.
  • Characteristic of the Imprintstkov according to the invention is at least that the carrier from an arbitrary rest position, which may be without tension and must not be present in a plane at least a certain deflection of the carrier without plastic deformation elastically under tension in another position to bring and after End of the deflection springs back into a rest position, which need not be the same rest position, and can take the same situation without plastic deformation in two identical deflection operations of this particular deflection.
  • Connection level under tension is to find the rest position of the wearer approximately and from a practical point of view in a plane and springs the carrier with elastic deflection from its flat rest position after completion of the deflection back to a rest position, which is identical to its previous rest position.
  • the flexible tensioning material or fabric can be bonded with the usual techniques of screen printing under tension with a screen printing frame.
  • the carrier may also be glued to the flexible clamping material.
  • all other available techniques come to
  • the carrier is to be elastically spring-deflected in the direction of its surface normal or in the direction perpendicular to a plane of the rest position from the rest position, wherein the carrier is deformed without deflection into its previous rest position.
  • the properties for the deflection depend essentially on the
  • the flexibility of the structure is increased when the carrier itself has flexibility.
  • the flexibility of the carrier depends essentially on the material properties and the thickness of the carrier.
  • the thickness of the material determines. At a 180 ° bend, the theoretical bend radius on the outside would be equal to the thickness of the material. For the theoretical, completely conforming adaptation of a carrier of thickness ⁇ to a semi-cylindrical structure of the height of 5 ⁇ and the width of ⁇ , ie a radius of 5 ⁇ , the smallest necessary bending radius of the carrier would be on the outside of the carrier 15 ⁇ .
  • elongation properties of the carrier are another criterion.
  • a criterion for a yield strength is technically the strain limit Rp, o, 2 used, which indicates the voltage limit, from a material after
  • the modulus of elasticity can be used. In order to meet requirements for elasticity for elastic load cases, materials such as rubber or silicone would be considered as a carrier, but the carrier should be distortion-free or low distortion to reduce distortion of the stamp structure.
  • the relative change in length ⁇ is described by the absolute change in length AL to the viewing length L. It follows that at the same voltage ⁇ , which is introduced by a deflection of a clamped carrier in the carrier, the relative
  • Length change AL of a stamp surface with respect to a length of the stamp surface L is lower, the greater the elastic modulus E of the support.
  • the change in length is AL 200 ⁇ based on a length of 100mm.
  • the modulus of elasticity of rubber for example, is less than 1 GPa and would be unsuitable as a carrier for distortion in the carrier.
  • Glass has a modulus of elasticity of 50 to 90 GPa, which meets the requirements of the
  • glass has almost no elasticity, but breaks easily under tensile or bending stress.
  • no Rp, o, 2 can be defined, since it can not be plastically deformed to 0.2%, but as a criterion can serve as a comparison the tensile strength, which can be stated with 30MPa.
  • Imprint stamp according to the invention a modulus of elasticity E of more than 50GPa, preferably more than 90GPa, and a yield strength R p , o, 2 of more than 30MPa, preferably more than lOOMPa on.
  • a tension-free connection of the carrier or the flexible clamping material to the frame or a connection with little tension is advantageous.
  • a tensile stress of less than 30N / mm 2 preferably less than 20N / mm 2 , preferably less than 10N / mm 2 proved.
  • the deflection from the rest position or a level of rest position over the entire extent of the connected stamp surface of the amount may be the same size or within the extent of the associated with the carrier stamp surface area may vary in size
  • a deflection from the rest position takes place uniformly over the entire area of the stamp surface connected to the carrier, so that the deflection of the amount over the entire stamp surface is the same. This is for example when
  • Expansion is greater than the stamp surface is pressed over the entire surface and the plane of the rest position of the wearer is spent in the frame for transmitting the punch surface on the substrate to a lower level in the direction of the substrate than the substrate surface, so that the carrier with the die surface relative to its rest position deflected in the frame becomes.
  • the carrier undergoes a plane deflection with at least the
  • Deflection of the carrier from the rest position is in certain cases 0.1 mm sufficient to ensure a secure contact of the stamp surface with an imprint material.
  • the imprint stamp according to the invention preferably has an elongation in the lateral direction over the greatest extent of the stamp surface of less than the smallest dimension of the same extent of elastic deflection from rest position over the entire stamp surface and / or additional stamping pressure by a top-side contact pressure by means of a flat plate shapeable three-dimensional
  • the deflection is within the extension of the carrier
  • the stamp with its stamp surface with a wedge angle of 0 °, ie parallel to
  • the punch can be rotatably mounted via a uniaxial hinge, which allows the punch to be arranged at an angle of 0 °, ie parallel to the substrate surface and, for example, 90 ° to the substrate surface.
  • the stamp can be rotated in the angular range of the hinge.
  • the Imprintvorgang can take place with a corresponding arrangement of a substrate, while supportive, the substrate can also be movable in the vertical direction against the punch to produce the necessary pressure for the imprint process.
  • the punch in the device or the substrate from the angle position 0 ° to higher
  • Opening angle rotated which increases the wedge angle between the substrate and stamp depending on the distance of the hinge to the stamp steadily.
  • the maximum angle at which the demoulding is completed depends, among other things, on the properties of the imprint material and the stamp and can be between 0 ° and 90 °. In practice, a combination of the cases described occurs or the cases can be combined as desired, depending on the application.
  • the demoulding with the Imprintstempel invention is basically carried out analogously in the three cases described. However, due to the flexible and resilient properties of the connection of the carrier to which the stack of layers of the stamping layer in the extension of the stamp surface is connected to the frame, a local wedge angle occurs during demolding in each of the three demolding arrangements described.
  • the clamping frame aligned parallel to the clamping plane of the carrier to the plane of the substrate surface, in the vertical direction to
  • Stamp surface is not simultaneously removed from the entire surface, but the carrier is first deflected with the full extent of the stamp surface from the rest position of the carrier in the frame until the spring forces at the edge of the stamp surface sufficient to start demolding against the adhesion forces.
  • a wedge angle is established locally.
  • Deformation front adjusts itself in the other arrangement cases and the combinations thereof from analog and is possible with the Imprintstempel invention, because a
  • Deflection of the carrier from the rest position on the extent of the entire connected stamp surface of the amount may be the same size or within the extent of the connected stamp surface area may vary in size, the carrier is formed without deflection in its previous rest position.
  • the support of Imprintstempels is performed in the form of a film.
  • the advantage of a film over, for example, a fabric is the small thickness variation. In the case of a fabric, a local maximum of the thickness is to be found at the nodal points of the threads, which is twice as high as the thread thickness itself. The difference between maximum thickness and minimum thickness is 100% of
  • the thickness at the anchor points can be reduced by locally flattened threads, whereby a difference between maximum thickness and minimum thickness of less than 25% of the minimum thickness is usually not undershot. A thickness variation of less than 25% of the average thickness is to be observed in technically conventional films.
  • a flatness of the surface on the underside of the carrier is advantageous to the
  • Layer stack of the stamp material is arranged with the stamp surface. At this site, excessive topography of the wearer can interfere with a uniform
  • stamp structure so that the first error in Imprintabsent can arise and secondly, the stamp structure is worn to surface increases faster. This is particularly noticeable in tissues as a carrier at the nodal points.
  • imprint stamp according to the invention it has proven advantageous if there is good flatness of the surface at least on the underside of the carrier, where the surface contour on the stamp side, at least in the extension of the stamp surface, is a difference between the surface maximum and the surface minimum of less than 25% of the thickness average of the film to provide an advantage over calendered fabrics.
  • a film suitable as a carrier may, for example, have a thickness of a few micrometers, depending on the material. The smallest thickness is mainly due to the technical
  • a thickness which is at most 200%, preferably at most 100%, even more preferably at most 50%, has proved to be advantageous as the maximum thickness with regard to the advantageous bending properties in order to utilize the effect of the demoulding front during the demoulding process largest increase in structure across the surface.
  • the maximum thickness of a material used as a film for the carrier is determined by the requirements of the occurring bending radii, which must take the film with elastic deformation in use as a carrier of Imprintstkov s invention, in order to spring back without plastic deformation back to its original state , In this case, a small bending radius means a greater deformation load.
  • the carrier must be able to assume at least a minimum bending radius without plastic deformation, which occurs during demoulding according to the first Entformungsfall, at least means that he can preferably take a bending radius below the minimum bending radius.
  • a center area in the limit of demolding a last point as the center, the die surface is not removed from the mold, while the outer areas are already removed from the center area of the die surface.
  • the carrier thus has a deflection within the extent of the connected stamp surface, which is partially different in area and in a vertical
  • Viewing section plane through the center approximately corresponds to a circle section and the carrier deformed with a minimum bending radius, which the carrier must be able to assume at least without plastic deformation.
  • the bending radius depends on the height of the jump of the clamping frame, ie the spacing of the plane of the stamp surface from the plane of the surface of the imprint material from.
  • the higher the jump in the limit of demolding the smaller the bending radius, since the deformation load increases with higher jump.
  • Common technical applications use a jump of up to 2mm, in special cases up to 4mm, 10mm, or 20mm.
  • Minimum bending radius of the carrier which the carrier must be able to assume without plastic deformation, for example for applications for semiconductor substrates, is determined by the bending radius, which is better at a jump of 2 mm, better still 4 mm 10mm, better yet 20mm in the limit of demolding sets based on a longest extension of the die surface of 300mm, better yet, 200mm better still 100 mm.
  • the carrier must be elastically bendable over its longest deflectable length without plastic deformation with a minimum bend radius or bend radius that is less than the minimum bend radius, with the minimum bend radius for the limit case of deflection z max of the beam given where a center region of the
  • Stamp surface in the limit, a point in the center of the stamp surface, which is connected to a solidified imprint material, from the rest position at spacing of the
  • Imprint stamp is deflected in the vertical direction to the plane of the rest position of the wearer against the finite adhesion forces between the stamp surface and the solidified imprint material, immediately before the point in the center of the stamp surface is released from the solidified imprint material against the adhesion.
  • the carrier has a translucent perforation in the region of the stamp surface.
  • the perforation consists of at least one or more recesses in the carrier which extend from the top to the bottom of the carrier so that light can pass from the top to the bottom.
  • the recesses may be arranged arbitrarily without a regular pattern or regularly.
  • UV-curing imprint material is irradiated with UV light from the back side of the carrier, while the imprint stamp is in contact with the imprint material, which passes through the perforation in the region of the stamp surface to the underside of the stamp and hits the imprint material, where it is to Hardening acts on the imprint material.
  • Intermediate material of the layer stack for the required wavelength range is transparent, at least for this wavelength range has a sufficiently low absorption, so that light of the required wavelength in sufficient intensity of the carrier ob he side through the stamp material and intermediate material of the layer stack through to
  • the carrier thus has areas of light transparency and
  • the fabric apertures are translucent and the filaments are above areas of shadowing, the apertures usually being regularly arranged by the nature of weaving.
  • the apertures usually being regularly arranged by the nature of weaving.
  • Recesses can be arranged in any arrangement, geometry and extent.
  • the Recesses can be machined out of a carrier using conventional techniques such as etching, drilling, LASER cutting, eroding or punching.
  • the carrier can be constructed in a structured manner with the recesses being cut out, for example by casting, injection molding, electroplating or weaving.
  • Imprint material is possible even in shaded areas.
  • the shaded areas are reflected by light reflection depending on the reflectivity of the
  • Substrate surface irradiated is limited in non-reflective substrate surfaces.
  • the arrangement, geometry and extent of the recesses may advantageously be selected so that the imprint material under the stamp surface in the region of the shading caused by the carrier is sufficiently exposed by stray light.
  • the scattering effect can be further increased by geometric properties and material properties.
  • the surface of the carrier in the recesses may be such that it has a high reflection and scattering effect on the light.
  • smooth metallic surfaces are very good.
  • the surface in the recesses of the carrier may further comprise a relief, structures or a roughness, which scatter the light in different directions.
  • the surface contour of the side walls of the recesses may be in a form which promotes a high reflection and scattering effect of light irradiated perpendicular to the carrier top side in a direction other than the vertical direction.
  • the round shape of the threads due to the curvature of the thread surface supports a reflection of the incident of the top of the carrier light in different
  • the side walls of the recesses may have an inclination with respect to the vertical direction, so that the opening of the recess on the upper side is larger than the opening of the recess on the underside of the carrier, so that perpendicularly irradiated from the top Light on the
  • the contour of the side walls of the recess may further be made concave or convex or in any combination of convex or concave contours to produce a scattering and reflection effect.
  • the scattering effect for the exposure of the shaded areas can be further enhanced by using at least one unoriented light source that does not emit parallel light for the exposure for curing the imprint material, or the direction of irradiation is selected specifically in a direction other than perpendicular to the carrier plane that the incoming light inevitably on the side walls of the
  • Recesses is reflected in a direction which is suitable to illuminate at the bottom of the stamp surface shaded areas.
  • the carrier material as such is sufficiently transparent for the wavelengths required for solidifying the imprint material.
  • the perforation in the region of the stamp surface also has advantages with regard to the strength of the bond between the layer stack of the stamp material and the carrier.
  • solidified material of the layer stack of the stamp material is located within the recesses of the perforation.
  • the layer stack of stamp material is anchored in addition to a compound on the underside of the carrier with the carrier, so that the composite between layer stack of stamp material and carrier can withstand greater forces, for example, during demolding than without the anchorage.
  • the effect of the anchoring can be further increased, wherein the carrier is anchored to the layer stack of stamp material on the underside of the carrier with the carrier at least in the extension of the die surface, when the recesses in the carrier are designed such that the opening of the recess on the Bottom of the carrier has a smaller cross-section than in a plane above the opening of the recess at the bottom, so that a solidified material of the layer stack of the stamp material, which is arranged on the underside of the carrier and from the underside of the carrier through the opening of the recess on the underside protrudes into a recess, even without surface adhesion to the carrier without external force application or deformation does not leave the carrier spatially arbitrarily separate or space.
  • An anchoring of the stamp surface can also be produced in one embodiment of the carrier, in which the carrier has a perforation, by the carrier being embedded between the layer stack of the stamp material on the underside and a material on the upper side of the carrier, wherein the layer stack of the stamp material with the material the top is firmly connected by the recesses.
  • This can be achieved by applying the material of the layer stack of the stamp material on the underside of the carrier with a material which is applied on the upper side of the carrier with a certain material thickness and with an extent around the opening of a recess which is larger than the largest cross section the respective recess, and through the opening of the recesses at the top in the recesses to the material of the layer stack of the
  • Stamping material of the underside extends, is firmly connected or fused in one piece with the material of the layer stack of the stamp material. This is advantageously achieved if the material on the upper side and in the recesses consists of the same material as the material of the layer stack of the stamp material on the underside of the carrier.
  • the material thickness at the upper side should have a minimum thickness which is suitable, so that the material of the layer stack of the stamp material, which is arranged on the underside of the carrier in the region of the stamp surface and is connected by a recess with the material on the upper side of the carrier , can not be spatially separated from the carrier without external force application or deformation.
  • the functionality of the imprint stamp can be maintained, even if the material of the layer stack of stamp material does not adhere to the surface of the stamp surface in the area of the stamp surface or by superficial release by demolding forces, since the anchoring a mechanical connection of the Maintains intermediate material or the stamp material to the carrier, which is ultimately needed mainly for the integrity of the demolding process.
  • the underside of the carrier closing are covered, by definition and by nature do not belong to the stamp surface, even if they can be surrounded or enclosed directly adjacent stamp surfaces, since in such areas no three-dimensional
  • the carrier has one or more recesses which are not covered with stamp material or intermediate material at the opening of the respective recess on the bottom closing and are not filled with stamp material or intermediate material within these respective recesses and not with Material at the opening of each Recess are covered at the top closing, so that air can pass from the side of the stamp surface through these respective recesses to the top of the carrier.
  • Such open, air-permeable recesses which do not belong to the stamp surface, can advantageously be arranged within the stamp surface in order to avoid trapped air when contacting the Imprintstempels with an Imprintmatenal by air located under the stamp surface can escape through these air-permeable recesses.
  • the invention also relates to a method for producing a device as described above
  • Imprint stamp the method comprising the steps:
  • connection to the carrier without tension or under tension is executed, so that the carrier is placed under a deflection of the carrier under a tensile stress, wherein the carrier without
  • Deformation elastic spring-back is to bring into a form in which the carrier from a rest position over the entire extent of the die surface assumes a deflection relative to the rest position, which is the same size over the entire extent of the die surface, or within the extent of the die surface is different in area,
  • stamping material so that the first layer or the layer stack of the moldable Stamp material is connected to the underside of the carrier or can not be spatially arbitrarily spaced from the carrier,
  • the layer of the stamp material may have the three-dimensional surface structure prior to connection to the support, which has previously been produced by any method according to the prior art.
  • the layer of the stamp material is designed, for example, as a film.
  • the connection side of the stamp material may be bonded to the support directly or by means of an intermediate layer, for example by gluing or laminating.
  • the connecting side of the layer or of the layer stack of the stampable stampable material is the side opposite the stamp side of the layer.
  • the layer stack may comprise a single layer of an impressionable stamp material or at least one layer of an impressionable stamp material and any number of further intermediate layers of the moldable stamp material or intermediate layers of another intermediate material, for example, for connection to the support.
  • the method then includes the further steps of providing this master surface, the impression of the master surface, and the demolding of the layer of moldable stamp material from the master surface.
  • the layer of moldable stamp material in the non-solidified state is applied to the master surface, which images the surface structure of the master surface on the stamp side and solidifies in contact with the master surface.
  • the carrier To connect the carrier to a layer stack of the stampable stampable material, the carrier is brought with its underside in contact with the connecting side of the layer stack of the stampable stampable material, wherein the material on the connecting side of the layer stack is solidified in and during contact with the underside of the carrier so that the material on the connection side of the layer stack of the moldable stamp material assumes a stable shape and is connected to the carrier.
  • the layer of moldable stamp material is brought into contact with the master surface in the solid state and the stamp material is temporarily liquefied to mold the master surface so that the moldable stamp material images the surface structure of the master surface on the stamp side in the stamp surface and solidifies again.
  • the stampable stamp material on the stamp side is in a solid state in the
  • the carrier is designed as a film
  • the carrier has a translucent perforation, wherein the perforation consists of at least one or more recesses in the carrier, which extend from the top to the bottom of the carrier, so that light from the top to Bottom of the vehicle can get.
  • the irradiation of light is carried out from the top of the support through the translucent perforation of the support, so that a photosensitive non-solidified stamp material can be solidified by the irradiation with light.
  • the carrier with the underside is immersed in the moldable, non-solidified stamp material or intermediate material of the layer stack at least at a fraction of the carrier thickness or dipped with full carrier thickness, so that formable, not solidified stamp material or intermediate material in the recesses of the perforation of Carrier enters or passes through the recesses on the top of the carrier and anchored to the carrier in this way.
  • stamp material or intermediate material is so far plastically deformable that it is under force with a stamp, a
  • a second layer of a second material is applied and solidified in a second application thickness on the top of the carrier in further process steps, if it is applied liquid, so that a portion of the second material through the perforation with the material of the layer stack of the Stamp material is brought into contact.
  • the second material is applied in a non-solidified state.
  • the second material can also be applied in solid form, for example in the form of a film, and be temporarily liquefied on the underside of the carrier for connection to the material of the layer stack of the stamp material and solidified again.
  • the second material having a non-zero transparency is transparent to light of a particular wavelength range which is suitable
  • Solidify imprint material on irradiation The second material is applied in a specific layer thickness and with at least one extension around a recess which is larger than the largest cross section of the respective recess.
  • the coating with the second layer takes place in the form that the material of the second layer through the
  • Stamping material at least in a partial area at the latest during solidification a mixture, so that there is a mixed material in this subarea after solidification.
  • the second layer of the second material is applied in liquid form prior to the curing of the stamp material or intermediate material so that the second material applied from the top co-hardens and bonds together with the stamp material or intermediate material in the curing step.
  • the curing is preferably carried out with light of a certain wavelength range, which is suitable for solidifying the stamp material, the intermediate material and the further material.
  • the second material applied from the upper side preferably consists of the same impressionable stamp material or intermediate material of the layer stack of the stamping layer.
  • the second material is applied in a layer thickness and an extension from the top, so that the carrier at least in the region of the stamp surface of material of the layer stack at the bottom, second material on top and material of the layer stack or further material embedded in at least one recess is.
  • the stamp according to the invention can be used for an imprint method for
  • an impressionable imprint material preferably as a layer on a
  • a laterally extended carrier having a top side and a bottom side, a layer stack having a layer of a stamp material or at least one layer of a stamp material and any number of further intermediate layers of the stamp material or intermediate layers of another intermediate material, wherein a layer of a stamp material on the bottom surface the layer, which forms the stamp side, has in at least one region of the stamp side a stamp surface, within the extent of which the stamp side has a surface structure that is three-dimensionally deformable in a deformable imprint material
  • the layer stack is connected on the side opposite the punch side at least over the extent of the stamp surface with the carrier on the underside of the carrier, so that the stamp material is not arbitrarily spatially separate from the carrier without deformation
  • the carrier being peripherally connected to a frame at its periphery, or the carrier being fixedly connected peripherally to the periphery by a flexible clamping material peripherally connected to a frame at a constant or variable distance from the periphery of the carrier, the said Connection is made to the carrier tensionless or under a tensile stress, so that the carrier is placed under a deflection of the carrier under a tensile stress, wherein the carrier is formed without deflection in a rest position,
  • Stamp area is the same size as the amount
  • the imprint material is applied to the substrate in liquid form, is easily deformable, or must be cured to maintain the mold.
  • the method then includes an additional curing step of the imprint material.
  • the curing can be carried out by expulsion of solvents, entry of heat, removal of heat or by irradiation with light, for example UV light. The curing takes place while the stamp surface is pressed into the imprint material.
  • the Imprintstempel is preferably within the stamp surface with a perforation in the carrier and stamp material and intermediate material, which is transparent to the required wavelength range, carried out so that from the top of the carrier irradiation with light needed for the curing Intensity and wavelength can pass through the recesses on the imprint material and causes the solidification of Imprintmaterials.
  • Pushing the stamp surface into the imprint material can be done by the transmission of force of the clamping of the carrier by the plane of the carrier in contact of the
  • Stamp surface is deflected with the Imprintmaterial from the rest position in the frame.
  • an external pressure is exerted on the stamp surface from the top side of the support, wherein a
  • the impression of the stamp in the Imprintmaterial from the top of the carrier and the application of external pressure on the stamp surface without deflection of the carrier from its rest position in the frame can be done for example with a roll, a flat plate or a doctor blade.
  • the flat plate is preferably made of glass or other translucent material, so that a solidification of Imprintmaterials means
  • Irradiation with light through the plate and the perforation in the carrier can be done.
  • a layer of a flowable imprint material between the three-dimensional surface structure of the stamp surface and an auxiliary substrate is arranged to the Stamp surface to be provided with a coating with Imprintmaterial.
  • the stamping surface is pressed into the layer of imprint material on the auxiliary substrate so that curing could take place with the desired three-dimensional surface structure.
  • the layer of the imprint material is separated in a separation step, wherein the Imprintstkov with a first part of the layer of imprint material in the
  • Three-dimensional surface structure and the auxiliary substrate with a second part of the layer of Imprintmaterials be separated from each other.
  • the first part of the layer of imprint material in the three-dimensional surface structure is pressed against the surface of the substrate to form the first part of the layer of the substrate
  • Imprintmaterials to transfer to the surface of the substrate In the curing step, the first part of the layer of imprint material is solidified on the surface of the substrate. The adhesion of the first part of the layer of the imprint material, which has the three-dimensional surface structure, takes place already in the transfer step or in the
  • Embodiments of the invention show, but this is not limited thereto. They show schematically:
  • Fig. 1 is a view from the top of Imprintstkov s according to a first
  • Fig. 2 is a cross-sectional view of Imprintstkov s according to the first
  • Fig. 3 is a cross-sectional view of Imprintstkov s according to a second
  • Top or bottom in the area of the stamp surface; 6 is a sectional view in cross section of Imprintstkovs according to another embodiment.
  • FIG. 1 la-d cross-sectional views according to an embodiment of the method for
  • FIGS. 1 and 2 show a plan view of the imprint stamp 1 and a cross-sectional view of the imprint stamp according to a first embodiment.
  • the Imprintstempel 1 has a carrier 10, which may be formed, for example, as a fabric or film. On its underside 91 of the carrier 10, a layer stack of a stamp material 20 is connected, wherein the layer stack consists of only one layer of a material. Within the expansion of the stamp material 20 on the carrier 10 there is an extension of a stamp surface 30, within which the layer of the stamp material 20 has the negative of a moldable three-dimensional surface structure.
  • the carrier 10 is around its circumference in a connecting region 70 with a flexible clamping material 40,
  • tissue connected For example, a tissue connected. In other embodiments may
  • Stamping material 20 are also on the flexible clamping material 40, it is crucial that the stamping surface 30 is located within the extension of the carrier.
  • the flexible clamping material 40 is connected in a connecting region 50 with a fixed frame 60 de-energized or clamped under tension.
  • the flexible tensioning material 40 is connected to a portion of the surface of the frame members.
  • the connection of the flexible clamping material 40 with the frame 60 can take any desired, it is crucial that the flexible clamping material 40, at least at a certain strictlyauslenkung, is under a certain tension, so that the carrier 10 springs back on deflection from its rest position after completion of the deflection back to its rest position.
  • FIGS. 3 and 4 cross-sectional views of the imprint stamp 1 according to a second embodiment are shown.
  • the carrier 10 is not a flexible one
  • Clamping material 40 is connected, but in is connected in a connecting region 50 directly to a frame 60.
  • the figures show the carrier 10 in a deflected from its rest position 110 state.
  • the deflection 210 is shown with respect to the underside 91 of the carrier 10, wherein the entire extent of the stamp surface 30 has a deflection 210 in the vertical direction 300 relative to the carrier plane in the rest position 110.
  • the support is located with the entire extent of the stamp surface in deflection in the plane 120.
  • the deflection 210 in FIG. 3 is smaller in magnitude than the deflection 230 in FIG. 4.
  • the deflection z (x) of the carrier 10 is identical in its entirety with the deflection 210 throughout the stamp surface 30.
  • Fig. 4 the limit case of demolding is shown in which after increasing the deflection of the carrier 10 in the vertical direction 300 relative to its rest position 110, the local
  • Deflection z (x) of the carrier 10 within the die surface 30 is different in size and only a last area in a center region of the die surface 30, in the limit, a point with the x-coordinate x z within the die surface 30, still in contact with the surface 100, this deflection z (x z ) having the amount of deflection 230, while a point of the carrier at the edge of the die surface 30 has the displacement 220, which is different and smaller than the deflection 230.
  • the coordinate x z is dependent on the geometry of the stamp surface.
  • the carrier 10 must have an elasticity, so that it can assume at least the bending radius of the curvature 500 which adjusts itself in this limiting case, preferably even smaller bending radii, without plastic deformation, in order to be able to elastically spring back into its rest position.
  • FIG. 5 shows a cutaway view of the imprint stamp from the upper side 92 or from the lower side 91 in the region of the stamp surface. 5 shows the stamp surface 30 in a cutout 11 of the carrier 10.
  • the carrier 10 is preferably designed in this embodiment as a film and has at least within the dashed
  • the recesses may be arranged regularly as in the arrangement 81 or irregular as in the arrangement 82.
  • the recesses can be circular like
  • FIG. 6 shows a cutaway view in cross section of the imprint stamp 1 according to a further embodiment. 6 shows the conditions when irradiated with light from the upper side 92 of the carrier 10, which is embodied with recesses 86 in the region of the stamp surface 30.
  • the stamp material 20 is connected to the underside 91 of the carrier. In the recesses 86 is also stamp material 20 to a certain depth of the material thickness of the carrier 10.
  • the non-directional light sources 600 emit light in different directions and a wavelength range for which the stamp material 20 is transparent.
  • the light 620 is reflected and scattered on the surfaces in the recesses 86 of the carrier 10, so that light beams 610 with sufficient exposure intensity also below a shadowed from the carrier 10 area 21 within the stamp material 20, in particular within the stamp surface 30, or on the surface 100th a substrate, or in the application of the
  • FIG. 7 shows a detail view in cross section of the imprint stamp 1 according to a further embodiment.
  • the carrier 10 is designed as a film with a perforation 80 in the region of the stamp surface 30.
  • a layer stack of the stamp material has a layer of a stamp material 20 and an intermediate layer 22.
  • the layer stack is connected to the underside 91 of the carrier 10 on the side opposite the stamp surface 30, which is the connection side.
  • the intermediate material 22 of the layer stack is arranged on the underside 91 of the carrier 10 and extends into the recesses 87 and 88 to a certain depth of the carrier thickness, wherein the parts of the intermediate layer 22 in the recesses 87 and 88 and at the bottom 91 of the carrier 10 consist of one piece.
  • the side walls 12 and 13 of the recess 88 have a deviating from the vertical direction of inclination, wherein the cross section of the opening 14 of the recess 88 at the bottom 91 of the carrier 10 is smaller than the cross section of the opening 15 at the top 92 of the carrier 10th
  • the side wall 12 of the recess 88 additionally has a relief structure.
  • the stamp material 20 and the intermediate material 22 has a concave contour, wherein the cross section of the opening 17 of the recess 87th on the underside 91 of the carrier 10 is smaller than the cross section of the recess 87 in any other plane 19 in the direction of the top 92 of the carrier 10, so that the stamp material 20 and the intermediate material 22 even in the absence of adhesion to
  • FIG. 8 shows an embodiment analogous to FIG
  • Layer stack of the stamp material consists only of a stamp material 20. In contrast to FIG. 7, there is no adhesion of the stamp material 20 and the material 20b to the surfaces of the carrier 10.
  • stamping material 20 and the material 20b of parts of the carrier 10 which are not extended arbitrarily, but by the integrity of the stamp material 20 and the material 20b are limited, so that a composite between the stamp material 20 and 20b material with the carrier 10 maintained remains.
  • FIG. 9 in analogy to FIG. 7, an embodiment is shown in which the material on the upper side 92 of the carrier 10 is identical to the stamp material 20 and is present in one piece without an interface.
  • the side walls of the recesses 87c and 88c are executed here without contour and without inclination. Since the stamp material 20 is applied to the upper side 92 of the carrier 10 with an extension around a recess 87c or 88c, which is larger than the largest cross-section of the respective recess, the stamp material 20 is anchored in the carrier 10 and can even in the absence of adhesion to the Surfaces of the carrier 10 are not spaced anywhere from the carrier 10 without deformation of the stamp material 20. 10, analogously to FIGS.
  • FIGS. 1 a to 1 d cross-sectional views according to an embodiment of the imprint method for producing a three-dimensional surface structure in an imprint material on a substrate are shown.
  • a layer of an impressionable imprint material 700 is applied to a substrate 800.
  • This layer of imprint material 700 may be in non-solidified form or in solidified form.
  • Fig. 1 lb arranging an imprint stamp 1 according to the invention to the layer of Imprintmaterials and the impressions of the stamp surface 30, which has the Imprintnegativ a three-dimensional surface structure 35, in the imprint material 700 is shown.
  • the Imprintstempel 1 is executed in this figure without a flexible clamping material between the frame 60 and the carrier 10.
  • the stamp material 20 is applied on the upper side 92 and the lower side 91 of the carrier 10, so that the carrier is embedded at least in the region of the extent of the stamp surface 30 of stamp material.
  • the carrier 10 is designed with a perforation, so that light can pass through the recesses 86 of the perforation from the upper side 92 of the carrier 10 to the lower side 91 of the carrier 10.
  • the carrier 10 has an elastic deflection relative to the plane of the frame attachment 110 during the depression in the layer of the imprint material 700, which results from a reduction in the distance between the frame 60 and the substrate 800 in the direction of the substrate 800 compared to a rest position of the carrier 10 in FIG Level of the frame attachment 110, so that due to the resilient connection between the frame 60 and the carrier 10 in the direction 350 directed to the substrate 800, a force Fi from the stamp surface 30 on the layer of
  • the plate 810 and the stamp material 20 are translucent for at least a wavelength range of the light emitted by the lamps 600, which is suitable for the effect of solidifying the layer of the imprint material 700.
  • the light rays 630 pass through the plate 810, through the stamp material 20 and the recesses 86 of the carrier 10 to the layer of the imprint material 700.
  • FIG. 1 d shows the step of demoulding the stamp surface 30 from the impressionable imprint material 700.
  • the imprint material 700 has depicted on the surface 36 of the layer the three-dimensional surface structure of the stamp surface 35 of the imprint stamp 1. At first, there is no difference whether the imprint material 700 has been solidified by irradiation or whether the imprint material 700 in the solidified state is the three-dimensional one
  • FIG. 1 d shows the moment of demoulding of a last center region 33 of the stamp surface 30, in which the carrier 10 within the stamp surface 30 has a different sized elastic deflection relative to the plane of the frame attachment 110.
  • Stamp material layer of a stamp material in the layer stack of stamp material and an intermediate material
  • Stamp surface expansion of the stamp surface, within the stamp material on the stamp page has a three-dimensional surface structure as a stamp structure center region of the stamp surface, in the limit, a point in the center of
  • Beams of the light source which undercut the area shaded by the beam rays from the light source that reach the imprint material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

L'invention concerne un tampon d'impression présentant un support plat (10) comportant un côté supérieur (92) et un côté inférieur (91), une couche (20) d'un matériau de tampon qui est assemblée au support (10) et qui présente une surface inférieure. La surface inférieure forme un côté du tampon, présente dans au moins une partie une surface de tampon, et se trouve sous le côté inférieur (91) du support, et un cadre (50) qui entoure le support (10) est assemblé au support (10). Le support (10) présente une perforation (80) comportant une pluralité d'évidements qui présentent respectivement une ouverture au niveau du côté inférieur (91) et une ouverture au niveau du côté supérieur (92), les évidements reliant ces ouvertures.
PCT/EP2015/059929 2014-05-07 2015-05-06 Tampon d'impression et procédé de fabrication et d'utilisation d'un tampon d'impression Ceased WO2015169840A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014006563.4 2014-05-07
DE102014006563.4A DE102014006563B4 (de) 2014-05-07 2014-05-07 Imprintstempel sowie Verfahren zur Herstellung und Anwendung eines Imprintstempels

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WO2015169840A1 true WO2015169840A1 (fr) 2015-11-12

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DE (1) DE102014006563B4 (fr)
TW (1) TW201604122A (fr)
WO (1) WO2015169840A1 (fr)

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DE102016124428A1 (de) 2016-12-14 2018-06-14 Amo Gmbh Vorrichtung sowie ein Verfahren zur Herstellung großflächiger periodischer Nanostrukturen auf einem flächenhaft ausgedehnten Substrat mittels eines Nanoimprintverfahrens
CN115167072A (zh) * 2022-01-24 2022-10-11 广东粤港澳大湾区国家纳米科技创新研究院 一种快速制备光刻胶掩膜的压印方法
WO2022217954A1 (fr) * 2021-04-16 2022-10-20 深圳先进技术研究院 Procédé et dispositif de fabrication de micro-nanostructure

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WO2014037044A1 (fr) * 2012-09-06 2014-03-13 Ev Group E. Thallner Gmbh Poinçon structuré, dispositif et procédé pour l'estampage

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US20100255139A1 (en) * 2009-04-03 2010-10-07 Ryuta Washiya Micropattern transfer stamper and micropattern transfer device
DE202010007762U1 (de) * 2009-06-09 2010-08-26 Nb Technologies Gmbh Siebdruckschablone
FR2977189A1 (fr) * 2011-07-01 2013-01-04 Commissariat Energie Atomique Systeme d'impression serigraphique pour cellule photovoltaique
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Publication number Priority date Publication date Assignee Title
DE102016124428A1 (de) 2016-12-14 2018-06-14 Amo Gmbh Vorrichtung sowie ein Verfahren zur Herstellung großflächiger periodischer Nanostrukturen auf einem flächenhaft ausgedehnten Substrat mittels eines Nanoimprintverfahrens
WO2018108579A1 (fr) 2016-12-14 2018-06-21 Amo Gmbh Dispositif et procédé de réalisation de nanostructures périodiques de grande surface sur un substrat planaire au moyen d'un procédé de nano-impression
WO2022217954A1 (fr) * 2021-04-16 2022-10-20 深圳先进技术研究院 Procédé et dispositif de fabrication de micro-nanostructure
CN115167072A (zh) * 2022-01-24 2022-10-11 广东粤港澳大湾区国家纳米科技创新研究院 一种快速制备光刻胶掩膜的压印方法

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