[go: up one dir, main page]

WO2015158549A1 - Condensateur avec vitrocéramique muni d' encapsulation en matière plastique - Google Patents

Condensateur avec vitrocéramique muni d' encapsulation en matière plastique Download PDF

Info

Publication number
WO2015158549A1
WO2015158549A1 PCT/EP2015/057120 EP2015057120W WO2015158549A1 WO 2015158549 A1 WO2015158549 A1 WO 2015158549A1 EP 2015057120 W EP2015057120 W EP 2015057120W WO 2015158549 A1 WO2015158549 A1 WO 2015158549A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass ceramic
capacitor
plastic
glass
silane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/057120
Other languages
German (de)
English (en)
Inventor
Jörn BESINGER
Martin Letz
Nikolaus Schultz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Publication of WO2015158549A1 publication Critical patent/WO2015158549A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates

Definitions

  • the invention generally relates to capacitors with a glass ceramic as a dielectric.
  • the invention relates to a capacitor with a glass ceramic as a dielectric and a Kunststoff erkapselung and a method for its preparation.
  • capacitors which have a ceramic as a dielectric.
  • a ceramic for example, a plate or disk-shaped
  • the thus coated ceramic or the capacitor is embedded in an electrically insulating material such that the electrically insulating material forms an encapsulation of the capacitor.
  • Capacitors are known which are embedded in oil. Another possibility is to coat the capacitor with an electrically insulating plastic.
  • Capacitors with such plastic encapsulation i. Plastic covering can be unlike
  • the distance between the electrodes and thus the thickness of the dielectric depends on the dielectric strength of the respective dielectric. The required
  • Minimum thickness of a ceramic dielectric leads in particular when using the capacitors in
  • Dielectric strength are possible.
  • the required minimum thickness of the dielectric and thus the size of the capacitor can be significantly reduced.
  • the reduction of the thickness of the dielectric also the
  • Encapsulation have a correspondingly higher creep resistance than in a conventional, ceramic
  • Another object of the invention is to provide a method of making a corresponding capacitor.
  • the invention relates to a capacitor with a
  • the glass ceramic is preferably plate-shaped or disc-shaped, i.
  • the thickness of the glass ceramic is small in relation to the length and width or to the radius.
  • a metal electrode in the form of a metal-containing coating. It is preferably a silver-containing coating. Alternatively or additionally, the metal-containing coating may contain other metals such as copper or aluminum.
  • the electrodes also have a supply or supply line for an electronic contact.
  • the side surfaces of the glass ceramic have no metal coating.
  • the glass ceramic shows a much higher
  • Dielectric strength so that dielectrics with small thicknesses, for example, can be relatively thin glass ceramic discs or plates.
  • the glass ceramic used is preferably a barium titanate or a barium titanate-containing glass ceramic, for example a glass ceramic with barium strontium titanate phases and / or barium aluminum titanate phases.
  • the metallized glass-ceramic i. Glass ceramic and
  • Kunststoffmantel coating is applied in the form of a coating and encapsulates the dielectric and electrodes,
  • the capacitor according to the invention is particularly suitable for use in the high voltage range.
  • Corresponding embodiments preferably have a thickness of
  • Dielectric i. the glass-ceramic in the range of 0.1 mm to 20 mm, particularly preferably in the range of 0.15 to 10 mm.
  • Dielectric strength of the glass ceramic allows.
  • the surface of the glass-ceramic is smoother than, for example, the surface of a conventional ceramic, which is also the creep path
  • inventive capacitor with respect to their Creep resistance higher requirements than a conventional capacitor, ie a capacitor with a ceramic dielectric.
  • this is a good wetting of
  • Moisture inclusions which can shorten the creepage path, are present. Be particularly advantageous in the case of the sheath of the capacitor components, the use of a plastic or a corresponding precursor has been found in which by curing the
  • Polymerization shrinkage occurs. While in most applications, such a polymerization shrinkage is just to be avoided, in one embodiment of the invention, the components of the sheath are chosen so that a polymerization shrinkage occurs. Preferably, the polymerization shrinkage is in the range of 0.6 to 10%. Due to the polymerization shrinkage, the sheath contracts, which creates a bond between the sheath and
  • the tracking resistance can be influenced on the one hand by the thickness of the insulating sheath.
  • the sheath has a thickness in the range of 1 to 15 mm, preferably in the range of 3 to 10 mm.
  • capacitors with a jacket of silicone resin are suitable for example, in terms of temperature stability.
  • capacitors with a jacket of silicone resin are suitable for example, in terms of temperature stability.
  • the choice of the plastic used in the sheath contributes significantly to the dielectric strength. This can be achieved, for example, by a low dielectric
  • £ r is in the range of 4 to 7.
  • the plastic is crosslinked.
  • networking for example, the mechanical strength of the plastic and thus the
  • the plastic is also crosslinked via siloxane units.
  • an organofunctional ionic silane is used for crosslinking the plastic, which may be part of the coating preparation.
  • the silanes act not only as crosslinkers, but also as water scavengers.
  • corresponding CC silanes are used for crosslinking used. These have particularly high hydrolysis and condensation rates.
  • organofunctional silanes leads to improved wettability of the
  • siloxane units Surface of the glass ceramic as well as the metal electrodes to form siloxane units.
  • silanes with hydrophobic radicals for example in the form of a
  • the silane thus also functions as
  • a silane is selected from the group of elements
  • Trimethylethoxysilane isooctyltrimethoxysilane
  • the organic radical of the silane may contain one or more reactive organofunctional moieties
  • the organofunctional group is an amino, an epoxy, a methacrylic, a vinyl, an isocyanato and / or a mercapto group.
  • the silane is thus covalently bonded both to the surface of the glass ceramic and to the plastic of the sheath.
  • a silane is selected from the group comprising the elements N- (2-aminoethyl) -3-amino-propyltrimethoxysilane, N- (2-)
  • the organofunctional silane can be the
  • Coating preparation can be added.
  • the surface of the glass ceramic and / or the metal electrodes can be treated with an organofunctional silane, so that a corresponding Coating on the surface of the glass ceramic forms.
  • the coating is covalently bonded to the glass ceramic via Si-O bonds.
  • the glass ceramic or the partially metallized glass ceramic can be completely provided with the coating or the coating can be carried out only on portions of the glass ceramic. It has been found to be particularly advantageous if at least the side surfaces of the
  • Glass ceramic can be treated with the organofunktionilen silane.
  • the glass ceramic thus treated can subsequently be encased with the plastic, the siloxane coating formed by the silane acting as a primer layer.
  • Embodiment of the invention at least partial areas, which have a bonding agent layer between the glass ceramic or the metal electrodes and the KunststoffStuffummantelung.
  • the primer layer has a
  • the adhesion-promoting effect of the adhesion promoter layer can be based primarily on van der Waals interactions between the hydrophobic radical of the silane used and the polymer of the
  • Prepolymers is, as well as a covalent bond between the adhesive layer and the
  • connection of the adhesive layer to the surface of the glass ceramic can be improved in this case if at least partial areas of the glass ceramic having a Si0 2 ⁇ containing layer. Through the Si0 2 ⁇ containing layer, the number of available for the condensation reaction with the silane hydroxy groups is still increased.
  • Sheath additionally inorganic fillers.
  • the sheath is a
  • Fillers can be increased on the one hand, the mechanical strength of the sheath. Furthermore, the use of inorganic fillers can lead to the
  • the breakdown capability of the cladding increases. This can be done in particular by the use of fillers based on A1 2 0 3 .
  • the sheath can also Si0 2 particles as fillers
  • organofunctional silane as crosslinker and / or
  • Adhesion promoters used so can in oxidic
  • Fillers also carried out a covalent attachment of the silane to the surface of the filler.
  • a surface modification of the filler can take place up to a covalent attachment of the filler to the polymer via the silane. This can for example lead to an increased mechanical and / or chemical resistance of the
  • the fillers may have particle sizes in the range of 1 to 100 pm.
  • the sheath contains fillers
  • Particle sizes in the nm range in particular in the range of 5 to 200 nm.
  • the invention relates to a method for
  • the method comprises at least the following
  • step b) a metal-containing paste, preferably a silver-containing paste, on the top and bottom of the
  • Applied glass ceramic This can be done for example by a printing process or by doctoring.
  • the paste contains metal particles in addition to a Anpastmedium,
  • the metal paste may contain particles of other metals, for example copper or aluminum particles.
  • the glass ceramic Before applying the metal paste, the glass ceramic can be completely or partially cleaned or etched. By etching, the surface is additionally roughened, resulting in improved adhesion of the
  • Glass ceramic can be improved.
  • step c) the cladding of the metallized in step b) glass ceramic takes place.
  • the metallized glass ceramic is coated with a thermoplastic material.
  • the coating can be applied by a dipping process.
  • the corresponding plastic is melted to a temperature above the glass transition temperature and the metallized
  • the glass-ceramic can also be coated by means of a fluidized bed process.
  • the glass-ceramic can also be coated by means of a fluidized bed process.
  • the coating composition is a two-component casting resin.
  • the casting resin may contain further additives,
  • the encapsulation may in particular be applied by a vacuum casting method or an automatic pressure gelling method.
  • Curing of the resin takes place by polymerization and / or crosslinking.
  • the coating composition can be cured at room temperature. Another embodiment provides that the coating composition is hot curing.
  • the coating composition may have inorganic fillers, for example Si0 2 or A1 2 0 3 .
  • the filler content is preferably in the range of 50 to 75 wt .-%, particularly preferably in the range of 55 to 68 wt .-% based on the total weight of the coating composition.
  • the filler content is preferably in the range of 50 to 75 wt .-%, particularly preferably in the range of 55 to 68 wt .-% based on the total weight of the coating composition.
  • the coating preparation comprises as prepolymer an epoxy resin and a hardener, preferably an anhydride or amine.
  • the prepolymer has an epoxide number (according to ISO 3001) in the range of 2 to 3 Eq / kg, preferably in the range of 2.2 to 2.35 Eq / kg.
  • the epoxide number accordinging to ISO 3001 in the range of 2 to 3 Eq / kg, preferably in the range of 2.2 to 2.35 Eq / kg.
  • Coating preparation an epoxy resin based on bisphenol A. This may be a solvent-free epoxy resin, but depending on the desired viscosity of the coating formulation, a reactive diluent may also be used as the solvent.
  • the curing agent contained in the coating composition is an anhydride-based curing agent in this embodiment. A further embodiment provides that the
  • thermosetting epoxy casting systems i. the crosslinking takes place in these systems at elevated temperatures. It is also possible to use those epoxy resin casting systems which cure at room temperature, for example the following systems from Huntsman:
  • the coating preparation can be further provided.
  • Additives such as e.g. Additives to increase the elasticity of the epoxy resin (Flex) or to accelerate the crosslinking (accelerator) included. Examples of such Additives
  • Coating formulations are the following systems from Huntsman:
  • Coating spread as a prepolymer, a polyurethane or a polyurethane precursor and a curing agent for example, the following 2-component polyurethane casting resins from Huntsman can be used:
  • a development of the invention provides that the
  • Coating mass additionally at least one
  • organofunctional silane which ions can be covalently bound by hydrolysis and / or Kondensationsreakt to the surface of the glass ceramic and / or the metal electrodes.
  • the organofunctional silane silane can act as a crosslinker.
  • the organofunctional silane can contain hydrophobic groups.
  • the organic radical of the silane may be one or more reactive
  • organofunktioneile groups that allows a covalent attachment to the polymer. It is also possible to use a mixture of different silanes.
  • upstream step are applied to the surface of the glass ceramic.
  • the order can be completed or it can be only part of the
  • the organofunctional silane is at least on the side surfaces of the glass ceramic
  • the organofunctional silane forms an adhesion promoter layer.
  • a covalent bonding of the two layers takes place in step c) at the interface between the silane layer and the synthetic material layer. This reacts the
  • organofunktioneile group of the silane with the polymer or prepolymer of the coating preparation preferably takes place by copolymerization, endcapping or free-radical addition.
  • Acrylic polymers aminosilanes and methacrylic polymers
  • Isocycanatosilanes and OH-terminated polymers such as polyethers, polyesters, polyurethanes, amino, epoxy and / or glycidoxysilanes, and epoxy precursors as prepolymers, and aminosilanes and phenolic precursors as prepolymers.
  • Unsaturated silanes and polymer or prepolymer can also be covalently linked together by a radical grafting reaction.
  • the following combinations have been found to be advantageous: vinylsilanes and polyolefins, methacryloxysilanes and polyolefins, and also methocryloxysilanes and unsaturated polyesters.
  • the capacitors according to the invention or the capacitors produced by the method according to the invention can be used for example in high voltage engineering.
  • FIGS. 1 to 3 show schematic representations of the cross sections of different embodiments of the converter according to the invention.
  • 1 shows an embodiment of the capacitor 1.
  • the disk-shaped glass ceramic 2 serves as a dielectric.
  • the electrodes 3a and 3b are with the same
  • Derivatives 5a and 5b connected. Glass ceramic 2 and
  • Electrodes (3a, 3b) have a plastic covering 4.
  • the side surfaces 2c have a full-surface bond with the
  • the KunststoffStoffSchicht 4 may contain a crosslinker based on a silane, so that glass ceramic 2 and / or metal electrodes 3a, 3b and
  • Kunststoffmantel 4 can be covalently connected to each other.
  • the embodiment 6 shown in FIG. 2 additionally has an adhesion promoter layer 7 between the synthetic material sheath 4 and the glass ceramic 2 or the electrodes (3a, 3b).
  • the adhesion promoter layer 7 is attached to the
  • the adhesion promoter layer 7 contains hydrophobic organic radicals and may be bonded to the plastic layer 4 by van der Waals interactions and / or via covalent bonds. Alternatively to that shown in FIG.
  • Adhesive layer 7 are provided. Preferably, at least the side surfaces 2 c of the glass ceramic are coated with the adhesion promoter layer 7.
  • FIG. 3 shows a further embodiment 8 of the capacitor, in which the glass ceramic 2 additionally has a layer 9 containing SiC> 2.
  • the SiC> 2-containing layer 9 improves in particular the wetting of the
  • an adhesion promoter layer 7 is additionally present.
  • In the embodiment 1 is a glass ceramic as a
  • Bariumtitantat Anlagen glass ceramic used.
  • the top and bottom of the glass ceramic are provided with a silver-containing coating, which each acts as an electrode.
  • the silver-containing coating contains silver and glass particles.
  • the coated glass ceramic is covered with an artificial material layer based on an epoxy resin.
  • the epoxy resin is reinforced with inorganic fillers.
  • Two-component epoxy casting resin system with an epoxy resin based on bisphenol A as a prepolymer and a
  • Anhydride hardener (Araldit ® - Giessharzsystem the company Huntsman with the components Araldit ® CW 229-3 and Aradur ® HW 229-1) used.
  • Resin and hardener components are homogenized for this purpose in the required amount at slightly elevated temperature up to 60 ° C under vacuum.
  • the sheathing is done with a conventional vacuum casting or with a
  • ADG method automatic pressure gelation method

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)

Abstract

L'invention concerne un condensateur (1), adapté en particulier à des applications haute tension, comprenant au moins un corps moulé en vitrocéramique (2) en tant que diélectrique et deux électrodes métalliques (3a, b), lesdites électrodes métalliques étant appliquées sous la forme d'un revêtement contenant du métal sur les surfaces opposées du corps moulé en vitrocéramique. La vitrocéramique (2) recouverte des électrodes métalliques (3a, b) présente une enveloppe (4) en matière plastique, ladite enveloppe (4) entourant la vitrocéramique (2) pourvue des électrodes métalliques (3a, b) et en particulier les faces latérales (2c) de la vitrocéramique non recouvertes présentant une liaison intégrale avec la matière plastique. En outre, l'invention concerne un procédé de production d'un condensateur correspondant.
PCT/EP2015/057120 2014-04-17 2015-03-31 Condensateur avec vitrocéramique muni d' encapsulation en matière plastique Ceased WO2015158549A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014105493.8A DE102014105493B3 (de) 2014-04-17 2014-04-17 Glaskeramikkondensator mit Kunststoffverkapselung, sowie Verfahren zu dessen Herstellung
DE102014105493.8 2014-04-17

Publications (1)

Publication Number Publication Date
WO2015158549A1 true WO2015158549A1 (fr) 2015-10-22

Family

ID=53724272

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/057120 Ceased WO2015158549A1 (fr) 2014-04-17 2015-03-31 Condensateur avec vitrocéramique muni d' encapsulation en matière plastique

Country Status (2)

Country Link
DE (1) DE102014105493B3 (fr)
WO (1) WO2015158549A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024124693B3 (de) * 2024-08-29 2025-12-04 Thyssenkrupp Ag Verbessertes Haftvermittlersystem für vergossene elektronische Bauteile insbesondere für Passivsonar

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1293898B (de) * 1963-05-13 1969-04-30 Sprague Electric Co Elektrischer Kondensator aus einer gebrannten Bariumtitanatscheibe
US20100035748A1 (en) * 2008-02-05 2010-02-11 Tdk Corporation Dielectric ceramic composition and an electronic component

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3946290A (en) * 1973-10-09 1976-03-23 Tdk Electronics Co. Ltd. High tension ceramic condenser
DE19505081C2 (de) * 1994-02-17 1999-11-25 Murata Manufacturing Co Hochspannungskondensator und Verfahren zu dessen Herstellung
JPH08138972A (ja) * 1994-11-11 1996-05-31 Murata Mfg Co Ltd 磁器コンデンサ
JPH1036510A (ja) * 1996-07-26 1998-02-10 Toray Dow Corning Silicone Co Ltd 電気部品およびその製造方法
JP2002083737A (ja) * 2000-09-07 2002-03-22 Murata Mfg Co Ltd 非線形誘電体素子
TW556237B (en) * 2001-09-14 2003-10-01 Matsushita Electric Industrial Co Ltd Ceramic capacitor
JP4856362B2 (ja) * 2004-05-20 2012-01-18 Ｔｄｋ株式会社 高電圧セラミックコンデンサ
DE102009024645B4 (de) * 2009-06-04 2011-06-01 Schott Ag Glaskeramik mit nanoskaligem Bariumtitanat, Verfahren zu deren Herstellung und Verwendung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1293898B (de) * 1963-05-13 1969-04-30 Sprague Electric Co Elektrischer Kondensator aus einer gebrannten Bariumtitanatscheibe
US20100035748A1 (en) * 2008-02-05 2010-02-11 Tdk Corporation Dielectric ceramic composition and an electronic component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Araldite Casting Resin System - Araldite CW1446 BDF/ Hardener HY2919", BROCHURE, 30 June 1998 (1998-06-30), pages 1 - 6, XP055210142, Retrieved from the Internet <URL:http://www.lindberg-lund.com/files/Tekniske%20datablad/VAN-CW1446-TD.pdf> [retrieved on 20150828] *

Also Published As

Publication number Publication date
DE102014105493B3 (de) 2015-09-24

Similar Documents

Publication Publication Date Title
DE2202337C3 (de) Verfahren zur Herstellung einer Halbleiteranordnung
WO1997002321A1 (fr) Utilisation de resines epoxy modifiees au silicone comme masses de scellement
DE102012021494A1 (de) Schichtstruktur auf Silikonbasis mit oleophob-hydrophober Oberfläche sowie elektrische Maschine mit einer solchen
DE602005004560T2 (de) Vorgeformte zusammensetzungen in geformter form mit polymermischungen
DE19904133A1 (de) Oberflächenmodifizierter Isolator und Verfahren zur Modifizierung der Oberfläche eines Isolators
DE1114031B (de) Verfahren zur Herstellung von Schichtkoerpern fuer elektrische Isolierungen
EP1518889B1 (fr) Système durcissable de résine réactive
DE102010022265A1 (de) Hydrophobe Beschichtung und Anwendung dazu
DE69226757T2 (de) Filmkondensator und Verfahren zur Herstellung
DE1621854A1 (de) Verfahren zur Herstellung von elektrischen Isolatoren
DE102020211111A1 (de) Pulverlack-Formulierung für ein Isolationssystem einer elektrischen Maschine, elektrische Maschine mit einem solchen Isolationssystem und Verfahren zum Herstellen eines solchen Isolationssystems
DE102014105493B3 (de) Glaskeramikkondensator mit Kunststoffverkapselung, sowie Verfahren zu dessen Herstellung
EP0919115A1 (fr) Materiau d&#39;etancheite conducteur et joint d&#39;etancheite profile
DE102010043811A1 (de) Gelpassiviertes elektrisches Bauteil
DE202014101837U1 (de) Glaskeramikkondensator mit Kunststoffverkapselung
DE69520490T2 (de) Methode zum Schützen von Schaltkreise
EP2742513B1 (fr) Revêtement à haute résistance à l&#39;effet corona et procédé de fabrication dudit revêtement
EP1337585A1 (fr) Masse de scellement a une composante modifiee a la silicone
DE2630731C3 (de) Verwendung von Metallpigmenten in elektrostatisch versprühbaren Nass- und Pulverlacken
WO2009089957A1 (fr) Système de résine réactive durcissable
DE102019217135A1 (de) Gasphasen-Beschichtungsverfahren mit funktionalisiertem Organosiloxan als Präkursor
EP1917316B1 (fr) Matiere de revetement
WO2015090935A1 (fr) Composition de résine coulable résistant aux décharges disruptives et au contournement
DE102020210680A1 (de) Haftvermittlungs-Verbundwerkstoff, Verfahren zum Herstellen eines Haftvermittlungs-Verbundwerkstoffs, Elektrische Vorrichtung, Verfahren zum Herstellen einer elektrischen Vorrichtung
DE10255326B3 (de) Steckverbindungselement

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15741884

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15741884

Country of ref document: EP

Kind code of ref document: A1