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WO2015152600A1 - Boîtier de module de circuit de protection de batterie et bloc-batterie - Google Patents

Boîtier de module de circuit de protection de batterie et bloc-batterie Download PDF

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Publication number
WO2015152600A1
WO2015152600A1 PCT/KR2015/003153 KR2015003153W WO2015152600A1 WO 2015152600 A1 WO2015152600 A1 WO 2015152600A1 KR 2015003153 W KR2015003153 W KR 2015003153W WO 2015152600 A1 WO2015152600 A1 WO 2015152600A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
protection circuit
battery
battery protection
polarity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/003153
Other languages
English (en)
Korean (ko)
Inventor
나혁휘
황호석
김영석
안상훈
박승욱
박재구
윤영근
이현석
왕성희
홍지현
백지선
임의혁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ITM Semiconductor Co Ltd
Original Assignee
ITM Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140040120A external-priority patent/KR101595501B1/ko
Priority claimed from KR1020140045642A external-priority patent/KR101582952B1/ko
Application filed by ITM Semiconductor Co Ltd filed Critical ITM Semiconductor Co Ltd
Publication of WO2015152600A1 publication Critical patent/WO2015152600A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0436—Small-sized flat cells or batteries for portable equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
    • H01M50/103—Primary casings; Jackets or wrappings characterised by their shape or physical structure prismatic or rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/572—Means for preventing undesired use or discharge
    • H01M50/574—Devices or arrangements for the interruption of current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H01M2200/10—Temperature sensitive devices
    • H01M2200/106—PTC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
    • H01M2220/30—Batteries in portable systems, e.g. mobile phone, laptop
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a package of a battery protection circuit module and a battery pack having the same, and more particularly, to a battery protection circuit module package and a battery pack that can be miniaturized and easily installed.
  • batteries are used in portable terminals such as mobile phones and PDAs.
  • Lithium-ion batteries are the most widely used batteries in portable terminals and the like. They generate heat during overcharging and overcurrent, and if the heating continues and the temperature rises, performance deterioration and risk of explosion occur. Therefore, a typical battery may include a protection circuit device that detects overcharge, overdischarge, and overcurrent and blocks battery operation.
  • Such a protection circuit device is generally mounted together with a holder on a battery bare cell.
  • the holder includes a body portion formed of resin, and optionally, at least one through hole formed in the body portion.
  • the holder serves as a guide for accurately aligning and mounting the battery protection circuit package on the top surface of the battery bare cell.
  • the holder may serve as a support for fixing the battery protection circuit package on the top surface of the battery bare cell. have.
  • the holder may serve to fix the top case provided on the battery bare cell.
  • a technology for forming a fixing part by insert injection on one side of the holder and bonding the fixing part on the upper surface of the battery bare cell has been developed.
  • the present invention has been made to solve various problems including the above problems, and an object thereof is to provide a battery protection circuit module package and a battery pack, which are advantageous for integration and miniaturization.
  • these problems are exemplary, and the scope of the present invention is not limited thereby.
  • the battery protection circuit module package may include: a first internal connection terminal lead electrically connected to an electrode terminal of a battery bare cell; An external connection terminal lead disposed to be spaced apart from the first internal connection lead and constituting a plurality of external connection terminals; And a dummy lead arranged spaced apart from the first internal connection lead and the external connection lead to electrically insulate the dummy lead.
  • the substrate includes a printed circuit board, wherein the battery protection circuit element comprises a protection IC, a field effect transistor (FET) and at least one or more disposed on the printed circuit board. It may include a passive element.
  • the battery protection circuit element comprises a protection IC, a field effect transistor (FET) and at least one or more disposed on the printed circuit board. It may include a passive element.
  • the substrate includes a mounting leadframe having a plurality of mounting leads spaced apart, the battery protection circuit element being directly mounted on the mounting leadframe, a field effect transistor and at least And at least one passive element, wherein the passive element is arranged to connect at least some of the spaced plurality of mounting leads, wherein the passive element is not inserted into and fixed on the mounting lead frame, but rather to surface mount technology.
  • the protection IC and the field effect transistor are not inserted into and fixed in the form of a semiconductor package on the mounting lead frame, but are fixed by at least a portion of the surface of the mounting lead frame.
  • the two chips selected from the group consisting of the protection IC, the field effect transistor, and the plurality of mounting leads are electrically fixed.
  • an electrical connection member including a bonding wire or a bonding ribbon to connect, the battery protection circuit can be configured without using a separate printed circuit board.
  • the first internal connection terminal lead and the dummy lead respectively disposed at both edges of the terminal lead frame are disposed in a plate of a first polarity and a plate of the first polarity.
  • One of the electrode terminals of the battery bare cell including two polarity electrode cells may be connected and connected to a plate of a first polarity, and the PTC structure may be electrically connected to an electrode cell of a second polarity among the electrode terminals of the battery bare cell. Can be.
  • a portion of the substrate corresponding to at least a portion of the lead for the external connection terminal is attached to the terminal lead frame through a conductive adhesive, and at least a portion of the dummy lead among the substrate. Corresponding portions may be attached to the terminal leadframe via an insulating adhesive.
  • the PTC structure includes a PTC element and a metal connection member attached to one of an upper surface and a lower surface of the PTC element, wherein the PTC element is sealed by the encapsulant, and the substrate At least a portion of the metal connecting member exposed through the first through hole formed in the second through hole formed in the encapsulant may be electrically connected to the electrode cell of the second polarity.
  • the lead for the first internal connection terminal and the dummy lead may be bent in a gull-form form to join the plate having the first polarity.
  • the first internal connection terminal lead and the dummy lead respectively disposed at both edges of the terminal lead frame are disposed in a plate of a first polarity and a plate of the first polarity.
  • the terminal lead frame is disposed between the lead for the external connection terminal and the dummy lead It may further include a lead for the second internal connection terminal, which can be directly connected to and electrically connected to the electrode cell of the second polarity.
  • the substrate may be attached via a conductive adhesive on the lead for the external connection terminal.
  • the PTC structure includes a PTC element and a metal connection member attached to one of an upper surface and a lower surface of the PTC element, wherein the PTC element and the metal connection member are attached to the encapsulant. Both can be sealed.
  • the lead for the first internal connection terminal and the dummy lead are bent in a form of a form to bond with the plate of the first polarity, and the lead for the second internal connection terminal is the second lead. It may be bent in the form of a gull form to be bonded to the electrode cell of the polarity.
  • the encapsulant includes a first encapsulation material and a second encapsulation material spaced apart from each other, and the first encapsulation material includes at least a portion of the lead for the external connection terminal, the substrate, and the PTC structure.
  • the second encapsulant may seal at least a portion of the second internal connection terminal lead and the dummy lead so as to seal a space between the second internal connection terminal lead and the dummy lead.
  • the substrate may have an exposed terminal that is not sealed by the encapsulant on an upper surface and / or a lower surface.
  • the exposed terminal may be electrically connected to at least a portion of the terminal leadframe.
  • a battery pack according to another aspect of the present invention may be provided.
  • the battery pack includes: a battery bare cell having an electrode terminal including a plate having a first polarity and an electrode cell having a second polarity disposed in the plate having the first polarity; And the battery protection circuit module package described above disposed on an upper surface of the battery bare cell.
  • a battery protection circuit package may be provided.
  • the battery protection circuit package is interposed between the top case having a first fastening member and the battery bare cell, and to fix the top case without using a separate holder on the battery bare cell, the battery protection circuit package It has a second fastening member that can be fastened corresponding to the first fastening member of the top case.
  • the second fastening member may include a fastening protrusion capable of fastening with the first fastening member including a fastening groove.
  • the second fastening member may include a fastening groove capable of fastening with the first fastening member including a fastening protrusion.
  • the second fastening member may be configured to be fastened with at least one of the first fastening member and an insertion fastening method, an engagement fastening method, and a locking fastening method.
  • the battery protection circuit package includes a substrate, a battery protection circuit element mounted on the substrate, and an encapsulant for sealing the battery protection circuit element, a part of the encapsulant is the second fastening
  • the member can be configured.
  • a battery pack according to another aspect of the present invention may be provided.
  • the battery pack includes a battery protection circuit package interposed between the top case and the battery bare cell, and to fix the top case without using a separate holder on the battery bare cell, the top case may include the first case.
  • the fastening member is provided, and the battery protection circuit package includes a second fastening member fastened corresponding to the first fastening member.
  • any one of the first fastening member and the second fastening member is a fastening groove and the other is a fastening protrusion, and the first fastening member and the second fastening member are inserted fastening methods, interlocking fastening methods, and
  • the fastening method may be fastened to each other in at least one or more ways.
  • the battery bare cell includes an electrode terminal having a first polarity plate and a second polarity electrode cell disposed in the first polarity plate
  • the battery protection circuit package comprises: a substrate; A battery protection circuit element mounted on the substrate; And an encapsulant for sealing the battery protection circuit element, wherein the substrate is for a first internal connection terminal bonded to the plate having the first polarity to electrically connect the battery bare cell and the battery protection circuit element.
  • a second internal connection terminal lead bonded to the electrode cell of the second polarity to electrically connect the battery bare cell and the battery protection circuit element;
  • a lead for an external connection terminal constituting a plurality of external connection terminals;
  • a terminal lead frame having a dummy lead connected to the plate having the first polarity while being electrically insulated from the first internal connection terminal lead, the second internal connection terminal lead, and the external connection terminal lead. It includes, The encapsulation material, The first encapsulation material for sealing the battery protection circuit element; And a second encapsulation material which is fixed to the dummy lead by sealing at least a portion of the dummy lead while being spaced apart from the first encapsulation material.
  • the first internal connection lead and the dummy lead are respectively bonded to the plate of the first polarity on both sides of the electrode cell of the second polarity, and the second internal connection lead is connected to the lead.
  • the battery protection circuit package can be fixed on the battery bare cell without using a separate holder.
  • a direction in which the first internal connection terminal lead and the dummy lead are exposed and extended from the encapsulation material is not parallel to a direction in which the second internal connection terminal lead is exposed and extended from the encapsulant.
  • the second internal connection terminal lead exposed from the encapsulant is folded so that the encapsulant constituting the battery protection circuit package is disposed directly on an upper surface of the battery bare cell. Can be.
  • FIG. 1 is a circuit diagram of a battery protection circuit constituting a part of a battery protection circuit module package according to some embodiments of the present invention.
  • FIGS. 2 and 3 are combined perspective views illustrating a battery protection circuit module package according to an embodiment of the present invention.
  • FIG. 4 is an exploded perspective view illustrating a battery protection circuit module package according to an embodiment of the present invention.
  • FIG. 5 is a perspective view illustrating a structure implemented in an intermediate process of manufacturing a battery protection circuit module package according to an embodiment of the present invention.
  • FIG. 6 is a perspective view illustrating a battery pack in which a battery protection circuit module package according to an embodiment of the present invention is coupled to a battery bare cell.
  • FIG. 7 and 8 are combined perspective views illustrating a battery protection circuit module package according to another embodiment of the present invention.
  • FIG. 9 is an exploded perspective view illustrating a battery protection circuit module package according to another embodiment of the present invention.
  • FIG. 10 is a perspective view illustrating a structure implemented in an intermediate process of manufacturing a battery protection circuit module package according to another embodiment of the present invention.
  • FIG. 11 is a perspective view illustrating a battery pack in which a battery protection circuit module package according to another embodiment of the present invention is coupled to a battery bare cell.
  • FIG. 12 is a perspective view illustrating a battery pack in which a battery protection circuit module package according to a comparative example of the present invention is coupled to a battery bare cell.
  • FIG. 13 is a perspective view illustrating a configuration in which a battery protection circuit module package according to embodiments of the present disclosure is further coupled to a battery pack coupled to a battery bare cell.
  • FIG. 14 is an exploded perspective view of a battery pack including a battery protection circuit package according to another embodiment of the present invention.
  • FIG. 15 is a perspective view of a battery pack including a battery protection circuit package according to another embodiment of the present invention.
  • 16 is an exploded perspective view illustrating a battery protection circuit package according to another embodiment of the present invention.
  • FIG. 17 is a combined perspective view illustrating a battery protection circuit package according to another embodiment of the present invention.
  • FIGS. 18 to 20 are perspective views sequentially illustrating a process of arranging a battery protection circuit package bonded to a battery bare cell according to another embodiment of the present invention.
  • FIG. 21 is a plan view of the structure shown in FIG.
  • FIG. 22 is an exploded perspective view of a battery pack including a battery protection circuit package according to a comparative example of the present invention.
  • first, second, etc. are used herein to describe various members, parts, regions, layers, and / or parts, these members, parts, regions, layers, and / or parts are defined by these terms. It is obvious that not. These terms are only used to distinguish one member, part, region, layer or portion from another region, layer or portion. Thus, the first member, part, region, layer or portion, which will be discussed below, may refer to the second member, component, region, layer or portion without departing from the teachings of the present invention.
  • top or “above” and “bottom” or “bottom” may be used herein to describe the relationship of certain elements to other elements as illustrated in the figures. It may be understood that relative terms are intended to include other directions of the device in addition to the direction depicted in the figures. For example, if the device is turned over in the figures, elements depicted as present on the face of the top of the other elements are oriented on the face of the bottom of the other elements. Thus, the exemplary term “top” may include both “bottom” and “top” directions depending on the particular direction of the figure. If the device faces in the other direction (rotated 90 degrees relative to the other direction), the relative descriptions used herein can be interpreted accordingly.
  • the lead frame is a structure in which lead terminals are patterned on a metal frame, and may be distinguished from a printed circuit board having a metal wiring layer formed on an insulating core in structure or thickness thereof.
  • FIG. 1 is a circuit diagram of a battery protection circuit constituting a part of a battery protection circuit module package according to some embodiments of the present invention.
  • the battery protection circuit 10 may include first and second internal connection terminals B + and B ⁇ to be connected to a battery cell, and may be connected to a charger.
  • the first to third external connection terminals (P +, CF, P-) for connecting to the electronic device (for example, a mobile terminal, etc.) operated by the battery power when the discharge is provided.
  • the first external connection terminal P + and the third external connection terminal P- among the first to third external connection terminals P +, CF, and P- are for power supply and the other external connection terminal is
  • the second external connection terminal CF divides the battery to charge the battery.
  • the second external connection terminal CF may apply a thermistor, which is a component that senses the battery temperature during charging, and may be used as a terminal to which other functions are applied.
  • the battery protection circuit 10 includes, for example, the dual FET chip 110, the protection IC 120, the resistors R1, R2, and R3, the varistor V1, and the capacitors C1 and C2. It may include a connection structure.
  • the dual FET chip 110 includes a first field effect transistor FET1 and a second field effect transistor FET2 having a drain common structure.
  • the protection IC 120 is connected to the first internal connection terminal B +, which is a positive terminal of the battery, through a resistor R1, and a charge voltage or a discharge voltage is applied through the first node n1.
  • the inside of the protection IC 120 includes a reference voltage setting unit, a comparison unit for comparing the reference voltage and the charge / discharge voltage, an overcurrent detector, and a charge / discharge detector.
  • the criterion for determining the charge and discharge states can be changed to a specification required by the user, and the charge / discharge state is determined by recognizing the voltage difference of each terminal of the protection IC 120 according to the determined criterion.
  • the DO terminal goes low to turn off the first field effect transistor FET1
  • the overcharge state reaches the overcharge state
  • the CO terminal goes low.
  • the field effect transistor FET2 is turned off, and when the overcurrent flows, the second field effect transistor FET2 is charged during charging and the first field effect transistor FET1 is turned off when discharging.
  • the resistor R1 and the capacitor C1 serve to stabilize the fluctuation of the power supply of the protection IC 120.
  • the resistor R1 is connected between the first node n1, which is the power supply V1 of the battery, and the VDD terminal of the protection IC 120, and the capacitor C1 is connected between the VDD terminal and the VSS terminal of the protection IC. do.
  • the first node n1 is connected to the first internal connection terminal B + and the first external connection terminal P +.
  • the resistor R1 is made larger, the detection voltage is increased due to the current penetrating into the protection IC 120 during voltage detection. Therefore, the value of the resistor R1 is set to an appropriate value of 1 K? Or less.
  • the value of the capacitor (C1) has a suitable value of 0.01 ⁇ F or more for stable operation.
  • the resistors R1 and R2 become current limiting resistors when the high voltage charger or the charger exceeding the absolute maximum rating of the protection IC 120 is connected upside down.
  • the resistor R2 is connected between the V-terminal of the protection IC 120 and the second node n2 to which the source terminal S2 of the second field effect transistor FET2 is connected. Since the resistors R1 and R2 may cause power consumption, the sum of the resistance values of the resistors R1 and R2 is usually set to be larger than 1 K ⁇ . If the resistor R2 is too large, no recovery may occur after the overcharge cutoff, and thus the value of the resistor R2 is set to a value of 10 K? Or less.
  • the capacitor C2 is the source node S1 (or VSS terminal, the second internal connection terminal B) of the second node n2 (or the third external connection terminal P ⁇ ) and the first field effect transistor FET1. -)) Has a structure that is connected between.
  • the capacitor C2 does not significantly affect the characteristics of the battery protection circuit product, but is added for the user's request or stability.
  • the capacitor C2 is for the effect of stabilizing the system by improving resistance to voltage fluctuations or external noise.
  • the resistor R3 and the varistor V1 are elements for ESD protection and surge protection.
  • the resistor R3 and the varistor V1 are connected to each other in parallel to each other so that the second external connection terminal CF and the second node n2 ( Or it is connected between the third external connection terminal (P-).
  • the varistor (V1) is a device that lowers the resistance when an overvoltage occurs, and when the overvoltage occurs, the resistance is lowered to minimize circuit damage due to the overvoltage.
  • a battery protection circuit configured by packaging the battery protection circuit 10 of FIG. 1 into one including an external connection terminal (P +, P-, CF) and an internal connection terminal (B +, B-). Implement a package of modules.
  • the protection circuit according to some embodiments of the present invention described above is exemplary, and the configuration, number, arrangement, etc. of the protection IC, the FET structure, or the passive elements may be appropriately modified according to the additional function of the protection circuit.
  • a modified embodiment of the battery protection circuit element will be described.
  • the arrangement of the dual FET chip 110 and the protection IC 120 may have a structure in which the dual FET chip 110 and the protection IC 120 are stacked vertically or adjacent to each other. That is, the protection IC 120 may be stacked on the upper surface of the dual FET chip 110, or the dual FET chip 110 may be disposed adjacent to the left or right side of the protection IC 120.
  • the dual FET chip 110 includes a first field effect transistor having a common drain structure and a second field effect transistor, that is, two field effect transistors (FETs), and the external connection terminal has a first gate of the first field effect transistor.
  • the terminal G1 and the first source terminal S1, the second gate terminal G2 and the second source terminal S2 of the second field effect transistor are provided on the upper surface of the dual FET chip 110.
  • the common drain terminal D may have a structure provided on the lower surface of the dual FET chip 110.
  • the protection IC 120 may have, for example, a structure in which the protection IC 120 is stacked on the upper surface of the dual FET chip 110.
  • the protection IC 120 is stacked in a region (for example, a central portion) except for a portion where external connection terminals on the dual FET chip 110 are disposed.
  • an insulating film for insulation may be disposed between the protection IC 120 and the dual FET chip 110, and the protection IC 120 and the dual FET chip 110 may be bonded with an adhesive of an insulating material. Since the size of the dual FET chip 110 is generally larger than that of the protection IC 120, an arrangement structure in which the protection IC 120 is stacked on the dual FET chip 110 is adopted.
  • the DO terminal DO of the protection IC 120 is electrically connected to the first gate terminal G1 through a wire or a wire.
  • the CO terminal CO of the protection IC 120 is electrically connected to the second gate terminal G2 through a wire or a wiring.
  • the connection structure of the remaining terminals will be described later.
  • the protection IC 120 and the dual FET chip 110 having the stacked structure as described above may be referred to as a stacked chip.
  • the battery protection circuit module package by introducing a protection IC having a stacked structure and a stacked chip of a dual FET chip, an area to be mounted on a substrate to be described later may be reduced, thereby miniaturizing the battery or Higher capacity can be achieved.
  • FIG. 2 and 3 are combined perspective views illustrating a battery protection circuit module package according to an embodiment of the present invention
  • FIG. 4 is an exploded perspective view illustrating a battery protection circuit module package according to an embodiment of the present invention.
  • 5 is a perspective view illustrating a structure implemented in an intermediate process of manufacturing a battery protection circuit module package according to an embodiment of the present invention
  • Figure 6 is a battery bare cell battery protection circuit module package according to an embodiment of the present invention
  • the battery protection circuit module package 300 includes a terminal lead frame 50, an element package 60, and an encapsulant 90.
  • the terminal leadframe 50 may include a first internal connection terminal lead 50a electrically connected to the electrode terminals 410 and 430 of the battery bare cell 400; An external connection terminal lead (50b, 50c, 50d, 50e) disposed to be spaced apart from the first internal connection terminal lead (50a) to constitute a plurality of external connection terminals; And the first internal connection terminal lead 50a and the external connection terminal lead 50b, to be electrically insulated from the first internal connection lead 50a and the external connection terminal leads 50b, 50c, 50d, and 50e. And a dummy lead 50f spaced apart from 50c, 50d, and 50e.
  • the terminal leadframe 50 may be made of nickel, copper, nickel plated copper, or other metal.
  • the lead 50a for the first internal connection terminal may be the first internal connection terminal B + illustrated in FIG. 1 to be connected to the battery cell. Any three leads selected from the leads 50b, 50c, 50d, and 50e for the external connection terminals are sequentially arranged with the leads P +, CF, and P- for the first to third external connection terminals shown in FIG. Or arranged in any order. The order of arranging the first to third external connection leads P +, CF, and P ⁇ may vary. The number or use of the leads 50b, 50c, 50d, and 50e for the external connection terminals may be appropriately changed according to the configuration of the battery protection circuit module package.
  • the dummy lead 50f is electrically insulated from the battery protection circuit elements 110, 120, 130, and 140 constituting the device package 60.
  • the first internal connection lead 50a and the dummy lead 50f are bonded to the top surface of the battery bare cell 400, so that the battery protection circuit module package 300 has no holder on the top surface of the battery bare cell 400. Can be fixed. In addition, even when the battery protection circuit module package 300 is to be fixed to the top surface of the battery bare cell 400 using the holder, there is no need to form a fixing part on one side of the holder by insert injection, thereby reducing the manufacturing cost. You can.
  • the bond may be joined in any manner selected from the group consisting of laser welding, resistance welding, soldering and conductive adhesives (eg, conductive epoxy), insulating adhesives, conductive tapes and insulating tapes.
  • conductive adhesives eg, conductive epoxy
  • the device package 60 is mounted on the terminal leadframe 50 so as to be electrically connected to the terminal leadframe 50, and the battery protection circuit elements 110, 120, 130, and 140 and the PTC structure 80 are disposed. And a substrate 62.
  • the encapsulant 90 seals the battery protection circuit elements 110, 120, 130, and 140, and seals at least a portion of the dummy lead 50f inwardly (for example, in the negative direction of the x-axis). At least a part of the terminal lead frame 50 is sealed to expose the rest of the dummy lead 50f, and at least a part of the PTC structure 80 is sealed.
  • the encapsulant 90 may include, for example, an epoxy molding compound (EMC).
  • the substrate 62 in which the battery protection circuit elements 110, 120, 130, and 140 may be disposed in the device package 60 may include a lead frame, a printed circuit board, a ceramic substrate, or a glass substrate. Can be.
  • the substrate 62 may include a printed circuit board.
  • the battery protection circuit elements 110, 120, 130, and 140 are specifically, a dual FET chip 110, a protection IC 120, and at least one passive element 130 disposed on the printed circuit board.
  • an electrical connection member 140 may include a bonding wire or a bonding ribbon.
  • the substrate 62 may include a mounting lead frame having a plurality of mounting leads spaced apart from each other.
  • the battery protection circuit elements 110, 120, 130, and 140 may include a protection IC, a field effect transistor, and at least one passive element mounted directly on the mounting lead frame.
  • the passive element is arranged to connect at least a portion of the spaced plurality of mounting leads, wherein the passive element is not inserted into and fixed on the mounting lead frame, but the surface of the surface of the mounting lead frame by surface mounting technology. It may be mounted and fixed on at least a portion.
  • the protection IC and the field effect transistor are not inserted into and fixed in the form of a semiconductor package on the mounting lead frame, but are sealed with a separate encapsulant on at least a part of the surface of the mounting lead frame by surface mounting technology. It may be mounted and fixed in the form of an unused chip die. Furthermore, by further comprising an electrical connection member including a bonding wire or a bonding ribbon for electrically connecting any two selected from the group consisting of the protection IC, the field effect transistor, and the plurality of mounting leads, separate printing is possible.
  • the battery protection circuit can be configured without using a circuit board.
  • the substrate 62 includes a mounting lead frame having a plurality of mounting leads spaced apart
  • an electrical connection member such as a bonding wire or a bonding ribbon is disposed on the mounting lead frame, thereby forming a circuit.
  • the process of designing and manufacturing the mounting leadframe for construction has a significant advantage that it can be simplified. If the electrical connection member described in the embodiments of the present invention is not introduced in the configuration of the battery protection circuit, the configuration of the plurality of leads constituting the mounting lead frame becomes very complicated, so that it is easy to effectively provide an appropriate mounting lead frame. You can't.
  • the protection IC and the field effect transistor are not inserted into and fixed in the form of a semiconductor package on the mounting lead frame, but by surface mounting technology.
  • the surface of the mounting leadframe it may be mounted and fixed in the form of a chip die sawed on a wafer not sealed with a separate encapsulant.
  • a chip die is implemented by performing a sawing process without sealing a separate encapsulant on a wafer on which a plurality of array-type structures (eg, a protection IC and a field effect transistor) are formed. Mean individual structures.
  • the protection IC and the field effect transistor are formed by a subsequent encapsulant 90 after the protection IC and the field effect transistor are mounted without being sealed with a separate encapsulant. Since sealing is performed, the process of forming the encapsulant may be performed only once in implementing the battery protection circuit module package 300.
  • the passive elements, the protection IC, and the field effect transistor are separately inserted and fixed or mounted on the printed circuit board, one molding process is required for each component first, and the fixed or mounted on the printed circuit board is required. Since another molding process is additionally required for each component mounted thereafter, the manufacturing process is complicated and the manufacturing cost is high.
  • the lead frame when the lead frame is used in the device package 60 of the battery protection circuit module package 300 according to the embodiment of the present invention, compared to the case of mounting a protection circuit on a printed circuit board (PCB), It can be expected that the overall height can be significantly reduced. That is, since the printed circuit board typically has a thickness of about 2 mm, the lead frame has a thickness of about 0.8 mm, so that the battery can be miniaturized by the thickness difference or the battery size can be increased by the thickness difference. Can be implemented.
  • PCB printed circuit board
  • the first internal connection lead 50a and the dummy lead 50f respectively disposed at both edges of the terminal lead frame 50 may include: A plate 430 of the first polarity among the electrode terminals of the battery bare cell 400 including the plate 430 of the first polarity and the electrode cell 410 of the second polarity disposed in the plate 430 of the first polarity. And may be connected to each other.
  • the PTC structure 80 may be directly electrically connected to the electrode cell 410 of the second polarity among the electrode terminals of the battery bare cell 400.
  • the plating material may be at least one selected from gold, silver, nickel, tin and chromium.
  • At least a portion of the substrate 62 corresponding to at least a portion of the lead 50b, 50c, 50d, and 50e for the external connection terminal may be attached to the terminal leadframe 50 via a conductive adhesive.
  • a conductive pad may be formed on a portion of the substrate 62 which is in contact with the terminal lead frame 50, and the conductive adhesive may be interposed between the terminal lead frame 50 and the conductive pad.
  • a portion of the substrate 62 corresponding to at least a portion of the dummy lead 50f may be attached on the terminal leadframe 50 via an insulating adhesive. Accordingly, the dummy lead 50f is bonded to the plate 430 of the first polarity, which is the electrode terminal of the battery bare cell 400, but the battery protection circuit module package 300 is connected to the battery bare through the dummy lead 50f. It is not electrically connected to the electrode terminal of the cell 400. However, since the dummy lead 50f is bonded to the plate 430 of the first polarity that is the electrode terminal of the battery bare cell 400, the coupling between the battery protection circuit module package 300 and the battery bare cell 400 is further improved. Robustly implemented
  • the PTC structure 80 includes a PTC element 82 and a metal connecting member 84 attached to one of the upper and lower surfaces of the PTC element 82.
  • the PTC (Positive Temperature Coefficient) element 82 can be formed by, for example, dispersing conductive particles in a crystalline polymer. Therefore, the PTC element 82 becomes a passage through which current flows between the metal connecting member 84 and the conductive pad 64 formed on the substrate 62 below the set temperature. However, when the temperature rises above the set temperature due to overcurrent, the crystalline polymer expands and the connection between the conductive particles dispersed in the crystalline polymer is separated, thereby rapidly increasing the resistance. Therefore, the flow of current between the metal connecting member 84 and the conductive pad 64 is blocked or the flow of current is reduced.
  • the PTC device 82 serves as a safety device for preventing the battery from rupturing.
  • the PTC device 82 contracts the crystalline polymer to restore the connection between the conductive particles, thereby smoothly flowing the current.
  • the PTC element 82 is sealed by the sealing material 90.
  • At least a portion of the metal connecting member 84 exposed through the first through hole 65 formed in the substrate 62 and the second through hole 95 formed in the encapsulant 90 may have an electrode cell 410 having a second polarity. ) And can be electrically connected.
  • the battery protection circuit elements 110, 120, and 130 disposed on the substrate 62 may be electrically connected to the conductive pads 64 formed on the substrate 62 through a predetermined wiring circuit.
  • the metal connecting member 84 may be electrically connected to the electrode cell 410 of the second polarity of the battery bare cell 400. Therefore, in the battery protection circuit module package 300 according to the exemplary embodiment of the present invention, a separate lead constituting the terminal lead frame 50 is formed by the lead B- for the second internal connection terminal illustrated in FIG. 1. It may be understood as the metal connecting member 84 of the PTC structure 80.
  • the first internal connection lead 50a and the dummy lead 50f are at the level of the package 300 of the battery protection circuit module. It may be bent in a gull-form form to join the plate 430 of the first polarity while being aligned horizontally.
  • the substrate 62 constituting the device package 60 may have exposed terminals 66, 67, 68, and 69 that are not sealed by the encapsulant 90 on the upper and / or lower surfaces thereof.
  • the exposed terminals 66, 67, 68, and 69 formed on the upper and / or lower surfaces of the substrate 62 may be electrically connected to at least a portion of the terminal leadframe 50.
  • the device package 60 is mounted on the terminal leadframe 50 to be electrically connected to the terminal leadframe 50.
  • the device package 60 may be mounted on the terminal leadframe 50 using surface mounting technology.
  • the device package 60 may have at least one exposed terminal (not shown) on the bottom surface thereof.
  • at least one exposed terminal 66, 67, 68, or 69 may be formed on the upper surface of the device package 60.
  • the encapsulant 90 sealing the battery protection circuit elements 110, 120, 130, and 140 may be formed to expose the exposed terminal.
  • at least one of the exposed terminals formed on the lower surface of the device package 60 may be bonded to and electrically connected to at least a portion of the terminal leadframe 50 to form at least a portion of the circuit shown in FIG. 1. .
  • the exposed terminals 66, 67, 68, and 69 illustrated in the drawing may be NFC connection terminals configured to electrically connect the NFC antenna and the NFC matching element.
  • an NFC circuit may be added to the battery protection circuit illustrated in FIG. 1 to support near field communication (NFC).
  • the added NFC circuit may include, for example, an NFC connection terminal and an NFC matching element.
  • the NFC connection terminal may be in contact with the end of the NFC antenna disposed around the battery pack.
  • the NFC antenna may be, for example, an antenna in a loop form. When the end of the NFC antenna is in contact with the NFC connection terminal, the NFC matching element and the NFC antenna can be electrically connected to form a closed loop (closed loop).
  • the NFC matching element may be, for example, a capacitor for frequency matching.
  • both ends of the NFC loop antenna are connected to the capacitor which is the NFC matching element to form a closed loop, and by using the resonance generated from the NFC antenna and the capacitor to generate a frequency region for NFC communication of 13.56 MHz Communicate with the device.
  • the technical idea of the present invention is not limited to the exemplary number, arrangement, and the above-described uses of the exposed terminals 66, 67, 68, and 69 shown in the drawings.
  • the battery protection circuit module package 300 according to the exemplary embodiment of the present invention described above is mounted on the top surface of the battery bare cell 400 to constitute the battery pack 500.
  • the battery bare cell 400 includes an electrode assembly and a cap assembly.
  • the electrode assembly is interposed between a positive electrode plate formed by applying a positive electrode active material to a positive electrode current collector, a negative electrode plate formed by applying a negative electrode active material to a negative electrode current collector, and between the positive electrode plate and the negative electrode plate to prevent short circuit between the two electrode plates and to move lithium ions.
  • the separator can be made.
  • the positive electrode tab attached to the positive electrode plate and the negative electrode tab attached to the negative electrode plate are drawn out to the electrode assembly.
  • the cap assembly includes a plate 430 of a first polarity and an electrode cell 410 of a second polarity.
  • the plate 430 of the first polarity may serve as a positive terminal and may be referred to as a cap plate.
  • the electrode cell 410 of the second polarity may serve as a negative electrode terminal and may be referred to as a negative electrode cell.
  • the first internal connection lead 50a and the dummy lead 50f constituting both edges of the battery protection circuit module package 300 according to an embodiment of the present invention are bonded to the plate 430 of the first polarity.
  • the battery protection circuit module package 300 is fixed to the battery bare cell 400.
  • the electrode cell 410 of the second polarity which is the electrode terminal of the battery bare cell 400, is joined to the metal connecting member 84 of the PTC structure 80 through the second through hole 95 in the encapsulant 90. Electrically connected.
  • FIG. 7 and 8 are a perspective view illustrating a battery protection circuit module package according to another embodiment of the present invention
  • Figure 9 is an exploded perspective view illustrating a battery protection circuit module package according to another embodiment of the present invention
  • 10 is a perspective view illustrating a structure implemented in the intermediate process of manufacturing a battery protection circuit module package according to another embodiment of the present invention
  • Figure 11 is a battery bare cell battery protection circuit module package according to another embodiment of the present invention
  • the battery protection circuit module package 300 includes a terminal leadframe 50, an element package 60, and an encapsulant 90.
  • the terminal lead frame 50 includes a first internal connection terminal lead 50a and a second internal connection terminal lead 50g electrically connected to the electrode terminals 410 and 430 of the battery bare cell 400; An external connection terminal lead (50b, 50c, 50d, 50e) disposed between the first internal connection terminal lead (50a) and the second internal connection terminal lead (50g) and constituting a plurality of external connection terminals; And a lead for the first internal connection terminal to be electrically insulated from the lead for the first internal connection terminal 50a, the lead for the second internal connection terminal 50g, and the leads 50b, 50c, 50d, and 50e for the external connection terminal ( And a dummy lead 50f disposed to be spaced apart from the second internal connection lead 50g and the external connection terminal leads 50b, 50c, 50d, and 50e.
  • the first internal connection lead 50a and the dummy lead 50f are disposed at both edges of the terminal lead frame 50, respectively.
  • the first internal connection lead 50a and the second internal connection lead 50g are connected to the battery cell by the first internal connection terminal B + and the second internal connection terminal B ⁇ shown in FIG. 1. May be). Any three leads selected from the leads 50b, 50c, 50d, and 50e for the external connection terminals are sequentially arranged with the leads P +, CF, and P- for the first to third external connection terminals shown in FIG. Or arranged in any order. The order of arranging the first to third external connection leads P +, CF, and P ⁇ may vary. The number or use of the leads 50b, 50c, 50d, and 50e for the external connection terminals may be appropriately changed according to the configuration of the battery protection circuit module package.
  • the dummy lead 50f is electrically insulated from the battery protection circuit elements 110, 120, 130, and 140 constituting the device package 60.
  • the first internal connection terminal lead 50a and the dummy lead 50f are bonded to the upper surface of the battery bare cell 400 (for example, the plate 430 of the first polarity), thereby providing a battery protection circuit module package ( 300 may be fixed to the top surface of the battery bare cell 400 without a holder.
  • the lead 50g for the second internal connection terminal is bonded to the upper surface of the battery bare cell 400 (for example, the electrode cell 410 of the second polarity), whereby the battery protection circuit module package 300 is a battery.
  • the top surface of the bare cell 400 may be further fixed without a holder.
  • the bond may be joined in any manner selected from the group consisting of laser welding, resistance welding, soldering and conductive adhesives (eg, conductive epoxy), insulating adhesives, conductive tapes and insulating tapes.
  • conductive adhesives eg, conductive epoxy
  • the device package 60 is mounted on the terminal leadframe 50 to be electrically connected to the terminal leadframe 50.
  • the device package 60 includes a substrate 62 on which the battery protection circuit elements 110, 120, 130, and 140 and the PTC structure 80 are disposed.
  • the encapsulant 90 seals the battery protection circuit elements 110, 120, 130, and 140, and seals at least a portion of the dummy lead 50f inwardly (for example, in the negative direction of the x-axis). At least a part of the terminal lead frame 50 is sealed to expose the rest of the dummy lead 50f, and at least a part of the PTC structure 80 is sealed.
  • the first internal connection lead 50a and the dummy lead 50f respectively disposed at both edges of the terminal lead frame 50 are disposed in the plate 430 of the first polarity and the plate 430 of the first polarity.
  • the first polarity may be connected to the plate 430.
  • the second internal connection terminal lead 50g constituting the terminal lead frame 50 is disposed between the external connection terminal leads 50b, 50c, 50d and 50e and the dummy lead 50f, and has a second polarity electrode.
  • the cell 410 may be directly bonded and electrically connected to the cell 410.
  • the substrate 62 may be attached to the leads 50b, 50c, 50d, and 50e for the external connection terminals through a conductive adhesive.
  • a conductive pad may be formed on a portion of the substrate 62 which is in contact with the terminal lead frame 50, and the conductive adhesive may be interposed between the terminal lead frame 50 and the conductive pad.
  • the substrate 62 may include a printed circuit board.
  • the battery protection circuit elements 110, 120, 130, and 140 are specifically, a dual FET chip 110, a protection IC 120, and at least one passive element 130 disposed on the printed circuit board.
  • an electrical connection member 140 may include a bonding wire or a bonding ribbon.
  • the substrate 62 may include a mounting lead frame having a plurality of mounting leads spaced apart from each other.
  • the battery protection circuit elements 110, 120, 130, and 140 may include a protection IC, a field effect transistor, and at least one passive element mounted directly on the mounting lead frame.
  • the passive element is arranged to connect at least a portion of the spaced plurality of mounting leads, wherein the passive element is not inserted into and fixed on the mounting lead frame, but the surface of the surface of the mounting lead frame by surface mounting technology. It may be mounted and fixed on at least a portion.
  • the protection IC and the field effect transistor are not inserted into and fixed in the form of a semiconductor package on the mounting lead frame, but are sealed with a separate encapsulant on at least a part of the surface of the mounting lead frame by surface mounting technology. It may be mounted and fixed in the form of an unused chip die. Furthermore, by further comprising an electrical connection member including a bonding wire or a bonding ribbon for electrically connecting any two selected from the group consisting of the protection IC, the field effect transistor, and the plurality of mounting leads, separate printing is possible.
  • the battery protection circuit can be configured without using a circuit board.
  • the PTC structure 80 is a metal connection member attached to either the PTC element 82 and one of the top and bottom surfaces of the PTC element 82. It may include.
  • the PTC (Positive Temperature Coefficient) element 82 can be formed by, for example, dispersing conductive particles in a crystalline polymer. Therefore, below the set temperature, the PTC element 82 becomes a passage through which a current flows. However, when the temperature rises above the set temperature due to overcurrent, the crystalline polymer expands and the connection between the conductive particles dispersed in the crystalline polymer is separated, thereby rapidly increasing the resistance. Therefore, the flow of current between the metal connecting member 84 and the substrate 62 is blocked or the flow of current is reduced. As the current flow can be interrupted by the PTC device 82 as described above, the PTC device 82 serves as a safety device for preventing the battery from rupturing.
  • the PTC device 82 contracts the crystalline polymer to restore the connection between the conductive particles, thereby smoothly flowing the current.
  • the PTC element 82 and the metal connecting member 84 are all sealed by the encapsulant 90.
  • the first internal connection lead 50a and the dummy lead 50f are bent in a form of a form for joining the plate 430 of the first polarity, and the second internal connection lead 50g is the second polarity.
  • the electrode cell 410 of the can be bent in a form.
  • the encapsulant 90 may include a first encapsulant 92 and a second encapsulant 94 spaced apart from each other.
  • the first encapsulant 92 seals at least a portion of the leads 50b, 50c, 50d, and 50e for the external connection terminals and the substrate 62, and further seals the PTC structure 80 entirely.
  • the second encapsulant 94 is formed of the second internal connection terminal lead 50g and the dummy lead 50f so as to seal a space between the second internal connection terminal lead 50g and the dummy lead 50f. Seal at least a portion.
  • the first encapsulant 92 and the second encapsulant 94 may be simultaneously formed by a single encapsulation process.
  • the battery protection circuit module package 300 according to another embodiment of the present invention described above is mounted on the top surface of the battery bare cell 400 to constitute the battery pack 500.
  • the first internal connection lead 50a and the dummy lead 50f constituting both edges of the battery protection circuit module package 300 according to another embodiment of the present invention are bonded to the plate 430 of the first polarity.
  • the battery protection circuit module package 300 is fixed to the battery bare cell 400.
  • the electrode cell 410 of the second polarity that is the electrode terminal of the battery bare cell 400 is electrically connected to the lead 50g for the second internal connection terminal.
  • FIG. 12 is a perspective view illustrating a battery pack in which a battery protection circuit module package according to a comparative example of the present invention is coupled to a battery bare cell.
  • the battery protection circuit package 600 is mounted on the battery bare cell 400 in combination with the holder 700.
  • the battery protection circuit package 600 includes an encapsulant 640 formed so that the internal connection terminal lead 620 is exposed at both edges without forming a dummy lead. Furthermore, the PTC structure 660 bonded to the lead 620 for the internal connection terminal is further configured.
  • the holder 700 is easy to be lifted from the top surface of the battery bare cell 400. Therefore, in order to fix the holder 700 on the top surface of the battery bare cell 400, a fixing part 720 is formed on one side of the holder 700 and bonded on the plate 430 of the first polarity.
  • the fixing part 720 may be formed together with the holder 700 by, for example, a nickel insert injection method. When the holder 700 and the fixing part 720 are introduced, the manufacturing cost inevitably increases.
  • the battery protection circuit module package 300 can be strongly fixed to the battery bare cell 400 without introducing a holder, a battery pack of good quality at a relatively low manufacturing cost. It can have advantageous advantages that can be implemented.
  • the battery protection circuit module package 300 is to be fixed to the top surface of the battery bare cell 400 by using the holder, there is no need to form the fixing part 720 on one side of the holder by insert injection. The unit price can be reduced.
  • the battery protection circuit module package 300 according to the embodiments of the present invention, the first internal connection lead 50a and the dummy lead 50f are joined to and fixed to the plate 430 of the first polarity.
  • the lead 50g for the second internal connection terminal may be fixed to the electrode cell 410 having the second polarity. Therefore, the battery protection circuit module package 300 may be stably fixed because it is bonded to the electrode terminal of the battery bare cell 400.
  • the manufacturing process is simplified and the final product battery Can be miniaturized.
  • FIG. 13 is a perspective view illustrating a configuration in which a battery protection circuit module package according to embodiments of the present disclosure is further coupled to a battery pack coupled to a battery bare cell.
  • the battery pack 570 illustrated in FIG. 13 may be implemented by coupling the upper case 550 to the structure 500 illustrated in FIGS. 6 and 11.
  • the upper case 550 may be formed of a plastic material, and a through hole may be formed in a corresponding portion so that the external connection terminals 50a, 50b, 50c, and 50d may be exposed. In some cases, the upper case 550 may be combined with the holder. In the battery pack 570 illustrated in FIG. 13, a taping operation or a labeling operation surrounding the side may be further performed.
  • FIG. 14 and 15 are exploded perspective and combined perspective views of a battery pack including a battery protection circuit package according to another embodiment of the present invention, respectively.
  • a battery pack 1600 includes a battery bare cell 1400 and a top case 1550.
  • the battery pack 1600 includes a battery protection circuit package 1300 interposed between the top case 1550 and the battery bare cell 1400.
  • the battery protection circuit package 1300 is mounted on the top surface of the battery bare cell 1400, and the top case 1550 on the battery bare cell 1400 to cover the battery protection circuit package 1300. Can be fixed.
  • the battery bare cell 1400 includes an electrode assembly and a cap assembly.
  • the electrode assembly is interposed between a positive electrode plate formed by applying a positive electrode active material to a positive electrode current collector, a negative electrode plate formed by applying a negative electrode active material to a negative electrode current collector, and between the positive electrode plate and the negative electrode plate to prevent short circuit between the two electrode plates and to move lithium ions.
  • the separator can be made.
  • the positive electrode tab attached to the positive electrode plate and the negative electrode tab attached to the negative electrode plate are drawn out to the electrode assembly.
  • the cap assembly includes a plate 1430 of a first polarity and an electrode cell 1410 of a second polarity.
  • the plate 1430 of the first polarity may serve as a positive terminal and may be referred to as a cap plate.
  • the electrode cell 1410 of the second polarity is disposed in the plate 1430 of the first polarity, may serve as a negative electrode terminal, and may be referred to as a negative electrode cell.
  • the battery protection circuit package 1300 includes a substrate 1050, a battery protection circuit element mounted on the substrate 1050, and an encapsulant 1090 sealing the battery protection circuit element. Detailed description thereof will be described later.
  • the upper case 1550 may be formed of a plastic material, and the through hole 1555 may be formed at a portion corresponding to the external connection terminals 1050c, 1050d, 1050e, and 1050f of the battery protection circuit package 1300. Can be formed. In the battery pack 1600 illustrated in FIG. 15, a taping operation or a labeling operation surrounding the side may be further performed.
  • the top case 1550 may be disposed on the battery bare cell 1400 without using a separate holder (eg, 1190 in FIG. 22).
  • the first fastening member 1595 formed on the top case 1550 and the second fastening member 1095 formed on the body of the battery protection circuit package 1300 may be fastened to correspond to each other.
  • One of the first fastening member 1595 and the second fastening member 1095 may be a fastening groove and the other may be a fastening protrusion.
  • the second fastening member 1095 may be a fastening protrusion. Accordingly, when the second fastening member 1095 is a part of the encapsulant 1090 constituting the battery protection circuit package 1300, the fastening protrusion constitutes a part of the encapsulant 1090 and the encapsulant 1090 is formed. It may have a shape protruding from the surface.
  • the second fastening member 1095 may be a fastening groove. Accordingly, when the second fastening member 1095 is a part of the encapsulant 1090 constituting the battery protection circuit package 1300, the fastening groove constitutes a part of the encapsulant 1090 and the encapsulant 1090 of the encapsulant 1090. It may have a shape that is embedded in the surface from the inside.
  • the first fastening member 1595 and the second fastening member 1095 may be fastened to each other by at least one or more of an insertion fastening method, an engagement fastening method, and a locking fastening method.
  • the fastening protrusion may have various shapes by the fastening groove and the fastening method.
  • the fastening protrusion may be configured in the form of a hook (hook).
  • the second fastening member 1095 formed in the body portion of the battery protection circuit package 1300 may constitute a part of the encapsulant 1090. That is, part of the encapsulant 1090 may be the second fastening member 1095.
  • the second fastening member 1095 may form part of a substrate such as the lead frame 1050 or the mounting member 1062. That is, part of the lead frame 1050 or the mounting member 1062 may be the second fastening member 1095.
  • the first fastening grooves formed in the top case 1550 may have the second fastening members 1095 having the fastening protrusions formed on the battery protection circuit package 1300.
  • the top case 1550 may be fixed onto the battery bare cell 1400 without using a holder. As the holder is removed, the manufacturing cost of the battery pack 1600 is reduced, and an advantageous effect of reducing the assembly process can be expected.
  • 16 and 17 are exploded and combined perspective views illustrating a battery protection circuit package according to still another embodiment of the present invention, respectively.
  • 18 to 20 are perspective views sequentially illustrating a process of arranging a battery protection circuit package bonded to a battery bare cell according to another embodiment of the present invention, and
  • FIG. 21 is a plan view of the structure shown in FIG. 20. This is a plan view from above.
  • the battery protection circuit package 1300 includes a terminal leadframe 1050, an element package 1060, and an encapsulant 1090.
  • the terminal lead frame 1050 may include a first internal connection lead 1050a and a second internal connection lead 1050g electrically connected to the electrode terminals 1410 and 1430 of the battery bare cell 1400; Leads 1050c, 1050d, 1050e, and 1050f for external connection terminals constituting a plurality of external connection terminals; And a lead for the first internal connection terminal to be electrically insulated from the lead for the first internal connection terminal 1050a, the lead for the second internal connection terminal 1050g, and the lead for the external connection terminal 1050c, 1050d, 1050e, and 1050f.
  • the terminal leadframe 1050 may be made of nickel, copper, nickel plated copper, or other metal.
  • the lead 1050a for the first internal connection terminal may be the first internal connection terminal B + illustrated in FIG. 3 to be connected to the battery cell.
  • the lead 1050g for the second internal connection terminal may be the second internal connection terminal B- illustrated in FIG. 3 for connecting to the battery cell.
  • Any of the three leads selected from the leads 1050c, 1050d, 1050e, and 1050f for the external connection terminals are sequentially arranged with the leads P +, CF, and P- for the first to third external connection terminals shown in FIG. Or arranged in any order.
  • the order of arranging the first to third external connection leads P +, CF, and P ⁇ may vary.
  • the number or use of the external connection terminal leads 1050c, 1050d, 1050e, and 1050f may be appropriately changed depending on the configuration of the battery protection circuit package.
  • the dummy lead 1050b is configured to be electrically insulated from the battery protection circuit elements 110, 120, 130, and 140 constituting the device package 1060.
  • the device package 1060 is mounted on the terminal leadframe 1050 so as to be electrically connected to the terminal leadframe 1050, and the battery protection circuit elements 110, 120, 130, and 140 and the PTC structure 1080 are disposed. And a mounting member 1062.
  • the encapsulant 1090 seals the battery protection circuit elements 110, 120, 130, and 140, seals at least a portion inwardly of the dummy leads 1050b and exposes the rest of the dummy leads 1050b. At least a portion of the terminal leadframe 1050 is sealed and at least a portion of the PTC structure 1080 is sealed.
  • the encapsulant 1090 may include, for example, an epoxy molding compound (EMC).
  • the encapsulant 1090 may include a first encapsulant 1092 and a second encapsulant 1094 spaced apart from each other.
  • the first encapsulant 1092 seals at least a portion of the leads 1050c, 1050d, 1050e, and 1050f for the external connection terminal and the mounting member 1062, and further seals the PTC structure 1080 entirely.
  • the second encapsulant 1094 is formed of the second internal connection terminal lead 1050g and the dummy lead 1050b to seal a space between the second internal connection terminal lead 1050g and the dummy lead 1050b. Seal at least a portion.
  • the first encapsulant 1092 and the second encapsulant 1094 may be simultaneously formed by a single encapsulation process.
  • the mounting member 1062 on which the battery protection circuit elements 110, 120, 130, and 140 may be mounted in the device package 1060 may include a lead frame, a printed circuit board, a ceramic substrate, or a glass substrate. can do.
  • the mounting member 1062 may include a printed circuit board.
  • the battery protection circuit elements 110, 120, 130, and 140 are specifically, a dual FET chip 110, a protection IC 120, and at least one passive element 130 disposed on the printed circuit board.
  • an electrical connection member 140 may include a bonding wire or a bonding ribbon.
  • the mounting member 1062 may include a mounting lead frame having a plurality of mounting leads spaced apart from each other.
  • the battery protection circuit elements 110, 120, 130, and 140 may include a protection IC, a field effect transistor, and at least one passive element mounted directly on the mounting lead frame.
  • the passive element is arranged to connect at least a portion of the spaced plurality of mounting leads, wherein the passive element is not inserted into and fixed on the mounting lead frame, but the surface of the surface of the mounting lead frame by surface mounting technology. It may be mounted and fixed on at least a portion.
  • the protection IC and the field effect transistor are not inserted into and fixed in the form of a semiconductor package on the mounting lead frame, but are sealed with a separate encapsulant on at least a part of the surface of the mounting lead frame by surface mounting technology. It may be mounted and fixed in the form of an unused chip die. Furthermore, by further comprising an electrical connection member including a bonding wire or a bonding ribbon for electrically connecting any two selected from the group consisting of the protection IC, the field effect transistor, and the plurality of mounting leads, separate printing is possible.
  • the battery protection circuit can be configured without using a circuit board.
  • the mounting member 1062 includes a mounting lead frame having a plurality of mounting leads spaced apart
  • an electrical connection member such as a bonding wire or a bonding ribbon is disposed on the mounting lead frame to configure a circuit, and thus a battery protection circuit.
  • the process of designing and manufacturing a mounting leadframe for structuring has a significant advantage. If the electrical connection member described in the embodiments of the present invention is not introduced in the configuration of the battery protection circuit, the configuration of the plurality of leads constituting the mounting lead frame becomes very complicated, so that it is easy to effectively provide an appropriate mounting lead frame. You can't.
  • the protection IC and the field effect transistor are not inserted into and fixed in the form of a semiconductor package on the mounting lead frame, but instead are fixed to the surface mounting technology.
  • at least a portion of the surface of the mounting leadframe may be mounted and fixed in the form of a chip die sawed from a wafer not sealed with a separate encapsulant.
  • a chip die is implemented by performing a sawing process without sealing a separate encapsulant on a wafer on which a plurality of array-type structures (eg, a protection IC and a field effect transistor) are formed. Mean individual structures.
  • the protection IC and the field effect transistor are formed by a subsequent encapsulant 1090 after being mounted without being sealed with a separate encapsulant. Since sealing is performed, the process of forming the encapsulant may be performed only once in implementing the battery protection circuit package 1300.
  • the passive elements, the protection IC, and the field effect transistor are separately inserted and fixed or mounted on the printed circuit board, one molding process is required for each component first, and the fixed or mounted on the printed circuit board is required. Since another molding process is additionally required for each component mounted thereafter, the manufacturing process is complicated and the manufacturing cost is high.
  • the lead frame when the lead frame is used in the device package 1060 of the battery protection circuit package 1300 according to the above-described embodiment of the present invention, as compared with the case where the protection circuit is mounted on the printed circuit board (PCB), It can be expected that the height can be significantly reduced. That is, since the printed circuit board typically has a thickness of about 2 mm, the lead frame has a thickness of about 0.8 mm, so that the battery can be miniaturized by the thickness difference or the battery size can be increased by the thickness difference. Can be implemented.
  • the PTC structure 1080 may be electrically connected to an electrode cell 1410 having a second polarity among the electrode terminals of the battery bare cell 1400.
  • the PTC structure 1080 includes a PTC element 1082 and a metal connecting member 1084 attached to one of the top and bottom surfaces of the PTC element 1082.
  • the PTC (Positive Temperature Coefficient) element 1082 can be formed by, for example, dispersing conductive particles in a crystalline polymer. Accordingly, below the set temperature, the PTC element 1082 becomes a passage through which a current flows between the metal connecting member 1084 and the conductive pad 1064 formed on the mounting member 1062. However, when the temperature rises above the set temperature due to overcurrent, the crystalline polymer expands and the connection between the conductive particles dispersed in the crystalline polymer is separated, thereby rapidly increasing the resistance. Therefore, the flow of current between the metal connecting member 1084 and the conductive pad 1064 is blocked or the flow of current is reduced.
  • the PTC element 1082 serves as a safety device to prevent the battery from rupturing.
  • the temperature of the PTC device 1082 is lowered below the set temperature, the crystalline polymer contracts to restore the connection between the conductive particles, thereby smoothly flowing the current.
  • the PTC element 1082 is sealed by the encapsulant 1090.
  • the mounting member 1062 constituting the device package 1060 may have exposed terminals 1066, 1067, 1068, and 1069 that are not sealed by the encapsulant 1090 on the top and / or bottom surfaces thereof.
  • the exposed terminals 1066, 1067, 1068, and 1069 formed on the upper and / or lower surfaces of the mounting member 1062 may be connected to and electrically connected to at least a portion of the terminal leadframe 1050.
  • the device package 1060 is mounted on the terminal leadframe 1050 to be electrically connected to the terminal leadframe 1050.
  • the device package 1060 may be mounted on the terminal leadframe 1050 using surface mounting technology.
  • At least one exposed terminal (not shown) may be formed on the bottom surface of the device package 1060.
  • at least one exposed terminal 1066, 1067, 1068, and 1069 may be formed on the upper surface of the device package 1060.
  • the encapsulant 1090 encapsulating the battery protection circuit elements 110, 120, 130, and 140 may be formed to expose the above-described exposed terminal.
  • at least one of the exposed terminals formed on the lower surface of the device package 1060 may be bonded to and electrically connected to at least a portion of the terminal leadframe 1050, thereby forming at least a part of the circuit illustrated in FIG. 3. .
  • the exposed terminals 1066, 1067, 1068, and 1069 illustrated in the drawing may be NFC connection terminals formed to electrically connect the NFC antenna and the NFC matching element.
  • an NFC circuit may be added to the battery protection circuit illustrated in FIG. 3 to support near field communication (NFC).
  • the added NFC circuit may include, for example, an NFC connection terminal and an NFC matching element.
  • the NFC connection terminal may be in contact with the end of the NFC antenna disposed around the battery pack.
  • the NFC antenna may be, for example, an antenna in a loop form. When the end of the NFC antenna is in contact with the NFC connection terminal, the NFC matching element and the NFC antenna can be electrically connected to form a closed loop (closed loop).
  • the NFC matching element may be, for example, a capacitor for frequency matching.
  • both ends of the NFC loop antenna are connected to the capacitor which is the NFC matching element to form a closed loop, and by using the resonance generated from the NFC antenna and the capacitor to generate a frequency region for NFC communication of 13.56 MHz Communicate with the device.
  • the technical idea of the present invention is not limited to the exemplary number, arrangement, and the above-described uses of the exposed terminals 1066, 1067, 1068, and 1069 shown in the drawings.
  • Portions corresponding to the other surface of the leads 1050c, 1050d, 1050e, and 1050f may be selectively plated in whole or in part.
  • the plating material may be at least one selected from gold, silver, nickel, tin and chromium.
  • At least a portion of the mounting member 1062 corresponding to at least a portion of the leads 1050c, 1050d, 1050e, and 1050f for the external connection terminal may be attached to the terminal leadframe 1050 via a conductive adhesive.
  • a conductive pad may be formed on a part of the mounting member 1062 that contacts the terminal lead frame 1050, and the conductive adhesive may be interposed between the terminal lead frame 1050 and the conductive pad.
  • the mounting member 1062 may be attached to the terminal lead frame 1050 via an insulating adhesive. Accordingly, the dummy lead 1050b is bonded to the plate 1430 of the first polarity that is the electrode terminal of the battery bare cell 1400, but the battery protection circuit package 1300 is connected to the battery bare cell through the dummy lead 1050b. It is not electrically connected to the electrode terminal of (1400).
  • the coupling between the battery protection circuit package 1300 and the battery bare cell 1400 is more robust. Is implemented.
  • the substrate when the battery protection circuit elements 1080, 110, 120, 130, and 140 are mounted on a substrate, the substrate may include the above-described terminal lead frame 1050 or the mounting member 1062. It may include.
  • the battery protection circuit elements 110, 120, 130, 140, and 1080 are not mounted on the mounting member 1062, but the terminal lead frame. It may be directly mounted on 1050.
  • the battery protection circuit package 1300 may include the terminal leadframe 1050, the battery protection circuit elements 110, 120, 130, 140, and 1080 mounted on the terminal leadframe 1050 and the battery protection circuit element 110. , 120, 130, 140, and 1080, and an encapsulant for exposing at least a portion of the first internal connection lead 1050a, the second internal connection lead 1050g, and the dummy lead 1050b ( 1090).
  • the first internal connection lead 1050a, the second internal connection lead 1050g, and the dummy lead 1050b are bonded to the top surface of the battery bare cell 1400.
  • the battery protection circuit package 1300 may be fixed to the top surface of the battery bare cell 1400 without a holder.
  • the bond may be joined in any manner selected from the group consisting of laser welding, resistance welding, soldering and conductive adhesives (eg, conductive epoxy), insulating adhesives, conductive tapes and insulating tapes.
  • a direction in which the first internal connection lead 1050a and the dummy lead 1050b are exposed and extended from the encapsulant 1090 (for example, the direction parallel to the x-axis of FIG. 18 is parallel to the direction in which the second internal connection lead 1050g is exposed and extended from the encapsulant 1090 (for example, the direction parallel to the y-axis of FIG. 18).
  • the first internal connection lead 1050a and the dummy lead 1050b respectively disposed at both edges of the terminal lead frame 1050 are bonded to the plate 1430 of the first polarity, and the terminal lead frame (
  • the lead 1050g for the second internal connection terminal extending to protrude on one side of the 1050 is bonded to the electrode cell 1410 of the second polarity disposed in the plate 1430 of the first polarity, thereby forming the battery protection circuit package 1300.
  • the battery bare cell 1400 and the battery protection circuit elements 110, 120, 130, and 140 are electrically connected through the first internal connection lead 1050a and the second internal connection lead 1050g.
  • the dummy lead 1050b does not have an electrical connection path between the battery bare cell 1400 and the battery protection circuit elements 110, 120, 130, and 140.
  • the first internal connection lead 1050a and the dummy lead 1050b level the level of the package 1300 of the battery protection circuit. It may be bent in a gull-form form to join with the plate 1430 of the first polarity while fitting.
  • the lead 1050g for the second internal connection terminal is bonded to the electrode cell 1410 of the second polarity of the battery bare cell 1400. Can be folded in a state.
  • a portion of the second internal connection lead 1050g is bonded to the electrode cell 1410 of the second polarity. Since the second internal connection lead 1050g has a form that protrudes from the side of the battery protection circuit package 1300 and extends, the battery protection circuit package 1300 before the second internal connection lead 1050g is folded. The body portion of) may not be disposed directly above the top surface of the battery bare cell 1400.
  • the rest of the second internal connection terminal lead 1050g which is not bonded to the electrode cell 1410 of the second polarity around a predetermined axis of the second internal connection terminal lead 1050g.
  • the part can be bent approximately 90 degrees.
  • a slit (h in FIG. 16) may be disposed on the predetermined axis to facilitate such bending.
  • the remaining portion of the lead 1050g for the second internal connection terminal may be bent about 90 degrees with respect to a predetermined axis.
  • the lead 1050g for the second internal connection terminal may be folded so that the body portion of the battery protection circuit package 1300 may be disposed directly on the upper surface of the battery bare cell 1400.
  • a process of bonding the first internal connection lead 1050a and the dummy lead 1050b to the top surface of the battery bare cell 1400 may be performed in the structure shown in FIG. 20.
  • a second fastening member 1095 having a fastening protrusion shape may be disposed on a side surface of the battery protection circuit package 1300.
  • FIG. 22 is an exploded perspective view of a battery pack according to a comparative example of the present invention.
  • a holder 1190 including a body part formed of resin and at least one through hole 1193 formed in the body part is disposed on an upper surface of the battery bare cell 1400.
  • the top case 1550 may be fixed on the top surface of the battery bare cell 1400 by engaging the protrusion 1195 protruding from the body of the holder 1190 and the fastening groove 1595 formed in the top case 1550.
  • the battery protection circuit package 1300 may be mounted on the upper surface of the battery bare cell 1400 by being mounted in combination with the holder 1190.
  • the second fastening member 1095 formed in the body portion of the battery protection circuit package 1300 is By coupling with the first fastening member 1595 formed in the top case 1550, the top case 1550 may be fixed on the top surface of the battery bare cell 1400 without using a separate holder.
  • the direction in which the first internal connection lead 1050a and the dummy lead 1050b are exposed and extended from the encapsulant 1090 is a direction in which the second internal connection lead 1050g is exposed and extended from the encapsulant 1090 (for example, the direction parallel to the y-axis of FIG. 18).
  • the first internal connection lead 1050a and the dummy lead 1050b which are configured to cross each other without being parallel to (for example, vertically) and disposed at both edges of the battery protection circuit package 1300, respectively.
  • the second internal connection lead 1050g bonded to the plate 1430 of the first polarity and extended to protrude on one side of the battery protection circuit package 1300 is disposed in the plate 1430 of the first polarity.
  • Battery protection circuit package by bonding with polarity electrode cell 1410 1300. This can be implemented so as to be firmly connected to the structure on the upper surface of the bare cell battery (1400).

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

La présente invention concerne un boîtier de module de circuit de protection de batterie avantageux en termes d'intégration et de compacité et un bloc-batterie le comprenant. Le boîtier de module de circuit de protection de batterie comprend : un cadre de conducteurs de borne qui comprend un premier conducteur de borne de connexion interne, électriquement connecté à une borne d'électrode d'une cellule nue de batterie, un conducteur de borne de connexion externe qui est disposé séparément du premier conducteur de borne de connexion interne et qui constitue une pluralité de bornes de connexion externes, ainsi qu'un conducteur factice disposé séparément pour être électriquement isolé du premier conducteur de borne de connexion interne et du conducteur de borne de connexion externe ; un boîtier de dispositif qui est monté sur le cadre de conducteurs de borne pour être connecté électriquement à au moins une partie du cadre de conducteurs de borne et qui comprend un substrat sur lequel un dispositif de circuit de protection de batterie et une structure PTC sont disposés ; et un matériau de scellement qui scelle le dispositif de circuit de protection de batterie, scelle au moins une partie du conducteur factice à l'intérieur, scelle au moins une partie du cadre de conducteurs de borne pour exposer le reste du conducteur factice et scelle au moins une partie de la structure PTC.
PCT/KR2015/003153 2014-04-03 2015-03-31 Boîtier de module de circuit de protection de batterie et bloc-batterie Ceased WO2015152600A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2014-0040120 2014-04-03
KR1020140040120A KR101595501B1 (ko) 2014-04-03 2014-04-03 배터리 보호회로 모듈 패키지 및 배터리 팩
KR10-2014-0045642 2014-04-16
KR1020140045642A KR101582952B1 (ko) 2014-04-16 2014-04-16 배터리 보호회로 패키지 및 배터리 팩

Publications (1)

Publication Number Publication Date
WO2015152600A1 true WO2015152600A1 (fr) 2015-10-08

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Application Number Title Priority Date Filing Date
PCT/KR2015/003153 Ceased WO2015152600A1 (fr) 2014-04-03 2015-03-31 Boîtier de module de circuit de protection de batterie et bloc-batterie

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Country Link
WO (1) WO2015152600A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112204802A (zh) * 2018-08-17 2021-01-08 理百思特有限公司 可穿戴配件和其中设置的电路保护模块

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004178994A (ja) * 2002-11-27 2004-06-24 Matsushita Electric Ind Co Ltd 非水電解質二次電池
KR100685605B1 (ko) * 2006-10-20 2007-02-22 주식회사 이랜텍 배터리 팩
KR20100062166A (ko) * 2008-12-01 2010-06-10 삼성에스디아이 주식회사 이차 전지
JP2011003523A (ja) * 2009-06-16 2011-01-06 Samsung Sdi Co Ltd バッテリーパック
KR20130080331A (ko) * 2012-01-04 2013-07-12 주식회사 아이티엠반도체 배터리 보호회로의 패키지 모듈

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004178994A (ja) * 2002-11-27 2004-06-24 Matsushita Electric Ind Co Ltd 非水電解質二次電池
KR100685605B1 (ko) * 2006-10-20 2007-02-22 주식회사 이랜텍 배터리 팩
KR20100062166A (ko) * 2008-12-01 2010-06-10 삼성에스디아이 주식회사 이차 전지
JP2011003523A (ja) * 2009-06-16 2011-01-06 Samsung Sdi Co Ltd バッテリーパック
KR20130080331A (ko) * 2012-01-04 2013-07-12 주식회사 아이티엠반도체 배터리 보호회로의 패키지 모듈

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112204802A (zh) * 2018-08-17 2021-01-08 理百思特有限公司 可穿戴配件和其中设置的电路保护模块
CN112204802B (zh) * 2018-08-17 2024-03-29 理百思特有限公司 可穿戴配件和其中设置的电路保护模块

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