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WO2015145402A1 - Matériaux de support thermiquement conducteurs pour sondes et systèmes à ultrasons - Google Patents

Matériaux de support thermiquement conducteurs pour sondes et systèmes à ultrasons Download PDF

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Publication number
WO2015145402A1
WO2015145402A1 PCT/IB2015/052291 IB2015052291W WO2015145402A1 WO 2015145402 A1 WO2015145402 A1 WO 2015145402A1 IB 2015052291 W IB2015052291 W IB 2015052291W WO 2015145402 A1 WO2015145402 A1 WO 2015145402A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe assembly
ultrasonic transducer
transducer probe
polymer material
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2015/052291
Other languages
English (en)
Inventor
Jeffrey Scott HART
Harry Amon KUNKEL III
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of WO2015145402A1 publication Critical patent/WO2015145402A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/067—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface which is used as, or combined with, an impedance matching layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
    • B06B1/0685—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure on the back only of piezoelectric elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides

Definitions

  • This invention relates to medical diagnostic ultrasound systems and, in particular, to thermally conductive backing materials for ultrasound probes and systems .
  • Array transducers such as linear, curved or two dimensional array transducers, are used in ultrasonic imaging.
  • Two dimensional arrays for example, have numerous rows and columns of transducer elements in both the azimuth and elevation directions, which would require a large number of cable conductors to couple signals between the probe and the mainframe ultrasound system.
  • minimizing the number of signal conductors in the probe cable is to perform at least some of the beamforming in the probe in a microbeamformer ASIC (Application Specific Integrated Circuit) .
  • ASIC Application Specific Integrated Circuit
  • microbeamformer ASIC One efficient way to make these connections is to design the transducer array and the ASIC to have flip-chip interconnections, whereby conductive pads of the transducer array are bump bonded directly to corresponding conductive pads of the ASIC.
  • the high density electronic circuitry of the microbeamformer ASIC can, however, produce a
  • One direction is forward towards the patient-contacting end of the probe .
  • preferred thermal conduction direction is to the rear, away from the lens and toward a heat spreader at the rear of the probe. Also located behind the transducer stack, the array elements and the
  • microbeamformer ASIC is an acoustic backing block.
  • the purpose of the acoustic backing block is to attenuate ultrasonic energy emanating from the rear of the acoustic stack and prevent this energy from causing reverberations that are reflected toward the acoustic stack.
  • An acoustic backing block is
  • an acoustic backing block for an ultrasound probe which exhibits good acoustic attenuation of acoustic energy entering the block, good thermal conductivity toward the rear of the probe and away from the lens, good mechanical structure which can support the acoustic stack as needed, and appropriate electrical isolation of the microbeamformer ASIC from other conductive components of the probe.
  • an ultrasound probe is provided with backing block that includes thermally and
  • the backing block materials have an in-plane
  • FIGURE 1 illustrates an ultrasound system having an ultrasound probe that includes a backing block material in accordance with the present invention.
  • FIGURE 2 illustrates an acoustic stack
  • FIGURE 3A depicts oblique fins in a backing block in accordance with the present invention.
  • FIGURE 3B depicts a perforated fin in a backing block in accordance with the present invention.
  • FIGURE 4 illustrates an acoustic stack and backing block of the present invention assembled in a transducer probe with a lens cover.
  • the present invention provides transducer backing blocks that include materials with a unique combination of properties that allow, e.g., for better quality ultrasound imaging compared to
  • the present invention provides new and improved backing blocks that provide high thermal conductivity and high attenuation characteristics.
  • the backing block materials of the present invention include a thermally and electrically conductive liquid crystalline polymer material. In some embodiments, the backing block materials of the present invention include a
  • thermally and electrically conductive nylon polymer material can have desired thermal and acoustic properties for improved ultrasound imaging.
  • the backing block materials have an in-plane thermal conductivity of greater than 30 W/m K in combination with an attenuation property of greater than 1.5 db/mm/MHz .
  • liquid crystalline polymer material examples include a base material of partially crystalline aromatic polyesters, e.g., based on p-hydroxybenzoic acid and related monomers, that are modified with fillers (such as powdered graphite or other thermally conductive materials), fibers (such as carbon fibers or other electrically conductive materials), internal lubricants, and impact modifiers to tailor the specific properties of the material using methods known in the art.
  • the thermally and electrically conductive liquid crystalline polymer includes an in-plane thermal conductivity of about 32 W/m K or greater and an attenuation property of greater than 1.5 db/mm/MHz .
  • nylon polymer material examples include a base polymer of nylon 6, nylon 4/6, nylon 6/6, nylon 6/10, nylon 6/12, nylon 11 and/or nylon 12 that is modified with fillers (such as powdered graphite or other thermally conductive materials), fibers (such as carbon fibers or other electrically conductive materials), internal lubricants, and impact modifiers to tailor the specific properties of the material using methods known in the art.
  • the backing block of the present invention includes a thermally and electrically conductive nylon 6/6 polymer material.
  • a thermally and electrically conductive nylon 6/6 polymer material includes RTP 200 TC-C-70 from RTP, Co.
  • the thermally and electrically conductive nylon polymer material includes an in- plane thermal conductivity of about 32 W/m K or greater and an attenuation property of greater than 1.5 db/mm/MHz .
  • the ultrasonic probe 10 includes a transducer array 12 that is coupled to a backing block as described further herein, which can include, e.g., a thermally and electrically conductive liquid crystalline polymer material or a thermally and electrically conductive liquid nylon material.
  • Conductors 14 connect individual elements of the transducer array to conductors inside a cable 20, which connects to an ultrasonic imaging system 30.
  • the conductors of the cable are electrically connected to a beamformer 32 in the imaging system, which controls the timing of the pulsing of the elements of the transducer array, and delays and sums received echo signals from the transducer elements to form coherent beams of echo signals.
  • the beamformed echo signals are coupled to an image processor 34 where they are processed to form an image of tissue or flow within the body of the patient being scanned.
  • the resultant ultrasonic image is displayed on an image display 36.
  • a system controller 38 which receives instructions from a user by way of various user controls. While the elements of the transducer array 12 are shown directly wired to the conductors of the cable in FIGURE 1, multiplexers can be included within the probe between the array elements and the cable to reduce the number of cable conductors. It is then necessary to control the multiplexers from the ultrasound system with control lines, so that the cable conductors are multiplexed to the elements of the current active aperture each time the probe is transmitting or receiving ultrasonic signals.
  • the beamformer and other components are provided in the ultrasonic probe 10.
  • the present invention can include an ultrasound transducer that includes an acoustic stack having transducer elements that are coupled to an interconnect layer, such as a flex circuit.
  • an ultrasound transducer that includes an acoustic stack having transducer elements that are coupled to an interconnect layer, such as a flex circuit.
  • an ultrasound transducer includes an acoustic stack that has a flat array of acoustic elements that are coupled to a surface of an
  • the transducer can further include a transducer base and an interconnection cable.
  • the interconnection cable connects an integrated circuit (an ASIC) and an external cable.
  • the integrated circuit is electrically coupled to the
  • the integrated circuit is coupled to a backing block of the present invention described further herein.
  • a backing block which attenuates acoustic energy emanating from the bottom of the transducer stack.
  • the backing block also conducts heat generated by the integrated circuit away from the integrated circuit and the transducer stack and away from the patient-contacting end of the
  • transducer stack configurations can be used.
  • the layers in the stack e.g., a dematching layer, piezoelectric layer, and at least one matching layer
  • the layers in the stack can be fully diced or partially diced.
  • at least one outer matching layer that is not diced can bridge the diced layers.
  • four diced layers e.g., a dematching layer, a piezoelectric layer, and a first and second matching layer
  • four diced layers e.g., a dematching layer, a piezoelectric layer, and a first and second matching layer
  • an outer third matching layer that bridges the diced layers.
  • interconnect layering can be used to couple the acoustic stack layers (e.g., the dematching layer) to the backing block.
  • flip chip bump architecture can be used.
  • flex circuits or other integrated circuit architectures can be used.
  • FIGURE 2 shows an example embodiment of a transducer arrangement of the present invention.
  • the arrangement of layers and structures are shown diced into individual acoustic elements 51 of an array.
  • the acoustic stack assembly 50 includes at least one matching layer 52.
  • the at least one matching layer 52 can include, e.g., two or three matching layers of different acoustic impedance.
  • the acoustic stack 50 can include at least one matching layer that bridges the diced layers.
  • this transducer architecture includes bridged matching layers 53 and 55.
  • the matching layers contact a layer 54 of piezoelectric material, such as lead zirconate titanate (PZT) , Pb (Mgi /3 Nb 2 /3) 0 3 -PbTi0 3 (PMN-PT) , or Pb ( Ini/ 2 bi/ 2 ) 0 3 - Pb (Mgi /3 Nb 2 /3) 0 3 -PbTi0 3 (PIN-PMN-PT) .
  • PZT lead zirconate titanate
  • PMN-PT Pb
  • Pb Ini/ 2 bi/ 2
  • Pb Ini/ 2 bi/ 2
  • Pb Ini/ 2 bi/ 2
  • Pb Mgi /3 Nb 2 /3
  • PbTi0 3 PIN-PMN-PT
  • the piezoelectric material is a single crystal.
  • the layers in the stack can include a dematching layer and the piezoelectric layer includes PIN-PMN-PT.
  • the piezoelectric layer in each acoustic element can also include a single crystal of PIN-PMN-PT, which has three dimensions that are less than 100 microns in thickness.
  • the piezoelectric material 54 contacts a dematching layer 56.
  • Other layers could be used, however, such as a metallized layer.
  • the dematching layer is positioned on a layer 58 of flip chip bumps (black dots) and underfill (grey), which couples the acoustic stack layers to the integrated circuit 60.
  • the backing material 62 is also
  • the backing material of the present invention is shown to include fin structures 64 of graphite or other highly conductive material that further enhances thermal and electrical conductivity of the backing material.
  • the backing material 62 can be further coupled to a support rail 66, such as an aluminum support rail.
  • the backing block can be composed of only thermally and electrically conductive polymer
  • the backing block can include oblique fins (as shown in FIGURE 3A) or perforated fins (as shown in FIGURE 3B) of highly conductive material, such as pyralyzed graphite (e.g., from Graphtech) , to
  • the density of the fins can be tailored to modulate the desired conductive materials of the backing block.
  • FIGURE 4 illustrates a transducer stack assembly of the present invention when assembled inside a transducer probe.
  • the stack assembly can, e.g., the same as that disclosed in FIGURE 2, or other
  • a fully diced two or three matching layer stack can be structurally coupled to flex circuitry 79 that lies between the backing 62 and dematching layer (shown in dark grey) .
  • a piezoelectric layer shown in light grey as described further herein is between the dematching layer and the matching layers (the white and medium grey layers) .
  • a top matching layer such as the medium grey layer, in the acoustic stack 71 can be bonded to the acoustic lens 70. Ultrasound waves are transmitted through the lens 70 and into a patient's body during imaging, and echoes received in response to these waves are received by the transducer stack through the lens 70.
  • the acoustic lens 70 is replaced with a window, i.e., an element with no focusing acoustical power.
  • the window may be made of the window material PEBAX, for instance.
  • another matching layer 72 also serves to enclose the transducer stack as it is wrapped around the stack and bonded by an epoxy bond 74 to the probe housing 76.
  • a ground plane 78 is bonded to the top of the grey matching layer coupled to the matching layer 72.
  • the ground plane is electrically coupled to the transducer elements through the electrically conductive matching layers and is connected to a ground conductor of flex circuit 80. Further details of this type of construction are found in US patent publication no. US 2010/0168581 (Knowles et al . ) , which is incorporated herein by reference.
  • the backing material 62 is positioned below a flex circuit 79, which is coupled to the stack assembly 11.
  • the backing block can be coated with a non-conductive insulative coating.
  • a non-conductive insulative coating it may be desirable to coat only the side of the block which is in contact with the transducer stack. In other implementations it may be desirable to coat multiple sides of the backing block. It may be desirable, for instance, to coat the lateral sides of the block with an insulative acoustic damping material which would provide the additional benefit of suppressing lateral acoustic reverberation.
  • the backing blocks can be made using conventional methods, such as by injection molding, extrusion or compression molding.
  • the methods described herein can be used to make transducers of many shapes, sizes, and performance levels.
  • the backing blocks of the present invention can be employed, e.g., in ID or 2D array transducers.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Abstract

L'invention concerne un bloc de support de sonde de transducteur comprenant un matériau polymère cristallin liquide thermiquement et électriquement conducteur ou un matériau polymère de nylon thermiquement et électriquement conducteur. Parmi de nombreuses autres propriétés, les matériaux du bloc de support présentent une conductivité thermique dans le plan supérieure à 30 W/m K en combinaison avec une propriété d'atténuation supérieure à 1,5 db/mm/MHz.
PCT/IB2015/052291 2014-03-27 2015-03-27 Matériaux de support thermiquement conducteurs pour sondes et systèmes à ultrasons Ceased WO2015145402A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461970936P 2014-03-27 2014-03-27
US61/970,936 2014-03-27

Publications (1)

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WO2015145402A1 true WO2015145402A1 (fr) 2015-10-01

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021011220A2 (fr) 2019-07-17 2021-01-21 Ticona Llc Sonde ultrasonore
US11806191B2 (en) 2018-05-21 2023-11-07 General Electric Company Phased array transducers and wafer scale manufacturing for making the same

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US20060043839A1 (en) * 2004-08-27 2006-03-02 Wildes Douglas G Ultrasound transducer with enhanced thermal conductivity
US20090062656A1 (en) * 2007-09-03 2009-03-05 Fujifilm Corporation Backing material, ultrasonic probe, ultrasonic endoscope, ultrasonic diagnostic apparatus, and ultrasonic endoscopic apparatus
US20090072668A1 (en) * 2007-09-13 2009-03-19 General Electric Company Method and apparatus for optimized dematching layer assembly in an ultrasound transducer
US20100168581A1 (en) 2005-08-08 2010-07-01 Koninklijke Philips Electronics, N.V. Wide bandwidth matrix transducer with polyethylene third matching layer
US20120037839A1 (en) * 2010-08-10 2012-02-16 Trs Technologies, Inc. Temperature and field stable relaxor-pt piezoelectric single crystals
US20120238880A1 (en) * 2011-03-17 2012-09-20 Koninklijke Philips Electronics N.V. Composite acoustic backing with high thermal conductivity for ultrasound transducer array
US20130018266A1 (en) * 2010-03-31 2013-01-17 Konica Minolta Medical & Graphic, Inc. Laminated piezoelectric body, laminated piezoelectric body manufacturing method, and ultrasound transducer and ultrasound diagnostic device using laminated piezoelectric body
US20130085390A1 (en) * 2011-09-30 2013-04-04 Konica Minolta Medical & Graphic, Inc. Ultrasound transducer, ultrasound probe, and ultrasound diagnostic apparatus
EP2662024A1 (fr) * 2011-01-06 2013-11-13 Hitachi Medical Corporation Sonde ultrasonore
US20140062261A1 (en) * 2012-08-28 2014-03-06 Toshiba Medical Systems Corporation Ultrasonic probe, piezoelectric transducer, method of manufacturing ultrasonic probe, and method of manufacturing piezoelectric transducer

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060043839A1 (en) * 2004-08-27 2006-03-02 Wildes Douglas G Ultrasound transducer with enhanced thermal conductivity
US20100168581A1 (en) 2005-08-08 2010-07-01 Koninklijke Philips Electronics, N.V. Wide bandwidth matrix transducer with polyethylene third matching layer
US20090062656A1 (en) * 2007-09-03 2009-03-05 Fujifilm Corporation Backing material, ultrasonic probe, ultrasonic endoscope, ultrasonic diagnostic apparatus, and ultrasonic endoscopic apparatus
US20090072668A1 (en) * 2007-09-13 2009-03-19 General Electric Company Method and apparatus for optimized dematching layer assembly in an ultrasound transducer
US20130018266A1 (en) * 2010-03-31 2013-01-17 Konica Minolta Medical & Graphic, Inc. Laminated piezoelectric body, laminated piezoelectric body manufacturing method, and ultrasound transducer and ultrasound diagnostic device using laminated piezoelectric body
US20120037839A1 (en) * 2010-08-10 2012-02-16 Trs Technologies, Inc. Temperature and field stable relaxor-pt piezoelectric single crystals
EP2662024A1 (fr) * 2011-01-06 2013-11-13 Hitachi Medical Corporation Sonde ultrasonore
US20120238880A1 (en) * 2011-03-17 2012-09-20 Koninklijke Philips Electronics N.V. Composite acoustic backing with high thermal conductivity for ultrasound transducer array
US20130085390A1 (en) * 2011-09-30 2013-04-04 Konica Minolta Medical & Graphic, Inc. Ultrasound transducer, ultrasound probe, and ultrasound diagnostic apparatus
US20140062261A1 (en) * 2012-08-28 2014-03-06 Toshiba Medical Systems Corporation Ultrasonic probe, piezoelectric transducer, method of manufacturing ultrasonic probe, and method of manufacturing piezoelectric transducer

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11806191B2 (en) 2018-05-21 2023-11-07 General Electric Company Phased array transducers and wafer scale manufacturing for making the same
WO2021011220A2 (fr) 2019-07-17 2021-01-21 Ticona Llc Sonde ultrasonore
WO2021011220A3 (fr) * 2019-07-17 2021-03-11 Ticona Llc Sonde ultrasonore
CN114126496A (zh) * 2019-07-17 2022-03-01 提克纳有限责任公司 超声波探头
JP2022541162A (ja) * 2019-07-17 2022-09-22 ティコナ・エルエルシー 超音波プローブ
EP3998952A4 (fr) * 2019-07-17 2023-07-19 Ticona LLC Sonde ultrasonore
JP7526780B2 (ja) 2019-07-17 2024-08-01 ティコナ・エルエルシー 超音波プローブ
TWI884158B (zh) * 2019-07-17 2025-05-21 美商堤康那責任有限公司 超音波探針

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