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WO2015144393A1 - Dispositif luminescent à zone cob - Google Patents

Dispositif luminescent à zone cob Download PDF

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Publication number
WO2015144393A1
WO2015144393A1 PCT/EP2015/054274 EP2015054274W WO2015144393A1 WO 2015144393 A1 WO2015144393 A1 WO 2015144393A1 EP 2015054274 W EP2015054274 W EP 2015054274W WO 2015144393 A1 WO2015144393 A1 WO 2015144393A1
Authority
WO
WIPO (PCT)
Prior art keywords
lighting device
cob
dam
light
potting compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/054274
Other languages
German (de)
English (en)
Inventor
Martin Reiss
Robert Kraus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of WO2015144393A1 publication Critical patent/WO2015144393A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations

Definitions

  • the invention relates to a lighting device comprising at least one CoB region with at least one semiconductor light source chip applied to a printed circuit board, wherein the at least one semiconductor light source chip is covered by a CoB's own transparent potting compound.
  • the invention is particularly applicable to lighting modules, in particular LED modules.
  • a CoB (“chip-on-board”) module is typically understood to mean a printed circuit board which has at least one (CoB) region on its front side
  • light-emitting semiconductor chip is fitted in the form of an LED chip. As LED chips are in this sense
  • watch unpackaged LED chips i. one
  • LED chips typically are radial LEDs or SMD LEDs
  • the LED chips are often covered with a CoB proprietary potting compound, which is a transparent
  • Base material with phosphor as filler contains.
  • the phosphor emits the light emitted by the LED chips
  • Primary light at least partially in secondary light
  • the phosphor can also serve as a litter material.
  • the front, free surface of the CoB's own potting compound serves as a surface-emitting CoB emission surface ("light emission surface")
  • Light emission surface Mixed light with proportions of primary light and secondary light emitted.
  • the mixed light in this case has a sum color location whose position in a color space depends on the respective proportions of the contributing light colors.
  • Transparent or transparent silicone is known as the basic or matrix material of CoB's own potting compound. The material properties of the silicone (or another translucent
  • Matrix material aim in particular at a good spreadability of the phosphor as well as at a sufficiently high flowability, since a compliance of a same
  • the CoB proprietary potting compound offers often insufficient protection against environmental influences such as noxious gas, salt, moisture, dust, fingerprints, etc.
  • Efficiency is a coverage of the light emitting surface through a transparent glass plate or plastic plate of e.g. Polycarbonate or polymethyl methacrylate (PMMA) known.
  • a transparent glass plate or plastic plate of e.g. Polycarbonate or polymethyl methacrylate (PMMA) known.
  • a lighting device comprising at least one CoB region with at least one semiconductor light source chip applied to a printed circuit board, wherein the at least one semiconductor light source chip is covered by a CoB own translucent potting compound and the translucent potting compound at its Lichtabstrahl behavior of a shed on it
  • potting compounds which are specially provided for potting CoB chips are considered as CoB proprietary potting compound. Furthermore, this may be a potting compound, which covers a COB area and is spatially delimited by a further potting compound, which is provided to cover other electronic components.
  • Covering material is also castable, it is as a further advantage directly or without gaps on the
  • Potting compound whereby reflection losses are suppressed and a high optical efficiency can be achieved.
  • the type of potting is basically not limited.
  • Semiconductor light source chip at least one LED chip. If there are more than one LED chip, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). Also, the light emitted by the at least one LED chip may be an infrared light (IR LED) or an ultraviolet light (UV LED). Several LED chips can produce a mixed light; e.g. a white mixed light. The at least one LED chip can have at least one
  • wavelength-converting phosphor included conversion LED
  • the phosphor may alternatively or additionally
  • LED chips can be mounted on a common substrate (“submount ”).
  • submount a common substrate
  • LED chips eg based on InGaN or AlInGaP
  • organic LED chips eg polymer
  • the LEDs eg polymer
  • At least one semiconductor light source chip e.g. have at least one diode laser chip.
  • the dam achieves an encircling lateral boundary around the CoB area, which in particular can serve to hold the cover material therein (especially during a potting process) and to prevent a lateral flow-off of the cover material.
  • the dam also allows a predetermined adjustment of the layer thickness over the entire Area of CoB's own potting material.
  • the dam can also be referred to as a side wall or boundary ring.
  • the dam can on the inside one or more for particularly accurate adjustment of the filling height of the covering
  • filling aids e.g. circumferential edges, steps or inward protrusions.
  • dam is placed on the circuit board, on which also the at least one
  • Printed circuit board can be used as a position reference, so that the layer height of the cover over the CoB's own translucent potting compound can be set exactly with simple means. Especially in this case like the
  • the lighting device may be a CoB module in which the cover material is added after completion of the CoB area. This can e.g. a touchdown or
  • Lighting device has at least one CoB module. This may in particular include a lighting device, which
  • the CoB module may, for example, on a pad of the
  • Lighting device may be arranged, e.g. with the back of its printed circuit board attached to the pad, e.g. be glued to it.
  • the dam may laterally encompass the entire CoB module. This has the advantage that not only the light emission surface of the CoB module is protected by the cover material, but also all other exposed surfaces of the CoB module. For example, located outside the CoB area
  • Components eg electrical and / or electronic components such as driver chips and / or circuit board
  • Components of the CoB module be shed with the cover, which further increases a touch security etc.
  • the refractive indices are the same may include in particular that the value of the refractive index of the covering material does not deviate by more than 10% from the value of the refractive index of the CoB's own encapsulant, in particular not more than 5%, in particular not more than 2%. in particular not more than 1%.
  • the two refractive indices may be identical or virtually identical.
  • the covering material has a greater hardness than the CoB's own
  • Covering material can be achieved.
  • the cover material can also be kept very thin.
  • harder materials tend to have less stickiness. As a result of the greater hardness, contamination of a free light-radiating surface of the lighting device can be prevented, in particular by lint and dust particles adhering thereto. Furthermore, harder materials tend to have higher chemical resistance
  • the covering material (22) has a Shore A hardness of at least 60, in particular of at least 70.
  • Potting compound is not more than 30, in particular not more than 20. It is also an embodiment that the dam surrounding the CoB area laterally split. So the dam can simply be arranged around the CoB area, eg on one
  • the gap can flow into the gap when filling the covering material in the dam and fix the dam so laterally against the CoB area.
  • Lighting device a lid with a
  • Light passage opening which light passage opening is located in front of the light emitting surface of the CoB area and wherein an edge of the light passage opening extends above a lid facing the front side of the dam.
  • the dam thus projects laterally into the light passage opening and also extends laterally outside the light passage opening.
  • a vertical projection of the contour of the light passage opening extends in yet other words so on the dam.
  • Sealant be placed in the gap between the lid and the dam, whereby this gap is reliably sealed.
  • the cover material comprises or is transparent material.
  • the cover material may be transparent silicone.
  • the covering material comprises transparent base or matrix material in which scattering particles are distributed as filling material.
  • the Stray particles can be, for example, white pigments, trapped air bubbles or small hollow spheres, eg of glass.
  • the scattering particles may not be wavelength-converting scattering particles, that is, they can not also serve as phosphors.
  • Covering material has or is heat and blue light stable material.
  • cover material comprises or is silicone. Silicone is cheap,
  • the cover material may therefore consist of transparent silicone with or without scattering particles.
  • the silicone is self-adhesive silicone.
  • the surfaces to be covered, in particular the potting compound of the CoB range, do not need
  • CoB's own translucent potting compound is silicone or has as a base material.
  • the silicone is not self-adhesive or the covering material is not a silicone-based covering material
  • the light-emitting surface of the CoB region or the CoB-own potting compound is plasma-treated or is.
  • an N 2 plasma treatment or a plasma coating with e.g. Hexadimethylsilan precursor be made in the case of non-self-adhesive silicones and 02 plasma treatment in the case of non-silicone-based covering materials.
  • the cover material is not limited to silicone.
  • the cover material may also be or have polyacrylic polyurethane copolymer, ABS and / or PMMA. It is one for a good adhesion and a low one
  • the cover material has a layer thickness between one and ten millimeters. This represents a preferred compromise between a small volume of material, especially a small one
  • the covering material has a curved free surface.
  • the covering material likes a lens function for beam shaping of the light passing through the covering material
  • the dam has a wall thickness between one and ten millimeters.
  • the dam may be made of plastic, especially white or translucent, e.g. transparent, plastic.
  • the material of the dam is preferably inexpensive, harmless, heat stable and / or blue light stable.
  • the material of the dam may be, for example, silicone or polyacrylic polyurethane copolymer.
  • Cover material with the dam preferred that the material of the dam and the cover material are the same or similar.
  • a similar material may, for example, have the same basic material type (eg silicone in a varied version, eg soft or hard) or, for example, a similar basic material
  • the lighting device may be a lamp, a lamp or a module ("light module”)
  • Fig.l shows a sectional view in side view a
  • Fig.l shows a sectional view in side view of a lighting device in the form of a lighting module 11.
  • Luminous module 11 has a CoB region 12 with a
  • LED chips 17 Semiconductor light source chips in the form of LED chips 17. Such an arrangement is also referred to as a “chip-on-board” or “CoB” arrangement.
  • the light module 11 may also be referred to as a “CoB module.”
  • the circuit board 13 may be referred to as
  • Base material for example, conventional board base material such as FR4, etc. or have a base made of ceramic.
  • the circuit board 13 may also be a metal core board.
  • the LED chips 17 are surrounded by a CoB-own ring 18 having a hollow cylindrical basic shape, which is fastened to the front side on the printed circuit board 13. In the ring 18 is
  • Potting compound 19 is filled so that it covers the LED chips 17.
  • the potting compound 19 has a transparent
  • Matrix material here: silicone, which is mixed with phosphor as filler.
  • the LED chips 17 radiate purely by way of example blue (primary) light from, while the phosphor partially converts the blue primary light in its passage in yellow (secondary) light.
  • the potting compound 19 At the front surface of the potting compound 19, which in
  • Potting compound 19 as well as its material properties such as hardness are thus dominated by the desire to achieve the color, not by the desire to achieve a good protective function.
  • the silicone of the potting compound 19 is usually soft and sensitive to mechanical stress.
  • the CoB area 12 in turn is circumferentially surrounded laterally by a dam 21 with a hollow cylindrical basic shape, namely with a gap through a (ring) gap 15. To the front of the dam 21 is on the potting compound 19 and their
  • the dam 21 has a
  • a height of the dam is preferably also between one and ten millimeters.
  • the dam 21 is filled with translucent, here: transparent, cover 22 to over the light exit surface 20.
  • a layer thickness of the covering material 22 above the light exit surface 20 is in a range between one and ten millimeters.
  • the cover material 22 is in particular moldable, so that it can easily penetrate into the gap 15 during filling into the interior of the dam 21 and thus the dam 21 can fix laterally against the CoB region 12.
  • the cover material 22 is also selected here as silicone, but in a greater hardness after curing than the silicone of the potting compound 19. The cover material 22 thereby enables better protection of the CoB region 12, in particular with respect to an external mechanical stress.
  • the cover material 22 may consist of non-scattering silicone in order to achieve a particularly high light output. However, the cover material 22 may also have deliberately introduced scattering particles or scattering centers in a silicone matrix in order to increase a light homogeneity.
  • Covering material 22 is self-adhesive. Another advantage consists in an at least similar, in particular practically the same refractive index, whereby reflection losses can be kept low.
  • the light-emitting module 11 further has a cover 24 which is attached peripherally to the printed circuit board 13 and which has a central circular light passage opening 25.
  • Light transmission opening 25 is located on the front side in front of the light emission surface 20 of the CoB region 12, wherein an edge 26 of the light transmission opening 25 extends above a front side facing the cover 24 in the form of an annular end face 27 of the dam 21. In this case remains in the height of a small gap 28 between the front end face 27 of the Dam 21 and the lid 24. This allows a safe
  • the gap 28 can be sealed by placing a sealant 29 after placing the lid 24.
  • Cavity 30 and thus outside of the dam 21 13 and 13 electrical and / or electronic components 31 are arranged on the front side 16 of the circuit board. These may e.g. serve an electrical connection of the light-emitting module 11 (for example an electrical plug) or for operating the LED chips 17 (for example at least as part of a drive or
  • Driver electronics may be provided.
  • the electrical and / or electronic components 31 are electrically connected to the LED chips 17 via suitable conductor tracks (not shown).
  • the lighting device 11 is shown here with a cover material 22, the front, free surface 32 is flat, the lighting device 11 is not limited thereto.
  • the free surface 32 may be e.g. at least partially nonplanar, e.g. be curved,
  • FIG. 2 shows a sectional side view of a lighting device 41 according to a second embodiment.
  • the lighting device 41 has a lower-side pad 42, on whose front side a CoB module 43 is fixed.
  • the CoB module 43 has, similar to the light-emitting module 11 from FIG. 1, a CoB region 12 with a plate-shaped
  • Printed circuit board 13 e.g. from FR4, on. At the front 16 of the circuit board 13 are also several here
  • LED chips Semiconductor light source chips in the form of LED chips 17.
  • the LED chips 17 are also surrounded by a CoB own ring 18 having a hollow cylindrical basic shape, which is fixed on the front side of the circuit board 13.
  • Potting compound 19 is filled so that it covers the LED chips 17.
  • the potting compound 19 also has one here
  • Light exit surface 20 then also emerges mixed light as useful light.
  • the CoB module 43 is circumferentially surrounded by a dam 44 with a hollow cylindrical basic shape, namely gap-shaped to the circuit board 13 through a gap 45.
  • a dam 44 with a hollow cylindrical basic shape, namely gap-shaped to the circuit board 13 through a gap 45.
  • To the front of the dam 44 is on the potting compound 19 and their
  • a height of the dam 44 is preferably between one and ten millimeters, plus the height of the printed circuit board 13.
  • the dam 44 is covered with transparent cover material 22 to above
  • Covering material 22 above the light exit surface 20 is also in a range between one and ten
  • the cover material 22 is also chosen here as a comparatively hard silicone.
  • the covering material 22 now also covers the remaining printed circuit board 13 and thus also protects the functional elements arranged thereon, such as printed conductors, electrical and / or electronic components 31, etc. Since silicone is inexpensive, the use of a larger material volume increases it the cost of the lighting device 41 is not essential. On a cover may now be dispensed with.
  • Streupumblen other filling material have. So may the cover material in general also have phosphor. Generally, “on”, “an”, etc. may be taken to mean a singular or a plurality, in particular in the sense of “at least one” or “one or more”, etc., as long as this is not explicitly excluded, eg by the expression “exactly a "etc.
  • a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un dispositif luminescent (11), comportant au moins une zone CoB (12) pourvue au moins d'une puce à source lumineuse semi-conductrice (17) disposée sur une carte de circuit imprimé (13). La ou les puces à source lumineuse semi-conductrice (17) sont couvertes au moyen d'une masse coulée (19) perméable à la lumière dédiée à la CoB. La masse coulée (19) perméable à la lumière dédiée à la CoB (19) est recouverte sur sa surface réfléchissant la lumière (20) d'une matière de recouvrement perméable à la lumière coulée par-dessus. L'invention est en particulier applicable à des modules luminescents, en particulier des modules LED.
PCT/EP2015/054274 2014-03-24 2015-03-02 Dispositif luminescent à zone cob Ceased WO2015144393A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014205470.2 2014-03-24
DE102014205470.2A DE102014205470B4 (de) 2014-03-24 2014-03-24 Leuchtvorrichtung mit CoB-Bereich

Publications (1)

Publication Number Publication Date
WO2015144393A1 true WO2015144393A1 (fr) 2015-10-01

Family

ID=52672237

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/054274 Ceased WO2015144393A1 (fr) 2014-03-24 2015-03-02 Dispositif luminescent à zone cob

Country Status (2)

Country Link
DE (1) DE102014205470B4 (fr)
WO (1) WO2015144393A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016201917A1 (de) * 2016-02-09 2017-08-10 Tridonic Jennersdorf Gmbh LED-Lichtquelle mit höherer Schutzklasse
DE102016205691A1 (de) * 2016-04-06 2017-10-12 Tridonic Jennersdorf Gmbh LED-Modul in Chip-on-Board-Technologie
DE102017106959A1 (de) * 2017-03-31 2018-10-04 Osram Opto Semiconductors Gmbh Leuchtvorrichtung und Leuchtsystem

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006101257A1 (fr) * 2005-03-23 2006-09-28 Matsushita Electric Industrial Co., Ltd. Module d'emission de lumiere
DE102011003988A1 (de) * 2011-02-11 2012-08-16 Osram Ag Leuchtvorrichtung
WO2013015058A1 (fr) * 2011-07-25 2013-01-31 日亜化学工業株式会社 Dispositif d'émission de lumière
US20130334559A1 (en) * 2011-03-07 2013-12-19 Koninklijke Philips N.V. Light emitting module, a lamp, a luminaire and a display device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005061204A1 (de) * 2005-12-21 2007-07-05 Perkinelmer Elcos Gmbh Beleuchtungsvorrichtung, Beleuchtungssteuergerät und Beleuchtungssystem
US7777412B2 (en) * 2007-03-22 2010-08-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Phosphor converted LED with improved uniformity and having lower phosphor requirements
US8247827B2 (en) * 2008-09-30 2012-08-21 Bridgelux, Inc. LED phosphor deposition
US8568012B2 (en) * 2010-01-18 2013-10-29 Lg Innotek Co., Ltd. Lighting unit and display device having the same
DE102011003989A1 (de) * 2011-02-11 2012-08-16 Osram Ag Leuchtvorrichtung
DE102011084885A1 (de) * 2011-10-20 2013-04-25 Osram Gmbh Auflage für eine Leuchtvorrichtung
WO2013056927A1 (fr) * 2011-10-20 2013-04-25 Osram Gmbh Pièce de recouvrement conçue pour un support d'un dispositif d'éclairage à semi-conducteurs
DE102012210743A1 (de) * 2012-06-25 2014-01-02 Osram Gmbh Leuchtvorrichtung mit lichtsensor
DE102013214235A1 (de) * 2013-07-19 2015-01-22 Osram Gmbh Leuchtvorrichtung mit Halbleiterlichtquellen und umlaufendem Damm

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006101257A1 (fr) * 2005-03-23 2006-09-28 Matsushita Electric Industrial Co., Ltd. Module d'emission de lumiere
DE102011003988A1 (de) * 2011-02-11 2012-08-16 Osram Ag Leuchtvorrichtung
US20130334559A1 (en) * 2011-03-07 2013-12-19 Koninklijke Philips N.V. Light emitting module, a lamp, a luminaire and a display device
WO2013015058A1 (fr) * 2011-07-25 2013-01-31 日亜化学工業株式会社 Dispositif d'émission de lumière

Also Published As

Publication number Publication date
DE102014205470A1 (de) 2015-09-24
DE102014205470B4 (de) 2016-10-13

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