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WO2015037370A1 - Condensateur électrolytique et composition de résine époxy - Google Patents

Condensateur électrolytique et composition de résine époxy Download PDF

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Publication number
WO2015037370A1
WO2015037370A1 PCT/JP2014/070822 JP2014070822W WO2015037370A1 WO 2015037370 A1 WO2015037370 A1 WO 2015037370A1 JP 2014070822 W JP2014070822 W JP 2014070822W WO 2015037370 A1 WO2015037370 A1 WO 2015037370A1
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WO
WIPO (PCT)
Prior art keywords
electrolytic capacitor
epoxy resin
resin composition
capacitor element
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2014/070822
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English (en)
Japanese (ja)
Inventor
君光 鵜木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2015536490A priority Critical patent/JPWO2015037370A1/ja
Priority to CN201480049812.3A priority patent/CN105531779A/zh
Priority to KR1020167009258A priority patent/KR20160055206A/ko
Publication of WO2015037370A1 publication Critical patent/WO2015037370A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H01G9/151—Solid electrolytic capacitors with wound foil electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires

Definitions

  • the present invention relates to an electrolytic capacitor and an epoxy resin composition.
  • Patent Documents 1 and 2 relate to an electrolytic capacitor including a capacitor element in which an electrode foil is wound through a separator.
  • Patent Document 1 describes a solid electrolytic capacitor including a capacitor element and an outer shell made of an insulating resin that covers the capacitor element.
  • Patent Document 2 describes a method for manufacturing a solid electrolytic capacitor including a step of placing a capacitor element in a mold and injecting a mold resin into the mold to mold the mold.
  • an electrolytic capacitor element formed by winding a laminated film in which a cathode foil, a separator, and an anode foil are laminated in this order; Mold resin that is composed of a cured product of an epoxy resin composition and covers at least a part of the electrolytic capacitor element; With The epoxy resin composition is Epoxy resin (A), Crystalline silica (B); An electrolytic capacitor is provided.
  • an epoxy resin composition comprising an epoxy resin (A) and crystalline silica (B) is provided.
  • the reliability of the electrolytic capacitor can be improved.
  • FIG. 2 is a perspective view schematically showing the electrolytic capacitor element shown in FIG. 1.
  • FIG. 1 is a cross-sectional view schematically showing an electrolytic capacitor 100 according to this embodiment.
  • FIG. 2 is a perspective view schematically showing the electrolytic capacitor element 10 shown in FIG.
  • the electrolytic capacitor 100 according to the present embodiment includes an electrolytic capacitor element 10 and a mold resin 20.
  • the electric field capacitor element 10 is formed by winding a laminated film in which a cathode foil 12, a separator 16, and an anode foil 14 are laminated in this order.
  • the mold resin 20 is made of a cured product of an epoxy resin composition and covers at least a part of the electrolytic capacitor element 10.
  • the said epoxy resin composition contains an epoxy resin (A) and crystalline silica (B).
  • a mold resin covering the electrolytic capacitor element is used as crystalline silica. It was newly found out that the temperature resistance cycle characteristics of the electrolytic capacitor can be improved by comprising a cured product of the epoxy resin composition containing, thereby reaching the constitution of the present embodiment.
  • the mold resin 20 that covers the electrolytic capacitor element 10 is constituted by a cured product of an epoxy resin composition that includes an epoxy resin (A) and crystalline silica (B). For this reason, the temperature cycle resistance characteristics of the electrolytic capacitor 100 can be improved.
  • a temperature-resistant cycle characteristic for example, an equivalent series resistance (ESR (Equivalent Series Resistance)) caused by peeling between the capacitor element 10 and the mold resin 20 due to the temperature cycle, damage of the electrolytic capacitor element 10, or the like. It is possible to suppress an increase or a decrease in lifetime. Therefore, the reliability of the electrolytic capacitor can be improved.
  • ESR Equivalent Series Resistance
  • the electrolytic capacitor 100 is, for example, an electrolytic capacitor or a conductive polymer electrolytic capacitor.
  • the electrolytic capacitor 100 includes an electrolytic capacitor element 10 and a mold resin 20 that covers at least a part of the electrolytic capacitor element 10.
  • an aluminum case, sealing rubber, a pedestal or the like for protecting the electrolytic capacitor element 10 becomes unnecessary. Therefore, it is possible to realize the electrolytic capacitor 100 that is excellent from the viewpoint of volume efficiency and low profile.
  • Electrolytic capacitor element 10 includes an anode, a cathode provided opposite to the anode, and a dielectric provided between the anode and the cathode.
  • the electrolytic capacitor element 10 according to the present embodiment is a wound electrolytic capacitor element formed by winding a laminated film in which, for example, a cathode foil 12, a separator 16, and an anode foil 14 are laminated in this order. Thereby, the capacity and size of the electrolytic capacitor element 10 can be reduced.
  • FIG. 2 illustrates a case where the electrolytic capacitor element 10 is formed by winding a laminated film in which the cathode foil 12, the separator 16, the anode foil 14, and the separator 16 are laminated in this order. In the example shown in FIG. 2, the laminated film is wound so that the cathode foil 12 is positioned on the outermost layer, but the structure of the electrolytic capacitor element 10 is not limited to this.
  • the cathode foil 12 and the anode foil 14 are made of, for example, a metal material mainly composed of Al.
  • the electrolytic capacitor element 10 is an aluminum electrolytic capacitor.
  • a metal material which comprises an anode and a cathode the alloy containing 2 or more types selected from Ta, Nb or Al, Ta, and Nb is also mentioned, for example.
  • the surface of the cathode foil 12 and the anode foil 14 is subjected to, for example, an etching process for increasing the surface area.
  • an insulating layer or a semiconductor layer constituting a dielectric of the electrolytic capacitor element 10 is formed on the surface of the anode foil 14.
  • a dielectric layer made of, for example, Al 2 O 3 is formed on the surface of the anode foil 14 by a chemical conversion process.
  • the separator 16 is impregnated with an electrolytic solution, thereby forming an electrolyte layer.
  • the solvent in the electrolytic solution is not particularly limited, and for example, a protonic solvent such as alcohols, an aprotic solvent such as lactones, or water can be used. These may be used alone or in combination of two or more.
  • solute in the electrolytic solution examples include adipic acid, glutaric acid, succinic acid, benzoic acid, isophthalic acid, phthalic acid, terephthalic acid, maleic acid, toluic acid, enanthic acid, malonic acid, formic acid, decanedicarboxylic acid, Organic acids such as octanedicarboxylic acid, azelaic acid or sebacic acid, inorganic acids such as boric acid, phosphoric acid, carbonic acid or silicic acid, or ammonium salts, amine salts, quaternary ammonium salts, amidines containing these conjugate bases as anionic components Examples thereof include system salts.
  • the electrolyte layer may be a solid electrolyte layer formed by, for example, immersing a polymerizable monomer solution in the separator 16 and polymerizing the monomer in the solution.
  • the monomer solution include those containing thiophene, aniline, pyrrole, furan, acetylene, or derivatives thereof. Among these, it is particularly preferable to use those containing thiophene derivatives such as 3,4-ethylenedioxythiophene.
  • the electrolytic capacitor 100 may further include an external terminal 30 connected to the anode or the cathode of the electrolytic capacitor element 10.
  • the mold resin 20 is provided so as to cover at least a part of the external terminal 30.
  • FIG. 1 the case where the mold resin 20 is provided so as to cover one end side of the external terminal 30 connected to the anode or the cathode and to expose the other end side is illustrated.
  • the external terminal 30 is constituted by a lead wire, for example.
  • the external terminal 30 is made of, for example, a metal material whose main component is Al.
  • the mold resin 20 that covers the electrolytic capacitor element 10 is constituted by a cured product of an epoxy resin composition that includes an epoxy resin (A) and crystalline silica (B).
  • the temperature cycle characteristics of the electrolytic capacitor 100 can be improved also from such a viewpoint.
  • the mold resin 20 covers at least a part of the electrolytic capacitor element 10. In the present embodiment, it is preferable that the entire electrolytic capacitor element 10 is covered with the mold resin 20 from the viewpoint of improving reliability.
  • a mold resin 20 is provided so as to seal the entire electrolytic capacitor element 10.
  • the mold resin 20 is provided so as to cover at least a part of the external terminal 30 as described above, for example.
  • the external terminal 30 is provided so as to cover only a part of the external terminal 30 while sealing the entire electrolytic capacitor element 10.
  • Mold resin 20 is composed of a cured product of an epoxy resin composition.
  • the epoxy resin composition includes an epoxy resin (A) and crystalline silica (B).
  • A epoxy resin
  • B crystalline silica
  • epoxy resin (A) Epoxy resin
  • monomers, oligomers and polymers generally having two or more epoxy groups in one molecule can be used, and the molecular weight and molecular structure are not particularly limited.
  • the epoxy resin (A) for example, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol type epoxy resin such as tetramethylbisphenol F type epoxy resin, stilbene type epoxy resin, Crystalline epoxy resins such as hydroquinone type epoxy resins; Novolak type epoxy resins such as cresol novolak type epoxy resins, phenol novolak type epoxy resins, naphthol novolak type epoxy resins; Epoxy resins, naphthol aralkyl-type epoxy resins containing a phenylene skeleton, phenol aralkyl epoxy resins containing an alkoxynaphthalene skeleton, etc.
  • Lukyle-type epoxy resin Trifunctional epoxy resin such as triphenolmethane-type epoxy resin and alkyl-modified triphenolmethane-type epoxy resin; Modified phenol-type epoxy resin such as dicyclopentadiene-modified phenol-type epoxy resin and terpene-modified phenol-type epoxy resin A heterocyclic ring-containing epoxy resin such as a triazine nucleus-containing epoxy resin. These may be used alone or in combination of two or more. Among these, it is more preferable to use at least one of a novolac-type epoxy resin and an aralkyl-type epoxy resin from the viewpoint of improving the balance between the temperature cycle characteristics, moisture resistance, and moldability of the electrolytic capacitor 100.
  • an aralkyl type epoxy resin from the viewpoint of improving the moisture resistance of the electrolytic capacitor 100, it is particularly preferable to use an aralkyl type epoxy resin, and it is more preferable to use a phenol aralkyl type epoxy resin having a biphenylene skeleton.
  • the aralkyl type epoxy resin used as an epoxy resin (A) can be represented by the following general formula (1), for example.
  • X represents any one of a phenylene group, a biphenylene group, or a naphthylene group
  • Y represents a phenylene group or a naphthylene group
  • R 1 and R 2 each independently represent 1 to 10 carbon atoms.
  • g is an integer of 0 to 8
  • h is an integer of 0 to 5
  • n is an integer of 1 to 5 indicating the degree of polymerization
  • content of the epoxy resin (A) in an epoxy resin composition is not specifically limited, For example, it is preferable that it is 1 to 50 weight% with respect to the whole epoxy resin composition, and is 2 to 30 weight%. More preferably, it is more preferably 5% by weight or less and 20% by weight or less.
  • content of an epoxy resin (A) more than the said lower limit, the fluidity
  • the content of the epoxy resin (A) to be equal to or less than the above upper limit value, the moisture resistance reliability and temperature cycle resistance characteristics of the electrolytic capacitor 100 can be more effectively improved.
  • the average particle diameter D 50 of the crystalline silica is preferably 0.2 ⁇ m or more 50 ⁇ m or less, more preferably 0.5 ⁇ m or 30 ⁇ m or less.
  • the average particle diameter D 50 is a commercially available laser particle size distribution analyzer (e.g., manufactured by Shimadzu Corporation, SALD-7000) was defined as the average particle diameter at. The same applies to fused silica (C).
  • the content of the crystalline silica (B) in the epoxy resin composition is not particularly limited, but for example, it is preferably 50% by weight or more and 95% by weight or less, and 60% by weight or more with respect to the entire epoxy resin composition. It is more preferably 95% by weight or less, and particularly preferably 70% by weight or more and 90% by weight or less.
  • the temperature cycle characteristics and moisture resistance of the electrolytic capacitor 100 can be more effectively improved.
  • liquidity of an epoxy resin composition can be made favorable, and it becomes possible to improve a moldability more effectively.
  • the epoxy resin composition may further contain fused silica (C).
  • fused silica (C) those known to those skilled in the art can be used.
  • the fluidity in the epoxy resin composition can be easily improved and the moldability can be further improved.
  • it can also contribute to improvement of moisture resistance reliability.
  • fused silica (C) for example, fused spherical silica or fused crushed silica can be used. These may be used alone or in combination. Among these, from the viewpoint of ease of improvement in fluidity, it is more preferable to use fused spherical silica.
  • the average particle diameter D 50 of the fused silica (C) is preferably 0.2 ⁇ m or more and 50 ⁇ m or less, and more preferably 0.5 ⁇ m or more and 30 ⁇ m or less.
  • the average particle diameter D 50 of less than the above lower limit the fluidity of the epoxy resin composition is made excellent, it is possible to improve the formability more effectively. Further, by the average particle diameter D 50 and more than the above upper limit can reliably prevent the gate clogging occurs.
  • the content of the fused silica (C) in the epoxy resin composition is not particularly limited, but is preferably 0.5% by weight or more and 30% by weight or less, for example, based on the entire epoxy resin composition, and preferably 1% by weight.
  • the content is more preferably 25% by weight or less and particularly preferably 2% by weight or more and 20% by weight or less.
  • the epoxy resin composition may further contain a filler in addition to the crystalline silica (B) and the fused silica (C).
  • a filler in addition to the crystalline silica (B) and the fused silica (C).
  • examples of such fillers include silica, alumina, kaolin, talc, clay, mica, rock wool, wollastonite, glass powder, glass flakes, glass beads, glass fibers, silicon carbide, and silicon nitride obtained by the sol-gel method.
  • a pulverized pulverized powder is exemplified.
  • the epoxy resin composition can contain a curing agent (D), for example.
  • the curing agent (D) is not particularly limited as long as it can be cured by reacting with the epoxy resin (A), but for example, ethylene diamine, trimethylene diamine, tetramethylene diamine, hexamethylene diamine and the like having 2 to 20 carbon atoms.
  • Organic acids These may be used alone or in combination of two or more.
  • at least one of a novolac type phenol resin or a phenol aralkyl resin is used. More preferred. From the viewpoint of improving the moisture resistance of the electrolytic capacitor 100, it is particularly preferable to use a phenol aralkyl resin.
  • curing agent (D) in an epoxy resin composition is not specifically limited, For example, it is preferable that it is 1 to 10 weight% with respect to the whole epoxy resin composition, and is 3 to 8 weight%. It is particularly preferable that the amount is not more than% by weight.
  • An epoxy resin composition can contain a coupling agent (E), for example.
  • a coupling agent (E) known cups such as various silane compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, vinyl silane, titanium compounds, aluminum chelates, aluminum / zirconium compounds, etc.
  • a ring agent can be used. Examples include vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxyethoxy) silane, ⁇ -methacryloxypropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxy.
  • the content of the coupling agent (E) in the epoxy resin composition is not particularly limited.
  • the content is preferably 0.1% by weight or more and 3% by weight or less with respect to the entire epoxy resin composition. It is particularly preferable that the content is 2% by weight or more and 2% by weight or less.
  • content of a coupling agent (E) more than the said lower limit, the dispersibility of filler components, such as crystalline silica (B) in a epoxy resin composition, and fused silica (C), shall be favorable. can do.
  • content of a coupling agent (E) below into the said upper limit the fluidity
  • the epoxy resin composition is, for example, an organic phosphine, a tetra-substituted phosphonium compound, a phosphobetaine compound, an adduct of a phosphine compound and a quinone compound, or an addition of a phosphonium compound and a silane compound.
  • a phosphorus atom-containing compound such as 1,8-diazabicyclo (5,4,0) undecene-7, an amidine compound such as imidazole, a tertiary amine such as benzyldimethylamine, or a quaternary onium salt of the compound.
  • Curing accelerators such as nitrogen atom-containing compounds typified by amidinium salts or ammonium salts; Colorants such as carbon black; Release agents such as natural wax, synthetic wax, higher fatty acids or metal salts thereof, paraffin, polyethylene oxide, etc. ; Silicone oil, silicone rubber, etc. Low stress agents; ion scavengers such as hydrotalcite; flame retardants such as aluminum hydroxide; various additives such as antioxidants.
  • the flow length of the epoxy resin composition measured by spiral flow measurement is preferably 30 cm or more and 150 cm or less, more preferably 40 cm or more and 130 cm or less, and particularly preferably 50 cm or more and 110 cm or less. Thereby, the improvement of the moldability of an epoxy resin composition can be aimed at.
  • the spiral flow measurement of the epoxy resin composition is performed using a low-pressure transfer molding machine, for example, a mold temperature of 175 ° C. and an injection pressure of 6. An epoxy resin composition is injected under conditions of 9 MPa and a curing time of 120 seconds, and the flow length is measured.
  • the epoxy resin composition preferably has a gel time at 175 ° C. of, for example, 15 seconds to 60 seconds, more preferably 20 seconds to 55 seconds, and particularly preferably 25 seconds to 50 seconds. .
  • a gel time at 175 ° C. of, for example, 15 seconds to 60 seconds, more preferably 20 seconds to 55 seconds, and particularly preferably 25 seconds to 50 seconds.
  • the epoxy resin composition preferably has a glass transition temperature (Tg) of a cured product that is thermally cured at 175 ° C. for 4 hours, for example, 130 ° C. or more and 200 ° C. or less, and 140 ° C. or more and 180 ° C. or less. Is more preferable, and it is particularly preferably 145 ° C. or higher and 170 ° C. or lower.
  • the linear expansion coefficient ( ⁇ 1 ) at the glass transition temperature or lower of the cured product is preferably, for example, from 5 ppm / ° C. to 40 ppm / ° C., more preferably from 8 ppm / ° C.
  • the linear expansion coefficient ( ⁇ 2 ) at the glass transition temperature or higher of the cured product is preferably, for example, 30 ppm / ° C. or higher and 90 ppm / ° C. or lower, more preferably 40 ppm / ° C. or higher and 80 ppm / ° C. or lower, It is particularly preferably 45 ppm / ° C. or more and 75 ppm / ° C. or less.
  • Tg, ⁇ 1 , and ⁇ 2 of the cured product of the epoxy resin composition can be measured as follows, for example. First, an epoxy resin composition is injection-molded using a low-pressure transfer molding machine at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds to obtain a 10 mm ⁇ 4 mm ⁇ 4 mm test piece. Next, the obtained test piece is post-cured at 175 ° C.
  • the glass transition temperature (Tg), the linear expansion coefficient ( ⁇ 1 ) below the glass transition temperature, and the linear expansion coefficient ( ⁇ 2 ) above the glass transition temperature can be calculated.
  • the epoxy resin composition preferably has a differential boiling water absorption of, for example, 0.3% by mass or less, more preferably 0.26% by mass or less, after being cured at 175 ° C. for 4 hours. It is preferably 0.24% by mass or less.
  • the reliability in the electrolytic capacitor 100 such as moisture resistance reliability can be improved.
  • the differential boiling water absorption of the cured product can be measured, for example, as follows. First, using a low-pressure transfer molding machine, a disk-shaped test piece having a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, a curing time of 120 seconds and a diameter of 50 mm and a thickness of 3 mm is molded.
  • the mass of the test piece before boiling treatment and the mass after boiling treatment in pure water for 24 hours are measured.
  • the boiling water absorption rate of the test piece is obtained as a percentage.
  • the electrolytic capacitor 100 according to the present embodiment is manufactured as follows, for example. First, after connecting the external terminal 30 to the cathode foil 12 and the anode foil 14, these electrode foils are wound through the separator 16.
  • the electrolytic capacitor element 10 thus obtained is encapsulated with an epoxy resin composition. Examples of the molding method include a transfer molding method and a compression molding method. Next, the epoxy resin composition is thermally cured to form the mold resin 20. Thereby, the electrolytic capacitor 100 according to the present embodiment is obtained.
  • the mold resin 20 that covers the electrolytic capacitor element 10 is constituted by a cured product of an epoxy resin composition that includes an epoxy resin (A) and crystalline silica (B). For this reason, the temperature cycle resistance characteristics of the electrolytic capacitor 100 can be improved. Therefore, the reliability of the electrolytic capacitor can be improved.
  • epoxy resin compositions were prepared as follows. First, each component blended according to Table 1 was mixed at 15 to 28 ° C. using a mixer. Next, the obtained mixture was roll kneaded at 70 to 100 ° C., cooled and pulverized to obtain an epoxy resin composition. The details of each component in Table 1 are as follows. Moreover, the unit in Table 1 is mass%.
  • Epoxy resin Epoxy resin 1 phenol aralkyl type epoxy resin containing biphenylene skeleton (NC-3000P, manufactured by Nippon Kayaku Co., Ltd.)
  • Epoxy resin 2 Orthocresol novolac type epoxy resin (EOCN-1020-75, manufactured by Nippon Kayaku Co., Ltd.)
  • B Crystalline silica crystallite SKS, manufactured by Tatsumori Co., Ltd. (average particle size: 23 ⁇ m)
  • C Fused silica FB-950, manufactured by Denki Kagaku Kogyo Co., Ltd.
  • electrolytic capacitors were produced as follows. First, lead wires as external terminals were connected to the anode foil and the cathode foil, and both electrode foils were wound through a separator to form an electrolytic capacitor element.
  • the anode foil used was an aluminum foil that was subjected to surface expansion treatment by etching, and then subjected to chemical conversion treatment in an aqueous solution of ammonium adipate to form an oxide film layer on the surface.
  • the cathode foil an aluminum foil etched and expanded was used.
  • the lead wire one formed of a metal material containing 99% or more of aluminum was used.
  • the electrolytic capacitor element was impregnated with an electrolytic solution composed of a mixed solution of ⁇ -butyrolactone and ethyldimethylimidazolinium phthalate.
  • the obtained electrolytic capacitor element and lead wire were molded using a low-pressure transfer molding machine (“KTS-15” manufactured by Kotaki Seiki Co., Ltd.) with a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds. Seal molding was performed with an epoxy resin composition under conditions. Thereafter, the epoxy resin composition was post-cured at 175 ° C. for 4 hours to obtain an electrolytic capacitor coated with a mold resin.
  • KTS-15 low-pressure transfer molding machine
  • Glass transition temperature (Tg), linear expansion coefficient ( ⁇ 1 , ⁇ 2 ) About each Example and the comparative example, the glass transition temperature (Tg) and linear expansion coefficient ((alpha) 1 , (alpha) 2 ) of the hardened
  • KTS-15 low-pressure transfer molding machine
  • thermomechanical analyzer manufactured by Seiko Denshi Kogyo Co., Ltd., TMA100
  • TMA100 thermomechanical analyzer
  • the measurement was performed under the condition of 5 ° C./min. From this measurement result, the glass transition temperature (Tg), the linear expansion coefficient ( ⁇ 1 ) below the glass transition temperature, and the linear expansion coefficient ( ⁇ 2 ) above the glass transition temperature were calculated.
  • Tg glass transition temperature
  • ⁇ 1 and ⁇ 2 is ppm / ° C.
  • Tg the unit of Tg is ° C.
  • cured material of the obtained epoxy resin composition was measured as follows. First, using a low-pressure transfer molding machine (“KTS-15” manufactured by Kotaki Seiki Co., Ltd.), a disk-shaped test having a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, a curing time of 120 seconds and a diameter of 50 mm and a thickness of 3 mm A piece was molded. Next, after the obtained test piece was post-cured at 175 ° C. for 4 hours, the mass of the test piece before boiling treatment and the mass after boiling treatment in pure water for 24 hours were measured. From the result of calculating the mass change before and after the boiling treatment based on this measurement result, the boiling water absorption rate of the test piece was obtained as a percentage. The unit in Table 1 is mass%.
  • ESR Equivalent series resistance
  • the electrolytic capacitor was left in an atmosphere of 65 ° C. and RH (relative humidity) 95% for 500 hours.
  • ESR Equivalent series resistance
  • ESR Equivalent series resistance
  • Examples 1 to 3 all showed good results in the temperature cycle test. Among these, Examples 1 and 2 showed particularly excellent results in the moisture resistance test. In addition, Examples 1 and 3 showed particularly excellent results in the moldability test as compared with Example 2.

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Abstract

L'invention porte sur un condensateur électrolytique (100) qui comprend : un élément de condensateur électrolytique (10) qui est formé par bobinage d'un film multicouche obtenu par stratification de manière séquentielle d'une feuille d'électrode négative, d'un séparateur et d'une feuille d'électrode positive dans cet ordre ; et une résine à mouler (20) qui est constituée d'un produit durci d'une composition de résine époxy et recouvre au moins une partie de l'élément de condensateur électrolytique (10). La composition de résine époxy contient (A) une résine époxy et (B) de la silice cristalline.
PCT/JP2014/070822 2013-09-10 2014-08-07 Condensateur électrolytique et composition de résine époxy Ceased WO2015037370A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015536490A JPWO2015037370A1 (ja) 2013-09-10 2014-08-07 電解コンデンサおよびエポキシ樹脂組成物
CN201480049812.3A CN105531779A (zh) 2013-09-10 2014-08-07 电解电容器和环氧树脂组合物
KR1020167009258A KR20160055206A (ko) 2013-09-10 2014-08-07 전해 콘덴서 및 에폭시 수지 조성물

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JP2013-187358 2013-09-10
JP2013187358 2013-09-10

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WO2015037370A1 true WO2015037370A1 (fr) 2015-03-19

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JP (1) JPWO2015037370A1 (fr)
KR (1) KR20160055206A (fr)
CN (1) CN105531779A (fr)
TW (1) TW201512295A (fr)
WO (1) WO2015037370A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
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JP2018117078A (ja) * 2017-01-20 2018-07-26 株式会社トーキン 固体電解コンデンサ
EP3811389A4 (fr) * 2018-06-21 2022-03-23 AVX Corporation Condensateur électrolytique solide
EP3811390A4 (fr) * 2018-06-21 2022-05-04 KYOCERA AVX Components Corporation Condensateur électrolytique solide à propriétés électriques stables à hautes températures
US20230110194A1 (en) * 2020-03-27 2023-04-13 Nippon Chemi-Con Corporation Electrolytic capacitor

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111785524A (zh) * 2020-07-15 2020-10-16 常州华威电子有限公司 一种耐高温的高分子铝固体电容器
CN112164591B (zh) * 2020-10-09 2023-03-10 福建国光新业科技股份有限公司 一种提升叠层铝电解电容器高温高湿耐受能力的制造方法
CN118098828B (zh) * 2024-04-10 2024-08-30 上海永铭电子股份有限公司 一种高频低esr有机片式固体钽电解电容器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04239518A (ja) * 1991-01-23 1992-08-27 Nec Corp 電子部品封止用エポキシ樹脂組成物及びその製造方法
JP2003249423A (ja) * 2001-12-20 2003-09-05 Toyota Motor Corp 蓄電素子およびその製造方法
WO2008108089A1 (fr) * 2007-03-08 2008-09-12 Panasonic Corporation Condensateur à boîtier moulé et son procédé d'utilisation
JP2011054726A (ja) * 2009-09-01 2011-03-17 Kyocera Chemical Corp 電気二重層キャパシタ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101329951B (zh) * 2008-05-23 2011-05-04 电子科技大学 一种高频无极性有引线固体钽电解电容器及其制造方法
CN102030968B (zh) * 2009-09-30 2012-02-01 北京科化新材料科技有限公司 用于半导体器件封装的环氧树脂组合物及其制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04239518A (ja) * 1991-01-23 1992-08-27 Nec Corp 電子部品封止用エポキシ樹脂組成物及びその製造方法
JP2003249423A (ja) * 2001-12-20 2003-09-05 Toyota Motor Corp 蓄電素子およびその製造方法
WO2008108089A1 (fr) * 2007-03-08 2008-09-12 Panasonic Corporation Condensateur à boîtier moulé et son procédé d'utilisation
JP2011054726A (ja) * 2009-09-01 2011-03-17 Kyocera Chemical Corp 電気二重層キャパシタ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018117078A (ja) * 2017-01-20 2018-07-26 株式会社トーキン 固体電解コンデンサ
EP3811389A4 (fr) * 2018-06-21 2022-03-23 AVX Corporation Condensateur électrolytique solide
EP3811390A4 (fr) * 2018-06-21 2022-05-04 KYOCERA AVX Components Corporation Condensateur électrolytique solide à propriétés électriques stables à hautes températures
US11342129B2 (en) 2018-06-21 2022-05-24 KYOCERA AVX Components Corporation Solid electrolytic capacitor with stable electrical properties at high temperatures
US20230110194A1 (en) * 2020-03-27 2023-04-13 Nippon Chemi-Con Corporation Electrolytic capacitor
US12400801B2 (en) * 2020-03-27 2025-08-26 Nippon Chemi-Con Corporation Electrolytic capacitor

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