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WO2015016404A1 - Nanoparticules d'oxyde de cuivre, encre associée et procédé pour préparer un film mince de cuivre par réduction d'un film mince d'oxyde de cuivre sous l'effet d'une irradiation par des micro-ondes - Google Patents

Nanoparticules d'oxyde de cuivre, encre associée et procédé pour préparer un film mince de cuivre par réduction d'un film mince d'oxyde de cuivre sous l'effet d'une irradiation par des micro-ondes Download PDF

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Publication number
WO2015016404A1
WO2015016404A1 PCT/KR2013/006945 KR2013006945W WO2015016404A1 WO 2015016404 A1 WO2015016404 A1 WO 2015016404A1 KR 2013006945 W KR2013006945 W KR 2013006945W WO 2015016404 A1 WO2015016404 A1 WO 2015016404A1
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WIPO (PCT)
Prior art keywords
cuo
thin film
ink
nanoparticles
microwave irradiation
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2013/006945
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English (en)
Korean (ko)
Inventor
한윤봉
모하매드바즘
홍아라
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Industry Academic Cooperation Foundation of Chonbuk National University
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Industry Academic Cooperation Foundation of Chonbuk National University
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Publication of WO2015016404A1 publication Critical patent/WO2015016404A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G3/00—Compounds of copper
    • C01G3/02—Oxides; Hydroxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/10—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer

Definitions

  • the present invention relates to a method of preparing copper oxide (CuO) nanoparticles and using them to produce CuO nanoparticle ink.
  • the present invention also relates to a method of reducing a CuO thin film printed on a substrate using the CuO nanoparticle ink to a metallic copper (Cu) thin film through microwave irradiation.
  • the present invention also relates to a gel pen manufacturing method using the CuO nanoparticle ink.
  • Ink-printing of functional materials overcomes the shortcomings of conventional photolithography processes by direct printing of various patterns and studies and uses them as a low cost alternative. Ink printing will be widely used in the manufacture of conductive circuits for the electronics industry.
  • conductive ink-jet inks consist of a liquid carrier (water or organic solvent) that determines the dispersion or dissolution of components that provide the basic properties of the ink and the desired function.
  • Most conductive inks use silver (Ag), gold (Au) and platinum (Pt), which are expensive and have limited application in terms of mass production and economics.
  • copper metal is a good substitute for silver, gold and platinum. The only drawback with copper is that it oxidizes easily.
  • copper nanoparticles require toxic compounds, surfactants or post-synthetic surface treatment to prevent oxidation. Therefore, after printing and drying the liquid, the copper nanoparticles are covered with an organic stabilizer and an oxide that act as an insulator. The filtration process is limited due to the presence of organics and oxides between the particles. Additional post-printing composites, such as vacuum sintering, photosintering and pulsed electromagnetic sintering, are required to obtain conductive patterns. As a result, the production of conductor copper-based inks is expensive.
  • the present invention for solving the above problems is an object of the present invention to provide a method for producing copper oxide (CuO) nanoparticles without additional oxidation problems in an inexpensive solution method.
  • An object of the present invention is to provide a method for producing an electronic ink using CuO nanoparticles.
  • the purpose is to convert the printed CuO nanoparticles to copper nanoparticles through vacuum microwave irradiation.
  • the present invention for achieving the above object provides a copper oxide (CuO) nanoparticles produced by a simple solution method.
  • the present invention provides the CuO nanoparticles, wherein the CuO nanoparticles are characterized by a size of 5 to 8 nm in a black colloidal state.
  • step 1 of mixing acetic acid with an aqueous solution of copper acetate; 2 steps of heating the resultant of the first step to 9 (rC, reflux; and 3 steps of adding a metal hydroxide while maintaining the resultant of the second step at 90 ° C .; It provides a method for producing CuO nanoparticles comprising the fourth step after centrifugation and washing.
  • the metal hydroxide in the method for preparing copper oxide (CuO) nanoparticles, is provided with CuO nanoparticles manufacturing method, characterized in that any one selected from LiOH, NaOH, KOH, RbOH or CsOH. do.
  • the copper oxide (CuO) nanoparticles manufacturing method the copper acetate solution has a concentration of 0.2M
  • the first step is to mix the copper acetate solution and acetic acid in a ratio of 100: 0.5 It provides a method for producing CuO nanoparticles, characterized in that.
  • the present invention provides a method for producing CuO nanoparticles, characterized in that the black colloidal solution obtained after reflux for 10 to 15 minutes in the method of producing CuO nanoparticles is sonicated for 15 minutes.
  • the present invention provides an electronic ink prepared by mixing the CuO nanoparticles and an ink solvent.
  • the present invention is the electronic ink, the ink solvent is 30-40 wt% water, ethanol
  • the present invention provides the electron ink, wherein the CuO nanoparticle concentration is 25-35 wt% in the electron ink.
  • the present invention provides the electronic ink, wherein the CuO nanoparticles and the ink solvent are homogenized by using a homogenizer (Thinky ARE-100 Conditioning Mixer).
  • a homogenizer Thinky ARE-100 Conditioning Mixer
  • the present invention provides an electron ink, wherein in the electron ink, ethylene glycol serves as a reducing agent for reducing CuO to copper.
  • the present invention provides an electronic ink, wherein in the electronic ink, ethylene glycol can also use a solvent based on other glycols (diethylene glycol, propylene glycol).
  • the thin film deposition using the electronic ink is performed by spin coating, spray printing, ink pen, inkjet printing, screen printing, -to- (R2R), offset, etc. It provides an electronic ink, characterized in that can be used.
  • the electron ink in the thin film manufacturing process by spin coating of the electron ink, is microwave in a vacuum state on a CuO thin film deposited by spin coating on a glass substrate. It provides a thin film manufacturing process characterized in that to investigate.
  • the present invention provides a device characterized in that the vacuum microwave equipment is manufactured using a device including a microwave generator in the thin film manufacturing process of the electronic ink.
  • the pressure is atmospheric pressure or a vacuum pressure range provides an apparatus that is characterized by 1 X 10- 1 to 1 X 10- 5 Pa.
  • the present invention provides a device characterized in that a thin film including CuO nanoparticles is rapidly heated by microwave irradiation, and ethylene glycol present in the thin film is heated to a boiling point.
  • the present invention provides an apparatus, wherein in the vacuum microwave apparatus, ethylene glycol heated to the boiling point dehydrates acetaldehyde. ⁇ 25> In the present invention, the acetaldehyde in the reduction process of the CuO nanoparticle ink
  • the present invention provides a preparation of a CuO nanoparticle gel pen for producing a CuO nanoparticle ink pen, wherein the electronic ink is prepared using a gel pen having a 300 tip.
  • the present invention provides a gel pen characterized in that the CuO nanoparticle gel pen is used for paper, glass, polymer, and silicon substrates.
  • the present invention provides an electrode fabricated on paper with the CuO nanoparticle gel pen.
  • an electrode made of a CuO nanoparticle gel pen is provided.
  • the electrode made of the nanoparticle gel pen is irradiated with microwaves at 54.31 y Q. to provide a resistance of cm.
  • an electrode made of a CuO nanoparticle gel pen has an electric resistance improved as the microwave irradiation time increases, and provides an electrode having a constant resistance when the microwave irradiation time is 60 seconds or more.
  • the electrode produced by continuous printing with the CuO nanoparticle gel pen provides a characteristic that the electrical resistance is improved as the number of continuous printing.
  • the continuous printing is filled with pores formed in the thin film as the number of times increases Dense copper thin film on paper substrate Provide the properties that are created in the.
  • the present invention provides a method for producing CuO nanoparticles by a solution method having a simple process and low cost.
  • the present invention provides a method for producing an ink which is economical, environmentally friendly, long-term oxidation-free, and stable at room temperature by mixing the CuO nanoparticles with a predetermined ink solvent.
  • the present invention provides a method for reducing a CuO thin film printed on a substrate using the CuO nanoparticle ink to a metallic copper (Cu) thin film through microwave irradiation.
  • the present invention also provides a method for preparing an ink gel pen with the CuO nanoparticle ink.
  • FIG. 1 is a view illustrating a method for preparing copper oxide nanoparticles, thin film deposition, and microwave irradiation according to an embodiment of the present invention.
  • FIG. 2 illustrates a cross-sectional FESEM image and EDX analysis results after microwave irradiation of a thin film spin-coated on a glass substrate with a copper oxide nanoparticle ink according to an embodiment of the present invention
  • (a) spin The figure shows coating deposition, (b) 1 minute microwave irradiation, (c) 2 minutes microwave irradiation, (d) 3 minutes microwave irradiation, and (e) 4 minutes microwave irradiation.
  • FIG. 3 shows low resolution and high resolution surface FESEM images after microwave irradiation on a thin film spin-coated on a glass substrate with a copper oxide nanoparticle ink according to an embodiment of the present invention.
  • 1 minute microwave irradiation (c) 2 minutes microwave irradiation, (d) 3 minutes microwave irradiation and (d) 4 minutes microwave irradiation.
  • FIG. 4 is a graph showing an element composition comparison graph by surface EDX analysis after microwave irradiation of a thin film spin-coated on a glass substrate with a copper oxide nanoparticle ink according to an embodiment of the present invention.
  • FIG. 5 is a graph showing X-ray emission graphs after microwave irradiation on a thin film spin-coated deposited on a glass substrate with a copper oxide nanoparticle ink according to an embodiment of the present invention.
  • FIG. 8 is an electrode diagram of a copper oxide nanoparticle gel pen on a paper substrate according to an embodiment of the present invention.
  • FIGS. 9 and 10 illustrate the electrical resistance of a paper substrate according to one embodiment of the present invention obtained by irradiating microwaves to an electrode made of a copper oxide nanoparticle ink pen using a 2-point probe. Drawing.
  • FIG. 11 is a diagram illustrating electrical resistance measurements and calculations using a 2-point probe of an electrode made of a copper oxide nanoparticle gel pen on a paper substrate according to an embodiment of the present invention.
  • FIG. 12 illustrates surface and cross-sectional FESEM images of structural changes after 1 minute microwave irradiation on an electrode made of a copper oxide nanoparticle gel pen on a paper substrate according to an embodiment of the present invention.
  • (1) One time print (2) Two times continuous printing (3) Three times continuous printing is shown.
  • FIG. 13 is a view showing optical and FESEM images of an electrode made of a gel pen on a paper substrate according to an embodiment of the present invention.
  • One embodiment of the present invention provides a method for preparing CuO nanoparticles by a simple solution method.
  • the CuO nanoparticles are synthesized by a low solution solution using copper acetate as a precursor.
  • NaOH sodium hydroxide
  • ⁇ 5 1> by adding a solvent to the CuO nanoparticles made by the above method to form an electronic ink, depositing it as a thin film, drying the deposited thin film, and depositing the deposited CuO thin film under vacuum It consists of irradiating microwaves and sintering them into Cu thin films. It provides a method for producing a CuO nanoparticle ink comprising the step of homogenizing and sonicating the reaction solution and centrifugation and washing.
  • the step of depositing the CuO nanoparticle ink made by the above method as a thin film the step of drying the deposited thin film, and sintering the deposited CuO thin film by microwave irradiation in a vacuum to form a Cu thin film It consists of steps.
  • FIG. 1 is a diagram showing steps 1 to 3 described above showing a method of synthesizing copper oxide nanoparticles, an electron ink formulation, and a microwave irradiation process.
  • a mixed solution is prepared while stirring 100 ml of 0.02 M copper acetate solution and 0.5 ml of 35% acetic acid aqueous solution at room temperature.
  • Step 1 Stir well the mixture of copper acetate solution and acetic acid solution while heating slowly under reflux reaction (Step 2).
  • the heating temperature of the mixture is preferably set to 90 ° C to 120 ° C, in this embodiment was heated to a temperature of 90 ° C.
  • 0.5 g of metal hydroxide Pal let is added to the mixture.
  • the metal hydroxide may be LiOH, NaOH, K0H, RbOH or CsOH pallet, in this embodiment was added NaOH 3 ⁇ 4lets.
  • step 3 a black solution is produced (step 3). It can be seen that the formation of the CuO nanoparticles is made through such a color change.
  • the temperature reaction time, concentration reaction conditions are only one embodiment, and do not represent all of the technical ideas of the present invention.
  • the resultant was centrifuged at 3000 rpm for 2 minutes and washed with water and ethanol to obtain black colloidal CuO nanoparticles.
  • the size of the obtained CuO nanoparticles is 5 to 8 nm.
  • the ink solvent may be prepared by mixing water, ethanol, ethylene glycol, and polyvinylpyrrolidone, but are not limited thereto.
  • the ink solvent is 30-40, ethanol 6-9w%, EG 22-27w%, and PVP 1-3 ⁇ .
  • CuO nanoparticles and ethylene glycol are prepared in an ink ratio of 1.15: 1.
  • CuO nanoparticles, water, ethanol, ethylene glycol and polyvinylpyrrolidone may be combined with, but not limited to, wt% (mass ratio) of 29.0: 36.4: 7.3: 25.5: 1.8, respectively. .
  • the electronic ink mixture is homogenized at 2000 rpm for 2 minutes in a homogenizer (Thinky ARE-100 Conditon ionizing Mixer).
  • Ethylene glycol acts as a reducing agent to convert CuO to copper.
  • Other glycol-based solvents can be used.
  • the CuO nanoparticle ink makes a thin film by spin coating on a substrate.
  • the substrate to be used may be glass, paper, fiber, silk, polymer, silicon, or the like.
  • CuO Thin film deposition using nanoparticle ink may use spin coating, spray printing, ink pen, ink-jet printing, screen printing, and the like.
  • the deposited thin film is dried to evaporate low boiling solvents such as water and ethanol.
  • microwave irradiation was performed under atmospheric pressure or vacuum.
  • the vacuum pressure range is 1 ⁇ 10—1 to 1 ⁇ 10 Pa, and the vacuum used in one embodiment is 3.5 ⁇ 10 Pa.
  • Vacuum microwave equipment was produced using a microwave oven.
  • Microwave irradiation heats up thin films containing CuO nanoparticles quickly and heats the ethylene glycol present in the thin films to the boiling point. When the boiling point of ethylene glycol is reached, the resulting acetaldehyde (C3 ⁇ 4CH0) is dehydrated. Acetaldehyde converts CuO nanoparticles into pure Cu phase. In order to produce dense, interconnected Cu films, continuous irradiation of microwaves is required. Reduction reaction by microwave is as follows.
  • FIG. 2 is a view showing a cross-sectional FESEM and EDX analysis results after microwave irradiation on a thin film spin-coated on a glass substrate with the CuO nanoparticle ink of the present embodiment.
  • FIG. 3 (a ′ 1) shows that the thickness of the deposited thin film is 4 to 5 ⁇ in the FESEM image of the deposited copper oxide thin film.
  • 2 (a-2) and 2 (a-3) show the elemental composition of the deposited thin film. It shows that the thickness of copper (a-2) and oxygen (a-3) is equal to the thickness of the thin film deposited with 4 to 5 ⁇ .
  • 2 (bl), (b-2) and (b-3) are cross-sectional FESEM and EDX results after 1 minute microwave irradiation of the deposited copper oxide thin film of this example.
  • the upper layer shows a thickness of 0.5 to 0.65iim or less with the reduced and sintered copper phase.
  • the lower layer shows that the CuO layer which was not reduced exists.
  • 2 (cl), (c-2) and (c-3) are cross-sectional FESEM and EDX results after 2 minutes of microwave irradiation on the deposited CuO thin film. As the microwave irradiation time increases, most thin films having a thickness of 1 to 2 mu ⁇ are reduced and sintered to show only the Cu phase (c-2) without the oxygen (0) phase (c ⁇ 3).
  • FIG. 3 shows the reduction and sintering of the Cu metal phase as a result of further increasing the microwave irradiation time.
  • the oxygen element is detected by detecting oxygen contained in the glass substrate.
  • the microwave irradiated for 2 minutes was found to penetrate up to 2 ym of the thin film. Increased microwave irradiation time can reduce and sinter thicker CuO thin films.
  • FIG. 3 shows a low resolution and high resolution surface FESEM image after microwave irradiation in a thin film spin-coated on a glass substrate with CuO nanoparticle ink according to the present embodiment.
  • conductive thin films must have a three-dimensional interconducting path between Cu nanoparticles. The conduction path appears after 1 minute of microwave irradiation.
  • FIG. 3 (a) shows small, spherical nanoparticles.
  • Figure 3 (b) shows the change in nanoparticles continuous and sintered particle shape after 1 minute microwave irradiation.
  • 3 (ce) shows that as the microwave irradiation time increases, the thin film becomes dense and the particles grow in association.
  • FIG. 5 shows an X-ray diffraction graph according to a change in irradiation time after microwave irradiation on a thin film spin-coated on a glass substrate with CuO nanoparticle ink according to the present embodiment.
  • the XRD diffraction peaks observed in the deposited CuO thin film show the CuO monoclinic phase.
  • Other impurities except CuO characteristic peaks or other crystal phase peaks such as copper oxide (I) (Cu 2 0) copper hydroxide (II) (Cu (0H) 2 ) were not observed.
  • the deposited CuO nanoparticles show high purity crystalline.
  • FIG. 6 is an electrical resistance (R) measured by a 4-point probe after microwave irradiation of a thin film spin-coated on a glass substrate with CuO nanoparticle ink according to an embodiment of the present invention (R). ) And (b) resistance (p).
  • the deposited film was ⁇ 10 2 ⁇ . It has an electrical resistance of ⁇ . After 1 minute to 4 minutes of microwave irradiation, the electrical resistance is substantially improved. In cm, the resistance is 2 to 3 times higher than the bulk state.
  • FIG. 7 illustrates a method of applying CuO nanoparticle ink to a gel pen according to the present embodiment, depositing a thin film on a paper substrate, and microwave irradiation.
  • CuO prepared according to the ink formulation of Figure 2 Gel pens are made using old particle ink. Gel pens were used gel pens (Dong-A Co., Ltd.) having a 300 ⁇ tip. Before filling the CuO nanoink, the pen tip of the gel pen is sonicated under water and ethanol to remove the commercial ink. Fill the gel pen with the commercial ink removed from the bottom using a syringe with CuO nanoparticle ink. Gel pens are used to create CuO nanoparticle thin films on paper substrates. The gel pen can be used not only for paper substrates but also for glass, polymer and silicon substrates. The formed CuO thin film is sintered by microwave irradiation in a vacuum state to produce a Cu thin film.
  • FIG. 8 shows an example of an electrode made of CuO nanoparticle gel pen on a paper substrate according to the present embodiment.
  • a 16 mm long, 2 ⁇ wide electrode was prepared with a gel pen to check the performance of the electrode, including its shape and electrical properties.
  • FIGS. 9 and 10 illustrate an electrical resistance measured by a 2-point probe by irradiating microwaves to an electrode made of a CuO nanoparticle ink pen on a paper substrate according to an embodiment of the present invention. It is a figure which shows (R) and (b) resistance degree (p).
  • FIG. 11 shows electrical resistance (R) and resistance (p) measured by a 2-point probe of an electrode manufactured by continuously printing a CuO nanoparticle gel pen on a paper substrate according to the present embodiment. To burn. Each continuous printing method is carried out after 2 minutes of microwave irradiation in a vacuum state. 11 shows that the electrical resistance improves as the number of continuous prints increases. Also, when printing more than 3 times continuously, the resistance is 10 ⁇ . Constant at ⁇ , which is six times higher than the bulk state.
  • FIG. 12 illustrates surface and cross-sectional FESEM images of structural changes after 1 minute microwave irradiation on electrodes made of CuO nanoparticle gel pens on a paper substrate according to an embodiment of the present invention. As the number of consecutive prints increases, the pores formed in the thin film are filled, indicating that a small, dense copper thin film is formed on the paper substrate. Surface and cross-sectional FESEM images support the electrical properties observed so far.
  • FIG. 13 is an optical photograph of an electrode made of a gel pen on a paper substrate according to the present embodiment
  • Electrodes prepared after 1 minute microwave irradiation show the color and uniform printing characteristics of the metal Cu.
  • the present invention is a technique relating to the production of ink and thus the recovery of copper, and is applicable to the production and recycling industry of ink.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)

Abstract

La présente invention a trait à la synthèse de nanoparticules d'oxyde de cuivre (CuO) ayant une taille de particule de 2 à 20 nm. La présente invention concerne un procédé de fabrication d'encre à partir des nanoparticules de CuO et d'un solvant mélangé comprenant de l'eau, de l'éthanol et de l'éthylène glycol. L'éthylène glycol joue un rôle d'agent réducteur. La présente invention concerne en outre la préparation d'un film mince sur un substrat en utilisant une encre de nanoparticules de CuO mélangées et la formation d'un film mince de cuivre pur en appliquant un rayonnement de micro-ondes à différents intervalles de temps. Un film mince d'encre CuO préparé par centrifugation possède une résistance de 4,65 μΩ·cm, c'est-à-dire 2 à 3 fois plus élevée que celle en vrac, lorsque le film mince de CuO est irradié par des micro-ondes pendant au moins trois minutes. L'encre a été utilisée dans un stylo à gel afin d'être déposée sur différents substrats. Une électrode, déposée sur un substrat en papier au moyen du stylo à encre, a été déposée en continu trois fois et irradiée par des micro-ondes. Cette électrode présente une résistance de 10 μΩ, c'est-à-dire six fois plus élevée que celle en vrac.
PCT/KR2013/006945 2013-07-29 2013-08-01 Nanoparticules d'oxyde de cuivre, encre associée et procédé pour préparer un film mince de cuivre par réduction d'un film mince d'oxyde de cuivre sous l'effet d'une irradiation par des micro-ondes Ceased WO2015016404A1 (fr)

Applications Claiming Priority (2)

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KR10-2013-0089525 2013-07-29
KR1020130089525A KR101582637B1 (ko) 2013-07-29 2013-07-29 CuO 나노입자와 그의 잉크 및 마이크로파 조사를 통한 CuO 박막으로부터 Cu박막으로 환원시키는 이들의 제조방법

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CN110342564A (zh) * 2019-07-28 2019-10-18 陕西理工大学 一种片状结构CuO纳米光热转换材料及其制备方法
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104698054A (zh) * 2015-04-07 2015-06-10 天津理工大学 一种纳米氧化铜修饰丝网印刷电极的非酶葡萄糖传感器
CN110342564A (zh) * 2019-07-28 2019-10-18 陕西理工大学 一种片状结构CuO纳米光热转换材料及其制备方法
US10995010B1 (en) 2020-06-26 2021-05-04 King Saud University Synthesis of copper oxide nanoparticles
US11718537B2 (en) 2020-06-26 2023-08-08 King Saud University Synthesis of copper oxide nanoparticles

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