WO2015014410A1

WO2015014410A1 - Holding arrangement for substrates

Info

Publication number: WO2015014410A1
Application number: PCT/EP2013/066293
Authority: WO
Inventors: Oliver Heimel; Andre Brüning
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2013-08-02
Filing date: 2013-08-02
Publication date: 2015-02-05
Anticipated expiration: 2016-02-02
Also published as: CN105452524B; KR102190806B1; TW201518531A; KR20160040626A; CN105452524A

Abstract

A holding arrangement (10) for holding a substrate (20) during vacuum layer deposition is provided. The holding arrangement (10) includes a frame (30) configured to support the substrate (20), and one or more holding devices (40) attached to the frame (30) and configured to provide a holding force to the substrate (20). Each holding device (40) includes an elastic unit (41) configured to provide the holding force, and engaging means (42) configured to be engaged for providing a release force (52) opposing the holding force to release the substrate (20).

Description

HOLDING ARRANGEMENT FOR SUBSTRATES

TECHNICAL FIELD OF THE INVENTION

[0001] Embodiments of the present invention relate to a holding arrangement for holding a substrate during processing, e.g., layer deposition. Embodiments of the present invention particularly relate to a holding arrangement for holding a substrate during vacuum layer deposition.

BACKGROUND OF THE INVENTION

[0002] Several methods are known for depositing a material on a substrate. For instance, substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process etc. Typically, the process is performed in a process apparatus or process chamber, where the substrate to be coated is located. A deposition material is provided in the apparatus. A plurality of materials, but also oxides, nitrides or carbides thereof, may be used for deposition on a substrate. Further, other processing steps like etching, structuring, annealing, or the like can be conducted in processing chambers.

[0003] Coated materials may be used in several applications and in several technical fields. For instance, an application lies in the field of microelectronics, such as generating semiconductor devices. Also, substrates for displays are often coated by a PVD process. Further applications include insulating panels, organic light emitting diode (OLED) panels, substrates with TFT, color filters or the like.

[0004] Typically, glass substrates can be supported on carriers during processing thereof. A carrier supports the glass or the substrate and is driven through the processing machine. Thereby, the carrier drives the glass or substrate. The carriers typically form a frame or a plate, which supports a surface of the substrate along the periphery thereof or, in the latter case, supports the surface as such. Particularly, a frame shaped carrier can also be used to mask a glass substrate, wherein the aperture in the carrier, which is surrounded by the frame, provides an aperture for coating material to be deposited on the exposed substrate portion or an aperture for other processing steps acting on the substrate portion, which is exposed by the aperture. Further, holding arrangements are provided for fixing the substrate to the frame and holding it in place during the deposition process.

[0005] To fix the substrate in the carrier there are different holding arrangements available, e.g., glass holders. The simplest holder is a suitable bended flat spring. This type of spring needs a pusher acting from the front side of the carrier/glass to open it. Therefore a hole in the carrier frame is needed. During processing, coating material passes through said hole, which results in a coating of the bended flat spring. When a pusher is inserted for opening the holder, the coating is scratched off the bended flat spring and thus, particles are generated which impede a coating quality. Avoiding particle generation is an important consideration for customers. Other known holders which are operated from the backside of the carrier are very expensive to manufacture and in maintenance.

[0006] In view of the above, it is an object to provide a holding arrangement, particularly a holding arrangement for holding a substrate during vacuum layer deposition, which overcomes at least some of the problems in the art.

SUMMARY OF THE INVENTION

[0007] In light of the above, a holding arrangement for holding a substrate during vacuum layer deposition according to independent claim 1, and a method for releasing a substrate hold by said holding arrangement according to independent claim 17 are provided. Further aspects, advantages, and features of the present invention are apparent from the dependent claims, the description, and the accompanying drawings. [0008] According to one embodiment, a holding arrangement for holding a substrate during vacuum layer deposition is provided. The holding arrangement includes a frame configured to support the substrate and one or more holding devices attached to the frame and configured to provide a holding force to the substrate. Each holding device includes an elastic unit configured to provide the holding force, and engaging means configured to be engaged for providing a release force opposing the holding force to release the substrate.

[0009] According to another embodiment, a holding arrangement for holding a substrate during vacuum layer deposition is provided. The holding arrangement includes a frame configured to support the substrate and one or more holding devices attached to the frame and configured to provide a holding force to the substrate, wherein there are no through holes formed in said frame at a position corresponding to the one or more holding devices.

[0010] According to another aspect, an apparatus for depositing a layer on a substrate is provided. The apparatus includes a chamber adapted for layer deposition therein, a holding arrangement as described above within the chamber, and a deposition source for depositing material forming the layer.

[0011] According to yet another aspect, a method for releasing a substrate being held by a holding arrangement having an elastic unit and engaging means is provided. The method includes: providing, by means of the elastic unit, a holding force to the substrate, engaging the engaging means, applying a release force to the engaging means opposing the holding force, and releasing the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the invention and are described in the following: illustrates a holding arrangement according to embodiments described herein and with a substrate provided in a substrate area of the holding arrangement; shows a holding arrangement and an external unit for releasing the substrate according to embodiments described herein; shows a detailed view of a holding arrangement according to embodiments described herein being engaged by an external unit for releasing the substrate; shows a detailed view of a holding arrangement according to embodiments described herein being engaged and pulled by an external unit for releasing the substrate; shows an example of a holding device of a holding arrangement according to embodiments described herein; shows another example of a holding device of a holding arrangement according to embodiments described herein; shows a view of an apparatus for depositing a layer of material on a substrate utilizing a holding arrangement according to embodiments described herein; and shows a flowchart of a method for releasing a substrate according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0013] Reference will now be made in detail to the various embodiments of the invention, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the invention and is not meant as a limitation of the invention. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations. [0014] According to typical embodiments, which can be combined with other embodiments described herein, the substrate thickness can be from 0.1 to 1.8 mm and the holding arrangement, and particularly the holding devices, can be adapted for such substrate thicknesses. However, it is particularly beneficial when the substrate thickness is about 0.9 mm or below, such as 0.5 mm or 0.3 mm and the holding arrangement, and the holding devices are specifically adapted for such substrate thicknesses.

[0015] According to some embodiments, large area substrates may have a size of at least 0.174 m². Typically the size can be about 1.4 m 2 to about 8 m 2 , more typically about 2 m to about 9 m² or even up to 12 m². Typically, the rectangular substrates, for which the mask structures, apparatuses, and methods according to embodiments described herein are provided, are large area substrates as described herein. For instance, a large area substrate can be GEN

5, which corresponds to about 1.4 m substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.39 m substrates (1.95 m x 2.25 m), GEN 8.5, which corresponds to about 5.5m² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.

[0016] Typically, the substrate may be made from any material suitable for material deposition. For instance, the substrate may be made from a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.

[0017] Figure 1 illustrates a holding arrangement 10 or carrier according to embodiments described herein. [0018] The holding arrangement 10 for holding a substrate 20 during vacuum layer deposition includes a frame 30 configured to support the substrate 20 and one or more holding devices 40 attached to the frame 30 and configured to provide a holding force to the substrate 20. According to some embodiments, each holding device 40 includes an elastic unit configured to provide the holding force, and engaging means 42 configured to be engaged for providing a release force 52 opposing the holding force to release the substrate 20. According to some embodiments, which could be combined with other embodiments described herein, the elastic unit and the engaging means 42 are formed of one piece. According to some other embodiments, the elastic unit and the engaging means 42 are formed of two or more pieces. As an example, the elastic unit and the engaging means 42 could be formed independently from each other, i.e., as two separate pieces or entities, and could then be attached to each other, e.g., by welding, soldering, screws, adhesives, clamping and the like, or combinations thereof. "Engaging means" as used herein may refer to the singular or plural form of "means", i.e., to one single engaging means or to two or more engaging means.

[0019] According to some embodiments, which could be combined with other embodiments described herein, the holding devices 40 are provided at a backside of the frame 30. A front side of the frame 30 is the side that is exposed to a deposition source during layer deposition, and the backside of the frame 30 is the side that is not exposed to the deposition source during layer deposition. According to some embodiments, the substrate is loaded from said backside into or onto the frame 30. The holding devices 40 can be opened from the backside of the frame 30 so as to release the substrate 20. Hence, a hole in the frame is not needed and no particles are generated during opening or releasing of the holding devices. Thereby, for example the quality of the deposited layers is improved.

[0020] The frame 30 is configured to support the substrate 20. According to some embodiments, the frame 30 defines an aperture opening for accommodating the substrate 20. For instance, the substrate 20 could be positioned within the aperture opening. As an example, the substrate 20 could be positioned within the aperture opening so as to cover the rims or edges thereof to avoid coating of said rims or edges. Accordingly, an edge exclusion mask can be provided by the frame of the carrier. According to some embodiments, a support surface for supporting at least a part of the edge regions of the substrate 20 is provided within the aperture opening. As an example, a cross section of the frame 30 could be L-shaped to provide the support surface.

[0021] According to some other embodiments, as it is for instance shown in figure 1, the substrate 20 is arranged at the backside of the frame 30. According to some embodiments, the substrate 20 is arranged on an upper surface of one side of the frame 30. In both cases, the rims or edges of said substrate 20 do not necessarily have to be covered.

[0022] According to some embodiments, which could be combined with other embodiments described herein, a masking arrangement is provided for covering the rims or edges of the substrate 20 on the opposing side, e.g. the frontside, to exclude said rims or edges from layer deposition. According to some embodiments, the frame 30 itself could serve as a masking arrangement or could provide additional masking. As it is shown in the examples of figures 1 and 2, at least a part of the edge regions of the surface to be processed is covered or masked by the frame 30.

[0023] The holding arrangement 10 in figure 1 includes one or more holding devices 40 attached to the frame 30. For instance, the one or more holding devices 40 could be attached to the backside of the frame 30. According to some embodiments, which could be combined with other embodiments described herein, at least one of the one or more holding devices 40 is firmly attached to the frame 30. The holding device can be attached by holding elements such as screws, soldering, welding, clamping and/or adhesion or a combination thereof.

[0024] According to some embodiments, which could be combined with other embodiments described herein, at least one of the one or more holding devices 40 is attached to the frame 30 moveably substantially parallel to a substrate area, i.e. substantially parallel to the surfaces of the substrate 20, and along the frame 30. This allows positioning of the holding device 40 at different positions of the frame 30, for instance at any edge location of the substrate 20, depending, for instance, on process requirements, area to be coated, etc.

[0025] In the example shown in figure 1 two holding devices 40 are provided at opposite sides (frame elements) of the frame 30. Although two holding devices 40 are shown in figure 1, the present embodiments are not limited thereto. More than two holding devices 40 could be provided at different locations of the frame 30. According to some embodiments, at least one of the two or more holding devices 40 could be provided in a corner region of the frame 30. According to some embodiments, for instance more than one holding device 40 could be provided on a side of the frame 30, i.e., on each side of the substrate 20.

[0026] Figure 2 shows a holding arrangement 10 and an external unit 50 for releasing the substrate 20 according to embodiments described herein.

[0027] According to some embodiments, which could be combined with other embodiments described herein, the external unit 50 is configured to engage or be inserted into the holding device 40, particularly the engaging means 42 of the holding device 40. As an example, the external unit 50 includes an element that is configured to engage or be inserted into the holding device 40, particularly the engaging means 42. For instance, the external unit 50 is L-shaped, wherein one of the parts of the L-shaped external unit 50 is configured to engage or being inserted into the holding device 40. According to some embodiments, which could be combined with other embodiments described herein, the external unit 50 includes a rod or bar-shaped unit 51 configured to engage the holding device 40. As an example, the rod or bar- shaped unit 51 could be one of the parts of the L-shaped external unit 50, particularly the shorter part, as it is shown in figure 2.

[0028] According to some embodiments, which could be combined with other embodiments described herein, the external unit 50 is a hand-held device that can be held and guided by a user to engage the engaging means 42 of the holding device 40 for releasing the substrate 20. According to some other embodiments, the external unit 50 could be provided by a mechanical device, for instance an automated setup or device such as a robotic device, a robot handler, and/or a robot grip.

[0029] According to some embodiments, which could be combined with other embodiments described herein, the engaging means 42 of the holding device 40 is configured to be pulled for providing the release force. As an example, the external unit 50 engages or is inserted into the engaging means 42 of the holding device 40 and is pulled so as to provide the release force counteracting the holding force. By pulling instead of pushing (as described above with reference to the background section of this disclosure), a hole in the frame 30 is not needed, and hence, no particles are generated which would impede a coating process (e.g. sputtering). Thereby, particularly the quality of the deposited layers is improved.

[0030] Figure 3 shows a detailed view of a holding arrangement 10 according to embodiments described herein being engaged by an external unit 50 for releasing the substrate 20.

[0031] The holding arrangement 10 shown in figure 3 includes an elastic unit configured to provide the holding force, and engaging means 42 configured to be engaged for providing a release force opposing the holding force to release the substrate 20. According to some embodiments, the elastic unit and the engaging means 42 are formed of one piece.

[0032] According to some other embodiments, the elastic unit and the engaging means 42 are formed of two or more pieces. As an example, the elastic unit and the engaging means 42 could be formed independently from each other, i.e., as two separate pieces or entities, and could then be attached to each other, e.g., by welding, soldering, screws, adhesives, and the like.

[0033] According to some embodiments, the elastic unit provides a holding force acting on a surface of the substrate 20. In the example shown in figure 3, the holding force is provided to the surface of the substrate 20 via a contact region 43 of the holding device 40. According to some embodiments, the elastic unit is configured to provide the holding force that is substantially perpendicular to the surface of the substrate 20. In the example shown in figure 3, the holding force presses the substrate 20 against the surface of a support part 33 of the frame 30 described later.

[0034] According to some embodiments, which could be combined with other embodiments described herein, the contact region 43 includes a contact unit. For instance, the contact unit includes or is made of flexible material. As an example, the contact unit includes or is made of rubber. One beneficial effect of the contact unit is that damage, and particularly scratches, of the surface of the substrate 20 can be avoided.

[0035] According to some embodiments, which could be combined with other embodiments described herein, at least a part of the elastic unit has a wave-like shape with one or more reversal points. According to some embodiments, the elastic unit has a wave-like shape with three reversal points, as it is shown in figure 3. According to some embodiments, the elastic unit is a bended flat spring. The elastic properties of the elastic unit provide the holding force acting on the surface of the substrate 20.

[0036] According to some embodiments, which could be combined with other embodiments described herein, the elastic unit has one or more through holes 44 for fixation of the holding device 40 to the frame 30. For instance, the one or more through holes 44 are configured for insertion of holding elements, e.g., screws. According to some embodiments, which could be combined with other embodiments described herein, the elastic unit has no through holes and is fixed to the frame 30 by means of soldering, welding, clamping and/or adhesion or a combination thereof.

[0037] According to some embodiments, which could be combined with other embodiments described herein, the engaging means 42 is defined by a region surrounding one of the one or more reversal points. This allows a simple and cost effective manufacturing of the holding device 40, since the engaging means 42 is defined by a region surrounding one of the one or more reversal points, without the need to provide any additional elements.

[0038] According to some embodiments, which could be combined with other embodiments described herein, the elastic unit and the engaging means 42 are formed of one piece. This allows a simple and cost effective manufacturing of the holding device.

[0039] According to some other embodiments, the elastic unit and the engaging means 42 are formed of two or more pieces. As an example, the elastic unit and the engaging means 42 could be formed independently from each other, i.e., as two separate pieces or entities, and could then be attached to each other, e.g., by welding, soldering, screws, adhesives, clamping and the like, or a combination thereof.

[0040] According to some embodiments, which could be combined with other embodiments described herein, the elastic unit includes metal or synthetic material. As an example, the elastic unit and the engaging means 42 being one single piece could at least partially be made of metal or synthetic material.

[0041] According to some embodiments, which could be combined with other embodiments described herein, the frame 30 includes a main part 31 and the support part 33. The main part 31 defines an aperture opening configured to accommodate the substrate 20. According to some embodiments, the support part 33 is attached to a lower surface of the main part 31 and extends into the aperture opening so as to provide a support surface for the substrate 20. However, the main part 31 and the support part 33 could also be made of one single piece, i.e., they could be integrally formed. According to some embodiments, the support part 33 and particularly the support surface of said support part 33 could be used for masking the substrate edges during layer deposition.

[0042] According to some embodiments the support part 33 could be provided exchangeable. Thereby, the frame 30 could be adapted to different applications, e.g., different masking requirements or for holding different types of substrates. For instance, when the edge region to be masked is large and/or when thin substrates are to be processed, a support part 33 could be provided that extends further into the aperture opening than a corresponding support part used when the edge region to be masked is small and/or when thick substrates are to be processed. This greatly enhances flexibility of the holding arrangement 10. [0043] According to some embodiments, which could be combined with other embodiments described herein, the frame 30 has a recess 32 formed therein. The recess is configured to house the holding device 40. This has the particular advantage that the backside of the holding arrangement is substantially planar so that it can be attached for instance to a planar transport device, as it is shown in figure 7 below. Further, the holding device 40 is protected from being hit accidentally, e.g., during handling of the frame 30. According to some embodiments, the recess 32 is configured to provide sufficient space so that the engaging means 42 can be engaged with the external unit 50. According to some embodiments, the recess 32 is formed in the main part 31 of the frame 30.

[0044] According to some embodiments, which could be combined with other embodiments described herein, the frame 30 has at least one edge 34 opposed to at least one of the substrate sides or edges. According to some embodiments, when loading the substrate 20 into the frame 30, there is a distance between the at least one of the substrate sides or edges and the at least one edge 34. As an example, the distance is 1 to 3mm, and particularly 1.5 to 2mm when the substrate 20 is loaded into said frame 30. During processing, particularly the substrate 20 might be heated and is thus subject to thermal expansion. By providing the distance between the at least one of the substrate sides or edges and the at least one edge 34 at the time of loading, breakage of the substrate 20 during processing is avoided.

[0045] According to some embodiments, the at least one edge 34 is a contact edge configured to contact the at least one of the substrate sides or edges to hold the substrate 20 in position. According to some embodiments, which could be combined with other embodiments described herein, two or more edges 34 are provided. As an example, one of said edges could be provided as contact edge, wherein one or more of said edges could be provided having a distance to their opposed substrate sides or edges. This is particularly advantageous for vertically oriented substrates. In this case, the contact edge could be provided for supporting a weight of the substrate along the gravitational vector, wherein one or more of said edges could be provided having a distance to their opposed substrate sides or edges to avoid breaking of the substrate due to thermal expansion.

[0046] According to some embodiments, which could be combined with other embodiments described herein, the holding arrangement for holding a substrate during vacuum layer deposition includes the frame 30 configured to support the substrate 20 and one or more holding devices 40 attached to the frame 30 and configured to provide a holding force to the substrate 20, wherein there are no through holes formed in said frame 30 at the positions of the one more holding devices 40. Thus, there is no hole in the frame through which coating material could pass during processing, and hence, no coating of the bended flat spring occurs. As a result, there is no coating on the bended flat spring which could be scratched off and impede a coating quality. Moreover, it can be avoided that deposited material penetrates in the holes and through the holes, which may cause contamination at the back side of the carrier and/or the substrate.

[0047] According to some embodiments, which could be combined with other embodiments described herein, a method for releasing a substrate 20 held by a holding arrangement including an elastic unit includes providing a holding force to the substrate by the elastic unit and applying a release force opposing the holding force, particularly by pulling with an external unit. Thus, according to embodiments described herein, openings in the frame of the carrier can be avoided while a release mechanism is provided. The release force is according to embodiments described herein, which can be combined with other embodiments described herein, a pulling force provided e.g. by an external unit. This can for example be provided by a holding device with an engagement means according to embodiments described herein.

[0048] Figure 4 shows a detailed view of a holding arrangement 10 according to embodiments described herein being engaged and pulled by an external unit 50 for releasing the substrate 20.

[0049] In the example of figure 4, the external unit 50 is pulled to provide a release force 52 counteracting the holding force provided by the elastic unit. The elastic unit is bent, e.g., upwards, so as to release the substrate 20. Thereby, the substrate 20 can be removed, for instance, after completion of a deposition process.

[0050] Figure 5 shows another example of a holding device 40 of a holding arrangement 10 according to embodiments, which could be combined with other embodiments described herein.

[0051] The holding device 40 is similar to the holding devices shown in figures 3 and 4 and hence, descriptions of identical or similar features or elements given above with reference to figures 3 and 4 also apply to the example shown in figure 5. [0052] As shown in figure 5, the holding device 40 is a bended flat spring having the elastic unit 41 and the engaging means 42. The engaging means 42 is defined by a region surrounding one of the one or more reversal points 46. The flat spring includes a cut-out 47 at a center portion thereof. Thereby, elasticity of the holding device 40 and thus an amount of holding force applied to the substrate can be adjusted by adjusting a size of said cut-out 47.

[0053] Figure 6 illustrates still another example of a holding device 40 of a holding arrangement 10, which could be combined with other embodiments described herein.

[0054] The holding device 40 of figure 6 is similar to the holding devices shown in figures 3, 4 and 5 and hence, descriptions of identical or similar features or elements given above with reference to figures 3, 4 and 5 also apply to the example shown in figure 6.

[0055] As shown in figure 6, the holding device 40 is a bended flat spring having two or more reversal points 46 and a contact region 45 for contacting the substrate. According to some embodiments, which could be combined with other embodiments described herein, the elastic unit has one or more through holes 44 for fixation of the holding device 40 to the frame 30.

[0056] According to some embodiments, which could be combined with other embodiments described herein, the holding device 40 includes a bended end portion. The bended end portion forms the engaging means 42. As an example, the bended end portion forms a loop configured to be engaged by the external unit.

[0057] According to different embodiments, a holding arrangement 10 can be utilized for PVD deposition processes, CVD deposition process, substrate structuring edging, heating (e.g. annealing) or any kind of substrate processing. Embodiments of holding arrangements 10 as described herein and methods of utilizing such holding arrangements 10 are particularly useful for non- stationary, i.e. continuous substrate processing of the vertically oriented large area glass substrates. Non-Stationary processing typically requires that the holding arrangement also provides masking elements for the process.

[0058] Figure 7 shows a schematic view of a chamber 600, e.g. a deposition chamber, according to embodiments. The chamber 600 is adapted for a deposition process, such as a PVD or CVD process. A substrate 20 is shown being located within or at a holding arrangement 10 or carrier according to embodiments described herein on a substrate transport device 620. A deposition source 630, e.g. material source or deposition material source, is provided in processing chamber 612 facing the side of the substrate 20 to be coated. The material source, e.g. the deposition material source, provides deposition material to be deposited on the substrate 20.

[0059] In figure 7, the deposition source 630 may be a target with deposition material thereon or any other arrangement allowing material to be released for deposition on substrate 20. Typically, the material source 630 may be a rotatable target. According to some embodiments, the deposition source 630 may be movable in order to position and/or replace the source. According to other embodiments, the material source may be a planar target.

[0060] According to some embodiments, the deposition material may be chosen according to the deposition process and the later application of the coated substrate. For instance, the deposition material of the source may be a material selected from the group consisting of: a metal, such as aluminum, molybdenum, titanium, copper, or the like, silicon, indium tin oxide, and other transparent conductive oxides. Typically, oxide-, nitride- or carbide-layers, which can include such materials, can be deposited by providing the material from the source or by reactive deposition, i.e. the material from the source reacts with elements like oxygen, nitride, or carbon from a processing gas. According to some embodiments, thin film transistor materials like siliconoxides, siliconoxynitrides, siliconnitrides, aluminumoxide or aluminumoxynitrides may be used as deposition materials.

[0061] Typically, the substrate 20 is provided within or at the holding arrangement 10 or carrier, which can also serve as an edge exclusion mask, particularly for non-stationary deposition processes. Dashed lines 665 show exemplarily the path of the deposition material during operation of the chamber. According to other embodiments, which can be combined with other embodiments described herein, the masking can be provided with a separate edge exclusion mask, which is provided in the processing chamber 612. Thereby, the holding arrangement 10 according to embodiments described herein can be beneficial for stationary processes and also for non-stationary processes.

[0062] As shown in figure 7, the holding devices 40 can be opened from the backside so as to release the substrate 20. Hence, a hole in the frame 30 is not needed and no particles are generated which would impede a coating process (sputtering). Thereby, particularly the quality of the deposited layers is improved.

[0063] Figure 8 shows a flowchart of a method 80 for releasing a substrate according to embodiments described herein.

[0064] The method 80 for releasing the substrate being held using the holding arrangement having the elastic unit and the engaging means includes the blocks of providing 81, by the elastic unit, a holding force to the substrate, engaging 82 the engaging means, applying 83 a release force to the engaging means opposing the holding force, and releasing 84 the substrate.

[0065] According to some embodiments, which could be combined with other embodiments described wherein, applying 83 the release force to the engaging means includes pulling the engaging means to provide the release force. [0066] According to the embodiments described herein, the holding devices of the holding arrangement firmly hold the substrate particularly during a deposition process. Since the holding devices can be opened from the backside of the frame to release the substrate, a hole in the frame is not needed, and hence, no particles are generated which would impede a coating process (sputtering). Thereby, particularly the quality of the deposited layers is improved.

[0067] While the foregoing is directed to embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A holding arrangement (10) for holding a substrate (20) during vacuum layer deposition, the holding arrangement (10) comprising: a frame (30) configured to support the substrate (20); and one or more holding devices (40) attached to the frame (30) and configured to provide a holding force to the substrate (20), each holding device (40) comprising: an elastic unit (41) configured to provide the holding force; and engaging means (42) configured to be engaged for providing a release force (52) opposing the holding force to release the substrate (20).

2. A holding arrangement (10) for holding a substrate (20) during vacuum layer deposition, the holding arrangement (10) comprising: a frame (30) configured to support the substrate (20); and one or more holding devices (40) attached to the frame (30) and configured to provide a holding force to the substrate (20), wherein there are no through holes formed in said frame (30) at positions corresponding to the one or more holding devices.

3. The holding arrangement (10) of claim 2, wherein each holding device (40) comprises at least one of: an elastic unit (41) configured to provide the holding force; and engaging means (42) configured to be engaged for providing a release force (52) opposing the holding force to release the substrate (20).

4. The holding arrangement (10) of claims 1 or 3, wherein the elastic unit (41) and the engaging means (42) are formed of one piece, or wherein the elastic unit (41) and the engaging means (42) are formed of two or more pieces.

5. The holding arrangement (10) of claims 1, 3 or 4, wherein the elastic unit (41) is a bended flat spring.

6. The holding arrangement (10) of claims 1 or 3 to 5, wherein at least a part of the elastic unit (41) has a wave-like shape with one or more reversal points (46).

7. The holding arrangement (10) of claim 6, wherein the engaging means (42) is defined by a region surrounding one of the one or more reversal points (46).

8. The holding arrangement (10) of one of claims 1 or 3 to 7, wherein the engaging means (42) is configured to be engaged by a rod-shaped unit (51).

9. The holding arrangement (10) of one of claims 1 or 3 to 8, wherein the engaging means (42) is configured to be pulled for providing the release force (52).

10. The holding arrangement (10) of one of claims 1 or 3 to 9, wherein the elastic unit (41) comprises one or more through holes (44) for fixation of the holding device (40) to the frame (30).

11. The holding arrangement (10) of one of claims 1 or 3 to 10, wherein the elastic unit (41) comprises a contact region (43, 45) configured to contact the substrate (20) to provide the holding force to the substrate (20).

12. The holding arrangement (10) of claim 11, wherein the contact region (45) comprises a contact unit made of flexible material, preferably rubber.

13. The holding arrangement (10) of one of claims 1 or 3 to 12, wherein the elastic unit (41) comprises metal or synthetic material.

14. The holding arrangement (10) of one of claims 1 to 13, wherein each holding device (40) is positioned in a recess (32) formed in the frame (30).

15. The holding arrangement (10) of claim 14, as dependent on one of claims 1 or 3 to 13, wherein the recess (32) is configured to provide space for engaging the engaging means (42) with an external unit (50, 51).

16. An apparatus for depositing a layer on a substrate (20), comprising: a chamber (600) adapted for layer deposition therein; a holding arrangement (10) according to any of claims 1 to 15 within the chamber (600); and a deposition source (630) for depositing material forming the layer.

17. A method (80) for releasing a substrate (20) being held by a holding arrangement (10) comprising an elastic unit (41) and engaging means (42), the method (60) comprises: providing (81), by means of the elastic unit (41), a holding force to the substrate (20); engaging (82) the engaging means (42); applying (83) a release force (52) to the engaging means (42) opposing the holding force; and releasing (84) the substrate (20).

18. The method (80) of claim 17, wherein applying (83) the release force to the engaging means (42) comprises pulling the engaging means (42).