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WO2015013360A1 - Procédés de traitement de surfaces en verre - Google Patents

Procédés de traitement de surfaces en verre Download PDF

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Publication number
WO2015013360A1
WO2015013360A1 PCT/US2014/047734 US2014047734W WO2015013360A1 WO 2015013360 A1 WO2015013360 A1 WO 2015013360A1 US 2014047734 W US2014047734 W US 2014047734W WO 2015013360 A1 WO2015013360 A1 WO 2015013360A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass surface
glass
etched
sludge
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2014/047734
Other languages
English (en)
Inventor
Jeanne Spadinger Cavuoti
Jun Hou
Yuhui Jin
Jum Sik Kim
Timothy James ORCUTT
Shyamala Shanmugam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Priority to JP2016529851A priority Critical patent/JP2016528146A/ja
Priority to CN201480053148.XA priority patent/CN105593182A/zh
Priority to KR1020167004472A priority patent/KR20160037952A/ko
Publication of WO2015013360A1 publication Critical patent/WO2015013360A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075Cleaning of glass

Definitions

  • Disclosed herein are methods for treating an etched glass surface comprising applying a solution comprising at least one mineral acid to the etched glass surface.
  • the glass surface has been etched with an etchant comprising fluoride ions.
  • the solution comprising at least one mineral acid does not contain fluoride ions.
  • solutions for treating an etched glass surface comprising at least one mineral acid does not contain fluoride ions.
  • etched glass surfaces that have been etched with an etchant comprising fluoride ions, prepared by a process comprising applying a solution comprising at least one mineral acid to an etched glass surface.
  • glass panels may be thinned to a range of about 0.1 mm to about 0.4 mm substrate thickness using hydrofluoric acid (HF).
  • HF hydrofluoric acid
  • the thinning or etching process may produce an insoluble byproduct known as sludge. Sludge is generated from the etching process and can attach to the glass surface, thereby contaminating the glass. It is possible to clean and/or remove sludge from the glass panels after they have been etched by either physical or chemical methods, or both.
  • glass panels may be brush cleaned after etching.
  • Brush cleaning can cause damage to the glass surface that could lead to reduced strength and surface quality of the glass.
  • the previously etched glass may first be rinsed in a water rinse and then brush cleaned.
  • a simple water rinse may work when the contaminants are water soluble.
  • Brush cleaning is often used when the contaminants on the glass surface have poor solubility in water and/or a strong attachment to the glass surface.
  • brush cleaning not only removes contaminants from the glass surface, but it also may introduce scratches or defects onto the glass surface. The scratches or defects may significantly reduce the strength and performance of the glass, even if the shape of the defects is small and/or shallow.
  • Chemical cleaning can overcome some limitations of the physical methods of cleaning.
  • the rinsing liquid is not water, but rather a solution that is able to remove the sludge from the glass surface, and brush cleaning may not be required when a chemical cleaning is used.
  • etched glass surface may, in at least certain
  • the cleaning solution does not contain fluoride ions, such as ions from hydrofluoric acid.
  • solutions for treating an etched glass surface comprising at least one mineral acid comprising at least one mineral acid.
  • the solution does not contain fluoride ions.
  • etched glass surfaces that have been etched with an etchant comprising fluoride ions, prepared by a process comprising treating the etched glass surface with a solution comprising at least one mineral acid.
  • a glass surface after etching, for example etching with HF, may contain or be contaminated with the insoluble sludge produced during the etching process.
  • the sludge may be composed of metal ions from the etched glass, such as K + , Ca 2+ , Al 3+ , and Si 4+ , as well as ions from the etchant, such as ammonium (NH + ) and fluoride (F " ).
  • the sludge from glass and the etchant may comprise Ca 2+ , Al 3+ , and F " . Because the sludge cannot be dissolved in either the base or acid, for example HF, that are used in traditional chemical cleaning solutions, the sludge particles can detach and then reattach to the glass surface during a chemical cleaning process that uses a base and an acid such as HF.
  • the glass surface is not completely cleaned using the current chemical methods, as sludge contaminants that have reattached remain on the glass.
  • the chemical cleaning solution may contain dangerous chemicals such as KOH and/or HF. Traditional chemical cleaning may be dangerous, and the waste treatment expensive.
  • Figure 1 is an X-Ray Diffraction (XRD) spectrum of glass sludge generated from Eagle XG ® glass and HF.
  • Figure 2 is a graph showing the etch rate of Eagle XG ® glass in a used cleaning solution comprising 6M HCI and 12 g/L dissolved Eagle XG ® glass sludge.
  • Figure 3 is a graph showing the dissolution of Eagle XG ® glass sludge at room temperature.
  • Figures 4A and 4B show X-ray Photoelectron Spectroscopy (XPS) results of glass cleaned using different cleaning methods, including glass that was not etched, etched glass (i.e., glass was etched and then rinsed in deionized water for 10 minutes), etched glass cleaned with deionized water plus mechanical agitation, etched glass cleaned with an ultrasonic method, etched glass cleaned in 3M HCI, and etched glass cleaned in 6M HCI.
  • Figure 4A shows the amount of B, Al, Si, and F remaining on the glass surface after cleaning with each method.
  • Figure 4B shows the amount of N, Mg, and Ca remaining on the glass surface after cleaning with each method.
  • Figures 5A and 5B show TOF-SIMS (Time of Flight - Secondary Ion Mass Spectrometry) results of glass cleaned using different cleaning methods, including glass that was not etched, etched glass (i.e., glass was etched and then rinsed in deionized water for 10 minutes), etched glass cleaned with deionized water plus mechanical agitation, etched glass cleaned with an ultrasonic method, etched glass cleaned in 3M HCI, etched glass cleaned in 6M HCI, etched glass cleaned with horizontal brushing, etched glass cleaned with vertical brushing, and etched glass cleaned with a Standard Cleaning 1 ("SC1 ”) megasonic cleaning method.
  • Figure 5A shows the amounts of Al, Si, K, Ca, O, and F remaining.
  • Figure 5B shows the amounts of B, Sr, and Mg remaining.
  • Figure 6 is a surface strength comparison of glass surfaces after different cleaning methods, including an as-drawn sample of Eagle XG ® glass that was not etched, as-etched baseline sample of Eagle XG ® glass, etched glass cleaned by brush cleaning, etched glass cleaned by ultrasonic cleaning, and etched glass cleaned by an HCI rinse.
  • a glass surface After undergoing an etching process, such as etching with HF, a glass surface may still be considered dirty, as the glass surface may contain sludge formed during the etching process. Therefore, it may be desirable to treat or clean a glass surface that has been previously etched.
  • Disclosed herein are novel methods to clean a glass surface after the glass surface has undergone etching with an etchant comprising fluoride ions, wherein the methods may not, in at least certain embodiments, generate defects or scratches on the glass surface and/or may not re- contaminate the glass substrate.
  • the glass surface is cleaned by dissolving the sludge contaminants into a cleaning solution so that the sludge contaminants are chemically unavailable for reattachment to the etched glass surface.
  • the glass surface may be completely cleaned of sludge and not re-contaminated, because the sludge is completely, or substantially completely, dissolved in the cleaning solution.
  • cleaning refers to treating the etched glass surface in a manner so as to reduce the amount of sludge on the etched glass surface.
  • treating refers to exposing the glass surface and/or sludge to the cleaning solution.
  • cleaning may comprise dissolving some or all of the surface sludge generated by etching a glass surface with an etchant comprising fluoride ions, such as HF.
  • the etched glass surface may have been etched with any etchant comprising fluoride ions known to those of ordinary skill in the art.
  • the etched glass surface disclosed herein may have been etched with at least one of HF, HF and mineral acid, buffered HF (such as ammonium fluoride and hydrofluoric acid), ammonium bifluoride, and ammonium fluoride and at least one acid.
  • buffered HF such as ammonium fluoride and hydrofluoric acid
  • the solution disclosed herein for treating the etched glass comprises at least one mineral acid, for example a mineral acid that has a stronger acidity than the etchant.
  • the at least one mineral acid has a pKa less than the 3.16 pKa of HF.
  • the concentration of the at least one mineral acid is at least about 3M, such as at least about 6M.
  • Exemplary and non-limiting mineral acids that may be used according to certain embodiments disclosed herein include hydrochloric acid (HCI) and nitric acid (HNO3).
  • Sulfuric acid (H 2 SO 4 ) may be used in certain embodiments, for example embodiments wherein the sludge does not contain Ca 2+ . This is because H 2 SO 4 may react with Ca 2+ and generate insoluble calcium sulfate (CaSO 4 ). It is contemplated, however, that any mineral acid having a pKa less than HF may be used when the etched glass surface was etched with HF.
  • the cleaning solution disclosed herein may further comprise at least one surfactant.
  • the surfactant may aid the detachment of sludge from the glass surface and/or suspend the sludge particles in the cleaning solution, although it is not required.
  • the suspended sludge particles may, in some embodiments, dissolve more quickly in a cleaning solution comprising at least one surfactant.
  • Exemplary surfactants that may be used in accordance with certain embodiments disclosed herein include fluorinated surfactants, such as FS-10 from DuPont.
  • Other exemplary surfactants may include anionic surfactants, such as sodium dodecyl sulfate, and nonionic surfactants, such as TritonTM X-100.
  • Increasing the temperature of the cleaning solution disclosed herein may, in at least certain embodiments, further accelerate the cleaning process.
  • the temperature of the cleaning solution may be room temperature or higher, such as, for example at least about 22 °C, such as at least about 25 °C, or at least about 30 °C.
  • one component of the sludge generated by the cleaning process may include fluoride from the HF etching process.
  • the sludge containing fluoride may first slightly dissociate and release free fluoride ions at a certain concentration.
  • the cleaning solution comprising at least one mineral acid contains protons (H + ) at a high concentration from the mineral acid ions.
  • the protons may serve as fluoride (F " ) ion scavengers that bind together with the F " ions and form water-soluble HF.
  • the depletion of F " ions may then further promote the dissociation of the sludge until the sludge is almost completely, or in some embodiments completely, dissolved in the cleaning solution.
  • Equation 1 (EQ. 1 ) below represents the general mechanism of forming glass sludge during the process of etching of a glass surface with an etchant comprising fluoride ions, wherein M represents the metal ions.
  • M represents the metal ions.
  • the metal ions from the glass sludge combine together with the fluoride ions from the fluoride-containing etchant, and the compound (MF n ) precipitates because of its strong binding force.
  • Equation 2 (EQ. 2) is the reverse reaction of EQ. 1 , which may also be called the dissociation reaction.
  • the glass precipitate (MF n ) can be dissolved through the reaction shown in EQ. 2.
  • the methods of cleaning glass disclosed herein may be used to clean the sludge generated from the HF etching of any kind of silicate-containing glass.
  • a display glass such as for a liquid crystal display, may be cleaned.
  • the glass may be chosen from aluminosilicate glass and borosilicate glass.
  • Gorilla ® glass may be cleaned, including, for example Gorilla ® glass 2 and Gorilla ® glass 3.
  • the methods disclosed herein may be relatively efficient, as the cleaning solution may dissolute the sludge from the glass surface rapidly, and therefore clean the glass in a short period of time.
  • the cleaning solution disclosed herein may dissolve the sludge from the glass surface in a period of time less than or equal to about 25 minutes, such as less than or equal to about 10 minutes, or less than or equal to about 5 minutes.
  • a large quantity of glass sludge for example, about 4 g/L can be dissolved within about 5 minutes.
  • the methods disclosed herein may not physically damage the glass surface during the cleaning process, or physical damage to the glass may be reduced compared to traditional chemical cleaning methods.
  • the methods described herein may substantially preserve the glass surface without generating defects and/or lowering the strength of the glass surface.
  • the cleaning solution disclosed herein may comprise only one type of mineral acid, such as for example HCI.
  • the cleaning solution disclosed herein comprises 3M, 4.5M, or 6M HCI.
  • the methods for treating an etched glass surface disclosed herein are relatively safer, compared to traditional chemical cleaning methods, as traditional chemical cleaning methods may either use HF and/or KOH at very high temperatures, which may be dangerous.
  • the cleaning solution disclosed herein may be free of HF and/or KOH, and/or the process may be run at room temperature.
  • the cleaning solution disclosed herein may comprise only mineral acid, the cost of raw materials may also be relatively low.
  • the method for treating an etched glass surface disclosed herein generates HF in the cleaning solution.
  • the used cleaning solution may thus optionally be further employed and/or recycled for the etching of additional glass surfaces.
  • treating an etched glass surface with HCI may remove the fluoride residue from the etched glass surface efficiently and also does not negatively affect the surface strength of the etched glass surface, as, for example, traditional brush cleaning may.
  • the sludge may, in certain embodiments disclosed herein, comprise F " and, for example, at least one of Al 3+ , Ca 2+ , Si 4+ , Mg 2+ , and Sr 2+ .
  • F for example, at least one of Al 3+ , Ca 2+ , Si 4+ , Mg 2+ , and Sr 2+ .
  • the sludge may comprise at least one of AIF 3 and SiF .
  • the major component of the sludge may be CaAIF x , wherein x may, for example, range from about 3 to about 5, but is in no way bound by that range.
  • the major component of the sludge may be CaAIF 5 .
  • the minor phase of sludge may be
  • Figure 1 shows an XRD spectrum of an exemplary glass sludge generated from Eagle XG ® glass dissolved in 3M HF and 6M HCI. It is theorized that the major peak at the low angle may be CaAIF x (wherein x is not known), while the minor phase of the sludge is MgAIF 5 (H 2 O)2.
  • the cleaning efficiency refers to the dissolution rate of glass sludge in a cleaning solution.
  • the cleaning efficiency may be further improved by adjusting several factors.
  • One factor that may improve the dissolution rate of the glass sludge is the type of mineral acid used, as the cation from the mineral acid may react with the glass sludge and inhibit the dissolution process.
  • the type of mineral acid used as the cation from the mineral acid may react with the glass sludge and inhibit the dissolution process.
  • Ca 2+ from the CaAIFx can react with SO 4 2" when H 2 SO 4 is used as the at least one mineral acid and form CaSO 4 .
  • H 2 SO 4 may be able to dissolve sludge that does not contain sulfate reactive metal ions such as Ca 2+ .
  • HCI for example, may dissolve Eagle XG ® sludge very quickly because chloride does not react with the metal ions from the sludge.
  • concentration of the mineral acid used is the concentration of the mineral acid used. Increasing the concentration of the mineral acid may reduce the time needed to dissolve the glass sludge. In certain embodiments, for example, the concentration of the mineral acid may be at least about 3M, such as at least about 4.5M or at least about 6M. In at least one exemplary embodiment, the time of dissolving about 4 g/L of Eagle XG ® sludge may be reduced from about 80 minutes to about 10 minutes by increasing the
  • concentration of HCI from about 3M to about 6M.
  • the cleaning solution contains substantially no fluoride ions.
  • the cleaning solution contains no HF.
  • reaction temperature An additional factor that may improve the dissolution rate of the glass sludge is the reaction temperature.
  • the reaction temperature by increasing the reaction temperature from about 22°C to about 30°C, or higher, for example, the dissolution rate may be increased and the dissolution time shortened.
  • agitation such as stirring and/or sonication may also accelerate the dissolution process since the reaction occurs at the interface of solid (i.e., sludge) and liquid (i.e., cleaning solution).
  • the used cleaning solution may be further employed for etching a glass surface by being recycled. Reusing the cleaning solution for etching a glass surface may reduce the cost for raw materials and waste treatment.
  • fluoride-containing sludge may be dissolved into the mineral acid, thereby generating HF in the cleaning solution during the cleaning process.
  • the mixture of HF and mineral acid in the used cleaning solution can etch a glass surface.
  • 1 L of 6M HCI can dissolve about 16g of Eagle XG ® sludge.
  • the etch rate of a used cleaning solution disclosed herein, generated by dissolving 12 g/L of Eagle XG ® sludge in 6M HCI, on Eagle XG ® glass is about 0.1 ⁇ /min. See, for example, Figure 2, which shows the etch rage of a used cleaning solution (6M HCI + 12 g/L dissolved Eagle XG ® sludge) for etching Eagle XG ® glass.
  • the etch rate may be increased by adding additional fluoride ions, such as adding HF, to the used cleaning solution.
  • the methods disclosed herein have many advantages including simplicity and low cost.
  • the solution disclosed herein may be applied to the etched glass surface in any method known to those of ordinary skill in the art.
  • the solution may be applied by dipping the etched glass surface into the solution or by spraying the solution onto the etched glass surface.
  • dipping the glass into the cleaning solution at room temperature, followed by rinsing in de-ionized water may be sufficient to remove glass sludge from the glass surface.
  • the cleaning method disclosed herein may preserve the glass surface as being substantially defect-free. Without applying a brush to physically clean the glass surface, the cleaning method disclosed herein may preserve the glass surface from scratches or other defects during the cleaning process.
  • Eagle XG ® sludge was dissolved in three different solutions: 15 wt% of potassium hydroxide (KOH), 6M of HCI, and 10 wt% of HF.
  • KOH potassium hydroxide
  • 6M HCI
  • 10 wt% of HF 10 wt% of HF.
  • Four g/L of Eagle XG ® sludge was added to each solution (i.e., 0.2g of Eagle XG ® sludge was added to 50ml_ of each solution).
  • Eagle XG ® sludge was completely dissolved in 6M HCI within 10 minutes, resulting in a clear solution. The sludge does not dissolve in the other two solutions over several days, resulting in noticeably cloudy solutions.
  • Figure 3 shows the dissolution of Eagle XG ® sludge in 6M HCI at room temperature.
  • metal ions such as Ca 2+ , Al 3+ , and Mg 2+
  • the dissolution rate of Eagle XG ® sludge can be obtained by monitoring the concentration of the metal ions at different times. From a calculation based on the concentration change of Ca 2+ during the dissolution process, it is shown that nearly 65% of the sludge was dissolved within the first 2 minutes.
  • Eagle XG ® glass was etched using 12% HF (i.e., 24 volume % of a 50 volume % stock solution of HF), and the etched sheets were cleaned using different cleaning methods. Cleaning with HCI proved to remove the fluoride residue from the surface efficiently and also did not decrease the surface strength of the etched samples.
  • Etching was done in an automated etch system using 12% HF. 10" x 14" 1 .1 mm thick Eagle XG ® sheets were thinned to 0.7mm, removing 200 microns on either side for a total of 400 ⁇ of the substrate. N 2 bubbling was used during thinning and rinsing. After thinning, the sheets were rinsed with deionized water twice, i.e., the sheets were rinsed for 5 minutes, then the rinse water was discarded and the sheets were rinsed for an additional 5 minutes with fresh deionized water. Thinned samples were then cleaned using the following different cleaning methods:
  • TOF-SIMS analysis confirmed the presence of calcium, magnesium and fluorine on the surfaces of as-etched samples and deionized water rinsed samples. See Figures 5A and 5B. As shown in Figures 5A, the 3M HCI solution depletes some Al at the surface and removes fluorides efficiently. Both the horizontal and the horizontal + vertical brush cleaned samples showed the presence of potassium on the surface. Brush cleaning was efficient in removing the fluoride residue, but the surface had some amount of potassium. It is possible that the potassium is from the semi-clean KG detergent used during the brush cleaning.
  • Table 1 shows a summary of the cleaning methods used and the respective results for both surface quality and surface strength.
  • Table 2 shows the times and cleaning solutions used to dissolve Eagle XG ® sludge. Four g/L of Eagle XG ® sludge was suspended in each solution for testing.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Surface Treatment Of Glass (AREA)
  • Inorganic Chemistry (AREA)
  • Detergent Compositions (AREA)

Abstract

L'invention concerne des procédés pour traiter une surface de verre gravé, comprenant l'application d'une solution de nettoyage contenant au moins un acide minéral à un substrat de verre qui a été gravé. L'invention concerne également une solution de nettoyage comprenant au moins un acide minéral pour le nettoyage d'un substrat de verre qui a été gravé.
PCT/US2014/047734 2013-07-25 2014-07-23 Procédés de traitement de surfaces en verre Ceased WO2015013360A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016529851A JP2016528146A (ja) 2013-07-25 2014-07-23 ガラス表面を処理する方法
CN201480053148.XA CN105593182A (zh) 2013-07-25 2014-07-23 玻璃表面的处理方法
KR1020167004472A KR20160037952A (ko) 2013-07-25 2014-07-23 유리 표면의 처리 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361858292P 2013-07-25 2013-07-25
US61/858,292 2013-07-25

Publications (1)

Publication Number Publication Date
WO2015013360A1 true WO2015013360A1 (fr) 2015-01-29

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PCT/US2014/047734 Ceased WO2015013360A1 (fr) 2013-07-25 2014-07-23 Procédés de traitement de surfaces en verre

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JP (1) JP2016528146A (fr)
KR (1) KR20160037952A (fr)
CN (1) CN105593182A (fr)
TW (1) TW201504177A (fr)
WO (1) WO2015013360A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9488857B2 (en) 2014-01-10 2016-11-08 Corning Incorporated Method of strengthening an edge of a glass substrate
CN106348613A (zh) * 2016-08-24 2017-01-25 赣州帝晶光电科技有限公司 一种液晶玻璃基板薄化预处理方法
CN115028359A (zh) * 2017-03-28 2022-09-09 康宁股份有限公司 纹理化玻璃制品及其制造方法
US12291479B2 (en) 2019-08-13 2025-05-06 Corning Incorporated Textured glass articles and methods of making the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105016629B (zh) * 2015-08-05 2018-01-23 福耀玻璃工业集团股份有限公司 一种洗涤硅酸盐玻璃板的酸洗液及方法
CN106365459A (zh) * 2016-08-24 2017-02-01 赣州帝晶光电科技有限公司 一种液晶玻璃基板化学薄化方法
CN107640907A (zh) * 2017-10-27 2018-01-30 惠州市清洋实业有限公司 一种玻璃减薄的预处理方法
KR20230109814A (ko) 2022-01-13 2023-07-21 삼성디스플레이 주식회사 커버 윈도우의 제조방법 및 커버 윈도우를 포함하는 표시 장치의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004108617A2 (fr) * 2003-05-30 2004-12-16 Lam Research Corporation Procedes de finition pour des surfaces en silice fondue et composants fabriques selon le procede
JP2008056544A (ja) * 2006-09-01 2008-03-13 Nishiyama Stainless Chem Kk 微細な直線溝を有するガラス板の製造方法及びガラス板
CN103107086A (zh) * 2013-01-29 2013-05-15 淄博晨启电子有限公司 一种低压芯片的生产工艺及其低压芯片

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168270A (ja) * 2008-12-26 2010-08-05 Hoya Corp ガラス基材及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004108617A2 (fr) * 2003-05-30 2004-12-16 Lam Research Corporation Procedes de finition pour des surfaces en silice fondue et composants fabriques selon le procede
JP2008056544A (ja) * 2006-09-01 2008-03-13 Nishiyama Stainless Chem Kk 微細な直線溝を有するガラス板の製造方法及びガラス板
CN103107086A (zh) * 2013-01-29 2013-05-15 淄博晨启电子有限公司 一种低压芯片的生产工艺及其低压芯片

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 200827, Derwent World Patents Index; AN 2008-D75602 *
DATABASE WPI Week 201376, Derwent World Patents Index; AN 2013-Q67101 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9488857B2 (en) 2014-01-10 2016-11-08 Corning Incorporated Method of strengthening an edge of a glass substrate
CN106348613A (zh) * 2016-08-24 2017-01-25 赣州帝晶光电科技有限公司 一种液晶玻璃基板薄化预处理方法
CN115028359A (zh) * 2017-03-28 2022-09-09 康宁股份有限公司 纹理化玻璃制品及其制造方法
US12291479B2 (en) 2019-08-13 2025-05-06 Corning Incorporated Textured glass articles and methods of making the same

Also Published As

Publication number Publication date
KR20160037952A (ko) 2016-04-06
CN105593182A (zh) 2016-05-18
TW201504177A (zh) 2015-02-01
JP2016528146A (ja) 2016-09-15

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