WO2015003763A1 - Method for applying at least one electrical or electronic component to the surface of an object - Google Patents

Abstract

A method for applying at least one electrical or electronic component (1) to the surface of an object (7) is mentioned, wherein the at least one electrical or electronic component (1) is applied to a liquid-soluble carrier substrate (6), wherein the carrier substrate (6) is arranged on the surface (10) of a liquid, wherein the object (7) dips through the surface (10) of the liquid on which the carrier substrate (6) is arranged, wherein the electrical or electronic component (1) is pressed onto the surface of the object (7) by the pressure of the liquid and is thereby applied with adhesion, and wherein the object (7) with the at least one electrical or electronic component (1) applied is removed from the liquid. Furthermore, an assembly (20) comprising a main body (8) and comprising at least one electrical or electronic component (1) is mentioned, wherein the electrical or electronic component (1) is applied to the surface of the main body (8) by such a method.

Description

 description

Method for applying at least one electrical or electronic component to the surface of an object

The invention relates to a method for applying at least one electrical or electronic component, in particular a conductor track or a circuit, to the surface of an object. Furthermore, the invention relates to a structural unit having a base body and at least one electrical or electronic component, in particular an injection-molded circuit carrier, wherein the electrical or electronic component is applied to the surface of the base body with such a method.

A molded-plastic interconnect device (MID) is an almost arbitrarily shaped injection molded part made of a plastic with an integrated conductor structure, which may contain semiconductor switching elements. By direct material integration functional components such as antennas, switches or push-buttons, connectors, as well as the use of the injection molded part can be realized as a housing or as a shield for electromagnetic compatibility.

Due to the high degree of design freedom for a MID circuit carrier rationalization potentials offer, since electrical and / or electronic components can be integrated directly on the circuit board and not separately manufactured and subsequently attached. Due to the saving of mechanical components, the assembly is simplified, thereby increasing the reliability. In addition, process chains in production are shortened. In addition, economic advantages can be achieved by a lower material consumption and a reduced number of assembly steps. The aspect of environmental

CONFIRMATION COPY compatibility is an additional benefit as MID circuit carriers are made of recyclable thermoplastics and are therefore not critical to disposal. In addition, the integration of functional components reduces the diversity of materials, leading to further cost savings.

To complete a MI D circuit carrier, several further steps are usually required after the production of the injection molded part as a substrate for the electrical and / or electronic components. After preparation of the injection molded part by applying conductive adhesive or solder paste, conductor elements can be applied.

On the loading of the injection molded part with conductor and / or switching elements, the production of the connections between electrical and / or electronic components and the substrate follows. These connections can preferably be made by soldering. To be able to use classic soldering processes here, high-temperature-resistant thermoplastics are required. Other plastics can with low-melting solder pastes, conductive adhesives or special processes, eg. B. selective soldering, processed. Alternatively, printed conductors can be directly printed on the injection molded part by a conductive ink. A further alternative consists in the application of paste containing conductor particles, in which the conductor particles are fused together by laser irradiation and thus the conductivity is first activated.

For the mentioned methods for applying the electrical and / or electronic components, machines with an extended kinematics are generally required due to a possible geometric complexity of the injection-molded part. For example, additional axes of rotation in the workpiece handling or the use of flexible tools may be necessary. The complexity of the machines and the associated costs of acquiring the systems mean that in the production process usually only very few MID circuit carriers, often only a single one, can be treated simultaneously, which considerably slows down the entire production process. Moreover, resulting from the comparable complexity of the methods mentioned special requirements for the material properties of individual components, such. As a high Adhäsionsfähigkeit, resistance to the temperatures occurring during soldering or controlled by heating or laser irradiation activated conductivity. These requirements adversely affect the material costs. From the point of view of cost and time savings, therefore, a simplification of the method for applying the electrical and / or electronic components is desirable. Moreover, a method is desirable, which does not require soldering, since thus can be used as substrate of the conductor and circuit elements and circuit carrier made of non-refractory materials.

The invention has for its object to provide a simple method for applying at least one electrical and / or electronic component to the surface of an object, in which the object must be moved as little as possible, and which for all components involved as small a deviation from the Ambient temperature allows. Furthermore, the invention is based on the object, a structural unit with a base body and at least one in the simplest possible way to the surface of the

Specify basic body applied electrical and / or electronic component.

The first object is achieved by a method for applying at least one electrical or electronic component to the surface of an object, wherein the at least one electrical or electronic component is applied to a liquid-soluble carrier substrate, wherein the carrier substrate is disposed on the surface of a liquid, wherein the surface of the liquid on which the carrier substrate is arranged is penetrated by the object, the electrical or electronic component being pressed by the pressure of the liquid surface of the object and being adhesively applied thereby, and the object having the at least one applied electric or electronic device electronic component of the fluid is removed. The invention is based on the surprising finding that the application of one or more electrical and / or electronic components to the surface of an object can take place with the steps of the so-called water transfer printing. This applies in particular to components which, compared to the dimensions of the object, are to be designated as planar or linear, ie whose elevation over the surface of the object after application in relation to the object itself can be largely neglected.

Water transfer printing is a surface coating process and can be used to apply a pattern to a surface of an object, particularly an irregularly shaped surface. The pattern is first applied as a color film to a liquid-soluble substrate, in particular printed. Subsequently, the substrate with the pattern is placed on the surface of a liquid dissolving the substrate, and the color film is dissolved with another solvent. The color film floating on the surface of the liquid, which remains in its spatial structure, is now immersed in the object to be coated, so that the color film in the form of the pattern adheres to the object.

The invention now recognizes in a first step that a desired spatial arrangement of one or more electrical and / or electronic components on the surface of the object can be achieved by applying the or each component to a liquid-soluble carrier substrate. In particular, with a plurality of such components, necessary spacings for avoiding short circuits or the like can be observed. The arrangement of each component remains intact, even after the carrier substrate has been dissolved, long enough for the or each component to be applied to the surface of the object by immersing the object through the surface of the liquid on which the or each component is floating to apply desired position. The immersion angle and speed are based on the geometry of the object to be loaded as well as the geometry and dimension of the or each component. In particular, a substantially planar or linear component, which has a certain flexibility in relation to a length dimension, can conform to the surface of the object when the object passes through the liquid surface.

In a second step, the invention recognizes that for a suitable component and for a suitable surface (of the object), the fluid pressure may be sufficient to allow the or each component to submerge or

Dipping the object so pressed against its surface, that by adhesion sufficient adhesion arises, which ensures that the or each component remains applied even after the removal of the object from the liquid to the surface at the desired location. In particular, residues of the incompletely dissolved carrier substrate may prove to be adhesion-enhancing.

Advantageously, in this case the object or a part thereof is used as a support or a housing for a component with an electrodynamic function, such as e.g. an antenna, a switch or a plug connection, designed so that the assembly with an electrical and / or electronic component produces the functionality of the electrodynamic component.

Preferably, as a carrier substrate, a water-soluble film, in particular e.g. made of polyvinyl alcohol (PVOH), are used. Thus, as to

immersing the carrier substrate dissolving liquid water are used. A particular advantage of this selection is the low chemical load by the carrier substrate, solvents, or dissolved residues. Moreover, in the case of PVOH, the process can be carried out at room temperature. This also makes it possible to carry out the method for equipping a non-heat-resistant object, in particular from monomeric organic or biogenic material. In an advantageous embodiment, the surface of the object and / or the at least one electrical or electronic component before the

Dipping the liquid prepared adhesion-enhancing. This can enhance the adhesion of the or each component to the surface of the object. In particular, for this purpose, a predicted contact surface, ie the surface of the object and / or the or each component, cleaned or freed from fat. Preferably, a predicted contact surface can be roughened, in particular by sanding, area-wide chemical etching or sandblasting. An anticipated contact surface may also be primed with an adhesion promoting agent. In turn, different plastics can be used as adhesion promoters. Preferably, the adhesion-promoting preparation is performed on the or each component prior to application to the carrier substrate.

Conveniently, the surface of the object is cleaned with the at least one applied electrical or electronic component after removal from the liquid. This may prove to be particularly useful if the carrier substrate does not dissolve completely in the liquid, but leaves incompletely loosened residues on the object, which remain after removal of the object from the liquid to this partially adhere. When cleaning the surface of the object, it is preferable to take care not to damage or to remove an adhesively applied component.

It proves to be expedient if the surface of the object with the at least one applied electrical or electronic component after removal from the liquid and / or after the cleaning process with a protective layer is fixed. Preferably, this Schutzschickt include a paint or a flexible film. Such a protective layer can particularly effectively protect an adhesively applied component from damage in the use of the object, particularly when stresses may occur on use of the object at the surface where application may not be solely due to adhesion between a component and the surface of the object sufficient. In a further advantageous embodiment, a film is applied to the liquid-soluble carrier substrate, on which the at least one electrical or electronic component is arranged. Preferably, the film may be formed as a color film with a pattern. This allows the application of a functional component together with a decorative element in the same work step, which saves working time and production costs.

Preferably, an activator is introduced between the at least one electrical or electronic component and the surface of the object, which activates the at least one electrical or electronic component on at least one surface and / or the surface of the three-dimensional object. The dissolution of one or more intended contact surfaces may increase the adhesion between a component and the surface of the object. In particular, this can be advantageous if, together with the or each electrical or electronic component, a decorative color film is to be applied to the surface of the object. In this case, the color film can be pre-dissolved by means such as e.g. Require methyl isobutyl ketone. By applying such a solvent to a color film applied on the carrier substrate and the or each component arranged thereon, the surface of the object can be wetted by the solvent upon entry into the liquid and thus the adhesion of the or each component can be improved.

Conveniently, an electrical or electronic component is applied as at least one track of conductive ink on the carrier substrate. For fluid dynamic reasons, a conductive ink can not be applied at any angle to gravity on an object. In particular, for an object having a complex surface geometry, therefore, applying conductive ink to a desired track on the surface may require the object to be moved in a complex three-dimensional manner. Instead, if the conductive ink is previously applied to a carrier substrate, then only a two-dimensional movement of the ink jet over a plane is necessary therefor. A formed of conductive ink electrical or electronic component can be particularly well adapted to the surface of the object to be equipped in the above-described method. In particular, the conductive ink may be dissolved by a solvent just prior to contact with the surface of the object, which enhances adhesion to the object.

Conveniently, an electrical or electronic component is applied as at least one conductor track on the carrier substrate. As a result of the essentially linear geometry of the conductor track in relation to the dimensions of the object, it can adapt well to the surface of the object. In particular, in this case, the conductor can be made of an easily bendable conductor. As a result, the hydrostatic pressure of the liquid which has been submerged presses the conductor track, without any further measures being necessary, to the desired location of the surface of the object.

Advantageously, an electrical or electronic component is applied as at least one semiconductor component to the carrier substrate. This may preferably be a transistor, a semiconductor relay, a diode, in particular a photodiode or a light-emitting diode, or a solar cell. This allows a particularly simple method to apply to a surface with a complex geometry by switching current or light incidence switchable or light-emitting or by incident light stream for further applications generating elements. In particular, light-emitting diodes together with power connections and a color film can be applied to curved surfaces of a vehicle part, for example a spoiler or the like, and thus implement lighting and decorative enhancement in one work step.

Further, it may be advantageous if an electrical or electronic component is applied as at least one circuit to the carrier substrate. This allows for easy fabrication of microchips whose intended use requires non-planar geometry. This may for example be the case in cylindrical medical sensors. It also proves to be advantageous if an electrical or electronic component is applied as at least one RFID transponder on the carrier substrate. In particular, POVH can be used as the carrier substrate, so that the process can be carried out at room temperature. In this case, an RFID transponder can also be applied to a living object, in particular to a human being. In this case, the RFID transponder can preferably still be fixed after application with a protective layer designed as a film or plaster. This can be useful, for example, in the event of catastrophes if as many people as possible can be identified in the shortest possible time with the least possible effort. The biggest advantage over an RFID transponder fixed only by a patch then consists in the continuing liability of the RFID transponder even after a possible loss of the patch, which is to be included in catastrophic situations. Preferably, the method for applying an RFID transponder can also be used in the observation or monitoring of animals, in particular in grazing.

The second object is achieved by a structural unit with a base body and with at least one electrical or electronic component, wherein the electrical or electronic component is applied to the surface of the base body with the above-described method. The advantages stated for the method and its embodiments can be transferred analogously to the structural unit and its developments.

In this case, the structural unit is preferably designed as a spatially injection-molded circuit carrier. The above-described method is particularly efficient for equipping a main body designed as an injection molded part with conductor and / or switching elements for constructing a MID circuit carrier.

In the following an embodiment of the invention will be explained in more detail with reference to a drawing. Showing: 1 shows an embodiment of the method as a flow chart, and

Fig. 2 shows a structural unit with an applied electrical component in a schematic representation.

In Fig. 1, an embodiment of the method is shown in a flow chart. Rectangles each symbolize a material component, diamonds each represent a process step.

An electric, electronic or electromagnetic component 1, which in the exemplary embodiment is designed as a conductor track 2 welded into a thin plastic material, is subjected to a cleaning process 5 in order to strengthen the adhesion capability 4 in order to rid the surface of possible dust or engine grease. The welded-in and cleaned conductor 2 is then applied to a carrier substrate 6 made of POVH.

An already manufactured object 7, which is embodied here as an injection molded part 8, is subjected to a priming step 9 to reinforce the adhesion capability 4. In the exemplary embodiment, the priming step 9, the surface of the injection molded part 8 is coated with a fine-pored plastic. Before the adhesion-enhancing effect of the priming step 9 subsides, the carrier substrate 6 with the printed conductor 2 applied is applied to a surface 10 of a liquid, in this case water. As a result, the carrier substrate 6, on which the conductor track 2 is arranged, is released. Even during the dissolution of the carrier substrate 6, the carrier substrate 6 and the applied conductor 2 are sprayed with an activator 12, which slightly dissolves the plastic surrounding the conductor 2.

After the carrier substrate 6 is dissolved in the water not affecting the process residues, immersed in the injection molded part 8 in a

Dipping step 14, the surface 0 of the water on which, at a predetermined position by the carrier substrate 6, the conductor 2 floatingly arranged is. The injection-molded part 8 presses the conductor 2 under water, and due to the water pressure, the conductor 2 is adhesively applied to the injection molded part 8 due to the adhesion-enhancing preparation 4 of the intended contact surfaces. Subsequently, the injection molded part 8 is removed with applied trace 2 the water.

In a cleaning step 16, residues of the incompletely dissolved carrier substrate 6 are removed from the surface of the injection molded part 8 on which the printed conductor 2 is applied, after removal of the injection molded part 8 from the water. Subsequently, to better fix the conductor 2 on the surface of the injection molded part 8, the surface is coated with a protective layer 18 of clearcoat, so that the assembly of the assembly 20, which is formed in the embodiment as a spatial injection-molded circuit carrier completed.

FIG. 2 schematically shows a structural unit 20 with an object 7 embodied as an injection molded part 8. On the surface of the injection-molded part 8, a conductor 2 is applied according to the method described above, which follows the curvature of the surface of the injection-molded part 8.

LIST OF REFERENCE NUMBERS

1 electrical or electronic component

2 trace

 4 adhesion-enhancing preparation

 5 cleaning step

 6 carrier substrate

 7 object

 8 formed as an injection molded part body

9 priming step

 10 liquid surface

12 activator

 14 diving step

 16 cleaning step

 18 protective layer

 20 unit

Claims

claims 1. A method for applying at least one electrical or electronic component (1) to the surface of an object (7), wherein the at least one electrical or electronic component (1) is applied to a liquid-soluble carrier substrate (6), wherein the carrier substrate (6) is arranged on the surface (10) of a liquid, wherein the surface (10) of the liquid on which the carrier substrate (6) is arranged, is penetrated by the object (7), wherein the electrical or electronic component (1) by the pressure the liquid is pressed against the surface of the object (7) and is thereby adhesively applied, and wherein the object (7) is removed with the at least one applied electrical or electronic component (1) of the liquid. 2. The method according to claim 1,  wherein the surface of the object (7) and / or the at least one electrical or electronic component (1) is prepared adhesion-enhancing (4, 5, 9) prior to the immersion of the liquid. 3. The method according to claim 1 or claim 2,  wherein the surface of the object (7) is cleaned (16) with the at least one applied electrical or electronic component (1) after removal from the liquid. 4. The method according to any one of the preceding claims, wherein the surface of the object (7) with the at least one applied electrical or electronic component (1) after the removal of would be fixed from the liquid and / or after the cleaning process (16) with a protective layer (18). 5. Method according to one of the preceding claims,  wherein on the liquid-soluble carrier substrate (6), a film is applied, on which the at least one electrical or electronic component (1) is arranged. 6. The method according to any one of the preceding claims,  wherein between the at least one electrical or electronic component (1) and the surface of the object (7) an activator (12) is introduced, which the at least one electrical or electronic component (1) on at least one surface and / or the surface of the object (7). 7. The method according to any one of the preceding claims,  wherein an electrical or electronic component (1) as at least one track of a conductive ink is applied to the carrier substrate (6). 8. The method according to any one of the preceding claims,  wherein an electrical or electronic component (1) as at least one conductor track (2) is applied to the carrier substrate (6). 9. The method according to any one of the preceding claims,  wherein an electrical or electronic component (1) is applied to the carrier substrate (6) as at least one semiconductor component. 10. The method according to any one of the preceding claims, wherein an electrical or electronic component (1) is applied as at least one circuit to the carrier substrate (6). 11. The method according to any one of the preceding claims,  wherein an electrical or electronic component (1) is applied to the carrier substrate (6) as at least one RFI D transponder. 12. assembly (20) having a base body (8) and with at least one electrical or electronic component (1), wherein the electrical or electronic component (l) applied by a method according to one of the preceding claims on the surface of the base body (8) is. 13. Assembly (20) according to claim 12, which is designed as a spatial injection-molded circuit carrier.