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WO2015088375A1 - Ensemble et procédé permettant de générer une puissance rf élevée - Google Patents

Ensemble et procédé permettant de générer une puissance rf élevée Download PDF

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Publication number
WO2015088375A1
WO2015088375A1 PCT/RU2013/001122 RU2013001122W WO2015088375A1 WO 2015088375 A1 WO2015088375 A1 WO 2015088375A1 RU 2013001122 W RU2013001122 W RU 2013001122W WO 2015088375 A1 WO2015088375 A1 WO 2015088375A1
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WO
WIPO (PCT)
Prior art keywords
docking station
assembly
unit
module
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/RU2013/001122
Other languages
English (en)
Inventor
Andrey Aleksandrovich KRASNOV
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens OOO
Original Assignee
Siemens Research Center LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Research Center LLC filed Critical Siemens Research Center LLC
Priority to PCT/RU2013/001122 priority Critical patent/WO2015088375A1/fr
Publication of WO2015088375A1 publication Critical patent/WO2015088375A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/60—Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators
    • H03F3/602—Combinations of several amplifiers

Definitions

  • the present invention relates to an assembly and a method to generate RF high power.
  • the assembly comprises at least one electrical power supply, at least one RF module and connectors connecting the devices.
  • Radio-Frequency RF and/or microwave power is produced with appropriate generators.
  • RF power generators for high power applications are based on tubes, for example klystrons, inductive output tubes or magnetrons. Disadvantages of high power RF generators known from the state of the art are large dimensions, low reliability and low overall system efficiency. The known tubes require high voltage power supplies, resulting in high system complexity, large dimensions and low efficiency due to losses in the power supply itself.
  • transistor technology Using solid state technology, particularly transistor technology, a reliable RF power production with small dimensions and high efficiency is possible. Disadvantage of transistor technology is a low RF power output per transistor chip, in the range of up to 1.5 kW power output at 500 MHz frequency. For comparison, with klystrons as an example for tube technology, up to some Megawatt RF power output is possible.
  • an aggregation of RF generators is applicable. But, with increasing output power to be generated the system complexity is increased. For example, thousand 1.5 kW transistors are required to produce 1.5 M RF power.
  • An aggregation of transistors in a single power amplifier PA can reduce the complexity a bit, but not by a very high extent.
  • PA requires usually DC power and low level of RF to amplify.
  • a number of combining stages is necessary to combine the power, and a cooling system is necessary to keep the temperature of the system and components in an adequate range, to prevent failures.
  • a control system to control the PA operation and the whole system with its components is commonly used. To combine and connect the system components with each other, different cables, transmission lines, wires, busses, hoses, and/or pipes are necessary. With an increasing number of components, the number of connections and complexity increases.
  • the PA and control system have modular design. Components are assembled in a standard 19 inch rack.
  • the use of a -backplane simplifies the interconnection of system components since nearly all electrical connections are realized by printed circuit board tracks particularly made of copper laminated to the PCB. Disadvantage of the use of PCB backplanes is the limit of some Kilowatts due to the material. Higher power levels and the associated currents and heat production can cause damage up to irreversible destruction of the device.
  • the object of the present invention is to present an assembly and a method to generate RF high power with decreased complexity and increased reliability compared to designs and methods known from the state of the art.
  • a further object is to generate high power RF respectively microwaves with transistor based generators in an easy and cost effective way, particularly in a modular assembly with easy maintenance.
  • the assembly to generate RF high power comprises at least one electrical power supply, at least one RF module and connectors connecting the devices.
  • the connectors comprise at least one docking station .
  • the use of a docking station to connect devices reduces complexity and increases the reliability compared to assembly designs known from the state of the art.
  • High power RF respectively microwaves can be generated with transistor based generators in an easy and cost effective way.
  • the docking station allows an easy exchange of RF modules, without for example unscrewing connections or other complicated handling. This enables an easy maintenance .
  • the docking station can be substantially in the shape of a plate, particularly comprising a metal or plastic plate. This enables an easy, cost effective assembly with high mechanical stability, reliability without high consumption of space.
  • the docking station can comprise at least one plug connector, particularly at least one plug connector to connect to at least one electrical wire and/or at least one plug connector to connect to at least one fluid pipe and/or at least one plug connector to' connect to at least one RF coaxial cable.
  • Plug connectors enable a fast and easy connection and disconnection between components. A fast and easy exchange of RF modules is enabled by plug connectors, without complicated handling steps like for example screwing.
  • the at least one RF module can be directly connected to the docking station, particularly to at least one plug connector of the docking station, and the docking station, particularly at least one plug connector of the docking station, is connected to the devices, particularly at least to one electrical power supply, by at least one electrical wire and/or at least one fluid pipe and/or at least one RF coaxial cable.
  • Directly connected particularly means mechanically connected without parts in-between. Connected in the following is used particularly in the sense of mechanically, electrically, fluidically and/or to transfer HF electrical power.
  • At least one RF module can be connected removable to at least one docking station in the kind of hot swap, particularly by a screw-free connection.
  • a fast, easy and cost effective exchange of RF modules is enabled, especially in case of maintenance or exchange of spoiled modules, i.e. modules out of order.
  • To at least one docking station a number of 4 to 12 RF modules can be connected, particularly to all docking stations a number of RF modules in the range of 4 to 12 can be connected respectively.
  • At least one power combiner, and/or at least one control unit, and/or at least one capacitor tank, and/or at least one cooling unit can be connected to the at least one docking station.
  • connection can be arranged to all docking stations respectively, particularly respectively by at least one electrical wire and/or at least one fluid pipe and/or at least one RF coaxial cable.
  • At least one RF module, particularly 4 to 12 RF modules, and at least one docking station, particularly exactly one docking station, can be comprised by a unit in form of a rack, particularly in form of a 19 inch rack. These racks are commonly used in electronics and allow a standardized form, for an easy, compact and clearly arranged storage and exchange of parts.
  • the unit in form of a rack can be arranged, particularly 10 to 12 units can be arranged in a cabinet comprised by the assembly, particularly a cabinet for 10 to 12 units. This further increases compactness and enables easy handling and exchange of parts.
  • the cabinet can comprise at least one unit, particularly 10 to 12 units, with at least one power combiner, and/or at least one unit with control unit, and/or at least one unit with capacitor tank, and/or at least one unit with cooling unit, particularly respectively in form of a 19 inch rack and/or particularly respectively connected electrically and/'or fluidically to every docking station.
  • This arrangement can configure an assembly to generate RF high power with the' before described advantages.
  • a Method according to the present invention to generate RF high power with an assembly, particularly with an assembly as described before, comprises connectors connecting devices with at least one electrical power supply and at least one RF module, in which the devices are interconnected by at least one docking station.
  • the at least one RF module can be plugged and/or unplugged automatically to/from the at least one docking station by moving the at least one RF module towards/away from the at least one docking station.
  • This enables a fast and easy exchange of modules, particularly if single modules are damaged / not working properly.
  • An exchange of an RF module can be performed in a kind of hot swap, particularly comprising the step of removing an RF module from a docking station by plug out all connections, particularly at the same time simultaneously, and/or of arranging an RF module to a docking station by plug in all connections, particularly at the same time simultaneously .
  • Connections can be automatically inactivated/activated during exchange by removing the RF module and/or by arranging the RF module to the docking station, particularly with automatic sealing of fluid connections. This enables an exchange of modules without the risk of electrical damage due to short circuits or leakage of cooling fluid like water.
  • the method can comprise the steps,
  • FIG 1 illustrates a schematic view of an assembly 1 according to the present invention, with electrical 6, 10 and fluidic 8 connections between components 11, 12, 13, 14, 2 and RF modules 3 via a docking station 4, and
  • FIG 2 shows a block diagram of the assembly 1 with connections 5, 6, 7, 8, 9, 10, and
  • FIG 3 shows a schematic view of the use of plug connectors 5, 7, 9 for the connection between modules 3 and docking station 4.
  • FIG 1 a schematic view of an assembly 1 to generate RF high power according to the present invention is shown as an example.
  • Six RF modules 3 are connected to a docking station 4 particularly removable in the kind of hot swap. The connection can be screw-free by using plug connectors 5, 7, 9.
  • the docking station 4 is connected to a power combiner 11 by RF coaxial cables 10, to a control unit 12 and to six capacitor tanks 13 by electrical wires 6, and to a cooling unit 14 by fluid pipes 8.
  • a power combiner 11 by RF coaxial cables 10
  • control unit 12 to six capacitor tanks 13 by electrical wires 6, and to a cooling unit 14 by fluid pipes 8.
  • fluid pipes 8 instead of multiple wires, cables and pipes also a single wire, cable or pipe can be used.
  • the number of devices and connectors in FIG 1 is an example, other kinds and numbers can be used depending on the application and electrical and/or thermal parameters .
  • the components or units 2, 3, 4, 11, 12, 13, 14 can be arranged in a rack respectively, for example a 19 inch rack not shown in FIG 1 for simplicity.
  • Racks 2, 3, 4, 11, 12, 13, 14 can be arranged in a cabinet, also not shown in FIG 1 for simplicity. Such arrangement results in an ordered, easy to handle assembly 1, with components easy to be connected to each other.
  • each RF module 3 shows a shape of a rectangle box. Further possible forms are among others square, rounded or triangular forms.
  • the advantage of a rectangular box is a possibility for a space saving parallel arrangement of modules 3.
  • RF coaxial cables 10 and fluid pipes among others can be used to connect components 2, 4, 11, 12, 13, 14 with the docking station 4 respectively, and via the docking station 4 for example via plug connectors 5, 7 not shown in FIG 1 for simplicity, to RF modules 3, particularly all RF modules 3 respectively.
  • the electrical power supply 2 supplies power to electrical components of the assembly 1. It can be composed of modules, for example four modules like in FIG 1 shown.
  • the AC/DC power supply 2 among others supplies DC voltage to the RF modules 3. It is electrical connected via electrical wires 6 respectively to the docking station 4 and via the docking station 4 to every RF module 3 for example using plug connectors 5.
  • Low level RF (LLRF) signals from a control unit 12 are amplified by the RF modules 3 and combined in a power combiner 11.
  • a cooling unit 14, for example for water or air cooling, can be used for removal of heat produced in RF modules 3.
  • One or more fluid pipes 8 are used to connect the cooling unit 12 with the docking station 4, and for example to connect via plug connectors for fluids 7 to every RF module 3.
  • Other kinds of cooling arrangements are possible too, for example with the help of indirect cooling via thermal contact between docking station 4 and RF modules 3.
  • the docking station 4 can be of the shape of a plate, like shown in FIG 1. Other forms are possible too. Materials to form the docking station 4 can comprise among others metals like copper and/or steel, plastic and/or composites.
  • the connection of docking station 4 with wires 6, cables 10 and pipes 8 from components 2, 4, 11, 12, 13, 14 can be arranged on one side. Plug connectors 5, 7, 9 and RF modules 3 can be arranged on the opposite side. Other arrangements are possible too, for example connectors and modules on each side next to each other on different areas of the docking station respectively.
  • SMA, QMA, SMB connector types can be used as LLRF connectors.
  • N and/or 7-16 connector types can be used as high level RF (HLRF) connectors.
  • RG-45, M8 , Ml2, and/or LEMO connector types can be used for control, telemetry and interlock lines.
  • Clamp and/or edge connector types can be used for DC voltage connection.
  • Conical or cylindrical thread, and/or hoses tails can be used to connect water hoses, pipes and/or tubes. Other connectors are possible too, depending among others on the kind of connection and physically requirements.
  • Water connectors can comprise automatic shut-off.
  • RF modules 3 comprise connectors of opposite sex/type compared with connectors of the docking station 4, ordered for example in a mirror arrangement, to be able to connect both with each other in the kind of hot swap.
  • the connector types and placement can be unified for any kind of RF module 3 to be connected.
  • the connectors can be arranged in a row on the docking station 4, so RF modules 3 can be connected side by side to each other to the docking station 4.
  • the RF modules 3 can consist of power amplifier PA and all auxiliary components to bring it into operation.
  • PA can be realized in any kind of topology, like push-pull, balanced, Doherty, and so on according to the special application.
  • Various auxiliary components as PA drivers, control units, measurement units, DC/DC converters, water-cooling plates or radiators, and so on can be used for different applications.
  • All RF modules 3 in general should comprise plug respectively quick connectors, for easy and fast replacement .
  • the control unit 14 is used to generate LLRF signals and to control/operate the assembly 1. It allows the user, or a higher level control unit not shown, to control the assembly 1 via for example TCP/IP or RS-485 protocol. Other types of protocols can be used too.
  • the control unit 14 can transmit LLRF signals to RF modules 3 from an internal oscillator or can use external RF sources.
  • the electrical power supply 2 can be in bulk form or in modular design.
  • a modular design has the advantage that the assembly 1 becomes more scalable.
  • capacitor tanks 13 can be connected to a DC bus.
  • Capacitor tanks 13 are used to provide enough power for the pulse to RF modules 3 and to reduce the power supply 2 output power requirements.
  • the number and the capacity of capacitors 13 depend on the requirements of the assembly 1. The use of capacitors is optional.
  • the cooling unit 14, particularly a water cooling system can comprise two manifolds, input and output, and flow and/or temperature sensors to monitor the water flow.
  • the cooling unit 14 is optional, if no high temperature arises for example in RF modules 3 the assembly does not need to comprise a cooling unit 14.
  • air cooled radiators can be used for heat dissipation from PA.
  • the use of water cooling units can be necessary or advantageous.
  • the power combiner 11 is used to combine RF power from the RF modules 3 and transmit it to the output of the assembly 1 without losses and reflections. It can be connected to the docking station 4 by RF coaxial cable 10.
  • the docking station 4 and RF modules 3 can comprise a plug connector 9 respectively, to connect for RF power transfer to the power combiner 11.
  • Components of the assembly 1 can be placed in 19 inch racks, with the racks in a cabinet. It is also possible to use any other type of framing system for placement.
  • a number of docking stations 4 can be placed in a row at the back of the cabinet. Components 2, 4, 11, 12, 13, 14 can be connected from the backside of the docking station 4.
  • a number of RF modules 3 can be inserted into the cabinet from the front side and connected to the respective docking station 4 by plug connectors 5, 7, 9. In case of a failure of a RF module 3, the module 3 can be easily replaced.
  • the system can be used to produce radio frequency (RF) with high power, in the range of a kW to some MW.
  • RF radio frequency
  • An easy exchange of RF modules 3 without much handling effort, just in a plug and play way is possible.
  • the system can be easy upgraded and extended.
  • the power supply 2 can be used to provide full power in pulsed mode operation using capacitor tanks 13, which provide extra power during a pulse.
  • the power supply 2 can also be used without capacitor tanks 13, for example with average power without pulses.
  • FIG 2 a block diagram of the assembly 1 with connections 5, 6, 7, 8, 9, 10 between components 2, 3, 4, 11, 12, 13, 14, 16, 17 is shown schematically.
  • the RF modules 3, for example three RF modules 3, are respectively connected with plug connectors 5, 7, 9 to the docking station 4. This enables a fast and easy exchange of RF modules 3 from the assembly 1.
  • Plug connectors for electrical power 5, for cooling fluid 7 and RF power 9 transmitted via coaxial cable can be comprised among others.
  • the docking station 4 is connected via electrical wires 6 and/or RF coaxial cables 10 with the control unit 12.
  • the control unit 12 can comprise an input 16 for an external RF signal.
  • the cooling unit 14 is connected via a fluid pipe 8 with the docking station 3, to provide the RF modules 3 with cooling fluid like water. Gases like cold air can be used as cooling fluid too, depending on the amount of heat to be removed from components of the assembly 1.
  • the docking station 4 is connected via electrical wires 6 direct or indirect to a DC output of the electrical power supply 2.
  • capacitor tanks 13 can support the power supply, connected via electrical wires 6 in-between connections.
  • an AC input 17 is comprised.
  • High RF power from RF modules 3 is respectively transmitted via plug connectors 9 to the docking station 4, which is connected via RF coaxial cables 10 to a power combiner 11.
  • Output high RF power from the assembly 1 is transferred via a RF output 15 to external devices.
  • the high RF power can be used among others for medical devices.
  • Fig 3 a schematic view of plug connectors 5, 7, 9 for the connection between modules 3 and docking station 4 is shown in more detail.
  • One or more docking stations 4 comprise plug connectors 5, 7, 9 to connect to RF modules 3.
  • Different kinds of plug connectors for example for electrical power, RF power or fluids can be used, depending on components of the assembly 1.
  • the female/male comppnents are respectively connected by attaching the RF module 3 to the docking station 4.
  • An automatic connection is established and the connection comprises a contact to other respective components 2, 4, 11, 12, 13, 14, which are connected to the docking station 4 by wires 6, pipes 8 and/or coaxial cables 10.
  • the wires 6, pipes 8 and/or coaxial cables 10 can be attached to the docking station 4 for example by screwing, brazing or gluing.
  • connection and materials can be used, like optical wires, other metals like aluminum, and/or other shapes of components like rounded boxes.
  • Different designs and arrangements like for example adjustable shelves can be used.
  • Connections can be arranged in different zones, and on the same or different sides of the docking station 4.
  • Advantageous is an arrangement with good accessibility of RF modules 3, to be able to exchange single modules 3 easy and fast.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention se rapporte à un ensemble et à un procédé permettant de générer une puissance RF élevée (1). L'ensemble (1) comprend au moins une alimentation électrique (2), au moins un module RF (3) et des connecteurs raccordant les dispositifs. Les connecteurs comprennent au moins une station d'accueil (4).
PCT/RU2013/001122 2013-12-13 2013-12-13 Ensemble et procédé permettant de générer une puissance rf élevée Ceased WO2015088375A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/RU2013/001122 WO2015088375A1 (fr) 2013-12-13 2013-12-13 Ensemble et procédé permettant de générer une puissance rf élevée

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU2013/001122 WO2015088375A1 (fr) 2013-12-13 2013-12-13 Ensemble et procédé permettant de générer une puissance rf élevée

Publications (1)

Publication Number Publication Date
WO2015088375A1 true WO2015088375A1 (fr) 2015-06-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/RU2013/001122 Ceased WO2015088375A1 (fr) 2013-12-13 2013-12-13 Ensemble et procédé permettant de générer une puissance rf élevée

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WO (1) WO2015088375A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5457607A (en) * 1994-03-28 1995-10-10 Raytheon Company Unified module housing
US6055418A (en) * 1996-07-05 2000-04-25 Thomcast Communications, Inc. Computer program product configured to control modular transmission system components
US20050010206A1 (en) 2000-05-12 2005-01-13 Cardima, Inc. System and method for multi-channel RF energy delivery with coagulum reduction

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5457607A (en) * 1994-03-28 1995-10-10 Raytheon Company Unified module housing
US6055418A (en) * 1996-07-05 2000-04-25 Thomcast Communications, Inc. Computer program product configured to control modular transmission system components
US20050010206A1 (en) 2000-05-12 2005-01-13 Cardima, Inc. System and method for multi-channel RF energy delivery with coagulum reduction

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