[go: up one dir, main page]

WO2015076050A1 - Structure de montage d'appareil de commande électronique - Google Patents

Structure de montage d'appareil de commande électronique Download PDF

Info

Publication number
WO2015076050A1
WO2015076050A1 PCT/JP2014/078010 JP2014078010W WO2015076050A1 WO 2015076050 A1 WO2015076050 A1 WO 2015076050A1 JP 2014078010 W JP2014078010 W JP 2014078010W WO 2015076050 A1 WO2015076050 A1 WO 2015076050A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic control
heat
control device
adhesive
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2014/078010
Other languages
English (en)
Japanese (ja)
Inventor
幸輔 高瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2015549040A priority Critical patent/JP6307093B2/ja
Publication of WO2015076050A1 publication Critical patent/WO2015076050A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a mounting structure of an in-vehicle electronic control device having a circuit board on which electronic components are mounted, and more particularly to a heat dissipation structure for electronic components mounted on a circuit board.
  • In-vehicle electronic control devices such as engine control units (hereinafter referred to as ECUs) and automatic transmission control devices (hereinafter referred to as ATCUs) reduce weight by reducing mounting harnesses and perform more precise electronic control. For this reason, the mounting position is required from the vehicle interior to the engine room, as well as directly mounted on the engine and mounted on the transmission.
  • the installation environment that is directly attached to the engine and the mission is a severe installation environment as compared with the conventional vehicle interior and engine room, and the environmental temperature is particularly high.
  • the electronic control device mounted directly on the engine or the mission may exceed the heat resistance temperature of the electronic component due to heat generation of the electronic component itself forming the electronic circuit of the electronic control device, and the heat dissipation structure to suppress the heat generation temperature Is required.
  • the heat resistance temperature of electronic components including passive elements such as semiconductor elements, chip resistors, and chip capacitors is 150 ° C
  • electrolytic capacitors are based on the structure of components that use electrolytes.
  • the upper limit of operating temperature was as low as 125 ° C.
  • the electrolytic capacitor has a small heat generation and has not required a heat dissipation structure.
  • an electrolytic capacitor with a low heat resistance temperature under the operating environment temperature directly mounted on the engine and directly on the mission is used. In order to use it, the electrolytic capacitor also needs a heat dissipation structure.
  • thermo conductivity structure for example, in the invention described in Patent Document 1, a resin material having high thermal conductivity is loaded in a state of being in contact with the lower surface of the semiconductor element and the conductor pattern of the circuit board, and connected to the conductor pattern of the circuit board.
  • a structure in which heat of a semiconductor element is dissipated from the lower surface of the semiconductor element to the circuit board by filling the through hole with a resin material having high thermal conductivity is disclosed.
  • a structure for an electrolytic capacitor for example, in the invention described in Patent Document 2, a structure is disclosed in which an electrolytic capacitor is embedded in a heat dissipation adhesive to dissipate heat from the body body of the electrolytic capacitor.
  • Patent Document 1 has the following problems.
  • Patent Document 2 Furthermore, the structure shown in Patent Document 2 has the following problems.
  • the metal cap of the electrolytic capacitor has an insulating coating on the outer periphery for insulation and has poor thermal conductivity. Therefore, heat radiation from the electrolytic capacitor body cannot provide a sufficient heat radiation effect.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component mounting structure that is excellent in heat dissipation.
  • a wiring board provided with at least one through-hole, an electronic component mounted on the first surface of the wiring board and electrically connected to the wiring board and protruding in one direction, and the wiring
  • An electronic control device that is mounted on a second surface facing a first surface of a substrate and includes a heat radiating member attached in a state facing the through-hole, the electronic component, wherein the lead terminal of the electronic component And an adhesive that covers the inside of the through hole, and the adhesive is in contact with the filler, and is further in thermal contact with the heat dissipation member.
  • a mounting structure of an electronic control device is provided in which a heat dissipation path is provided from the lead terminal to the heat dissipation member.
  • the present invention it is possible to provide a mounting structure for an electronic control device that improves the heat dissipation of an electronic component that does not have a heat dissipation structure, and is excellent in mass productivity. Therefore, it is possible to provide an electronic control device that can be used even in a mounting place where the environmental temperature is high, such as a mounting environment where the engine and the mission are directly attached.
  • FIG. 12 is a partial cross-sectional view showing the mounting structure of Example 1 of the electronic control device according to the present embodiment, and is a partially enlarged view of region A shown in FIG.
  • FIG. 5 is a partial cross-sectional view showing a part of the manufacturing method of Example 1 of the electronic control device according to the present embodiment. It is a figure which shows the through-hole of the wiring board of Example 1 of the electronic controller which concerns on this embodiment. It is a figure which shows the application
  • FIG. 12 is a partial cross-sectional view showing a mounting structure of Example 2 of the electronic control device according to the present embodiment, and is a partially enlarged view of a region A shown in FIG. It is a figure which shows the through-hole of the wiring board of Example 2 of the electronic controller which concerns on this embodiment. It is a figure explaining a mode when an electrolytic capacitor vibrates. It is a partial sectional view and a bottom view showing an example of an electrolytic capacitor. It is sectional drawing which shows an example of the electronic controller which concerns on a present Example.
  • the electronic control device of the present embodiment is an example of an ATCU that is directly mounted on a transmission, and according to the vehicle running state, input signals from various sensors, input switch states, and information on other control units by CAN communication. take in. Then, by controlling a plurality of solenoids, an appropriate vehicle running state is realized by performing AT speed change and hydraulic pressure adjustment.
  • FIG. 11 is a cross-sectional view showing an example of an electronic control device according to this embodiment.
  • the electronic control device 100 includes a wiring board 1, a connector 200 having a connector terminal 200a electrically connected to the outside, a metal base 2 on which the wiring board 1 is mounted, and a case 300.
  • the case 300 and the metal base 2 are bonded with a waterproof sealing material 400, and the wiring board 1 is sealed.
  • the transmission-side harness that engages with the connector 200 can be shortened, and more accurate solenoid control is possible.
  • electronic components such as an electrolytic capacitor 20, a microcomputer 41, an FET 42, an IC 43, a ceramic capacitor 44, a chip resistor 45, and a crystal (not shown) are mounted using lead-free solder, and the electronic circuit is mounted. Forming.
  • FIG. 10 shows a partial cross-sectional view and a bottom view showing an example of an electrolytic capacitor.
  • the electrolytic capacitor 20 has a structure in which an element 25, lead terminals 20a and 20b connected to the element 25 and connected to the outside, and an electrolytic solution 26 are sealed with a metal cap 23 and a sealing rubber 22. Above the metal cap 23 is an explosion-proof valve 24 that adjusts the internal pressure of the electrolytic capacitor 20. Furthermore, the electrolytic capacitor 20 is mounted on a resin pedestal 21 in order to improve the sitting so that the electrolytic capacitor 20 does not fall down when components are mounted on the substrate.
  • FIG. 1 is a partial sectional view showing a mounting structure of the electronic control device according to the present embodiment, and is a partially enlarged view of a region A shown in FIG.
  • Electrolytic capacitor 20 has a heat resistant temperature of 125 ° C, and other electronic components have a heat resistant temperature of 150 ° C. Therefore, the electrolytic capacitor 20 with low heat resistance is provided with a heat dissipation structure from the lead terminals 20a, 20b to the metal base via the heat dissipation adhesive 5.
  • the electrolytic capacitor 20 is mounted on the through hole 11 of the first surface 1a of the wiring board 1, and is electrically connected to the lead terminals 20a and 20b by lead-free solder.
  • the structure of the electrolytic capacitor is the same as that shown in FIG. 10, and the outer shape of the electrolytic capacitor is that the metal cap 23 is ⁇ 10 mm and the height is 10 mm.
  • the heat radiation adhesive 5 is applied so as to cover the lead terminals 20a and 20b of the electrolytic capacitor 20, and the heat radiation adhesive 5 is also filled in the through hole 11.
  • a protruding portion 2a of the metal base 2 that becomes a heat radiating member, and the wiring substrate 1 and the protruding portion 2a are thermally connected via the heat radiating adhesive 5. Touching. With this configuration, a heat dissipation path for radiating heat generated in the electrolytic capacitor 20 can be formed from the lead terminals 20a and 20b to the metal base 2.
  • Electrolytic capacitor 20 and other parts that do not have a heat dissipation structure are covered with an insulating member other than the lead terminals that are electrically connected.
  • the insulating member has low thermal conductivity as well as low electrical conductivity, the heat dissipation structure for dissipating heat from the body of the component is not efficient. Therefore, for a component that does not have a heat dissipation structure, the structure in which heat is radiated from a lead terminal connected to an element serving as a heating element is the most effective heat dissipation structure.
  • the lead that is closest to the heating element is provided in the electrolytic capacitor because the element that becomes the heating element and the lead terminal are directly connected. A structure that dissipates heat from the terminals is effective.
  • Wiring board 1 is a printed circuit board with flame retardancy equivalent to FR4 grade, and is a copper-clad laminated board consisting of 4 layers. This wiring board is a copper-clad laminated board in which an epoxy resin is impregnated with glass cloth. A substrate with a glass transition temperature of 150 ° C was selected for mounting on the transmission and mounting process using lead-free solder.
  • the through-hole 11 is a copper through-plated through-hole with a diameter of 1.0 mm created by a normal substrate manufacturing process, but it may be a through-hole that is not plated or simply drilled with a drill or laser. .
  • the metal base 2 of the heat radiating member is aluminum die casting (ADC12), and may be a sheet metal made of iron, aluminum, or an alloy thereof.
  • the heat radiation adhesive 5 is a thermosetting silicone adhesive containing alumina as a filler, and has a viscosity of 30 Pa ⁇ s at room temperature and a thermal conductivity of 2.2 W / m ⁇ K.
  • the silicone adhesive may be a moisture curable type or a thermosetting type, and the filler that imparts a heat dissipation function is also an insulating and thermal material such as silica, magnesium oxide, aluminum nitride, boron nitride, silicon nitride, silicon carbide, etc. Any conductive inorganic filler may be used.
  • the heat-dissipating adhesive 5 Since the heat-dissipating adhesive 5 is bonded to the lead ends 20a and 20b, if an electrically conductive material is used, the lead terminals are short-circuited. Therefore, the heat-dissipating adhesive 5 must be an insulating material.
  • the heat generated by the electronic component mounted on the wiring board is radiated from the lead terminal of the electronic component closest to the heat source to the heat radiating member without passing through the wiring board, the heat generated from the electronic component can be efficiently radiated.
  • the electronic component of the present invention may be an electronic component with leads connected to the outside, but in particular, the component itself does not have a heat dissipation structure and can be a heat dissipation structure suitable for an electrolytic capacitor.
  • the electronic component that does not have a heat dissipation structure is a component that does not have a heat sink member provided to dissipate heat to the outside, in addition to the lead terminal connected to the wiring board.
  • the heat dissipation structure of the electrolytic capacitor 20 of the present embodiment also has an effect as a damping mechanism that suppresses vibration when the electronic control device 100 is vibrated. Since the electrolytic capacitor 20 is taller than other electronic components, the head of the electrolytic capacitor is shaken as shown in FIG. 9 when vibration is applied. At this time, the place where the load is most applied is the bent portion 20c at the base of the terminal. The bent portion 20c is bent by press working, and when an excessive external force is applied, the bent portion 20 is bent, resulting in an open failure.
  • FIG. 5 is a diagram for explaining a part of the application part of the heat radiation adhesive of Example 1 of the electronic control device according to the present embodiment.
  • the base 21 of the electrolytic capacitor 20 and the lead terminals 20a and 20b are not fixed, but are only inserted into the insertion holes 210 of the base 21. Therefore, since the insertion hole 210 includes the gap portions 21a and 21b between the lead terminals 20a and 20b and the base 21, the gap portions 21a and 21b become rattling when shaken, and the structure is weak against vibration. . Therefore, the silicone adhesive is preferably applied so as to fill the gaps 21a and 21b from the viewpoint of vibration resistance. A method for applying the heat radiation adhesive 5 will be described later.
  • an epoxy adhesive is sometimes used for temporarily fixing components when they are mounted on both sides so as not to drop, or for improving vibration resistance.
  • Silicone adhesives are soft, low-elasticity adhesives with a Young's modulus of 1/1000 or less compared to epoxy resins. Accordingly, the epoxy resin has a structure in which the epoxy resin is fixed to the substrate rigidly against vibration and external force, whereas the silicone adhesive can have a vibration suppression structure that absorbs and suppresses vibration and external force.
  • the rigid structure made of epoxy resin and the substrate is fixed to the substrate base material and resist that becomes a protective film on the substrate surface due to thermal stress due to the difference in linear expansion coefficient between the epoxy adhesive and the substrate.
  • the silicone adhesive is a soft adhesive with low elasticity, it hardly causes stress on the substrate.
  • the heat dissipation structure using the silicone adhesive of this embodiment can be a vibration suppression structure, vibration resistance is improved. Therefore, it can be used even in applications that require high vibration resistance because it is affected by vibration of the transmission, such as an electronic control device mounted directly on the transmission. Furthermore, it is preferable that the filler filling the through hole is the heat radiation adhesive. Such means is excellent in mass productivity because the heat radiation path is formed by the same heat radiation adhesive, and the productivity becomes easy. Furthermore, the heat-dissipating adhesive is applied so as to protrude from an area projected from the outer shape of the electronic component. Such means makes it possible to inspect that the heat dissipating adhesive is reliably applied around the terminals.
  • FIG. 2 is a partial cross-sectional view showing a part of the manufacturing method of Example 1 of the electronic control device according to the present embodiment.
  • the solder 40 is printed on the wiring board 1 (3-1), and the electrolytic capacitor 20 is mounted on the first surface 1a of the wiring board 1 (3-2).
  • the heat dissipation adhesive 5 is applied in advance to the metal base protrusion 2a (3-3), and the metal substrate 2 protrusion 2a to which the heat dissipation adhesive 5 is applied has a through hole 11 in the wiring board 1
  • the wiring board 1 is mounted by pressing the second surface 1b.
  • the heat radiation adhesive 5 applied to the metal base 2 is filled in the through hole 11 and further covered from the lower surface of the electrolytic capacitor 20 so as to cover the periphery of the lead terminals 20a and 20b so as to be pushed out of the through hole 11.
  • the heat-dissipating adhesive 5 spreads wet (3-4). At this time, the gaps 21a and 21b can be filled with the heat radiation adhesive 5 as well.
  • the manufacturing method for realizing the mounting structure of the electronic control device of this embodiment can be described as follows. That is, a first step of mounting the electronic component on the first surface of the wiring substrate, a second step of applying the adhesive to the heat dissipation member, and the wiring substrate on the adhesive application surface of the heat dissipation member A second step of mechanically pressing the second surface of the wiring board through the through-hole of the wiring board, causing the adhesive to protrude from the first surface of the wiring board, and the lead terminal portion of the electronic component.
  • the method for manufacturing an electronic control device is characterized in that the adhesive material is disposed so as to be in contact with the electronic control device.
  • FIG. 6 is a view for explaining the space between the electrolytic capacitor and the wiring board according to this embodiment.
  • the height h of the space 30 between the pedestal 21 and the wiring board 1 is about 200 ⁇ m, which is very small.
  • the manufacturing method in which the heat dissipation adhesive 5 is applied to the wiring substrate 1 in advance and the electrolytic capacitor 20 is mounted may hinder subsequent soldering of the electrolytic capacitor 20. Therefore, the manufacturing method in which the electrolytic capacitor 20 described above is mounted on the wiring board 1 and then mechanically pressed against the metal base 2 coated with the heat dissipation adhesive 5 to apply the heat dissipation adhesive 5 is the most preferable manufacturing method.
  • the above manufacturing method pushes the heat dissipating adhesive 5 from the through hole 11 by pressing the wiring board 1 against the metal base 2 to which the heat dissipating adhesive 5 has been applied in advance, the voids in the heat dissipating adhesive 5 are Since it can also be extruded, it is possible to reduce deterioration of heat dissipation due to voids.
  • the heat-dissipating adhesive 5 is applied so as to protrude from the projected area of the electrolytic capacitor 20 on the wiring board 1 as shown in FIG. Accordingly, it is easy to inspect that the heat-dissipating adhesive 5 is filled in the through-hole 11 and is wet and spread so as to cover the lead terminals 20a and 20b.
  • FIG. 3 is a view showing a through hole of the wiring board of Example 1 of the electronic control device according to the present embodiment. It is. 20A is an outline of the electrolytic capacitor 20, and through holes 11 are arranged in the lands 10a and 10b on the wiring board 1 to which the lead terminals 20a and 20b are connected as shown in FIG.
  • the applicability of the heat dissipating adhesive 5 is determined by the viscosity of the heat dissipating adhesive 5, the diameter, the arrangement position, and the number of the through-holes 11. Can be determined.
  • the heat dissipating adhesive 5 is a thermosetting type silicone adhesive, a process of applying heat to the curing furnace and applying heat to cure after the heat dissipating adhesive 5 is applied is necessary.
  • solder reflow is performed, so that the solder connection of the electrolytic capacitor 20 and the heat radiation adhesive 5 are cured at the same time. Since it is unnecessary, it is excellent in mass productivity.
  • the electronic control device 100 created in this way has a heat dissipation structure that dissipates the heat generated in the electronic component from the lead terminal closest to the heat generation source, and is excellent in heat dissipation.
  • the vibration damping structure in which the electronic component is held by a low-elastic adhesive material provides excellent vibration resistance. Due to these effects, the electronic control device according to the present embodiment has reliability that can be used even in an environment where the transmission is directly attached, is easy to assemble, and is excellent in mass productivity.
  • FIG. 7 is a partial cross-sectional view showing the mounting structure of Example 2 of the electronic control device according to the present embodiment.
  • Example 1 The difference from Example 1 is that the heat-dissipating adhesive 5 that covers the lead terminals 20a and 20b of the electrolytic capacitor 20 and the heat-dissipating adhesive 5 that bonds the wiring board 1 and the protrusion 2a of the metal base 2 are the same as in Example 1. Although it is a silicone adhesive, the filler 9 is filled in the through hole 11 of the wiring board 1 on which the electrolytic capacitor 20 is mounted.
  • Filler 9 is an epoxy adhesive and contains alumina, which is an insulating and thermally conductive inorganic filler, in order to increase thermal conductivity, and has a thermal conductivity of 3 W / m ⁇ K.
  • This filler 9 is filled in advance, and pads 10a and 10b are formed on the upper surface of the filler 9 by copper plating.
  • the filling material 9 is filled from the beginning when the substrate is purchased, and the cost is somewhat increased when the substrate is purchased. However, the process of filling the heat radiation adhesive material 5 into the through hole 11 becomes unnecessary.
  • FIG. 8 is a view showing a through hole of the wiring board of Example 2 of the electronic control device according to the present embodiment.
  • the through-hole 11 is a through-hole having a diameter of 0.4 mm.
  • copper pads 10a and 10b that are solder-connected to the lead terminals 20a and 20b of the electrolytic capacitor 20 are arranged. Therefore, a pad-on-via structure is formed in which the pads 10a and 10b above the through hole 11 and the lead terminals 20a and 20b of the electrolytic capacitor 20 are connected.
  • the heat-dissipating adhesive 5 is applied after the electrolytic capacitor 20 is mounted, it is preferable to apply the heat-dissipating adhesive 5 so as to cover the lead terminals 20a and 20b and the pedestal 21 as shown in FIG. Of course, vibration resistance can be improved.
  • the electronic control device created in this way has a heat dissipation structure that dissipates heat from the heat generating source from the lead terminal closest to the heat source, and is excellent in heat dissipation.
  • the vibration damping structure in which the electronic component is held by a low-elastic adhesive material provides excellent vibration resistance. Due to these effects, the electronic control device of this embodiment has reliability that can be used even in an environment where the transmission is directly attached.
  • the mounting structure of the electronic control device according to the present embodiment is used, for example, as an in-vehicle ECU or ATCU, but may be used for in-vehicle electronic control.
  • the electronic control device mounting structure of the present invention can be modified in various ways without departing from the scope of the invention.
  • the electrolytic capacitor 20 may be a coil or the like that does not have a heat dissipation structure in the component itself.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention porte sur une structure de montage d'appareil de commande électronique, qui améliore les caractéristiques de dissipation thermique d'un composant électronique qui ne possède pas une structure de dissipation thermique, et qui possède une excellente productivité de masse. Un appareil de commande électronique selon la présente invention est configuré par : une carte de câblage qui comporte un trou traversant ; un composant électronique, qui est monté sur une première surface de la carte de câblage, et qui possède des bornes de conducteur faisant saillie dans une direction, lesdites bornes de conducteur étant connectées électriquement à la carte de câblage ; et un élément de dissipation thermique, qui est monté sur une seconde surface de la carte de câblage, ladite seconde surface étant sur le côté inverse de la première surface, et qui est fixé dans un état dans lequel l'élément de dissipation thermique est tourné vers le composant électronique et le trou traversant. L'appareil de commande électronique comporte : un matériau d'adhésif de dissipation thermique recouvrant les bornes de conducteur du composant électronique ; et un matériau de remplissage, avec lequel le trou traversant est rempli, ledit matériau de remplissage ayant une conductivité thermique élevée. Le matériau d'adhésif de dissipation thermique est en contact avec le matériau de remplissage, et en outre, un chemin de dissipation thermique depuis les bornes de conducteur vers l'élément de dissipation thermique est fourni par amenée du matériau d'adhésif de dissipation thermique en contact thermique avec l'élément de dissipation thermique.
PCT/JP2014/078010 2013-11-20 2014-10-22 Structure de montage d'appareil de commande électronique Ceased WO2015076050A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015549040A JP6307093B2 (ja) 2013-11-20 2014-10-22 電子制御装置、電子制御装置の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-239457 2013-11-20
JP2013239457 2013-11-20

Publications (1)

Publication Number Publication Date
WO2015076050A1 true WO2015076050A1 (fr) 2015-05-28

Family

ID=53179320

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/078010 Ceased WO2015076050A1 (fr) 2013-11-20 2014-10-22 Structure de montage d'appareil de commande électronique

Country Status (2)

Country Link
JP (1) JP6307093B2 (fr)
WO (1) WO2015076050A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018014415A (ja) * 2016-07-21 2018-01-25 Ｋｙｂ株式会社 放熱構造
WO2018124288A1 (fr) 2016-12-28 2018-07-05 三菱電機株式会社 Dispositif d'alimentation électrique et procédé de production de dispositif d'alimentation électrique
WO2019212680A1 (fr) * 2018-05-03 2019-11-07 Intel Corporation Solutions de gestion thermique pour dispositifs à circuits intégrés empilés utilisant des dispositifs de transfert de chaleur unidirectionnels
WO2020003423A1 (fr) 2018-06-27 2020-01-02 三菱電機株式会社 Dispositif d'alimentation électrique
KR102163763B1 (ko) * 2019-07-31 2020-10-08 현대오트론 주식회사 하우징과 pcb의 조립구조
WO2021096305A1 (fr) * 2019-11-13 2021-05-20 엘지이노텍 주식회사 Convertisseur
WO2021245983A1 (fr) * 2020-06-05 2021-12-09 日立Astemo株式会社 Dispositif de commande électronique monté sur véhicule
WO2022068337A1 (fr) * 2020-09-30 2022-04-07 东莞市趣电智能科技有限公司 Module de dissipation de chaleur, et pistolet de charge et base de charge le comprenant

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134953A (en) * 1980-12-29 1982-08-20 Honeywell Inf Systems Integrated circuit package
JPH03128965U (fr) * 1990-04-11 1991-12-25
JP2013012649A (ja) * 2011-06-30 2013-01-17 Denso Corp 電子部品の実装構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134953A (en) * 1980-12-29 1982-08-20 Honeywell Inf Systems Integrated circuit package
JPH03128965U (fr) * 1990-04-11 1991-12-25
JP2013012649A (ja) * 2011-06-30 2013-01-17 Denso Corp 電子部品の実装構造

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018014415A (ja) * 2016-07-21 2018-01-25 Ｋｙｂ株式会社 放熱構造
WO2018016144A1 (fr) * 2016-07-21 2018-01-25 Ｋｙｂ株式会社 Structure de dissipation de charleur
WO2018124288A1 (fr) 2016-12-28 2018-07-05 三菱電機株式会社 Dispositif d'alimentation électrique et procédé de production de dispositif d'alimentation électrique
JPWO2018124288A1 (ja) * 2016-12-28 2019-03-28 三菱電機株式会社 電源装置及び電源装置の製造方法
US11172573B2 (en) 2016-12-28 2021-11-09 Mitsubishi Electric Corporation Power supply device
WO2019212680A1 (fr) * 2018-05-03 2019-11-07 Intel Corporation Solutions de gestion thermique pour dispositifs à circuits intégrés empilés utilisant des dispositifs de transfert de chaleur unidirectionnels
US11234343B2 (en) 2018-05-03 2022-01-25 Intel Corporation Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices
EP3817529A4 (fr) * 2018-06-27 2021-07-28 Mitsubishi Electric Corporation Dispositif d'alimentation électrique
JPWO2020003423A1 (ja) * 2018-06-27 2021-04-22 三菱電機株式会社 電源装置
WO2020003423A1 (fr) 2018-06-27 2020-01-02 三菱電機株式会社 Dispositif d'alimentation électrique
US11772829B2 (en) 2018-06-27 2023-10-03 Mitsubishi Electric Corporation Power supply device
JP7278278B2 (ja) 2018-06-27 2023-05-19 三菱電機株式会社 電源装置
KR102163763B1 (ko) * 2019-07-31 2020-10-08 현대오트론 주식회사 하우징과 pcb의 조립구조
WO2021096305A1 (fr) * 2019-11-13 2021-05-20 엘지이노텍 주식회사 Convertisseur
US12219742B2 (en) 2019-11-13 2025-02-04 Lg Innotek Co., Ltd. Converter including heat transfer layer
JP2021192401A (ja) * 2020-06-05 2021-12-16 日立Astemo株式会社 車載電子制御装置
WO2021245983A1 (fr) * 2020-06-05 2021-12-09 日立Astemo株式会社 Dispositif de commande électronique monté sur véhicule
JP7365295B2 (ja) 2020-06-05 2023-10-19 日立Astemo株式会社 車載電子制御装置
WO2022068337A1 (fr) * 2020-09-30 2022-04-07 东莞市趣电智能科技有限公司 Module de dissipation de chaleur, et pistolet de charge et base de charge le comprenant

Also Published As

Publication number Publication date
JP6307093B2 (ja) 2018-04-04
JPWO2015076050A1 (ja) 2017-03-16

Similar Documents

Publication Publication Date Title
JP6307093B2 (ja) 電子制御装置、電子制御装置の製造方法
US7679914B2 (en) Electronic controller
JP6666927B2 (ja) 電子制御装置
JP6443688B2 (ja) 回路構成体、及び電気接続箱
JP2013514674A (ja) 変速機制御装置として使用するため裸ダイ取付けにより重なり合って設けられる複数の印刷配線板層を持つ印刷配線板
JP2016502279A (ja) プラスチックで被覆された電子回路を備えた電子モジュールおよび該電子モジュールを製造する方法
JP6327140B2 (ja) 電子装置
JP4841592B2 (ja) 制御装置
JP2010219182A (ja) コイル部品
JPWO2011062252A1 (ja) 部品内蔵モジュールの製造方法および部品内蔵モジュール
JP6354163B2 (ja) 回路基板および電子装置
JP5239736B2 (ja) 電子装置
JP2003218317A (ja) 半導体電力変換装置
JP6391430B2 (ja) 電子制御装置およびその製造方法
JP2004179313A (ja) 回路配線基板
JP2020047840A (ja) 電子制御装置
JP4860800B2 (ja) パワー回路配線構造の製造方法
JP5150563B2 (ja) 電子制御装置
JP5164780B2 (ja) 変速制御装置および電子回路封入装置
JP6323011B2 (ja) 多層基板
JP2010219093A (ja) 電子回路装置
JP4770528B2 (ja) 電子機器
JP2015002244A (ja) 電子部品を有する電子装置
JP4439248B2 (ja) 配線基板およびこれを用いた半導体装置
JP2009049109A (ja) モジュール装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14863816

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2015549040

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14863816

Country of ref document: EP

Kind code of ref document: A1