WO2015068805A1 - 封止用樹脂組成物 - Google Patents
封止用樹脂組成物 Download PDFInfo
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- WO2015068805A1 WO2015068805A1 PCT/JP2014/079588 JP2014079588W WO2015068805A1 WO 2015068805 A1 WO2015068805 A1 WO 2015068805A1 JP 2014079588 W JP2014079588 W JP 2014079588W WO 2015068805 A1 WO2015068805 A1 WO 2015068805A1
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- resin composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08L23/22—Copolymers of isobutene; Butyl rubber; Homopolymers or copolymers of other iso-olefins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Definitions
- the present invention relates to a resin composition that can be suitably used for sealing an organic EL element.
- An organic EL (Electroluminescence) element is a light-emitting element using an organic substance as a light-emitting material, and can obtain high-intensity light emission at a low voltage.
- organic EL elements are extremely sensitive to moisture, and the organic material itself is altered by moisture, resulting in a decrease in brightness, no light emission, the interface between the electrode and the organic EL layer being peeled off due to moisture, metal There is a problem that the metal oxide is oxidized to increase the resistance.
- thermosetting resin composition When the thermosetting resin composition is used as a whole surface sealing material for an organic EL element, the lamination work is easy because the material viscosity before curing is low, and the moisture permeability of the cured product after thermosetting is low. As an advantage. However, on the other hand, there is a problem that the organic EL element deteriorates due to the heating temperature during thermosetting.
- Patent Document 1 discloses an encapsulating film containing a polyisobutylene resin and a hydrogenated cyclic olefin-based polymer.
- the film is usually laminated with a protective film and the tackiness of the film is large, it is difficult to peel off the protective film, and the film is greatly deformed when the protective film is peeled off. It is known that handling is extremely difficult.
- Patent Document 2 discloses a composition for a sealing material containing an isobutylene polymer, an epoxy group-containing compound, and a curing agent for epoxy resin, and this composition is used for hot melt coating. Therefore, a sheet cannot be produced as easily as varnish coating. In addition, there is no mention of adhesion and handling properties, and no sufficient study has been made. Further, as a method for avoiding thermal degradation of the organic EL element, Patent Document 3 discloses polyisobutylene resin, polyisoprene resin having a functional group capable of reacting with an epoxy group and / or polyisobutylene resin, tackifying resin, and epoxy. A resin composition containing a resin is disclosed.
- Patent Document 4 discloses a sealing resin composition containing a styrene-isobutylene-modified resin and (B) a tackifying resin.
- a process of heating and curing at a high temperature such as 130 ° C. for a long time after coating and drying is required, and there is a problem in flatness and productivity such as curling of the film.
- the hardness is insufficient, there is a problem that the adhesive breaks down after storage at high temperature and peels off when used with another optical film that contracts due to heat, such as a polarizing plate. .
- varnish coating is possible, it can be easily made into a sheet, does not require a heat curing step, can greatly reduce the thermal deterioration of the organic EL device, and can also be productive It is an object to provide a resin composition and a resin composition sheet obtained from the resin composition that can realize a sheet having good transparency, moisture permeability resistance, adhesive strength, and heat resistance.
- the present inventor has used the sealing resin composition containing the polyisobutylene resin (A), the modified polyolefin resin (B), and the tackifier resin (C) to achieve the above problem. Has been found to be solved, and the present invention has been achieved.
- the present invention provides “(1) a sealing resin composition comprising a polyisobutylene resin (A), a modified polyolefin resin (B), and a tackifying resin (C), (2) The encapsulating resin composition according to (1), wherein the polyisobutylene resin (A) is contained in an amount of 35 to 95% by mass with respect to 100% by mass of the nonvolatile content in the resin composition.
- G hygroscopic metal oxide
- varnish coating can be performed, and a sheet can be easily formed without requiring a heat curing step. Not only can the thermal degradation of organic EL elements be greatly reduced, it can also greatly improve productivity, and can realize a sheet that combines good transparency, moisture permeability resistance, adhesive strength, and heat resistance.
- the resin composition sheet for sealing and the resin composition sheet for sealing obtained from this composition can be provided.
- the resin composition of the present invention is mainly characterized by containing a polyisobutylene resin (A), a modified polyolefin resin (B), and a tackifier resin (C).
- the polyisobutylene resin (A) (hereinafter also abbreviated as “component (A)”) used in the present invention has an effect of stably maintaining other physical properties while improving the moisture permeability of the resin composition.
- component (A) is preferably in a solid state at room temperature (25 ° C.).
- the component (A) is a polymer mainly composed of a polyisobutylene skeleton
- an isobutylene homopolymer (homopolymer) or an appropriate amount of an olefinic compound such as 1-butene or 2-butene is added to isobutylene.
- a copolymer (block copolymer or graft copolymer) in which the skeleton is copolymerized may be used.
- Examples of monomer components other than isobutylene in the copolymer include isoprene, styrene, butadiene, ethylene, propylene, acrylonitrile, vinyl chloride, vinyl bromide, hydrogenated styrene, pentadiene, cyclopentadiene, and dicyclopentadiene. These can use 1 type (s) or 2 or more types. Of these, styrene is preferable from the viewpoints of improvement of heat resistance and moisture permeability.
- the proportion of the polyisobutylene skeleton is preferably 50% by mass or more, more preferably 60% by mass or more of the whole polymer.
- the preferred copolymer composition that is, the ratio of each of the segment skeletons composed of monomer components other than polyisobutylene skeleton and isobutylene (polyisobutylene skeleton / segment skeleton composed of monomer components other than isobutylene) is 60 to 90% by mass / It is 10 to 40% by mass, and more preferably 65 to 80% by mass / 20 to 35% by mass.
- the copolymer may be used in combination with an isobutylene polymer.
- component (A) examples include commercially available products such as Opanol B10, B12, B15, B50, B50SF, B80, B100, B120, B150, B220 (manufactured by BASF), JSR butyl 065, 268, 365 (JSR). Manufactured), Vistanex LM-MS, MH, H, MML-80, 100, 120, 140 (manufactured by Exxon Chemical), HYCAR (manufactured by Goodrich), SIBSTARSTT102 (manufactured by Kaneka), and the like. These may be used alone or in combination of two or more.
- the average molecular weight of the component (A) is not particularly limited, but from the viewpoint of providing good coatability and compatibility, the viscosity average molecular weight is preferably 4,000,000 or less, and 2,600,000 or less. More preferred is 1,000,000 or less. On the other hand, the viscosity average molecular weight is preferably 100,000 or more from the viewpoint of preventing repellency during coating of the resin composition, expressing moisture resistance of the resin composition sheet, and improving mechanical strength. 000 or more is more preferable, and 300,000 or more is more preferable.
- the component (A) is preferably solid at room temperature (25 ° C.).
- the viscosity average molecular weight in this invention is calculated
- a component can use 1 type (s) or 2 or more types.
- limiting in particular in content of (A) component in a resin composition From a viewpoint that it can provide favorable coating property and compatibility, and can ensure favorable thermal resistance and handleability (tack suppression), 95 mass% or less is preferable with respect to 100 mass% of non volatile matters in a resin composition, and 80 mass% or less is more preferable.
- 35% by mass or more is preferable and 50% by mass or more is more preferable with respect to 100% by mass of the nonvolatile content in the resin composition.
- the modified polyolefin resin (B) used in the present invention (hereinafter also abbreviated as “component (B)”) has a cohesive strength while maintaining good adhesion to the substrate of the resin composition sheet obtained. (Holding power) is improved, heat resistance is improved, and handleability in the sheet processing step is also improved.
- the improvement of holding power here means reducing the amount of shear deviation after 1 hour at 80 ° C. and 1 kg load, preferably to 0.5 mm or less.
- the component (B) used in the present invention can further improve the cohesive force (holding force) and improve heat resistance by causing a crosslinking reaction after the sheet is formed.
- the component (B) is a polymer mainly composed of an olefin skeleton, and is a homopolymer (homopolymer) or a copolymer containing an olefin skeleton, and has a functional group, and is particularly limited. Not.
- the form of the copolymer is not particularly limited, and examples thereof include a random copolymer, a block copolymer, and a graft copolymer.
- Examples of the monomer component of the olefin include ethylene, propylene, 1-butene, 2-butene and the like, and these can be used alone or in combination of two or more. Of these, ethylene and 1-butene are preferable from the viewpoint of compatibility with the component (A).
- Examples of monomer components other than olefins include styrene, butadiene, acrylonitrile, vinyl chloride, vinyl bromide, hydrogenated styrene, pentadiene, cyclopentadiene, dicyclopentadiene, and the like, one or two of these. The above can be used. Of these, styrene is preferable from the viewpoints of improvement of heat resistance and moisture permeability.
- component (B) a copolymer containing ethylene and / or 1-butene and styrene and having a functional group can be mentioned.
- the proportion of each component of ethylene, 1-butene and styrene is not particularly limited, but the total proportion of ethylene and / or 1-butene component is 20% by mass or more of the entire copolymer. More preferably, it is 40% by mass or more, and the proportion of the styrene component is preferably 10% by mass or more, more preferably 20% by mass or more of the entire copolymer.
- the functional group may have any structure as long as it does not adversely affect the desired moisture resistance and adhesiveness.
- an acid anhydride group [—C (O) —O—C (O) —] Carboxyl group, epoxy group, amino group, hydroxyl group, oxazoline group, oxetane group, cyanate group, phenol group [-Ph-OH], hydrazide group, amide group, etc., among which an acid anhydride group is preferred.
- the functional group may be any one of these or two or more.
- component (B) examples include a copolymer containing an acid anhydride group as the functional group and containing ethylene and / or 1-butene and styrene.
- the acid value is preferably 1 to 50 mgKOH / g, and more preferably 5 to 30 mgKOH / g. preferable.
- the acid value referred to here is based on JIS K 2501-2003 petroleum product and lubricating oil-neutralization number test method.
- the number average molecular weight of the component (B) is preferably 300,000 or less, and more preferably 150,000 or less, from the viewpoint of improving the compatibility of the resin composition. Moreover, from a viewpoint of expressing the moisture permeability resistance of a resin composition, 5,000 or more are preferable and 10,000 or more are more preferable.
- the component (B) is preferably a solid at room temperature (25 ° C.).
- the number average molecular weight in this invention is measured by the gel permeation chromatography (GPC) method (polystyrene conversion).
- GPC gel permeation chromatography
- the number average molecular weight by the GPC method is LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device, and Shodex K-800P / K-804L / K-804L manufactured by Showa Denko KK as a column. Measured at a column temperature of 40 ° C. using tetrahydrofuran or the like as the mobile phase, and can be calculated using a standard polystyrene calibration curve.
- component (B) Commercially available products that can be used as component (B) include Surflene P-1000 (a special polyolefin resin acid-modified (number average molecular weight 70000) 20% solution (acid value 13-16 mg KOH / g), Mitsubishi Chemical Corporation. Manufactured).
- Surflene P-1000 a special polyolefin resin acid-modified (number average molecular weight 70000) 20% solution (acid value 13-16 mg KOH / g), Mitsubishi Chemical Corporation. Manufactured).
- (B) 1 type or 2 types or more can be used for a component.
- limiting in particular in content of (B) component in a resin composition 40 mass with respect to 100 mass% of non volatile matters in a resin composition from a viewpoint that the favorable moisture permeability resistance of a resin composition can be ensured. % Or less is preferable, and 30% by mass or less is more preferable.
- 1 mass% or more is preferable with respect to 100 mass% of non volatile matters in a resin composition, and 5 mass% or more is more preferable.
- the tackifier resin (C) used in the present invention can stably maintain other physical properties while improving the adhesiveness of the resin composition.
- the component (C) is not particularly limited, and is a terpene resin, modified terpene resin (hydrogenated terpene resin, terpene phenol copolymer resin, aromatic modified terpene resin, etc.), coumarone resin, indene resin, petroleum resin.
- terpene resin modified terpene resin
- modified terpene resin hydrochloric resin
- coumarone resin indene resin
- indene resin petroleum resin.
- terpene resin aromatic modified terpene resin, terpene phenol copolymer resin, hydrogenated alicyclic petroleum resin, aromatic petroleum resin, and aliphatic aromatic copolymer are preferred in terms of compatibility, adhesion, and moisture permeability.
- Polymerized petroleum resins and alicyclic petroleum resins are more preferable, and terpene resins and aromatic modified terpene resins are more preferable.
- the component (C) may be used alone or in combination of two or more.
- examples of terpene resins include YS resin PX and YS resin PXN (both manufactured by Yasuhara Chemical Co., Ltd.), and examples of aromatic modified terpene resins include YS resin TO, TR. Series (all manufactured by Yasuhara Chemical Co., Ltd.) and the like, and as hydrogenated terpene resins, Clearon P, Clearon M, Clearon K series (all manufactured by Yasuhara Chemical Co., Ltd.) and the like are listed, and terpene phenol copolymer resin is YS Polystar 2000.
- (C) component content in a resin composition From a viewpoint of maintaining favorable moisture permeability resistance, 40 mass% or less is with respect to 100 mass% of non volatile matters in a resin composition. Preferably, 30 mass% or less is more preferable. Moreover, from a viewpoint of having sufficient adhesiveness, 1 mass% or more is preferable with respect to 100 mass% of non volatile matters in a resin composition, and 5 mass% or more is more preferable.
- the softening point of the component (C) is preferably 50 to 200 ° C., more preferably 90 to 160 ° C., from the viewpoint that the sheet is softened in the step of laminating the resin composition sheet and has the desired heat resistance.
- the softening point is measured by the ring and ball method according to JIS K2207.
- Isoprene component (D)
- liquid polybutadiene is a liquid butadiene-based polymer
- liquid polyisoprene is a liquid isoprene-based polymer
- Liquid is a state at room temperature (25 ° C.).
- liquid polybutadiene and liquid polyisoprene having a functional group capable of reacting with an isocyanate group examples include NIISO-PB G series, GI series (manufactured by Nippon Soda Co., Ltd.), etc.
- liquid polyisoprene examples include Epol (made by Idemitsu Kosan Co., Ltd.). You may use these 1 type or in combination of 2 or more types.
- the content of the component (D) in the resin composition is not particularly limited, but is preferably 20% by mass or less with respect to 100% by mass of the nonvolatile content in the resin composition from the viewpoint of maintaining desired transparency. 15% by mass or less is more preferable. Moreover, 1 mass% or more is preferable with respect to 100 mass% of non volatile matters in a resin composition from a viewpoint of fully expressing the effect which mix
- the resin composition of the present invention can improve the curing performance of the resin composition by further containing a curing agent to the extent that the effects of the present invention are not impaired.
- the curing agent (E) in the present invention is a compound that reacts with the functional group of the component (B) or the component (D), and is not particularly limited, but is an epoxy compound, an isocyanate compound, a metal chelate compound, a metal alkoxide. , Metal salts, amine compounds, hydrazine compounds or aldehyde compounds. You may use these 1 type or in combination of 2 or more types. When using an isocyanate compound, a tin compound may be used in combination as a catalyst.
- the inorganic filler is not particularly limited, but silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, boron nitride, aluminum borate, barium titanate Strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate and the like.
- talc and mica are preferable and talc is particularly preferable from the viewpoint of improving the moisture permeability of the cured resin. You may use these 1 type or in combination of 2 or more types.
- the inorganic filler is preferably one that has been surface treated with a surface treatment agent to improve its moisture resistance.
- a surface treatment agent aminosilane-based cups such as aminopropylmethoxysilane, aminopropyltriethoxysilane, ureidopropyltriethoxysilane, N-phenylaminopropyltrimethoxysilane, N-2 (aminoethyl) aminopropyl trimethoxysilane, etc.
- Epoxy silanes such as ring agents, glycidoxypropyltrimethoxysilane, glycidoxypropyltriethoxysilane, glycidoxypropylmethyldiethoxysilane, glycidylbutyltrimethoxysilane, (3,4-epoxycyclohexyl) ethyltrimethoxysilane Coupling agents, mercaptosilane coupling agents such as mercaptopropyltrimethoxysilane, mercaptopropyltriethoxysilane, methyltrimethoxysilane, octadecyltrimethoxy Silane coupling agents such as Sisilane, Phenyltrimethoxysilane, Methacryloxypropyltrimethoxysilane, Imidazolesilane, Triazinesilane, Hexamethyldisilazane, Hexaphenyldisilazane, Trisilazan
- the average particle size of the inorganic filler is not particularly limited, but is preferably 10 ⁇ m or less and more preferably 5 ⁇ m or less from the viewpoint of not damaging the organic EL element. On the other hand, from the viewpoint of exhibiting moisture permeability resistance, 0.05 ⁇ m or more is preferable, and 0.1 ⁇ m or more is more preferable.
- the average particle size of the inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be created on a volume basis by a laser diffraction particle size distribution measuring device, and the median diameter can be measured as the average particle diameter.
- a measurement sample an inorganic filler dispersed in water by ultrasonic waves can be preferably used.
- LA-500 manufactured by Horiba, Ltd. can be used as a laser diffraction particle size distribution measuring apparatus.
- the content of the inorganic filler is not particularly limited, but from the viewpoint of preventing the viscosity of the resin composition from rising and preventing the strength of the cured product from being reduced and becoming brittle. 50 mass% or less is preferable with respect to 100 mass% of non volatile matters in a thing, 40 mass% or less is more preferable, and 30 mass% or less is still more preferable. On the other hand, from the viewpoint of sufficiently obtaining the effect of blending the inorganic filler, it is preferably 1% by mass or more, more preferably 5% by mass or more, more preferably 10% by mass or more with respect to 100% by mass of the nonvolatile content in the resin composition. Is more preferable.
- the resin composition of the present invention may further contain a hygroscopic metal oxide (G) in order to further improve the moisture permeability resistance of the cured product.
- hygroscopic metal oxide means a metal oxide that has a capability of absorbing moisture and chemically reacts with moisture that has been absorbed to become a hydroxide.
- it is one kind selected from calcium oxide, magnesium oxide, strontium oxide, aluminum oxide, barium oxide, or the like, or a mixture or solid solution of two or more kinds.
- calcium oxide and magnesium oxide are preferable from the viewpoint of high hygroscopicity, cost, and stability of raw materials.
- the mixture or solid solution of two or more types include calcined dolomite (a mixture containing calcium oxide and magnesium oxide), calcined hydrotalcite (a solid solution of calcium oxide and aluminum oxide), and the like. It is done.
- a hygroscopic metal oxide is known as a hygroscopic material in various technical fields, and a commercially available product can be used. Specifically, calcium oxide (“Moystop # 10” manufactured by Sankyo Flour Milling Co., Ltd.), magnesium oxide (“Kyowa Mag MF-150”, “Kyowa Mag MF-30” manufactured by Kyowa Chemical Industry Co., Ltd., “Pure Mag” manufactured by Tateho Chemical Industry Co., Ltd.
- the average particle diameter of the hygroscopic metal oxide is not particularly limited, but is 10 ⁇ m or less from the viewpoint of preventing coarse particles from damaging the organic EL element in the sealing step and increasing the interfacial bond strength with the resin component. Preferably, it is 5 ⁇ m or less, more preferably 1 ⁇ m or less. On the other hand, 0.001 ⁇ m or more is preferable from the viewpoint of preventing the particles from being easily aggregated and preventing it from being difficult to impart sufficiently high moisture resistance to the cured product due to poor dispersion in the composition. 0.01 ⁇ m or more is more preferable, and 0.1 ⁇ m or more is more preferable.
- the average particle size of the hygroscopic metal oxide is 10 ⁇ m or less, it can be used as it is, but if the average particle size of the commercial product exceeds 10 ⁇ m, the average particle size is 10 ⁇ m or less by pulverization, classification, etc. It is preferable to use after preparing the granular material.
- the hygroscopic metal oxide those having an average particle diameter in the above-mentioned preferred range and not containing coarse particles having a particle diameter of 20 ⁇ m or more are preferable. More preferably, it does not contain coarse particles of 5 ⁇ m or more. By not including such coarse particles, it is advantageous in that the EL element is hardly damaged in the sealing process.
- the average particle diameter of the hygroscopic metal oxide can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the hygroscopic metal oxide can be created on a volume basis by a laser diffraction particle size distribution measuring device, and the median diameter can be measured as the average particle diameter.
- a hygroscopic metal oxide dispersed in water by ultrasonic waves can be preferably used.
- a LAW-500 manufactured by Horiba Ltd. can be used as a laser diffraction type particle size distribution measuring device.
- hygroscopic metal oxide a surface treated with a surface treatment agent can be used.
- a surface-treated hygroscopic metal oxide By using such a surface-treated hygroscopic metal oxide, the adhesion stability of the cured product can be further increased, and the moisture in the resin reacts with the hygroscopic metal oxide before curing. Can be prevented.
- the surface treatment agent used for the surface treatment for example, higher fatty acids, alkylsilanes, silane coupling agents and the like can be used, among which higher fatty acids or alkylsilanes are preferable. You may use these 1 type or in combination of 2 or more types.
- higher fatty acid for example, higher fatty acids having 18 or more carbon atoms such as stearic acid, montanic acid, myristic acid and palmitic acid are preferable. Of these, stearic acid is preferred. You may use these 1 type or in combination of 2 or more types.
- Alkylsilanes include methyltrimethoxysilane, ethyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, octadecyltrimethoxysilane, dimethyldimethoxysilane, octyltriethoxysilane, n-octadecyldimethyl ( And 3- (trimethoxysilyl) propyl) ammonium chloride. You may use these 1 type or in combination of 2 or more types.
- silane coupling agent examples include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropyl (dimethoxy) methylsilane, and 2- (3,4-epoxycyclohexyl) ethyltrimethoxy.
- Epoxy silane coupling agents such as silane; mercapto silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane ; 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltri Amino-based silane cups such as toxisilane, N-methylaminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and N- (2-aminoethyl) -3-aminopropyldimethoxymethylsilane Ringing agents; Ureido silane coupling agents such
- the surface treatment can be performed, for example, by adding and spraying a surface treatment agent and stirring for 5 to 60 minutes while stirring and dispersing untreated hygroscopic metal oxide at room temperature with a mixer.
- a mixer a well-known mixer can be used, for example, blenders, such as V blender, a ribbon blender, and a bubble cone blender, mixers, such as a Henschel mixer and a concrete mixer, a ball mill, a cutter mill, etc. are mentioned.
- a method of surface treatment by mixing the higher fatty acid, alkylsilanes or silane coupling agent is also possible.
- the treatment amount of the surface treatment agent varies depending on the type of the hygroscopic metal oxide or the type of the surface treatment agent, but is preferably 1 to 10% by weight with respect to the hygroscopic metal oxide.
- the content of the hygroscopic metal oxide is not particularly limited, but from the viewpoint of preventing the viscosity of the resin composition from increasing and preventing the strength of the cured product from being reduced and becoming brittle. 50 mass% or less is preferable with respect to 100 mass% of non volatile matters in a resin composition, 40 mass% or less is more preferable, and 30 mass% or less is still more preferable. On the other hand, from the viewpoint of sufficiently obtaining the effect of blending the inorganic filler, it is preferably 1% by mass or more, more preferably 5% by mass or more, more preferably 10% by mass or more with respect to 100% by mass of the nonvolatile content in the resin composition. Is more preferable.
- the resin composition of the present invention may optionally contain various resin additives other than the above-described components to the extent that the effects of the present invention are not impaired.
- resin additives include organic fillers such as rubber particles, silicon powder, nylon powder, and fluorine powder, thickeners such as olben and benton, silicone-based, fluorine-based, and polymer-based antifoaming agents.
- adhesion promoters such as leveling agents, triazole compounds, thiazole compounds, triazine compounds, porphyrin compounds, and the like can be given.
- the method for preparing the resin composition of the present invention is not particularly limited, and examples thereof include a method of adding a solvent or the like as necessary and mixing the blended components using a rotary mixer or the like.
- the transparency of the cured product of the resin composition of the present invention can be measured with a spectrophotometer.
- the transmittance at 380 to 780 nm calculated in accordance with JIS Z8722 is preferably 80% or more, more preferably 82% or more, still more preferably 84% or more, still more preferably 86% or more, and 88%
- the above is particularly preferable, and 90% or more is particularly preferable.
- the moisture permeation resistance of the cured product of the resin composition of the present invention can be measured by the differential pressure method of JIS K-7129A (measuring conditions: temperature 40 ° C., relative humidity 90%).
- the value when a resin composition layer having a thickness of 50 ⁇ m is measured under the conditions of 40 ° C. and 90% RH is 40 g / m 2 ⁇ day or less is preferred, 20 g / m 2 ⁇ day or less is more preferred, and 10 / m 2 ⁇ day or less is even more preferred.
- the lower the moisture permeability the better, but practically, it is preferably 0.1 g / m 2 ⁇ day or more.
- the use of the resin composition of the present invention is not particularly limited, it can be used as a sealing material for various devices such as semiconductors, solar cells, high-brightness LEDs, LCDs, and organic ELs, and is particularly suitable for organic EL devices. Can be used.
- the resin composition sheet of the present invention includes both a sheet of the resin composition itself of the present invention and a sheet in which a layer of the resin composition of the present invention is formed on a support.
- a resin composition sheet obtained by forming a layer of the resin composition of the present invention on a support is laminated on a necessary portion of an object to be applied, and the resin composition layer is applied. You may make it transfer to a target object.
- the organic EL device When the resin composition sheet obtained by forming the resin composition layer of the present invention on a support is applied to an organic EL device, the organic EL device is cured in advance before the organic EL device sealing step. Heat sealing after the sealing step is not required, and the thermal deterioration of the organic EL element can be greatly reduced. Industrially, a method using such a resin composition sheet is preferable.
- the resin composition sheet having a support can be carried out using methods known to those skilled in the art, such as die coating, spin coating, doctor blade coating, calendering, and extrusion molding.
- it can be produced by preparing a varnish in which a resin composition is dissolved in an organic solvent, applying the varnish on a support, and further drying the organic solvent by heating or blowing hot air.
- organic solvent examples include aliphatic hydrocarbons such as hexane, heptane, and octane, alicyclic hydrocarbons such as cyclohexane and methylcyclohexane, and aromatic hydrocarbons such as toluene and xylene. From the viewpoint of the shelf life (usable period) of the resin composition sheet, those having a low boiling point are preferred, and one or two or more kinds may be used in combination.
- the drying conditions of the resin composition sheet of the present invention are not particularly limited, but are preferably dried at 50 to 140 ° C. for 3 to 20 minutes.
- the temperature is lower than 50 ° C., the amount of the solvent remaining in the resin composition layer tends to increase.
- the temperature is higher than 140 ° C., the support tends to be deformed by heat when the layer of the resin composition of the present invention is formed on the support.
- the resin composition sheet of the present invention can be cured by heating in advance to react the component (B), the component (D), and the component (E) before the sealing step.
- Such curing can be used as a resin composition sheet having better cohesive strength, adhesiveness, and handleability.
- the curing conditions are not particularly limited, but the curing temperature is preferably 20 to 50 ° C, more preferably 30 to 40 ° C.
- the curing time is preferably 1 to 10 days, and more preferably 3 to 7 days.
- the thickness of the cured resin composition sheet is preferably 3 ⁇ m to 200 ⁇ m, more preferably 10 ⁇ m to 100 ⁇ m, and even more preferably 20 ⁇ m to 80 ⁇ m.
- the cured resin composition sheet preferably has a resin composition weight reduction (residual solvent amount) of 0.1% or less when the sheet is dried at 130 ° C. for 15 minutes. By being 0.1% or less, the effect of reducing damage to the element after the sealing step to the organic EL device is improved.
- a moisture-proof support that is, a sealing substrate.
- the sealing substrate include a moisture-proof plastic film or a metal foil such as a copper foil and an aluminum foil.
- the plastic film having moisture resistance include a plastic film in which an inorganic substance such as silicon oxide (silica), silicon nitride, SiON, SiCN, or amorphous silicon is deposited on the surface.
- plastic film examples include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”), polyesters such as polyethylene naphthalate, polycarbonate, polyimide, and cycloolefin polymers (hereinafter referred to as “polyethylene terephthalate”).
- PET polyethylene terephthalate
- polyesters such as polyethylene naphthalate, polycarbonate, polyimide, and cycloolefin polymers
- COP cycloolefin polymers
- the sealing substrate one having a multilayer structure of two or more layers may be used.
- a support of the type in which the plastic film and the metal foil are bonded to each other with an adhesive in order to improve handling properties is inexpensive and is industrially convenient.
- a plastic film or the like that does not have moisture resistance can also be used as a support, and the surface of the resin composition may be protected by means such as a release liner. In that case, after forming the resin composition sheet on the substrate on which the organic EL element is formed, it is preferable to peel the support, and then separately laminate a sealing substrate on the resin composition sheet.
- the resin composition of the present invention can be provided in various shapes.
- a sheet formed from the resin composition of the present invention can be used in combination with a component of the electronic device. .
- a sheet formed from the resin composition can be used in combination with an optical film such as a color filter, a polarizing plate, or a retardation plate.
- Polyisobutylene resin (A) Polyisobutylene (isobutylene-based weight body) (Opanol B80, viscosity average molecular weight 800000, manufactured by BASF) -Polyisobutylene (isobutylene-based weight body) (B50SF, viscosity average molecular weight 400000, manufactured by BASF)
- Modified polyolefin resin (B) ⁇ Surflen P-1000 (20% solution of special polyolefin-based resin acid-modified product (number average molecular weight 70000), acid value 13-16 mg KOH / g, manufactured by Mitsubishi Chemical Corporation)
- Tackifying resin (C) Aromatic modified terpene resin (YS resin TO125, softening point 125 ° C., manufactured by Yasuhara Chemical Co., Ltd.)
- Liquid polybutadiene and / or liquid polyisoprene (D) having functional groups capable of reacting with isocyanate groups ⁇ Liquid polybutadiene (NIISO-PB G series, GI series, manufactured by Nippon Soda Co., Ltd.) ⁇ Liquid polyisoprene (Epol, Idemitsu Kosan Co., Ltd.)
- Curing agent (E) An isocyanate compound having a functional group capable of reacting with a functional group of liquid polyisobutylene and / or liquid polyisoprene butylene.
- Isocyanate compounds Duranate TPA-100, manufactured by Asahi Kasei Chemicals
- the resin composition sheet having a thickness of 50 ⁇ m was measured by a differential pressure method using a water vapor permeability evaluation apparatus DELTAPARM DP-ST manufactured by Technolox.
- a pressure-sensitive adhesive is applied on a release film so that the film thickness after drying is 50 ⁇ m, dried, and bonded to the moisture-proof layer side of COP having moisture resistance, and a laminated sheet provided with the moisture-proof film and the pressure-sensitive adhesive Created.
- a release film of such a laminated sheet is peeled off and bonded to a glass plate, and a polyvinyl alcohol polarizing plate having a cellulose triacetate film as a protective layer (average polymerization degree 1700 of polyvinyl alcohol polarizing film, average saponification degree 99.5).
- a polarizing plate having a pressure-sensitive adhesive layer on the cellulose triacetate film side was pressed and bonded to the moisture-proof film surface of a laminated sheet provided with a moisture-proof film and an adhesive.
- the bonded product was subjected to a durability test (left at 80 ° C. for 500 hours) to observe a foamed state, a peeled state, and a deteriorated state. The results are shown in Table 1.
- Example 1 40 parts of polyisobutylene (12.5% toluene solution of Oppanol B80) and 40 parts of polyisobutylene (12.5% toluene solution of B50SF) 5 parts) and 2 parts of an aromatic modified terpene resin solution (50% toluene solution of YS resin TO-125) were mixed and dispersed uniformly with a mixer to obtain a varnish.
- the obtained varnish is uniformly applied on a release treatment surface of a PET film (thickness 38 ⁇ m) treated with an alkyd release agent with a comma coater so that the thickness of the resin composition layer after drying becomes 50 ⁇ m.
- the resin composition sheet was obtained by applying and drying at 110 ° C. for 10 minutes.
- Example 2 Liquid polyisoprene (epol 50% toluene solution) 1 part, isocyanate compound (duranate TPA-100 50% toluene solution) 0.3 part, tin catalyst (0.1% toluene solution of dibutyltin laurate) 0
- a varnish was obtained according to the formulation table in Table 1 below.
- a resin composition sheet was obtained in exactly the same manner as in Example 1. The obtained resin composition sheet was aged at 35 ° C. for 3 days.
- Example 3 In the same manner as in Example 2 except that liquid polybutadiene (50% toluene solution of NIISO-PB GI3000) was used instead of liquid polyisoprene (50% toluene solution of Epaul), varnish was prepared according to the composition table of Table 1 below. Got. Using the obtained varnish, a resin composition sheet was obtained in exactly the same manner as in Example 2. The obtained resin composition sheet was aged at 35 ° C. for 3 days.
- liquid polybutadiene 50% toluene solution of NIISO-PB GI3000
- liquid polyisoprene 50% toluene solution of Epaul
- Example 1 A varnish was obtained in the same manner as in Example 1 except that the modified polyolefin resin (Surflen P-1000) was not used according to the formulation table in Table 1 below. Using the obtained varnish, a resin composition sheet was obtained in exactly the same manner as in Example 1.
- Example 2 A varnish was obtained in the same manner as in Example 2 except that the modified polyolefin resin (Surflen P-1000) was not used according to the formulation table in Table 1 below. Using the obtained varnish, a resin composition sheet was obtained in exactly the same manner as in Example 1. The obtained resin composition sheet was aged at 35 ° C. for 3 days.
- the modified polyolefin resin Sudflen P-1000
- Example 3 A varnish was obtained in the same manner as in Example 3 except that the modified polyolefin resin (Surflen P-1000) was not used according to the formulation table in Table 1 below. Using the obtained varnish, a resin composition sheet was obtained in exactly the same manner as in Example 1. The obtained resin composition sheet was aged at 35 ° C. for 3 days.
- the modified polyolefin resin Sudflen P-1000
- the resin composition sheet obtained from the resin composition of the present invention does not require high-temperature heating such as 80 ° C. for curing, and does not require heat-curing during lamination. It can be bonded with a sufficiently high adhesive force by low temperature heating, can maintain a good appearance even after being laminated in a polarizing plate and then placed in a high temperature environment, and has good transparency and good permeation resistance. Wet. Therefore, according to the present invention, a sealing material capable of forming a highly reliable sealing structure without causing deterioration of the organic EL element with respect to the organic EL element that is likely to be deteriorated by moisture or heat. A resin composition and a resin composition sheet can be obtained, thereby providing a highly reliable organic EL device.
- the resin composition of the present invention can be varnished and can be easily formed into a sheet. It does not require a heat-curing process and can not only greatly reduce the thermal degradation of organic EL elements, it can also greatly improve productivity, and has good moisture resistance, adhesive strength, transparency, and heat resistance. It is possible to provide a resin composition capable of realizing a sheet and a resin composition sheet obtained therefrom.
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Abstract
Description
また、有機EL素子の熱劣化を回避する方法として、特許文献3には、ポリイソブチレン樹脂、エポキシ基と反応し得る官能基を持つポリイソプレン樹脂及び/又はポリイソブチレン樹脂、粘着付与樹脂、及びエポキシ樹脂を含有する樹脂組成物が開示されている。特許文献4には、スチレンーイソブチレン変性樹脂及び(B)粘着付与樹脂を含有することを特徴とする封止用樹脂組成物が開示されている。しかし、いずれも塗布乾燥後に130℃といった高温で長時間かけて加熱硬化させる工程が必要となり、フィルムのカール等の平面性や生産性に問題があった。
一方、硬度が不十分であると、偏光板などの熱により収縮する他の光学フィルムと貼り合せて使用する場合に、高温保存後に粘着剤の凝集破壊が生じ、剥れてしまうという問題がある。
(2)前記樹脂組成物中の不揮発分100質量%に対し、前記ポリイソブチレン樹脂(A)を35~95質量%含有することを特徴とする、(1)に記載の封止用樹脂組成物、
(3)前記変性ポリオレフィン樹脂(B)が、単量体成分としてオレフィン及びスチレンを含む共重合体であることを特徴とする、(1)又は(2)に記載の封止用樹脂組成物、
(4)前記オレフィンがエチレン及び/又は1-ブテンであり、前記共重合体が、官能基を有するものであることを特徴とする(3)に記載の封止用樹脂組成物、
(5)前記変性ポリオレフィン樹脂(B)が、官能基として酸無水物基を有することを特徴とする、(1)~(4)のいずれか1項に記載の封止用樹脂組成物、
(6)前記樹脂組成物中の不揮発分100質量%に対し、前記変性ポリオレフィン樹脂(B)を1~40質量%含有することを特徴とする、(1)~(5)のいずれか1項に記載の封止用樹脂組成物、
(7)前記粘着付与樹脂(C)が、テルペン樹脂であることを特徴とする、(1)~(6)のいずれか1項に記載の封止用樹脂組成物、
(8)前記粘着付与樹脂(C)が、芳香族変性テルペン樹脂であることを特徴とする、(1)~(7)のいずれか1項に記載の封止用樹脂組成物、
(9)前記樹脂組成物中の不揮発分100質量%に対し、前記粘着付与樹脂(C)を1~40質量%含有することを特徴とする、(1)~(8)のいずれか1項に記載の封止用樹脂組成物、
(10)(1)~(9)のいずれか1項に記載の封止用樹脂組成物の硬化物、
(11)380nmから780nmまでの可視光透過率が80~100%であることを特徴とする、(10)に記載の硬化物、
(12)透湿度が0.1~40g/m2・dayであることを特徴とする、(10)または(11)に記載の硬化物、
(13)(1)~(9)のいずれか1項に記載の封止用樹脂組成物を含むことを特徴とする、封止用樹脂組成物シート、
(14)有機EL素子の封止用である(13)記載の封止用樹脂組成物シート、
(15)(1)~(9)のいずれか1項に記載の封止用樹脂組成物を含むことを特徴とする、有機ELデバイス、
(16)無機充填材(F)をさらに含有することを特徴とする、(1)~(9)のいずれか1項に記載の封止用樹脂組成物、
(17)吸湿性金属酸化物(G)をさらに含有することを特徴とする、(1)~(9)のいずれか1項に記載の封止用樹脂組成物」
に関する。
実験に用いた材料は以下の通りである。
ポリイソブチレン樹脂(A)
・ポリイソブチレン(イソブチレン系重量体)(オパノールB80、粘度平均分子量800000、BASF社製)
・ポリイソブチレン(イソブチレン系重量体)(B50SF、粘度平均分子量400000、BASF社製)
・サーフレンP-1000(特殊ポリオレフィン系樹脂酸変性物(数平均分子量70000)の20%溶液、酸価13~16mgKOH/g、三菱化学社製)
・芳香族変性テルペン樹脂(YSレジンTO125、軟化点125℃、ヤスハラケミカル社製)
・液状ポリブタジエン(NIISO-PB Gシリーズ、GIシリーズ、日本曹達社製)
・液状ポリイソプレン(エポール、出光興産社製)
液状ポリイソブチレン及び/又は液状ポリイソプレンブチレンの官能基と反応しうる官能基をもつ、イソシアネート系化合物。
・イソシアネート系化合物(デュラネートTPA-100、旭化成ケミカルズ社製)
・イソシアネート反応触媒:ラウリン酸ジブチルすず
・溶剤:トルエン
各種測定方法・評価方法について説明する。
厚み50μmの樹脂組成物シートを用い、島津社製分光光度UV-3600によって、380nmから780nmまでの分光スペクトルを測定し、JIS Z8722に準拠し、可視光透過率を算出した。
<ヘイズの評価>
ヘイズメーター(東京電色社製 TC-HIIIDPK)を用いて、JIS K6714に準拠して、得られた粘着シートのヘイズ値を測定した。
<対ガラス保持力の評価>
被着体としてガラス板に、各粘着シートを25mm×25mmの接着面積でラミネートし、50℃、0.5Paで30分間圧着し、ついでガラス板を垂下して粘着テープの自由末端に1000gの均一荷重を負荷し、80℃で1時間経過後の粘着テープがずれた長さを測定した。
<対ガラス剥離接着力>
被着体としてのガラス板に25mm×200mmの大きさにカットした各粘着テープを25×80mmの接着面積でラミネートし、50℃、0.5Paで30分間圧着し、23℃で20分間経過後、その剥離に要する力を測定した(180度剥離、引張り速度300mm/分、23℃、65%RH雰囲気下)。
<耐透湿性の評価>
厚み50μmの樹脂組成物シートについて、Technolox社の水蒸気透過性評価装置 DELTAPARM DP-STを用いて差圧法により測定した。(JIS K-7129A準拠 測定条件:温度40℃、相対湿度90%)
<耐熱性の評価>
粘着剤を剥離フィルム上に乾燥後の膜厚が50μmになるように塗布し乾燥後、防湿性を有するCOPの防湿処理層側と貼り合せ、防湿性フィルムと粘着剤とを備えた積層シートを作成した。かかる積層シートの剥離フィルムを剥離し、ガラス板に貼り合せ、三酢酸セルロースフィルムを保護層とするポリビニルアルコール系偏光板(ポリビニルアルコール系偏光性フィルムの平均重合度1700、平均ケン化度99.5モル%、5倍延伸)の三酢酸セルロースフィルム側に粘着層を有する偏光板を、防湿性フィルムと粘着剤とを備えた積層シートの防湿性フィルム面に、ローラーで押圧し貼り合せた。かかる貼合品について耐久性試験(80℃ 500時間放置)を行い、発泡状態、剥離状態、劣化状態を観察した。結果を表1に示す。
ポリイソブチレン(Oppanol B80の12.5%トルエン溶液)40部とポリイソブチレン(B50SFの12.5%トルエン溶液)40部に、変性ポリオレフィン樹脂(サーフレンP-1000:特殊ポリオレフィン系樹脂酸変性物の20%溶液)5部、芳香族変性テルペン樹脂溶液(YSレジンTO-125の50%トルエン溶液)2部を混合し、ミキサーで均一に分散してワニスを得た。
得られたワニスをアルキッド系離型剤で処理されたPETフィルム(厚さ38μm)の離型処理面上に、乾燥後の樹脂組成物層の厚さが50μmになるようコンマコーターにて均一に塗布し、110℃で10分間乾燥させることにより、樹脂組成物シートを得た。
液状ポリイソプレン(エポールの50%トルエン溶液)1部と、イソシアネート系化合物(デュラネートTPA-100の50%トルエン溶液)0.3部と、すず触媒(ラウリン酸ジブチルすずの0.1%トルエン溶液)0.67部とを更に混合したこと以外は実施例1と同様にして、下記表1の配合表に従い、ワニスを得た。得られたワニスを使用し、実施例1と全く同様にして樹脂組成物シートを得た。得られた樹脂組成物シートを35℃で3日エージングした。
液状ポリイソプレン(エポールの50%トルエン溶液)の代わりに液状ポリブタジエン(NIISO-PB GI3000の50%トルエン溶液)を使用したこと以外は実施例2と同様にして、下記表1の配合表に従い、ワニスを得た。得られたワニスを使用し、実施例2と全く同様にして樹脂組成物シートを得た。得られた樹脂組成物シートを35℃で3日エージングした。
変性ポリオレフィン樹脂(サーフレンP-1000)を使用しないこと以外は実施例1と同様にして、下記表1の配合表に従い、ワニスを得た。得られたワニスを使用し、実施例1と全く同様にして樹脂組成物シートを得た。
変性ポリオレフィン樹脂(サーフレンP-1000)を使用しないこと以外は実施例2と同様にして、下記表1の配合表に従い、ワニスを得た。得られたワニスを使用し、実施例1と全く同様にして樹脂組成物シートを得た。得られた樹脂組成物シートを35℃で3日エージングした。
変性ポリオレフィン樹脂(サーフレンP-1000)を使用しないこと以外は実施例3と同様にして、下記表1の配合表に従い、ワニスを得た。得られたワニスを使用し、実施例1と全く同様にして樹脂組成物シートを得た。得られた樹脂組成物シートを35℃で3日エージングした。
一方、比較例1、2および3では(B)変性ポリオレフィン樹脂(サーフレンP-1000)を用いておらず、本発明の効果が発揮されていない。つまり、(B)成分を混合させることが重要であることがわかる。
Claims (17)
- ポリイソブチレン樹脂(A)、変性ポリオレフィン樹脂(B)、および粘着付与樹脂(C)を含有することを特徴とする封止用樹脂組成物。
- 前記樹脂組成物中の不揮発分100質量%に対し、前記ポリイソブチレン樹脂(A)を35~95質量%含有することを特徴とする、請求項1に記載の封止用樹脂組成物。
- 前記変性ポリオレフィン樹脂(B)が、単量体成分としてオレフィン及びスチレンを含む共重合体であることを特徴とする、請求項1又は2に記載の封止用樹脂組成物。
- 前記オレフィンがエチレン及び/又は1-ブテンであり、前記共重合体が、官能基を有するものであることを特徴とする請求項3に記載の封止用樹脂組成物。
- 前記変性ポリオレフィン樹脂(B)が、官能基として酸無水物基を有することを特徴とする、請求項1~4のいずれか1項に記載の封止用樹脂組成物。
- 前記樹脂組成物中の不揮発分100質量%に対し、前記変性ポリオレフィン樹脂(B)を1~40質量%含有することを特徴とする、請求項1~5のいずれか1項に記載の封止用樹脂組成物。
- 前記粘着付与樹脂(C)が、テルペン樹脂であることを特徴とする、請求項1~6のいずれか1項に記載の封止用樹脂組成物。
- 前記粘着付与樹脂(C)が、芳香族変性テルペン樹脂であることを特徴とする、請求項1~7のいずれか1項に記載の封止用樹脂組成物。
- 前記樹脂組成物中の不揮発分100質量%に対し、前記粘着付与樹脂(C)を1~40質量%含有することを特徴とする、請求項1~8のいずれか1項に記載の封止用樹脂組成物。
- 請求項1~9のいずれか1項に記載の封止用樹脂組成物の硬化物。
- 380nmから780nmまでの可視光透過率が80~100%であることを特徴とする、請求項10に記載の硬化物。
- 透湿度が0.1~40g/m2・dayであることを特徴とする、請求項10または11に記載の硬化物。
- 請求項1~9のいずれか1項に記載の封止用樹脂組成物を含むことを特徴とする、封止用樹脂組成物シート。
- 有機EL素子の封止用である請求項13記載の封止用樹脂組成物シート。
- 請求項1~9のいずれか1項に記載の封止用樹脂組成物を含むことを特徴とする、有機ELデバイス。
- 無機充填材(F)をさらに含有することを特徴とする、請求項1~9のいずれか1項に記載の封止用樹脂組成物。
- 吸湿性金属酸化物(G)をさらに含有することを特徴とする、請求項1~9のいずれか1項に記載の封止用樹脂組成物。
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| CN201480056892.5A CN105637029A (zh) | 2013-11-08 | 2014-11-07 | 密封用树脂组合物 |
| JP2015546698A JPWO2015068805A1 (ja) | 2013-11-08 | 2014-11-07 | 封止用樹脂組成物 |
| KR1020167002194A KR20160086317A (ko) | 2013-11-08 | 2014-11-07 | 밀봉용 수지 조성물 |
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| JP (1) | JPWO2015068805A1 (ja) |
| KR (1) | KR20160086317A (ja) |
| CN (1) | CN105637029A (ja) |
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Cited By (7)
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| WO2018151002A1 (ja) * | 2017-02-14 | 2018-08-23 | 積水化学工業株式会社 | 光硬化性樹脂組成物、有機el表示素子用封止剤、有機el表示素子、量子ドットデバイス用封止剤、及び、量子ドットデバイス |
| KR20190019960A (ko) * | 2016-06-16 | 2019-02-27 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 나노입자 충전된 배리어 접착제 조성물 |
| WO2019082468A1 (ja) * | 2017-10-27 | 2019-05-02 | 株式会社Moresco | フレキシブル有機デバイス用の封止材、およびその利用 |
| WO2019159830A1 (ja) * | 2018-02-16 | 2019-08-22 | 三井化学株式会社 | 画像表示装置封止材および画像表示装置封止シート |
| WO2021065973A1 (ja) * | 2019-09-30 | 2021-04-08 | 味の素株式会社 | 封止用樹脂組成物 |
| US20220029133A1 (en) * | 2018-12-07 | 2022-01-27 | Lg Chem, Ltd | Encapsulation composition |
| JPWO2023190191A1 (ja) * | 2022-03-30 | 2023-10-05 |
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| JP6725373B2 (ja) * | 2015-09-16 | 2020-07-15 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、粘着剤層付光学フィルム、光学部材、及び画像表示装置 |
| JP6852967B2 (ja) * | 2015-09-16 | 2021-03-31 | 日東電工株式会社 | 粘着剤層付偏光フィルム、光学部材、及び画像表示装置 |
| CN109890926B (zh) * | 2016-11-18 | 2021-12-28 | 琳得科株式会社 | 粘接剂组合物、密封片和密封体 |
| WO2018221572A1 (ja) * | 2017-05-31 | 2018-12-06 | リンテック株式会社 | 接着剤組成物、接着シート、及び封止体 |
| KR102722508B1 (ko) * | 2018-02-27 | 2024-10-29 | 아지노모토 가부시키가이샤 | 밀봉용 수지 조성물 |
| CN116018358B (zh) * | 2020-08-19 | 2025-07-29 | 株式会社Lg化学 | 热固性树脂组合物和使用其的封装膜 |
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| KR102407014B1 (ko) | 2016-06-16 | 2022-06-10 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 나노입자 충전된 배리어 접착제 조성물 |
| CN109937214A (zh) * | 2017-02-14 | 2019-06-25 | 积水化学工业株式会社 | 光固化性树脂组合物、有机el显示元件用密封剂、有机el显示元件、量子点设备用密封剂和量子点设备 |
| WO2018151002A1 (ja) * | 2017-02-14 | 2018-08-23 | 積水化学工業株式会社 | 光硬化性樹脂組成物、有機el表示素子用封止剤、有機el表示素子、量子ドットデバイス用封止剤、及び、量子ドットデバイス |
| CN109937214B (zh) * | 2017-02-14 | 2022-10-21 | 积水化学工业株式会社 | 光固化性树脂组合物、有机el显示元件用密封剂、有机el显示元件、量子点设备用密封剂和量子点设备 |
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| WO2019082468A1 (ja) * | 2017-10-27 | 2019-05-02 | 株式会社Moresco | フレキシブル有機デバイス用の封止材、およびその利用 |
| JPWO2019082468A1 (ja) * | 2017-10-27 | 2020-12-10 | 株式会社Moresco | フレキシブル有機デバイス用の封止材、およびその利用 |
| WO2019159830A1 (ja) * | 2018-02-16 | 2019-08-22 | 三井化学株式会社 | 画像表示装置封止材および画像表示装置封止シート |
| JP7079839B2 (ja) | 2018-02-16 | 2022-06-02 | 三井化学株式会社 | 画像表示装置封止材および画像表示装置封止シート |
| JPWO2019159830A1 (ja) * | 2018-02-16 | 2020-12-17 | 三井化学株式会社 | 画像表示装置封止材および画像表示装置封止シート |
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| WO2023190191A1 (ja) * | 2022-03-30 | 2023-10-05 | 三井化学株式会社 | エポキシ樹脂組成物、封止材および画像表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201522592A (zh) | 2015-06-16 |
| JPWO2015068805A1 (ja) | 2017-03-09 |
| CN105637029A (zh) | 2016-06-01 |
| KR20160086317A (ko) | 2016-07-19 |
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