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WO2015041325A8 - シリコーン変性エポキシ樹脂およびその組成物と硬化物 - Google Patents

シリコーン変性エポキシ樹脂およびその組成物と硬化物 Download PDF

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Publication number
WO2015041325A8
WO2015041325A8 PCT/JP2014/074864 JP2014074864W WO2015041325A8 WO 2015041325 A8 WO2015041325 A8 WO 2015041325A8 JP 2014074864 W JP2014074864 W JP 2014074864W WO 2015041325 A8 WO2015041325 A8 WO 2015041325A8
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
cured article
composition
silicone
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2014/074864
Other languages
English (en)
French (fr)
Other versions
WO2015041325A1 (ja
Inventor
塩原　利夫
純一 沢田
若尾　幸
柏木　努
直房 宮川
義浩 川田
智江 佐々木
政隆 中西
窪木　健一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Nippon Kayaku Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd, Nippon Kayaku Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to US15/023,263 priority Critical patent/US9777107B2/en
Priority to JP2015537979A priority patent/JP6397823B2/ja
Priority to CN201480063205.2A priority patent/CN105873976B/zh
Publication of WO2015041325A1 publication Critical patent/WO2015041325A1/ja
Publication of WO2015041325A8 publication Critical patent/WO2015041325A8/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

【課題】　本発明は、上記事情に鑑みてなされたもので、低ガス透過性、強度に優れた硬化物を与えるシリコーン変性エポキシ樹脂組成物及び当該組成物を硬化することに得られるエポキシ樹脂硬化物を提供することを目的とする。 【解決手段】　下記式（１）で表されるエポキシ樹脂。 （式中、Ｒ１はエステル、エーテル結合を含有してもよい炭素数２～６のアルキレン基を、Ｒ２は炭素数１～６の一価脂肪族炭化水素基又は炭素数６～１２の一価芳香族炭化水素基を、Ｒ３は酸素原子もしくはフェニレン基を、ｋは平均値で１～１０を、ｍは０～２の整数を、ｎは平均値で０～１０をそれぞれ表す。式中、複数存在するＲ１～Ｒ３、ｋ、ｍはそれぞれ同一であっても異なっても構わない。）
PCT/JP2014/074864 2013-09-20 2014-09-19 シリコーン変性エポキシ樹脂およびその組成物と硬化物 Ceased WO2015041325A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US15/023,263 US9777107B2 (en) 2013-09-20 2014-09-19 Silicone-modified epoxy resin and composition and cured article thereof
JP2015537979A JP6397823B2 (ja) 2013-09-20 2014-09-19 シリコーン変性エポキシ樹脂およびその組成物と硬化物
CN201480063205.2A CN105873976B (zh) 2013-09-20 2014-09-19 有机硅改性环氧树脂及其组合物和固化物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013196250 2013-09-20
JP2013-196250 2013-09-20

Publications (2)

Publication Number Publication Date
WO2015041325A1 WO2015041325A1 (ja) 2015-03-26
WO2015041325A8 true WO2015041325A8 (ja) 2015-06-18

Family

ID=52688972

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/074864 Ceased WO2015041325A1 (ja) 2013-09-20 2014-09-19 シリコーン変性エポキシ樹脂およびその組成物と硬化物

Country Status (5)

Country Link
US (1) US9777107B2 (ja)
JP (1) JP6397823B2 (ja)
CN (1) CN105873976B (ja)
TW (1) TWI629307B (ja)
WO (1) WO2015041325A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017010401A1 (ja) * 2015-07-10 2017-01-19 住友精化株式会社 エポキシ樹脂組成物、その製造方法、及び該組成物の用途
EP3378897B1 (en) * 2015-11-18 2020-08-05 Sumitomo Seika Chemicals CO. LTD. Epoxy resin composition, method for producing same, and use of composition
JP6556965B2 (ja) 2017-01-10 2019-08-07 住友精化株式会社 エポキシ樹脂組成物
JP6553311B2 (ja) * 2017-01-10 2019-07-31 住友精化株式会社 エポキシ樹脂組成物
EP3569653B1 (en) 2017-01-10 2021-03-10 Sumitomo Seika Chemicals Co. Ltd. Epoxy resin composition
CN110177819B (zh) * 2017-01-10 2022-11-08 住友精化株式会社 环氧树脂组合物
US20200385514A1 (en) * 2017-01-10 2020-12-10 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition
WO2018181719A1 (ja) * 2017-03-31 2018-10-04 住友精化株式会社 エポキシ樹脂、エポキシ樹脂組成物、並びに、その硬化物、用途及び製造方法
TW201910376A (zh) * 2017-07-31 2019-03-16 日商住友精化股份有限公司 環氧樹脂組成物
US11427466B2 (en) * 2019-07-19 2022-08-30 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method for manufacturing the same
JP7390236B2 (ja) * 2020-03-31 2023-12-01 京セラ株式会社 異方導電性樹脂組成物、及びマイクロｌｅｄディスプレイ装置
JP2024029572A (ja) * 2022-08-22 2024-03-06 信越化学工業株式会社 カチオン硬化型組成物、硬化物、及び光半導体装置

Family Cites Families (14)

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JPH02207087A (ja) * 1989-02-07 1990-08-16 Adeka Argus Chem Co Ltd エポキシ基含有シラン化合物
DE4328466C1 (de) 1993-08-24 1995-04-13 Siemens Ag Siloxanhaltiges Gießharzsystem
JP4009067B2 (ja) 2001-03-06 2007-11-14 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
US7034089B2 (en) * 2002-12-20 2006-04-25 National Starch And Chemical Investment Holding Corporation Epoxy-functional hybrid copolymers
US7004375B2 (en) * 2003-05-23 2006-02-28 National Starch And Chemical Investment Holding Corporation Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
JP4520251B2 (ja) * 2003-10-10 2010-08-04 信越化学工業株式会社 硬化性組成物
TW200513483A (en) * 2003-10-10 2005-04-16 Shinetsu Chemical Co Curable composition
DE10359732A1 (de) 2003-12-19 2005-07-14 Leica Microsystems Semiconductor Gmbh Substratträger zur Aufnahme und Lagerfixierung eines flächigen Körpers
JP4347103B2 (ja) 2004-03-22 2009-10-21 信越化学工業株式会社 硬化性シリコーン組成物
WO2005121200A1 (fr) * 2004-05-13 2005-12-22 Rhodia Chimie Composition dentaire reticulable/polymerisable par voie cationique stable et a haute teneur en charge
CN100560629C (zh) * 2004-05-13 2009-11-18 罗狄亚化学公司 具有高填料含量的稳定的通过阳离子途径可交联/可聚合的牙科组合物
US20050261390A1 (en) 2004-05-13 2005-11-24 Jean-Marc Frances Stable cationically crosslinkable/polymerizable dental composition with a high filler content
JP2006282988A (ja) 2005-03-08 2006-10-19 Sanyo Chem Ind Ltd 光半導体素子封止用エポキシ樹脂組成物
JP2008045088A (ja) 2006-08-21 2008-02-28 Sekisui Chem Co Ltd 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体装置

Also Published As

Publication number Publication date
CN105873976B (zh) 2018-07-03
TWI629307B (zh) 2018-07-11
TW201518393A (zh) 2015-05-16
CN105873976A (zh) 2016-08-17
JPWO2015041325A1 (ja) 2017-03-02
JP6397823B2 (ja) 2018-09-26
US20160237202A1 (en) 2016-08-18
US9777107B2 (en) 2017-10-03
WO2015041325A1 (ja) 2015-03-26

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