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WO2014200221A1 - Structure de rayonnement de chaleur pour dispositif électrique/électronique - Google Patents

Structure de rayonnement de chaleur pour dispositif électrique/électronique Download PDF

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Publication number
WO2014200221A1
WO2014200221A1 PCT/KR2014/004916 KR2014004916W WO2014200221A1 WO 2014200221 A1 WO2014200221 A1 WO 2014200221A1 KR 2014004916 W KR2014004916 W KR 2014004916W WO 2014200221 A1 WO2014200221 A1 WO 2014200221A1
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Prior art keywords
heat dissipation
heat
aluminum
printed circuit
circuit board
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Ceased
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PCT/KR2014/004916
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English (en)
Korean (ko)
Inventor
이진성
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Individual
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Individual
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Definitions

  • the present invention relates to a heat dissipation structure for an electric and electronic device, and more particularly, a plurality of heat dissipation fins formed to have a predetermined shape with a material having better thermal conductivity than aluminum and installed to penetrate a ceramic or aluminum sheet or an aluminum or epoxy printed circuit board.
  • the heat dissipation plastic eg, heat dissipation
  • the heat dissipation to surround the top surface of the ceramic or aluminum plate or aluminum or epoxy printed circuit board including a heat dissipation fin protruding from the ceramic or aluminum plate or the aluminum or epoxy printed circuit board.
  • LED lighting equipment which is widely used in recent years, including CPUs used in various electric and electronic devices and large-capacity semiconductor switching devices (for example, FETs, TGBTs, triacs, etc.) by installing heat-dissipating bodies injected by injection molding of composite polymers, etc.) The heat generated during the driving of the room more smoothly It is invented so that it can be exported.
  • CPUs used in various electric and electronic devices
  • large-capacity semiconductor switching devices for example, FETs, TGBTs, triacs, etc.
  • a heat sink having a plurality of vertical heat dissipation fins is formed on the upper surface by using aluminum, and the metal plate of the upper surface of the CPU or the large-capacity semiconductor switching element by fixing clamps or bolts. It is fixed to, but if necessary, it is configured to have a blowing fan for increasing the heat dissipation efficiency by smoothing the air flow to the upper portion of the heat sink.
  • the heat dissipation plate or the heat dissipation element having a predetermined shape is fixed to be installed in close contact with the upper surface of the aluminum or epoxy printed circuit board having a plurality of LEDs mounted on the front. It is.
  • heat dissipation structures for electric and electronic devices having such a configuration include a heat dissipation plate having a vertical plate or the like made of the same material, or a metal plate of a top surface of a CPU or a bottom surface of a heat dissipation body having different thermal conductivity. Since it is installed in direct contact with the upper surface or the upper surface of the aluminum printed circuit board and the epoxy printed circuit board on which the LED is mounted, when a gap is generated between each element and the contact portion of the heat dissipation structure, the heat dissipation efficiency is greatly reduced.
  • heat generated from a plurality of LEDs passes through the aluminum or epoxy printed circuit board primarily, and has a different material and is fixedly fixed to the upper surface of the printed circuit board. Since the heat transfer plate or the radiator has a predetermined shape, the heat dissipation efficiency is low, as well as the rapid heat dissipation.
  • LED lighting device having a heat dissipation means including a flat plate has been developed and has been proposed as a Korean Patent Publication No. 10-1184325. .
  • the LED lighting device comprising an LED board mounted with an LED, a heat dissipation means for contacting the top surface of the LED substrate to release heat generated from the LED substrate and a case forming the appearance
  • the heat dissipation means is in contact with the top surface of the LED substrate
  • a countersink hole formed in the countersink, the material having a higher thermal conductivity than the heat dissipation means is inserted into the countersink hole for heat transfer, and the head further includes a flat screw contacting the upper surface of the LED substrate.
  • the LED lighting apparatus having a heat dissipation means including the flat screw having such a configuration transmits heat generated from the LED substrate of the LED lighting apparatus to the inside of the heat dissipation means through the flat screw, so that a heat sink or heat sink is installed on the top surface of the LED substrate.
  • the heat can be effectively radiated through the heat transfer to some extent, and the volume of the heat radiating means of the LED lighting device can be relatively reduced, thereby reducing the size of the overall lighting device to some extent.
  • the LED lighting device having such a configuration does not directly install a flat screw made of a material having a relatively higher thermal conductivity than the heat dissipation means on the LED substrate on which the LED is directly mounted, and the heat dissipation means closely installed on the upper surface of the LED substrate.
  • the flat screw is inserted into the countersink hole formed in the heat sink of the heat sink, so that the head of the flat screw is in contact with the upper surface of the LED substrate.
  • Patent Document 1 Republic of Korea Patent Publication No. 10-1184325 (September 13, 2012)
  • Patent Document 2 Korean Utility Model Registration Publication No. 20-0188874 (May 01, 2000)
  • the present invention has been made in order to solve such a conventional problem, a plurality of heat sink fins formed to have a predetermined shape made of a material such as copper, which is more thermally conductive than aluminum, a ceramic or aluminum plate or aluminum or epoxy printed circuit board Directly penetrates LEDs that are used in driving LED lighting devices, including CPUs and large-capacity semiconductor switching devices (e.g., FETs, TGBTs, triacs, etc.) that are used in various electrical and electronic devices.
  • LEDs that are used in driving LED lighting devices, including CPUs and large-capacity semiconductor switching devices (e.g., FETs, TGBTs, triacs, etc.) that are used in various electrical and electronic devices.
  • High heat can be directly dissipated through heat dissipation fins with very good thermal conductivity, thereby increasing heat dissipation uniformity, and providing a heat dissipation structure for electric and electronic devices that can freely flow air between heat dissipation fins and significantly increase heat dissipation efficiency. Its purpose is to.
  • Another object of the present invention in the case of an aluminum or epoxy printed circuit board having a predetermined copper foil pattern and the LEDs are directly mounted, the space portion without the copper foil pattern is installed to protrude to the bottom, the portion having the copper foil pattern is a copper foil Install the heat dissipation fins so as to be connected to the pattern, and if necessary, the upper surface of the ceramic or aluminum plate or the aluminum or epoxy printed circuit board including the heat dissipation fins protruding from the upper surface of the ceramic or aluminum plate or the aluminum or epoxy printed circuit board.
  • heat-dissipating agent that is injection-molded with a heat-dissipating plastic such as a heat-dissipating composite polymer to wrap, it directly transfers the heat generated from the CPU or large-capacity semiconductor switching element and LEDs to the heat-dissipating agent that helps the heat spread quickly through the heat-sink fins.
  • Heat dissipation Secondary heat dissipation through ceramic or aluminum plate or aluminum or epoxy printed circuit board and heat dissipating agent can further increase heat dissipation effect, and short circuit of heat dissipation fins electrically connected to copper foil pattern.
  • the present invention provides a heat dissipation structure for electric and electronic devices that can prevent corrosion and of course obtain a waterproof effect on water that can flow through the heat dissipation fins.
  • a plurality of I let pins having a flat cross section such as a cylindrical or square bar, may be formed of ceramic or aluminum. It is fixedly installed to be exposed up and down a predetermined length along the periphery of the plate, but the lower ends of the eyelet pins are installed through the main printed circuit board in which the CPU or the large-capacity semiconductor switching element is installed, and then soldering or caulking is performed.
  • the heat dissipation structure installed in close contact with the upper surface of the CPU or the large-capacity semiconductor switching element can be fixed through the eyelet pins without using screws or bolts. Good and long-term use ensures that the heat dissipation structure is completely maintained so that the CPU or large
  • To provide an electric heat radiating structure for electronic equipment that can continuously maintain the heat radiation effect of heat generated from the elements referred to it is an object.
  • an I let pin having a flat cross section having a cylindrical or square shape is electrically installed to be electrically connected to the signal transmission and power supply copper foil patterns connected to the control and power supply unit.
  • a portion of the upper end portion of the fin is installed higher than the heat dissipation fins to penetrate the bottom of the case of the control and power supply, so that a portion of the upper end portion of the eyelet fins is enclosed by the heat dissipating member so as to have a state inflowed into the case.
  • the case of the control and power supply with a waterproof packing on the top surface of the heat sink fin having a second Attach the heat dissipating agent and the bottom of the case integrally through wave or adhesion, but the upper part of the eyelet pin introduced into the inner surface of the case can be fixed integrally to the case by caulking, etc.
  • the present invention is a ceramic or aluminum plate that is coupled to the upper surface of the CPU or a large-capacity semiconductor switching element used in various electrical and electronic devices to dissipate heat, or directly mounted LEDs having a copper foil pattern of a predetermined shape
  • a plurality of pin-inserted holes having a predetermined diameter are formed in the aluminum or epoxy printed circuit board for LED lighting equipment, and each of the pin-inserted holes is formed to have a predetermined shape by using a material having higher thermal conductivity than aluminum.
  • the heat dissipation fin is forcibly inserted and installed, but the lower end portion of the heat dissipation fin, which has a predetermined diameter and length and is forcibly inserted into the pin insertion hole, has a bottom or copper foil pattern of ceramic or aluminum plate that is in direct contact with the CPU or the large-capacity semiconductor switching element.
  • Low cost of aluminum or epoxy printed circuit boards In that a consistently with the features.
  • the heat dissipation fins installed in the portion that is not in direct contact with the CPU or the large-capacity semiconductor switching element is characterized in that the lower end portion is installed so as to protrude by a predetermined length from the bottom of the ceramic or aluminum plate.
  • the pin insertion hole is formed only in the portion without the copper foil pattern to insert the heat radiation fin, the lower end portion of the heat radiation fin is determined from the bottom of the aluminum or epoxy printed circuit board It is characterized by being installed to protrude as long.
  • a pin insertion hole is formed in a part of the copper foil pattern to further install the heat dissipation fins so that the lower end is electrically connected to the copper foil pattern.
  • a plurality of heat dissipation pin insert rods and wrap plates may be provided to surround the top and side surfaces of the ceramic or aluminum plate or the aluminum or epoxy printed circuit board including heat dissipation fins protruding from the top surface of the ceramic or aluminum plate or the aluminum or epoxy printed circuit board.
  • a heat dissipating member injection molded of heat dissipating plastic is further provided so as to be integrally provided.
  • a plurality of eyelet pins having a flat cross section having a cylindrical or square bar shape are exposed along a periphery of the ceramic or aluminum plate by a predetermined length.
  • the lower ends of the eyelet pins are installed to penetrate the main printed circuit board on which the CPU or the large-capacity semiconductor switching element is installed, and the lower end of the eyelet pins protruding through the bottom of the main printed circuit board are soldered. Or it is fixed to the main printed circuit board integrally through the caulking.
  • a flat cross section has a cylindrical or square rod shape so as to be electrically connected to the copper foil pattern for signal transmission and power supply which should be electrically connected to the control and power supply.
  • the eyelet fins are installed, but the eyelet fins are installed higher than the heat dissipation fins so as to penetrate the bottom of the case of the control and power supply.
  • the eyelet pin insert rod further protruded to the same height as the height of the heat radiation fin insert rod on the heat dissipating member having a plurality of heat radiation fin insert rods and the wrap plate integrally.
  • the contact portion between the bottom surface of the case of the control and power supply unit mounted on the top surface of the heat radiation fin inserting rod and the eyelet pin inserting rod of the heat dissipating member and the top surface of the heat dissipating fin inserting rod and the eyelet pin inserting rod of the heat dissipating member is applied with ultrasonic irradiation or adhesive. It is attached to each other integrally, and the upper end of the eyelet pin introduced into the interior through the bottom of the case of the control and power supply is fixed to the case integrally through the caulking.
  • a plurality of heat dissipation pin insertion rods and eyelet pin insertion rods of the heat dissipating member may be disposed between the bottom surface of the case of the control and power supply unit and the top surface of the heat dissipating fin inserting rod and the eyelet pin inserting rod. It is characterized in that the waterproof seal packing is further installed through the rod through hole.
  • a plurality of heat dissipation fins formed of a material such as copper having better thermal conductivity than aluminum and having a predetermined shape may be formed of a ceramic or aluminum plate or an aluminum or epoxy printed circuit board.
  • This very good heat dissipation fins can be directly dissipated to increase the uniformity of heat dissipation in heat dissipation through the heat dissipation structure, and the flow of air through the heat dissipation fins can greatly increase the heat dissipation efficiency.
  • heat dissipation fins are installed to be connected to the copper foil pattern as well as a space part without the copper foil pattern, and the ceramic as necessary.
  • a heat dissipating agent injection-molded with a heat dissipating plastic such as a heat dissipating composite polymer to surround the top surface of the ceramic or aluminum plate or the aluminum or epoxy printed circuit board including a heat dissipation fin protruding from an aluminum plate or an aluminum or epoxy printed circuit board.
  • the heat generated from the CPU or the large-capacity semiconductor switching element and LEDs can be directly transferred to the heat dissipating agent to help heat dissipation through heat dissipation fins in a short time.
  • Circuit Heat radiation effect can be further increased through the substrate and the heat dissipating agent, which can further increase the heat dissipation effect, and can prevent the heat dissipation fins electrically connected to the copper foil pattern from being electrically shorted and corroded. It is possible to obtain a waterproof effect on water that can be introduced through them.
  • a plurality of I let pins having a flat cross section having a shape such as a cylindrical or square bar are formed around the ceramic or aluminum plate. It is fixedly installed so as to be exposed up and down by a predetermined length along the part, but the lower ends of the eyelet pins are installed to penetrate the main printed circuit board where the CPU or the large-capacity semiconductor switching element is installed, and then main printing through soldering or caulking.
  • the heat dissipation structure that is installed on the upper surface of the CPU or the large-capacity semiconductor switching element can be fixed through the eyelet pins without using screws or bolts.
  • CPU or large-capacity semiconductor switching device It can keep the heat dissipation effect on the heat generated from.
  • an eyelet pin having a flat cross section having a cylindrical or square bar shape is installed to be electrically connected to a signal transmission and a power supply copper foil pattern connected to a power supply unit, and a part of the upper end of the eyelet pin is a control and power supply unit.
  • the upper surface of the eyelet pins introduced into the inner surface of the case can be fixed integrally to the case by caulking, etc.
  • Figure 1 (a) (b) is a partially exploded perspective view of a heat dissipation structure for an electric and electronic device to which an embodiment of the present invention is applied.
  • FIGS. 2A and 2B are cross-sectional views of a heat dissipation structure to which an embodiment of the present invention is applied to a CPU and a large capacity semiconductor switching device.
  • 3 and 4 are cross-sectional views showing a heat radiation structure to which an embodiment of the present invention is applied to an aluminum or epoxy printed circuit board on which light emitting diodes are mounted.
  • FIG. 5 is a cross-sectional view of a state in which a heat radiation structure to which another embodiment of the present invention is applied to an aluminum or epoxy printed circuit board on which light emitting diodes are mounted.
  • Figure 6 (a) (b) is a cross-sectional view of a state in which the heat dissipation structure to which another embodiment of the present invention is applied to the CPU and the large-capacity semiconductor switching element.
  • FIG. 7 is a cross-sectional view of a state in which a heat dissipation structure to which another embodiment of the present invention is applied to an aluminum or epoxy printed circuit board on which light emitting diodes are mounted and combined with a case of a control and power supply.
  • Figure 1 (a) (b) is a partially exploded perspective view of a heat dissipation structure for an electric and electronic device to which an embodiment of the present invention is applied
  • Figure 2 (a) (b) is a heat dissipation structure to which an embodiment of the present invention is applied Is a cross-sectional view showing a state in which a CPU and a large-capacity semiconductor switching element are installed
  • FIGS. 3 and 4 are cross-sectional views showing a heat radiation structure to which an embodiment of the present invention is applied to an aluminum or epoxy printed circuit board mounted with light emitting diodes. It is shown.
  • FIG. 5 is a cross-sectional view of a state in which a heat radiation structure to which another embodiment of the present invention is applied to an aluminum or epoxy printed circuit board on which light emitting diodes are mounted
  • FIG. 6 (a) (b) shows another embodiment of the present invention.
  • 7 illustrates a cross-sectional view of a state in which a heat dissipation structure to which an example is applied is installed on a CPU and a large-capacity semiconductor switching element
  • FIG. 7 is a control unit by applying a heat dissipation structure to which another embodiment of the present invention is applied to an aluminum or epoxy printed circuit board on which light emitting diodes are mounted.
  • the cross-sectional view of the state combined with the case of the power supply is shown.
  • LEDs having a ceramic or aluminum plate 3 or a copper foil pattern 51 of a predetermined shape which are coupled to an upper surface of a CPU 1 or a large-capacity semiconductor switching element 2 used in various electric and electronic devices to radiate heat.
  • a pin insertion hole (PH) having a predetermined diameter at a predetermined interval in the aluminum or epoxy printed circuit board (5) for LED lighting equipment is mounted directly, the aluminum or epoxy printed circuit board (5) for LED lighting equipment
  • a plurality of heat radiation fins (6) molded to have a predetermined shape by using a material having a higher thermal conductivity than aluminum is forced to the pin insertion hole (PH).
  • the heat dissipation fin 6, which is installed at a portion which is not in direct contact with the CPU 1 or the large-capacity semiconductor switching element 2, is characterized in that the lower end portion is installed so as to protrude by a predetermined length from the bottom of the ceramic or aluminum plate 3. It is done.
  • a heat dissipation fin 6 inserted into a portion where the copper foil pattern of the aluminum or epoxy printed circuit board 5 for the LED lighting device is not protrudes by a predetermined length from a bottom surface of the aluminum or epoxy printed circuit board 5. It is characterized in that the installation.
  • a pin insertion hole P.H is also formed in a part of the copper foil pattern 51 so that the lower ends of the heat dissipation fins 6 are electrically connected to the copper foil pattern 51 directly.
  • the ceramic or aluminum plate 3 or the aluminum or epoxy printed circuit board (5) comprising a heat dissipation fin (6) protruding to the upper surface of the ceramic or aluminum plate (3) or aluminum or epoxy printed circuit board (5).
  • a plurality of eyelet pins 7 having a cylindrical cross section or a rectangular bar shape are fixedly installed to be exposed up and down by a predetermined length along the periphery of the ceramic or aluminum plate 3, but the eyelet pins 7
  • the lower end of the gate is installed to penetrate the main printed circuit board 10 in which the CPU 1 or the large-capacity semiconductor switching element 2 is directly installed, and the eyelet pin protrudes through the bottom of the main printed circuit board 10.
  • the lower end of (7) is characterized in that it is fixed integrally to the main printed circuit board 10 through soldering or caulking.
  • Eyelet pins 7 having a cylindrical or square bar shape having a flat cross section so as to be electrically connected to the copper foil pattern 51 for signal transmission and power supply which is to be electrically connected to the control and power supply unit 9.
  • Eyelet fin (7) is characterized in that installed higher than the heat radiation fins (6) to penetrate the bottom surface of the case 91 of the control and power supply (9).
  • the eyelet pin insertion rods 83 at the same height as the height of the heat radiation fin inserting rods 82 in the heat dissipating member 8 having a plurality of heat radiation fin inserting rods 82 and the wrap plate 81 integrally. It characterized by further protruding molded.
  • the bottom surface of the case 91 of the control and power supply unit 9 and the heat dissipating member 8 which are placed on the top surface of the heat dissipating fin inserting rod 82 and the eyelet pin inserting rod 83 of the heat dissipating member 8.
  • the contact portion between the heat radiation fin inserting rod 82 and the upper surface of the eyelet pin inserting rod 83 is attached to each other integrally using ultrasonic irradiation or adhesive, and the bottom surface of the case 91 of the control and power supply 9 is
  • the upper end of the eyelet pin 7 introduced into the interior through the caulking is characterized in that integrally fixed to the case (91).
  • the heat dissipating member 8 may be disposed between the bottom surface of the case 91 of the control and power supply unit 9 and the top surface of the heat dissipating fin insertion rod 82 of the heat dissipating member 8 and the upper surface of the eyelet pin inserting rod 83. It is characterized in that the waterproof packing 11 is further provided with a plurality of rod through holes 111 perforated at positions corresponding to the positions of the heat radiation fin insertion rods 82 and the eyelet pin insertion rods 83.
  • the heat dissipation structure for an electric and electronic device of the present invention as shown in (a) (b) to Figure 4 of Figure 1, such as the CPU (1) or FET, TGBT, triac, etc. used in various electrical and electronic devices
  • Ceramic or aluminum plate 3 coupled to the upper surface of the large-capacity semiconductor switching element 2 to dissipate heat, or aluminum or epoxy for LED lighting equipment having LEDs 4 directly mounted with copper foil patterns 51 of a predetermined shape.
  • a pin insertion hole PH having a predetermined diameter is formed on the printed circuit board 5 at predetermined intervals, and a plurality of heat dissipation fins 6 are installed through a forced insertion method.
  • the heat radiation fin (6) is made of a wire having a predetermined diameter (for example 1.6 ⁇ 2.0mm) by using a copper, such as a material having a higher thermal conductivity than aluminum cut by a predetermined length by a pin insertion robot or press
  • a copper such as a material having a higher thermal conductivity than aluminum cut by a predetermined length by a pin insertion robot or press
  • PH pin insertion holes
  • the wire reels install the wires integrally installed in each of the pin insertion hole (PH) using an electric roller equipped with a wire guider, and then repeats the method of cutting the other end to the required length with the heat radiation fin (6) It can also be installed continuously.
  • each of the heat radiation fin (6) having a predetermined diameter and length and forcibly inserted into the pin insertion hole (PH) or the ceramic directly contacting the CPU (1) or the large-capacity semiconductor switching element (2) or
  • the heat dissipation fins 6 are mounted on the bottom surface of the aluminum plate 3 or the copper foil pattern 51 to be aligned with the bottom surface of the aluminum or epoxy printed circuit board 5 on which the LEDs 4 are directly mounted.
  • heat transfer from the large-capacity semiconductor switching element (2) or LEDs (4) to the outside faster than the rate transmitted through the ceramic or aluminum plate (3) and aluminum or epoxy printed circuit board (5) Can give
  • the plurality of heat dissipation fins 6 formed of copper or the like having higher thermal conductivity than aluminum are installed to penetrate the ceramic or aluminum plate 3 or the aluminum or epoxy printed circuit board 5 for LED lighting equipment, Heat generated from LEDs 4 when driving LED lighting devices, which are widely used in recent years, including high-capacity semiconductor switching devices 2 such as CPU 1 used in various electric and electronic devices, FETs, TGBTs, triacs, and the like.
  • the heat dissipation effect is improved because the heat dissipation is faster than the ceramic or aluminum plate 3 and the aluminum or epoxy printed circuit board 5, and thus the heat dissipation effect is increased. It is installed to not only increase the uniformity of heat dissipation, but also free the flow of air between the heat dissipation fins 6 and improve the heat dissipation efficiency. Width will be capable of growth.
  • the ceramic or aluminum plate (3) and the upper surface of the body of the CPU (1) or large-capacity semiconductor switching element (2) and The copper foil pattern 51 is provided to transfer the power voltage and the control signal from the control and power supply unit 9 to the LEDs 4. Therefore, the copper foil pattern is not provided on the outer circumferential surface of the heat dissipation fin 6.
  • the heat dissipation fins 6 adjacent to each other may be electrically shorted to each other, thereby forming a pin insertion hole PH only at a portion having no copper foil pattern as shown in FIG.
  • the radiating fins 6 are press-installed by force, but the radiating fins 6 are installed so that the lower end thereof is coincident with the bottom of the aluminum or epoxy printed circuit board 5.
  • the bottom end of the heat radiation fins 6 coincides with the bottom surface of the aluminum or epoxy printed circuit board 5.
  • the heat dissipation fins 6 are provided to protrude from the bottom surface of the substrate 5 by a predetermined length, the heat dissipation fins 6 transmit heat generated by the LEDs 4 and transmitted through the aluminum or epoxy printed circuit board 5 as described above.
  • a part of the copper foil pattern 51 may be used as necessary.
  • Another main technical component is to further install the heat dissipation fins 6 to form a pin insertion hole PH so that a low end surface is electrically connected to the copper foil pattern 51 as shown in FIG. 4.
  • the heat radiation fins 6 when the heat radiation fins 6 are installed to the portion having the copper foil pattern as well as the portion without the copper foil pattern, the heat radiation fins 6 having a state connected to the copper foil pattern having the corresponding LEDs among the heat generated from the LEDs 4 are provided. Not only can be directly radiated heat, but the heat conducted through the aluminum or epoxy printed circuit board (5) can be radiated through the heat dissipation fin (6) installed in the portion without the copper foil pattern, and also the aluminum or epoxy printed circuit board (5) Heat remaining in the air around the bottom of the heat sink can radiate heat by dissipating the heat dissipation fins 6 installed to protrude to the bottom of the aluminum or epoxy printed circuit board 5 through the lower protrusions. You can increase it.
  • Figs. 5 and 6 as a method for further increasing the electrical short circuit problem and heat dissipation efficiency due to the contact between the heat radiation fins 6 are bent due to an external impact or the like as shown in Figs. 5 and 6 (a) (b).
  • the ceramic or aluminum plate 3 or aluminum or epoxy printed circuit board 5 comprising all of the heat dissipation fins 6 protruding from the ceramic or aluminum plate 3 or the upper surface of the aluminum or epoxy printed circuit board 5.
  • the heat dissipating member 8 which is injection-molded with a heat dissipating plastic (eg, a heat dissipating composite polymer) to integrally include a plurality of heat dissipating pin inserting rods 82 and the wrap plate 81 so as to cover the top and side surfaces thereof. Further installation is another major technical component.
  • a heat dissipating plastic eg, a heat dissipating composite polymer
  • the heat dissipating member 8 has a plurality of heat dissipation fin insertion rods 82 are formed at a position corresponding to the position of the heat dissipation fins 6,
  • the wrap plate 81 is the ceramic or aluminum plate (3) or After injection molding separately using a heat-dissipating plastic to have an outer shape (ie, circular, square, polygonal, etc.) and area of the aluminum or epoxy printed circuit board 5, the ceramic with a plurality of heat-dissipating fins 6 as described above Alternatively, while mutually bonding with the aluminum plate (3) or aluminum or epoxy printed circuit board (5), they are integrated with each other through ultrasonic processing.
  • the inner diameter of the heat dissipation fin insertion rod 82 of the heat dissipation member 8 is molded so as to have, for example, 1.6 to 2.0 mm corresponding to the outer diameter of the heat dissipation fin 6 so that the heat dissipation fin 6 is inserted into a tight fit.
  • the outer diameter is preferably molded to have a range of 4 to 6 mm so as to have a space portion through which the air can sufficiently pass between the heat dissipation fin insertion rods 82 adjacent to each other while the heat dissipation area is sufficiently wide.
  • the heat dissipating member 8 When the heat dissipating member 8 is further installed to cover the top and side surfaces of the ceramic or aluminum plate 3 or the aluminum or epoxy printed circuit board 5 including the heat dissipation fins 6, the CPU 1 B.
  • the heat radiating member (6) may be quickly discharged through the radiating fins 6. 8) and then heat radiation to the air layer as well as the second heat radiation through the ceramic or aluminum sheet (3) or aluminum or epoxy printed circuit board (5) and the heat dissipating member (8) itself, so that the heat dissipation effect.
  • the heat dissipation fins 6 having a state electrically connected to the copper foil pattern 51 can be completely prevented from being electrically shorted. It can be prevented, and also waterproof effect can be obtained for water that can be introduced through the heat dissipation fins 6.
  • a flat cross section is formed along the periphery of the ceramic or aluminum plate 3;
  • a plurality of eyelet pins 7 having a cylindrical or square bar shape were fixedly installed so as to be exposed up and down by a predetermined length.
  • the lower ends of the eyelet pins 7 are installed to penetrate the main printed circuit board 10 in which the CPU 1 or the large-capacity semiconductor switching element 2 is directly installed, and the main printed circuit board 10.
  • the heat dissipation structure installed in close contact with the upper surface of the CPU 1 or the large-capacity semiconductor switching element 2 can be fixed through the eyelet pins 7 without the use of a separate screw or bolt.
  • the heat dissipation structure is completely maintained and the heat dissipation effect on heat generated from the CPU and the large-capacity semiconductor switching device can be maintained.
  • the aluminum or epoxy printed circuit to be electrically connected to the control and power supply unit 9.
  • the eyelet pins 7 having a cylindrical or square bar shape with a flat cross section are installed together so as to be electrically connected to the copper foil patterns 51 for signal transmission and power supply.
  • 7) is installed higher than the heat dissipation fins 6 as shown in Figures 3 to 7 so as to penetrate the bottom surface of the case 91 of the control and power supply (9).
  • the heat dissipation fin insert rods 82 when injection-molding the heat dissipating member 8 having a plurality of heat dissipation fin inserting rods 82 and the wrap plate 81 integrally, the heat dissipation fin insert rods 82 have the same height as that of the heat dissipation fin inserting rods 82.
  • the eyelet pin insertion rods 83 through which the eyelet pins 7 are inserted are further protruded.
  • the plurality of heat dissipation fin insertion rods 82 and the eyelet fin insertion rods 83 and the heat dissipation fins 6 and the eyelet fins 7 are integrally provided on the upper surface of the aluminum or epoxy printed circuit board 5.
  • the eyelets introduced together through the bottom of the case 91 of the control and power supply unit 9 are attached to each other by irradiating ultrasonic waves or by applying an adhesive to the contact between the upper surface of the pin pin insertion rod 83.
  • the upper end of the pin 7 is integral to the case 91 as shown in Figure 7 through the caulking You can fix it.
  • both ends of the signal line and the power supply line which are output from the control and power supply unit 9 to transmit a signal or supply a power voltage to the LEDs 4 of the aluminum or epoxy printed circuit board 5 are the control and Interconnecting and fixing may be made between the eyelet pins 7 having a caulked state in the case 91 of the power supply unit 9 and the printed circuit boards of the control and power supply unit 9 by soldering.
  • a waterproof packing 11 having a plurality of rod through holes 111 perforated at positions corresponding to the positions of the heat radiation fin insertion rods 82 and the eyelet pin insertion rods 83 of 8). It can completely block the inflow of water or water to the aluminum or epoxy printed circuit board 5 where the LEDs 4 are mounted along the eyelet pins 7, etc., which in turn can greatly increase the waterproofing effect. Its own productability and reliability can be greatly improved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne une structure de rayonnement de chaleur destinée à un dispositif électrique/électronique, caractérisée notamment en ce qu'un trou d'insertion d'ailettes est formé dans un élément plaque en céramique ou en aluminium, qui est couplé à une UCT qui est utilisée pour divers types de dispositifs électriques/électroniques ou pour un élément de commutation à semi-conducteur de grande capacité pour émettre de la chaleur, ou dans une carte de circuit imprimé en aluminium ou époxy destinée à un dispositif d'éclairage à DEL, et une pluralité d'ailettes de rayonnement de chaleur sont insérées/installées à force dans le trou d'insertion d'ailettes de manière que les extrémités inférieures des ailettes de rayonnement de chaleur insérées à force dans le trou d'insertion d'ailettes coïncident avec la surface inférieure de l'élément plaque en céramique ou en aluminium ou avec la surface inférieure de la carte de circuit imprimé en aluminium ou époxy sur laquelle les dispositifs à DEL sont directement montés. Par conséquent, lors de l'attaque d'un dispositif d'attaque à DEL, qui, récemment est largement utilisé, et autres, comprenant une UCT qui est utilisée pour divers types de dispositifs électriques/électroniques ou un élément de commutation à semi-conducteur de grande capacité tel qu'un FET, TGBT ou TRIAC, la grande quantité de chaleur produite par les dispositifs à DEL peut être directement émise par le biais des ailettes de rayonnement de chaleur présentant une excellente conductivité thermique, ce qui permet d'améliorer l'uniformité de rayonnement de chaleur à travers la structure de rayonnement de chaleur et d'augmenter sensiblement l'efficacité de rayonnement de chaleur au moyen du flux d'air libre entre les ailettes de rayonnement de chaleur.
PCT/KR2014/004916 2013-06-10 2014-06-03 Structure de rayonnement de chaleur pour dispositif électrique/électronique Ceased WO2014200221A1 (fr)

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KR10-2013-0065898 2013-06-10
KR1020130065898A KR101319564B1 (ko) 2013-06-10 2013-06-10 전기전자 기기용 방열구조체

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018509780A (ja) * 2015-03-23 2018-04-05 広東美的制冷設備有限公司Ｇｄ Ｍｉｄｅａ Ａｉｒ−Ｃｏｎｄｉｔｉｏｎｉｎｇ Ｅｑｕｉｐｍｅｎｔ Ｃｏ．，Ｌｔｄ． インテリジェントパワーモジュール及びその製造方法
CN110914979A (zh) * 2017-03-30 2020-03-24 株式会社自动网络技术研究所 电路装置
CN111780005A (zh) * 2020-08-06 2020-10-16 广东康荣高科新材料股份有限公司 一种可拆卸模块化散热模组及可调模块化led路灯

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* Cited by examiner, † Cited by third party
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US10433418B2 (en) 2015-12-08 2019-10-01 Signify Holding B.V. Assembly and lighting device comprising the assembly
CN107295782B (zh) * 2017-07-05 2024-02-23 华勤技术股份有限公司 一种适用于终端的硅胶垫的结构及终端
CN108882625B (zh) * 2018-06-20 2023-12-12 江苏英杰电子器件有限公司 一种高效的机箱散热器
US11317540B2 (en) 2019-09-20 2022-04-26 Samsung Electronics Co., Ltd. Solid state drive apparatus and data storage apparatus including the same
EP4622398A1 (fr) * 2024-03-21 2025-09-24 Valeo Vision Ensemble électronique pour dispositif lumineux d'automobile et dispositif lumineux d'automobile

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250631A (ja) * 1995-03-13 1996-09-27 Alpha:Kk 熱交換装置
JP2006114688A (ja) * 2004-10-14 2006-04-27 Okano Electric Wire Co Ltd ヒートシンク
KR20080097379A (ko) * 2008-10-23 2008-11-05 문대식 히트 싱크 제조 방법
JP2009278092A (ja) * 2008-05-16 2009-11-26 Fuzhun Precision Industry (Shenzhen) Co Ltd ヒートシンク及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10153674A (ja) * 1996-11-26 1998-06-09 Nippon Alum Co Ltd ヒートパイプ式ピンフィン型ヒートシンク及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250631A (ja) * 1995-03-13 1996-09-27 Alpha:Kk 熱交換装置
JP2006114688A (ja) * 2004-10-14 2006-04-27 Okano Electric Wire Co Ltd ヒートシンク
JP2009278092A (ja) * 2008-05-16 2009-11-26 Fuzhun Precision Industry (Shenzhen) Co Ltd ヒートシンク及びその製造方法
KR20080097379A (ko) * 2008-10-23 2008-11-05 문대식 히트 싱크 제조 방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018509780A (ja) * 2015-03-23 2018-04-05 広東美的制冷設備有限公司Ｇｄ Ｍｉｄｅａ Ａｉｒ−Ｃｏｎｄｉｔｉｏｎｉｎｇ Ｅｑｕｉｐｍｅｎｔ Ｃｏ．，Ｌｔｄ． インテリジェントパワーモジュール及びその製造方法
CN110914979A (zh) * 2017-03-30 2020-03-24 株式会社自动网络技术研究所 电路装置
CN110914979B (zh) * 2017-03-30 2023-09-15 株式会社自动网络技术研究所 电路装置
CN111780005A (zh) * 2020-08-06 2020-10-16 广东康荣高科新材料股份有限公司 一种可拆卸模块化散热模组及可调模块化led路灯

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