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WO2014119547A1 - Film adhésif et procédé de fabrication de composant électronique - Google Patents

Film adhésif et procédé de fabrication de composant électronique Download PDF

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Publication number
WO2014119547A1
WO2014119547A1 PCT/JP2014/051783 JP2014051783W WO2014119547A1 WO 2014119547 A1 WO2014119547 A1 WO 2014119547A1 JP 2014051783 W JP2014051783 W JP 2014051783W WO 2014119547 A1 WO2014119547 A1 WO 2014119547A1
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Prior art keywords
layer
mass
parts
fpc
trade name
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PCT/JP2014/051783
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English (en)
Japanese (ja)
Inventor
良介 小高
佐藤　大祐
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デクセリアルズ株式会社
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Priority to CN201480019700.3A priority Critical patent/CN105051136A/zh
Priority to HK16100913.6A priority patent/HK1213004A1/zh
Publication of WO2014119547A1 publication Critical patent/WO2014119547A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present invention relates to an adhesive film for bonding two adherends and a method for manufacturing an electronic component using the same.
  • a method of connecting a flexible substrate and another electronic component using an anisotropic conductive adhesive or the like is known in the manufacture of electronic devices.
  • a reinforcing material or the like is sometimes thermocompression bonded to a flexible substrate using a thermosetting adhesive or a thermoplastic adhesive.
  • a nonpolar film such as polypropylene or polymethylpentene is used for the purpose of buffering effect or protecting the pressure-bonding head (for example, see Patent Document 1).
  • the present invention has been proposed in view of such a conventional situation, and provides an adhesive film having an excellent adhesive force even on a nonpolar surface, and a method of manufacturing an electronic component using the same. .
  • an adhesive film according to the present invention includes a first layer containing a thermosetting resin and a curing agent, and a second layer containing 50 wt% or more of a styrene-based hydrogenated block copolymer. And having a layer.
  • a method for manufacturing an electronic component is a method for manufacturing an electronic component in which a first electronic component having a polar surface and a second electronic component having a nonpolar surface are electrically connected, and the thermosetting resin And an adhesive film having a first layer containing a curing agent and a second layer containing 50 wt% or more of a styrene-based hydrogenated block copolymer, the first layer being the polar surface side, And it arrange
  • the second layer contains the styrene-based hydrogenated block copolymer, sufficient adhesion can be obtained even on the adherend on which the components of the nonpolar film adhere to the surface. it can.
  • FIG. 1 is a cross-sectional view showing an example of a mounting body according to an embodiment of the present invention.
  • Adhesive film is used to bond the first adherend and the second adherend, and particularly suitably used when one of the adherends has a nonpolar surface. be able to.
  • the nonpolar surface include polyolefin layers such as polypropylene and polymethylpentene.
  • the adhesive film has a first layer containing a thermosetting resin and a curing agent, and a second layer containing 50 wt% or more of a styrene-based hydrogenated block copolymer.
  • the adhesive film is used so that the second layer side is in contact with the nonpolar surface.
  • the styrene-based hydrogenated block copolymer is blended in the second layer, sufficient adhesive force can be obtained even on the adherend on which the components of the nonpolar film adhere to the surface. Can do.
  • the first layer and the second layer are not compatible with each other.
  • “not compatible” refers to a state in which clear cloudiness can be visually confirmed when all components forming each layer are dissolved in a solvent and cast into a film to evaporate the solvent.
  • thermosetting resin and the curing agent of the first layer either an acrylic thermosetting type or an epoxy thermosetting type may be used, but the curing temperature at the time of connection is low and the tact time is shortened. It is preferable to use an acrylic thermosetting type that can be used. Moreover, when mix
  • the first layer preferably contains conductive particles.
  • the conductive particles can also be contained in the second layer, but the conductive particles of the first layer are mainly present between the terminals after crimping and are involved in conduction.
  • the first layer contains a film-forming resin, a polymerizable acrylic compound that is a thermosetting resin, and a radical polymerization initiator that is a curing agent.
  • thermoplastic elastomer such as phenoxy resin, epoxy resin, polyester resin, polyurethane resin, polyamide, EVA, or the like can be used.
  • a phenoxy resin synthesized from bisphenol A and epichlorohydrin can be preferably used for heat resistance and adhesiveness.
  • An epoxy group-containing acrylate is used as the polymerizable acrylic compound.
  • the epoxy group-containing acrylate include PO-modified bisphenol A diglycidyl ether diacrylate, 4-hydroxybutyl acrylate glycidyl ether, glycidyl methacrylate, novolac partial epoxy acrylate, 3,4-epoxycyclohexyl methyl acrylate, and 3,4-epoxycyclohexyl. Examples thereof include methyl methacrylate.
  • polymerizable acrylic compound other acrylates may be used in combination, for example, tricyclodecane dimethanol dimethacrylate, urethane acrylate, polyethylene glycol diacrylate, phosphate ester acrylate, 2-hydroxyethyl acrylate, 2 -Hydroxypropyl acrylate, 4-hydroxybutyl acrylate, isobutyl acrylate, t-butyl acrylate, isooctyl acrylate and the like may be used.
  • the amount of the polymerizable acrylic compound used is too small, the conduction reliability will be low, and if it is too large, the adhesive strength will be low, and there is a tendency that a film cannot be formed.
  • organic peroxides examples include lauroyl peroxide, di (4-methylbenzoyl) peroxide, di (3-methylbenzoyl) peroxide, dibenzoyl-peroxide, t-hexyl-peroxybenzoate (, t-butyl-peroxybenzoate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, dilauroyl peroxide, di (3,5,5-trimethylhexanoyl) peroxide, t-butyl peroxypivalate, etc.
  • azo compound examples include 2,2′-azobis-isobutyronitrile, 2,2′-azobis-2-methylbutyronitrile, 1,1′-azobis-1-cyclohexanecarbonitrile, dimethyl-2, 2'-azobisisobutyrate, 1,1'-azobis- 1-acetoxy-1-phenylethane), and the like.
  • radical polymerization initiators may be used alone or in admixture of two or more.
  • the resin solid content (the polymerizable acrylic compound and the film-forming resin are preferably used). 0.1-30 wt% of the total), more preferably 0.5-20 wt%.
  • acid-modified polyolefin particles as another additive composition.
  • the adhesion between the layers can be improved.
  • examples of the acid modification include carboxylic acid modification and maleic anhydride modification.
  • Specific examples of commercially available products include Mitsui Chemicals Co., Ltd. Unistall, Chuo Rika Kogyo Co., Ltd. Aquatex, Sumitomo Seika Co., Ltd. Sepoljon, Syxen, CSM Latex and the like.
  • the content of the acid-modified polyolefin particles is too small, the improvement of the adhesive strength between the layers will not be exhibited, and if it is too large, the adhesive strength as an adhesive tends to decrease.
  • an inorganic filler may be contained.
  • an inorganic filler By containing an inorganic filler, the fluidity of the resin layer during pressure bonding can be adjusted, and the particle capture rate can be improved.
  • the inorganic filler fused silica, talc, titanium oxide, calcium carbonate, magnesium oxide or the like can be used, and the kind of the inorganic filler is not particularly limited.
  • conductive particles are blended.
  • the conductive particles include any known conductive particles used in anisotropic conductive films.
  • the conductive particles include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, and acrylic resin, acrylonitrile styrene (AS ) A resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, or the like coated with a metal, or a surface of these particles coated with an insulating thin film.
  • AS acrylonitrile styrene
  • monomers for dilution such as various acrylic monomers, fillers, softeners, colorants, flame retardants, thixotropic agents, coupling agents, and the like may be included.
  • the second layer contains 50 wt% or more of a styrene-based hydrogenated block copolymer.
  • the styrene-based hydrogenated block copolymer has a styrene phase having a high glass transition point (Tg) and an olefin phase having a low polarity at the same time, the styrene-based hydrogenated block copolymer has good heat resistance and is attached to the flexible substrate. High adhesion to polar film components can be expressed.
  • styrene-based hydrogenated block copolymer examples include SEBS (styrene-ethylene / butylene-styrene block copolymer) and SEPS (styrene-ethylene / propylene-styrene block copolymer).
  • the acid-modified styrene-based hydrogenated block copolymer is obtained by modifying a styrene-based hydrogenated block copolymer with an acid such as maleic anhydride or carboxylic acid.
  • the amount of the styrene-based hydrogenated block copolymer used is too small, sufficient adhesion to a nonpolar film cannot be obtained, and therefore it is preferably 50 to 100 wt% of the total resin solid content.
  • SBS styrene-butadiene-styrene block copolymer
  • SIS styrene-isoprene-styrene block copolymer
  • the second layer preferably contains a film-forming resin, a polymerizable acrylic compound that is a thermosetting resin, and a radical polymerization initiator that is a curing agent, as in the case of the first layer.
  • a monomer for dilution such as various acrylic monomers, a filler, a softener, a coloring agent, a flame retardant, a thixotropic agent, a coupling agent etc. as needed.
  • the second layer contains 50 wt% or more of a styrene-based hydrogenated block copolymer, so that the non-polar film component adheres to the adherend on the surface. , Sufficient adhesive strength can be obtained.
  • the first layer and the second layer are respectively manufactured, and the first layer and the second layer are bonded to each other.
  • the method for producing the first layer and the second layer has an application step of applying the composition on the release substrate and a drying step of drying the composition on the release substrate.
  • the resin composition of the first layer or the second layer is dissolved in an organic solvent and mixed, and then the resin composition is coated on the peeling substrate using a bar coater, a coating device, or the like.
  • the organic solvent toluene, ethyl acetate, or a mixed solvent thereof, and other various organic solvents can be used.
  • the release substrate is made of, for example, a laminated structure in which a release agent such as silicone is applied to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), and the like. And maintaining the film shape of the composition.
  • the composition on the release substrate is dried by a heat oven, a heat drying apparatus or the like. Thereby, the 1st layer and 2nd layer in which the resin composition was formed in the film form can be obtained.
  • An adhesive film having a two-layer structure can be obtained by superimposing the first layer and the second layer.
  • connection method of the electronic component using the adhesive film mentioned above is demonstrated.
  • a specific example of the method for connecting an electronic component when electrically connecting a first electronic component having a polar surface and a second electronic component having a nonpolar surface, a thermosetting resin, a curing agent, An adhesive film having a first layer containing styrene-based hydrogenated block copolymer and a second layer containing 50 wt% or more of the styrene-based hydrogenated block copolymer, the first layer being a polar surface side, and the second layer being non- It arrange
  • the adhesive in this embodiment can be used in various situations.
  • the first electronic component is a printed wiring board (PWB), a liquid crystal panel, and the like
  • the second electric component is a flexible printed circuit.
  • PWB printed wiring board
  • the second electric component is a flexible printed circuit.
  • FPC substrate
  • TCP tape carrier package
  • COF chip-on-film
  • it can be preferably applied as an anisotropic conductive film by blending conductive particles.
  • it can also use for the connection of the terminal of a photovoltaic cell in a solar cell module, and a tab wire as an electroconductive adhesive film which mix
  • FIG. 1 is a cross-sectional view showing an example of a mounting body according to an embodiment of the present invention.
  • This mounting body uses a printed wiring board (PWB) 11 as a first electronic component and a flexible printed circuit board (FPC) 12 as a second electronic component and is connected by an anisotropic conductive film 20. is there.
  • the FPC 12 has a nonpolar polyolefin layer 12a on the bonding surface side.
  • the anisotropic conductive film 20 includes a first layer 21 containing acid-modified polyolefin particles 31 and conductive particles 32, and a second layer 22 containing 50 wt% or more of a styrene-based hydrogenated block copolymer. And the second layer 22 is disposed on the polyolefin layer 12a side. The conductive particles 32 are crushed between the terminals 13 of the PWB 11 and the terminals 14 of the FCP, thereby connecting the terminals.
  • the interface between the first layer 21 and the second layer 22 after crimping exists between the terminal 13 of the PWB 11 and the terminal 14 of the FCP. Thereby, the outstanding adhesive force can be obtained.
  • the adhesive force at the interface between the first layer 21 and the second layer 22 can be improved.
  • Example> Examples of the present invention will be described in detail below, but the present invention is not limited to these examples.
  • an anisotropic conductive film (ACF: Anisotropic Conductive Film) having a first layer and a second layer was produced.
  • ACF Anisotropic Conductive Film
  • the mounting body was created using the adhesive film and the adhesive strength of the mounting body was evaluated.
  • the compatibility evaluation of the first layer and the second layer, the fabrication of the mounting body, and the evaluation of the adhesive strength were performed as follows.
  • the FPC described above was sandwiched between constituent materials (polypropylene) and pressure-bonded using an elastic head under the conditions of 160 ° C.-90 min-1.3 MPa to produce an FPC having a nonpolar surface.
  • polypropylene was transferred onto the pressure-bonded surface of the ACF peeled from the FPC.
  • FPC and PWB or non-polar FPC and PWB were connected under pressure bonding conditions of 170 ° C.-10 s and 3 MPa with an ACF sandwiched so that the second layer was on the FPC side, and a mounted body was fabricated.
  • Each mount was subjected to a 90 degree peel test (JIS K6854-1) for peeling FPC or nonpolar FPC in a 90 degree direction at a peel rate of 50 mm / min, and the peel strength was measured as the adhesive strength. More than 7 N / cm was evaluated as ⁇ , 7-5 N / cm was evaluated as ⁇ , and less than 5 N / cm was evaluated as ⁇ .
  • the adhesive strength was also evaluated after a high temperature and high humidity test at a temperature of 60 ° C. and a humidity of 95% RH for 500 hours. Further, after the peel test, whether the first layer and the second layer of ACF are present in FPC or PWB was observed with a microscope and FT-IR.
  • Example 1 As a first layer, 34 parts by mass of bisphenol A type phenoxy resin (trade name: YP-50, manufactured by Tohto Kasei Co., Ltd.), bifunctional epoxy acrylate (trade name: 3002A, manufactured by Kyoeisha Chemical Co., Ltd., PO-modified bisphenol A diglycidyl ether) 27 parts by mass of diacrylate), 8 parts by mass of bifunctional acrylate (trade name: DCP, Shin-Nakamura Chemical Co., Ltd., tricyclodecane dimethanol dimethacrylate), hydroxyl group-containing acrylic rubber (trade name: SG80H, manufactured by Nagase Chemtex Co., Ltd.) ) 21 parts by mass, organic peroxide (trade name: Parroyl L, manufactured by Nippon Oil & Fats, Lauroyl peroxide) 6 parts by mass, Ni / Au plated acrylic resin particles (manufactured by Nippon Chemical Co., Ltd.) having an average particle size of 10 ⁇ m
  • the second layer 50 parts by mass of acid-modified SEBS (styrene-ethylene-butylene-styrene block copolymer) (trade name: Kraton FG1924, manufactured by Kraton Co., Ltd.), bifunctional epoxy acrylate (trade name: 3002A, Kyoeisha) 35 parts by mass of PO-modified bisphenol A diglycidyl ether diacrylate manufactured by Kagaku Co., Ltd., 10 parts by mass of bifunctional acrylate (trade name: DCP, Shin-Nakamura Chemical Co., Ltd., tricyclodecane dimethanol dimethacrylate) A total of 100 parts by mass of a resin composition containing 5 parts by mass of an oxide (trade name: Parroyl L, manufactured by NOF Corporation, Lauroyl peroxide) was prepared.
  • SEBS styrene-ethylene-butylene-styrene block copolymer
  • bifunctional epoxy acrylate trade name: 3002A, Kyoeisha 35 parts by mass
  • each resin composition was dissolved and mixed in 100 parts by mass of toluene, using a bar coater, the first layer was applied to the release PET sheet so that the second layer was 25 ⁇ m and the second layer was 10 ⁇ m. After drying for 10 minutes at a temperature to evaporate the solvent, the first layer and the second layer were overlapped to obtain an ACF having a thickness of 35 ⁇ m. And each mounting body was produced as mentioned above.
  • Table 1 shows the results of evaluating the adhesive strength of the mounted body of Example 1.
  • the compatibility of the first and second layers of ACF was incompatible.
  • the initial adhesion strength evaluation between FPC and PWB was “ ⁇ ”, and the ACF after peeling adhered to the FPC side in both the first layer and the second layer.
  • the initial adhesive strength evaluation of nonpolar FPC and PWB was ⁇ , and the ACF after peeling adhered to the FPC side in both the first layer and the second layer.
  • the evaluation of the adhesive strength between the nonpolar FPC and PWB after the high-temperature and high-humidity test was ⁇ , and the ACF after peeling adhered to the FPC side in both the first layer and the second layer.
  • Example 2 As the first layer, 32 parts by mass of bisphenol A type phenoxy resin (trade name: YP-50, manufactured by Tohto Kasei Co., Ltd.), 26 parts by mass of bifunctional epoxy acrylate (trade name: 3002A, manufactured by Kyoeisha Chemical Co., Ltd.), bifunctional 8 parts by mass of acrylate (trade name: DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 20 parts by mass of hydroxyl group-containing acrylic rubber (trade name: SG80H, manufactured by Nagase Chemtex Co., Ltd.), organic peroxide (trade name: Parroyl L, Japan) 6 parts by mass (made by Yushi Co., Ltd.), 3 parts by mass of Ni / Au plated acrylic resin particles (manufactured by Nippon Chemical Co., Ltd.) having an average particle size of 10 ⁇ m, and acid-modified polyolefin fine particles (trade name: UNISTOL R200: made by Mitsui Chemicals) Except that
  • Table 1 shows the results of evaluating the adhesive strength of the mounted body of Example 2.
  • the compatibility of the first and second layers of ACF was incompatible.
  • the initial adhesion strength evaluation between FPC and PWB was “ ⁇ ”, and the ACF after peeling adhered to the FPC side in both the first layer and the second layer.
  • the initial adhesive strength evaluation of nonpolar FPC and PWB was ⁇ , and the ACF after peeling adhered to the FPC side in both the first layer and the second layer.
  • the evaluation of the adhesive strength between the nonpolar FPC and PWB after the high-temperature and high-humidity test was ⁇ , and the ACF after peeling adhered to the FPC side in both the first layer and the second layer.
  • Example 3 As the first layer, 34 parts by mass of bisphenol A type phenoxy resin (trade name: YP-50, manufactured by Tohto Kasei Co., Ltd.), 27.5 parts by mass of bifunctional epoxy acrylate (trade name: 3002A, manufactured by Kyoeisha Chemical Co., Ltd.), 8 parts by mass of bifunctional acrylate (trade name: DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 21 parts by mass of hydroxyl group-containing acrylic rubber (trade name: SG80H, manufactured by Nagase Chemtex Co., Ltd.), organic peroxide (trade name: Parroyl L) , Manufactured by Nippon Oil & Fats Co., Ltd.), 6 parts by mass of Ni / Au plated acrylic resin particles (manufactured by Nippon Chemical Co., Ltd.) with an average particle size of 10 ⁇ m, and acid-modified polyolefin fine particles (trade name: Unistor R200: Mitsui Chemicals,
  • Table 1 shows the results of evaluating the adhesive strength of the mounted body of Example 3.
  • the compatibility of the first and second layers of ACF was incompatible.
  • the initial evaluation of the adhesive strength between FPC and PWB was ⁇ , and after peeling, the first layer adhered to the PWB side and the second layer adhered to the FPC side.
  • the initial evaluation of adhesion strength between non-polar FPC and PWB was “ ⁇ ”, and the peeled ACF had the first layer attached to the PWB side and the second layer attached to the FPC side.
  • the adhesion strength evaluation after the high-temperature and high-humidity test of nonpolar FPC and PWB was “good”, and the ACF after peeling was attached to the PWB side on the first layer and attached to the FPC side on the second layer.
  • Example 4 As the first layer, 27 parts by mass of bisphenol A type phenoxy resin (trade name: YP-50, manufactured by Tohto Kasei Co., Ltd.), 22 parts by mass of bifunctional epoxy acrylate (trade name: 3002A, manufactured by Kyoeisha Chemical Co., Ltd.), bifunctional 6 parts by mass of acrylate (trade name: DCP, Shin-Nakamura Chemical Co., Ltd.), 17 parts by mass of hydroxyl group-containing acrylic rubber (trade name: SG80H, Nagase Chemtex Co., Ltd.), organic peroxide (trade name: Parroyl L, Japan) 5 parts by weight of oil and fat), 3 parts by weight of Ni / Au plated acrylic resin particles (manufactured by Nippon Chemical Co., Ltd.) having an average particle size of 10 ⁇ m, and acid-modified polyolefin fine particles (trade name: Unistor R200: manufactured by Mitsui Chemicals) ACF and a mounting body were produced and the adhesive strength was
  • Table 1 shows the results of evaluating the adhesive strength of the mounted body of Example 4.
  • the compatibility of the first and second layers of ACF was incompatible.
  • the initial adhesion strength evaluation between FPC and PWB was “good”, and the ACF after peeling adhered to the FPC side in both the first layer and the second layer.
  • the initial bond strength evaluation between the nonpolar FPC and the PWB was “good”, and the ACF after peeling adhered to the FPC side in both the first layer and the second layer.
  • the adhesion strength evaluation after the high-temperature and high-humidity test of nonpolar FPC and PWB was “good”, and the ACF after peeling adhered to the FPC side in both the first layer and the second layer.
  • Example 5 As the first layer, 34 parts by mass of bisphenol A type phenoxy resin (trade name: YP-50, manufactured by Tohto Kasei Co., Ltd.), 27 parts by mass of bifunctional epoxy acrylate (trade name: 3002A, manufactured by Kyoeisha Chemical Co., Ltd.), bifunctional 8 parts by mass of acrylate (trade name: DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 21 parts by mass of hydroxyl group-containing acrylic rubber (trade name: SG80H, manufactured by Nagase Chemtex Co., Ltd.), organic peroxide (trade name: Parroyl L, Japan) 6 parts by weight of oil and fat, 3 parts by weight of Ni / Au plated acrylic resin particles (manufactured by Nippon Chemical Co., Ltd.) with an average particle size of 10 ⁇ m, and 1 part of fused silica (trade name: FB-12D: manufactured by Denka) Except for preparing a total of 100 parts by mass of a resin composition
  • Table 1 shows the results of evaluating the adhesive strength of the mounted body of Example 5.
  • the compatibility of the first and second layers of ACF was incompatible.
  • the initial evaluation of the adhesive strength between FPC and PWB was ⁇ , and after peeling, the first layer adhered to the PWB side and the second layer adhered to the FPC side.
  • the initial evaluation of adhesion strength between non-polar FPC and PWB was “ ⁇ ”, and the peeled ACF had the first layer attached to the PWB side and the second layer attached to the FPC side.
  • the adhesion strength evaluation after the high-temperature and high-humidity test of nonpolar FPC and PWB was “good”, and the ACF after peeling was attached to the PWB side on the first layer and attached to the FPC side on the second layer.
  • Example 6 As the first layer, 34 parts by mass of bisphenol A type phenoxy resin (trade name: YP-50, manufactured by Tohto Kasei Co., Ltd.) and 28 parts by mass of bifunctional epoxy acrylate (trade name: 3002A, manufactured by Kyoeisha Chemical Co., Ltd.) 8 parts by mass of acrylate (trade name: DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 21 parts by mass of hydroxyl group-containing acrylic rubber (trade name: SG80H, manufactured by Nagase Chemtex Co., Ltd.), organic peroxide (trade name: Parroyl L, Japan) Except for preparing a total of 100 parts by mass of a resin composition in which 6 parts by mass of Yushi Co., Ltd.) and 3 parts by mass of Ni / Au plated acrylic resin particles (Nippon Chemical Co., Ltd.) having an average particle size of 10 ⁇ m were prepared. In the same manner as in No. 1, an ACF and a mounting body were produced, and
  • Table 1 shows the results of evaluating the adhesive strength of the mounted body of Example 6.
  • the compatibility of the first and second layers of ACF was incompatible.
  • the initial evaluation of the adhesive strength between FPC and PWB was ⁇ , and after peeling, the first layer adhered to the PWB side and the second layer adhered to the FPC side.
  • the initial evaluation of adhesion strength between non-polar FPC and PWB was “ ⁇ ”, and the peeled ACF had the first layer attached to the PWB side and the second layer attached to the FPC side.
  • the adhesion strength evaluation after the high-temperature and high-humidity test of nonpolar FPC and PWB was “good”, and the ACF after peeling was attached to the PWB side on the first layer and attached to the FPC side on the second layer.
  • Example 7 As the first layer, 34 parts by mass of bisphenol A type phenoxy resin (trade name: YP-50, manufactured by Tohto Kasei Co., Ltd.) and 28 parts by mass of bifunctional epoxy acrylate (trade name: 3002A, manufactured by Kyoeisha Chemical Co., Ltd.) 8 parts by mass of acrylate (trade name: DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 21 parts by mass of hydroxyl group-containing acrylic rubber (trade name: SG80H, manufactured by Nagase Chemtex Co., Ltd.), organic peroxide (trade name: Parroyl L, Japan) A total of 100 parts by mass of a resin composition was prepared by blending 6 parts by mass of Ogyu Co., Ltd.
  • Ni / Au plated acrylic resin particles manufactured by Nippon Chemical Co., Ltd.
  • Acid-modified SEBS styrene-ethylene-butylene-styrene block copolymer
  • Kraton FG1924 manufactured by Kraton Polymer Japan
  • Table 1 shows the results of evaluating the adhesive strength of the mounted body of Example 7.
  • the compatibility of the first and second layers of ACF was incompatible.
  • the initial evaluation of the adhesive strength between FPC and PWB was ⁇ , and after peeling, the first layer adhered to the PWB side and the second layer adhered to the FPC side.
  • the initial evaluation of adhesion strength between non-polar FPC and PWB was “ ⁇ ”, and the peeled ACF had the first layer attached to the PWB side and the second layer attached to the FPC side.
  • the adhesion strength evaluation after the high-temperature and high-humidity test of nonpolar FPC and PWB was “good”, and the ACF after peeling was attached to the PWB side on the first layer and attached to the FPC side on the second layer.
  • Example 8 As the first layer, 34 parts by mass of bisphenol A type phenoxy resin (trade name: YP-50, manufactured by Tohto Kasei Co., Ltd.) and 28 parts by mass of bifunctional epoxy acrylate (trade name: 3002A, manufactured by Kyoeisha Chemical Co., Ltd.) 8 parts by mass of acrylate (trade name: DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 21 parts by mass of hydroxyl group-containing acrylic rubber (trade name: SG80H, manufactured by Nagase Chemtex Co., Ltd.), organic peroxide (trade name: Parroyl L, Japan) A total of 100 parts by mass of a resin composition was prepared by blending 6 parts by mass of Ogyu Co., Ltd.
  • Ni / Au plated acrylic resin particles manufactured by Nippon Chemical Co., Ltd.
  • a hydrogenated styrene / butadiene block copolymer (trade name: Septon 8076, manufactured by Kuraray Co., Ltd.) was prepared in the same manner as in Example 1 except that 100 parts by mass of a resin composition was prepared. To produce F and mount assembly, to evaluate the adhesion strength.
  • Table 1 shows the results of evaluating the adhesive strength of the mounted body of Example 8.
  • the compatibility of the first and second layers of ACF was incompatible.
  • the initial evaluation of the adhesion strength between FPC and PWB was “ ⁇ ”, and the peeled ACF had the first layer attached to the PWB side and the second layer attached to the FPC side.
  • the initial adhesion strength evaluation between the nonpolar FPC and the PWB was “good”, and the ACF after peeling was attached to the PWB side in the first layer and attached to the FPC side in the second layer.
  • the adhesion strength evaluation after the high-temperature and high-humidity test of nonpolar FPC and PWB was “good”, and the ACF after peeling was attached to the PWB side on the first layer and attached to the FPC side on the second layer.
  • Table 1 shows the results of evaluating the adhesive strength of the mounting body of Comparative Example 1.
  • the initial adhesion strength evaluation between FPC and PWB was “ ⁇ ⁇ ”, and the ACF after peeling adhered to the PWB side and the FRC side.
  • the initial adhesive strength evaluation of nonpolar FPC and PWB was x, and the ACF after peeling adhered to the PWB side.
  • the adhesive strength evaluation after the high-temperature high-humidity test of nonpolar FPC and PWB was x, and the ACF after peeling adhered to the PWB side.
  • Table 1 shows the results of evaluating the adhesive strength of the mounting body of Comparative Example 2.
  • the initial adhesion strength evaluation between FPC and PWB was “ ⁇ ⁇ ”, and the ACF after peeling adhered to the PWB side and the FRC side.
  • the initial adhesive strength evaluation of nonpolar FPC and PWB was x, and the ACF after peeling adhered to the PWB side.
  • the adhesive strength evaluation after the high-temperature high-humidity test of nonpolar FPC and PWB was x, and the ACF after peeling adhered to the PWB side.
  • the second layer 40 parts by mass of acid-modified SEBS (styrene-ethylene-butylene-styrene block copolymer) (trade name: Kraton FG1924, manufactured by Kraton Co., Ltd.), bifunctional epoxy acrylate (trade name: 3002A, Kyoeisha) Chemical Co., Ltd.) 45 parts by mass, bifunctional acrylate (trade name: DCP, Shin-Nakamura Chemical Co., Ltd.) 10 parts by mass, and organic peroxide (trade name: Parroyl L, manufactured by NOF Corporation) 5 parts by mass A total of 100 parts by mass of the blended resin composition was prepared. Except for the above, an ACF and a mounted body were produced in the same manner as in Example 1, and the adhesive strength was evaluated.
  • SEBS styrene-ethylene-butylene-styrene block copolymer
  • Table 1 shows the results of evaluating the adhesive strength of the mounting body of Comparative Example 3.
  • the compatibility of the first and second layers of ACF was incompatible.
  • the initial evaluation of the adhesive strength between FPC and PWB was ⁇ , and after peeling, the first layer adhered to the PWB side and the second layer adhered to the FPC side.
  • the initial adhesive strength evaluation of nonpolar FPC and PWB was x, and the ACF after peeling adhered to the PWB side in both the first layer and the second layer.
  • the adhesive strength evaluation after the high-temperature high-humidity test of nonpolar FPC and PWB was x, and the ACF after peeling adhered to the FPC side in both the first layer and the second layer.
  • Comparative Examples 1 and 2 do not have a two-layer structure corresponding to nonpolar FPC, high adhesive strength could not be obtained for nonpolar FPC. Further, although Comparative Example 3 has a two-layer structure, the second layer on the nonpolar FPC side does not contain 50 wt% or more of the styrene-based hydrogenated block copolymer, so that high adhesive strength can be obtained. There wasn't.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

L'invention concerne un film adhésif présentant une excellente adhérence, même sur une surface non polaire, et un procédé de fabrication de composants électroniques l'utilisant. Selon l'invention, un film adhésif, présentant une première couche (11), comprenant une résine thermodurcissable et un agent de durcissement, et une deuxième couche (12), comprenant 50 % en poids ou plus d'un copolymère séquencé hydrogéné à base de styrène, est disposé de manière telle qu'une surface non polaire se trouve du côté de la deuxième couche. Puisque la deuxième couche (12) comprend un copolymère séquence hydrogéné à base de styrène, ce film adhésif peut atteindre une adhérence suffisante même sur un adhésif présentant des constituants d'un film non polaire qui adhère sur une surface correspondante.
PCT/JP2014/051783 2013-01-30 2014-01-28 Film adhésif et procédé de fabrication de composant électronique WO2014119547A1 (fr)

Priority Applications (2)

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CN201480019700.3A CN105051136A (zh) 2013-01-30 2014-01-28 粘接膜和电子部件的制造方法
HK16100913.6A HK1213004A1 (zh) 2013-01-30 2014-01-28 粘接膜和电子部件的制造方法

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JP2013-015807 2013-01-30
JP2013015807A JP6133069B2 (ja) 2013-01-30 2013-01-30 加熱硬化型接着フィルム

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Publication number Priority date Publication date Assignee Title
JP6783537B2 (ja) * 2016-03-24 2020-11-11 デクセリアルズ株式会社 接続体の製造方法
JP6889020B2 (ja) * 2016-05-02 2021-06-18 デクセリアルズ株式会社 異方性導電フィルムの製造方法、及び異方性導電フィルム

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312176A (ja) * 1996-05-23 1997-12-02 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
WO1998038261A1 (fr) * 1997-02-27 1998-09-03 Seiko Epson Corporation Adhesif, dispositif a cristaux liquides, procede de production d'un dispositif a cristaux liquides, et appareil electronique
WO2001068785A1 (fr) * 2000-03-13 2001-09-20 Sumitomo Chemical Company, Limited Adhesif, procede de production de stratifie avec l'adhesif, et stratifie
JP2005255829A (ja) * 2004-03-11 2005-09-22 Nitto Denko Corp 加熱剥離型粘着シートおよび被着体の加工方法
JP2012094834A (ja) * 2010-09-13 2012-05-17 Sumitomo Bakelite Co Ltd ダイシングフィルム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4447485A (en) * 1981-08-04 1984-05-08 Mitsubishi Plastics Industries Limited Adhesive tape and process for its production

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312176A (ja) * 1996-05-23 1997-12-02 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
WO1998038261A1 (fr) * 1997-02-27 1998-09-03 Seiko Epson Corporation Adhesif, dispositif a cristaux liquides, procede de production d'un dispositif a cristaux liquides, et appareil electronique
WO2001068785A1 (fr) * 2000-03-13 2001-09-20 Sumitomo Chemical Company, Limited Adhesif, procede de production de stratifie avec l'adhesif, et stratifie
JP2005255829A (ja) * 2004-03-11 2005-09-22 Nitto Denko Corp 加熱剥離型粘着シートおよび被着体の加工方法
JP2012094834A (ja) * 2010-09-13 2012-05-17 Sumitomo Bakelite Co Ltd ダイシングフィルム

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JP6133069B2 (ja) 2017-05-24
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JP2014145055A (ja) 2014-08-14

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