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WO2014115263A1 - Système de commande de positionnement - Google Patents

Système de commande de positionnement Download PDF

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Publication number
WO2014115263A1
WO2014115263A1 PCT/JP2013/051288 JP2013051288W WO2014115263A1 WO 2014115263 A1 WO2014115263 A1 WO 2014115263A1 JP 2013051288 W JP2013051288 W JP 2013051288W WO 2014115263 A1 WO2014115263 A1 WO 2014115263A1
Authority
WO
WIPO (PCT)
Prior art keywords
control system
control
positioning control
positioning
axis direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/051288
Other languages
English (en)
Japanese (ja)
Inventor
小田井　正樹
博紀 小川
豊和 高木
恵利衣 高野
功 高平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to PCT/JP2013/051288 priority Critical patent/WO2014115263A1/fr
Publication of WO2014115263A1 publication Critical patent/WO2014115263A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/404—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for compensation, e.g. for backlash, overshoot, tool offset, tool wear, temperature, machine construction errors, load, inertia
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/42—Servomotor, servo controller kind till VSS
    • G05B2219/42249—Relative positioning
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49176—Compensation of vibration of machine base due to slide movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Definitions

  • the present invention relates to a positioning control system for controlling the position of a moving body.
  • the positioning accuracy of the moving bodies constituting the device is a major factor that determines the quality of processed products and mechatronic products.
  • a positioning control system that controls the positioning of a moving body is recognized as an important mechanism element that determines the quality of a product. Technological development is progressing to improve positioning accuracy.
  • a servo system is formed by a host controller, a servo amplifier, and a servo motor.
  • a servo amplifier to which the operation command for positioning control of the device is input, in the servo system that drives the servo motor connected to the load device with variable speed by the drive current based on the position / speed adjustment calculation result for positioning control, A servo system is disclosed in which a load device continuously performs reciprocating motions a plurality of times in a servo amplifier even when no operation command is issued.
  • Factors affecting the accuracy of the positioning control system include, for example, changes in the position of the center of gravity and changes in rigidity of the configuration including the moving body, balance between thrust and inertial force, machine differences associated with component processing accuracy and assembly accuracy, etc. There is a tendency that the influence becomes remarkable as the movable range of the moving body becomes wider. In addition, deterioration of lubricants and adhesives used for components such as linear guides, wear of sliding / connecting parts, secular changes such as deformation and creep, or floor rigidity, ground vibration, vibration from peripheral devices The installation environment of the positioning device such as propagation also affects the characteristic variation of the controlled object. Therefore, it is important to realize uniform and accurate mechanism characteristics over the entire operating range of the moving body and to suppress fluctuations in the characteristics of the controlled object.
  • control parameter is determined based on the characteristics and response at the position of the control target at the time of adjustment execution, it is not possible to perform appropriate adjustment considering the position dependency of the control target. Therefore, it is difficult to maintain robustness with respect to position dependence over the entire movable range.
  • the present invention has been made in view of the above, and an object of the present invention is to provide a positioning control system that is highly robust with respect to the position dependency of the control target in the entire movable range and the machine difference of each device.
  • the present invention measures a moving device that moves a moving object, a position detecting device that detects the position of the moving object, and control characteristics of a control system of the moving device at a plurality of positions.
  • a measurement device an adjustment value calculation unit for calculating an adjustment value for adjusting a control parameter of a control system of the mobile device based on the plurality of measurement results obtained by the measurement device, and a position detection device. Based on the detection result and the control parameter, the moving object is controlled to move to a predetermined target position, and the control parameter is adjusted based on the adjustment value calculated by the adjustment value calculation unit.
  • a control parameter adjustment unit is provided.
  • the present invention it is possible to provide a positioning control system having high robustness with respect to the position dependency of the controlled object in the entire movable range and the machine difference of each device.
  • FIG. 10 is a diagram corresponding to the characteristics of the controlled object shown in FIG. 9 and showing open loop characteristics when the notch filter is automatically adjusted. It is a figure which shows the sensitivity function corresponding to the open loop characteristic shown in FIG. It is a figure which shows schematically the whole structure of the component mounting apparatus which concerns on 2nd Embodiment. It is a figure which shows schematically the whole structure of the semiconductor manufacturing / inspection apparatus which concerns on 3rd Embodiment. It is a figure which shows roughly the whole structure of the printed circuit board processing apparatus which concerns on 4th Embodiment.
  • FIG. 1 is a diagram schematically showing an overall configuration of a positioning control system according to the present embodiment.
  • the X axis is set in the horizontal direction and the Y axis is set in the vertical direction.
  • the positioning control system includes a base table 100 serving as a base of the positioning control system, a top table 110 as a movement target, an X-axis direction driving mechanism 120 that is a moving device that moves the top table 110, and a Y-axis direction.
  • the driving mechanism 130 and a control device 140 that controls the operation of the entire positioning control system including them are schematically configured.
  • the positioning control system shown in the present embodiment moves the top table 110 by operating the X-axis direction driving mechanism 120 and the Y-axis direction driving mechanism 130 under the control of the control device 140, and positioning the top table 110 with respect to the base table 100. Is to do.
  • the Y-axis direction drive mechanism 130 includes a Y-axis direction linear guide 131, a Y-axis direction drive motor stator 132, and a Y-axis direction linear scale 133 that are arranged on the base table 100 along the Y-axis direction. Yes.
  • a slide unit (not shown) is attached to the Y-axis direction linear guide 131, thereby guiding the movement of the Y table 126 of the X-axis direction drive mechanism 120 in the Y-axis direction.
  • the Y table 126 can be driven along the Y axis direction linear guide 131 by driving the Y axis direction motor movable element 124 provided on the Y table 126 with respect to the Y axis direction motor stator 132. .
  • the Y-axis direction linear scale 133 and the Y scale head 125 constitute a part of a position detection device that detects the position of the top table 110 that is a movement target.
  • the X-axis direction drive mechanism 120 has an X-axis direction linear guide 121, an X-axis direction drive motor stator 122, and an X-axis direction linear scale 123 arranged on the Y table 126 along the X-axis direction. Yes.
  • a slide unit (not shown) is attached to the X-axis direction linear guide 121, thereby guiding the movement of the top table 110 in the X-axis direction. Further, the top table 110 can be driven along the X-axis direction linear guide 121 by driving the X-axis direction motor movable element 111 provided on the top table 110 with respect to the X-axis direction motor stator 122. .
  • the position (coordinates) of the top table 110 in the X-axis direction can be detected.
  • the X-axis direction linear scale 123 and the X scale head 112 constitute a part of a position detection device that detects the position of the top table 110 that is a movement target.
  • the mass configured to be driven in the Y-axis direction by the Y-axis direction drive motor movable element 124 includes the Y table 126, the X-axis direction linear guide 123, the X-axis direction motor stator 122, the top table 110, and the like. Since the position of the center of gravity of the movable mass in the Y-axis direction varies greatly depending on the position of the top table 110, the characteristics of the controlled object change such that the resonance frequency and the magnitude of the resonance peak change as seen from the control system in the Y-axis direction.
  • the load varies depending on the position of the top table 110 due to the mounting accuracy and lubrication state of the X-axis direction and Y-axis direction linear guides 121 and 131, the deflection of the Y table 126, and the like.
  • the control device 140 includes a display device 141 that displays various information and setting screens, an input device 142 that inputs various information and setting values, a storage unit 143 that stores various information and setting values, and a control system in the positioning control system.
  • a control system in the positioning control system.
  • the adjustment value calculation unit 145 for calculating the adjustment value, the detection result of the position detection device, and the control parameter
  • the top table 110 that is the movement target is controlled to move to a predetermined target position, and the adjustment value
  • a control parameter adjustment unit 146 that adjusts the control parameter based on the adjustment value calculated by the calculation unit 145.
  • FIG. 2 is a functional block diagram showing a control system of the positioning control system in the present embodiment.
  • the control system in one axial direction for example, the X-axis direction
  • the same configuration is applied to other axial directions (for example, the Y-axis direction).
  • the command generation unit 150 outputs the movement of the top table 110 to the target position as a position command, and movements such as a target movement amount, speed, acceleration, etc. that are preset and stored in the storage unit 143.
  • a position command is generated and output using parameters.
  • the subtractor 151 includes a Y scale head 125 in conjunction with the current position (in other words, the Y-axis direction motor movable element 124 controlled by the position command) which is the position command output from the command generation unit 150 and the output 156a of the control target 156. And the difference from the position in the Y-axis direction detected in step S3) is output to the signal processing unit 152.
  • the signal processing unit 152 includes a controller 153 and a filter 154, and calculates and outputs an operation amount for the control target 156.
  • the controller 153 of the signal processing unit 152 can be realized using, for example, a PID controller.
  • the transfer function Gc of the controller 153 in the present embodiment is expressed by the following equation 1 where s is a Laplace operator, Kp is a proportional gain, Ki is an integral gain, and Kd is a differential gain.
  • the filter 154 of the signal processing unit 152 can be realized using, for example, a notch filter that suppresses vibration at a resonance frequency.
  • the transfer function Gf of the filter 154 in the present embodiment is expressed by the following expression 2 where ⁇ c is the resonance frequency and ⁇ is the parameter that determines the width of the notch.
  • the open loop characteristic is suitable for evaluating the stability of the control system
  • the sensitivity function is suitable for evaluating the disturbance suppression characteristic
  • control parameter adjustment unit 146 adjusts the parameter of the filter 154 (notch filter) of the signal processing unit 152 as a control parameter.
  • FIG. 3 is a diagram illustrating an example of a plurality of positions (9 positions in the present embodiment) at which the control characteristic of the control system in the positioning control system is measured by the measuring device. In FIG. 3, only some components are illustrated for the sake of simplicity.
  • a position 166 shows a case where the Y table 126 is near the center of the stroke in the Y-axis direction.
  • Positions 163 and 169 illustrate the case where the Y table 126 is near the positive stroke end (upper side in FIG. 3) and the negative stroke end (lower side in FIG. 3) in the Y-axis direction.
  • the Y table 126 shown near the center of the stroke in the Y-axis direction shows a case where the top table 110 is at a position 165 near the center of the stroke in the X-axis direction and positions 164 and 166 near both the left and right stroke ends. .
  • the top table 110 is located at a position 162 near the center of the stroke in the X axis direction and positions 161 and 163 near both the left and right stroke ends. It is shown.
  • the Y table 126 shown at the stroke end on the Y axis direction negative side shows a case where the top table 110 is at a position 168 near the center of the stroke in the X axis direction and positions 167 and 169 near both the left and right stroke ends. Show.
  • the positions 161 to 169 of the nine top tables 110 shown in FIG. 3 indicate the prescribed positions for characteristic measurement in this embodiment.
  • the characteristics at the end points can be obtained in correspondence with the case where the characteristics change from the vicinity of the center toward the stroke end in each of the X-axis and Y-axis directions. it can.
  • a certain range of operation is required.
  • the specified position for the characteristic measurement needs to be selected without reaching the stroke end during the characteristic measurement and close to the stroke end. For example, it is desirable to select a position within 10% from the stroke end.
  • the number of specified positions and how to select the positions can be freely designed according to the size of the movable range and characteristics of characteristic fluctuations, and the measurement position setting device can be set arbitrarily by the operator. It is desirable. In particular, it is expected that setting a point at which a characteristic change is expected to be large or a point where frequent positioning operations are performed in a normal state as a specified position will bring about an effective effect as an embodiment of the present invention. That is, it is effective to determine the coordinates at which many positioning operations are performed in the normal operation based on the history of the target position, and to measure the characteristics using the position as the specified position.
  • FIG. 4 is a flowchart relating to the control parameter adjustment function of the control system in this embodiment.
  • the control device 140 is in the activated state of the time monitoring function that monitors and stores the elapsed time since the previous adjustment of the control parameter (step S100), and the elapsed time has passed a predetermined time. Is determined (step S110).
  • step S110 an operation monitoring function for storing an evaluation amount such as positioning accuracy and the magnitude of vibration amplitude at the time of settling is started (step S111), and the stored evaluation amount is set in advance. It is determined whether adjustment is necessary by comparing the threshold values (step S112). If the determination result in step S112 is NO, the process returns to step S100.
  • step S110 or step S112 the notification confirmation setting is made to notify the operator and determine whether or not adjustment is necessary when adjustment is necessary for the control parameter set in advance for the apparatus.
  • Step S120 if the confirmation result is YES, that is, if the setting is made to make the operator judge, the necessity confirmation screen is displayed on the display device 141, and the operator (Step S130), and the operator's determination result confirms whether or not adjustment is performed (step S140). If the confirmation result in step S140 is NO, the process ends without adjusting the control parameter.
  • step S120 If the determination result in step S120 is NO or the determination result in step S140 is YES, characteristic parameter adjustment (automatic adjustment function) is performed (step S150), and the process is performed when the automatic adjustment function ends. finish.
  • the specified time in step S110, the threshold value of the evaluation amount in step S112, and the notification confirmation setting in step S120 can be set as device-specific setting values, but the control device 140 has an adjustment condition setting function, and the operator It is effective that these can be set freely.
  • FIG. 5 is a flowchart showing details of the automatic adjustment function.
  • characteristic measurement open loop characteristic and sensitivity function measurement
  • FIG. 6 is a flowchart showing details of the filter redesign process.
  • FIG. 7 is a diagram showing a design concept of a notch filter which is a filter in the present embodiment.
  • the control device 140 first determines the maximum gain specification Gs that should be satisfied in the sensitivity function (step S300), and then determines the frequency having the greatest sensitivity in all control characteristics as the center frequency ⁇ c of the filter. Determine (step S310). Subsequently, all the acquired frequency characteristics have sensitivity characteristics larger than the specification Gs, and the frequency farthest from ⁇ c is ⁇ 1, and the gain of the open loop characteristic at ⁇ 1 is G2 (step S320). Next, an ideal filter gain Gn at ⁇ 1 is obtained (step S330). Next, the filter width ⁇ is determined using the filter gain Gn, the frequency ⁇ 1, and the center frequency ⁇ c (step S340). Then, the filter is constructed by substituting the obtained filter parameter into the above-described equation 2 to determine each filter coefficient (step S350), and the process is terminated.
  • the filter gain Gn and the filter width ⁇ are obtained from the following formulas 5 and 6, respectively.
  • FIG. 8 is a diagram showing the frequency characteristics of the output of the controlled object 156 in FIG.
  • FIG. 8 schematically shows the frequency characteristics of the controlled object measured at three different specified positions. As can be seen from FIG. 8, at the resonance point near the frequency of 5 kHz, the resonance frequency varies depending on the difference in the specified position.
  • FIG. 9 shows an open loop in the case where a notch filter set in advance corresponding to a representative position (a position indicated by a solid line in the figure) is applied to the control object 156 having the frequency characteristics shown in FIG. It is a figure which shows a characteristic.
  • FIG. 10 is a sensitivity function corresponding to the open loop characteristics shown in FIG.
  • the maximum gain near the resonance frequency is about 5 dB.
  • FIG. 11 corresponds to the characteristics of the controlled object shown in FIG. 9 and shows the open loop characteristics when the notch filter is automatically adjusted. Compared with the result of FIG. 9, it can be confirmed that the peak gain is reduced in the characteristics at points other than the representative position.
  • FIG. 12 is a sensitivity function corresponding to the open loop characteristics shown in FIG. In FIG. 10, the maximum gain in the vicinity of the resonance frequency is about 5 dB, whereas in FIG. 12 in which the notch filter is automatically adjusted, the gain is greatly reduced to 2 dB or less.
  • Factors affecting the accuracy of the positioning control system include, for example, changes in the position of the center of gravity and changes in rigidity of the configuration including the moving body, balance between thrust and inertial force, machine differences associated with component processing accuracy and assembly accuracy, etc. There is a tendency that the influence becomes remarkable as the movable range of the moving body becomes wider. In addition, deterioration of lubricants and adhesives used for components such as linear guides, wear of sliding / connecting parts, secular changes such as deformation and creep, or floor rigidity, ground vibration, vibration from peripheral devices The installation environment of the positioning device such as propagation also affects the characteristic variation of the controlled object. Therefore, it is important to realize uniform and accurate mechanism characteristics over the entire operating range of the moving body and to suppress fluctuations in the characteristics of the controlled object.
  • control parameter is determined based on the characteristics and response at the position of the control target at the time of adjustment execution, it is not possible to perform appropriate adjustment in consideration of the position dependency of the control target. It has been difficult to maintain robustness against position dependence over the entire movable range.
  • a moving device that moves the moving object, a position detecting device that detects the position of the moving object, a measuring device that measures the control characteristics of the control system of the moving device at a plurality of positions, Based on a plurality of measurement results obtained by the measurement device, an adjustment value calculation unit for calculating an adjustment value for adjusting a control parameter of the control system of the mobile device, and based on a detection result and a control parameter of the position detection device
  • the movement target is controlled to move to a predetermined target position
  • the control parameter adjustment unit that adjusts the control parameter based on the adjustment value calculated by the adjustment value calculation unit is provided.
  • the positioning control system can be made highly robust with respect to the position dependency of the controlled object in the entire movable range and the machine difference for each apparatus.
  • the configuration of the positioning device is not limited to that shown in FIG. That is, it goes without saying that the type, number and arrangement of motors, the configuration of the linear guide, and the like can be freely designed according to the purpose.
  • the positioning control system according to the first embodiment is applied to a component mounting apparatus, and includes a control device 140A that controls the operation of the entire component mounting apparatus as a positioning control system. .
  • FIG. 13 is a diagram schematically showing the overall configuration of the component mounting apparatus according to the present embodiment.
  • a Y beam 1303 movable in the Y-axis direction in the drawing is driven and positioned in the Y-axis direction with respect to the base by two Y linear motors 1301 and 1302.
  • the mounting head 1305 is driven and positioned in the X-axis direction with respect to the Y beam 1303 by the X linear motor 1304. Accordingly, the mounting head 1305 is freely positioned on the XY plane.
  • the mounting head 1305 is provided with a plurality of suction nozzles 1306. Each suction nozzle 1306 sucks and holds a component and is moved in the Z direction to mount the component at an arbitrary position on the printed circuit board 1307.
  • the position of the center of gravity of the movable mass in the X-axis direction including the mounting head 1305 varies depending on the position of the mounting head 1305 as in FIG. 1, and the characteristics of the control target viewed from the Y linear motors 1301 and 1302 are position-dependent. Have sex. Further, since the Y beam 1303 has a so-called gantry structure, its deformation and the influence of the eccentric gravity center cannot be ignored.
  • the present invention provides an effective solution to such positional dependency and characteristic variation accompanying deformation, and provides a suitable positioning control system for the component mounting apparatus as shown in FIG. can do.
  • the positioning control system according to the first embodiment is applied to a semiconductor manufacturing / inspection apparatus, and a control device 140B that controls the operation of the entire semiconductor manufacturing / inspection apparatus as a positioning control system; It has.
  • FIG. 14 is a diagram schematically showing an overall configuration of the semiconductor manufacturing / inspection apparatus according to the present embodiment.
  • a Y linear guide 1402 is arranged on the base 1401 in the Y-axis direction in the drawing, and the Y table 1404 is freely restrained only in the Y-axis direction and is positioned in the Y-axis direction by the Y linear motor 1403.
  • the top table 1407 is freely restrained only in the X axis direction with respect to the Y table 1404 by the X linear guide 1405, and is positioned in the X axis direction by the X linear motor 1406.
  • the wafer 1408 mounted on the top table 1407 is positioned in the XY axis direction with respect to the base 1404.
  • the wafer 1408 is irradiated with an optical beam or electron beam 1409 for semiconductor manufacturing or inspection, and semiconductor manufacturing or inspection is performed.
  • the position of the center of gravity of the movable mass in the X-axis direction including the top table 1407 and the wafer 1408 varies depending on the position of the top table 1407. Therefore, the characteristics of the controlled object viewed from the Y linear motor 1403 are position dependent.
  • manufacturing / inspection devices are required to have particularly precise positioning and vibration suppression. For example, even Y table 1404 flexural vibrations and slight fluctuations in frictional resistance may cause deterioration in control performance. It becomes.
  • the present invention provides an effective solution to such demands for characteristic fluctuations such as position dependence and severe control performance, and is suitable for the semiconductor manufacturing / inspection apparatus as shown in FIG.
  • a positioning control system can be provided.
  • the positioning control system according to the first embodiment is applied to a printed circuit board processing apparatus, and includes a control device 140C that controls the operation of the entire printed circuit board processing apparatus as a positioning control system. ing.
  • FIG. 15 is a diagram schematically showing the overall configuration of the printed circuit board processing apparatus according to the present embodiment.
  • a table 1503 is freely installed on the bed 1501 via two guide guides 1504 in the Y-axis direction in the figure.
  • the table 1503 is positioned in the Y-axis direction by the Y feed screw 1505.
  • a portal column rail 1502 is provided on the bed 1501, and a slide plate 1508 is attached to the side surface of the portal column rail 1506 via an X guide guide 1506.
  • the slide plate 1508 is positioned in the X-axis direction with respect to the portal column rail 1506 by X drive means (not shown). Thereby, the slide plate 1508 and the table 1503 are relatively positioned in the XY axis directions.
  • a plurality of drill units 1507 are disposed on the slide plate 1508, and a printed circuit board disposed on the table 1503 is processed.
  • the reaction force due to substrate processing acts on the portal column rail 1506 via the drill unit 1507 and the slide plate 1508. Since the position where the reaction force acts differs depending on the position of the slide plate 1508, there is a dependency of characteristics depending on the position. In addition, deformation due to reaction force, periodic disturbance of the drill, and the weight of the apparatus are greatly affected by the installation environment, which causes deterioration of control performance.
  • the present invention provides an effective solution to such characteristic fluctuations, and can provide a suitable positioning control system for the printed circuit board processing apparatus as shown in FIG.
  • Base table 110 Top table 111 X-axis direction motor movable element 120 X-axis direction drive mechanism 121 X-axis direction linear guide 122 X-axis direction drive motor stator 123 X-axis direction linear scale 124 Y-axis direction drive motor movable element 125 Scale head 126 Y table 130 Y axis direction drive mechanism 131 Y axis direction linear guide 132 Y axis direction drive motor stator 133 Y axis direction linear scales 140, 140A, 140B, 140C Controller 141 Display unit 142 Input unit 143 Storage unit 144 Measuring unit 145 Adjustment value calculation unit 146 Control parameter adjustment unit

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

La présente invention est dotée des éléments suivants : des dispositifs de déplacement (120, 130) destinés à déplacer une table supérieure (110) ; des dispositifs de détection de position (112, 125) destinés à détecter la position de la table supérieure (110) ; un dispositif de mesure (144) qui mesure les caractéristiques de commande d'un système de commande des dispositifs de déplacement (120, 130) à une pluralité de positions ; une unité de calcul de valeur d'ajustement (145) qui calcule une valeur d'ajustement permettant d'ajuster les paramètres de commande du système de commande des dispositifs de déplacement (120, 130) en fonction de la pluralité de résultats de mesure obtenus à partir du dispositif de mesure (144) ; et une unité d'ajustement de paramètre de commande (146) qui exécute une commande en fonction des paramètres de commande et des résultats de détection en provenance des dispositifs de détection de position (112, 125) de sorte que la table supérieure (110) se déplace vers une position cible prédéterminée, et qui ajuste les paramètres de commande en fonction de la valeur d'ajustement calculée par l'unité de calcul de valeur d'ajustement (145). En raison de ce qui précède, la présente invention pourvoit à un système de commande de positionnement qui est extrêmement fiable par rapport à la dépendance de position d'objets de commande dans toute la portée mobile, et aux différences mécaniques pour chaque dispositif.
PCT/JP2013/051288 2013-01-23 2013-01-23 Système de commande de positionnement Ceased WO2014115263A1 (fr)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104597818A (zh) * 2015-01-26 2015-05-06 北京诺安舟应急缓降机械装置有限公司 一种高层救援逃生设备的智能控制方法及系统
JP2017194881A (ja) * 2016-04-22 2017-10-26 三菱電機株式会社 機械装置、および機械装置の振動制御方法
CN111868658A (zh) * 2018-04-26 2020-10-30 欧姆龙株式会社 控制系统、控制方法以及控制程序
JP2023155768A (ja) * 2022-04-11 2023-10-23 オークマ株式会社 負荷装置の位置による特性変動を考慮したパラメータ調整装置および方法

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