WO2014109493A1 - Jig for fixing socket board for testing memory package - Google Patents

Abstract

The present invention relates to a jig for fixing a socket board for testing a memory package, and is to provide a handler pusher for selectively and simultaneously raising a plurality of pressure elements fixedly protruding from the lower surface of a raised/lowered panel by turning a raising/lowering lever, whereby a plurality of memory packages inserted in a plurality of package reception hollows arranged in the upper fixing jig may be simultaneously pressed so as to considerably increase the efficiency of testing the memory packages. To this end, a jig for fixing a socket board for testing memory packages according to the present invention comprises: an upper and a lower fixing jig; and a socket board having sockets and fixed between the upper and the lower fixing jig, wherein a plurality of package reception hollows are arranged in the upper fixing jig corresponding to a memory package test base plate with a lower surface contacting the upper surface of the sockets so as to receive the memory packages selectively pressed for testing by a pressure member fixedly arranged in the package reception hollows, and a handler pusher is arranged with one side hinged to the upper side of the upper fixing jig and the other side provided with a resilient means to enable the lower surface to resiliently contact the upper surface of the upper fixing jig, and a fixing hook is arranged in the other side of the pusher handler so as to be held by a hook fixing slot formed in one side of the upper fixing jig, so that the pressure elements protruding downwardly may be selectively lowered so as to press the memory packages inserted in the package reception hollows of the upper base plate pressure member.

Description

Socket board fixing jig for memory package test

The present invention relates to a socket board fixing jig for testing a memory package, and more particularly, a handler pusher for selectively simultaneously lifting and lowering a plurality of pressure pieces which are projected downward downward on the lower surface of the elevating panel according to the rotation of the elevating lever is provided. By pressing a plurality of memory packages at once in a package seating groove arranged in a plurality on the fixing jig can be pressurized mounting of a plurality of memory packages at the same time, thereby significantly improving the work efficiency for the test whether the memory package is defective The present invention relates to a socket board fixing jig for testing a memory package so as to be increased.

In general, BGA is an abbreviation of Ball Grid Array. It is a type of SMD (Surface Mount Devices), which uses a ball instead of a pin (PGA) or lead (QFP) surface when packaging. Packaging technology.

Such BGA is classified into Flexible BGA (Main PI material), C-BGA (Ceramic), and P-BGA (Plastic, BT) according to materials.

As described above, the BGA packaging technology can reduce the size of a chip to about 50% of the size of a conventional chip, thereby reducing the mounting area of components when mounted on a board (such as a main board or a graphics card). . In addition, this BGA packaging technology has the advantage that the terminal is not exposed to the outside of the chip is also strong against noise.

On the other hand, the performance of personal computers is rapidly improving due to the development of central processing unit (CPU), and the competition for developing faster and better computers is continuing. As a result, supercomputers, parallel processing computers, and RISC (Reduced Instruction) Set Computer) is being developed. Of course, efforts are still being made to improve the performance of computers.

As mentioned above, the race to develop faster and better computers focuses on the development of CPUs that can process more data at higher speeds, and higher density, higher capacity, and faster memory chips, accelerating development competition. have. In particular, the memory chip developed through such technology development is being developed as a BGA type memory chip in order to reduce the mounting area of components and to secure reliability by reducing noise.

On the other hand, the conventional technique for testing the defective rate of the high-density, high-capacity, high-speed BGA type memory chip (hereinafter referred to collectively referred to as "memory package" all memory chips, including BGA type memory chip)) As a method of testing the defect rate of the memory package, the socket board is fixed to the socket board through the socket board fixing jig, and then the electrical contact is confirmed through the electrical contact between the socket mounted on the socket board and the memory package. A method of testing a defective rate of a memory package to be tested is provided.

When the defect rate test of the memory package as described above is pressed into the socket board fixing jig and pressed through the package insertion groove to press the memory package located in the upper portion of the socket to the upper side of the socket in the process of confirming the electrical connection The method of pressurizing the memory package is to install a manual handler pusher on the upper side of the package insertion groove of the upper fixing jig constituting the socket board fixing jig and pressurize the memory package and the automatic type according to the horizontal direction of the left and right and vertical movement of the upper and lower sides. The handler pusher pushes the memory package into the socket.

Among the above-described methods, the socket board fixing jig for testing a memory package, in particular, for a memory package test using a passive handler pusher is configured to include an upper fixing jig and a lower fixing jig, and a package formed on the upper fixing jig. It is a device for testing the failure rate of the memory package by pressing the memory package through the mounting groove.

The conventional socket board fixing jig for testing a memory package is particularly configured to further include a handler pusher rotatably installed in the upper fixing jig to be selectively inserted into the package seating groove to selectively pressurize the memory package. .

Here, the handler pusher is provided with a pressing piece for protruding downward on one side to seat and press the memory package selectively inserted into the package seating groove.

In other words, one end of the handler pusher is rotatably connected to the upper fixing jig by a hinge connection structure, and the pressing piece is protruded and installed on the side bottom face opposite to the hinge.

Therefore, according to the conventional socket board fixing jig for testing a memory package, the memory package is seated in the package seating groove in accordance with the rotation of the handler pusher, the one end of which is pivotally connected to the hinge fixing structure on the upper fixing jig. The failure rate of the memory package can be tested by allowing the memory package to be seated and pressed by the pressing piece of the handler pusher.

The above-described conventional socket board fixing jig for testing a memory package has a single pressing piece on a side bottom surface facing the hinge of the handler pusher, and in particular, the handler pusher corresponds to the memory seating groove formed on the upper fixing jig. It is installed on the upper fixing jig in a hinge structure so that each can be rotated.

That is, the conventional socket board fixing jig for testing a memory package is provided with a handler pusher having a single pressing piece corresponding to the memory seating groove. In order to test a plurality of memory packages, each handler pusher must be manually operated. Rotation and fixation work is required.

Therefore, there is a problem in that a plurality of memory packages to be tested for defects may not be fixed and tested simultaneously on a plurality of package seating grooves.

In addition, since a plurality of memory packages cannot be fixed and tested at the same time, only a small number of memory packages should be repeatedly tested, and thus there is a problem in that work efficiency for a bad test of a memory package is degraded.

Therefore, by pressing the memory package on the package seating groove arranged in a plurality on the upper fixing jig at a time can be pressurized mounting of a plurality of memory packages at the same time, thereby improving the work efficiency of the test whether the memory package defective There is a need for research and development on a socket board fixing jig for testing a memory package that can be significantly increased.

In order to solve the above problems, the present invention is arranged on the upper fixing jig by a handler pusher for selectively elevating a plurality of pressure pieces which are projected downward downwardly on the lower surface of the elevating panel in accordance with the rotation of the elevating lever. An object of the present invention is to provide a socket board fixing jig for testing a memory package that allows a plurality of memory packages to be seated and pressed at a time on a package seating groove of a substrate pressing member.

In addition, the technology according to the present invention is provided with a handler pusher for selectively elevating a plurality of pressing pieces downwardly projecting fixed on the lower surface of the elevating panel at the same time in accordance with the rotation of the elevating lever is arranged on a plurality of substrate pressing member on the upper fixing jig It is possible to significantly increase the work efficiency for the test of the failure of the memory package by pressing the mounting of the plurality of memory packages at the same time by pressing a plurality of memory packages at once in the package seating groove of the.

The present invention for achieving the above object is as follows. That is, the socket board fixing jig for testing a memory package according to the present invention includes an upper fixing jig and a lower fixing jig to fix a socket board on which a socket is mounted between the upper fixing jig and the lower fixing jig, The defective rate of the memory package is tested by selectively seating and pressing the memory package on the package seating groove of the substrate pressing member fixedly installed in a plurality of package inserting grooves formed on the upper fixing jig corresponding to the contacted memory package test substrate. In the socket board fixing jig for testing a memory package, one side is connected to the hinge structure so as to be rotatable on the upper side of the upper fixing jig so that the bottom surface is in contact with the upper surface of the upper fixing jig by rotation is provided on the other side Rotation is always performed by the elastic force After the other side is fixed to the hook fixing groove formed on one side of the upper fixing jig through the fixing hook, a plurality of pressing pieces provided downward downward is selectively lowered on the package seating groove of the substrate pressing member selectively And a handler pusher for seating and pressing the memory package.

Here, the handler pusher is fixed to the plurality of pressing pieces protruding downwards and fixed upward downwards a plurality of upwardly projecting along the periphery of the upper surface, but the upper surface is inclined upward from one side and the horizontal surface extending a predetermined length from one end of the inclined surface An elevating panel having an elevating guide and a roller, which is in close contact with the upper surface of the elevating guide of the elevating panel, is rotatably installed to protrude downwardly, and a link bar protrudes on one side of the flat plate on the bottom surface of the end of the link bar. Link protrusions are formed to protrude downward and reciprocate in the horizontal direction by the link structure, the roller is guided on the lifting guide upper surface of the lifting panel to selectively lift the lifting panel and the link protrusion of the reciprocating panel on one side Grooves are formed A shaft hole for rotation is formed at one side of the link groove, and the other side is rotated and returned by a predetermined angle with respect to the shaft hole to move the reciprocating panel back and forth in a horizontal direction so that the elevating panel is selectively elevated. It is connected to the hinge structure so as to be rotatable on the upper side of the upper fixing jig, the elevating panel is installed from the lower side so as to be elevated, and the inner and the reciprocating panel is interposed between the elevating panel, the shaft hole of the elevating lever on the other side Preferably, the rotating shaft inserted into the pusher housing includes a pusher housing protruding downward.

In this case, the elevating guide of the elevating panel is seated and fixed on the horizontal plane in the process of moving from the inclined surface of the elevating guide to the horizontal plane by the rotation of the elevating lever in the state in which the roller of the reciprocating panel is in close contact, the It is preferable that the recessed groove in which the roller is seated on a horizontal surface is formed to be recessed downward to correspond to the roller.

In addition, the upper part of the socket may be prevented from being overheated by heat generated during electrical connection between the socket mounted on the socket board and the substrate pressing member and the memory package fixed between the upper fixing jig and the lower fixing jig. It is preferable that a cooling fan is further installed on the other side of the fixing jig.

Further, the other side of the upper fixing jig so as to measure the electrical connection state of the memory package which is in close contact with the socket mounted on the socket board fixed between the upper fixing jig and the lower fixing jig. It is preferable that a digital voltmeter is further installed at the top.

In addition, when the handler pusher is rotated so that the bottom surface is in close contact with the upper surface of the upper fixing jig, the buffer pusher is elastically contacted with each other to be fixed to maintain the state in which the handler pusher is in close contact with the fixing hook. It is preferable that the buffer member is further provided with an elastic to protrude downward.

In addition, the hook of the upper fixing jig so that the handler pusher is rotated so that the bottom surface is in close contact with the upper surface of the upper fixing jig so that the handler pusher can be firmly contacted with each other through the fixing hook. One side of the fixing groove is preferably provided with a second cushioning member which has an elasticity from the upper surface and protrudes upward at a predetermined height.

The effect of the socket board fixing jig for testing a memory package according to the present invention is as follows.

First, on the package seating groove of the substrate pressing member, which is arranged on the upper fixing jig by a plurality of handler pushers for selectively simultaneously elevating a plurality of pressing pieces downwardly projected on the lower surface of the elevating panel according to the rotation of the elevating lever. The mounting pressing of the plurality of memory packages may be simultaneously performed by allowing the pressing of the plurality of memory packages at once.

Second, on the package seating groove of the substrate pressing member arranged in a plurality on the upper fixing jig is provided with a handler pusher for selectively elevating a plurality of pressing pieces protruding downward downward fixed on the lower surface of the elevating panel according to the rotation of the elevating lever. By allowing a plurality of memory packages to be seated and pressed at a time, the seating pressurization of the plurality of memory packages may be simultaneously performed, thereby significantly increasing the work efficiency for testing whether the memory package is defective.

1 is an exploded perspective view showing a socket board fixing jig for testing a memory package according to the present invention.

Figure 2 is a combined perspective view showing a socket board fixing jig for testing a memory package according to the present invention.

3 is a cross-sectional view taken along the line A-A of Figure 2, showing a coupling cross-sectional view showing a socket board fixing jig for testing a memory package according to the present invention.

Figure 4 is an exploded perspective view showing a handler pusher which is a main part of a socket board fixing jig for testing a memory package according to the present invention.

Figure 5 is a bottom perspective perspective view showing the configuration seen from the bottom of FIG.

Figure 6 is a side view showing the operating state of the operation state showing the operating state of the elevating panel is guided and lifted by the guide panel in the handler pusher which is the main portion of the socket board fixing jig for testing the memory package according to the present invention.

Figure 7 is a plan view showing the operating state of the main portion of the operation state in which the lifting panel is guided and lifted by the guide panel in the handler pusher which is the main part of the socket board fixing jig for testing the memory package according to the present invention.

[Description of the code]

1: Socket board fixing jig for memory package test

100: upper fixing jig 110: package insertion groove

120: substrate pressing member 121: package seating groove

130: hook fixing groove 140: second buffer member

150: cooling fan 160: digital voltmeter

200: lower fixing jig 300: handler pusher

310: fixed hook 311: elastic member

320: elevating panel 321: elevating guide

322: sloped surface 323: horizontal surface

324: seating groove 325: guide shaft

326: elastic member 329: guide portion

330: pressure piece 340: reciprocating panel

341: link bar 342: link projection

345: roller 346: roller shaft

347: fixed bolt 360: lifting lever

362: link groove 363: shaft

368: first engagement surface 369: second engagement surface

380: pusher housing 381: fixing piece

382: coupling piece 383: rotation axis

385: buffer member 387: restraint groove

388: first constraint surface 389: second constraint surface

400: socket board 410: socket

500: memory package 600: memory package test substrate

Hereinafter, exemplary embodiments of a socket board fixing jig for testing a memory package according to the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view showing a socket board fixing jig for testing a memory package according to the present invention, and FIG. 2 is a combined perspective view showing a socket board fixing jig for testing a memory package according to the present invention, and FIG. A cross-sectional view taken along line AA of FIG. 2, showing a combined cross-sectional view showing a socket board fixing jig for testing a memory package according to the present invention.

4 is an exploded perspective view showing a handler pusher which is a main portion of a socket board fixing jig for testing a memory package according to the present invention, and FIG. 5 is a bottom detached perspective view showing a configuration viewed from the bottom of FIG. 4.

Figure 6 is a side view showing the main state of the operation state showing the operating state of the elevating panel is guided by the guide panel in the pusher of the handle of the socket board fixing jig for testing the memory package according to the present invention, Figure 7 is according to the present invention This is a plan view of the main part of the operation state showing the operating state where the elevating panel is guided by the guide panel in the handler pusher, which is a recess of the socket board fixing jig for testing the memory package.

1 to 7, the socket board fixing jig 1 for testing a memory package according to an exemplary embodiment of the present invention includes an upper fixing jig 100 and a lower fixing jig 200, and the upper fixing jig ( The socket board 400 having the socket 410 mounted therebetween is fixed between the 100 and the lower fixing jig 200, but the upper portion corresponds to the memory package test substrate 600 having a lower surface contacting the upper surface of the socket 410. The memory package 500 may be selectively seated and pressed on the package seating groove 121 of the substrate pressing member 120 fixedly installed in a plurality of package inserting grooves 110 formed on the fixing jig 100. 500) is a device for testing the defective rate.

The socket board fixing jig 1 for testing the memory package is particularly connected to a hinge structure so that one side is rotatable on the upper side of the upper fixing jig 100 so that the bottom surface thereof is rotated with the upper surface of the upper fixing jig 100. The hook fixing groove 130 formed on one side of the upper fixing jig 100 on the other side through the fixing hook 310 which can be rotated and returned by the elastic force provided on the other side so that the state in which the adhesive state is maintained is maintained. After the locking is fixed to the plurality of pressing pieces 330 which are provided with a downward protrusion selectively descends to selectively press the memory package 500 on the package seating groove 121 of the substrate pressing member 120. It further comprises a handler pusher (300).

In this case, the handler pusher 300 is classified into a lifting panel 320, a reciprocating panel 340, a lifting lever 360, and a pusher housing 380.

At this time, the elevating panel 320 is fixed to the plurality of pressing pieces 330 downwardly projecting downward upwardly fixed to the upper surface along the circumference so as to selectively descend, the inclined surface 322 and the upper surface is inclined upward from one side and the It is preferable that the inclined surface 322 is made of a configuration having a lifting guide 321 consisting of a horizontal surface 323 extending flat from a certain length.

The pressing piece 330 protruding downwardly to the elevating panel 320 as described above is fixed to the bottom surface of the elevating panel 320 to protrude downward, and to be elastically cushioned.

That is, when the pressing piece 330 is in close contact with the bottom surface to pressurize the memory package 500, the pressing piece 330 has a buffering force at the time of close pressing to stably prevent the damage of the memory package 500. 500) to pressurize.

The pressing piece 300 is elastically guided in the vertical direction by the guide shaft 325 protruding downward on the bottom of the elevating panel 320, the installation groove (not shown) recessed downward from the upper surface in the corner portion An elastic member 326 is internally installed on and fixed to the bottom surface of the elevating panel 320.

At this time, the pressing piece 300 is formed along the circumference of the upper end of the engaging groove (unsigned) so that the engaging groove (unsigned) is fixed by the head of the coupling bolt (unsigned) of the elevating panel 320 It is preferred to be bonded to the bottom.

In other words, the pressing piece 300 is fixed to be guided in the vertical direction with elasticity by the guide shaft 325 protruding downward on the bottom surface of the elevating panel 320 by the elastic member 326.

And the reciprocating panel 340 is rotatably installed so that the roller 345 in close contact with the upper surface of the elevating guide 321 of the elevating panel 320 protrudes downward, the link bar 341 on one side on the plate ) Is protruded so that the link protrusion 342 protrudes downward on the bottom surface of the end of the link bar 341.

Therefore, the reciprocating panel 340 is reciprocated in the horizontal direction by a link structure so that the roller 345 is guided to the upper surface of the elevating guide 321 of the elevating panel 320 to selectively select the elevating panel 320. It can be lifted.

In the reciprocating panel 340 as described above, the roller 345 is provided in plurality in correspondence with the lifting guide 321, and the roller 345 is fixed to the roller shaft 346 on the reciprocating panel 340. It is preferably installed by the bolt 347 but protrudes downward from the bottom of the reciprocating panel 340 so as to be rotatably installed.

On the other hand, the lifting lever 360 is formed with a link groove 362 is inserted into the link projection 342 of the reciprocating panel 340 on one side, the shaft hole 363 for rotation on one side of the link groove 362 The other side is rotated and returned by a predetermined angle based on the shaft hole 363 so as to reciprocate the reciprocating panel 340 in a horizontal direction to selectively lift the elevating panel 320.

And the pusher housing 380 is connected to the hinge structure so that one side is rotatable on the upper side of the upper fixing jig 100, and the inner lifting panel 320 from the lower side is built up to be able to lift and lower the lifting panel 320 and It is preferable that the reciprocating panel 340 is interposed therebetween.

Here, the pusher housing 380 of the handler pusher 300 is always rotated and returned by the elastic force to the other side the fixed hook (135) is selectively caught on the hook fixing groove 130 of the upper fixing jig (100) 310 is provided.

At this time, the fixing hook 310 is fixedly installed in the hinge structure on the other side of the pusher housing 380 to be always rotated, return by the elastic force, the upper one side of the pusher housing 380 in the central side of the other side The elastic member 311 is fixed to maintain the vertical state at all times.

Accordingly, when the upper surface of the fixing hook 310 is pressed and then released, the fixing hook 310 may be returned to its original state, that is, by an elastic force in a vertical state. The hook can be selectively made on the hook fixing groove 130 of the upper fixing jig (100).

On the other hand, the pusher housing 380 is preferably a rotating shaft 383 is inserted into the shaft hole 363 of the lifting lever 360 on the other bottom surface protruding downward, and thus the lifting lever (3) on the rotating shaft 383 The shaft hole 363 of the 360 is inserted and fixed so that one end of the elevating lever 360 is rotatably connected, and thus the other end of the elevating lever 360 may be rotated based on one end thereof.

In this case, the lifting lever 360 is rotated to the other side of the pusher housing 380 by the coupling piece 382 is tightly coupled to the lower end of the rotary shaft 383 after the shaft hole 363 is inserted into the rotary shaft 383. It is installed to be possible.

In addition, the pusher housing 380 is a guide portion 329 formed to be recessed upwardly by chamfering the corner portion of the elevating panel 320 after the reciprocating panel 340, the elevating panel 320 is sequentially inserted from the lower side. The fixing piece 381 is in close contact with each other, so that the reciprocating panel 340 and the elevating panel 320 are installed by the fixing piece 381.

In addition, the lifting lever 360 installed to be rotatable on the other side of the pusher housing 380 is rotated and returned with respect to a predetermined angle with the rotation shaft 383 as an axis.

In detail, a constraining groove 387 is formed at one of the other corners of the other side of the pusher housing 380 to be recessed upwardly from the bottom to form a first constraining surface 388 which is one sidewall of the constraining groove 387. The first locking surface 368 protruding from one side of the elevating lever 360 is selectively blocked by rotation, and the elevating surface is lifted on the second restraining surface 389 which is the other side wall of the restraining groove 387. The second locking surface 369 recessed in the 'V' shape on the other side of the lever 360 is selectively tightly blocked by rotation.

Accordingly, the lifting lever 360 may be prevented from being rotated any further by rotating and returning only one predetermined angle to the one side and the other side with the rotation shaft 383 as the axis.

Further, the elevating guide 321 of the elevating panel 320 is the inclined surface of the elevating guide 321 by the rotation of the elevating lever 360 in a state in which the roller 345 of the reciprocating panel 340 is in close contact ( In order to be seated and fixed on the horizontal surface 323 in the process of moving from the 322 to the horizontal surface 323, the seating groove 324 on which the roller 345 is seated on the horizontal surface 323 is the roller ( Corresponding to the 345 may be formed to be recessed downwardly round.

Meanwhile, the socket board fixing jig 1 for testing a memory package according to the present invention as described above is mounted on the socket board 400 fixed between the upper fixing jig 100 and the lower fixing jig 200. Cooling fan 150 on the other side of the upper fixing jig 100 to prevent overheating of the device due to heat generated during electrical connection between the socket 410, the substrate pressing member 120, and the memory package 500. ) Can be installed further.

In addition, the memory package is in close contact with the socket 410 and the substrate pressing member 120 mounted on the socket board 400 fixed between the upper fixing jig 100 and the lower fixing jig 200. In order to measure the electrical connection state of the 500, it is preferable that a digital voltage meter 160 is further installed on the other side of the upper fixing jig 100.

As described above, since the cooling fan 150 and the digital voltmeter 160 are installed, it is possible to quickly check whether the memory package 500 is a test object is defective, and at the same time, overheating of the device may be performed through the cooling fan 150. It is possible to stably prevent the test of the memory package 500 to be executed continuously.

Furthermore, the socket board fixing jig 1 for testing a memory package according to the present invention as described above is mutually resilient when the handler pusher 300 is rotated so that the bottom surface is in close contact with the upper surface of the upper fixing jig 100. Preferably, a cushioning member 385 is provided on the other bottom surface of the handler pusher 300 to protrude downward and elastically so as to be buffered to be in contact with the fixing hook 310 to be maintained in close contact. Do.

In addition, a second buffer member 140 may be further provided on one side of the hook fixing groove 130 of the upper fixing jig 100 to protrude upward at a predetermined height with elasticity from an upper surface thereof. As the 140 is further provided with the shock absorbing member 385, a more stable shock absorbing effect can be achieved.

Referring to the state of use for the test of the memory package 500 through the socket board fixing jig 1 for the memory package test according to the present invention as described above are as follows.

First, the socket board 400 having the socket 410 mounted on the upper surface is fixed between the upper fixing jig 100 and the lower fixing jig 200, and at this time, the upper surface of the socket 410 has a substrate for testing a memory package ( The substrate 600 for testing the memory package is disposed to contact the bottom surface of the memory package 600.

Then, the upper side of the upper fixing jig 100, the handler pusher 300, one side of which is connected by a hinge structure, does not cover the upper portion of the upper fixing jig 100, that is, the upper fixing jig in a vertical state. A plurality of memory packages 500 are seated on the package seating recess 121 of the substrate pressing member 120 arranged in a plurality of package inserting recesses 110 of 100.

Thereafter, the other side of the handler pusher 300 is rotated based on one side connected to the hinge structure of the handler pusher 300 so that the bottom surface of the handler pusher 300 is in close contact with the upper surface of the upper fixing jig 100.

Then, the fixing hook 310 provided on the other side of the handler pusher 300 is hooked to the hook fixing groove 130 of the upper fixing jig 100, the bottom surface of the handler pusher 300 is the upper fixing jig ( Maintain close contact with the upper surface of 100).

Subsequently, the lifting lever 360 rotatably installed on the other side of the handler pusher 300 is rotated in one direction, and the first locking surface 368 of the lifting lever 360 is configured to rotate the handler pusher 300. The lifting lever 360 is rotated in one direction until it stops by being stopped by the first restraining surface 388 of the restraining groove 387 recessed upwardly at the other edge portion.

As described above, when the lifting lever 360 is rotated in one direction until it stops by being stopped by the first restraining surface 388 of the restraint groove 387, the reciprocating panel 340 is moved by the lifting lever 360. The lifting panel 320 is lowered by the roller 345 and the lifting guide 321 while moving in one direction.

That is, when the lifting panel 320 is lowered, the pressing piece 330 which is installed downwardly protruding from the lifting panel 320 is lowered by a certain height, and the package seating groove is lowered by the lowering of the pressing piece 330. The plurality of memory packages 500 seated on the 121 may be pressed downward.

In other words, the plurality of memory packages 500 seated on the package seating groove 121 as described above may be simultaneously pressed downward, and when the pressing process is completed, the upper fixing jig 100 may be lifted. The defective rate test of the plurality of memory packages 500 is performed through the digital voltmeter 160 installed in the plurality of memory packages 500.

Through the above-described process, a failure rate test for a plurality of memory packages 500 using the socket board fixing jig 1 for a memory package test according to the present invention can be performed at the same time.

In addition, it will be understood that the defect rate can be simultaneously tested for a plurality of memory packages by repeatedly removing the memory package 500 that has been tested by performing the above-described process and repeatedly performing the above-described process.

The socket board fixing jig 1 for testing a memory package according to the present invention as described above rotates the lifting lever 360 to the pressing pieces 330 which are fixed downwardly and protruded to the lower surface of the lifting panel 320. The plurality of memory packages 500 on the package seating groove 121 of the substrate pressing member 120 are arranged on the upper fixing jig 100 by being provided with the handler pusher 300 to selectively lift at the same time. ) To be seated and pressed at a time, the seating pressurization of the plurality of memory packages 500 may be simultaneously performed.

Further, an upper fixing jig is provided with a handler pusher 300 for selectively simultaneously elevating the pressing piece 330 which is fixed downwardly to the lower surface of the elevating panel 320 in accordance with the rotation of the elevating lever 360. The mounting pressurization of the plurality of memory packages 500 is simultaneously performed by allowing the plurality of memory packages 500 to be seated and pressed at a time on the package seating grooves 121 of the substrate pressing member 120 arranged in plural on the substrate 100. As a result, the work efficiency for the failure test of the memory package 500 may be significantly increased.

In other words, the plurality of memory packages 500 are seated and pressed at a time on the package seating groove 121 so that pressing and pressing of the plurality of memory packages 500 are simultaneously performed to test the plurality of memory packages 500. The time taken to perform may be reduced, and the reliability of the performance of the memory package 500 may be improved.

Although specific embodiments of the present invention have been described in detail above, the present invention is not limited thereto, and the present invention can be variously modified by those skilled in the art to which the present invention pertains. Is included in the scope of the present invention.

Claims (7)

The upper fixing jig 100 and the lower fixing jig 200 is fixed between the upper fixing jig 100 and the lower fixing jig 200 to fix the socket board 400 on which the socket board 400 is mounted. 410 The package seating of the substrate pressing member 120 fixedly installed in a plurality of package inserting groove 110 formed on the upper fixing jig 100 corresponding to the memory package test substrate 600 which the lower surface is in contact with the upper surface In the socket board fixing jig 1 for a memory package test for selectively testing the defective rate of the memory package 500 by selectively seating and pressing the memory package 500 on the groove 121, One side is connected to the hinge structure so as to be rotatable on the upper side of the upper fixing jig 100 is constantly rotated by the elastic force provided on the other side so that the bottom surface is in close contact with the upper surface of the upper fixing jig 100 by rotation. After the other side is fixed on the hook fixing groove 130 formed on one side of the upper fixing jig 100 through the fixing hook 310 which can be made by returning, a plurality of pressing pieces are provided to protrude downward ( 330 is selectively lowered and further comprises a handler pusher 300 for selectively mounting and pressing the memory package 500 on the package seating groove 121 of the substrate pressing member 120 Socket board fixing jig for package test. The method of claim 1, The handler pusher 300 is fixed to the plurality of pressing pieces 330 is projected downward to be selectively lowered upwardly fixed to a plurality of upwardly along the circumference of the upper surface, the inclined surface 322 and the inclined surface formed to be inclined upward from one side ( 322) the elevating panel 320 having a lifting guide 321 made of a horizontal surface 323 extending flat from one end, and The roller 345 which is in close contact with the upper surface of the elevating guide 321 of the elevating panel 320 is rotatably installed to protrude downward, and the link bar 341 protrudes on one side of the elevating panel 320 so that the link bar ( A link protrusion 342 is formed to protrude downward in the bottom surface of the end portion 341 to reciprocate in a horizontal direction by a link structure so that the roller 345 is guided to the upper and lower surfaces of the elevating guide 321 of the elevating panel 320. A reciprocating panel 340 for selectively elevating the panel 320; A link groove 362 is formed at one side into which the link protrusion 342 of the reciprocating panel 340 is inserted, and a shaft hole 363 is formed at one side of the link groove 362 to form the shaft hole 363. A lifting lever 360 for allowing the other side to rotate and return at a predetermined angle to reciprocate the reciprocating panel 340 in a horizontal direction to selectively lift the lifting panel 320. One side is connected to the hinge structure so as to be rotatable on the upper side of the upper fixing jig 100, and the elevating panel 320 is installed from the lower side so as to be elevated, but the reciprocating panel 340 between the elevating panel 320. ) Is interposed therebetween, the socket for the memory package test, characterized in that it comprises a pusher housing (380) is formed on the other side the rotating shaft (383) inserted into the shaft hole (363) of the lifting lever (360) protruding downwardly Board fixing jig. The method of claim 2, The elevating guide 321 of the elevating panel 320 is the inclined surface 322 of the elevating guide 321 by the rotation of the elevating lever 360 in a state in which the roller 345 of the reciprocating panel 340 is in close contact. The roller 345 includes a seating groove 324 in which the roller 345 is seated on the horizontal surface 323 so that the roller 345 is seated on the horizontal surface 323 in the process of moving from the horizontal surface 323 to the horizontal surface 323. Socket board fixing jig for testing the memory package, characterized in that formed in a downward recessed corresponding to the round. The method according to claim 1 or 2, Electrical connection between the socket 410 and the substrate pressing member 120 and the memory package 500 mounted on the socket board 400 fixed between the upper fixing jig 100 and the lower fixing jig 200. The socket board fixing jig for testing a memory package, characterized in that the cooling fan 150 is further installed on the other side of the upper fixing jig 100 to prevent overheating of the device due to heat generated at the time. The method according to claim 1 or 2, The memory package 500 in which the socket 410 mounted on the socket board 400 fixed between the upper fixing jig 100 and the lower fixing jig 200 and the substrate pressing member 120 are in close contact with each other. The socket board fixing jig for testing a memory package, characterized in that the digital voltmeter 160 is further installed on the other side of the upper fixing jig 100 to measure the electrical connection state of the upper side. The method of claim 1, When the handler pusher 300 is rotated so that the bottom surface is in close contact with the upper surface of the upper fixing jig 100, the buffer pusher 300 is contacted with each other by elasticity so that the handler pusher 300 may be fixed to be maintained in close contact with the fixing hook 310. The socket board fixing jig for testing a memory package, characterized in that the buffer member 385 is further provided with a resilient downward projecting on the bottom of the other side of the handler pusher (300). The method according to claim 1 or 6, When the handler pusher 300 is rotated so that the bottom surface is in close contact with the upper surface of the upper fixing jig 100, the buffer pusher 300 is contacted with each other by elasticity so that the handler pusher 300 may be fixed to be maintained in close contact with the fixing hook 310. A socket board fixing jig for testing a memory package according to claim 1, further comprising a second buffer member (140) protruding upward at a predetermined height from an upper surface of the hook fixing groove (130) of the upper fixing jig (100).

Images