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WO2014181984A3 - 발열체 냉각장치 - Google Patents

발열체 냉각장치 Download PDF

Info

Publication number
WO2014181984A3
WO2014181984A3 PCT/KR2014/003633 KR2014003633W WO2014181984A3 WO 2014181984 A3 WO2014181984 A3 WO 2014181984A3 KR 2014003633 W KR2014003633 W KR 2014003633W WO 2014181984 A3 WO2014181984 A3 WO 2014181984A3
Authority
WO
WIPO (PCT)
Prior art keywords
impeller
heating element
cooling apparatus
cooling water
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2014/003633
Other languages
English (en)
French (fr)
Other versions
WO2014181984A2 (ko
Inventor
박동식
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140013737A external-priority patent/KR101467375B1/ko
Application filed by Individual filed Critical Individual
Priority to CN201490000655.2U priority Critical patent/CN205281385U/zh
Publication of WO2014181984A2 publication Critical patent/WO2014181984A2/ko
Publication of WO2014181984A3 publication Critical patent/WO2014181984A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

발열체 냉각장치가 개시된다. 본 발명의 일 실시예에 따른 발열체 냉각장치는, 발열체에 접촉되며, 내부에서 냉각수가 유동하는 하우징; 및 하우징에 수용되어 회전되는 임펠러를 포함하며, 하우징은, 임펠러가 결합되는 본체부; 임펠러를 사이에 두고 본체부에 결합되며, 발열체에 접촉되는 열전도성부재인 제1 커버부; 및 임펠러의 중심부에 결합되어 임펠러와 함께 회전되며, 냉각수를 임펠러의 중심부에서 제1 커버부 방향으로 공급하는 냉각수 공급부를 포함한다.
PCT/KR2014/003633 2013-05-10 2014-04-25 발열체 냉각장치 Ceased WO2014181984A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201490000655.2U CN205281385U (zh) 2013-05-10 2014-04-25 发热元件冷却设备

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20130003699 2013-05-10
KR20-2013-0003699 2013-05-10
KR20-2013-0004488 2013-06-04
KR20130004488 2013-06-04
KR10-2014-0013737 2014-02-06
KR1020140013737A KR101467375B1 (ko) 2013-05-10 2014-02-06 발열체 냉각장치

Publications (2)

Publication Number Publication Date
WO2014181984A2 WO2014181984A2 (ko) 2014-11-13
WO2014181984A3 true WO2014181984A3 (ko) 2015-04-09

Family

ID=51867830

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2014/003633 Ceased WO2014181984A2 (ko) 2013-05-10 2014-04-25 발열체 냉각장치

Country Status (1)

Country Link
WO (1) WO2014181984A2 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016222376B3 (de) * 2016-11-15 2018-02-15 Zf Friedrichshafen Ag Elektronikmodul und Verfahren zum Herstellen desselben
US10928142B2 (en) * 2018-05-04 2021-02-23 Auras Technology Co., Ltd. Water-cooling head

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040047719A (ko) * 2002-11-28 2004-06-05 가부시끼가이샤 도시바 냉각용 펌프, 전기 기기 및 퍼스널 컴퓨터
KR100450326B1 (ko) * 2002-01-22 2004-09-30 성이제 방열면적을 크게한 씨피유냉각용 히트싱크구조
KR100456342B1 (ko) * 2002-02-08 2004-11-12 쿨랜스코리아 주식회사 반도체 칩의 수냉식 냉각 블록
JP2006324647A (ja) * 2005-04-21 2006-11-30 Nippon Light Metal Co Ltd 液冷ジャケット
KR20110032266A (ko) * 2009-09-22 2011-03-30 재영솔루텍 주식회사 사출 금형

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100450326B1 (ko) * 2002-01-22 2004-09-30 성이제 방열면적을 크게한 씨피유냉각용 히트싱크구조
KR100456342B1 (ko) * 2002-02-08 2004-11-12 쿨랜스코리아 주식회사 반도체 칩의 수냉식 냉각 블록
KR20040047719A (ko) * 2002-11-28 2004-06-05 가부시끼가이샤 도시바 냉각용 펌프, 전기 기기 및 퍼스널 컴퓨터
JP2006324647A (ja) * 2005-04-21 2006-11-30 Nippon Light Metal Co Ltd 液冷ジャケット
KR20110032266A (ko) * 2009-09-22 2011-03-30 재영솔루텍 주식회사 사출 금형

Also Published As

Publication number Publication date
WO2014181984A2 (ko) 2014-11-13

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