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WO2014144157A1 - Configurations optiques destinées à être utilisées avec une caméra à matrice - Google Patents

Configurations optiques destinées à être utilisées avec une caméra à matrice Download PDF

Info

Publication number
WO2014144157A1
WO2014144157A1 PCT/US2014/028447 US2014028447W WO2014144157A1 WO 2014144157 A1 WO2014144157 A1 WO 2014144157A1 US 2014028447 W US2014028447 W US 2014028447W WO 2014144157 A1 WO2014144157 A1 WO 2014144157A1
Authority
WO
WIPO (PCT)
Prior art keywords
lens
camera
monolithic
optics
distal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2014/028447
Other languages
English (en)
Inventor
Jacques Duparre
Dan Lelescu
Kartik Venkataraman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pelican Imaging Corp
Original Assignee
Pelican Imaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/832,120 external-priority patent/US20130265459A1/en
Application filed by Pelican Imaging Corp filed Critical Pelican Imaging Corp
Publication of WO2014144157A1 publication Critical patent/WO2014144157A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/61—Noise processing, e.g. detecting, correcting, reducing or removing noise the noise originating only from the lens unit, e.g. flare, shading, vignetting or "cos4"
    • H04N25/615—Noise processing, e.g. detecting, correcting, reducing or removing noise the noise originating only from the lens unit, e.g. flare, shading, vignetting or "cos4" involving a transfer function modelling the optical system, e.g. optical transfer function [OTF], phase transfer function [PhTF] or modulation transfer function [MTF]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/58—Optics for apodization or superresolution; Optical synthetic aperture systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images

Definitions

  • optical arrays can be formed by molding or embossing from a master lens array, or fabricated by standard lithographic or other means.
  • the standard polymer-on-glass WLO and monolithic lens WLO manufacturing techniques have so far not been adapted for the specific high performance requirements of array cameras.
  • some technical limitations of conventional WLO-processes need to be reduced, such as, for example, minimum substrate thickness requirements, inflexibility of where to place the aperture stop, accuracy, etc.
  • the flexibility of such choices or processes needs to be increased in order to meet the high demands by array cameras otherwise such WLO techniques cannot be used to manufacture array cameras.
  • a second lens element having a second concave proximal surface and a second convex distal surface
  • first, second and thirds lens elements are arranged sequentially in optical alignment with an imager positioned at the distal end thereof.
  • a plurality of the five-surface optical arrangements is provided in an array.
  • the array is designed to image a selected wavelength band, and wherein the profile of at least one of the lens surfaces within each optical arrangement is adapted to optimally image only a narrow-band portion of the selected wavelength such that in combination the plurality of arrangements within the array image the entirety of the selected wavelength band.
  • FIG. 2A is a perspective view of a camera module in accordance with embodiments of the invention.
  • a focal plane of an array of light sensitive pixels formed from a quantum film sensor may be implemented.
  • the formation, composition, performance and function of various quantum films, and their use in optical detection in association with semiconductor integrated circuits are described in U.S. Patent Publication US/2009/0152664, entitled “Materials, Systems and Methods for Optoelectronic Devices", published June 18, 2009, the disclosure of which is incorporated by reference herein in its entirety.
  • lens elements 288 are formed on the top lens wafer 262. Although these lens elements 288 are shown as being identical in FIG. 2B, it should be understood that within the same camera array different types, sizes, and shapes of elements may be used. Another set of lens elements 286 is formed on the bottom lens wafer 268. The combination of the lens elements on the top lens wafer and bottom lens wafer form the lens stacks 220 shown in FIG. 2A.
  • through-silicon vias 274 may also be provided to paths for transmitting signal from the imagers.
  • the top lens wafer 262 may be partially coated with light blocking materials 284 (e.g., chromium, oxidized (“black”) chromium, opaque photoresist) to block of light.
  • light blocking materials 284 e.g., chromium, oxidized (“black”) chromium, opaque photoresist
  • the portions of the top lens wafer 262 of the optics array not coated with the blocking materials 284 serve as apertures through which light passes to the bottom lens wafer 268 and the imager array. Although only a single aperture is shown in the embodiment provided in FIG.
  • the third lens element 504 is disposed comparatively close to the image surface 524, and the second side of the third lens element is preferably connected with the image sensor or image sensor cover glass by a transparent areal bond or a local bond (e.g. UV- and/or thermally curing adhesive), or even a (-n opaque) spacing structure with transparent openings as described above.
  • a transparent areal bond or a local bond e.g. UV- and/or thermally curing adhesive
  • the optical arrangement is designed in such a way that very high contrast at the used image sensor's Nyquist spatial frequency is achieved, which at the same time (for gradual fall-off of contrast with increasing spatial frequency) provides sufficient contrast at 1 .5x or 2x the sensor's Nyquist frequency to allow the super-resolution image information recovery to work effectively.
  • the optical arrangement is optimized for allowing a small lateral distance between adjacent optical channels in order to economically exploit the die real-estate area, consequently the lens diameters and the wall-thickness of (opaque) spacer structures may be reduced.
  • this is sometimes difficult to achieve.
  • Embodiment 5 Three-Element Monolithic Lens Design
  • a third menisc-lens element 812 that has a concave first surface 813 and a convex second surface 814, both bent towards the object side.
  • This lens is preferably a strongly bent concave-convex lens that is made from a second (high dispersion, high refractive index) lens material.
  • This third lens element is disposed adjacent to the image sensor cover glass 816, which itself is placed in above the image sensor 817.
  • the three- element monolithic optical arrangement provides high image quality (See, e.g., Figures 8E to 8H) comparable to that of a design using a field-flattening element (such as e.g. applied in Embodiment 2 above).
  • a field-flattening element such as e.g. applied in Embodiment 2 above.
  • only three lens elements need to be stacked in the current design it is much more suitable for manufacture using a monolithic method compared to complex conventional multielement optical arrangements.
  • the lens material sequence i.e., in the above embodiment high Abbe number, high Abbe number, low Abbe number
  • the lens material sequence for the positive, positive, negative elements provides an efficient way of achromatization for each considered channel's spectral band (See Embodiment 6).
  • the blue channel performance seen in the exemplary embodiment is much better than can be obtained for regular designs (See, e.g., Figures 8I and 8J).
  • this achromatization still increases the performance since both the central wavelength and the wavelengths at the sides of the used spectral band of the considered channels are imaged sharply.
  • a "crown-like" polymer material would, e.g., be PMMA, Zeonex (COP) and Topas (COC), and a "flint-like” material would be Polycarbonate (PC) and Polystyrene (PS).
  • PC Polycarbonate
  • PS Polystyrene
  • Embodiment 9 Waveplate Or Multilevel Diffractive Phase Elements
  • the invention is directed to a waveplate or multilevel diffractive phase element ("kinoform") for channelwise correction of chromatic aberrations in an array camera, and an iterative fabrication process tolerance compensation.
  • kinoform multilevel diffractive phase element
  • Lens design experiments show that it could be beneficial to separate the channel-averaged optical power from the channel-specific optical power, which is then related to the color correction.
  • the current embodiment is directed to an optical arrangement that accomplishes this channel-wise correction using a channel-specific surface that introduces only a minor wavefront deformation of exactly the size needed to distinguish the channels from each other so that they are perfectly adapted to their individual waveband.
  • the wavefront deformation required for this is typically on the order of only several wavelengths.
  • this surface can either be a very shallow refractive surface ("waveplate”), a "low frequency” diffractive lens (“kinoform”) or radial symmetric multilevel diffractive phase element.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Lenses (AREA)

Abstract

L'invention concerne une variété de configurations optiques et de procédés destinés à modifier ou à améliorer les caractéristiques optiques et la fonctionnalité desdites configurations optiques. Les configurations optiques sont plus précisément conçues pour fonctionner avec des matrices de caméras incorporant un dispositif d'imagerie constitué d'une pluralité d'imageurs comprenant chacun une pluralité de pixels. Dans de nombreuses configurations optiques, les caractéristiques MTF de l'optique permettent un contraste à des fréquences spatiales qui sont au moins aussi élevées que la résolution souhaitée des images à haute résolution synthétisées par la caméra à matrice et considérablement supérieures à la fréquence de Nyquist du pas de pixel des pixels sur le plan focal, qui dans certains cas peuvent équivaloir à 1,5 fois, 2 fois ou 3 fois la fréquence de Nyquist.
PCT/US2014/028447 2013-03-15 2014-03-14 Configurations optiques destinées à être utilisées avec une caméra à matrice Ceased WO2014144157A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/832,120 US20130265459A1 (en) 2011-06-28 2013-03-15 Optical arrangements for use with an array camera
US13/832,120 2013-03-15

Publications (1)

Publication Number Publication Date
WO2014144157A1 true WO2014144157A1 (fr) 2014-09-18

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US9521416B1 (en) 2013-03-11 2016-12-13 Kip Peli P1 Lp Systems and methods for image data compression
US9578259B2 (en) 2013-03-14 2017-02-21 Fotonation Cayman Limited Systems and methods for reducing motion blur in images or video in ultra low light with array cameras
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US9766380B2 (en) 2012-06-30 2017-09-19 Fotonation Cayman Limited Systems and methods for manufacturing camera modules using active alignment of lens stack arrays and sensors
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