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WO2014141493A1 - Receptacle assembly and transceiver module assembly - Google Patents

Receptacle assembly and transceiver module assembly Download PDF

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Publication number
WO2014141493A1
WO2014141493A1 PCT/JP2013/067110 JP2013067110W WO2014141493A1 WO 2014141493 A1 WO2014141493 A1 WO 2014141493A1 JP 2013067110 W JP2013067110 W JP 2013067110W WO 2014141493 A1 WO2014141493 A1 WO 2014141493A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
optical module
receptacle
module
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/067110
Other languages
French (fr)
Japanese (ja)
Inventor
利育 伊藤
佐藤 繁
陽介 高居
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Priority to CN201390001138.2U priority Critical patent/CN205081293U/en
Publication of WO2014141493A1 publication Critical patent/WO2014141493A1/en
Anticipated expiration legal-status Critical
Priority to US14/974,289 priority patent/US10321607B2/en
Ceased legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4269Cooling with heat sinks or radiation fins
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4277Protection against electromagnetic interference [EMI], e.g. shielding means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581Shield structure
    • H01R13/6582Shield structure with resilient means for engaging mating connector

Definitions

  • the present invention relates to a receptacle assembly including a heat sink, and a transceiver module assembly.
  • a transceiver module is practically used to transmit an optical signal transmitted by an optical connector or the like to a motherboard.
  • the transceiver module is arranged in a chassis constituting the communication system.
  • Such a transceiver module includes an optical module (referred to as a module assembly in Patent Document 1), and an optical module receptacle (patent) which is placed on a circuit board as a motherboard and detachably accommodates the optical module. (Referred to as a receptacle assembly in Document 1) as a main component.
  • a plurality of optical modules may be arranged in parallel in one direction at a predetermined interval on the front cover of the chassis described above.
  • an optical cable connector and an optical cable for interconnection with other systems are connected to the ports at the ends of the optical modules exposed on the front cover of the chassis.
  • the connection end of the optical module is connected to the connected portion of the receptacle connector mounted on the circuit board in the optical module receptacle.
  • the connected portion of the receptacle connector is electrically connected to the circuit board described above.
  • the optical cable connector and the optical cable are electrically connected to the circuit board via the transceiver module.
  • the heat sink As shown in FIG. 2, when the optical module is connected to the optical module receptacle, the heat sink has a raised heat transfer surface portion on the lower end surface where the outer peripheral surface of the optical module abuts through the opening of the cage. ing. The periphery of the heat transfer surface portion of the heat sink is received by a frame portion formed at the periphery of the opening formed in the upper end surface of the cage, and is held in the cage by a clip. At that time, both side portions of the clip are respectively engaged with holding tabs formed on both side walls of the cage.
  • the area of the heat transfer surface of the heat sink described above is required to be larger from the viewpoint of heat dissipation efficiency.
  • Patent Document 1 in a cage formed by sheet metal processing, in a configuration in which a heat sink is received by a frame portion formed at the periphery of an opening formed in the upper end surface of the cage, the frame portion Therefore, there is a limit to increasing the opening area of the opening through which the heat transfer surface portion of the heat sink passes.
  • the outer peripheral surface of the optical module inserted into the cage is not guided to the heat transfer surface portion of the heat sink, and the optical module The optical module inserted by the gap between the outer peripheral portion and the cage is not positioned at an appropriate position, and as a result, the connection end portion of the optical module may not be smoothly connected to the connected portion of the receptacle connector.
  • the present invention is a receptacle assembly including a heat sink, and a transceiver module assembly, wherein the heat transfer surface area of the heat sink is maximized with respect to the optical module housing portion of the optical module receptacle.
  • a receptacle assembly and a transceiver module assembly that can be set and can smoothly connect the connection end of the optical module to the connected portion of the receptacle connector even when the heat sink is not disposed in the cage The purpose is to do.
  • a receptacle assembly including a heat sink has at least one module slot through which an optical module including a module substrate having a connection end at one end passes.
  • An optical module is detachably accommodated, and at least one module accommodating portion having a bottom wall portion that contacts the lower surface of the optical module, and a connector that communicates with the module accommodating portion and is connected to the connection end of the module substrate in a detachable manner.
  • An outer periphery of the optical module via a heat transfer surface selectively disposed on the receptacle cage and having an area corresponding to the area of the bottom wall. Heat sink and heat sink to dissipate the heat generated from the optical module.
  • the module slot is The tip of the connecting end of the optical module inserted through the connector is brought into contact with the tip of the outer portion protruding toward the connector from the connecting end of the optical module so that the tip is placed in the connector housing.
  • a guide plate member that guides.
  • the guide plate member may have a cutout portion at a position above the connector housing portion, and the heat transfer surface of the heat sink may have an extension portion inserted into the cutout portion.
  • the guide plate member may be fixed to the side wall of the receptacle cage.
  • a gap may be formed between the inner peripheral surface of the guide plate member and the outer peripheral surface of the connector cover that covers the connector so that a protective wall of the optical module that protects the connection end portion is inserted.
  • the guide plate member may be provided at a position lower than the position of the heat sink support mechanism in the receptacle cage.
  • the width in the direction orthogonal to the attaching / detaching direction of the optical module in the notch portion of the guide plate member may be smaller than the width orthogonal to the attaching / detaching direction in the protective wall of the optical module.
  • a transceiver module assembly includes an optical module including a module substrate having a connection end at one end, and the above-described receptacle assembly.
  • the heat sink support mechanism when the heat sink support mechanism is arranged in the receptacle cage and the heat sink is arranged in the receptacle cage, the heat sink is arranged along the mounting direction of the optical module. Therefore, the area of the heat transfer surface portion of the heat sink can be set to the maximum with respect to the optical module housing portion of the optical module receptacle, and the guide plate member is arranged in the receptacle cage.
  • the connecting end of the optical module can be smoothly connected to the connecting portion of the receptacle connector.
  • FIG. 1 is a plan view showing a first embodiment of a receptacle assembly according to the present invention.
  • FIG. 2 is a perspective view showing a first embodiment of a receptacle assembly according to the present invention together with a heat sink.
  • FIG. 3 is a perspective view showing a heat sink used in the example shown in FIG.
  • FIG. 4 is a cross-sectional view showing a main part partially enlarged with the heat sink attached in the example shown in FIG.
  • FIG. 5 is a partially enlarged perspective view of the example shown in FIG.
  • FIG. 3 is a partial perspective view for explaining an operation in the example shown in FIG. 2.
  • FIG. 7A is a partial cross-sectional view for explaining the operation in the example shown in FIG. FIG.
  • FIG. 7B is a partial cross-sectional view for explaining the operation in the example shown in FIG.
  • FIG. 8 is a perspective view showing a second embodiment of the receptacle assembly according to the present invention.
  • FIG. 9 is a perspective view showing a heat sink used in the example shown in FIG.
  • FIG. 10A is a partial cross-sectional view for explaining the operation in the example shown in FIG.
  • FIG. 10B is a partial cross-sectional view for explaining the operation in the example shown in FIG.
  • FIG. 2 shows a first embodiment of a receptacle assembly which constitutes a part of a transceiver module assembly according to the present invention, together with a printed wiring board disposed inside a predetermined housing.
  • FIG. 2 shows a state where an optical module 14 and a heat sink 26 described later are removed.
  • a case (not shown) that forms a sealed space accommodates a printed wiring board 16 on which a transceiver module assembly is mounted.
  • a printed wiring board 16 on which a transceiver module assembly is mounted.
  • four receptacle cages are mounted on one printed wiring board 16.
  • the invention is not limited to such an example, and five or more receptacle cages are formed on one printed wiring board. 16 may be implemented.
  • the transceiver module assembly includes an optical module 14 and an optical module receptacle assembly.
  • the optical module 14 includes, as main elements, a metal upper case and a lower plate that form an outer shell, a module substrate that is positioned at a predetermined position in a housing space formed between the upper case and the lower plate. It is configured.
  • the upper case as the upper member has an open lower end.
  • a thin plate-like protective wall 143 that is continuous with the upper surface and both side surfaces of the upper case and protrudes in the longitudinal direction is formed in a gate shape.
  • the distal end portion of the protective wall 143 has an arc portion that is rounded in the thickness direction, as shown partially enlarged in FIGS. 4 and 6.
  • tip part of the protective wall 143 is not restricted to such an example, For example, in FIG. 4, you may have a slope part which goes to the diagonally downward direction by chamfering.
  • the protective wall 143 is used to protect a plug connector 146 described later when the optical module 14 is accidentally dropped.
  • a latch mechanism (not shown) is provided at the other end of the upper case.
  • the latch mechanism includes a release plate and a latch lever.
  • a latch lever (not shown) is rotated in one direction, the locking piece of the release plate is moved and released from a lock piece 129 (see FIG. 2) described later to be unlocked. Further, when the latch lever is rotated in the other direction, the locking piece of the release plate is locked to the lock piece 129 of the receptacle cage 12 described later. As a result, the optical module 14 is locked with respect to the receptacle cage 12.
  • the module substrate has an electrode portion constituting a plug connector 146 as a connection end portion at one end portion.
  • a plurality of contact pads are arranged in parallel with each other at a predetermined interval on a common plane on the front surface and the back surface of the electrode portion formed at the distal end portion of the plug connector 146.
  • the plate-like lower plate as the lower member is fixed to the lower end of the upper case with a small screw so as to cover the opening at the lower end of the upper case.
  • An optical connector connected to one end of an optical cable (not shown) is connected to a port provided at the end of the optical module 14.
  • the other end of the optical cable is connected to, for example, an optical connector of another housing constituting a communication system (not shown).
  • the above-described module substrate has a plug connector 146 as a connection end.
  • the present invention is not limited to such an example.
  • the module substrate may be replaced with a plug connector as a connection end. You may have an edge terminal in a front-end
  • the optical module receptacle assembly is disposed on the printed circuit board 16 in the receptacle cage 12 that detachably accommodates the optical module 14 described above, and in each receptacle connector accommodating portion of the receptacle cage 12.
  • the main component includes a receptacle connector 22 to be accommodated and a cover 24 having a plurality of connector accommodating portions for individually accommodating the receptacle connectors 22.
  • the receptacle cage 12 is made of, for example, stainless steel or phosphor bronze thin plate, preferably stainless steel having high thermal conductivity, or phosphor bronze by pressing.
  • the receptacle cage 12 has compartments 121, 122, 123, and 124 formed of a module housing portion and a receptacle connector housing portion inside.
  • the compartments 121, 122, 123, and 124 are arranged in parallel along the Y coordinate axis extending in a direction orthogonal to the attaching / detaching direction of the optical module 14 in the orthogonal coordinates in FIG. 2. Since the compartments 121, 122, 123, and 124 have the same structure, the compartment 121 will be described, and the description of the other compartments 122, 123, and 124 will be omitted.
  • the module housing portion in the compartment 121 is formed by being surrounded by the side wall 126 and the partition wall 125 facing each other with a predetermined interval and the bottom wall portion 12BP.
  • the side wall 126 and the partition wall 125 extend along the X coordinate axis in FIG. 2, that is, the attaching / detaching direction of the optical module 14.
  • Each of the side wall 126 and the partition wall 125 has a lock piece 129 in the vicinity of a module slot described later.
  • the lock pieces 129 in the side wall 126 and the partition wall 125 face each other.
  • Each lock piece 129 is selectively engaged with a locking piece of a release plate of the optical module 14 so that the optical module 14 is locked with respect to the module housing portion.
  • the module housing part has a module slot that opens in the X coordinate axis direction at one end. Thereby, the optical module 14 is attached and detached through the module slot.
  • a cylindrical front EMI finger 13 is provided on the entire periphery of the module slot having a substantially rectangular cross section.
  • the partition wall 125 is also provided with other front EMI fingers (not shown).
  • the front EMI finger 13 and the other front EMI fingers constitute a shield member.
  • the inner peripheral portion of the front EMI finger 13 is in contact with the outer peripheral portion of the optical module 14 to be inserted, and the outer peripheral portion of the front EMI finger 13 is in contact with, for example, the peripheral edge of the opening of the housing described above. Become.
  • the shield member including the metal front EMI finger 13 Since it is shielded, the noise is confined in the above-described casing, and there is no possibility that the noise leaks to the outside through the gap between the outer peripheral portion of the optical module 14 and the inner peripheral portion of the module housing portion.
  • the other end of the module housing portion that faces the module slot communicates with the receptacle connector housing portion.
  • An opening that opens along the Z-coordinate axis in FIG. 2 is formed in a portion of the receptacle cage 12 that faces the bottom wall 12BP.
  • a heat sink support mechanism for detachably supporting a heat sink 26 described later is provided at the periphery of the opening.
  • a heat sink support mechanism for detachably supporting the heat sink 26 is also provided in the compartments 122, 123, and 124. Thereby, each heat sink 26 is selectively disposed in the receptacle cage 12 via the heat sink support mechanism so as to close the above-described openings of the compartments 121, 122, 123 and the compartment 124.
  • the heat sink 26 is made of a metal having good thermal conductivity such as aluminum.
  • the plurality of fins 26Fi are formed substantially perpendicular to the flat surface of the base portion 26M supported by the heat sink support mechanism.
  • a pair of flange portions 26F are formed on both sides of the base portion 26M so as to face each other by a predetermined length.
  • An elongated groove 26GA is formed between the connecting portion where the lower ends of the plurality of fins 26Fi are connected to each other and the flange portion 26F.
  • the elongated groove 26GA is formed on the bent pieces 126S2 and the three pressing springs 126S1 formed at the upper end of the side wall 126, and the bent pieces 127S2 and the three pressing springs 127S1 of the top plate 127 provided at the upper end of the partition wall 125. It is slidably engaged.
  • a pressing end portion 26EF is formed as shown in an enlarged manner in FIG.
  • the pressing end portion 26EF has a width that is smaller than the width of the central portion of the base portion 26M, and abuts on a return leaf spring 12LF described later. Further, an extending portion 26ER is formed at the other end in the longitudinal direction of the base portion 26M.
  • the extending part 26ER has a width Hc that is smaller than the width of the center part of the base part 26M, and extends from one end of the flange part 26F along the longitudinal direction of the base part 26M.
  • the width Hc is set slightly smaller than the distance Lc (see FIG. 1) between guide pieces of a guide plate 12RP described later.
  • a groove 26EG is formed on the end surface of the extending portion 26ER to be locked to a locking portion of a guide plate 12RP described later when the heat sink 26 is mounted.
  • the heat transfer surface of the base portion 26 ⁇ / b> M including the extending portion 26 ⁇ / b> ER has an upper plate and a protective wall portion 143 of the optical module 14 as shown in FIG. 4.
  • the heat from the optical module 14 is dissipated through the heat sink 26.
  • the heat transfer surface of the extension part 26ER and the surface of the protective wall part 143 come into contact with each other, so that the heat transfer area is further expanded, so that the optical module 14 can be cooled more efficiently. Further, the strength of the heat sink 26 is improved by the extending portion 26ER.
  • the heat sink support mechanism described above includes a bent piece 126S2, three pressing springs 126S1 formed at a bent portion formed at the uppermost end of the side wall 126 constituting the receptacle cage 12, Bending pieces 127S2 and three pressing springs 127S1 formed on the top plate 127 provided at the upper end of the partition wall 125, and three bending pieces 128S2 formed on the bending portion formed at the uppermost end of the side wall 128 and three pressings. And a spring 128S1.
  • heat sink fixing means there are a guide plate 12RP provided on the back surface of the receptacle cage 12, and a leaf spring 12LF for urging the groove 26EG of the extending portion 26ER of the heat sink 26 toward the engaging portion of the guide plate 12RP.
  • the receptacle cage 12 is provided.
  • the pressing spring 126S1 and the bent piece 126S2 of the side wall 126 and the top plate 127 provided at the upper end of the partition wall 125 are formed to face each other at a predetermined interval on a common plane.
  • One end of the side walls 126 and 128 and one end of each partition wall 125 are connected by a guide plate 12RP extending along the Y coordinate axis in FIG.
  • the guide plate 12RP is formed to be connected to one end of the side walls 126 and 128 and one end of each partition wall 125 to form a cover fixing portion that forms the back portion of the receptacle cage 12, and an upper end portion of the cover fixing portion.
  • the cover fixing portion is formed with a pair of ejecting leaf springs 12 RPSf on a common straight line.
  • Each pair of ejecting leaf springs 12RPSf is formed to correspond to the compartments 121, 122, 123, and 124, respectively.
  • a rectangular opening into which a claw portion of a cover 24 described later is inserted is formed at a position below the pair of ejection plate springs 12RPSf. Thereby, the cover 24 is fixed to the guide plate 12RP.
  • Each pair of ejecting leaf springs 12RPSf urges the protective wall portion 143 of each mounted optical module 14 to be pushed out of the receptacle cage 12 by a predetermined amount to the outside through the module slot.
  • the guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5 are placed and locked on the upper part of one end of the side walls 126 and 128 and the upper part of one end of each partition wall 125, respectively.
  • the guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5 are formed in parallel to each other and extend a predetermined distance toward the bent pieces 126S2, 127S2, and 128S2.
  • the tip portions of the guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5 are positions separated from the ends of the bent piece 126S2, the bent piece 127S2, and the bent piece 128S2, respectively, by a predetermined distance Ld. Is formed.
  • the bent piece 126S2 As a result, as shown in FIG. 2 in an enlarged manner, the bent piece 126S2, the bent pieces 127S2 and 128S2 are respectively heat sinks in a state in which the pressing end portion 26EF is inclined obliquely to the left and downward toward the module housing portion. It is easily inserted into each of the 26 elongated grooves 26GA.
  • One end of the guide piece 12RT1 and the guide piece 12RT2, one end of the guide piece 12RT2 and the guide piece 12RT3, one end of the guide piece 12RT3 and the guide piece 12RT4, and one end of the guide piece 12RT4 and the guide piece 12RT5 face each other with a predetermined distance Lc.
  • the predetermined distance Lc is set slightly smaller than the width of the protective wall portion 143 of the optical module 14. Thereby, a notch is formed between them.
  • the guide piece 12RT2, the guide piece 12RT3, and the guide piece 12RT4 each protrude into the adjacent compartment.
  • the heat sink 26 described above is provided between the guide piece 12RT1 and the guide piece 12RT2, between the guide piece 12RT2 and the guide piece 12RT3, between the guide piece 12RT3 and the guide piece 12RT4, and between the guide piece 12RT4 and the guide piece 12RT5.
  • the extended portion 26ER is inserted.
  • the one end of the guide piece 12RT1 and the guide piece 12RT2, the one end of the guide piece 12RT2 and the guide piece 12RT3, the one end of the guide piece 12RT3 and the guide piece 12RT4, and the portion between the one end of the guide piece 12RT4 and the guide piece 12RT5 are respectively described above.
  • the groove 26EG of the extending portion 26ER of the heat sink 26 is a locking portion that is locked.
  • bent portion 12RS formed integrally with the guide piece 12RT1 and the bent portion (not shown) formed integrally with the guide piece 12RT5 are locked to the outer peripheral portions of the side walls 126 and 128, respectively.
  • the positions of the guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5 are set to positions that are lower than the position of the top plate 127 by a predetermined dimension ⁇ H, as shown in FIGS. 7A and 7B. Further, the distance ⁇ Ga between the inner peripheral portion of the guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5 and the upper surface of the outer peripheral portion of the cover 24 is larger than the thickness T of the protective wall portion 143 of the optical module 14.
  • Is set to The distance ⁇ Ga is such that when the protective wall 143 is inserted between the guide piece 12RT1 and the upper surface of the outer periphery of the cover 24, the gap between the upper surface of the protective wall 143 and the inner peripheral surface of the guide piece 12RT1 is It is set to be larger than the gap between the slit of the cover 24 and the plug connector 146.
  • the bent portion of the side wall 126 has three pressing springs 126S1 that urge one flange portion 26F of the heat sink 26 downward with a predetermined interval on a common straight line. Is formed.
  • the base end of each pressing spring 126S1 is formed integrally with the bent portion of the side wall 126, and the end of each pressing spring 126S1 extends toward the bent piece 126S2 and has a bent portion that can be elastically displaced along the Z coordinate axis. is doing.
  • the bent portion has a curvature corresponding to the height of each elongated groove 26GA of the heat sink 26.
  • pressing springs 127S1 for urging the other flange portion 26F of the heat sink 26 are formed at three positions on the common straight line with a predetermined interval.
  • the base end of each pressing spring 127S1 is formed integrally with the top plate 127, and the end of each pressing spring 127S1 extends toward the bent piece 127S2 and has a bent portion that can be elastically displaced along the Z coordinate axis. Yes.
  • the bent portion has a curvature corresponding to the height of each elongated groove 26GA of the heat sink 26.
  • a return leaf spring 12LF is integrally formed at a portion of the connecting portion facing each locking portion of the guide plate 12RP.
  • the return leaf spring 12LF has a movable piece that can be elastically displaced along the X coordinate axis.
  • the movable piece of the return leaf spring 12LF urges the entire heat sink 26 toward each locking portion of the guide plate 12RP.
  • the return leaf spring 12LF is not limited to such an example.
  • the return leaf spring 12LF may be formed separately and fixed to the connecting portion.
  • the end of the bottom wall portion 12BP connecting the side wall 126 and the lower end of the partition wall 125 is in contact with the mounting surface of the printed wiring board 16. Further, the end portion of the bottom wall portion 12BP is in contact with one side of an annular grounding contact pad formed on the mounting surface of the printed wiring board 16. As a result, the receptacle cage 12 is grounded.
  • a plurality of press-fit claw portions Ta are formed at predetermined intervals on the lower ends of the side wall 126, the partition wall 125, and the side wall 128, respectively. As shown in FIG. 2, each press-fit claw portion Ta is press-fitted into each pore formed on the surface of the printed wiring board 16 corresponding to the arrangement of the press-fit claw portions Ta. As a result, the lower end surface of the receptacle cage 12 is tightly fixed to the surface of the printed wiring board 16.
  • the receptacle connector housing portion that opens toward the surface of the printed wiring board 16 is surrounded by the receptacle connector side closed end facing the module slot in the receptacle cage 12 and the receptacle connector side portion of the side wall 126 and the partition wall 125. Is formed.
  • a plurality of flange portions for screwing the receptacle cage 12 to the mounting surface of the printed wiring board 16 are provided on the outer sides of the side surface and the rear surface of the receptacle cage 12.
  • the cover 24 is made of, for example, a metal material by die casting, and is formed by connecting fraction portions inserted into the compartments 121, 122, 123, and 124 of the receptacle cage 12 to each other. It has an outer part.
  • the outer shell portion is composed of a pair of side walls facing each other, and a top plate portion connecting the upper end portion of one side wall and the upper end portion of the other side wall.
  • a slit through which the tip of the plug connector 146 of the optical module 14 passes is formed in the portion of the cover 24 that faces each module housing portion.
  • a groove corresponding to the partition wall 125 is formed at the boundary portion between the portions of the cover 24 inserted into the adjacent compartments 121 and 122. Further, a groove corresponding to the partition wall 125 is also formed at the boundary portion between the portions inserted into the adjacent compartments 122 and 123. Furthermore, a groove corresponding to the partition wall 125 is also formed in a boundary portion between portions inserted into the adjacent compartments 123 and 124.
  • a plurality of claw portions 24n are formed on the back surface of the outer portion of the cover 24 as shown in an enlarged view in FIG. Each of the plurality of claw portions 24n is engaged with each opening portion of the above-described guide plate 12RP that forms the receptacle connector side closed end portion.
  • Connector accommodating portions are respectively formed inside the fraction portions inserted into the compartments 121, 122, 123, and 124 in the cover 24, respectively.
  • Adjacent connector housing portions are each partitioned by a partition wall.
  • the receptacle connector 22 includes a connector insulator having a slot into which the plug connector 146 of the optical module 14 is detachably inserted, and a plurality of contact terminals CT1 and CT2. ing.
  • the contact terminals CT1 and CT2 are to electrically connect the plug connector 146 of the optical module 14 to an electrode group connected to the conductor pattern of the printed wiring board 16, respectively.
  • a plurality of positioning pins (not shown) that fit into the positioning holes of the printed wiring board 16 are formed on the bottom of the connector insulator.
  • the posture of the heat sink 26 is set to the module housing portion so that the bent piece 126S2 and the bent piece 127S2 are respectively inserted into the opening ends of the elongated grooves 26GA of the heat sink 26 through the openings. Tilt against.
  • the heat sink 26 has its pressing end 26EF in the moving direction against the movable piece of the return leaf spring 12LF so that each pressing spring 126S1 and each pressing spring 127S1 is inserted into the elongated groove 26GA of the heat sink 26.
  • the return leaf spring 12LF is further pushed against the elastic force of the movable piece.
  • a predetermined gap is formed between the locking portion of the guide plate 12RP and the end surface of the extending portion 26ER. Further, when the heat sink 26 is inserted, the pressing spring 126S1 and the pressing spring 127S1 are not likely to be deformed because the heat sink 26 is inserted into the groove 26GA from a bent portion having a size corresponding to the height of the groove 26GA.
  • the heat sink 26 when removing the heat sink 26 from the receptacle cage 12 in an unlocked state, first, the heat sink 26 is pushed against the elastic force of the movable piece of the return leaf spring 12LF, and the groove 26EG of the extending portion 26ER is engaged. It is made into an unlocking state with respect to a stop part. Next, after a predetermined gap is formed between the end surface of the extending portion 26ER and the locking portion, the end of the heat sink 26 is pulled up directly, whereby the heat sink 26 is removed from the receptacle cage 12. .
  • FIG. 8 shows a second embodiment of a receptacle assembly that constitutes a part of a transceiver module assembly according to the present invention, together with a printed wiring board disposed inside a predetermined housing.
  • FIG. 8 shows a state where a plurality of optical modules 14 and a plurality of heat sinks described later are removed. 8 to 10B, the same components in the example shown in FIG. 2 are denoted by the same reference numerals, and redundant description thereof is omitted.
  • four receptacle cages are mounted on one printed wiring board 16, but the present invention is not limited to this example, and five or more receptacle cages are formed on one printed wiring board. 16 may be implemented.
  • the transceiver module assembly includes the above-described optical module 14 and the optical module receptacle assembly.
  • the optical module receptacle assembly is accommodated in a receptacle cage 32 that is arranged on a printed wiring board 16 and detachably accommodates the optical module 14 described above, and a receptacle connector accommodating portion of the receptacle cage 32.
  • the receptacle connector 22 and the cover 24 having a plurality of connector accommodating portions for individually accommodating the receptacle connectors 22 are included as main elements.
  • the receptacle cage 32 is made of, for example, a stainless steel or phosphor bronze thin plate, preferably stainless steel or phosphor bronze having good thermal conductivity, by pressing.
  • the receptacle cage 32 has compartments 321, 322, 323, and 324 including a module housing portion and a receptacle connector housing portion inside.
  • the compartments 321, 322, 323, and 324 are arranged in parallel along the Y coordinate axis that extends in a direction orthogonal to the attaching / detaching direction of the optical module 14 in orthogonal coordinates in FIG. 8. Since the compartments 321, 322, 323, and 324 have the same structure, the compartment 321 will be described, and the description of the other compartments 322, 323, and 324 will be omitted.
  • the module housing portion in the compartment 321 is formed by being surrounded by a side wall 326 and a partition wall 325 facing each other with a predetermined interval, and a bottom wall portion 32BP.
  • the side wall 326 and the partition wall 325 extend along the X coordinate axis in FIG. 2, that is, the attaching / detaching direction of the optical module 14.
  • Each of the side wall 326 and the partition wall 325 has a lock piece 329 in the vicinity of a module slot described later.
  • the lock pieces 329 in the side wall 326 and the partition wall 325 face each other.
  • Each lock piece 329 is selectively engaged with a locking piece of a release plate of the optical module 14 so that the optical module 14 is locked with respect to the module housing portion.
  • the module housing part has a module slot that opens in the X coordinate axis direction at one end. Thereby, the optical module 14 is attached and detached through the module slot.
  • a cylindrical front EMI finger 13 is provided on the entire periphery of the module slot having a substantially rectangular cross section.
  • the partition wall 325 is also provided with other front EMI fingers (not shown).
  • the front EMI finger 13 and the other front EMI fingers constitute a shield member.
  • the inner peripheral portion of the front EMI finger 13 is in contact with the outer peripheral portion of the optical module 14 to be inserted, and the outer peripheral portion of the front EMI finger 13 is in contact with, for example, the peripheral edge of the opening of the housing described above. Become.
  • the shield member including the metal front EMI finger 13 Since it is shielded, the noise is confined in the above-described casing, and there is no possibility that the noise leaks to the outside through the gap between the outer peripheral portion of the optical module 14 and the inner peripheral portion of the module housing portion.
  • the other end of the module housing portion that faces the module slot communicates with the receptacle connector housing portion.
  • an opening that opens along the Z coordinate axis in FIG. 8 is formed in the portion of the receptacle cage 32 facing the bottom wall portion 32BP.
  • a heat sink support mechanism that detachably supports a heat sink 36 to be described later is provided at the periphery of the opening.
  • a heat sink support mechanism that detachably supports the heat sink 36 is also provided in the compartments 322, 323, and 324. Thereby, each heat sink 36 is selectively disposed in the receptacle cage 32 via the heat sink support mechanism so as to close the above-described openings of the compartments 321, 322, 323 and the compartment 324.
  • the plurality of fins 36Fi are formed substantially perpendicular to the flat surface of the base portion 36M supported by the heat sink support mechanism.
  • a pair of flange portions 36F are formed on both sides of the base portion 36M so as to face each other by a predetermined length.
  • An elongated groove 36GA is formed between the connecting portion where the lower ends of the plurality of fins 36Fi are connected to each other and the flange portion 36F.
  • the elongated groove 36GA has a bent piece 326S2 formed at the upper end portion of the side wall 326, two pressing springs 326S1, and a bent piece 327S2 of the top plate 327 provided at the upper end of the partition wall 325, and the two pressing springs 327S1. It is slidably engaged.
  • a pressing end 36EF is formed at one end of the base portion 36M in the longitudinal direction.
  • the pressing end portion 36EF has a width that is smaller than the width of the central portion of the base portion 36M, and abuts on a return leaf spring 32LF described later.
  • a groove 36EG that is locked to a locking portion of a guide plate 32RP described later when the heat sink 36 is mounted is formed in the locking end 36ER in the longitudinal direction of the base portion 36M.
  • the heat sink support mechanism described above includes a bent piece 326S2 formed at a bent portion formed at the uppermost end of the side wall 326 constituting the receptacle cage 32, two pressing springs 326S1, A bent piece 327S2 formed on the top plate 327 provided at the upper end of the partition wall 325, two pressing springs 327S1, and a bent piece 328S2 formed on the bent portion formed at the uppermost end of the side wall 328, two pressed And a spring 128S1.
  • a guide plate 32RP provided on the back surface portion of the receptacle cage 32 and a leaf spring 32LF that urges the groove 36EG of the heat sink 36 toward the engaging portion of the guide plate 32RP are included in the receptacle cage 32. Is provided.
  • the pressing spring 326S1 and the bent piece 326S2 of the side wall 326 and the top plate 327 provided at the upper end of the partition wall 325 are formed to face each other at a predetermined interval on a common plane.
  • One end of each of the side walls 326 and 328 and one end of each partition wall 325 are connected by a guide plate 32RP extending along the Y coordinate axis in FIG.
  • the guide plate 32RP is formed so as to be connected to one end of the side walls 326 and 328 and one end of each partition wall 325 to form a cover fixing portion that forms the back portion of the receptacle cage 32, and an upper end portion of the cover fixing portion.
  • the cover fixing portion is formed with a pair of ejecting leaf springs 32RPSf on a common straight line. Each pair of ejecting leaf springs 32RPSf is formed corresponding to the compartments 321, 322, 323, and 324, respectively. A rectangular opening into which the claw 24n of the cover 24 is inserted is formed at a position below the pair of ejection leaf springs 32RPSf. Thereby, the cover 24 is fixed to the guide plate 32RP.
  • Each pair of ejection leaf springs 32RPSf urges the protective wall portion 143 of each mounted optical module 14 to be pushed out from the receptacle cage 32 by a predetermined amount to the outside through the module slot.
  • the guide pieces 32RT1, 32RT2, 32RT3, and 32RT4 are placed and locked on the top of one end of the side walls 326 and 328 and the top of one end of each partition wall 325.
  • the guide pieces 32RT1, 32RT2, 32RT3, and 32RT4 are formed in parallel to each other and extend by a predetermined distance toward the bent pieces 326S2, 327S2, and 328S2.
  • the distal ends of the guide pieces 32RT1, 32RT2, 32RT3, and 32RT4 are formed at positions separated from the ends of the bent pieces 326S2, the bent pieces 327S2, and the bent pieces 328S2 by a predetermined distance, respectively.
  • bent pieces 326S2, the bent pieces 327S2 and 328S2 are easily inserted into the respective elongated grooves 36GA of the heat sink 36 in a state where the pressing end portion 36EF is inclined obliquely to the left and downward toward the inside of the module housing portion.
  • One end of each of the guide piece 32RT1 and the guide piece 32RT2 and one end of the guide piece 32RT3 and the guide piece 32RT4 serve as a locking portion to which the groove 36EG of the heat sink 36 described above is locked.
  • bent portion 32RS formed integrally with the guide piece 32RT1 and the bent portion (not shown) formed integrally with the guide piece 32RT4 are locked to the outer peripheral portions of the side walls 326 and 328, respectively.
  • the positions of the guide pieces 32RT1, 32RT2, 32RT3, and 32RT4 are set to positions that are lower than the position of the top plate 327 by a predetermined dimension ⁇ H, as shown in FIGS. 10A and 10B. Further, the distance ⁇ Ga between the inner peripheral part of the guide pieces 32RT1, 32RT2, 32RT3, and 32RT4 and the upper surface of the outer peripheral part of the cover 24 is set to be larger than the thickness T of the protective wall part 143 of the optical module 14. Has been. Further, when the protective wall 143 is inserted between the guide piece 32RT1 and the upper surface of the outer peripheral portion of the cover 24, the distance ⁇ Ga is a gap between the upper surface of the protective wall 143 and the inner peripheral surface of the guide piece 32RT1. It is set to be larger than the gap between the slit of the cover 24 and the plug connector 146.
  • each pressing spring 326S1 that urge one flange portion 36F of the heat sink 36 downward are formed on a common straight line at predetermined intervals.
  • the base end of each pressing spring 326S1 is formed integrally with the bent portion of the side wall 326, and the end of each pressing spring 326S1 has a bent portion that extends toward the bent piece 326S2 and can be elastically displaced along the Z coordinate axis. is doing.
  • the bent portion has a curvature corresponding to the height of each elongated groove 36GA of the heat sink 36.
  • each pressing spring 327S1 for biasing the other flange portion 36F of the heat sink 36 is formed at two positions on the common straight line with a predetermined interval.
  • the base end of each pressing spring 327S1 is formed integrally with the top plate 327, and the end of each pressing spring 327S1 extends toward the bent piece 327S2 and has a bent portion that can be elastically displaced along the Z coordinate axis. Yes.
  • the bent portion has a curvature corresponding to the height of each elongated groove 36GA of the heat sink 36.
  • a return leaf spring 32LF is integrally formed at a portion of the connecting portion facing each locking portion of the guide plate 32RP.
  • the return leaf spring 32LF has a movable piece that can be elastically displaced along the X coordinate axis.
  • the movable piece of the return leaf spring 32LF urges the entire heat sink 26 toward each locking portion of the guide plate 32RP.
  • the return leaf spring 32LF is not limited to such an example.
  • the return leaf spring 32LF may be formed separately and fixed to the connecting portion.
  • the end portion of the bottom wall portion 32BP that connects the lower ends of the side wall 326 and the partition wall 325 is in contact with the mounting surface of the printed wiring board 16. Further, the end portion of the bottom wall portion 32BP is in contact with one side of an annular grounding contact pad formed on the mounting surface of the printed wiring board 16. As a result, the receptacle cage 32 is grounded.
  • a plurality of press-fit claw portions Ta are formed at predetermined intervals on the lower ends of the side wall 326, the partition wall 325, and the side wall 328, respectively. As shown in FIG. 8, each press-fit claw portion Ta is press-fitted into each pore formed on the surface of the printed wiring board 16 corresponding to the arrangement of the press-fit claw portions Ta. As a result, the lower end surface of the receptacle cage 32 is tightly fixed to the surface of the printed wiring board 16.
  • the receptacle connector housing portion that opens toward the surface of the printed circuit board 16 is surrounded by the receptacle connector side closed end facing the module slot in the receptacle cage 32, and the side wall 326 and the receptacle connector side portion of the partition wall 325. Is formed.
  • a plurality of flange portions for screwing the receptacle cage 32 to the mounting surface of the printed wiring board 16 are provided on the outer periphery of the side surface and the rear surface of the receptacle cage 32, respectively.
  • the posture of the heat sink 36 is inclined with respect to the module housing portion so that the bent piece 326S2 and the bent piece 327S2 are inserted into the opening ends of the elongated grooves 36GA of the heat sink 36 through the openings, respectively.
  • the heat sink 36 has its pressing end 36EF in the advancing direction against the movable piece of the return leaf spring 32LF so that each pressing spring 326S1 and each pressing spring 327S1 is inserted into the elongated groove 36GA of the heat sink 36.
  • the return leaf spring 32LF is further pushed against the elastic force of the movable piece.
  • a predetermined gap is formed between the locking portion of the guide plate 32RP and the end surface of the locking end 36ER.
  • the pressing spring 326S1 and the pressing spring 327S1 are not likely to be deformed because the heat sink 36 is inserted into the groove 36GA from a bent portion having a size corresponding to the height of the groove 36GA.
  • the heat sink 36 is unlocked from the receptacle cage 32 and removed, the heat sink 36 is first pushed against the elastic force of the movable piece of the return leaf spring 32LF, and the groove 36EG of the locking end 36ER is engaged. It is made into an unlocking state with respect to a stop part. Next, after a predetermined gap is formed between the end face of the locking end 36ER and the locking portion, the end of the heat sink 36 is pulled straight up, whereby the heat sink 36 is removed from the receptacle cage 32. .
  • the receptacle cages 12 and 32 have four compartments.
  • the present invention is not limited to this example.
  • one to three receptacle cages may be used. It may have a compartment or five or more compartments.
  • the optical module 14 accommodates one module board, and the receptacle connectors 22 each have one slot into which the connection end of one module board is inserted.
  • the present invention is not limited to such an example.
  • the optical module accommodates two module boards in a two-layered manner with a predetermined interval, and the receptacle connector has a connection end portion of each of the module boards. It may have two slots to be inserted.
  • the cover has two slits into which connection end portions of two module substrates are respectively inserted.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

In a state in which a heat sink (26) has been detached from a receptacle cage (12), if an optical module (14) is inserted into a compartment (12) of the receptacle cage (12), even if said optical module (14) is inserted in an orientation in which a protective wall (143) of the optical module (14) is raised, by the distal part of the protective wall (143) of the optical module (14) abutting against the ends of guide tabs (12R2, 12RT2) of a guide plate (12RP), the distal part of the protective wall (143) is pressed down and guided into the gap between the guide tabs (12RT1, 12RT2).

Description

リセプタクルアッセンブリーおよびトランシーバモジュールアッセンブリーReceptacle assembly and transceiver module assembly

 本発明は、ヒートシンクを備えるリセプタクルアッセンブリー、および、トランシーバモジュールアッセンブリーに関する。 The present invention relates to a receptacle assembly including a heat sink, and a transceiver module assembly.

 光通信システムにおいては、光コネクタ等により伝送される光信号をマザーボードに伝送するためにトランシーバモジュールが実用に供されている。トランシーバモジュールは、例えば、特許文献1にも示されるように、通信システムを構成するシャーシに配置されている。そのようなトランシーバモジュールは、光モジュール(特許文献1においては、モジュール組立体と呼称されている)と、マザーボードとしての回路基板上に配され光モジュールを着脱可能に収容する光モジュール用リセプタクル(特許文献1においては、リセプタクル組立体と呼称されている)と、を主な要素として含んで構成されている。 In an optical communication system, a transceiver module is practically used to transmit an optical signal transmitted by an optical connector or the like to a motherboard. For example, as disclosed in Patent Document 1, the transceiver module is arranged in a chassis constituting the communication system. Such a transceiver module includes an optical module (referred to as a module assembly in Patent Document 1), and an optical module receptacle (patent) which is placed on a circuit board as a motherboard and detachably accommodates the optical module. (Referred to as a receptacle assembly in Document 1) as a main component.

 上述のシャーシの前面カバーには、複数個の光モジュールが所定の間隔をもって一方向に並列に配置される場合がある。シャーシの前面カバーに露出した各光モジュールの端部におけるポートには、例えば、他のシステムとの相互接続を行う光ケーブル用コネクタおよび光ケーブルが接続される。各光モジュールが光モジュール用リセプタクルに接続される場合、光モジュールの接続端部が光モジュール用リセプタクル内の回路基板上に実装されるリセプタクルコネクタの被接続部に接続される。そのリセプタクルコネクタの被接続部は、上述の回路基板に電気的に接続されている。これにより、光ケーブル用コネクタおよび光ケーブルが、トランシーバモジュールを介して回路基板に電気的に接続されることとなる。 A plurality of optical modules may be arranged in parallel in one direction at a predetermined interval on the front cover of the chassis described above. For example, an optical cable connector and an optical cable for interconnection with other systems are connected to the ports at the ends of the optical modules exposed on the front cover of the chassis. When each optical module is connected to the optical module receptacle, the connection end of the optical module is connected to the connected portion of the receptacle connector mounted on the circuit board in the optical module receptacle. The connected portion of the receptacle connector is electrically connected to the circuit board described above. As a result, the optical cable connector and the optical cable are electrically connected to the circuit board via the transceiver module.

 また、光モジュール用リセプタクルのケージ(特許文献1においては、ガイドフレームと呼称されている)の上端部には、図9に示されるように、光モジュールから発生した熱をシャーシ内に放熱するためのヒートシンクが設けられている。ヒートシンクは、図2に示されるように、光モジュールが光モジュール用リセプタクルに接続される場合、光モジュールの外周面がケージの開口部を介して当接する隆起した伝熱面部を下端面に有している。ヒートシンクにおける伝熱面部の周縁は、ケージの上端面に形成される開口部の周縁に形成される枠部に受け止められ、クリップによりケージに保持されている。その際、そのクリップの両側部は、それぞれ、ケージの両側壁に形成される保持タブに係合されている。 Further, at the upper end of the optical module receptacle cage (referred to as a guide frame in Patent Document 1), as shown in FIG. 9, heat generated from the optical module is radiated into the chassis. A heat sink is provided. As shown in FIG. 2, when the optical module is connected to the optical module receptacle, the heat sink has a raised heat transfer surface portion on the lower end surface where the outer peripheral surface of the optical module abuts through the opening of the cage. ing. The periphery of the heat transfer surface portion of the heat sink is received by a frame portion formed at the periphery of the opening formed in the upper end surface of the cage, and is held in the cage by a clip. At that time, both side portions of the clip are respectively engaged with holding tabs formed on both side walls of the cage.

特表2005-520296号公報JP 2005-520296 A

 上述のヒートシンクの伝熱面部の面積は、放熱効率の観点からより大であることが要望される。 The area of the heat transfer surface of the heat sink described above is required to be larger from the viewpoint of heat dissipation efficiency.

 しかしながら、特許文献1にも示されるように、板金加工により成形されるケージにおいて、ヒートシンクがケージの上端面に形成される開口部の周縁に形成される枠部に受け止められる構成においては、枠部の所定の曲げ代が必要とされるのでヒートシンクにおける伝熱面部が通過する開口部の開口面積を大きくすることにも限界がある。 However, as shown in Patent Document 1, in a cage formed by sheet metal processing, in a configuration in which a heat sink is received by a frame portion formed at the periphery of an opening formed in the upper end surface of the cage, the frame portion Therefore, there is a limit to increasing the opening area of the opening through which the heat transfer surface portion of the heat sink passes.

 また、ヒートシンクがケージに配置されていない場合、光モジュールが光モジュール用リセプタクルに接続されるとき、ケージ内に挿入された光モジュールの外周面がヒートシンクの伝熱面部に案内されず、光モジュールの外周部とケージとの間の隙間によって挿入された光モジュールが適正な位置に位置決めされず、その結果、光モジュールの接続端部がリセプタクルコネクタの被接続部に円滑に接続されない虞がある。 Further, when the heat sink is not arranged in the cage, when the optical module is connected to the optical module receptacle, the outer peripheral surface of the optical module inserted into the cage is not guided to the heat transfer surface portion of the heat sink, and the optical module The optical module inserted by the gap between the outer peripheral portion and the cage is not positioned at an appropriate position, and as a result, the connection end portion of the optical module may not be smoothly connected to the connected portion of the receptacle connector.

 以上の問題点を考慮し、本発明は、ヒートシンクを備えるリセプタクルアッセンブリー、および、トランシーバモジュールアッセンブリーであって、ヒートシンクにおける伝熱面部の面積を、光モジュール用リセプタクルの光モジュール収容部に対し最大限に設定することができ、しかも、ヒートシンクがケージに配置されていない場合であっても、光モジュールの接続端部をリセプタクルコネクタの被接続部に円滑に接続できるリセプタクルアッセンブリー、および、トランシーバモジュールアッセンブリーを提供することを目的とする。 In view of the above problems, the present invention is a receptacle assembly including a heat sink, and a transceiver module assembly, wherein the heat transfer surface area of the heat sink is maximized with respect to the optical module housing portion of the optical module receptacle. A receptacle assembly and a transceiver module assembly that can be set and can smoothly connect the connection end of the optical module to the connected portion of the receptacle connector even when the heat sink is not disposed in the cage The purpose is to do.

 上述の目的を達成するために、本発明に係るヒートシンクを備えるリセプタクルアッセンブリーは、一方の端部に接続端部を有するモジュール基板を含む光モジュールが通過する少なくとも1つのモジュールスロットを一端に有し、光モジュールを着脱可能に収容し、光モジュールの下面に当接する底壁部を有する少なくとも1つのモジュール収容部と、モジュール収容部に連通しモジュール基板の接続端部が着脱可能に接続されるコネクタを収容する少なくとも1つのコネクタ収容部と、を含んでなるリセプタクル用ケージと、リセプタクル用ケージに選択的に配され、底壁部の面積に対応する面積を有する伝熱面を介して光モジュールの外周部に当接し光モジュールから発生した熱を放熱させるヒートシンクと、リセプタクル用ケージに配され、ヒートシンクがリセプタクル用ケージ配置される場合、ヒートシンクを光モジュールの着脱方向に沿って摺動可能に支持するヒートシンク支持機構と、リセプタクル用ケージに配され、ヒートシンクが配置されない場合、モジュールスロットを介して挿入された光モジュールの接続端部の先端部をコネクタに誘導するように光モジュールにおける接続端部よりもコネクタに向けて突出する外郭部の先端部に当接され先端部をコネクタ収容部内に案内するガイドプレート部材と、を備えて構成される。 To achieve the above object, a receptacle assembly including a heat sink according to the present invention has at least one module slot through which an optical module including a module substrate having a connection end at one end passes. An optical module is detachably accommodated, and at least one module accommodating portion having a bottom wall portion that contacts the lower surface of the optical module, and a connector that communicates with the module accommodating portion and is connected to the connection end of the module substrate in a detachable manner. An outer periphery of the optical module via a heat transfer surface selectively disposed on the receptacle cage and having an area corresponding to the area of the bottom wall. Heat sink and heat sink to dissipate the heat generated from the optical module. When the heat sink is placed in the receptacle cage, the heat sink support mechanism that slidably supports the heat sink along the mounting / removing direction of the optical module and the heat sink support mechanism that is placed in the receptacle cage and the heat sink is not arranged, the module slot is The tip of the connecting end of the optical module inserted through the connector is brought into contact with the tip of the outer portion protruding toward the connector from the connecting end of the optical module so that the tip is placed in the connector housing. And a guide plate member that guides.

 また、ガイドプレート部材は、コネクタ収容部の上方となる位置に切欠部を有し、ヒートシンクの伝熱面は、切欠部に挿入される延在部を有するものでもよい。ガイドプレート部材は、リセプタクル用ケージの側壁に固定されてもよい。ガイドプレート部材の内周面とコネクタを覆うコネクタカバーの外周面との間に、接続端部を保護する光モジュールの保護壁が挿入されるように隙間が形成されていてもよい。ガイドプレート部材は、リセプタクル用ケージにおけるヒートシンク支持機構の位置よりも低い位置に設けられるものでもよい。ガイドプレート部材の切欠部における光モジュールの着脱方向に対し直交する方向の幅は、光モジュールの保護壁における着脱方向に直交する幅よりも小であってもよい。 Further, the guide plate member may have a cutout portion at a position above the connector housing portion, and the heat transfer surface of the heat sink may have an extension portion inserted into the cutout portion. The guide plate member may be fixed to the side wall of the receptacle cage. A gap may be formed between the inner peripheral surface of the guide plate member and the outer peripheral surface of the connector cover that covers the connector so that a protective wall of the optical module that protects the connection end portion is inserted. The guide plate member may be provided at a position lower than the position of the heat sink support mechanism in the receptacle cage. The width in the direction orthogonal to the attaching / detaching direction of the optical module in the notch portion of the guide plate member may be smaller than the width orthogonal to the attaching / detaching direction in the protective wall of the optical module.

 本発明に係るトランシーバモジュールアッセンブリーは、一方の端部に接続端部を有するモジュール基板を含む光モジュールと、上述のリセプタクルアッセンブリーと、を備えて構成される。 A transceiver module assembly according to the present invention includes an optical module including a module substrate having a connection end at one end, and the above-described receptacle assembly.

 本発明に係るヒートシンクを備えるリセプタクルアッセンブリー、および、トランシーバモジュールアッセンブリーによれば、ヒートシンク支持機構が、リセプタクル用ケージに配され、ヒートシンクがリセプタクル用ケージ配置される場合、ヒートシンクを光モジュールの着脱方向に沿って摺動可能に支持するのでヒートシンクにおける伝熱面部の面積を、光モジュール用リセプタクルの光モジュール収容部に対し最大限に設定することができ、また、ガイドプレート部材が、リセプタクル用ケージに配され、ヒートシンクが配置されない場合、モジュールスロットを介して挿入された光モジュールの接続端部の先端部をコネクタに誘導するように光モジュールにおける接続端部よりもコネクタに向けて突出する外郭部の先端部に当接され先端部をコネクタ収容部内に案内するのでヒートシンクがケージに配置されていない場合であっても、光モジュールの接続端部をリセプタクルコネクタの被接続部に円滑に接続できる。 According to the receptacle assembly including the heat sink and the transceiver module assembly according to the present invention, when the heat sink support mechanism is arranged in the receptacle cage and the heat sink is arranged in the receptacle cage, the heat sink is arranged along the mounting direction of the optical module. Therefore, the area of the heat transfer surface portion of the heat sink can be set to the maximum with respect to the optical module housing portion of the optical module receptacle, and the guide plate member is arranged in the receptacle cage. When the heat sink is not arranged, the distal end of the outer portion protruding toward the connector rather than the connecting end of the optical module so as to guide the distal end of the connected end of the optical module inserted through the module slot to the connector Abutted against Since guides the tip into the connector receptacle even if the heat sink is not placed in the cage, the connecting end of the optical module can be smoothly connected to the connecting portion of the receptacle connector.

図1は、本発明に係るリセプタクルアッセンブリーの第1実施例を示す平面図である。FIG. 1 is a plan view showing a first embodiment of a receptacle assembly according to the present invention. 図2は、本発明に係るリセプタクルアッセンブリーの第1実施例を、ヒートシンクとともに示す斜視図である。FIG. 2 is a perspective view showing a first embodiment of a receptacle assembly according to the present invention together with a heat sink. 図3は、図2に示される例において用いられるヒートシンクを示す斜視図である。FIG. 3 is a perspective view showing a heat sink used in the example shown in FIG. 図4は、図2に示される例においてヒートシンクが装着された状態で要部を部分的に拡大して示す断面図である。FIG. 4 is a cross-sectional view showing a main part partially enlarged with the heat sink attached in the example shown in FIG. 図5は、図2に示される例において一部を部分的に拡大して示す斜視図である。FIG. 5 is a partially enlarged perspective view of the example shown in FIG. 図2に示される例における動作説明に供される部分的な斜視図である。FIG. 3 is a partial perspective view for explaining an operation in the example shown in FIG. 2. 図7Aは、図2に示される例における動作説明に供される部分的な断面図である。FIG. 7A is a partial cross-sectional view for explaining the operation in the example shown in FIG. 図7Bは、図2に示される例における動作説明に供される部分的な断面図である。FIG. 7B is a partial cross-sectional view for explaining the operation in the example shown in FIG. 図8は、本発明に係るリセプタクルアッセンブリーの第2実施例を示す斜視図である。FIG. 8 is a perspective view showing a second embodiment of the receptacle assembly according to the present invention. 図9は、図8に示される例において用いられるヒートシンクを示す斜視図である。FIG. 9 is a perspective view showing a heat sink used in the example shown in FIG. 図10Aは、図8に示される例における動作説明に供される部分的な断面図である。FIG. 10A is a partial cross-sectional view for explaining the operation in the example shown in FIG. 図10Bは、図8に示される例における動作説明に供される部分的な断面図である。FIG. 10B is a partial cross-sectional view for explaining the operation in the example shown in FIG.

 図2は、本発明に係るトランシーバモジュールアッセンブリーの一部を構成するリセプタクルアッセンブリーの第1実施例を所定の筐体の内部に配されるプリント配線基板とともに示す。なお、図2は、後述する光モジュール14およびヒートシンク26が取り外されている状態を示す。 FIG. 2 shows a first embodiment of a receptacle assembly which constitutes a part of a transceiver module assembly according to the present invention, together with a printed wiring board disposed inside a predetermined housing. FIG. 2 shows a state where an optical module 14 and a heat sink 26 described later are removed.

 密閉空間を内部に形成する筐体(不図示)は、トランシーバモジュールアッセンブリーが実装されるプリント配線基板16を内部に収容している。なお、図2において、4個のリセプタクル用ケージが一枚のプリント配線基板16に実装されているが、斯かる例に限られることなく、5個以上のリセプタクル用ケージが一枚のプリント配線基板16に実装されてもよい。 A case (not shown) that forms a sealed space accommodates a printed wiring board 16 on which a transceiver module assembly is mounted. In FIG. 2, four receptacle cages are mounted on one printed wiring board 16. However, the invention is not limited to such an example, and five or more receptacle cages are formed on one printed wiring board. 16 may be implemented.

 トランシーバモジュールアッセンブリーは、光モジュール14および光モジュール用リセプタクルアッセンブリーを含んで構成されている。 The transceiver module assembly includes an optical module 14 and an optical module receptacle assembly.

 光モジュール14は、外郭部を形成する金属製のアッパケースおよびロアプレートと、アッパケースとロアプレートとの間に形成される収容空間おける所定位置に位置決めされるモジュール基板と主な要素として含んで構成されている。 The optical module 14 includes, as main elements, a metal upper case and a lower plate that form an outer shell, a module substrate that is positioned at a predetermined position in a housing space formed between the upper case and the lower plate. It is configured.

 アッパ部材としてのアッパケースは、開口する下端を有している。アッパケースの一方の端部には、図4に示されるように、アッパケースの上面および両側面に連なって長手方向に突出する薄板状の保護壁143が門型に形成されている。保護壁143の先端部は、図4および図6に部分的に拡大されて示されるように、厚さ方向に丸みをもった円弧部を有している。なお、保護壁143の先端部は、斯かる例に限られることなく、例えば、図4において、面取りによる右斜め下方に向かう斜面部を有するものであってもよい。保護壁143は、光モジュール14が誤って落下された場合、後述するプラグコネクタ146を保護するためのものとされる。アッパケースの他方の端部には、ラッチ機構(不図示)が設けられている。ラッチ機構は、リリースプレートおよびラッチレバーを含んで構成されている。ラッチレバー(不図示)が、一方向に回動されるとき、リリースプレートの係止片が移動され後述するロック片129(図2参照)に対し離脱されアンロック状態とされる。また、ラッチレバーが、他方向に回動されるとき、リリースプレートの係止片が後述するリセプタクル用ケージ12のロック片129に対し係止される。これにより、光モジュール14がリセプタクル用ケージ12に対しロック状態とされる。 The upper case as the upper member has an open lower end. At one end of the upper case, as shown in FIG. 4, a thin plate-like protective wall 143 that is continuous with the upper surface and both side surfaces of the upper case and protrudes in the longitudinal direction is formed in a gate shape. The distal end portion of the protective wall 143 has an arc portion that is rounded in the thickness direction, as shown partially enlarged in FIGS. 4 and 6. In addition, the front-end | tip part of the protective wall 143 is not restricted to such an example, For example, in FIG. 4, you may have a slope part which goes to the diagonally downward direction by chamfering. The protective wall 143 is used to protect a plug connector 146 described later when the optical module 14 is accidentally dropped. A latch mechanism (not shown) is provided at the other end of the upper case. The latch mechanism includes a release plate and a latch lever. When a latch lever (not shown) is rotated in one direction, the locking piece of the release plate is moved and released from a lock piece 129 (see FIG. 2) described later to be unlocked. Further, when the latch lever is rotated in the other direction, the locking piece of the release plate is locked to the lock piece 129 of the receptacle cage 12 described later. As a result, the optical module 14 is locked with respect to the receptacle cage 12.

 モジュール基板は、一方の端部に、接続端部としてのプラグコネクタ146を構成する電極部を有している。プラグコネクタ146の先端部に形成される電極部の表面および裏面には、それぞれ、複数のコンタクトパッドが共通の平面上に所定の間隔で互いに平行に配列されている。 The module substrate has an electrode portion constituting a plug connector 146 as a connection end portion at one end portion. A plurality of contact pads are arranged in parallel with each other at a predetermined interval on a common plane on the front surface and the back surface of the electrode portion formed at the distal end portion of the plug connector 146.

 ロア部材としての板状のロアプレートは、上述のアッパケースの下端における開口を覆うようにアッパケースの下端に小ネジにより固定される。 The plate-like lower plate as the lower member is fixed to the lower end of the upper case with a small screw so as to cover the opening at the lower end of the upper case.

 光モジュール14の端部に設けられるポートには、光ケーブル(不図示)の一端に接続された光コネクタが接続されている。その光ケーブルの他端は、例えば、図示が省略される通信システムを構成する他の筐体の光コネクタに接続されている。 An optical connector connected to one end of an optical cable (not shown) is connected to a port provided at the end of the optical module 14. The other end of the optical cable is connected to, for example, an optical connector of another housing constituting a communication system (not shown).

 なお、上述のモジュール基板は、接続端部としてのプラグコネクタ146を有するものとされるが、斯かる例に限られることなく、例えば、モジュール基板が、プラグコネクタに代えて、接続端部としてカードエッジ端子を先端部に有するものでもよい。 The above-described module substrate has a plug connector 146 as a connection end. However, the present invention is not limited to such an example. For example, the module substrate may be replaced with a plug connector as a connection end. You may have an edge terminal in a front-end | tip part.

 光モジュール用リセプタクルアッセンブリーは、図2に示されるように、プリント配線基板16に配され上述の光モジュール14を着脱可能に収容するリセプタクル用ケージ12と、リセプタクル用ケージ12の各リセプタクルコネクタ収容部に収容されるリセプタクルコネクタ22と、各リセプタクルコネクタ22を個別に収容する複数個のコネクタ収容部を有するカバー24と、を主な要素として含んで構成される。 As shown in FIG. 2, the optical module receptacle assembly is disposed on the printed circuit board 16 in the receptacle cage 12 that detachably accommodates the optical module 14 described above, and in each receptacle connector accommodating portion of the receptacle cage 12. The main component includes a receptacle connector 22 to be accommodated and a cover 24 having a plurality of connector accommodating portions for individually accommodating the receptacle connectors 22.

 リセプタクル用ケージ12は、図2に示されるように、例えば、ステンレス鋼、または、りん青銅の薄板、好ましくは、熱伝導性のよいステンレス鋼、または、りん青銅でプレス加工により作られている。リセプタクル用ケージ12は、モジュール収容部およびリセプタクルコネクタ収容部からなる隔室121,122,123、および124を内側に有している。隔室121,122,123、および124は、図2において直交座標における光モジュール14の着脱方向に対し直交する方向に延びるY座標軸に沿って並列に配置されている。隔室121,122,123、および124は、それぞれ、互いに同一構造を有するので隔室121について説明し、他の隔室122,123、および124についての説明を省略する。 As shown in FIG. 2, the receptacle cage 12 is made of, for example, stainless steel or phosphor bronze thin plate, preferably stainless steel having high thermal conductivity, or phosphor bronze by pressing. The receptacle cage 12 has compartments 121, 122, 123, and 124 formed of a module housing portion and a receptacle connector housing portion inside. The compartments 121, 122, 123, and 124 are arranged in parallel along the Y coordinate axis extending in a direction orthogonal to the attaching / detaching direction of the optical module 14 in the orthogonal coordinates in FIG. 2. Since the compartments 121, 122, 123, and 124 have the same structure, the compartment 121 will be described, and the description of the other compartments 122, 123, and 124 will be omitted.

 隔室121におけるモジュール収容部は、所定の間隔をもって相対向する側壁126および仕切壁125と、その底壁部12BPと、により囲まれて形成されている。側壁126および仕切壁125は、図2におけるX座標軸、即ち、光モジュール14の着脱方向に沿って延在している。側壁126および仕切壁125は、それぞれ、ロック片129を後述するモジュールスロット近傍に有している。側壁126および仕切壁125におけるロック片129は、互いに向き合っている。各ロック片129は、上述の光モジュール14をモジュール収容部に対しロック状態とするように光モジュール14のリリースプレートの係止片に選択的に係合される。 The module housing portion in the compartment 121 is formed by being surrounded by the side wall 126 and the partition wall 125 facing each other with a predetermined interval and the bottom wall portion 12BP. The side wall 126 and the partition wall 125 extend along the X coordinate axis in FIG. 2, that is, the attaching / detaching direction of the optical module 14. Each of the side wall 126 and the partition wall 125 has a lock piece 129 in the vicinity of a module slot described later. The lock pieces 129 in the side wall 126 and the partition wall 125 face each other. Each lock piece 129 is selectively engaged with a locking piece of a release plate of the optical module 14 so that the optical module 14 is locked with respect to the module housing portion.

 モジュール収容部は、X座標軸方向に開口しているモジュールスロットを一端に有している。これにより、光モジュール14がモジュールスロットを通じて着脱される。略矩形の断面を有するモジュールスロットの全周縁には、筒状のフロントEMIフィンガー13が設けられている。また、仕切壁125にも、他のフロントEMIフィンガー(不図示)が設けられている。フロントEMIフィンガー13および他のフロントEMIフィンガーが、シールド部材を構成する。フロントEMIフィンガー13の内周部は、挿入される光モジュール14の外周部に当接し、また、フロントEMIフィンガー13の外周部は、例えば、上述の筐体の開口部の周縁に当接することとなる。 The module housing part has a module slot that opens in the X coordinate axis direction at one end. Thereby, the optical module 14 is attached and detached through the module slot. A cylindrical front EMI finger 13 is provided on the entire periphery of the module slot having a substantially rectangular cross section. The partition wall 125 is also provided with other front EMI fingers (not shown). The front EMI finger 13 and the other front EMI fingers constitute a shield member. The inner peripheral portion of the front EMI finger 13 is in contact with the outer peripheral portion of the optical module 14 to be inserted, and the outer peripheral portion of the front EMI finger 13 is in contact with, for example, the peripheral edge of the opening of the housing described above. Become.

 これにより、リセプタクル用ケージ12が筐体の開口部に圧入された場合、筐体の開口部とリセプタクル用ケージ12の外周部との隙間が金属製のフロントEMIフィンガー13を含んでなるシールド部材によりシールドされるのでノイズが、上述の筐体内に閉じ込められるとともに、光モジュール14の外周部とモジュール収容部の内周部との隙間を通じてノイズが外部に漏れ出す虞がないこととなる。 Thereby, when the receptacle cage 12 is press-fitted into the opening of the casing, the gap between the opening of the casing and the outer periphery of the receptacle cage 12 is caused by the shield member including the metal front EMI finger 13. Since it is shielded, the noise is confined in the above-described casing, and there is no possibility that the noise leaks to the outside through the gap between the outer peripheral portion of the optical module 14 and the inner peripheral portion of the module housing portion.

 また、モジュール収容部におけるモジュールスロットに向かい合う他端は、リセプタクルコネクタ収容部内に連通している。リセプタクル用ケージ12における底壁部12BPに向かい合う部分には、図2におけるZ座標軸に沿って開口する開口部が、形成されている。その開口部の周縁には、後述するヒートシンク26を着脱可能に支持するヒートシンク支持機構が設けられている。なお、ヒートシンク26を着脱可能に支持するヒートシンク支持機構は、隔室122,123、および124にも設けられている。これにより、各ヒートシンク26が、隔室121、122,123、および、隔室124の上述の開口部を塞ぐようにヒートシンク支持機構を介して選択的にリセプタクル用ケージ12に配置される。 Also, the other end of the module housing portion that faces the module slot communicates with the receptacle connector housing portion. An opening that opens along the Z-coordinate axis in FIG. 2 is formed in a portion of the receptacle cage 12 that faces the bottom wall 12BP. A heat sink support mechanism for detachably supporting a heat sink 26 described later is provided at the periphery of the opening. A heat sink support mechanism for detachably supporting the heat sink 26 is also provided in the compartments 122, 123, and 124. Thereby, each heat sink 26 is selectively disposed in the receptacle cage 12 via the heat sink support mechanism so as to close the above-described openings of the compartments 121, 122, 123 and the compartment 124.

 ヒートシンク26は、例えば、アルミニウム等の熱伝導率の良好な金属で作られている。ヒートシンク26は、所定の間隔をもってX座標軸に沿って互いに平行に配列される複数のフィン26Fi(i=1~n,nは正の整数)を有している。複数のフィン26Fiは、ヒートシンク支持機構に支持される基台部26Mの平坦面に対し略垂直に形成されている。その基台部26Mの両側部には、図3に拡大されて示されるように、それぞれ、一対のフランジ部26Fが所定の長さだけ向かい合って形成されている。複数のフィン26Fiの下端部が互いに連結された連結部とフランジ部26Fとの間には、細長い溝26GAが形成されている。細長い溝26GAは、側壁126の上端部に形成される屈曲片126S2、3個の押し付けばね126S1、および、仕切壁125の上端に設けられるトッププレート127の屈曲片127S2、3個の押し付けばね127S1に摺動可能に係合される。基台部26Mにおける長手方向の一端には、図3に拡大されて示されるように、押圧用端部26EFが、形成されている。押圧用端部26EFは、基台部26Mの中央部の幅に比して小なる幅を有し後述するリターン用板ばね12LFに当接する。また、基台部26Mにおける長手方向の他端には、延在部26ERが形成されている。延在部26ERは、基台部26Mの中央部の幅に比して小なる幅Hcを有しフランジ部26Fの一端部から基台部26Mにおける長手方向に沿って延びている。幅Hcは、後述するガイドプレート12RPのガイド片の相互間距離Lc(図1参照)よりも若干小に設定されている。延在部26ERの端面には、ヒートシンク26の装着時、後述するガイドプレート12RPの係止部に係止される溝26EGが形成されている。光モジュール14がリセプタクル用ケージ12内に装着された場合、延在部26ERを含む基台部26Mの伝熱面は、図4に示されるように、光モジュール14のアッパプレートおよび保護壁部143の表面に当接するので光モジュール14からの熱がヒートシンク26を通じて放熱される。その際、延在部26ERの伝熱面と保護壁部143の表面とが当接することにより、伝滅面積がより拡大するので光モジュール14をより効率よく冷却できることとなる。また、延在部26ERによりヒートシンク26の強度が向上することとなる。 The heat sink 26 is made of a metal having good thermal conductivity such as aluminum. The heat sink 26 has a plurality of fins 26Fi (i = 1 to n, n are positive integers) arranged in parallel with each other along the X coordinate axis at a predetermined interval. The plurality of fins 26Fi are formed substantially perpendicular to the flat surface of the base portion 26M supported by the heat sink support mechanism. As shown in an enlarged view in FIG. 3, a pair of flange portions 26F are formed on both sides of the base portion 26M so as to face each other by a predetermined length. An elongated groove 26GA is formed between the connecting portion where the lower ends of the plurality of fins 26Fi are connected to each other and the flange portion 26F. The elongated groove 26GA is formed on the bent pieces 126S2 and the three pressing springs 126S1 formed at the upper end of the side wall 126, and the bent pieces 127S2 and the three pressing springs 127S1 of the top plate 127 provided at the upper end of the partition wall 125. It is slidably engaged. At one end in the longitudinal direction of the base portion 26M, a pressing end portion 26EF is formed as shown in an enlarged manner in FIG. The pressing end portion 26EF has a width that is smaller than the width of the central portion of the base portion 26M, and abuts on a return leaf spring 12LF described later. Further, an extending portion 26ER is formed at the other end in the longitudinal direction of the base portion 26M. The extending part 26ER has a width Hc that is smaller than the width of the center part of the base part 26M, and extends from one end of the flange part 26F along the longitudinal direction of the base part 26M. The width Hc is set slightly smaller than the distance Lc (see FIG. 1) between guide pieces of a guide plate 12RP described later. A groove 26EG is formed on the end surface of the extending portion 26ER to be locked to a locking portion of a guide plate 12RP described later when the heat sink 26 is mounted. When the optical module 14 is mounted in the receptacle cage 12, the heat transfer surface of the base portion 26 </ b> M including the extending portion 26 </ b> ER has an upper plate and a protective wall portion 143 of the optical module 14 as shown in FIG. 4. The heat from the optical module 14 is dissipated through the heat sink 26. At this time, the heat transfer surface of the extension part 26ER and the surface of the protective wall part 143 come into contact with each other, so that the heat transfer area is further expanded, so that the optical module 14 can be cooled more efficiently. Further, the strength of the heat sink 26 is improved by the extending portion 26ER.

 上述したヒートシンク支持機構は、図2に示されるように、リセプタクル用ケージ12を構成する側壁126の最上端に形成される屈曲部に形成される屈曲片126S2、3個の押し付けばね126S1と、各仕切壁125の上端に設けられるトッププレート127に形成される屈曲片127S2、3個の押し付けばね127S1と、側壁128の最上端に形成される屈曲部に形成される屈曲片128S2、3個の押し付けばね128S1と、から構成されている。 As shown in FIG. 2, the heat sink support mechanism described above includes a bent piece 126S2, three pressing springs 126S1 formed at a bent portion formed at the uppermost end of the side wall 126 constituting the receptacle cage 12, Bending pieces 127S2 and three pressing springs 127S1 formed on the top plate 127 provided at the upper end of the partition wall 125, and three bending pieces 128S2 formed on the bending portion formed at the uppermost end of the side wall 128 and three pressings. And a spring 128S1.

 ヒートシンク固定手段として、リセプタクル用ケージ12の背面部に設けられるガイドプレート12RPと、ヒートシンク26の延在部26ERの溝26EGを、ガイドプレート12RPの係止部に向けて付勢する板ばね12LFとが、リセプタクル用ケージ12に設けられている。 As heat sink fixing means, there are a guide plate 12RP provided on the back surface of the receptacle cage 12, and a leaf spring 12LF for urging the groove 26EG of the extending portion 26ER of the heat sink 26 toward the engaging portion of the guide plate 12RP. The receptacle cage 12 is provided.

 側壁126の押し付けばね126S1および屈曲片126S2と仕切壁125の上端に設けられるトッププレート127とは、共通の平面上に所定の間隔をもって向かい合って形成されている。側壁126および128の一方の端および各仕切壁125の一方の端は、図2におけるY座標軸の沿って延びるガイドプレート12RPにより連結されている。 The pressing spring 126S1 and the bent piece 126S2 of the side wall 126 and the top plate 127 provided at the upper end of the partition wall 125 are formed to face each other at a predetermined interval on a common plane. One end of the side walls 126 and 128 and one end of each partition wall 125 are connected by a guide plate 12RP extending along the Y coordinate axis in FIG.

 ガイドプレート12RPは、側壁126および128の一方の端および各仕切壁125の一方の端に当接しリセプタクル用ケージ12の背面部を形成するカバー固定部と、カバー固定部の上端部に連なり形成されるガイド片12RT1、12RT2,12RT3,12RT4,および、12RT5と、から構成されている。 The guide plate 12RP is formed to be connected to one end of the side walls 126 and 128 and one end of each partition wall 125 to form a cover fixing portion that forms the back portion of the receptacle cage 12, and an upper end portion of the cover fixing portion. Guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5.

 そのカバー固定部の長手方向に沿った両端は、それぞれ、側壁126および128の外周部に係止されている。カバー固定部には、図5に拡大されて示されるように、一対のイジェクト用板バネ12RPSfが共通の直線上に形成されている。各一対のイジェクト用板バネ12RPSfは、隔室121,122,123,124にそれぞれ対応して形成されている。一対のイジェクト用板バネ12RPSfの下方の位置には、後述するカバー24の爪部が挿入される矩形の開口部が形成されている。これにより、カバー24がガイドプレート12RPに固定されることとなる。各一対のイジェクト用板バネ12RPSfは、装着された各光モジュール14の保護壁部143をリセプタクル用ケージ12から所定量だけモジュールスロットを介し外部に押し出すように付勢するものとされる。 Both ends along the longitudinal direction of the cover fixing portion are locked to the outer peripheral portions of the side walls 126 and 128, respectively. As shown in an enlarged view in FIG. 5, the cover fixing portion is formed with a pair of ejecting leaf springs 12 RPSf on a common straight line. Each pair of ejecting leaf springs 12RPSf is formed to correspond to the compartments 121, 122, 123, and 124, respectively. A rectangular opening into which a claw portion of a cover 24 described later is inserted is formed at a position below the pair of ejection plate springs 12RPSf. Thereby, the cover 24 is fixed to the guide plate 12RP. Each pair of ejecting leaf springs 12RPSf urges the protective wall portion 143 of each mounted optical module 14 to be pushed out of the receptacle cage 12 by a predetermined amount to the outside through the module slot.

 ガイド片12RT1、12RT2,12RT3,12RT4,および、12RT5は、図1に示されるように、側壁126および128の一方の端の上部および各仕切壁125の一方の端の上部に載置され係止されている。ガイド片12RT1、12RT2,12RT3,12RT4,および、12RT5は、それぞれ、互いに平行に形成され、屈曲片126S2、127S2,128S2に向かって所定距離だけ延びている。ガイド片12RT1、12RT2,12RT3,12RT4,および、12RT5の先端部は、それぞれ、図1に示されるように、屈曲片126S2、屈曲片127S2、屈曲片128S2の端部から所定距離Ldだけ離隔した位置に形成されている。これにより、図2に拡大されて示されるように、押圧用端部26EFがモジュール収容部内に向かって左斜め下方に傾けられた状態において、屈曲片126S2、屈曲片127S2および128S2が、それぞれ、ヒートシンク26の各細長い溝26GAに容易に挿入される。 As shown in FIG. 1, the guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5 are placed and locked on the upper part of one end of the side walls 126 and 128 and the upper part of one end of each partition wall 125, respectively. Has been. The guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5 are formed in parallel to each other and extend a predetermined distance toward the bent pieces 126S2, 127S2, and 128S2. As shown in FIG. 1, the tip portions of the guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5 are positions separated from the ends of the bent piece 126S2, the bent piece 127S2, and the bent piece 128S2, respectively, by a predetermined distance Ld. Is formed. As a result, as shown in FIG. 2 in an enlarged manner, the bent piece 126S2, the bent pieces 127S2 and 128S2 are respectively heat sinks in a state in which the pressing end portion 26EF is inclined obliquely to the left and downward toward the module housing portion. It is easily inserted into each of the 26 elongated grooves 26GA.

 ガイド片12RT1およびガイド片12RT2の一端、ガイド片12RT2およびガイド片12RT3の一端、ガイド片12RT3およびガイド片12RT4の一端、ガイド片12RT4およびガイド片12RT5の一端は、それぞれ、所定距離Lcの間隔をもって向かい合い互いに連結されている。所定距離Lcは、光モジュール14の保護壁部143の幅よりも若干小に設定されている。これにより、それらの相互間に切欠部が形成される。また、ガイド片12RT2、ガイド片12RT3、および、ガイド片12RT4は、それぞれ、隣接する隔室に突出している。 One end of the guide piece 12RT1 and the guide piece 12RT2, one end of the guide piece 12RT2 and the guide piece 12RT3, one end of the guide piece 12RT3 and the guide piece 12RT4, and one end of the guide piece 12RT4 and the guide piece 12RT5 face each other with a predetermined distance Lc. Are connected to each other. The predetermined distance Lc is set slightly smaller than the width of the protective wall portion 143 of the optical module 14. Thereby, a notch is formed between them. Further, the guide piece 12RT2, the guide piece 12RT3, and the guide piece 12RT4 each protrude into the adjacent compartment.

 ガイド片12RT1およびガイド片12RT2の相互間、ガイド片12RT2およびガイド片12RT3の相互間、ガイド片12RT3およびガイド片12RT4の相互間、ガイド片12RT4およびガイド片12RT5の相互間には、上述のヒートシンク26の延在部26ERが挿入される。ガイド片12RT1およびガイド片12RT2の一端、ガイド片12RT2およびガイド片12RT3の一端、ガイド片12RT3およびガイド片12RT4の一端、ガイド片12RT4およびガイド片12RT5の一端の相互間の部分は、それぞれ、上述のヒートシンク26の延在部26ERの溝26EGが係止される係止部とされる。 The heat sink 26 described above is provided between the guide piece 12RT1 and the guide piece 12RT2, between the guide piece 12RT2 and the guide piece 12RT3, between the guide piece 12RT3 and the guide piece 12RT4, and between the guide piece 12RT4 and the guide piece 12RT5. The extended portion 26ER is inserted. The one end of the guide piece 12RT1 and the guide piece 12RT2, the one end of the guide piece 12RT2 and the guide piece 12RT3, the one end of the guide piece 12RT3 and the guide piece 12RT4, and the portion between the one end of the guide piece 12RT4 and the guide piece 12RT5 are respectively described above. The groove 26EG of the extending portion 26ER of the heat sink 26 is a locking portion that is locked.

 ガイド片12RT1と一体に形成される屈曲部12RSおよびガイド片12RT5と一体に形成される屈曲部(不図示)は、それぞれ、側壁126および128の外周部に係止されている。 The bent portion 12RS formed integrally with the guide piece 12RT1 and the bent portion (not shown) formed integrally with the guide piece 12RT5 are locked to the outer peripheral portions of the side walls 126 and 128, respectively.

 ガイド片12RT1、12RT2,12RT3,12RT4,および、12RT5の位置は、図7Aおよび図7Bに示されるように、トッププレート127の位置よりも所定の寸法ΔHだけ低い位置に設定されている。また、ガイド片12RT1、12RT2,12RT3,12RT4,および、12RT5の内周部とカバー24の外周部の上面との間の距離ΔGaは、光モジュール14の保護壁部143の厚さTよりも大に設定されている。また、距離ΔGaは、保護壁143がガイド片12RT1とカバー24の外周部の上面との間に挿入された場合、保護壁143の上面とガイド片12RT1の内周面との間の隙間が、カバー24のスリットとプラグコネクタ146との間の隙間よりも大となるように設定されている。 The positions of the guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5 are set to positions that are lower than the position of the top plate 127 by a predetermined dimension ΔH, as shown in FIGS. 7A and 7B. Further, the distance ΔGa between the inner peripheral portion of the guide pieces 12RT1, 12RT2, 12RT3, 12RT4, and 12RT5 and the upper surface of the outer peripheral portion of the cover 24 is larger than the thickness T of the protective wall portion 143 of the optical module 14. Is set to The distance ΔGa is such that when the protective wall 143 is inserted between the guide piece 12RT1 and the upper surface of the outer periphery of the cover 24, the gap between the upper surface of the protective wall 143 and the inner peripheral surface of the guide piece 12RT1 is It is set to be larger than the gap between the slit of the cover 24 and the plug connector 146.

 側壁126の屈曲部には、図1および図2に示されるように、ヒートシンク26の一方のフランジ部26Fを下方に向けて付勢する押し付けばね126S1が共通の直線上に所定の間隔をもって3箇所に形成されている。各押し付けばね126S1の基端は、側壁126の屈曲部と一体に形成され、各押し付けばね126S1の末端は、屈曲片126S2に向かって延び、Z座標軸に沿って弾性変位可能な折曲部を有している。その折曲部は、ヒートシンク26の各細長い溝26GAの高さに対応する曲率を有している。 As shown in FIG. 1 and FIG. 2, the bent portion of the side wall 126 has three pressing springs 126S1 that urge one flange portion 26F of the heat sink 26 downward with a predetermined interval on a common straight line. Is formed. The base end of each pressing spring 126S1 is formed integrally with the bent portion of the side wall 126, and the end of each pressing spring 126S1 extends toward the bent piece 126S2 and has a bent portion that can be elastically displaced along the Z coordinate axis. is doing. The bent portion has a curvature corresponding to the height of each elongated groove 26GA of the heat sink 26.

 トッププレート127にも、ヒートシンク26の他方のフランジ部26Fを付勢する押し付けばね127S1が共通の直線上に所定の間隔をもって3箇所に形成されている。各押し付けばね127S1の基端は、トッププレート127と一体に形成され、各押し付けばね127S1の末端は、屈曲片127S2に向かって延び、Z座標軸に沿って弾性変位可能な折曲部を有している。その折曲部は、ヒートシンク26の各細長い溝26GAの高さに対応する曲率を有している。これにより、ヒートシンク26が装着されない場合、光モジュール14が挿入されたときであっても、光モジュール14が、押し付けばね126S1、押し付けばね127S1に干渉することなく、折曲部が座屈する虞がない。 Also on the top plate 127, pressing springs 127S1 for urging the other flange portion 26F of the heat sink 26 are formed at three positions on the common straight line with a predetermined interval. The base end of each pressing spring 127S1 is formed integrally with the top plate 127, and the end of each pressing spring 127S1 extends toward the bent piece 127S2 and has a bent portion that can be elastically displaced along the Z coordinate axis. Yes. The bent portion has a curvature corresponding to the height of each elongated groove 26GA of the heat sink 26. Thereby, when the heat sink 26 is not attached, even when the optical module 14 is inserted, the optical module 14 does not interfere with the pressing spring 126S1 and the pressing spring 127S1, and there is no possibility that the bent portion is buckled. .

 側壁126および仕切壁125の他方の端および側壁128の他方の端は、モジュールスロットの周縁を形成するフロントEMIフィンガー13が設けられる連結部により連結されている。その連結部におけるガイドプレート12RPの各係止部に向かい合う部分には、リターン用板ばね12LFが一体に形成されている。リターン用板ばね12LFは、X座標軸に沿って弾性変位可能な可動片を有している。リターン用板ばね12LFの可動片は、ヒートシンク26全体を上述のガイドプレート12RPの各係止部に向けて付勢するものとされる。なお、リターン用板ばね12LFは、斯かる例に限られることなく、例えば、リターン用板ばね12LFが別個に成形され、それが連結部に固定されるように構成されてもよい。 The other end of the side wall 126 and the partition wall 125 and the other end of the side wall 128 are connected by a connecting portion provided with a front EMI finger 13 that forms the periphery of the module slot. A return leaf spring 12LF is integrally formed at a portion of the connecting portion facing each locking portion of the guide plate 12RP. The return leaf spring 12LF has a movable piece that can be elastically displaced along the X coordinate axis. The movable piece of the return leaf spring 12LF urges the entire heat sink 26 toward each locking portion of the guide plate 12RP. The return leaf spring 12LF is not limited to such an example. For example, the return leaf spring 12LF may be formed separately and fixed to the connecting portion.

 側壁126および仕切壁125の下端を連結している底壁部12BPにおける端部は、プリント配線基板16の実装面に当接している。また、底壁部12BPにおける端部は、プリント配線基板16の実装面に形成される環状の接地用コンタクトパッドの一辺に当接している。これにより、リセプタクル用ケージ12が接地される。 The end of the bottom wall portion 12BP connecting the side wall 126 and the lower end of the partition wall 125 is in contact with the mounting surface of the printed wiring board 16. Further, the end portion of the bottom wall portion 12BP is in contact with one side of an annular grounding contact pad formed on the mounting surface of the printed wiring board 16. As a result, the receptacle cage 12 is grounded.

 側壁126、仕切壁125、および側壁128の下端には、それぞれ、複数個のプレスフィット用爪部Taが所定の間隔で形成されている。各プレスフィット用爪部Taは、図2に示されるように、プレスフィット用爪部Taの配列に対応してプリント配線基板16の表面に形成される各細孔に圧入される。これにより、リセプタクル用ケージ12の下端面がプリント配線基板16の表面に密着固定される。 A plurality of press-fit claw portions Ta are formed at predetermined intervals on the lower ends of the side wall 126, the partition wall 125, and the side wall 128, respectively. As shown in FIG. 2, each press-fit claw portion Ta is press-fitted into each pore formed on the surface of the printed wiring board 16 corresponding to the arrangement of the press-fit claw portions Ta. As a result, the lower end surface of the receptacle cage 12 is tightly fixed to the surface of the printed wiring board 16.

 プリント配線基板16の表面に向けて開口するリセプタクルコネクタ収容部は、リセプタクル用ケージ12におけるモジュールスロットに向き合うリセプタクルコネクタ側閉端部と、側壁126および仕切壁125のリセプタクルコネクタ側部分とにより囲まれて形成されている。 The receptacle connector housing portion that opens toward the surface of the printed wiring board 16 is surrounded by the receptacle connector side closed end facing the module slot in the receptacle cage 12 and the receptacle connector side portion of the side wall 126 and the partition wall 125. Is formed.

 リセプタクル用ケージ12の側面および背面の外周部にそれぞれ、リセプタクル用ケージ12をプリント配線基板16の実装面にねじ止めするための複数のフランジ部が設けられている。 A plurality of flange portions for screwing the receptacle cage 12 to the mounting surface of the printed wiring board 16 are provided on the outer sides of the side surface and the rear surface of the receptacle cage 12.

 カバー24は、例えば、金属材料でダイキャスト成形により一体に作られ、リセプタクル用ケージ12の隔室121,122,123、および124内にそれぞれ挿入される分画部分が互いに連結されて形成される外郭部を有している。その外郭部は、互いに向かい合う一対の側壁と、一方の側壁の上端部と他方の側壁の上端部とを連結する天板部とから構成されている。カバー24における各モジュール収容部に向き合う部分には、それぞれ、光モジュール14のプラグコネクタ146の先端部が通過するスリットが形成されている。 The cover 24 is made of, for example, a metal material by die casting, and is formed by connecting fraction portions inserted into the compartments 121, 122, 123, and 124 of the receptacle cage 12 to each other. It has an outer part. The outer shell portion is composed of a pair of side walls facing each other, and a top plate portion connecting the upper end portion of one side wall and the upper end portion of the other side wall. In the portion of the cover 24 that faces each module housing portion, a slit through which the tip of the plug connector 146 of the optical module 14 passes is formed.

 カバー24における隣接する隔室121,122内にそれぞれ挿入される部分の境界部分には、仕切壁125に対応した溝が形成されている。また、隣接する隔室122、123内にそれぞれ挿入される部分の境界部分にも、仕切壁125に対応した溝が形成されている。さらに、隣接する隔室123、124内にそれぞれ挿入される部分の境界部分にも、仕切壁125に対応した溝が形成されている。各溝には、光モジュール14がリセプタクル用ケージ12に挿入された場合、仕切壁125を挟んで隣接する各光モジュール14のアッパケースにおける一方の側壁が挿入されることとなる。これにより、各光モジュール14がカバー24に対し精度よく位置決めされることとなる。 A groove corresponding to the partition wall 125 is formed at the boundary portion between the portions of the cover 24 inserted into the adjacent compartments 121 and 122. Further, a groove corresponding to the partition wall 125 is also formed at the boundary portion between the portions inserted into the adjacent compartments 122 and 123. Furthermore, a groove corresponding to the partition wall 125 is also formed in a boundary portion between portions inserted into the adjacent compartments 123 and 124. When the optical module 14 is inserted into the receptacle cage 12 in each groove, one side wall of the upper case of each optical module 14 adjacent to the partition wall 125 is inserted. As a result, each optical module 14 is accurately positioned with respect to the cover 24.

 カバー24の外郭部の背面部には、図4に拡大されて示されるように、複数の爪部24nが形成されている。複数の爪部24nは、それぞれ、リセプタクルコネクタ側閉端部を形成する上述のガイドプレート12RPの各開口部に係合される。 A plurality of claw portions 24n are formed on the back surface of the outer portion of the cover 24 as shown in an enlarged view in FIG. Each of the plurality of claw portions 24n is engaged with each opening portion of the above-described guide plate 12RP that forms the receptacle connector side closed end portion.

 カバー24における隔室121,122,123、および124内にそれぞれ挿入される分画部分の内側には、それぞれ、コネクタ収容部が形成されている。隣接したコネクタ収容部相互間は、それぞれ、仕切壁で仕切られている。 Connector accommodating portions are respectively formed inside the fraction portions inserted into the compartments 121, 122, 123, and 124 in the cover 24, respectively. Adjacent connector housing portions are each partitioned by a partition wall.

 カバー24における分画部分の内側にそれぞれ、配されるリセプタクルコネクタは、互いに同一の構造を有する。リセプタクルコネクタ22は、図4に拡大されて示されるように、光モジュール14のプラグコネクタ146が着脱可能に挿入されるスロットを有するコネクタインシュレータと、複数のコンタクト端子CT1およびCT2とを含んで構成されている。 The receptacle connectors arranged inside the fractional portion of the cover 24 have the same structure. As shown in an enlarged view in FIG. 4, the receptacle connector 22 includes a connector insulator having a slot into which the plug connector 146 of the optical module 14 is detachably inserted, and a plurality of contact terminals CT1 and CT2. ing.

 コンタクト端子CT1およびCT2は、それぞれ、光モジュール14のプラグコネクタ146をプリント配線基板16の導体パターンに接続される電極群に電気的に接続するものとされる。コネクタインシュレータの底部には、プリント配線基板16の位置決め孔に嵌合される位置決めピン(不図示)が複数個形成されている。 The contact terminals CT1 and CT2 are to electrically connect the plug connector 146 of the optical module 14 to an electrode group connected to the conductor pattern of the printed wiring board 16, respectively. A plurality of positioning pins (not shown) that fit into the positioning holes of the printed wiring board 16 are formed on the bottom of the connector insulator.

 斯かる構成において、各ヒートシンク26をガイドプレート12RP側からリセプタクル用ケージ12の各隔室に固定するにあたっては、取り付け作業は、同様な取り付け作業となるので隔室121についての取り付け作業について代表的に説明し、その他の隔室についての取り付け作業の説明については省略する。 In such a configuration, when the heat sinks 26 are fixed to the compartments of the receptacle cage 12 from the guide plate 12RP side, the attachment work is the same as the attachment work. Explanation will be omitted, and description of the attachment work for other compartments will be omitted.

 先ず、図2に示されるように、屈曲片126S2と屈曲片127S2とが、それぞれ、開口部を通じてヒートシンク26の細長い溝26GAの開口端に挿入されるように、ヒートシンク26の姿勢がモジュール収容部に対し傾けられる。次に、各押し付けばね126S1、各押し付けばね127S1がヒートシンク26の細長い溝26GAに挿入されるように、ヒートシンク26が、その進行方向の押圧用端部26EFがリターン用板ばね12LFの可動片に当接した後、リターン用板ばね12LFの可動片の弾性力に抗してさらに押し込まれる。その際、ガイドプレート12RPの係止部と延在部26ERの端面との間に所定の隙間が形成される。また、ヒートシンク26の挿入時、溝26GAの高さに対応した大きさの屈曲部から溝26GAに挿入されるので押し付けばね126S1および押し付けばね127S1は、変形する虞がない。 First, as shown in FIG. 2, the posture of the heat sink 26 is set to the module housing portion so that the bent piece 126S2 and the bent piece 127S2 are respectively inserted into the opening ends of the elongated grooves 26GA of the heat sink 26 through the openings. Tilt against. Next, the heat sink 26 has its pressing end 26EF in the moving direction against the movable piece of the return leaf spring 12LF so that each pressing spring 126S1 and each pressing spring 127S1 is inserted into the elongated groove 26GA of the heat sink 26. After the contact, the return leaf spring 12LF is further pushed against the elastic force of the movable piece. At that time, a predetermined gap is formed between the locking portion of the guide plate 12RP and the end surface of the extending portion 26ER. Further, when the heat sink 26 is inserted, the pressing spring 126S1 and the pressing spring 127S1 are not likely to be deformed because the heat sink 26 is inserted into the groove 26GA from a bent portion having a size corresponding to the height of the groove 26GA.

 そして、ヒートシンク26が解放されるとき、延在部26ERの溝26EGが係止部に対しロック状態とされる。これにより、ヒートシンク26の取り付けが完了する。 And when the heat sink 26 is released, the groove 26EG of the extending part 26ER is locked with respect to the engaging part. Thereby, the attachment of the heat sink 26 is completed.

 一方、ヒートシンク26をリセプタクル用ケージ12に対しアンロック状態とし取り外す場合、先ず、ヒートシンク26がリターン用板ばね12LFの可動片の弾性力に抗して押し込まれ、延在部26ERの溝26EGが係止部に対しアンロック状態とされる。次に、延在部26ERの端面と係止部との間に所定の隙間が形成された後、ヒートシンク26の端が真上に引き上げられることにより、ヒートシンク26がリセプタクル用ケージ12に対し取り外される。 On the other hand, when removing the heat sink 26 from the receptacle cage 12 in an unlocked state, first, the heat sink 26 is pushed against the elastic force of the movable piece of the return leaf spring 12LF, and the groove 26EG of the extending portion 26ER is engaged. It is made into an unlocking state with respect to a stop part. Next, after a predetermined gap is formed between the end surface of the extending portion 26ER and the locking portion, the end of the heat sink 26 is pulled up directly, whereby the heat sink 26 is removed from the receptacle cage 12. .

 また、図7Aに拡大されて示されるように、ヒートシンク26がリセプタクル用ケージ12に対し取り外された状態において、光モジュール14がリセプタクル用ケージ12の隔室121に対し挿入された場合、仮に光モジュール14の保護壁部143が浮き上がった姿勢で挿入された場合であっても、光モジュール14の保護壁部143の先端部がガイドプレート12RPのガイド片12RT1および12RT2の端部に当接することより、図7Bに示されるように、保護壁部143の先端部が矢印の示す方向に押し下げられ、ガイド片12RT1および12RT2の下方の隙間に案内された後、矢印の示す方向に沿って一対のイジェクト用板バネ12RPSfの付勢力に抗して押し込まれることとなる。これにより、光モジュール14のプラグコネクタ146が、破損することなく、リセプタクルコネクタ22に円滑に接続されることとなる。 7A, when the optical module 14 is inserted into the compartment 121 of the receptacle cage 12 in a state where the heat sink 26 is removed from the receptacle cage 12, as shown in FIG. 14 even when the protective wall portion 143 of the optical module 14 is inserted in a lifted posture, the tip of the protective wall portion 143 of the optical module 14 abuts against the end portions of the guide pieces 12RT1 and 12RT2 of the guide plate 12RP. As shown in FIG. 7B, the distal end portion of the protective wall portion 143 is pushed down in the direction indicated by the arrow, guided to the gap below the guide pieces 12RT1 and 12RT2, and then a pair of ejectors along the direction indicated by the arrow. It will be pushed against the urging force of the leaf spring 12RPSf. As a result, the plug connector 146 of the optical module 14 is smoothly connected to the receptacle connector 22 without being damaged.

 図8は、本発明に係るトランシーバモジュールアッセンブリーの一部を構成するリセプタクルアッセンブリーの第2実施例を所定の筐体の内部に配されるプリント配線基板とともに示す。 FIG. 8 shows a second embodiment of a receptacle assembly that constitutes a part of a transceiver module assembly according to the present invention, together with a printed wiring board disposed inside a predetermined housing.

 なお、図8は、複数個の光モジュール14および後述する複数のヒートシンクが取り外されている状態を示す。また、図8乃至図10Bにおいては、図2に示される例における同一の構成要素について同一の符号を付して示し、その重複説明を省略する。なお、図8において、4個のリセプタクル用ケージが一枚のプリント配線基板16に実装されているが、斯かる例に限られることなく、5個以上のリセプタクル用ケージが一枚のプリント配線基板16に実装されてもよい。 FIG. 8 shows a state where a plurality of optical modules 14 and a plurality of heat sinks described later are removed. 8 to 10B, the same components in the example shown in FIG. 2 are denoted by the same reference numerals, and redundant description thereof is omitted. In FIG. 8, four receptacle cages are mounted on one printed wiring board 16, but the present invention is not limited to this example, and five or more receptacle cages are formed on one printed wiring board. 16 may be implemented.

 トランシーバモジュールアッセンブリーは、上述の光モジュール14および光モジュール用リセプタクルアッセンブリーを含んで構成されている。 The transceiver module assembly includes the above-described optical module 14 and the optical module receptacle assembly.

 光モジュール用リセプタクルアッセンブリーは、図8に示されるように、プリント配線基板16に配され上述の光モジュール14を着脱可能に収容するリセプタクル用ケージ32と、リセプタクル用ケージ32のリセプタクルコネクタ収容部に収容されるリセプタクルコネクタ22と、リセプタクルコネクタ22を個別に収容する複数個のコネクタ収容部を有するカバー24と、を主な要素として含んで構成される。 As shown in FIG. 8, the optical module receptacle assembly is accommodated in a receptacle cage 32 that is arranged on a printed wiring board 16 and detachably accommodates the optical module 14 described above, and a receptacle connector accommodating portion of the receptacle cage 32. The receptacle connector 22 and the cover 24 having a plurality of connector accommodating portions for individually accommodating the receptacle connectors 22 are included as main elements.

 リセプタクル用ケージ32は、図8に示されるように、例えば、ステンレス鋼、または、りん青銅の薄板、好ましくは、熱伝導性のよいステンレス鋼、または、りん青銅でプレス加工により作られている。リセプタクル用ケージ32は、モジュール収容部およびリセプタクルコネクタ収容部からなる隔室321,322,323、および324を内側に有している。隔室321,322,323、および324は、図8において直交座標における光モジュール14の着脱方向に対し直交する方向に延びるY座標軸に沿って並列に配置されている。隔室321,322,323、および324は、それぞれ、互いに同一構造を有するので隔室321について説明し、他の隔室322,323、および324についての説明を省略する。 As shown in FIG. 8, the receptacle cage 32 is made of, for example, a stainless steel or phosphor bronze thin plate, preferably stainless steel or phosphor bronze having good thermal conductivity, by pressing. The receptacle cage 32 has compartments 321, 322, 323, and 324 including a module housing portion and a receptacle connector housing portion inside. The compartments 321, 322, 323, and 324 are arranged in parallel along the Y coordinate axis that extends in a direction orthogonal to the attaching / detaching direction of the optical module 14 in orthogonal coordinates in FIG. 8. Since the compartments 321, 322, 323, and 324 have the same structure, the compartment 321 will be described, and the description of the other compartments 322, 323, and 324 will be omitted.

 隔室321におけるモジュール収容部は、所定の間隔をもって相対向する側壁326および仕切壁325と、その底壁部32BPと、により囲まれて形成されている。側壁326および仕切壁325は、図2におけるX座標軸、即ち、光モジュール14の着脱方向に沿って延在している。側壁326および仕切壁325は、それぞれ、ロック片329を後述するモジュールスロット近傍に有している。側壁326および仕切壁325におけるロック片329は、互いに向き合っている。各ロック片329は、上述の光モジュール14をモジュール収容部に対しロック状態とするように光モジュール14のリリースプレートの係止片に選択的に係合される。 The module housing portion in the compartment 321 is formed by being surrounded by a side wall 326 and a partition wall 325 facing each other with a predetermined interval, and a bottom wall portion 32BP. The side wall 326 and the partition wall 325 extend along the X coordinate axis in FIG. 2, that is, the attaching / detaching direction of the optical module 14. Each of the side wall 326 and the partition wall 325 has a lock piece 329 in the vicinity of a module slot described later. The lock pieces 329 in the side wall 326 and the partition wall 325 face each other. Each lock piece 329 is selectively engaged with a locking piece of a release plate of the optical module 14 so that the optical module 14 is locked with respect to the module housing portion.

 モジュール収容部は、X座標軸方向に開口しているモジュールスロットを一端に有している。これにより、光モジュール14がモジュールスロットを通じて着脱される。略矩形の断面を有するモジュールスロットの全周縁には、筒状のフロントEMIフィンガー13が設けられている。また、仕切壁325にも、他のフロントEMIフィンガー(不図示)が設けられている。フロントEMIフィンガー13および他のフロントEMIフィンガーが、シールド部材を構成する。フロントEMIフィンガー13の内周部は、挿入される光モジュール14の外周部に当接し、また、フロントEMIフィンガー13の外周部は、例えば、上述の筐体の開口部の周縁に当接することとなる。 The module housing part has a module slot that opens in the X coordinate axis direction at one end. Thereby, the optical module 14 is attached and detached through the module slot. A cylindrical front EMI finger 13 is provided on the entire periphery of the module slot having a substantially rectangular cross section. The partition wall 325 is also provided with other front EMI fingers (not shown). The front EMI finger 13 and the other front EMI fingers constitute a shield member. The inner peripheral portion of the front EMI finger 13 is in contact with the outer peripheral portion of the optical module 14 to be inserted, and the outer peripheral portion of the front EMI finger 13 is in contact with, for example, the peripheral edge of the opening of the housing described above. Become.

 これにより、リセプタクル用ケージ32が筐体の開口部に圧入された場合、筐体の開口部とリセプタクル用ケージ32の外周部との隙間が金属製のフロントEMIフィンガー13を含んでなるシールド部材によりシールドされるのでノイズが、上述の筐体内に閉じ込められるとともに、光モジュール14の外周部とモジュール収容部の内周部との隙間を通じてノイズが外部に漏れ出す虞がないこととなる。 Thereby, when the receptacle cage 32 is press-fitted into the opening of the housing, the gap between the opening of the housing and the outer periphery of the receptacle cage 32 is caused by the shield member including the metal front EMI finger 13. Since it is shielded, the noise is confined in the above-described casing, and there is no possibility that the noise leaks to the outside through the gap between the outer peripheral portion of the optical module 14 and the inner peripheral portion of the module housing portion.

 また、モジュール収容部におけるモジュールスロットに向かい合う他端は、リセプタクルコネクタ収容部内に連通している。リセプタクル用ケージ32における底壁部32BPに向かい合う部分には、図8におけるZ座標軸に沿って開口する開口部が、形成されている。その開口部の周縁には、後述するヒートシンク36を着脱可能に支持するヒートシンク支持機構が設けられている。なお、ヒートシンク36を着脱可能に支持するヒートシンク支持機構は、隔室322,323、および324にも設けられている。これにより、各ヒートシンク36が、隔室321、322,323、および、隔室324の上述の開口部を塞ぐようにヒートシンク支持機構を介して選択的にリセプタクル用ケージ32に配置される。 Also, the other end of the module housing portion that faces the module slot communicates with the receptacle connector housing portion. In the portion of the receptacle cage 32 facing the bottom wall portion 32BP, an opening that opens along the Z coordinate axis in FIG. 8 is formed. A heat sink support mechanism that detachably supports a heat sink 36 to be described later is provided at the periphery of the opening. A heat sink support mechanism that detachably supports the heat sink 36 is also provided in the compartments 322, 323, and 324. Thereby, each heat sink 36 is selectively disposed in the receptacle cage 32 via the heat sink support mechanism so as to close the above-described openings of the compartments 321, 322, 323 and the compartment 324.

 ヒートシンク36は、例えば、アルミニウム等の熱伝導率の良好な金属で作られている。ヒートシンク36は、図9に拡大されて示されるように、所定の間隔をもってX座標軸に沿って互いに平行に配列される複数のフィン36Fi(i=1~n,nは正の整数)を有している。複数のフィン36Fiは、ヒートシンク支持機構に支持される基台部36Mの平坦面に対し略垂直に形成されている。その基台部36Mの両側部には、それぞれ、一対のフランジ部36Fが所定の長さだけ向かい合って形成されている。複数のフィン36Fiの下端部が互いに連結された連結部とフランジ部36Fとの間には、細長い溝36GAが形成されている。細長い溝36GAは、側壁326の上端部に形成される屈曲片326S2、2個の押し付けばね326S1、および、仕切壁325の上端に設けられるトッププレート327の屈曲片327S2、2個の押し付けばね327S1に摺動可能に係合される。基台部36Mにおける長手方向の一端には、押圧用端部36EFが、形成されている。押圧用端部36EFは、基台部36Mの中央部の幅に比して小なる幅を有し後述するリターン用板ばね32LFに当接する。また、基台部36Mにおける長手方向の係止端36ERには、ヒートシンク36の装着時、後述するガイドプレート32RPの係止部に係止される溝36EGが形成されている。光モジュール14がリセプタクル用ケージ32内に装着された場合、基台部36Mの伝熱面は、光モジュール14のアッパプレートおよび保護壁部143の表面に当接するので光モジュール14からの熱がヒートシンク36を通じて放熱される。その際、基台部36Mの伝熱面と挿入された光モジュール14のアッパプレート表面全体が当接することにより、伝滅面積がより拡大するので光モジュール14をより効率よく冷却できることとなる。 The heat sink 36 is made of a metal having good thermal conductivity such as aluminum. As shown in an enlarged view in FIG. 9, the heat sink 36 has a plurality of fins 36Fi (i = 1 to n, n is a positive integer) arranged in parallel with each other along the X coordinate axis at a predetermined interval. ing. The plurality of fins 36Fi are formed substantially perpendicular to the flat surface of the base portion 36M supported by the heat sink support mechanism. A pair of flange portions 36F are formed on both sides of the base portion 36M so as to face each other by a predetermined length. An elongated groove 36GA is formed between the connecting portion where the lower ends of the plurality of fins 36Fi are connected to each other and the flange portion 36F. The elongated groove 36GA has a bent piece 326S2 formed at the upper end portion of the side wall 326, two pressing springs 326S1, and a bent piece 327S2 of the top plate 327 provided at the upper end of the partition wall 325, and the two pressing springs 327S1. It is slidably engaged. A pressing end 36EF is formed at one end of the base portion 36M in the longitudinal direction. The pressing end portion 36EF has a width that is smaller than the width of the central portion of the base portion 36M, and abuts on a return leaf spring 32LF described later. Further, a groove 36EG that is locked to a locking portion of a guide plate 32RP described later when the heat sink 36 is mounted is formed in the locking end 36ER in the longitudinal direction of the base portion 36M. When the optical module 14 is mounted in the receptacle cage 32, the heat transfer surface of the base portion 36M comes into contact with the upper plate of the optical module 14 and the surface of the protective wall portion 143. The heat is dissipated through 36. At this time, the entire surface of the upper plate of the inserted optical module 14 comes into contact with the heat transfer surface of the base portion 36M, so that the extinction area is further expanded, so that the optical module 14 can be cooled more efficiently.

 上述したヒートシンク支持機構は、図8に示されるように、リセプタクル用ケージ32を構成する側壁326の最上端に形成される屈曲部に形成される屈曲片326S2、2個の押し付けばね326S1と、各仕切壁325の上端に設けられるトッププレート327に形成される屈曲片327S2、2個の押し付けばね327S1と、側壁328の最上端に形成される屈曲部に形成される屈曲片328S2、2個の押し付けばね128S1と、から構成されている。 As shown in FIG. 8, the heat sink support mechanism described above includes a bent piece 326S2 formed at a bent portion formed at the uppermost end of the side wall 326 constituting the receptacle cage 32, two pressing springs 326S1, A bent piece 327S2 formed on the top plate 327 provided at the upper end of the partition wall 325, two pressing springs 327S1, and a bent piece 328S2 formed on the bent portion formed at the uppermost end of the side wall 328, two pressed And a spring 128S1.

 ヒートシンク固定手段として、リセプタクル用ケージ32の背面部に設けられるガイドプレート32RPと、ヒートシンク36の溝36EGを、ガイドプレート32RPの係止部に向けて付勢する板ばね32LFとが、リセプタクル用ケージ32に設けられている。 As a heat sink fixing means, a guide plate 32RP provided on the back surface portion of the receptacle cage 32 and a leaf spring 32LF that urges the groove 36EG of the heat sink 36 toward the engaging portion of the guide plate 32RP are included in the receptacle cage 32. Is provided.

 側壁326の押し付けばね326S1および屈曲片326S2と仕切壁325の上端に設けられるトッププレート327とは、共通の平面上に所定の間隔をもって向かい合って形成されている。側壁326および328の一方の端および各仕切壁325の一方の端は、図8におけるY座標軸の沿って延びるガイドプレート32RPにより連結されている。 The pressing spring 326S1 and the bent piece 326S2 of the side wall 326 and the top plate 327 provided at the upper end of the partition wall 325 are formed to face each other at a predetermined interval on a common plane. One end of each of the side walls 326 and 328 and one end of each partition wall 325 are connected by a guide plate 32RP extending along the Y coordinate axis in FIG.

 ガイドプレート32RPは、側壁326および328の一方の端および各仕切壁325の一方の端に当接しリセプタクル用ケージ32の背面部を形成するカバー固定部と、カバー固定部の上端部に連なり形成されるガイド片32RT1、32RT2,32RT3,および、32RT4と、から構成されている。 The guide plate 32RP is formed so as to be connected to one end of the side walls 326 and 328 and one end of each partition wall 325 to form a cover fixing portion that forms the back portion of the receptacle cage 32, and an upper end portion of the cover fixing portion. Guide pieces 32RT1, 32RT2, 32RT3, and 32RT4.

 そのカバー固定部の長手方向に沿った両端は、それぞれ、側壁326および328の外周部に係止されている。カバー固定部には、一対のイジェクト用板バネ32RPSfが共通の直線上に形成されている。各一対のイジェクト用板バネ32RPSfは、隔室321,322,323,324にそれぞれ対応して形成されている。一対のイジェクト用板バネ32RPSfの下方の位置には、カバー24の爪部24nが挿入される矩形の開口部が形成されている。これにより、カバー24がガイドプレート32RPに固定されることとなる。各一対のイジェクト用板バネ32RPSfは、装着された各光モジュール14の保護壁部143をリセプタクル用ケージ32から所定量だけモジュールスロットを介し外部に押し出すように付勢するものとされる。 Both ends along the longitudinal direction of the cover fixing portion are locked to the outer peripheral portions of the side walls 326 and 328, respectively. The cover fixing portion is formed with a pair of ejecting leaf springs 32RPSf on a common straight line. Each pair of ejecting leaf springs 32RPSf is formed corresponding to the compartments 321, 322, 323, and 324, respectively. A rectangular opening into which the claw 24n of the cover 24 is inserted is formed at a position below the pair of ejection leaf springs 32RPSf. Thereby, the cover 24 is fixed to the guide plate 32RP. Each pair of ejection leaf springs 32RPSf urges the protective wall portion 143 of each mounted optical module 14 to be pushed out from the receptacle cage 32 by a predetermined amount to the outside through the module slot.

 ガイド片32RT1、32RT2,32RT3,および、32RT4は、側壁326および328の一方の端の上部および各仕切壁325の一方の端の上部に載置され係止されている。ガイド片32RT1、32RT2,32RT3,および、32RT4は、それぞれ、互いに平行に形成され、屈曲片326S2、327S2,328S2に向かって所定距離だけ延びている。ガイド片32RT1、32RT2,32RT3,および、32RT4の先端部は、それぞれ、屈曲片326S2、屈曲片327S2、屈曲片328S2の端部から所定距離だけ離隔した位置に形成されている。これにより、押圧用端部36EFがモジュール収容部内に向かって左斜め下方に傾けられた状態において、屈曲片326S2、屈曲片327S2および328S2が、それぞれ、ヒートシンク36の各細長い溝36GAに容易に挿入される。 The guide pieces 32RT1, 32RT2, 32RT3, and 32RT4 are placed and locked on the top of one end of the side walls 326 and 328 and the top of one end of each partition wall 325. The guide pieces 32RT1, 32RT2, 32RT3, and 32RT4 are formed in parallel to each other and extend by a predetermined distance toward the bent pieces 326S2, 327S2, and 328S2. The distal ends of the guide pieces 32RT1, 32RT2, 32RT3, and 32RT4 are formed at positions separated from the ends of the bent pieces 326S2, the bent pieces 327S2, and the bent pieces 328S2 by a predetermined distance, respectively. Accordingly, the bent pieces 326S2, the bent pieces 327S2 and 328S2 are easily inserted into the respective elongated grooves 36GA of the heat sink 36 in a state where the pressing end portion 36EF is inclined obliquely to the left and downward toward the inside of the module housing portion. The

 ガイド片32RT1およびガイド片32RT2の一端、ガイド片32RT3およびガイド片32RT4の一端は、それぞれ、上述のヒートシンク36の溝36EGが係止される係止部とされる。 One end of each of the guide piece 32RT1 and the guide piece 32RT2 and one end of the guide piece 32RT3 and the guide piece 32RT4 serve as a locking portion to which the groove 36EG of the heat sink 36 described above is locked.

 ガイド片32RT1と一体に形成される屈曲部32RSおよびガイド片32RT4と一体に形成される屈曲部(不図示)は、それぞれ、側壁326および328の外周部に係止されている。 The bent portion 32RS formed integrally with the guide piece 32RT1 and the bent portion (not shown) formed integrally with the guide piece 32RT4 are locked to the outer peripheral portions of the side walls 326 and 328, respectively.

 ガイド片32RT1、32RT2,32RT3,および、32RT4の位置は、図10Aおよび図10Bに示されるように、トッププレート327の位置よりも所定の寸法ΔHだけ低い位置に設定されている。また、ガイド片32RT1、32RT2,32RT3,および、32RT4の内周部とカバー24の外周部の上面との間の距離ΔGaは、光モジュール14の保護壁部143の厚さTよりも大に設定されている。また、距離ΔGaは、保護壁143がガイド片32RT1とカバー24の外周部の上面との間に挿入された場合、保護壁143の上面とガイド片32RT1の内周面との間の隙間が、カバー24のスリットとプラグコネクタ146との間の隙間よりも大となるように設定されている。 The positions of the guide pieces 32RT1, 32RT2, 32RT3, and 32RT4 are set to positions that are lower than the position of the top plate 327 by a predetermined dimension ΔH, as shown in FIGS. 10A and 10B. Further, the distance ΔGa between the inner peripheral part of the guide pieces 32RT1, 32RT2, 32RT3, and 32RT4 and the upper surface of the outer peripheral part of the cover 24 is set to be larger than the thickness T of the protective wall part 143 of the optical module 14. Has been. Further, when the protective wall 143 is inserted between the guide piece 32RT1 and the upper surface of the outer peripheral portion of the cover 24, the distance ΔGa is a gap between the upper surface of the protective wall 143 and the inner peripheral surface of the guide piece 32RT1. It is set to be larger than the gap between the slit of the cover 24 and the plug connector 146.

 側壁326の屈曲部には、ヒートシンク36の一方のフランジ部36Fを下方に向けて付勢する押し付けばね326S1が共通の直線上に所定の間隔をもって2箇所に形成されている。各押し付けばね326S1の基端は、側壁326の屈曲部と一体に形成され、各押し付けばね326S1の末端は、屈曲片326S2に向かって延び、Z座標軸に沿って弾性変位可能な折曲部を有している。その折曲部は、ヒートシンク36の各細長い溝36GAの高さに対応する曲率を有している。 In the bent portion of the side wall 326, two pressing springs 326S1 that urge one flange portion 36F of the heat sink 36 downward are formed on a common straight line at predetermined intervals. The base end of each pressing spring 326S1 is formed integrally with the bent portion of the side wall 326, and the end of each pressing spring 326S1 has a bent portion that extends toward the bent piece 326S2 and can be elastically displaced along the Z coordinate axis. is doing. The bent portion has a curvature corresponding to the height of each elongated groove 36GA of the heat sink 36.

 トッププレート327にも、ヒートシンク36の他方のフランジ部36Fを付勢する押し付けばね327S1が共通の直線上に所定の間隔をもって2箇所に形成されている。各押し付けばね327S1の基端は、トッププレート327と一体に形成され、各押し付けばね327S1の末端は、屈曲片327S2に向かって延び、Z座標軸に沿って弾性変位可能な折曲部を有している。その折曲部は、ヒートシンク36の各細長い溝36GAの高さに対応する曲率を有している。これにより、ヒートシンク36が装着されない場合、光モジュール14が挿入されたときであっても、光モジュール14が、押し付けばね326S1、押し付けばね327S1に干渉することなく、折曲部が座屈する虞がない。 Also on the top plate 327, the pressing springs 327S1 for biasing the other flange portion 36F of the heat sink 36 are formed at two positions on the common straight line with a predetermined interval. The base end of each pressing spring 327S1 is formed integrally with the top plate 327, and the end of each pressing spring 327S1 extends toward the bent piece 327S2 and has a bent portion that can be elastically displaced along the Z coordinate axis. Yes. The bent portion has a curvature corresponding to the height of each elongated groove 36GA of the heat sink 36. Thereby, even when the optical module 14 is inserted when the heat sink 36 is not attached, the optical module 14 does not interfere with the pressing spring 326S1 and the pressing spring 327S1, and there is no possibility that the bent portion is buckled. .

 側壁326および仕切壁325の他方の端および側壁328の他方の端は、モジュールスロットの周縁を形成するフロントEMIフィンガー13が設けられる連結部により連結されている。その連結部におけるガイドプレート32RPの各係止部に向かい合う部分には、リターン用板ばね32LFが一体に形成されている。リターン用板ばね32LFは、X座標軸に沿って弾性変位可能な可動片を有している。リターン用板ばね32LFの可動片は、ヒートシンク26全体を上述のガイドプレート32RPの各係止部に向けて付勢するものとされる。なお、リターン用板ばね32LFは、斯かる例に限られることなく、例えば、リターン用板ばね32LFが別個に成形され、それが連結部に固定されるように構成されてもよい。 The other end of the side wall 326 and the partition wall 325 and the other end of the side wall 328 are connected by a connecting portion provided with a front EMI finger 13 that forms the periphery of the module slot. A return leaf spring 32LF is integrally formed at a portion of the connecting portion facing each locking portion of the guide plate 32RP. The return leaf spring 32LF has a movable piece that can be elastically displaced along the X coordinate axis. The movable piece of the return leaf spring 32LF urges the entire heat sink 26 toward each locking portion of the guide plate 32RP. The return leaf spring 32LF is not limited to such an example. For example, the return leaf spring 32LF may be formed separately and fixed to the connecting portion.

 側壁326および仕切壁325の下端を連結している底壁部32BPにおける端部は、プリント配線基板16の実装面に当接している。また、底壁部32BPにおける端部は、プリント配線基板16の実装面に形成される環状の接地用コンタクトパッドの一辺に当接している。これにより、リセプタクル用ケージ32が接地される。 The end portion of the bottom wall portion 32BP that connects the lower ends of the side wall 326 and the partition wall 325 is in contact with the mounting surface of the printed wiring board 16. Further, the end portion of the bottom wall portion 32BP is in contact with one side of an annular grounding contact pad formed on the mounting surface of the printed wiring board 16. As a result, the receptacle cage 32 is grounded.

 側壁326、仕切壁325、および側壁328の下端には、それぞれ、複数個のプレスフィット用爪部Taが所定の間隔で形成されている。各プレスフィット用爪部Taは、図8に示されるように、プレスフィット用爪部Taの配列に対応してプリント配線基板16の表面に形成される各細孔に圧入される。これにより、リセプタクル用ケージ32の下端面がプリント配線基板16の表面に密着固定される。 A plurality of press-fit claw portions Ta are formed at predetermined intervals on the lower ends of the side wall 326, the partition wall 325, and the side wall 328, respectively. As shown in FIG. 8, each press-fit claw portion Ta is press-fitted into each pore formed on the surface of the printed wiring board 16 corresponding to the arrangement of the press-fit claw portions Ta. As a result, the lower end surface of the receptacle cage 32 is tightly fixed to the surface of the printed wiring board 16.

 プリント配線基板16の表面に向けて開口するリセプタクルコネクタ収容部は、リセプタクル用ケージ32におけるモジュールスロットに向き合うリセプタクルコネクタ側閉端部と、側壁326および仕切壁325のリセプタクルコネクタ側部分とにより囲まれて形成されている。 The receptacle connector housing portion that opens toward the surface of the printed circuit board 16 is surrounded by the receptacle connector side closed end facing the module slot in the receptacle cage 32, and the side wall 326 and the receptacle connector side portion of the partition wall 325. Is formed.

 リセプタクル用ケージ32の側面および背面の外周部にそれぞれ、リセプタクル用ケージ32をプリント配線基板16の実装面にねじ止めするための複数のフランジ部が設けられている。 A plurality of flange portions for screwing the receptacle cage 32 to the mounting surface of the printed wiring board 16 are provided on the outer periphery of the side surface and the rear surface of the receptacle cage 32, respectively.

 斯かる構成において、各ヒートシンク36をガイドプレート32RP側からリセプタクル用ケージ32の各隔室に固定するにあたっては、取り付け作業は、同様な取り付け作業となるので隔室121についての取り付け作業について代表的に説明し、その他の隔室についての取り付け作業の説明については省略する。 In such a configuration, when the heat sinks 36 are fixed to the compartments of the receptacle cage 32 from the guide plate 32RP side, the attachment work is the same attachment work. Explanation will be omitted, and description of the attachment work for other compartments will be omitted.

 先ず、屈曲片326S2と屈曲片327S2とが、それぞれ、開口部を通じてヒートシンク36の細長い溝36GAの開口端に挿入されるように、ヒートシンク36の姿勢がモジュール収容部に対し傾けられる。次に、各押し付けばね326S1、各押し付けばね327S1がヒートシンク36の細長い溝36GAに挿入されるように、ヒートシンク36が、その進行方向の押圧用端部36EFがリターン用板ばね32LFの可動片に当接した後、リターン用板ばね32LFの可動片の弾性力に抗してさらに押し込まれる。その際、ガイドプレート32RPの係止部と係止端36ERの端面との間に所定の隙間が形成される。また、ヒートシンク36の挿入時、溝36GAの高さに対応した大きさの屈曲部から溝36GAに挿入されるので押し付けばね326S1および押し付けばね327S1は、変形する虞がない。 First, the posture of the heat sink 36 is inclined with respect to the module housing portion so that the bent piece 326S2 and the bent piece 327S2 are inserted into the opening ends of the elongated grooves 36GA of the heat sink 36 through the openings, respectively. Next, the heat sink 36 has its pressing end 36EF in the advancing direction against the movable piece of the return leaf spring 32LF so that each pressing spring 326S1 and each pressing spring 327S1 is inserted into the elongated groove 36GA of the heat sink 36. After the contact, the return leaf spring 32LF is further pushed against the elastic force of the movable piece. At that time, a predetermined gap is formed between the locking portion of the guide plate 32RP and the end surface of the locking end 36ER. Further, when the heat sink 36 is inserted, the pressing spring 326S1 and the pressing spring 327S1 are not likely to be deformed because the heat sink 36 is inserted into the groove 36GA from a bent portion having a size corresponding to the height of the groove 36GA.

 そして、ヒートシンク36が解放されるとき、係止端36ERの溝36EGが係止部に対しロック状態とされる。これにより、ヒートシンク36の取り付けが完了する。 When the heat sink 36 is released, the groove 36EG of the locking end 36ER is locked with respect to the locking portion. Thereby, the attachment of the heat sink 36 is completed.

 一方、ヒートシンク36をリセプタクル用ケージ32に対しアンロック状態とし取り外す場合、先ず、ヒートシンク36がリターン用板ばね32LFの可動片の弾性力に抗して押し込まれ、係止端36ERの溝36EGが係止部に対しアンロック状態とされる。次に、係止端36ERの端面と係止部との間に所定の隙間が形成された後、ヒートシンク36の端が真上に引き上げられることにより、ヒートシンク36がリセプタクル用ケージ32に対し取り外される。 On the other hand, when the heat sink 36 is unlocked from the receptacle cage 32 and removed, the heat sink 36 is first pushed against the elastic force of the movable piece of the return leaf spring 32LF, and the groove 36EG of the locking end 36ER is engaged. It is made into an unlocking state with respect to a stop part. Next, after a predetermined gap is formed between the end face of the locking end 36ER and the locking portion, the end of the heat sink 36 is pulled straight up, whereby the heat sink 36 is removed from the receptacle cage 32. .

 また、図10Aに拡大されて示されるように、ヒートシンク36がリセプタクル用ケージ32に対し取り外された状態において、光モジュール14がリセプタクル用ケージ32の隔室321に対し挿入された場合、仮に光モジュール14の保護壁部143が浮き上がった姿勢で挿入された場合であっても、光モジュール14の保護壁部143の先端部がガイドプレート32RPのガイド片32RT1の端部に当接することより、図10Bに示されるように、保護壁部143の先端部が矢印の示す方向に押し下げられ、ガイド片32RT1の下方の隙間に案内された後、矢印の示す方向に沿って一対のイジェクト用板バネ32RPSfの付勢力に抗して押し込まれることとなる。これにより、光モジュール14のプラグコネクタ146が、破損することなく、リセプタクルコネクタ22に円滑に接続されることとなる。 10A, when the optical module 14 is inserted into the compartment 321 of the receptacle cage 32 in a state where the heat sink 36 is removed from the receptacle cage 32, the optical module is temporarily installed. 14B, even if the protective wall portion 143 of the optical module 14 is inserted in a lifted posture, the distal end portion of the protective wall portion 143 of the optical module 14 comes into contact with the end portion of the guide piece 32RT1 of the guide plate 32RP. As shown in FIG. 3, after the front end of the protective wall 143 is pushed down in the direction indicated by the arrow and guided in the gap below the guide piece 32RT1, the pair of eject leaf springs 32RPSf is moved along the direction indicated by the arrow. It will be pushed against the urging force. As a result, the plug connector 146 of the optical module 14 is smoothly connected to the receptacle connector 22 without being damaged.

 上述の本発明に係るリセプタクルアッセンブリーの一例において、リセプタクル用ケージ12、32は、4個の隔室を有するものとされるが、斯かる例に限られることなく、例えば、1個乃至3個の隔室、あるいは、5個以上の隔室を有するものであってもよい。 In the example of the receptacle assembly according to the present invention described above, the receptacle cages 12 and 32 have four compartments. However, the present invention is not limited to this example. For example, one to three receptacle cages may be used. It may have a compartment or five or more compartments.

 さらに、上述の例においては、光モジュール14は、一枚のモジュール基板を収容し、リセプタクルコネクタ22は、それぞれ、一枚のモジュール基板の接続端部が挿入される1個のスロットを有するものとされているが、斯かる例に限られることなく、例えば、光モジュールが所定の間隔をもって二段重ねで2枚のモジュール基板を収容し、リセプタクルコネクタが、それらのモジュール基板の接続端部がそれぞれ挿入される2個のスロットを有するものであってもよい。そのような場合、カバーは、例えば、2枚のモジュール基板の接続端部がそれぞれ挿入される二つのスリットを有することとなる。 Furthermore, in the above-described example, the optical module 14 accommodates one module board, and the receptacle connectors 22 each have one slot into which the connection end of one module board is inserted. However, the present invention is not limited to such an example. For example, the optical module accommodates two module boards in a two-layered manner with a predetermined interval, and the receptacle connector has a connection end portion of each of the module boards. It may have two slots to be inserted. In such a case, for example, the cover has two slits into which connection end portions of two module substrates are respectively inserted.

Claims (7)

 一方の端部に接続端部を有するモジュール基板を含む光モジュールが通過する少なくとも1つのモジュールスロットを一端に有し、該光モジュールを着脱可能に収容し、該光モジュールの下面に当接する底壁部を有する少なくとも1つのモジュール収容部と、前記モジュール収容部に連通し該モジュール基板の接続端部が着脱可能に接続されるコネクタを収容する少なくとも1つのコネクタ収容部と、を含んでなるリセプタクル用ケージと、
 前記リセプタクル用ケージに選択的に配され、底壁部の面積に対応する面積を有する伝熱面を介して光モジュールの外周部に当接し光モジュールから発生した熱を放熱させるヒートシンクと、
 前記リセプタクル用ケージに配され、前記ヒートシンクが該リセプタクル用ケージ配置される場合、該ヒートシンクを光モジュールの着脱方向に沿って摺動可能に支持するヒートシンク支持機構と、
 前記リセプタクル用ケージに配され、前記ヒートシンクが配置されない場合、前記モジュールスロットを介して挿入された前記光モジュールの接続端部の先端部を前記コネクタに誘導するように該光モジュールにおける接続端部よりも該コネクタに向けて突出する外郭部の先端部に当接され該先端部を該コネクタ収容部内に案内するガイドプレート部材と、
 を具備して構成されるヒートシンクを備えるリセプタクルアッセンブリー。
A bottom wall having at least one module slot through which an optical module including a module substrate having a connection end at one end passes, and which detachably accommodates the optical module and contacts the lower surface of the optical module For a receptacle comprising: at least one module housing portion having a portion; and at least one connector housing portion for housing a connector that communicates with the module housing portion and to which a connection end of the module substrate is detachably connected. The cage,
A heat sink that is selectively disposed in the receptacle cage and that contacts the outer periphery of the optical module through a heat transfer surface having an area corresponding to the area of the bottom wall, and dissipates heat generated from the optical module;
A heat sink support mechanism that is disposed in the receptacle cage and supports the heat sink so as to be slidable along an attaching / detaching direction of the optical module when the heat sink is arranged in the receptacle cage;
When the heat sink is not disposed, the tip of the connection end of the optical module inserted through the module slot is guided from the connection end of the optical module so as to be guided to the connector. A guide plate member that is brought into contact with the distal end portion of the outer shell portion protruding toward the connector and guides the distal end portion into the connector housing portion,
A receptacle assembly comprising a heat sink comprising:
 前記ガイドプレート部材は、前記コネクタ収容部の上方となる位置に切欠部を有し、前記ヒートシンクの伝熱面は、該切欠部に挿入される延在部を有することを特徴とする請求項1記載のヒートシンクを備えるリセプタクルアッセンブリー。 The said guide plate member has a notch part in the position which becomes above the said connector accommodating part, The heat-transfer surface of the said heat sink has an extension part inserted in this notch part. A receptacle assembly comprising the described heat sink.  前記ガイドプレート部材は、前記リセプタクル用ケージの側壁に固定されていることを特徴とする請求項1記載のヒートシンクを備えるリセプタクルアッセンブリー。 The receptacle assembly having a heat sink according to claim 1, wherein the guide plate member is fixed to a side wall of the receptacle cage.  前記ガイドプレート部材の内周面と前記コネクタを覆うコネクタカバーの外周面との間に、前記接続端部を保護する前記光モジュールの保護壁が挿入されるように隙間が形成されていることを特徴とする請求項1記載のヒートシンクを備えるリセプタクルアッセンブリー。 A gap is formed between the inner peripheral surface of the guide plate member and the outer peripheral surface of the connector cover that covers the connector so that the protective wall of the optical module that protects the connection end portion is inserted. A receptacle assembly comprising a heat sink according to claim 1.  前記ガイドプレート部材は、前記リセプタクル用ケージにおける前記ヒートシンク支持機構の位置よりも低い位置に設けられることを特徴とする請求項1記載のヒートシンクを備えるリセプタクルアッセンブリー。 The receptacle assembly having a heat sink according to claim 1, wherein the guide plate member is provided at a position lower than a position of the heat sink support mechanism in the receptacle cage.  前記ガイドプレート部材の切欠部における前記光モジュールの着脱方向に対し直交する方向の幅は、前記光モジュールの保護壁における該着脱方向に直交する幅よりも小であることを特徴とする請求項1記載のヒートシンクを備えるリセプタクルアッセンブリー。 2. The width in the direction perpendicular to the attaching / detaching direction of the optical module in the notch portion of the guide plate member is smaller than the width perpendicular to the attaching / detaching direction in the protective wall of the optical module. A receptacle assembly comprising the described heat sink.  一方の端部に接続端部を有するモジュール基板を含む光モジュールと、
 請求項1記載のリセプタクルアッセンブリーと、
 を具備して構成されるトランシーバモジュールアッセンブリー。
An optical module including a module substrate having a connection end at one end;
A receptacle assembly according to claim 1;
A transceiver module assembly comprising:
PCT/JP2013/067110 2013-03-13 2013-06-21 Receptacle assembly and transceiver module assembly Ceased WO2014141493A1 (en)

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