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WO2014030566A1 - Réceptacle, et module de transmission par fibre optique - Google Patents

Réceptacle, et module de transmission par fibre optique Download PDF

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Publication number
WO2014030566A1
WO2014030566A1 PCT/JP2013/071777 JP2013071777W WO2014030566A1 WO 2014030566 A1 WO2014030566 A1 WO 2014030566A1 JP 2013071777 W JP2013071777 W JP 2013071777W WO 2014030566 A1 WO2014030566 A1 WO 2014030566A1
Authority
WO
WIPO (PCT)
Prior art keywords
axis direction
optical
positioning member
optical fiber
receptacle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/071777
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English (en)
Japanese (ja)
Inventor
裕史 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2014030566A1 publication Critical patent/WO2014030566A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements

Definitions

  • the present invention relates to a receptacle and an optical transmission module used for optical communication, and more particularly to a receptacle and an optical transmission module including a plurality of optical elements.
  • this type of optical module 500 includes a single case 514 on the plurality of optical element groups 504 arranged on the substrate 511 so as to cover the plurality of optical element groups 504 (the present invention). Positioning member) is provided. As shown in FIG. 24, an optical connector 553 provided at the end of the optical fiber 542 is connected to the case 514.
  • the case 514 plays a role of optically coupling the optical fiber 542 and the plurality of optical element groups 504.
  • the optical fiber 542 and the plurality of optical element groups 504 are optically coupled to the plurality of optical element groups 504 with one case 514. Therefore, in the optical module 500, when the plurality of optical element groups 504 are mounted on the substrate 511, a deviation occurs in the relative positional relationship between the plurality of optical element groups 504 due to variations in the mounting positions.
  • the case 514 cannot be arranged according to the position of each optical element group 504. If the specific optical element group 504 and the case 514 are positioned, a deviation occurs in the positional relationship between the other optical element group 504 and the case 514. As a result, in the optical module 500, there is a possibility that the optical axis of the optical fiber 542 and the optical axis of the optical element group 504 are shifted and an optical loss occurs.
  • an object of the present invention is to provide a receptacle and an optical transmission module that can suppress the influence of positional deviation due to mounting variations of the plurality of optical elements in a receptacle and an optical transmission module including a plurality of optical elements. is there.
  • a receptacle includes a plurality of optical elements, and a plurality of positioning members for optically coupling an optical fiber and the plurality of optical elements. It is provided with respect to the optical element.
  • An optical transmission module includes the receptacle, an optical fiber, and a plug that is provided at an end of the optical fiber and is placed on the positioning member. .
  • each of the plurality of positioning members is provided for each optical element, and optically couples each optical element and the optical fiber.
  • each positioning member can be arranged according to each optical element. That is, in the receptacle and the optical transmission module according to one aspect of the present invention, when a specific optical element and a positioning member are aligned, as in the case where there is one positioning member for a plurality of optical elements, the other There is no deviation in the positional relationship between the optical element and the positioning member.
  • the influence of the positional deviation at the time of mounting each optical element is suppressed as compared with the case where there is one positioning member for the plurality of optical elements. can do.
  • the receptacle and the optical transmission module according to the present invention it is possible to suppress the influence of misalignment due to mounting variations of a plurality of optical elements.
  • FIG. 5 is a cross-sectional view taken along a line EE in FIG. 4.
  • FIG. 6 is a diagram in which a mounting board and a plug are added to the cross section taken along the line CC or DD of the positioning member illustrated in FIG. 5.
  • FIG. 5 is a cross-sectional view in which a metal cap of a receptacle according to a first modification is added to the EE cross section of FIG. 4. It is an external appearance perspective view of the metal plate arrange
  • FIG. 18 is a cross-sectional view taken along the line FF in FIG. 17.
  • FIG. 18 is a cross-sectional view taken along a line GG in FIG. 17.
  • FIG. 18 is a cross-sectional view taken along the line HH in FIG. 17.
  • FIG. 18 is a cross-sectional view taken along the line JJ of FIG. It is sectional drawing of the optical module of the same kind as the optical module of patent document 1. It is sectional drawing of the optical module of the same kind as the optical module of patent document 1.
  • optical transmission module including a positioning member according to an embodiment and a manufacturing method thereof will be described.
  • the vertical direction of the light transmission module 10 is defined as the z-axis direction
  • the direction along the long side of the light transmission module 10 when viewed in plan from the z-axis direction is defined as the x-axis direction
  • the direction along the short side of the optical transmission module 10 is defined as the y-axis direction.
  • the x axis, the y axis, and the z axis are orthogonal to each other.
  • the optical transmission module 10 includes a receptacle 20 and an optical fiber connection device 70 as shown in FIG.
  • the receptacle 20 includes a metal cap 30, a light receiving element 50, a light emitting element 100, a positioning member 200, a mounting board 22, and a drive circuit 26, as shown in FIG.
  • the mounting substrate 22 has a rectangular shape when seen in a plan view from the z-axis direction, as shown in FIG.
  • the surface mounting electrode E1 that contacts the land of the circuit board when the optical transmission module 10 is mounted on the circuit board is mounted on the surface on the negative side in the z-axis direction of the mounting board 22 (hereinafter referred to as the lower surface). (Not shown in FIG. 3) is provided.
  • a side L1 located on the negative direction side in the x-axis direction and a side L2 located on the negative direction side in the y-axis direction are formed on the surface on the positive direction side in the z-axis direction (hereinafter referred to as the upper surface) of the mounting substrate 22, a side L1 located on the negative direction side in the x-axis direction and a side L2 located on the negative direction side in the y-axis direction are formed.
  • a ground conductor exposed portion E2 is provided in which a part of the ground conductor provided in the mounting substrate 22 is exposed.
  • the ground conductor exposed portion E2 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.
  • the mounting substrate 22 is provided in the vicinity of an angle formed by the side L ⁇ b> 1 positioned on the negative side in the x-axis direction and the side L ⁇ b> 3 positioned on the positive direction side in the y-axis direction.
  • a ground conductor exposed portion E3 in which a part of the ground conductor is exposed is provided.
  • the ground conductor exposed portion E3 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.
  • the light receiving element 50 and the light emitting element 100 are provided on a portion on the positive side in the x-axis direction on the upper surface of the mounting substrate 22.
  • the light receiving element 50 is an element including a photodiode that converts an optical signal into an electric signal.
  • the light emitting element 100 is an element including a diode that converts an electrical signal into an optical signal.
  • the light emitting element 100 includes two VCSELs.
  • the drive circuit 26 is provided on the positive side in the x-axis direction on the upper surface of the mounting substrate 22 further on the positive side in the x-axis direction than the light receiving element 50 and the light emitting element 100.
  • the drive circuit 26 is a semiconductor circuit element for driving the light receiving element 50 and the light emitting element 100, and has a rectangular shape having a long side parallel to the y axis direction when viewed in plan from the z axis direction.
  • the drive circuit 26 and the light receiving element 50 are connected by wire bonding via the wire U.
  • the drive circuit 26 and the light emitting element 100 are connected to each other by wire bonding via a wire U. Thereby, the electrical signal from the drive circuit 26 is transmitted to the light emitting element 100 via the wire U, and the electrical signal from the light receiving element 50 is transmitted to the drive circuit 26 via the wire U.
  • the drive circuit 26 and the mounting substrate 22 are connected by wire bonding via the wire U.
  • the positioning member 200 is made of an epoxy-based or nylon-based resin or the like, and is provided so as to cover substantially the entire top surface of the mounting substrate 22 as shown in FIG.
  • the positioning member 200 includes a positioning member 220 for a light emitting element and a positioning member 240 for a light receiving element. That is, each of the positioning members 220 and 240 is provided for each optical element.
  • the positioning members 220 and 240 are provided so as to be arranged in this order from the negative direction side to the positive direction side in the y-axis direction, and the resin 260 is sandwiched between the positioning member 220 and the positioning member 240. Yes.
  • the positioning member 220 for the light emitting element has a substantially rectangular shape when viewed in plan from the z-axis direction. Further, as shown in FIG. 5, the positioning member 220 includes a plug placement portion 222 and an optical coupling portion 224.
  • the plug mounting portion 222 is a plate-like member that constitutes a portion of the positioning member 220 on the negative direction side of the x axis.
  • a portion on the negative side in the y-axis direction from the groove G1 is referred to as a flat portion F1
  • a portion on the positive direction side in the y-axis direction from the groove G1 is referred to as a flat portion F2.
  • the optical coupling portion 224 constitutes a portion of the positioning member 220 on the positive direction side in the x-axis direction. Moreover, the optical coupling part 224 has the main body 226, the abutting part 228, and leg part 232a, 232b, as shown in FIG.
  • the main body 226 has a rectangular parallelepiped shape.
  • the main body 226 is provided with a space SP1, a concave portion D1, and a convex lens 230.
  • the space SP1 is a substantially rectangular space provided on the lower surface of the main body 226, and the positive side in the y-axis direction and the negative direction side in the z-axis direction are openings. Yes.
  • the positioning member 220 is placed on the mounting substrate 22, a part of the light emitting element 100 and the drive circuit 26 are accommodated in the space SP1.
  • the concave portion D1 is provided in the vicinity of the side L4 on the positive side of the main body 226 in the y-axis direction, and overlaps the optical axis of the light emitting element 100 when viewed in plan from the z-axis direction. Further, the recess D1 overlaps with the optical axis of the optical fiber 60 connected to the plug 42 when viewed in plan from the x-axis direction. Furthermore, the concave portion D1 has a rectangular shape when viewed in plan from the z-axis direction. And as shown in FIG. 8, the recessed part D1 has comprised the V shape when planarly viewed from the y-axis direction.
  • the inner peripheral surface on the negative side in the x-axis direction of the recess D1 is a total reflection surface R1.
  • the total reflection surface R1 is parallel to the y-axis and tilted 45 ° counterclockwise with respect to the z-axis when viewed from the negative side in the y-axis direction.
  • the refractive index of the positioning member 220 is sufficiently larger than that of air. Therefore, the laser beam B1 emitted from the light emitting element 100 in the positive z-axis direction is incident on the optical coupling unit 224, and is totally reflected by the total reflection surface R1 in the negative x-axis direction.
  • the angle formed by the optical axis of the laser beam B1 emitted from the light emitting element 100 and the total reflection surface R1 is 45 ° and is directed to the optical fiber 60.
  • the angle formed by the optical axis of the laser beam B1 and the total reflection surface R1 is 45 °. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R1 and the light emitting element 100.
  • the convex lens 230 is provided on the lower surface of the optical coupling part 224 as shown in FIG. Further, the convex lens 230 overlaps the light emitting element 100 when viewed in plan from the z-axis direction. Accordingly, the convex lens 230 faces the light emitting element 100 and is positioned on the optical path of the laser beam B1. In addition, the convex lens 230 has a semicircular shape that protrudes toward the negative direction side of the z-axis when viewed from a direction orthogonal to the z-axis. Accordingly, the laser beam B1 emitted from the light emitting element 100 is condensed or collimated by the convex lens 230 and travels toward the total reflection surface R1.
  • the abutting portion 228 is substantially in the x-axis direction of the flat portion F ⁇ b> 1 along the flat portion F ⁇ b> 1 of the plug placement portion 222 from the negative end surface S ⁇ b> 2 in the x-axis direction of the main body 226. Projects to the center. Note that the end surface of the abutting portion 228 on the negative side in the x-axis direction is referred to as an end surface S3.
  • the leg portions 232a and 232b are rectangular parallelepiped members that protrude from the negative side surface in the y-axis direction of the main body 226 toward the negative direction side in the y-axis direction. Further, the leg portions 232a and 232b are provided at an interval H1 so as to be arranged in this order from the negative direction side to the positive direction side in the x-axis direction. A convex portion C3 of a metal cap 30 described later is fitted into the interval H1.
  • the positioning member 240 for the light receiving element has a rectangular shape when viewed in plan from the z-axis direction. Furthermore, the positioning member 240 includes a plug placement portion 242 and an optical coupling portion 244, as shown in FIG.
  • the plug placement portion 242 is a plate-like member that constitutes a portion of the positioning member 240 on the negative side of the x axis.
  • a groove G2 is provided along the axial direction.
  • a portion on the negative side in the y-axis direction from the groove G2 is referred to as a flat portion F3
  • a portion on the positive direction side in the y-axis direction from the groove G2 is referred to as a flat portion F4.
  • the optical coupling portion 244 constitutes a portion of the positioning member 240 on the positive direction side in the x-axis direction. Moreover, the optical coupling part 244 has the main body 246, the abutting part 248, and leg part 252a, 252b, as shown in FIG.
  • the main body 246 has a rectangular parallelepiped shape.
  • the main body 226 is provided with a space SP2, a concave portion D2, and a convex lens 250.
  • the space SP ⁇ b> 2 is a substantially rectangular space provided on the lower surface of the main body 246, and the negative direction side in the y-axis direction and the negative direction side in the z-axis direction are openings. Yes.
  • the positioning member 240 is placed on the mounting substrate 22, the other portions of the light receiving element 50 and the drive circuit 26 are accommodated in the space SP2.
  • the space SP1 is provided on the lower surface of the main body 226 located on the positive side in the x-axis direction of the positioning member 220
  • the space SP2 is the lower surface of the main body 246 located on the positive direction side in the x-axis direction of the positioning member 240.
  • the space SP1 and the space SP2 face each other at the adjacent positioning members 220 and 240.
  • the positive direction side in the y-axis direction of the space SP1 is an opening
  • the negative direction side in the y-axis direction of the space SP2 is an opening. Therefore, the opposing part in space SP1 and space SP2 is an opening part.
  • a resin 260 is sandwiched between the positioning member 220 and the positioning member 240 around the opening of the space SP1 and the opening of the space SP2.
  • the concave portion D2 is provided in the vicinity of the side L5 on the negative direction side of the main body 246 in the y-axis direction, and overlaps the light receiving element 50 when viewed in plan from the z-axis direction. Further, the recess D2 overlaps with the optical axis of the optical fiber 60 connected to the plug 46 when viewed in plan from the x-axis direction. Further, the recess D2 has a rectangular shape when viewed in plan from the z-axis direction. Further, as shown in FIG. 8, the recess D2 has a V-shape when viewed in plan from the y-axis direction.
  • the inner peripheral surface on the negative direction side in the x-axis direction of the recess D2 is a total reflection surface R2.
  • the total reflection surface R2 is parallel to the y-axis and tilted 45 ° counterclockwise with respect to the z-axis when viewed from the negative side in the y-axis direction.
  • the refractive index of the positioning member 240 is sufficiently larger than that of air. Accordingly, the laser beam B2 emitted from the optical fiber 60 to the positive side in the x-axis direction is incident on the optical coupling unit 244, and is totally reflected by the total reflection surface R2 to the negative direction side in the z-axis direction. Proceed to 50.
  • the angle formed by the optical axis of the laser beam B2 emitted from the optical fiber 60 and the total reflection surface R2 is 45 ° and is directed toward the light receiving element 50.
  • the angle formed by the optical axis of the laser beam B2 and the total reflection surface R2 is 45 °. That is, the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R2 and the light receiving element 50.
  • the convex lens 250 is provided on the lower surface of the optical coupling part 244 as shown in FIG.
  • the convex lens 250 overlaps the light receiving element 50 when viewed in plan from the z-axis direction. Thereby, the convex lens 250 faces the light receiving element 50 and is positioned on the optical path of the laser beam B2. Further, the convex lens 250 has a semicircular shape that protrudes toward the negative direction side of the z-axis when viewed from a direction orthogonal to the z-axis. Accordingly, the laser beam B ⁇ b> 2 emitted from the optical fiber 60 is reflected by the total reflection surface R ⁇ b> 2, then condensed or collimated by the convex lens 250, and travels toward the light receiving element 50.
  • the abutting portion 248 substantially extends in the x-axis direction of the flat portion F ⁇ b> 4 along the flat portion F ⁇ b> 4 of the plug placement portion 242 from the negative end surface S ⁇ b> 5 in the x-axis direction of the main body 246. Projects to the center.
  • the end surface on the negative direction side in the x-axis direction of the abutting portion 248 is referred to as an end surface S6.
  • the leg portions 252a and 252b are rectangular parallelepiped members that protrude from the surface on the positive direction side in the y-axis direction of the main body 226 toward the positive direction side in the y-axis direction. Further, the leg portions 252a and 252b are provided at an interval H2 so as to be arranged in this order from the negative direction side to the positive direction side in the x-axis direction. A protrusion C6 of a metal cap 30 described later is fitted into the interval H2.
  • the metal cap 30 is manufactured by bending a single metal plate (for example, SUS301) into a U-shape. Further, as shown in FIG. 1, the metal cap 30 covers the positioning member 200 from the positive direction side in the z-axis direction, the positive direction side in the y-axis direction, and the negative direction side in the y-axis direction. Thus, an opening A3 into which a plug 40 described later is inserted is formed on the negative side of the receptacle 20 in the x-axis direction.
  • the metal cap 30 includes a top plate portion 32 and side plate portions 34 and 36.
  • the top plate portion 32 is parallel to a plane orthogonal to the z-axis and has a rectangular shape.
  • the side plate portion 34 is formed by bending the metal cap 30 from the long side L6 on the negative direction side in the y-axis direction of the top plate portion 32 to the negative direction side in the z-axis direction.
  • the side plate portion 36 is formed by bending the metal cap 30 from the long side L7 on the positive side in the y-axis direction of the top plate portion 32 to the negative direction side in the z-axis direction.
  • Engaging portions 32 a and 32 b for fixing the plug 40 to the receptacle 20 are provided on the negative side of the top plate portion 32 in the x-axis direction.
  • the engaging portions 32a and 32b are provided in this order from the negative direction side in the y-axis direction toward the positive direction side.
  • the engaging portions 32 a and 32 b are formed by making a U-shaped cut in the top plate portion 32. Specifically, the engaging portions 32a and 32b have a U-shaped notch opened in the positive direction side in the x-axis direction in the top plate portion 32, and a portion surrounded by the U-shaped notch is formed in the z-axis direction. It is formed by bending so as to be dented in the negative direction side. Thus, the engaging portions 32a and 32b have a V-shape that protrudes in the negative direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • engaging portions 32c and 32d for fixing the plug 40 to the receptacle 20 are provided on the short side L8 on the negative side of the top plate portion 32 in the x-axis direction.
  • the engaging portions 32c and 32d are metal pieces that protrude from the top plate portion 32 toward the negative side in the x-axis direction.
  • the engaging portions 32c and 32d are bent so as to be recessed toward the negative direction side in the z-axis direction at a substantially central position in the x-axis direction in the engaging portions 32c and 32d.
  • the engaging portions 32c and 32d have a V-shape protruding in the negative direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • convex portions C1 to C3 projecting toward the negative direction side in the z-axis direction are directed from the negative direction side in the x-axis direction to the positive direction side. They are arranged in this order.
  • the convex portions C1 to C3 are each fixed to the mounting substrate 22 with an adhesive.
  • the convex portion C1 is connected to the ground conductor exposed portion E2 of the mounting substrate 22.
  • the convex portion C3 is fitted into a gap H1 provided between the leg portion 226a and the leg portion 226b of the main body 226 in the positioning member 220. Thereby, the metal cap 30 is positioned with respect to the mounting substrate 22.
  • convex portions C4 to C6 projecting toward the negative direction side in the z-axis direction are directed from the negative direction side in the x-axis direction to the positive direction side. They are arranged in this order.
  • the convex portions C4 to C6 are each fixed to the mounting substrate 22 with an adhesive.
  • the convex portion C4 is connected to the ground conductor exposed portion E3 of the mounting substrate 22.
  • the convex portion C6 is fitted into a gap H2 provided between the leg portion 246a and the leg portion 246b of the main body 246 in the positioning member 240. Thereby, the metal cap 30 is positioned with respect to the mounting substrate 22.
  • the optical fiber connection device 70 includes an optical fiber 60 and a plug 40.
  • the optical fiber 60 is composed of a core wire and a covering material that covers the core wire, and the core wire is composed of a core and a clad.
  • the core is made of a glass material
  • the clad is made of a glass material or a glass material covered with a fluorine resin.
  • the covering material is made of a resin such as polyethylene.
  • the plug 40 includes a transmission side plug 42 and a reception side plug 46, both of which are made of epoxy or nylon resin or the like.
  • the transmission side plug 42 is used for fixing the optical fiber 60 to the positioning member 220.
  • the transmission side plug 42 includes an optical fiber insertion portion 42a and a protrusion 42b.
  • the optical fiber insertion portion 42a constitutes a portion on the positive direction side in the y-axis direction of the transmission-side plug 42, and has a rectangular parallelepiped shape extending in the x-axis direction.
  • An opening A1 is provided in a portion on the negative direction side in the x-axis direction of the optical fiber insertion portion 42a. A resin for fixing the optical fiber 60 is injected into the opening A1.
  • the opening A1 is formed by cutting out the surface S7 located on the upper surface of the optical fiber insertion portion 42a and the end surface S8 on the negative side in the x-axis direction. Further, an insertion port H7 for guiding the core wire of the inserted optical fiber 60 to the tip of the transmission side plug 42 is provided on the inner peripheral surface on the positive side in the x-axis direction of the opening A1. Note that the number of insertion openings H7 corresponds to the number of optical fibers 60, and is two in this embodiment.
  • a concave portion D3 for injecting a matching agent is provided in a portion on the positive side in the x-axis direction of the optical fiber insertion portion 42a. Further, the recess D3 is recessed from the upper surface to the lower surface of the optical fiber insertion portion 42a.
  • An insertion port H7 is provided on the inner peripheral surface of the concave portion D3 on the negative side in the x-axis direction.
  • the insertion port H7 is connected to the inner peripheral surface of the opening A1 on the positive direction side in the x-axis direction. Therefore, the core wire of the optical fiber 60 reaches the recess D3 from the opening A1 through the insertion port H7.
  • the end surface of the core wire of the optical fiber 60 that has reached the recess D3 is positioned in the immediate vicinity of the inner peripheral surface S9 on the positive side in the x-axis direction of the recess D3.
  • the optical fiber 60 is fixed to the transmission-side plug 42 by injecting a matching agent made of a transparent resin, for example, an epoxy resin into the opening A1 and the recess D3.
  • a convex lens 44 is provided on the end surface S10 on the positive side in the x-axis direction of the optical fiber insertion portion 42a.
  • the convex lens 44 has a semicircular shape protruding in the positive direction side in the x-axis direction when seen in a plan view from a direction orthogonal to the x-axis direction. Accordingly, the laser beam B1 emitted from the light emitting element 100 and reflected by the total reflection surface R1 is condensed or collimated by the convex lens 44.
  • the convex lens 44 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Accordingly, the laser beam B1 collected or collimated by the convex lens 44 passes through the resin of the optical fiber insertion portion 42a. The laser beam B ⁇ b> 1 is transmitted to the core of the core of the optical fiber 60.
  • a protrusion N1 that engages with the engaging portion 32a of the metal cap 30 is provided on the surface S7 of the optical fiber insertion portion 42a.
  • the protrusion N1 is provided between the opening A1 and the recess D3 in the x-axis direction, and extends in the y-axis direction. Further, the protrusion N1 has a triangular shape protruding in the positive direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • a convex portion C7 is provided on the lower surface of the optical fiber insertion portion 42a.
  • the convex portion C7 corresponds to the groove G1 of the plug placement portion 222 of the positioning member 220.
  • the convex portion C7 is provided in parallel to the x-axis from the end surface S8 toward the end surface S10.
  • the protrusion 42b protrudes from the vicinity of the end of the optical fiber insertion portion 42a on the negative direction side in the x-axis direction to the negative direction side in the y-axis direction.
  • the transmission side plug 42 is L-shaped.
  • the protruding portion 42b functions as a grip portion when the transmitting side plug 42 is inserted and removed.
  • a substantially rectangular hollow hole is provided at the approximate center of the protrusion 42b when viewed in plan from the z-axis direction.
  • connection work between the transmission side plug 42 and the receptacle 20 is performed by pushing the convex portion C7 along the groove G1 to the positive side in the x-axis direction.
  • the end surface S11 on the positive side in the x-axis direction of the protrusion 42b abuts against the end surface S3 of the abutting portion 228 of the positioning member 220 shown in FIG.
  • the convex lens 44 is not in contact with the end surface S2 of the main body 226, and a gap of about 5 ⁇ m is provided. This is to prevent the transmittance from decreasing due to scratches and dirt on the convex lens 44 and the end surface S2 of the main body 226 due to contact.
  • the engaging portion 32a of the metal cap 30 is engaged with the protrusion N1, and the engaging portion 32c is formed by the surface S7 and the end surface S8 of the transmission side plug 42.
  • the transmission side plug 42 is fixed to the receptacle 20.
  • the receiving side plug 46 is used to fix the optical fiber 60 to the positioning member 240. Moreover, the receiving side plug 46 is provided with the optical fiber insertion part 46a and the projection part 46b, as shown in FIG.
  • the optical fiber insertion portion 46a constitutes a portion on the negative direction side in the y-axis direction of the reception side plug 46, and has a rectangular parallelepiped shape extending in the x-axis direction.
  • An opening A2 is provided in a portion on the negative direction side in the x-axis direction of the optical fiber insertion portion 46a. A resin for fixing the optical fiber 60 is injected into the opening A2.
  • the opening A2 is formed by cutting out the surface S12 located on the upper surface of the optical fiber insertion portion 46a and the end surface S13 on the negative side in the x-axis direction.
  • An insertion port H8 for guiding the core wire of the inserted optical fiber 60 to the tip of the receiving side plug 46 is provided on the inner peripheral surface on the positive side in the x-axis direction of the opening A2.
  • the number of insertion ports H8 corresponds to the number of optical fibers 60, and is two in this embodiment.
  • a concave portion D4 for injecting a matching agent is provided in a portion on the positive side in the x-axis direction in the optical fiber insertion portion 46a. Further, the recess D4 is recessed from the upper surface to the lower surface of the optical fiber insertion portion 46a.
  • An insertion port H8 is provided on the inner peripheral surface of the concave portion D4 on the negative side in the x-axis direction.
  • the insertion port H8 is connected to the inner peripheral surface of the opening A2 on the positive direction side in the x-axis direction. Therefore, the core wire of the optical fiber 60 reaches the recess D4 from the opening A2 through the insertion port H8.
  • the end surface of the core wire of the optical fiber 60 that has reached the recess D4 is positioned in the immediate vicinity of the inner peripheral surface S14 on the positive direction side in the x-axis direction of the recess D4. Then, the optical fiber 60 is fixed to the receiving side plug 46 by pouring a matching agent made of a transparent resin, for example, an epoxy resin into the opening A2 and the recess D4.
  • a convex lens 48 is provided on the end surface S15 on the positive side in the x-axis direction of the optical fiber insertion portion 46a, as shown in FIG.
  • the convex lens 48 has a semicircular shape protruding in the positive direction side in the x-axis direction when seen in a plan view from a direction orthogonal to the x-axis.
  • the convex lens 48 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Accordingly, the laser beam B2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 48 and proceeds to the total reflection surface R2. Then, the laser beam B ⁇ b> 2 is reflected by the total reflection surface R ⁇ b> 2 and transmitted to the light receiving element 50.
  • a projection N2 that engages with the engaging portion 32b of the metal cap 30 is provided on the surface S12 of the optical fiber insertion portion 46a.
  • the protrusion N2 is provided between the opening A2 and the recess D4 in the x-axis direction, and extends in the y-axis direction. Further, the protrusion N2 has a triangular shape protruding in the positive direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • the protrusion 46b protrudes from the end of the optical fiber insertion portion 46a on the negative direction side in the x-axis direction to the positive direction side in the y-axis direction.
  • the receiving side plug 46 is L-shaped.
  • the protruding portion 46b functions as a grip portion when the receiving side plug 46 is inserted and removed.
  • a substantially rectangular hollow hole is provided in the approximate center of the protrusion 46b when viewed in plan from the z-axis direction.
  • the engaging portion 32b of the metal cap 30 is engaged with the protrusion N2, and the engaging portion 32d is formed by the surface S12 and the end surface S13 of the receiving side plug 46.
  • the receiving side plug 46 is fixed to the receptacle 20 by engaging with the corner.
  • the laser beam B 1 emitted from the light emitting element 100 to the positive side in the z-axis direction passes through the sealing resin 24 and the positioning member 220. To do. Further, the laser beam B1 is reflected by the total reflection surface R1 to the negative direction side in the x-axis direction, passes through the plug 40, and is transmitted to the core of the optical fiber 60.
  • the laser beam B 2 emitted from the optical fiber 60 to the positive side in the x-axis direction passes through the positioning member 240. Further, the laser beam B ⁇ b> 2 is reflected by the total reflection surface R ⁇ b> 2 to the negative direction side in the z-axis direction, passes through the sealing resin 24, and is transmitted to the light receiving element 50.
  • solder is applied to the upper surface of a mother substrate 122 (not shown in the drawing) that is an assembly of the mounting substrates 22. More specifically, cream solder is pressed onto the mother substrate 122 on which the metal mask is placed using a squeegee. Then, the solder is printed on the mother substrate 122 by removing the metal mask from the mother substrate 122.
  • the capacitor is placed on the solder of the mother board 122. Thereafter, heat is applied to the mother substrate 122 to solder the capacitor.
  • Ag paste is applied to a predetermined position on the mother board 122.
  • the drive circuit 26, the light receiving element 50, and the light emitting element 100 are placed on the coated Ag, and die bonding is performed. Further, the drive circuit 26 and the light receiving element 50 are connected by wire bonding using an Au wire, and the drive circuit 26 and the light emitting element 100 are connected by wire bonding. Further, the drive circuit 26 and the mother substrate 122 are connected by wire bonding.
  • the mother substrate 122 is cut using a dicer to obtain a plurality of mounting substrates 22.
  • the positioning member 220 is placed on the mounting substrate 22. More specifically, a UV curable adhesive is applied to a portion where the positioning member 220 and the mounting substrate 22 are in contact with each other. After applying the adhesive, as shown in FIG. 12, the position of the center T100 of the light emitting part of the light emitting element 100 is confirmed by the position recognition camera V1.
  • the mounting machine V2 for placing the positioning member 220 on the mounting substrate 22 picks up and picks up the positioning member 220. Then, with the mounting machine V2 adsorbing the positioning member 220, the position recognition camera V3 confirms the position of the lens center T230 of the convex lens 230 of the positioning member 220.
  • the relative position of the part and the convex lens 230 is calculated. Based on the calculated result, the movement amount of the onboard machine V2 is determined.
  • the positioning member 220 is moved by the determined movement amount by the mounting machine V2. Thereby, the lens center T230 of the convex lens 230 and the optical axis of the light emitting element 100 coincide.
  • the work of placing the positioning member 240 on the mounting substrate 22 is performed. More specifically, after a UV curable adhesive is applied to the portion where the positioning member 240 and the mounting substrate 22 are in contact, the position of the center T50 of the light receiving portion of the light receiving element 50 is positioned as shown in FIG. Confirm with the recognition camera V4.
  • the mounting machine V5 for placing the positioning member 240 on the mounting substrate 22 picks up and picks up the positioning member 240. Then, the position of the lens center T250 of the convex lens 250 of the positioning member 240 is confirmed by the position recognition camera V6 with the mounting machine V5 sucking the positioning member 240.
  • the light receiving element 50 receives light from the position data of the center T50 of the light receiving portion of the light receiving element 50 confirmed by the position recognition camera V4 and the position data of the lens center T250 of the convex lens 250 of the positioning member 240 confirmed by the position recognition camera V6.
  • the relative position of the part and the convex lens 250 is calculated. Based on the calculated result, the movement amount of the onboard machine V5 is determined.
  • the positioning member 240 is moved by the determined movement amount by the mounting machine V5. Thereby, the lens center T250 of the convex lens 250 and the optical axis of the light receiving element 50 coincide.
  • the positioning members 220 and 240 Irradiate ultraviolet rays to the positioning members 220 and 240 arranged. During ultraviolet irradiation, the positioning members 220 and 240 are pressed against the mounting board 22 by the mounting machines V2 and V5. Accordingly, when the UV curable adhesive between the positioning members 220 and 240 and the mounting substrate 22 is cured, the positioning members 220 and 240 are fixed to the mounting substrate 22 without causing positional displacement. .
  • the metal cap 30 is attached to the mounting substrate 22 on which the positioning member 200 is placed. More specifically, on the upper surface of the mounting substrate 22, the distance H ⁇ b> 1 between the leg 232 a and the leg 232 b in the main body 226 of the positioning member 220, and the leg 246 a and the leg 246 b in the main body 226 of the positioning member 220.
  • a thermosetting adhesive such as epoxy is applied to the space H2 and the portion where the convex portions C2 and C5 of the metal cap 30 are in contact.
  • a conductive paste such as Ag is applied to the ground conductor exposed portions E2 and E3 of the mounting substrate 22.
  • the convex portion C3 of the metal cap 30 is fitted into the portion sandwiched between the leg portion 226a and the leg portion 226b, that is, the interval H1. Further, the convex portion C6 is fitted into a portion sandwiched between the leg portion 246a and the leg portion 246b, that is, the interval H2. Thereby, the position of the metal cap 30 with respect to the mounting substrate 22 is determined. Simultaneously with the positioning of the metal cap 30, the convex portions C1 to C6 come into contact with the adhesive or conductive paste on the mounting substrate 22.
  • the metal cap 30 After fitting the metal cap 30, heat is applied to the mounting substrate 22 to cure the adhesive and the conductive paste. Thereby, the metal cap 30 is fixed to the mounting substrate 22. Note that, by attaching the metal cap 30 to the mounting substrate 22, the convex portions C ⁇ b> 1 and C ⁇ b> 4 of the metal cap 30 come into contact with the ground conductor exposed portions E ⁇ b> 2 and E ⁇ b> 3 of the mounting substrate 22. Thereby, the metal cap 30 is connected to the ground conductor in the mounting substrate 22 and is kept at the ground potential.
  • the receptacle 20 is completed by the process as described above.
  • the optical fiber 60 inserted into the plug 40 is cut into a predetermined length.
  • the coating near the tip of the optical fiber 60 is removed using an optical fiber stripper. After removing the coating in the vicinity of the tip, cleaving is performed to bring out the cleavage plane of the core wire of the optical fiber 60.
  • the optical fiber 60 is pushed through the openings A1 and A2 so that the end of the core wire of the optical fiber 60 comes close to the surfaces S9 and S14 of the plug 40. Further, a transparent resin such as an epoxy resin for fixing the optical fiber 60 is injected into the openings A1 and A2 and the recesses D3 and D4 of the plug 40 shown in FIG. Then, the optical fiber 60 is fixed to the plug 40 by curing the transparent resin.
  • a transparent resin such as an epoxy resin for fixing the optical fiber 60 is injected into the openings A1 and A2 and the recesses D3 and D4 of the plug 40 shown in FIG.
  • the positioning member 220 is provided for the light emitting element 100, and the positioning member 240 is provided for the light receiving element 50. Therefore, the positioning member 220 can be arranged according to the mounting position of the light emitting element 100, and the positioning member 240 can be arranged according to the mounting position of the light receiving element 50. That is, since the positioning member 220 and the positioning member 240 can be arranged independently, when a specific optical element and the positioning member are aligned as in the case where there is one positioning member for a plurality of optical elements, The positional relationship between the other optical elements and the positioning member is not shifted. Therefore, in the receptacle 20 and the optical transmission module 10, it is possible to suppress the influence of the positional deviation when each optical element is mounted, as compared with the case where there is one positioning member for the plurality of optical elements.
  • the receptacle 20 and the optical transmission module 10 do not require so-called sealing resin that prevents dust from adhering to the light emitting element 100 and the light receiving element 50 and protects the light emitting element 100 and the light receiving element 50 from dust adhesion.
  • the difference between the receptacle 20 ⁇ / b> A and the receptacle 20, which is the first modification, is the shape of the metal cap 30.
  • Other configurations are the same as those in the above embodiment. Therefore, in the present modification, the description other than the metal cap 30 is as described in the above embodiment.
  • a metal plate portion 38 extending in the x-axis direction is provided at the approximate center in the y-axis direction on the lower surface of the top plate portion 32.
  • the metal plate portion 38 has a substantially rectangular shape when viewed from the y-axis direction. Further, when the metal plate portion 38 is mounted on the receptacle 20 ⁇ / b> A, the metal plate portion 38 fits in the gap between the positioning member 220 and the positioning member 240 as shown in FIG. 14. That is, the metal plate portion 38 extends from the lower surface of the top plate portion 32 toward the gap between the positioning member 220 and the positioning member 240.
  • high-viscosity resin is provided on both surfaces of the metal plate portion 38 in the y-axis direction.
  • the metal plate portion 38 is mounted on the receptacle 20 ⁇ / b> A, the high-viscosity resin together with the metal plate portion 38 fits in the gap between the positioning member 220 and the positioning member 240.
  • FIG. 2 is used for the external perspective view of the receptacle 20A.
  • the metal cap 30 in FIG. 2 is the metal cap 30A shown in FIG. 13 in the receptacle 20A.
  • a metal material is embedded in the positioning member 200.
  • a sheet metal 300 made of phosphor bronze, iron, copper, brass, or the like is bent so as to have the outer shape of the positioning member 200 as shown in FIG. .
  • the sheet metal 300 is placed on a molding die, and a resin is poured therein, whereby the positioning member 200 with the sheet metal 300 embedded therein as shown in FIGS. 17 to 22 is completed. To do.
  • the sheet metal 300 is disposed so as not to overlap the optical path connecting the optical fiber 60 and the light emitting element 100 and the optical path connecting the optical fiber 60 and the light receiving element 50.
  • Other configurations are the same as those in the above embodiment. Accordingly, in the present modification, the description other than the positioning member 200 is as described in the above embodiment.
  • the positioning member 200 has improved rigidity due to the metal material embedded in the positioning member 200. Thereby, since the deformation of the positioning member 200 can be suppressed, the optical coupling between the optical fiber 60 and the light emitting element 100 or the optical coupling between the optical fiber 60 and the light receiving element 50 can be maintained well.
  • the receptacle and the optical transmission module according to the present invention are not limited to the receptacles 20, 20 ⁇ / b> A, 20 ⁇ / b> B and the optical transmission module 10 according to the embodiment, and can be changed within the scope of the gist thereof.
  • the light emitting element 100 may be replaced with an optical element array that is an aggregate of these
  • the light receiving element 50 may be a light receiving element array that is an aggregate of these.
  • A1 to A5 Openings SP1, SP2 Space 10 Optical transmission module 20, 20A, 20B Receptacle 22 Mounting substrate 30 Metal cap 38 Metal plate 50
  • Light receiving element (optical element) 60
  • Optical fiber 100
  • Optical coupling portion 260 Resin

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un réceptacle et un module de transmission par fibre optique équipés d'une pluralité d'éléments optiques. Plus précisément, l'invention a pour objectif de fournir un réceptacle et un module de transmission par fibre optique qui permettent de supprimer l'influence d'un décalage de position dû à une installation irrégulière de la pluralité d'éléments optiques. Le réceptacle (20) est équipé d'éléments récepteurs de lumière (50) qui sont des éléments optiques, d'éléments luminescents (100) qui sont aussi des éléments optiques, et d'un organe de positionnement (200). Cet organe de positionnement (200) lie de manière optique les éléments récepteurs de lumière (50) et une fibre optique (60), et lie également de manière optique les éléments luminescents (100) et la fibre optique (60). L'organe de positionnement (200) est agencé sur chaque élément luminescent.
PCT/JP2013/071777 2012-08-23 2013-08-12 Réceptacle, et module de transmission par fibre optique Ceased WO2014030566A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2012184391 2012-08-23
JP2012-184391 2012-08-23
JP2012200652 2012-09-12
JP2012-200652 2012-09-12
JP2012-221552 2012-10-03
JP2012221552 2012-10-03
JP2013153715 2013-07-24
JP2013-153715 2013-07-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110770555A (zh) * 2017-04-20 2020-02-07 特里纳米克斯股份有限公司 光学检测器

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6240639A (ja) * 1985-08-15 1987-02-21 Olympus Optical Co Ltd 光学式ピツクアツプ
JPH118413A (ja) * 1997-06-18 1999-01-12 Sumitomo Electric Ind Ltd 光リンク
JP2007199461A (ja) * 2006-01-27 2007-08-09 Seiko Epson Corp 光モジュール
JP2007264411A (ja) * 2006-03-29 2007-10-11 Suzuka Fuji Xerox Co Ltd 光モジュール
JP2009164308A (ja) * 2007-12-28 2009-07-23 Opnext Japan Inc 光送受信モジュール
JP2011248243A (ja) * 2010-05-28 2011-12-08 Fujitsu Component Ltd 光電変換モジュール及び光電変換装置
US20120189306A1 (en) * 2011-01-21 2012-07-26 Finisar Corporation Multi-laser transmitter optical subassemblies for optoelectronic modules

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6240639A (ja) * 1985-08-15 1987-02-21 Olympus Optical Co Ltd 光学式ピツクアツプ
JPH118413A (ja) * 1997-06-18 1999-01-12 Sumitomo Electric Ind Ltd 光リンク
JP2007199461A (ja) * 2006-01-27 2007-08-09 Seiko Epson Corp 光モジュール
JP2007264411A (ja) * 2006-03-29 2007-10-11 Suzuka Fuji Xerox Co Ltd 光モジュール
JP2009164308A (ja) * 2007-12-28 2009-07-23 Opnext Japan Inc 光送受信モジュール
JP2011248243A (ja) * 2010-05-28 2011-12-08 Fujitsu Component Ltd 光電変換モジュール及び光電変換装置
US20120189306A1 (en) * 2011-01-21 2012-07-26 Finisar Corporation Multi-laser transmitter optical subassemblies for optoelectronic modules

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110770555A (zh) * 2017-04-20 2020-02-07 特里纳米克斯股份有限公司 光学检测器

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