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WO2014026675A3 - Method for producing hollow bodies, particularly for coolers, and electrical or electronic components containing hollow bodies and/or coolers - Google Patents

Method for producing hollow bodies, particularly for coolers, and electrical or electronic components containing hollow bodies and/or coolers Download PDF

Info

Publication number
WO2014026675A3
WO2014026675A3 PCT/DE2013/100290 DE2013100290W WO2014026675A3 WO 2014026675 A3 WO2014026675 A3 WO 2014026675A3 DE 2013100290 W DE2013100290 W DE 2013100290W WO 2014026675 A3 WO2014026675 A3 WO 2014026675A3
Authority
WO
WIPO (PCT)
Prior art keywords
coolers
hollow bodies
stack
electrical
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2013/100290
Other languages
German (de)
French (fr)
Other versions
WO2014026675A2 (en
Inventor
Jürgen SCHULZ-HARDER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Curamik Electronics GmbH
Original Assignee
Curamik Electronics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Curamik Electronics GmbH filed Critical Curamik Electronics GmbH
Publication of WO2014026675A2 publication Critical patent/WO2014026675A2/en
Publication of WO2014026675A3 publication Critical patent/WO2014026675A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Method for producing hollow bodies, particularly for coolers, with at least two metal layers arranged by stacking to create a stack and connected to one another via at least one connecting or bond layer, and with at least one cavity formed inside the stack and produced by structuring at least one metal layer, wherein a layer made of a bonding material is applied before the stack is created to at least one of the surface sides of the metal layers adjoining one another in the stack, and is formed after the stack is created into the bond layer connecting the metal layers.
PCT/DE2013/100290 2012-08-17 2013-08-12 Method for producing hollow bodies, particularly for coolers, hollow body and cooler containing electrical and/or electronic components Ceased WO2014026675A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012107570.0A DE102012107570B4 (en) 2012-08-17 2012-08-17 Process for the production of hollow bodies, in particular of coolers, hollow bodies and coolers containing electrical or electronic assemblies
DE102012107570.0 2012-08-17

Publications (2)

Publication Number Publication Date
WO2014026675A2 WO2014026675A2 (en) 2014-02-20
WO2014026675A3 true WO2014026675A3 (en) 2014-04-17

Family

ID=49115335

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2013/100290 Ceased WO2014026675A2 (en) 2012-08-17 2013-08-12 Method for producing hollow bodies, particularly for coolers, hollow body and cooler containing electrical and/or electronic components

Country Status (3)

Country Link
DE (1) DE102012107570B4 (en)
TW (1) TW201424900A (en)
WO (1) WO2014026675A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014204347A1 (en) * 2014-03-10 2015-09-10 Siemens Aktiengesellschaft Spark plasma sintering with improved joining zone strength
DE102014213490C5 (en) 2014-07-10 2020-06-18 Continental Automotive Gmbh Cooling device, method for producing a cooling device and power circuit
DE102015216887C5 (en) 2015-09-03 2025-11-27 Schaeffler Technologies AG & Co. KG Cooling device, method for manufacturing a cooling device and power circuit
CN106449567B (en) * 2016-11-26 2018-11-23 江苏拓博制冷科技有限公司 A kind of cooler
TWI749708B (en) * 2020-08-14 2021-12-11 大陸商廣州力及熱管理科技有限公司 A high-power vapor chamber structure manufacturing method
DE102023131882A1 (en) 2023-11-15 2025-05-15 TRUMPF Hüttinger GmbH + Co. KG Cooling arrangement, electronic assembly, electrical power converter and method for assembling the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1253685A1 (en) * 2000-10-20 2002-10-30 Mitsubishi Denki Kabushiki Kaisha Cooler, semiconductor laser light source, semiconductor laser light source unit, method for producing semiconductor laser light source unit, and solid laser
US20060108100A1 (en) * 2002-04-11 2006-05-25 Lytron, Inc. Contact cooling device
DE102005051142A1 (en) * 2004-11-11 2006-06-01 Taiwan Microloops Corp., Kweishan Bendable heat spreader with metallic microstructure based on a wire mesh and method for producing the same
DE202007007568U1 (en) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington A flat heatpipe (heat pipe) and heat sink using them
US20100307730A1 (en) * 2009-06-03 2010-12-09 High Conduction Scientific Co., Ltd. Liquid-cooled heat dissipating device and method of making the same
US20100307722A1 (en) * 2009-06-09 2010-12-09 Sony Corporation Heat transport device and method for manufacturing the same

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
GB931096A (en) * 1958-07-02 1963-07-10 Minnesota Mining & Mfg Improvements in ceramic articles
DE2213115C3 (en) * 1972-03-17 1975-12-04 Siemens Ag, 1000 Berlin Und 8000 Muenchen Process for the high-strength joining of ceramics made of carbides, including diamonds, borides, nitrides or suicides, with metal by the dry soldering process
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
JPH0810710B2 (en) * 1984-02-24 1996-01-31 株式会社東芝 Method for manufacturing good thermal conductive substrate
IN168174B (en) * 1986-04-22 1991-02-16 Siemens Ag
JP4015796B2 (en) * 1999-03-31 2007-11-28 Ｓｐｓシンテックス株式会社 Automatic pulse current pressure sintering method and system
DE10016129A1 (en) * 2000-03-31 2001-10-18 Siemens Ag Method for establishing a heat-conducting connection between two workpieces
DE102006003735A1 (en) * 2006-01-26 2007-08-09 Infineon Technologies Ag Arrangement for fixing electronic components on a support
DE102009000192A1 (en) * 2009-01-14 2010-07-15 Robert Bosch Gmbh Sintered material, sintered compound and method for producing a sintered compound

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1253685A1 (en) * 2000-10-20 2002-10-30 Mitsubishi Denki Kabushiki Kaisha Cooler, semiconductor laser light source, semiconductor laser light source unit, method for producing semiconductor laser light source unit, and solid laser
US20060108100A1 (en) * 2002-04-11 2006-05-25 Lytron, Inc. Contact cooling device
DE102005051142A1 (en) * 2004-11-11 2006-06-01 Taiwan Microloops Corp., Kweishan Bendable heat spreader with metallic microstructure based on a wire mesh and method for producing the same
DE202007007568U1 (en) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington A flat heatpipe (heat pipe) and heat sink using them
US20100307730A1 (en) * 2009-06-03 2010-12-09 High Conduction Scientific Co., Ltd. Liquid-cooled heat dissipating device and method of making the same
US20100307722A1 (en) * 2009-06-09 2010-12-09 Sony Corporation Heat transport device and method for manufacturing the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Ceramics and Composites Processing Methods", 1 January 2012, JOHN WILEY & SONS, US, ISBN: 978-0-47-055344-2, article RAJENDRA K. BORDIA ET AL: "Part 1: SINTERING: FUNDAMENTALS AND PRACTICE", pages: 3 - 42, XP055101655, DOI: 10.1002/9781118176665.ch1 *
SALVATORE GRASSO ET AL: "Electric current activated/assisted sintering ( ECAS ): a review of patents 1906-2008", SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, vol. 10, no. 5, 053001, 1 October 2009 (2009-10-01), pages 1 - 24, XP055101409, ISSN: 1468-6996, DOI: 10.1088/1468-6996/10/5/053001 *

Also Published As

Publication number Publication date
WO2014026675A2 (en) 2014-02-20
DE102012107570A1 (en) 2014-02-20
DE102012107570B4 (en) 2017-08-03
TW201424900A (en) 2014-07-01

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