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WO2014024867A1 - Système et procédé de production de dispositif d'affichage optique - Google Patents

Système et procédé de production de dispositif d'affichage optique Download PDF

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Publication number
WO2014024867A1
WO2014024867A1 PCT/JP2013/071217 JP2013071217W WO2014024867A1 WO 2014024867 A1 WO2014024867 A1 WO 2014024867A1 JP 2013071217 W JP2013071217 W JP 2013071217W WO 2014024867 A1 WO2014024867 A1 WO 2014024867A1
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WO
WIPO (PCT)
Prior art keywords
optical
optical member
bonding
cutting
member sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/071217
Other languages
English (en)
Japanese (ja)
Inventor
幹士 藤井
大充 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP2014529503A priority Critical patent/JP5791018B2/ja
Priority to KR1020157003602A priority patent/KR102031401B1/ko
Priority to CN201380041452.8A priority patent/CN104520916B/zh
Publication of WO2014024867A1 publication Critical patent/WO2014024867A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

Definitions

  • the present invention relates to a production system and production method for an optical display device such as a liquid crystal display.
  • This application claims priority based on Japanese Patent Application No. 2012-175963 filed on Aug. 08, 2012 and Japanese Patent Application No. 2013-104402 filed on May 16, 2013, and its contents Is hereby incorporated by reference.
  • an optical member such as a polarizing plate to be bonded to a liquid crystal panel (optical display component) is formed from a long film into a sheet piece having a size matching the display area of the liquid crystal panel. After being cut out, it is bonded to a liquid crystal panel (for example, see Patent Document 1).
  • Patent Document 1 employs a method of cutting an optical member from an optical member sheet by cutting using a cutter. Further, as a method of cutting out the optical member from the optical member sheet, a cutting process using a laser beam can be considered instead of the cutting process using a cutter.
  • the cutting process using laser light has a smaller runout width (tolerance) of the cutting line than the cutting process using a cutter such as a cutter, and can improve the cutting accuracy.
  • the cutting process using laser light may be referred to as “laser cut”.
  • the optical layer may include a film layer having a low average absorption rate of laser light in the oscillation wavelength range of the irradiated laser light. is there.
  • a film layer having a low average absorptance of laser light in the oscillation wavelength range of the irradiated laser light may be referred to as a “low absorptivity film layer”.
  • an optical member formed by laser-cutting an optical member sheet including a low absorptivity film layer has a problem that the cut end is largely thermally deformed and the effective area of the optical member is narrowed.
  • the present invention has been made in view of the above circumstances, and while reducing the frame portion around the display area to enlarge the display area and miniaturize the device, suppress thermal deformation of the cut end of the optical member due to laser cutting.
  • An optical display device production system and production method capable of expanding the effective area of an optical member are provided.
  • An optical display device production system is an optical display device production system in which an optical member is bonded to an optical display component.
  • the optical display component displays the optical display component on the optical display component.
  • a laminating device that is larger than the region and includes an optical member sheet including an optical layer having a laminated structure to form a bonded body, and a cutting device having a laser light irradiation device that irradiates a laser beam for cutting processing.
  • the cutting device separates the facing portion of the optical member sheet in the bonded body from the display region and the excess portion outside the facing portion, and has a size corresponding to the display region from the optical member sheet.
  • the optical member is formed, and the laser beam irradiation device is directed to the cut portion between the facing portion and the surplus portion of the optical member sheet in the bonded body.
  • the plurality of layers included in the optical layer structure focusing on the layer closest to the optical display component, and then irradiating the laser beam.
  • the optical member of the size corresponding to a display area is cut
  • cutting using laser light is more accurate than cutting using a cutting blade, and the frame portion around the display area can be narrower than when using a cutting blade.
  • the optical member sheet can be efficiently cut by irradiating laser light with focusing on the layer closest to the optical display component (generally a low absorption film layer) of the optical member sheet.
  • the thermal deformation of the cut end of the optical display device can be suppressed, and the surface damage of the optical display component can be suppressed, so that the frame of the optical display device can be further reduced.
  • the “part facing the display area” in the above configuration is an area that is not less than the size of the display area and not more than the size of the outer shape (contour shape in plan view) of the optical display component, and the electrical component mounting portion. The area where functional parts such as are avoided is shown. That is, the said structure includes the case where the surplus part is laser-cut along the outer periphery of an optical display component.
  • the “size corresponding to the display area” in the above configuration is a size not less than the size of the display area and not more than the size of the outer shape (contour shape in plan view) of the optical display component, and It refers to a size that avoids a functional part such as an electric part mounting part in an optical display part.
  • the “laser beam for cutting” in the above configuration means that the irradiated laser beam is used for cutting the optical member sheet. In this sense, the cutting process may be performed only by laser light irradiation. The cutting process may be performed by laser light irradiation and other additional operations.
  • the laser light irradiation device may be configured to form a cutting line in which the layer closest to the optical display component is partially cut and left in the cutting portion. .
  • damage to the surface of the optical display component can be effectively suppressed as compared with the case where the laser is completely cut to the layer closest to the optical display component.
  • the cutting device further includes a tearing device, and the tearing device includes an excess portion of the optical member sheet after the cutting device forms the cutting line.
  • the optical display component may be configured to be displaced toward the optical display component in a direction intersecting with a bonding surface on which the optical member sheet is bonded and torn from the facing portion. If it is this structure, while an excess part can be easily removed by tearing, the peeling by the tearing of the optical member left to affix to an optical display component, and disorder of a cut end can be suppressed.
  • the bonding body further includes a detection unit that detects an outer peripheral edge of a bonding surface between the optical member sheet and the optical display component. And the structure set along the said outer periphery may be sufficient as the said cutting
  • the “bonding surface between the optical member sheet and the optical display component” in the above configuration refers to a surface facing the optical member sheet of the optical display component, and specifically, “the outer peripheral edge of the bonding surface” In the optical display component, the outer peripheral edge of the substrate on which the optical member sheet is bonded is indicated.
  • An optical display device production method is an optical display device production method in which an optical member is bonded to an optical display component, and the optical display component includes the optical display component.
  • a bonding step of bonding an optical member sheet that is larger than the display area and including an optical layer having a laminated structure to form a bonded body, and a facing portion and the facing surface of the optical member sheet in the bonded body and the display area A laser for cutting processing, focusing on a layer closest to the optical display component among a plurality of layers included in the optical layer of the laminated structure, toward a cutting portion between an excess portion outside the portion
  • the cutting step further includes a laser irradiation step, and the laser irradiation step irradiates the cutting portion with laser light, and partially forms a layer closest to the optical display component.
  • the configuration may be such that a cutting line left uncut is formed.
  • the cutting step further includes a tearing step, and the tearing step includes an excess part of the optical member sheet after the cutting step forms the cutting line.
  • the optical display component may be displaced to the optical display component side in a direction intersecting with a bonding surface to which the optical member sheet is bonded, and torn from the facing portion.
  • the optical display device production system includes the optical member sheet, the optical display component, and the optical display component in the bonded body prior to the cutting step.
  • the structure which further has a detection process which detects the outer periphery of the bonding surface of this, and the said cutting part is set along the said outer periphery.
  • the frame portion around the display area is reduced to enlarge the display area and downsize the device, and the thermal deformation of the cut end of the optical member due to laser cutting is suppressed to increase the effective area of the optical member. be able to.
  • FIG. 1 shows the internal structure of the said 2nd cutting device.
  • FIG. 2 shows the internal structure of the said 2nd cutting device.
  • FIG. 2 shows the internal structure of the said 2nd cutting device.
  • FIG. 2 shows the internal structure of the said 2nd cutting device.
  • FIG. 2 shows the internal structure of the said 2nd cutting device.
  • FIG. 2 shows the internal structure of the said 2nd cutting device.
  • FIG. 8 is a cross-sectional view taken along the line AA of FIG. It is sectional drawing of the double-sided bonding panel which passed through the said film bonding system. It is sectional drawing of the liquid crystal panel and the bonding sheet bonded to this. It is sectional drawing of the state which carried out the laser cutting of the said bonding sheet
  • This embodiment demonstrates the production method of the optical display device using the film bonding system which comprises a part of production system of an optical display device as a production system of an optical display device, and a film bonding system.
  • an XYZ orthogonal coordinate system is set, the X direction indicates the width direction of the optical display component (liquid crystal panel), the Y direction indicates the conveyance direction of the optical display component, and the Z direction indicates the direction orthogonal to the X direction and the Y direction.
  • FIG. 1 shows a schematic configuration of a film bonding system (optical device production system) 1 of the present embodiment.
  • the film bonding system 1 bonds a film-shaped optical member such as a polarizing film, a retardation film, and a brightness enhancement film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.
  • the film bonding system 1 manufactures an optical member bonding body including the optical display component and the optical member.
  • a liquid crystal panel P is used as the optical display component.
  • Each part of the film bonding system 1 is comprehensively controlled by a control device 20 as an electronic control device.
  • the film bonding system 1 sequentially performs a predetermined process on the liquid crystal panels P while transporting the liquid crystal panels P from the start position to the end position using, for example, the drive roller conveyor 5.
  • the liquid crystal panel P is conveyed on the roller conveyor 5 with its front and back surfaces being horizontal.
  • the left side indicates the upstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport upstream side), and the right side in the diagram indicates the downstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport downstream side).
  • the liquid crystal panel P has a rectangular shape in plan view, and a display region P4 having an outer shape along the outer peripheral edge is formed on the inner side of the outer peripheral edge by a predetermined width.
  • the liquid crystal panel P is transported in a direction in which the short side of the display area P4 is substantially along the transport direction on the upstream side of the panel transport with respect to the second alignment device 14 described later. Further, the liquid crystal panel P is transported in a direction in which the long side of the display region P4 is substantially along the transport direction on the downstream side of the panel transport from the second alignment device 14.
  • First, second, and third optical members F11, F12, and F13 cut out from the long, strip-like first, second, and third optical member sheets F1, F2, and F3 with respect to the front and back surfaces of the liquid crystal panel P are provided. Bonded appropriately.
  • the first optical member (optical member, opposing portion) F11 and the third optical member (optical member, opposing portion) F13 as polarizing films are provided on both the backlight side and display surface side of the liquid crystal panel P.
  • a second optical member (an optical member, a facing portion) F12 as a brightness enhancement film is further laminated on the surface on the backlight side of the liquid crystal panel P so as to overlap the first optical member F11.
  • the film bonding system 1 includes a first alignment device 11 that transports the liquid crystal panel P from the upstream process to the panel transport upstream side of the roller conveyor 5 and aligns the liquid crystal panel P.
  • the 1st bonding apparatus (bonding apparatus) 12 provided in the panel conveyance downstream rather than the alignment apparatus 11, the 1st cutting apparatus 13 provided in proximity to the 1st bonding apparatus 12, and the 1st bonding apparatus 12 And a second alignment device 14 provided on the downstream side of the panel conveyance with respect to the first cutting device 13.
  • the film bonding system 1 is the 2nd bonding apparatus (bonding apparatus) 15 provided in the panel conveyance downstream rather than the 2nd alignment apparatus 14, and the 2nd provided in proximity to the 2nd bonding apparatus 15.
  • a cutting device (cutting device) 16 a third alignment device 17 provided on the downstream side of the panel transport relative to the second bonding device 15 and the second cutting device 16, and a downstream side of the panel transport relative to the third alignment device 17
  • the 3rd bonding apparatus (bonding apparatus) 18 and the 3rd cutting apparatus (cutting apparatus) 19 provided in proximity to the 3rd bonding apparatus 18 are provided.
  • the first alignment device 11 holds the liquid crystal panel P and freely conveys it in the vertical and horizontal directions.
  • the first alignment device 11 includes a camera (not shown) that images, for example, the upstream and downstream ends of the liquid crystal panel P.
  • the imaging data of this camera is sent to the control device 20.
  • the control device 20 operates the first alignment device 11 based on the imaging data and the inspection data in the optical axis direction stored in advance.
  • second and third alignment devices 14 and 17 described later also have cameras, and use image data of the cameras for alignment.
  • the first alignment device 11 is controlled by the control device 20 to perform alignment of the liquid crystal panel P with respect to the first bonding device 12.
  • the liquid crystal panel P is positioned in a horizontal direction (hereinafter referred to as a component width direction) orthogonal to the transport direction and in a rotation direction around the vertical axis (hereinafter simply referred to as a rotation direction).
  • the liquid crystal panel P is introduced into the bonding position of the first bonding apparatus 12.
  • the 1st bonding apparatus 12 is the upper surface (backlight side) of liquid crystal panel P conveyed below the lower surface of the elongate 1st optical member sheet
  • the 1st bonding apparatus 12 conveys the 1st optical member sheet
  • the transport device 12a holds the first original roll R1 around which the first optical member sheet F1 is wound, and rolls the first optical member sheet F1 along the longitudinal direction thereof, and a first optical member.
  • a protection film pf that overlaps the upper surface of the sheet F1 and is fed together with the first optical member sheet F1 is collected on the downstream side of the panel transfer of the first laminating device 12 and a pf collection unit 12d.
  • the pinching roll 12b has a pair of laminating rollers that are arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers. The inside of this gap becomes the bonding position of the first bonding apparatus 12.
  • the liquid crystal panel P and the first optical member sheet F1 are overlapped and introduced into the gap.
  • the liquid crystal panel P and the first optical member sheet F1 are sent out to the downstream side of the panel conveyance while being pressed between the bonding rollers.
  • the first bonding apparatus 12 allows the first optical member to be long while the plurality of liquid crystal panels P are spaced apart from each other.
  • seat F1 is formed.
  • the 1st cutting device 13 is located in the panel conveyance downstream rather than pf collection part 12d.
  • the 1st cutting device 13 forms the sheet piece F1S (refer FIG. 6) larger than the display area P4 (it is larger than liquid crystal panel P in this embodiment) from the 1st optical member sheet
  • the 1st cutting device 13 forms the 1st single-sided bonding panel (optical display component, bonding body) P11 by which the said sheet piece F1S larger than the display area P4 was bonded on the upper surface of liquid crystal panel P by the said cutting
  • the size of the portion that protrudes outside the liquid crystal panel P (the size of the surplus portion of the sheet piece F1S) is appropriately set according to the size of the liquid crystal panel P.
  • the distance between one side of the sheet piece F1S and one side of the liquid crystal panel P is 2 mm at each side of the sheet piece F1S. Set to a length in the range of ⁇ 5 mm.
  • the second alignment device 14 changes the direction so that the first single-sided bonding panel P11 that has been transported substantially parallel to the short side of the display region P4 is transported substantially parallel to the long side of the display region P4.
  • the said direction change is made
  • the second alignment device 14 performs the same alignment as the first alignment device 11. That is, the second alignment device 14 is based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera in the component width direction of the first single-sided bonding panel P11 with respect to the second bonding device 15. And positioning in the rotation direction. In this state, the first single-sided bonding panel P ⁇ b> 11 is introduced into the bonding position of the second bonding device 15.
  • the 2nd bonding apparatus 15 is the upper surface of the 1st single-sided bonding panel P11 conveyed below with respect to the lower surface of the elongate 2nd optical member sheet
  • the 2nd bonding apparatus 15 conveys the 2nd optical member sheet
  • seat F2 which the conveyance apparatus 15a conveys are provided.
  • the transport device 15a holds the second original roll R2 around which the second optical member sheet F2 is wound, and rolls the second optical member sheet F2 along the longitudinal direction thereof, and the pressure roll 15b.
  • a second recovery part (a tearing device) 15d that recovers an excess portion of the second optical member sheet F2 that has passed through the second cutting device 16 and is located on the downstream side of the panel conveyance.
  • the pinching roll 15b has a pair of laminating rollers arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers. The inside of this gap becomes the bonding position of the second bonding apparatus 15.
  • the first single-sided bonding panel P11 and the second optical member sheet F2 are overlapped and introduced into the gap. These 1st single-sided bonding panels P11 and the 2nd optical member sheet
  • seat F2 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers.
  • the second bonding device 15 allows the plurality of first single-sided bonding panels P11 to have a predetermined interval. While forming the 2nd bonding sheet
  • the 2nd cutting device 16 is located in the panel conveyance downstream rather than the pinching roll 15b.
  • the 2nd cutting device 16 is the sheet piece F1S of the 1st optical member sheet
  • the second cutting device 16 is, for example, a CO 2 laser cutter.
  • the second cutting device 16 cuts the second optical member sheet F2 and the sheet piece F1S endlessly along the outer peripheral edge of the display region P4 (in the present embodiment, along the outer peripheral edge of the liquid crystal panel P).
  • the 2nd cutting device 16 cuts each optical member sheet
  • the 2nd cutting device 16 cuts each optical member sheet
  • a bonding panel (optical display component, bonding body) P12 is formed (see FIG. 8).
  • the opposing part (each optical member F11, F12) with the 2nd single-sided bonding panel P12 and the display area P4 is cut off, and it remains in frame shape.
  • the optical member sheets F1 and F2 are separated into surplus portions Y and Y ′.
  • a plurality of surplus portions Y ′ of the second optical member sheet F2 are connected in a ladder shape (see FIG. 4). This surplus portion Y ′ is wound around the second recovery portion 15d together with the surplus portion Y of the first optical member sheet F1.
  • the “opposite part of the display area P4” is an area that is not less than the size of the display area P4 and not more than the size of the outer shape of the liquid crystal panel P, and avoids a functional part such as an electrical component mounting portion. Indicates the area.
  • the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P, and in one side corresponding to the functional portion, the liquid crystal The surplus portion is laser-cut at a position that appropriately enters the display region P4 side from the outer peripheral edge of the panel P.
  • the second cutting device 16 is configured to cut the second optical member sheet F2 and the sheet piece F1S of the first optical member sheet F1 at the same time. There may be a configuration in which only the sheet piece F1S of the member sheet F1 or only the second optical member sheet F2 is cut.
  • the third alignment device 17 reverses the second single-sided bonding panel P12 with the backlight side of the liquid crystal panel P as the upper surface so that the display surface side of the liquid crystal panel P is the upper surface.
  • the same alignment as that of the first and second alignment devices 11 and 14 is performed. That is, the 3rd alignment apparatus 17 is based on the inspection data of the optical axis direction memorize
  • the 3rd bonding apparatus 18 is the upper surface of the 2nd single-sided bonding panel P12 conveyed below with respect to the lower surface of the elongate 3rd optical member sheet
  • the 3rd bonding apparatus 18 conveys the 3rd optical member sheet
  • seat F3 which the conveyance apparatus 18a conveys are provided.
  • the conveying device 18a holds a third original roll R3 around which the third optical member sheet F3 is wound, a roll holding portion 18c that feeds the third optical member sheet F3 along its longitudinal direction, and a pressure roll 18b. And a third recovery part 18d that recovers the surplus portion of the third optical member sheet F3 that has passed through the third cutting device 19 and is located on the downstream side of the panel conveyance.
  • the pinching roll 18b has a pair of laminating rollers arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers. The inside of this gap becomes the bonding position of the third bonding apparatus 18.
  • the second single-sided bonding panel P12 and the third optical member sheet F3 are overlapped and introduced.
  • seat F3 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers.
  • the third bonding device 18 allows the plurality of second single-sided bonding panels P12 to leave a predetermined interval.
  • seat F23 bonded continuously to the lower surface of elongate 3rd optical member sheet
  • 3rd cutting device 19 is located in the panel conveyance downstream rather than pinching roll 18b, and cuts 3rd optical member sheet
  • the third cutting device 19 is a laser processing machine similar to the second cutting device 16, and the third optical member sheet F3 is endless along the outer peripheral edge of the display region P4 (for example, along the outer peripheral edge of the liquid crystal panel P). Disconnect.
  • seat F23 is the surplus part of the 3rd optical member sheet
  • a plurality of surplus portions of the third optical member sheet F3 are formed in a ladder shape like the surplus portions Y ′ of the second optical member sheet F2. The surplus portion of the third optical member sheet F3 is taken up by the third recovery portion 18d.
  • the double-sided bonding panel P13 is inspected for defects (bonding failure, etc.) through a defect inspection device (not shown) and then conveyed to the downstream process for other processing.
  • the optical member sheets F1, F2, and F3 are optical member sheets FX
  • the liquid crystal panels P that are bonded to the optical member sheets F1, F2, and F3 and the single-side bonded panels P11 and P12 are optical display components PX.
  • the optical members F11, F12, and F13 may be collectively referred to as an optical member FS.
  • the polarizer film constituting the optical member sheet FX is formed, for example, by uniaxially stretching a PVA film dyed with a dichroic dye.
  • the polarizer film has an unevenness in the optical axis direction between the inner side in the width direction and the outer side in the width direction of the optical member sheet FX due to unevenness in the thickness of the PVA film when stretched, uneven coloring in the dichroic dye, and the like. Differences tend to occur.
  • the first alignment device 11 and the second alignment device 14 are used.
  • the 3rd alignment apparatus 17 performs alignment of the optical display component PX bonded on the optical member sheet
  • the 1st bonding apparatus 12, the 2nd bonding apparatus 15, and the 3rd bonding apparatus 18 are bonding optical display component PX to the optical member sheet
  • the liquid crystal panel P includes a rectangular first substrate P1 made of, for example, a TFT substrate, a second rectangular substrate P2 disposed opposite to the first substrate P1, and a first substrate.
  • a liquid crystal layer P3 sealed between P1 and the second substrate P2 is included. For convenience of illustration, hatching of each layer is omitted.
  • the first substrate P1 has three sides of the outer periphery along the corresponding three sides of the second substrate P2, and the remaining one side of the outer periphery is a corresponding side of the second substrate P2. Overhang outside.
  • the electrical component attachment part P5 which protrudes outside the 2nd board
  • the second cutting device 16 detects the outer peripheral edge of the display area P4 with a detection unit such as a camera 16a, and the first and second optical members along the outer peripheral edge of the display area P4.
  • the sheets F1 and F2 are cut.
  • the third cutting device 19 similarly cuts the third optical member sheet F3 along the outer peripheral edge and the like of the display region P4 while detecting the outer peripheral edge of the display region P4 with a detection unit such as a camera 19a.
  • a frame portion G having a predetermined width for arranging a sealant or the like for joining the first and second substrates P1 and P2 is provided.
  • Each of the cutting devices 16 and 19 performs laser cutting within the width of the frame portion G.
  • the cut end of the optical member sheet FX may swell or wave due to thermal deformation. For this reason, when the optical member sheet FX after laser cutting is bonded to the optical display component PX, poor bonding such as air mixing and distortion is likely to occur in the optical member sheet FX.
  • the optical member sheet FX is laser-cut after the optical member sheet FX is bonded to the liquid crystal panel P
  • the cut end of the optical member sheet FX is backed up on the glass surface of the liquid crystal panel P. Therefore, the optical member sheet FX after laser cutting is less likely to cause swelling or undulation of the cut end of the optical member sheet FX.
  • the said bonding defect is hard to produce.
  • the runout width (tolerance) of the cutting line of the laser processing machine is smaller than the tolerance of the cutting blade such as a cutter. Therefore, in the film bonding system 1 of this embodiment, compared with the case where the optical member sheet
  • FIG. As a result, the liquid crystal panel P applied to the film bonding system 1 of the present embodiment can be downsized and / or the display area P4 can be enlarged. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.
  • the optical member sheet FX is cut into a sheet piece aligned with the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and their relative bonding Position tolerances overlap. Therefore, it becomes difficult to narrow the width of the frame portion G of the liquid crystal panel P (it becomes difficult to enlarge the display area).
  • the tolerance of the width of the frame part G can be reduced ( ⁇ 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).
  • the optical member sheet FX is cut with a laser beam instead of a blade. Therefore, in the film bonding system 1, the force at the time of cutting is not input to the liquid crystal panel P, and cracks and chips are less likely to occur at the edge of the substrate of the liquid crystal panel P, and durability against heat cycles and the like is improved. Similarly, in the film bonding system 1, since it is non-contact with the liquid crystal panel P when cutting the optical member sheet
  • the third cutting device 19 performs laser cutting on an extension of one long side of the display region P4, for example.
  • a starting point pt1 is set, and cutting of the one long side is started from the starting point pt1.
  • the third cutting device 19 sets the laser cut end point pt2 to a position where the laser beam goes around the display region P4 and extends on the extension of the short side on the start point side of the display region P4.
  • the start point pt1 and the end point pt2 are set so as to be able to withstand the tension when the optical member sheet FX is wound, leaving a predetermined connection allowance in the surplus portion of the optical member sheet FX.
  • FIG. 2 is a perspective view showing an example of a laser beam irradiation device 30 used as a cutting portion of the optical member sheet FX of each single-sided bonding panel P11, P12.
  • the second cutting device 16 is shown as an example in FIG. 2, the same configuration can be applied to the third cutting device 19.
  • the laser light irradiation device 30 includes a table 31, a scanner as the second cutting device 16, a moving device 32, and a control device 33.
  • the laser beam irradiation apparatus 30 operates each part based on control of the control apparatus 33 as an electronic control apparatus, and optical member sheet
  • the sheet piece F1S) is irradiated with a laser beam L, and the optical member sheet FX is cut into optical members FS having a predetermined size.
  • the table 31 has a holding surface 31a that holds the first single-sided bonding panel P11 (irradiation target).
  • the 2nd cutting device 16 scanner
  • the second cutting device 16 can scan the laser beam L biaxially in a plane parallel to the holding surface 31a of the table 31 (in the XY plane). That is, the second cutting device 16 can move relative to the table 31 independently in the X direction and the Y direction. Thereby, it is possible to move the second cutting device 16 to an arbitrary position on the table 31 and irradiate the laser beam L with high accuracy to an arbitrary position of the optical member sheet FX held on the table 31.
  • the moving device 32 enables the second cutting device 16 to move relative to the table 31.
  • the moving device 32 moves the second cutting device 16 relative to the table 31 in a first direction V1 (X direction) parallel to the holding surface 31a, a second direction parallel to the holding surface 31a and perpendicular to the first direction V1.
  • the relative movement is performed in the direction V2 (Y direction) and the third direction V3 (Z direction) which is the normal direction of the holding surface 31a.
  • the moving device 32 operates, for example, a linear motor of a slider mechanism provided in the second cutting device 16 (both not shown) to move the second cutting device 16 in each direction of XYZ.
  • the second cutting device 16 is moved by the moving device 32.
  • the table 31 may be moved by the same moving device as described above, and both the table 31 and the second cutting device 16 are moved. It may be configured.
  • FIG. 3 is a perspective view showing an internal configuration of the second cutting device 16 (scanner) in the laser light irradiation device 30.
  • the second cutting device 16 includes a laser beam oscillator 160, a first irradiation position adjustment device 161, a second irradiation position adjustment device 162, and a condenser lens 163.
  • the laser beam oscillator 160 is a device that oscillates the laser beam L.
  • a CO 2 laser beam oscillator carbon dioxide laser beam oscillator
  • Examples of the laser beam oscillator 160 include, but are not particularly limited to, a UV laser beam oscillator, a semiconductor laser beam oscillator, a YAG laser beam oscillator, and an excimer laser beam oscillator.
  • a CO 2 laser light oscillator is more preferable because it can oscillate laser light at a high output suitable for, for example, cutting of a polarizing film.
  • the first and second irradiation position adjusting devices 161 and 162 constitute a scanning element capable of biaxially scanning the laser beam L oscillated from the laser beam oscillator 160 in a plane parallel to the holding surface 31a.
  • a galvano scanner and a gimbal are used as the first and second irradiation position adjusting devices 161 and 162.
  • the first and second irradiation position adjusting devices 161 and 162 are arranged on the optical path of the laser beam L between the laser beam oscillator 160 and the condenser lens 163 from the laser beam oscillator 160 side.
  • the second irradiation position adjusting device 162 is arranged in this order.
  • the first irradiation position adjusting device 161 includes a mirror 161a and an actuator 161b that adjusts the installation angle of the mirror 161a.
  • the actuator 161b has a rotating shaft 161c parallel to the Z direction, and a mirror 161a is coupled to the rotating shaft 161c.
  • the second irradiation position adjusting device 162 includes a mirror 162a and an actuator 162b that adjusts the installation angle of the mirror 162a.
  • the actuator 162b has a rotation shaft 162c parallel to the Y direction, and connects the mirror 162a to the rotation shaft 162c.
  • the laser beam L oscillated from the laser beam oscillator 160 is applied to the optical member sheet FX held on the table 31 through the mirror 161a, the mirror 162a, and the condenser lens 163 in this order.
  • the first and second irradiation position adjusting devices 161 and 162 adjust the installation angles of the mirrors 161a and 162a by driving the actuators 161b and 162b.
  • the 1st and 2nd irradiation position adjustment apparatuses 161 and 162 carry out biaxial scanning of the irradiation position of the laser beam L irradiated toward the optical member sheet
  • the laser beam L oscillated from the laser beam oscillator 160 is focused on the focusing point Qa on the optical member sheet FX. .
  • the laser beam L is condensed at the condensing point Qb.
  • the laser beam L is condensed at the condensing point Qc.
  • the condensing lens 163 is arrange
  • the condensing lens 163 condenses the laser light L whose optical path is adjusted by the first and second irradiation position adjusting devices 161 and 162 at a predetermined position of the optical member sheet FX.
  • the condensing lens 163 is, for example, an f ⁇ lens.
  • the condensing lens 163 can condense the laser light L indicated by each line in the drawing inputted in parallel to the condensing lens 163 from the mirror 162a in parallel with the optical member sheet FX.
  • the control device 33 moves the laser light L that has passed through the condenser lens 163 so as to draw a desired trajectory on the optical member sheet FX held on the table 31 and the first and second irradiations.
  • the operation of the position adjusting devices 161 and 162 is controlled.
  • the optical member sheet FX is relatively moved with respect to the laser beam oscillator 160 by the nozzle method using the moving device 32, thereby enabling laser cutting over a wide range.
  • the laser beam L is biaxially scanned by a scanner method using the first and second irradiation position adjusting devices 161 and 162, so that detailed and highly accurate laser cutting can be performed.
  • the “nozzle method” indicates that the second cutting device 16 is moved relative to the table 31.
  • the “scanner method” means that the irradiation position of the laser light L irradiated toward the optical member sheet FX on the table 31 using the first and second irradiation position adjusting devices 161 and 162 is two. Refers to axial scanning.
  • FIG. 10 is a cross-sectional view of a state in which the protection film pf (separator) is separated from the first optical member sheet F1 and bonded to the liquid crystal panel P.
  • the protection film pf separator
  • the first optical member sheet F1 will be described as an example, but the second and third optical member sheets F2 and F3 have the same configuration.
  • the first optical member sheet F1 includes a film-like optical layer S1, an adhesive layer S2 provided on one surface (lower surface in the drawing) of the optical layer S1, and one surface of the optical layer S1 through the adhesive layer S2.
  • a protective film pf (separator, not shown in FIG. 10) and a surface protective film S4 laminated on the other surface (upper surface in the drawing) of the optical layer S1.
  • the optical layer S1 includes a sheet-like polarizer S6, a first film (layer closest to the optical display component) S7 bonded to one surface (the liquid crystal panel P side) of the polarizer S6, and the polarizer S6. And a second film S8 bonded to the other surface.
  • the first film S7 and the second film S8 are protective films that protect the polarizer S6, for example.
  • the optical layer S1 functions as a polarizing plate and is bonded over the entire display area P4 of the liquid crystal panel P. For convenience of illustration, hatching of each layer is omitted.
  • the first optical member sheet F1 has the adhesive layer S2 on the bonding surface T1 (backlight side in the present embodiment) of the liquid crystal panel P in a state where the protection film pf is separated while leaving the adhesive layer S2 on one surface. It is pasted through.
  • the film bonding system 1 of this embodiment conveys the 1st optical member sheet
  • a sheet body obtained by removing the protection film pf and the adhesive layer S2 from the first optical member sheet F1 (optical member sheet FX) is referred to as a bonding sheet S5.
  • the polarizer S6 is a polyvinyl alcohol (PVA) film layer.
  • the first film S7 is a cycloolefin polymer (COP) film layer.
  • the second film S8 is a triacetyl cellulose (TAC) film layer.
  • the surface protective film S4 (and the protection film pf) is a polyethylene terephthalate (PET) film layer.
  • the bonding sheet S ⁇ b> 5 having the optical layer S ⁇ b> 1 having the above laminated structure is laser-cut by the above-described second cutting device 16 in a state of being bonded to the bonding surface T ⁇ b> 1 of the liquid crystal panel P.
  • the 2nd cutting device 16 is the cutting part S between the opposing part (1st optical member F11) and the surplus part Y with respect to the display area P4 of liquid crystal panel P in the sheet
  • the laser light L is irradiated with the focus U on the layer immediately adjacent to the liquid crystal panel P (first film S7, low-absorbance film layer) of the optical layer S1 of the bonding sheet S5.
  • the first optical member sheet F1 is laser cut in a state where only the first optical member sheet F1 is bonded to one surface of the liquid crystal panel P.
  • the distance (focal length L1) from the surface T2 on the second cutting device 16 side in the bonding sheet S5 to the focal point U of the laser light L is the same as that for the bonding sheet S5 while suppressing damage to the liquid crystal panel P.
  • the focal distance L1 is equal to or greater than the thickness from the surface T2 on the second cutting device 16 side to the surface T3 on the second cutting device 16 side of the first film S7 in the bonding sheet S5, and the sheet S5 for bonding. Is set to be equal to or less than the thickness from the surface T2 on the second cutting device 16 side to the surface T4 on the liquid crystal panel P side of the first film S7.
  • the focal length L1 is adjusted according to irradiation conditions such as the output of the laser light L, the moving speed, and the spot diameter.
  • the focal length L1 is set by regarding them as an integral bonding sheet. do it. The same focusing is performed for the laser cut of the third optical member sheet F3.
  • a film layer having a high average absorptance of the laser light L in the oscillation wavelength range of the irradiated laser light L (a high absorptivity film layer, in this embodiment, a PET layer, a PVA layer and a TAC layer). Can be cut well even if the output of the laser beam L is suppressed.
  • a film layer having a low average absorptance of the laser beam L in the oscillation wavelength range of the irradiated laser beam L (a low absorptivity film layer, in this embodiment, a COP layer) in the bonding sheet S5 is a laser beam. It is necessary to cut by heat by increasing the output of L.
  • the low absorptivity film which is a layer nearest to an optical display component (liquid crystal panel P) among the several layers contained in optical layer S1 of sheet
  • the layer is irradiated with laser light L with the focal point U in focus (concentrating energy).
  • seat S5 can be cut
  • seat S5 can be cut
  • the process of irradiating the laser beam L to cut the optical member sheet (bonding sheet S5) to form the optical member corresponds to the cutting process of the present invention.
  • the low absorption rate film layer is preferably completely cut at intervals, but in order to further prevent damage to the liquid crystal panel P, as shown in FIG. 12A, the first film S7 (low absorption) of the optical layer S1. A portion of the film layer) may be left thinly or intermittently enough to be torn.
  • a cutting line formed on the first film S7 is indicated by reference sign SL in the figure.
  • the excess portion Y is torn from the optical member FS bonded to the display region P4.
  • the surplus portion Y is torn by being displaced toward the liquid crystal panel P in a direction intersecting the bonding surface T1 of the liquid crystal panel P (in the drawing, a direction orthogonal to the bonding surface T1).
  • the displacement is made, for example, by winding the second recovery portion 15d (see FIG. 4).
  • the optical member FS and the surplus portion Y are torn so as to be sheared at the edge of the edge of the liquid crystal panel P.
  • the process of displacing and tearing the surplus portion Y toward the liquid crystal panel P in the direction intersecting the bonding surface T1 of the liquid crystal panel P corresponds to the tearing process of the present invention.
  • the force generated in the optical member FS due to the tearing acts on the side pressing the optical member FS against the bonding surface T1. Thereby, bonding defects, such as peeling of the cut end of the optical member FS, are suppressed.
  • the displacement direction of the surplus portion Y is an angle close to the direction orthogonal to the bonding surface T1 in order to suppress disturbance of the cut end of the optical member FS due to the uncut portion of the cutting line SL. desirable.
  • the production system of the optical display device having the film bonding system 1 in the above embodiment after the optical member sheet FX larger than the display area P4 of the liquid crystal panel P is bonded to the liquid crystal panel P.
  • the optical member FS having a size corresponding to the display region P4 can be accurately formed on the surface of the liquid crystal panel P by cutting off the excess portion of the optical member sheet FX.
  • liquid crystal panel P applied to the film bonding system 1 can aim at the enlargement of a display area and size reduction of an apparatus by narrowing the frame part G outside a display area P4.
  • the cutting using the laser beam L has higher accuracy than the cutting using the cutting blade. Therefore, the frame part G around the display area P4 can be narrowed compared with the case where a cutting blade is used.
  • the optical member sheet FX is efficiently cut by irradiating the laser beam L with the focus U on the layer (low absorption rate film layer) immediately adjacent to the liquid crystal panel P of the optical layer S1 of the laminated structure in the optical member sheet FX. can do. Therefore, thermal deformation of the cut end of the optical member sheet FX can be suppressed, and damage to the surface of the liquid crystal panel P can be suppressed, so that the optical display device can be further narrowed.
  • the laser beam irradiation apparatus 30 which cut
  • seat FX is liquid crystal panel P of the optical layer S1 in the cutting part S of the optical member sheet
  • a tearing device that displaces the excess portion of the optical member sheet FX after the formation of the cutting line SL toward the liquid crystal panel P in the direction intersecting the bonding surface T1 of the liquid crystal panel P and tears it from the optical member FS.
  • second recovery that displaces the excess portion of the optical member sheet FX after the formation of the cutting line SL toward the liquid crystal panel P in the direction intersecting the bonding surface T1 of the liquid crystal panel P and tears it from the optical member FS.
  • the separation of the optical member FS of the optical display component PX and the surplus portion Y of the optical member sheet FX is performed by winding the surplus portion Y by the second or third recovery portions 15d and 18d.
  • the present invention is not limited to this, and the separation may be performed using various apparatuses and processes.
  • the edge of the edge of the liquid crystal panel P is used from the beginning of tearing, and the excess portion Y is smoothly separated. Can be made.
  • the laminated polarizing plate to be cut in this embodiment is not limited to a COP polarizing plate, but a polyethylene terephthalate (PET) film, polyvinyl chloride.
  • High absorptivity film layers such as alcohol (PVA) film, triacetyl cellulose (TAC) film, and low absorptivity films such as cycloolefin polymer (COP) film, polypropylene (PP) film, polymethyl methacrylate (PMMA) film
  • various layers including layers including layers.
  • the configuration in which the optical member sheet is cut into a frame shape is described as an example of the configuration for performing predetermined processing by irradiating the irradiation target with laser light, but the configuration is not limited thereto.
  • the structure may be such that the optical member sheet is divided into at least two parts, a cut is formed through the optical member sheet, or a groove (cut) having a predetermined depth is formed in the optical member sheet. Specifically, for example, there are cutting (cutting off), half-cutting, marking processing and the like of the end of the optical member sheet.
  • the optical member to be bonded to the liquid crystal panel may be a retardation film or a brightness enhancement film instead of a polarizing film as long as it has an optical layer having a laminated structure.
  • laser light may be irradiated while focusing on the layer closest to the liquid crystal panel of the optical layer of each film.
  • the second cutting device 16 detects the outer periphery of the display area P4 with a detection unit such as the camera 16a, and the first and second optical members along the outer periphery of the display area P4.
  • the sheets F1 and F2 were cut.
  • the third cutting device 19 cuts the third optical member sheet F3 along the outer periphery and the like of the display region P4 while detecting the outer periphery of the display region P4 with a detection unit such as a camera 19a.
  • the structure of the detection part in the 2nd cutting device 16 and the 3rd cutting device 19 is not restricted to this.
  • the film bonding system 1 has a detection unit that detects the outer peripheral edge of the bonding surface between the first and second optical member sheets F1 and F2 and the liquid crystal panel P in the second bonding sheet F22. And it is good also as cut
  • the film bonding system 1 has a detection part which detects the outer periphery of the bonding surface of the 3rd optical member sheet
  • the process of detecting the outer periphery of the bonding surface of the third optical member sheet F3 and the liquid crystal panel P corresponds to the detection process of the present invention.
  • the cutting part may be referred to as a cutting line.
  • FIG. 14 is a schematic diagram of the first detection unit 61 that detects the outer peripheral edge of the bonding surface.
  • the 1st detection part 61 with which the film bonding system 1 of this embodiment is provided is the bonding surface (henceforth 1st bonding surface SA1) of liquid crystal panel P and the sheet piece F1S in the 2nd bonding sheet
  • Imaging device 63 that captures an image of outer peripheral edge ED
  • illumination light source 64 that illuminates outer peripheral edge ED
  • a control unit 65 that performs an operation for the purpose.
  • Such a first detection unit 61 is provided on the upstream side of the panel conveyance of the second cutting device 16 in FIG. 1 and is provided between the pinching roll 15 b and the second cutting device 16.
  • the imaging device 63 is fixed and arranged inside the first bonding surface SA1 with respect to the outer peripheral edge ED, and the normal line of the first bonding surface SA1 and the normal line of the imaging surface 63a of the imaging device 63 are arranged.
  • the posture is inclined so as to form an angle ⁇ (hereinafter referred to as an inclination angle ⁇ of the imaging device 63).
  • the imaging device 63 directs the imaging surface 63a to the outer peripheral edge ED, and captures an image of the outer peripheral edge ED from the side where the sheet piece F1S is bonded in the second bonding sheet F22.
  • the inclination angle ⁇ of the imaging device 63 is preferably set so that the outer periphery of the first substrate P1 that forms the first bonding surface SA1 can be reliably imaged.
  • the liquid crystal panel P is formed by so-called multiple chamfering, in which the mother panel is divided into a plurality of liquid crystal panels, the liquid crystal panel P is shifted to the outer peripheral edge of the first substrate P1 and the second substrate P2 constituting the liquid crystal panel P. May occur, and the end surface of the second substrate P2 may be displaced outward from the end surface of the first substrate P1.
  • the inclination angle ⁇ of the imaging device 63 is a distance H between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter referred to as the height H of the imaging device 63). It is preferable to set so that it may fit. For example, when the height H of the imaging device 63 is 50 mm or more and 100 mm or less, the inclination angle ⁇ of the imaging device 63 is preferably set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 63 and the inclination angle ⁇ of the imaging device 63 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 63 is set to 78 mm, and the inclination angle ⁇ of the imaging device 63 is set to 10 °.
  • the inclination angle ⁇ of the imaging device 63 may be 0 °.
  • FIG. 15 is a schematic diagram showing a modification of the first detection unit 61, and is an example in the case where the inclination angle ⁇ of the imaging device 63 is 0 °.
  • each of the imaging device 63 and the illumination light source 64 may be disposed at a position overlapping the outer peripheral edge ED along the normal direction of the first bonding surface SA1.
  • a distance H1 between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 detects the outer peripheral edge ED of the first bonding surface SA1. It is preferable to set the position at an easy position.
  • the height H1 of the imaging device 63 is preferably set in a range of 50 mm or more and 150 mm or less.
  • the illumination light source 64 is fixed and arranged on the opposite side to the side where the sheet piece F1S in the second bonding sheet F22 is bonded.
  • the illumination light source 64 is arrange
  • the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 are parallel.
  • the illumination light source 64 may be arrange
  • the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 intersect. It may be.
  • FIG. 16 is a plan view showing a position where the outer peripheral edge of the bonding surface is detected.
  • An inspection area CA is set on the conveyance path of the second bonding sheet F22 shown in the drawing.
  • region CA is set in the position corresponding to the outer periphery ED of 1st bonding surface SA1 in liquid crystal panel P conveyed.
  • the inspection area CA is set at four locations corresponding to the four corners of the first bonding surface SA1 that is rectangular in plan view, and the corners of the first bonding surface SA1 are detected as the outer peripheral edge ED. It has a configuration.
  • the hook-shaped part corresponding to the corner is shown as the outer peripheral edge ED.
  • the first detection unit 61 in FIG. 14 detects the outer peripheral edge ED in the four inspection areas CA. Specifically, an imaging device 63 and an illumination light source 64 are arranged in each inspection area CA.
  • the 1st detection part 61 images the corner
  • region CA may be arrange
  • each side (four sides) of the first bonding surface SA1 is detected as an outer peripheral edge.
  • the imaging device 63 and the illumination light source 64 are not limited to the configuration arranged in each inspection area CA, but are configured to be able to move along a movement path that is set along the outer peripheral edge ED of the first bonding surface SA1. It may be.
  • the imaging device 63 and the illumination light source 64 are configured to detect the outer peripheral edge ED when the imaging device 63 and the illumination light source 64 are positioned in each inspection area CA, so that one imaging device 63 and one illumination light source 64 are provided. In this case, the outer periphery ED can be detected.
  • the cutting part (cutting line) for the sheet piece F1S and the second optical member sheet F2 by the second cutting device 16 is set based on the detection result of the outer peripheral edge ED of the first bonding surface SA1.
  • the control unit 65 shown in FIG. 11 has the first optical member F11 on the outside of the liquid crystal panel P (the outside of the first bonding surface SA1) based on the stored data of the outer peripheral edge ED of the first bonding surface SA1.
  • the cut positions of the sheet piece F1m and the second optical member sheet F2 are determined so as not to protrude.
  • the second cutting device 16 cuts the sheet piece F1S and the second optical member sheet F2 at the cutting position determined by the control unit 65.
  • the second cutting device 16 is provided on the downstream side of the panel conveyance from the first detection unit 61.
  • the 2nd cutting device 16 is a sheet
  • the first optical member F11 and the second optical member F12 (see FIG. 9) having a size corresponding to the display area P4 are cut along a cutting portion (cutting line) set based on the detected outer peripheral edge ED. cut. Thereby, the 2nd single-sided bonding panel P12 by which the 1st and 2nd optical members F11 and F12 were piled up and bonded on the upper surface of liquid crystal panel P is formed.
  • the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P at three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view, and the liquid crystal panel P at one side corresponding to the functional portion. It is possible to adopt a configuration in which the surplus portion is laser-cut at a position that appropriately enters the display region P4 side from the outer peripheral edge.
  • the first substrate P1 is a TFT substrate
  • FIG. 17 is a schematic diagram of the second detection unit 62 that detects the outer peripheral edge of the bonding surface.
  • the 2nd detection part 62 with which the film bonding system 1 of this embodiment is provided is the bonding surface (henceforth, 2nd bonding surface SA2) of liquid crystal panel P and the 3rd optical member sheet
  • the imaging device 63 that captures an image of the outer peripheral edge ED, the illumination light source 64 that illuminates the outer peripheral edge ED, and the image captured by the imaging device 63 are stored, and the outer peripheral edge ED is based on the image.
  • a control unit 65 that performs a calculation for detecting.
  • the second detection unit 62 has the same configuration as the first detection unit 61 described above.
  • Such a second detection unit 62 is provided on the upstream side of the panel conveyance of the third cutting device 19 in FIG. 1 and is provided between the pinching roll 18 b and the third cutting device 19.
  • the 2nd detection part 62 detects the outer periphery ED of 2nd bonding surface SA2 similarly to the above-mentioned 1st detection part 61 in the test
  • the cutting part (cutting line) for the third optical member sheet F3 by the third cutting device 19 is set based on the detection result of the outer peripheral edge ED of the second bonding surface SA2.
  • the control unit 65 of the second detection unit 62 causes the third optical member F13 to be outside the liquid crystal panel P (second bonding surface SA2).
  • the cutting part (cutting line) of the third optical member sheet F3 can be set so as not to protrude beyond the outer side.
  • the setting of the cutting part (cutting line) is not necessarily performed by the control unit 65 of the second detection unit 62, and the data of the outer peripheral edge ED detected by the second detection unit 62 is used, and a separate calculation unit is used. You may set a cutting part (cutting line) along the outer periphery of the bonding surface.
  • the 3rd cutting device 19 cuts the 3rd optical member sheet
  • the 3rd cutting device 19 detected the opposing part with the display area P4 (refer FIG. 8) among the 3rd optical member sheets F3 bonded by liquid crystal panel P, and the excess part of the outer side of an opposing part.
  • the third optical member F13 (see FIG. 9) having a size corresponding to the display area P4 is cut out along the cutting portion (cutting line) set based on the outer peripheral edge ED.
  • the double-sided bonding panel P13 by which the 3rd optical member F13 was bonded by the upper surface of the 2nd single-sided bonding panel P12 is formed. Also in the film bonding system according to the above modification, fume adhesion to the product surface can be effectively suppressed without affecting the product processing accuracy, which can contribute to narrowing the frame.
  • the entire second cutting device 16 including the laser beam oscillator 160 is described as moving relative to the table 31.
  • the present invention is not limited to this configuration.
  • the laser beam oscillator 160 is fixed and the scanning elements (the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162) are moved.
  • the table 31 is moved relative to the table 31 can be employed.
  • the condenser lens 163 may be moved following the scanning element.
  • the outer periphery of the bonding surface was detected for every some liquid crystal panel P using the detection part, and it bonded for every liquid crystal panel P based on the detected outer periphery.
  • the cutting positions of the sheet piece F1S, the second optical member sheet F2, and the third optical member sheet 3 are set. Thereby, an optical member having a desired size can be separated regardless of individual differences in the sizes of the liquid crystal panel P and the sheet piece F1S. Therefore, quality variations due to individual differences in the sizes of the liquid crystal panel P and the sheet piece F1S can be eliminated, and the frame portion around the display area can be reduced to enlarge the display area and downsize the device.

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  • Polarising Elements (AREA)

Abstract

Le système de production de dispositif d'affichage optique de l'invention, est équipé : de dispositifs de collage (12, 15, 18) qui collent sur des composants d'affichage optique (P, PX) une feuille d'élément optique (FX), formant ainsi des corps collés (P11, P12) ; et de dispositifs de découpe (16,19) possédant un dispositif d'irradiation à la lumière laser (30). Lesdits dispositifs de découpe (16,19) forment un élément optique (FS) à partir de ladite feuille d'élément optique (FX). Ladite lumière laser (30) effectue une irradiation à l'aide de une lumière laser (L) vers une partie découpe (S) entre une portion d'opposition et une portion surplus (Y) de ladite feuille d'élément optique (FX) desdits corps collés (P11, P12), en ajustant un foyer (U) sur une couche (S7) qui est la plus proche desdits composants d'affichage optique parmi une pluralité de couches contenues dans une couche optique (S1) de structure stratifiée.
PCT/JP2013/071217 2012-08-08 2013-08-06 Système et procédé de production de dispositif d'affichage optique Ceased WO2014024867A1 (fr)

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KR1020157003602A KR102031401B1 (ko) 2012-08-08 2013-08-06 광학 표시 디바이스의 생산 시스템 및 생산 방법
CN201380041452.8A CN104520916B (zh) 2012-08-08 2013-08-06 光学显示器件的生产系统以及生产方法

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JP5791018B2 (ja) 2015-10-07
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