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WO2014015063A3 - Electroless nickel coatings and compositions and methods for forming the coatings - Google Patents

Electroless nickel coatings and compositions and methods for forming the coatings Download PDF

Info

Publication number
WO2014015063A3
WO2014015063A3 PCT/US2013/050932 US2013050932W WO2014015063A3 WO 2014015063 A3 WO2014015063 A3 WO 2014015063A3 US 2013050932 W US2013050932 W US 2013050932W WO 2014015063 A3 WO2014015063 A3 WO 2014015063A3
Authority
WO
WIPO (PCT)
Prior art keywords
coatings
electroless nickel
forming
compositions
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2013/050932
Other languages
French (fr)
Other versions
WO2014015063A2 (en
Inventor
Matthew Joseph WOJCIK
Ambrose SCHAFFER
Jean M. LAPLANTE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coventya Inc
Original Assignee
Coventya Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coventya Inc filed Critical Coventya Inc
Priority to MX2015000850A priority Critical patent/MX363621B/en
Priority to US14/414,821 priority patent/US20150159277A1/en
Priority to CA2879315A priority patent/CA2879315C/en
Priority to EP13820572.9A priority patent/EP2875168B1/en
Priority to ES13820572.9T priority patent/ES2663684T3/en
Priority to BR112015001113-6A priority patent/BR112015001113B1/en
Publication of WO2014015063A2 publication Critical patent/WO2014015063A2/en
Publication of WO2014015063A3 publication Critical patent/WO2014015063A3/en
Anticipated expiration legal-status Critical
Priority to US17/585,093 priority patent/US20220145469A1/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)

Abstract

An aqueous electroless nickel plating bath for forming electroless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer, and is free of a sulfur compound.
PCT/US2013/050932 2012-07-17 2013-07-17 Electroless nickel coatings and compositions and methods for forming the coatings Ceased WO2014015063A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
MX2015000850A MX363621B (en) 2012-07-17 2013-07-17 Electroless nickel coatings and compositions and methods for forming the coatings.
US14/414,821 US20150159277A1 (en) 2012-07-17 2013-07-17 Electroless nickel coatings and compositions and methods for forming the coatings
CA2879315A CA2879315C (en) 2012-07-17 2013-07-17 Electroless nickel coatings and compositions and methods for forming the coatings
EP13820572.9A EP2875168B1 (en) 2012-07-17 2013-07-17 Electroless nickel coatings and compositions and methods for forming the coatings
ES13820572.9T ES2663684T3 (en) 2012-07-17 2013-07-17 Nickel coatings produced by chemical reduction and compositions and methods to form the coatings
BR112015001113-6A BR112015001113B1 (en) 2012-07-17 2013-07-17 method of forming a black autocatalytic nickel coating of a substrate
US17/585,093 US20220145469A1 (en) 2012-07-17 2022-01-26 Electroless nickel coatings and compositions and methods for forming the coatings

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261672584P 2012-07-17 2012-07-17
US61/672,584 2012-07-17

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US14/414,821 A-371-Of-International US20150159277A1 (en) 2012-07-17 2013-07-17 Electroless nickel coatings and compositions and methods for forming the coatings
US17/585,093 Continuation US20220145469A1 (en) 2012-07-17 2022-01-26 Electroless nickel coatings and compositions and methods for forming the coatings

Publications (2)

Publication Number Publication Date
WO2014015063A2 WO2014015063A2 (en) 2014-01-23
WO2014015063A3 true WO2014015063A3 (en) 2014-03-20

Family

ID=49949367

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/050932 Ceased WO2014015063A2 (en) 2012-07-17 2013-07-17 Electroless nickel coatings and compositions and methods for forming the coatings

Country Status (7)

Country Link
US (2) US20150159277A1 (en)
EP (1) EP2875168B1 (en)
BR (1) BR112015001113B1 (en)
CA (1) CA2879315C (en)
ES (1) ES2663684T3 (en)
MX (1) MX363621B (en)
WO (1) WO2014015063A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9520645B2 (en) * 2013-09-09 2016-12-13 Apple Inc. Electronic device with electromagnetic shielding structures
US9708693B2 (en) 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
US9768063B1 (en) 2016-06-30 2017-09-19 Lam Research Corporation Dual damascene fill
US10577692B2 (en) * 2017-01-05 2020-03-03 International Business Machines Corporation Pretreatment of iron-based substrates for electroless plating
GB2560969A (en) * 2017-03-30 2018-10-03 Ajt Eng Ltd Electroless plating
EP3617350A1 (en) 2018-08-31 2020-03-04 Tubacex Upstream Technologies, S.A. Method for coating a metal part destined to be subjected to high contact pressures and metal part obtained therefrom
US11054199B2 (en) 2019-04-12 2021-07-06 Rheem Manufacturing Company Applying coatings to the interior surfaces of heat exchangers
CN112359357B (en) * 2020-10-28 2022-03-01 瑞声科技（南京）有限公司 Chemical nickel plating process for steel sheet, phosphorus-nickel plated steel sheet and uniform temperature plate
CN117191723B (en) * 2023-08-25 2024-09-03 攀西钒钛检验检测院 Method for extracting and quantitatively detecting effective sulfur in calcium superphosphate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US4511614A (en) * 1983-10-31 1985-04-16 Ball Corporation Substrate having high absorptance and emittance black electroless nickel coating and a process for producing the same
JP2005290400A (en) * 2004-03-31 2005-10-20 Ebara Udylite Kk Electroless nickel plating bath and electroless nickel alloy plating bath
US7846503B2 (en) * 2002-10-04 2010-12-07 Enthone Inc. Process and electrolytes for deposition of metal layers
KR20120066303A (en) * 2010-12-14 2012-06-22 성열섭 Phosphorus-free electroless nickel plating solution and nickle-alloy plating solution and electroless plating method using the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1310921A (en) * 1970-04-13 1973-03-21 Gen Am Transport Electroless alloy coatings and processes
US3914126A (en) * 1973-02-12 1975-10-21 Xerox Corp Nickel oxide interlayers for photoconductive elements
CA1185404A (en) * 1981-07-27 1985-04-16 Glenn O. Mallory Electroless plating with reduced tensile stress
US4984855A (en) * 1987-11-10 1991-01-15 Anritsu Corporation Ultra-black film and method of manufacturing the same
JP2901523B2 (en) * 1995-08-09 1999-06-07 日本カニゼン株式会社 Electroless black plating bath composition and film formation method
JP3696429B2 (en) * 1999-02-22 2005-09-21 日本化学工業株式会社 Conductive electroless plating powder, method for producing the same, and conductive material comprising the plating powder
JP2003031028A (en) * 2001-07-17 2003-01-31 Shin Etsu Chem Co Ltd Conductive composition
JP4203744B2 (en) * 2003-12-02 2009-01-07 上村工業株式会社 Electroless nickel-phosphorous plating bath and method for forming black nickel coating using the same
JP4740724B2 (en) * 2005-12-01 2011-08-03 コーア株式会社 Method for forming resistor and method for forming metal film fixed resistor
JP4709731B2 (en) * 2006-11-17 2011-06-22 三菱重工業株式会社 Corrosion-resistant plating layer forming method and rotating machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US4511614A (en) * 1983-10-31 1985-04-16 Ball Corporation Substrate having high absorptance and emittance black electroless nickel coating and a process for producing the same
US7846503B2 (en) * 2002-10-04 2010-12-07 Enthone Inc. Process and electrolytes for deposition of metal layers
JP2005290400A (en) * 2004-03-31 2005-10-20 Ebara Udylite Kk Electroless nickel plating bath and electroless nickel alloy plating bath
KR20120066303A (en) * 2010-12-14 2012-06-22 성열섭 Phosphorus-free electroless nickel plating solution and nickle-alloy plating solution and electroless plating method using the same

Also Published As

Publication number Publication date
CA2879315A1 (en) 2014-01-23
WO2014015063A2 (en) 2014-01-23
ES2663684T3 (en) 2018-04-16
CA2879315C (en) 2019-09-10
BR112015001113A2 (en) 2017-06-27
BR112015001113B1 (en) 2021-05-18
EP2875168A2 (en) 2015-05-27
MX2015000850A (en) 2015-08-20
US20220145469A1 (en) 2022-05-12
MX363621B (en) 2019-03-28
US20150159277A1 (en) 2015-06-11
EP2875168A4 (en) 2016-04-06
EP2875168B1 (en) 2017-12-20

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