[go: up one dir, main page]

WO2014073237A1 - Solid-state lighting device - Google Patents

Solid-state lighting device Download PDF

Info

Publication number
WO2014073237A1
WO2014073237A1 PCT/JP2013/066889 JP2013066889W WO2014073237A1 WO 2014073237 A1 WO2014073237 A1 WO 2014073237A1 JP 2013066889 W JP2013066889 W JP 2013066889W WO 2014073237 A1 WO2014073237 A1 WO 2014073237A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
region
wavelength conversion
wavelength
conversion layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/066889
Other languages
French (fr)
Japanese (ja)
Inventor
要二 川崎
善久 池田
慶暁 松葉
順一 木下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012244911A external-priority patent/JP2016028370A/en
Priority claimed from JP2012249634A external-priority patent/JP2016028371A/en
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Publication of WO2014073237A1 publication Critical patent/WO2014073237A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/02Controlling the distribution of the light emitted by adjustment of elements by movement of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/12Combinations of only three kinds of elements
    • F21V13/14Combinations of only three kinds of elements the elements being filters or photoluminescent elements, reflectors and refractors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/22Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • F21V7/30Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings the coatings comprising photoluminescent substances
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/38Combination of two or more photoluminescent elements of different materials
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/40Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14Adjustable mountings
    • F21V21/30Pivoted housings or frames
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/30Semiconductor lasers

Definitions

  • Embodiments of the present invention relate to a solid state lighting device.
  • White solid-state lighting (SSL) devices using solid-state light-emitting elements are mainly LEDs (Light Emitting Diodes).
  • the white light emitting part having the phosphor is provided so as to cover the LED (Light Emitting Diode) chip, a substrate for heat dissipation and power feeding of the LED chip is required. If the white light emitting unit is composed only of an optical system, heat generation is small, the size and weight are reduced, and the design flexibility of the lighting device can be increased.
  • the output from a high-intensity solid-state light emitting device in the blue-violet to blue wavelength range is efficiently coupled to a light guide or the like, and irradiated to a wavelength conversion layer such as a phosphor separated from the solid light-emitting device.
  • a wavelength conversion layer such as a phosphor separated from the solid light-emitting device.
  • a structure that obtains white light emission may be used.
  • the solid-state lighting device of the embodiment includes a semiconductor light emitting element, a light source unit that emits excitation light, an incident unit that introduces the excitation light, and an irradiation unit that emits the excitation light introduced into the incident unit
  • the second wavelength converted light have different emission spectra, or the ratio of the optical output of the first wavelength converted light to the optical output of the excitation light emitted through the first region and the second region
  • the second wave with respect to the optical output of the excitation light emitted through The ratio of the light output of the converted light are different, it comprises a wavelength conversion layer, and a irradiation area moving means for changing an irradiation position on the surface of the wavelength conversion layer of the excitation light emitted from the irradiation unit.
  • a solid state lighting device that can easily dissipate heat and adjust chromaticity is provided.
  • FIG. 1A is a schematic perspective view of the solid-state lighting device according to the first embodiment
  • FIG. 1B is a schematic cross-sectional view along the line AA
  • 2A is a schematic plan view showing the structure of the wavelength conversion layer
  • FIG. 2B is a schematic cross-sectional view along the line BB
  • FIG. 2C is a schematic view showing a modification of the wavelength conversion layer.
  • FIG. 2D is a schematic cross-sectional view along the line BB.
  • FIG. 3A is a schematic plan view of the first irradiation position of the second embodiment
  • FIG. 3B is a schematic cross-sectional view along the line CC
  • FIG. 3C is the second irradiation position.
  • FIG. 3D is a schematic sectional view taken along the line CC
  • FIG. 3E is a schematic plan view of the third irradiation position
  • FIG. 3F is a line taken along the line CC. It is the model sectional drawing.
  • FIG. 4A is a schematic perspective view of the solid-state lighting device according to the third embodiment
  • FIG. 4B is a schematic cross-sectional view taken along the line CC.
  • 5A is a conical irradiation unit
  • FIG. 5B is a quadrangular pyramid irradiation unit
  • FIG. 5C is a triangular pyramid irradiation unit
  • FIG. 5D is an end polishing fiber irradiation unit
  • FIG. 5E is a schematic perspective view of the irradiation section of the fiber array
  • FIG. 5F is a schematic perspective view of the irradiation section of the multilayer fiber array
  • FIG. 6A is a schematic perspective view of a light emitting unit
  • FIG. 6B is a schematic perspective view of a spotlight which is an application example thereof.
  • FIG. 7A is a schematic perspective view of a solid-state lighting device according to the fourth embodiment
  • FIG. 7B is a schematic cross-sectional view taken along the line DD.
  • FIG. 8A is a schematic perspective view of a solid state lighting device according to the fifth embodiment
  • FIG. 8B is a schematic cross-sectional view taken along the line DD.
  • FIG. 9A is a partially cut schematic perspective view of a solid state lighting device according to the sixth embodiment
  • FIG. 9B is a partially cut schematic cross-sectional view
  • FIG. 10A is a partially cut schematic perspective view of the solid state lighting device according to the seventh embodiment
  • FIG. 10B is a partially cut schematic cross sectional view
  • FIG. 10C is a schematic cross sectional view of a modification.
  • FIG. 11A is a schematic perspective view of a light conversion unit constituting the solid-state lighting device according to the eighth embodiment
  • FIG. 11B is a schematic view showing the configuration of the solid-state lighting device
  • FIG. It is a model perspective view of a light body.
  • FIG. 12A is a schematic cross-sectional view of the light conversion unit of the solid state lighting device of the eighth embodiment
  • FIG. 12B is a schematic cross-sectional view in the vicinity of the transparent tube
  • FIG. 12C is a schematic perspective view of the application example.
  • FIG. 13A is a schematic perspective view of a solid-state lighting device according to the ninth embodiment
  • FIG. 13B is a schematic cross-sectional view along AA.
  • FIG. 14A is a schematic perspective view for explaining the operation of the functional element in the OFF state
  • FIG. 14B is a schematic sectional view taken along the line AA
  • FIG. 14C is the operation of the functional element in the on state.
  • FIG. 14D is a schematic cross-sectional view taken along the line AA.
  • FIG. 15A is a schematic perspective view of a solid-state lighting device according to the tenth embodiment, and FIG. 15B is a schematic cross-sectional view along the line AA.
  • FIG. 16A is a schematic perspective view for explaining the operation of the tenth embodiment
  • FIG. 16B is a schematic perspective view of the irradiation state of the first region
  • FIG. 16C is a irradiation state of the second region
  • FIG. 16D is a schematic perspective view of the irradiation state of the third region. It is a model perspective view of 11th Embodiment.
  • FIG. 18A is a schematic cross-sectional view for explaining the action in the first state of the solid state lighting device of the eleventh embodiment
  • FIG. 18B is a schematic cross-sectional view for explaining the action in the second state.
  • FIG. 1A is a schematic perspective view of the solid-state lighting device according to the first embodiment
  • FIG. 1B is a schematic cross-sectional view along the line AA.
  • the solid-state lighting device includes the light source unit 10, the wavelength conversion layer 54, the light guide unit 20, and the irradiation region moving unit 24.
  • the light source unit 10 is configured to emit the excitation light G1, and has at least a semiconductor light emitting element or the like as a means for generating the excitation light G1.
  • the semiconductor light emitting element can be, for example, a laser element or a light emitting diode that emits excitation light (light beam) G1 having a wavelength range of 400 to 490 nm.
  • the wavelength range of the excitation light G ⁇ b> 1 only needs to be absorbed by the wavelength conversion layer 54 described later and emit wavelength conversion light, and can be set to ultraviolet light with a wavelength of 400 nm or less, or with a wavelength of 500 nm or more, in combination with the wavelength conversion layer 54.
  • the light source unit 10 may be configured to irradiate light from the semiconductor light emitting element directly as excitation light, or may be configured to indirectly irradiate via an optical fiber, an optical lens, a reflecting member, or the like. Further, a configuration in which a plurality of semiconductor light emitting elements are provided to increase the output of the excitation light G1 from the light source unit 10 may be used. Moreover, when the light guide part 20 mentioned later consists of two or more light guides, the structure which branches the excitation light G1 from a semiconductor light-emitting element to a plurality of light guides, and guides the excitation light G1 may be sufficient. If the semiconductor light emitting element is a laser element, the beam divergence angle can be narrowed, so that the excitation light can be efficiently introduced into the incident part 20a of the light guide part 20 and efficiently guided to the irradiation part 20b.
  • the light guide unit 20 guides the excitation light G1 from the light source unit 10 to a wavelength conversion layer 54 described later, and is configured by, for example, an optical fiber or a light guide.
  • the light guide unit 20 includes an incident unit 20a on which one end is incident with excitation light, and an irradiation unit 20b on which the other end irradiates the excitation light G1 toward the wavelength conversion layer.
  • the irradiation unit 20b has, for example, a shape obtained by processing the tip of an optical fiber or a light guide into a taper shape, and controls the reflection direction of the excitation light G1 guided through the light guide unit 20 so as to be in an arbitrary irradiation direction. Excitation light G1 is irradiated. In the configuration of FIG.
  • the light guide unit 20 may be a spatial propagation optical path configured by a mirror, a lens, or the like.
  • the wavelength conversion layer 54 absorbs the excitation light G1 and emits wavelength conversion light having an emission spectrum including a wavelength longer than the wavelength of the excitation light G1.
  • the wavelength conversion layer 54 is made of, for example, a nitride-based phosphor such as (Ca, Sr) 2 Si 5 N 8 : Eu, (Ca, Sr) AlSiN 3 : Eu, or Cax (Si, Al) 12 (O, N ) 16 : Eu, (Si, Al) 6 (O, N) 8 : Eu, BaSi 2 O 2 N 2 : Eu, BaSi 2 O 2 N 2 : Eu and other oxynitride phosphors, Lu 3 Al 5 O 12 : Ce, (Y, Gd) 3 (Al, Ga) 5 O 12 : Ce, (Sr, Ba) 2 SiO 4 : Eu, Ca 3 Sc 2 Si 3 O 12 : Ce, Sr 4 Al 14 O 25 : Eu or other oxide-based phosphors, (Ca, Sr
  • the wavelength conversion layer 54 has, for example, at least two regions that emit at least two wavelength-converted lights having different emission spectra of the wavelength-converted light.
  • the wavelength conversion layer 54 includes a first region 54a, a second region 54b, a third region 54c, a fourth region 54d, a fifth region 54e, and a sixth region 54f.
  • the incident portion 20a of the light guide portion 20 is provided outside the region surrounded by the wavelength conversion layers 54a to 54f.
  • the irradiation unit 20b is provided so as to be surrounded by the wavelength conversion layers 54a to 54f, and emits the excitation light G1 from the light source unit 10 guided.
  • the irradiation region moving unit 24 moves the position of the irradiation region of the excitation light G1 emitted from the irradiation unit 20b toward the wavelength conversion layer 54.
  • the wavelength conversion light from the wavelength conversion layer 54 in the region irradiated with the excitation light G1 and a part of the excitation light G1 reflected by the wavelength conversion layer 54 are mixed.
  • the illuminated illumination light GT can be obtained.
  • the first region 54a and the fourth region 54d on the opposite side emit wavelength-converted light having a first emission spectrum that is substantially the same.
  • the second region 54b and the fifth region 54e on the opposite side emit wavelength converted light having a second emission spectrum different from the first emission spectrum.
  • the third region 54c and the sixth region 54f on the opposite side emit wavelength converted light having a third emission spectrum different from the first and second emission spectra.
  • the light guide unit 20 is rotated with the axial direction of the light guide unit 20 as the central axis 30c, and the irradiation position of the excitation light G1 from the irradiation unit 20b is set to the position of the first region 54a and the fourth region 54d, or the first
  • the chromaticity of the illumination light GT can be changed by switching to the position of the second area 54b and the fourth area 54e or the position of the third area 54c and the sixth area 54e.
  • the first emission spectrum is a blue wavelength conversion layer
  • the second emission spectrum is a green wavelength conversion layer
  • a third wavelength conversion layer By selecting the wavelength conversion layer whose red light emission spectrum is red, the color can be changed to blue, green, and red. Also, by providing a scattering layer that reflects / reflects blue-violet to blue laser light instead of the blue wavelength conversion layer, blue light can be generated by the scattering layer, so that the color can be changed in the same manner.
  • the wavelength conversion layer As another modification example regarding the arrangement of the wavelength conversion layer, a configuration in which a wavelength conversion layer in which a plurality of phosphors having different emission colors are mixed is used and the mixing ratio is changed and arranged in each region may be used.
  • a blue-violet to blue laser beam is used as the excitation light G1 of the light source unit 10
  • the wavelength conversion layer in which the first emission spectrum is adjusted to the blending ratio that becomes the first color temperature, the second emission By selecting the wavelength conversion layer whose spectrum is adjusted to the mixing ratio of the second color temperature and the wavelength conversion layer whose third emission spectrum is adjusted to the mixing ratio of the third color temperature, the illumination light GT is selected.
  • the color temperature can be varied.
  • the first region 54a may include a red wavelength conversion layer
  • the fourth region 54d on the opposite side may include a green wavelength conversion layer.
  • Variable colors are possible by changing the color.
  • blue-violet to blue laser light is used as the excitation light G1 of the light source unit 10, and a yellow phosphor having the same spectrum is applied as the wavelength conversion layer 54 to each of the regions 54a to 54f.
  • It can be set as the structure arrange
  • the absorption of excitation light can be increased, and yellow wavelength conversion light can be increased.
  • the illumination light GT can be a light emission color in which yellow light emission is dominant.
  • the emitted light GT can be a light emission color in which blue is dominant as compared with a region where the film thickness is thick. In this way, for example, emitted light with different colors can be obtained.
  • the first region to the sixth region of the wavelength conversion layer 54 can be divided by, for example, 60 degrees in plan view. Note that the number of divisions is not limited to six.
  • the solid state lighting device may further include a heat conducting unit 30 having a high heat conducting material such as metal or ceramic.
  • the heat conducting unit 30 has a recess 30b that is recessed from the first surface 30a.
  • the recess 30b has an inner wall 30d that is provided around the central axis 30c and widens toward the first surface 30a.
  • the wavelength conversion layer 54 is provided such that the plurality of regions (54a, 54b, etc.) are juxtaposed at different positions along the circumferential direction of the central axis 30c.
  • the excitation light can irradiate different regions of the wavelength conversion layer 54 by rotating at least one of the heat conduction unit 30 and the irradiation unit 20b.
  • the cover part 57 can be provided in the upper part of the recessed part 30b.
  • the cover part 57 can include a light diffusion layer.
  • the excitation light that is multiply reflected without being absorbed by the wavelength conversion layer provided on the inner wall 30d of the recess 30b can be scattered and emitted.
  • the excitation light is laser light
  • the laser light can be converted into incoherent light to improve safety for human eyes. Note that FIG. 1A does not illustrate the cover portion 57.
  • the cover part 57 and the wavelength conversion layer can be included.
  • the cover portion 57 includes a green wavelength conversion layer, and a red wavelength conversion layer and a green wavelength conversion layer are provided on the inner wall 30d of the recess 30b.
  • the green wavelength conversion layer of the cover part 57 transmits red light having a wavelength longer than that of green light with little absorption.
  • absorption of excitation light decreases due to an increase in the temperature of the wavelength conversion layer, the blue component of reflected light increases, and the illumination light GT becomes bluish.
  • the emission spectrum can be changed by moving the excitation light irradiation region to reduce the blue component and bring it closer to the desired color temperature.
  • the heat generation region of the wavelength conversion layer can be dispersed.
  • the irradiation region moving unit 24 is a unit that changes the relative position between the irradiation unit 20b and the wavelength conversion layer 54, has a motor, a gear, and the like, and is an automatic moving unit that moves mechanically by an electromagnetic method or an electronic method, Or. These can be simplified, and it can be set as the manual movement apparatus etc. which are moved manually by the operator.
  • the wavelength conversion layer 54 can be applied to one surface of a holding plate 50 that holds or fixes the wavelength conversion layer 54.
  • the holding plate 50 can be an insulating plate such as ceramics such as YAG or alumina.
  • ceramics transparent ceramics that transmit excitation light and light from the wavelength conversion layer 54, reflective ceramics that reflect these lights, and the like can be used.
  • the holding plate 50 can also be a metal plate such as aluminum or copper in order to improve heat dissipation.
  • the thickness of the holding plate 50 is, for example, 0.05 to 3.0 mm, and is set according to heat dissipation and light utilization efficiency.
  • a wavelength conversion material such as phosphor particles can be applied by being mixed in an amorphous silica mixed solution, for example.
  • the reflective layer 52 containing Ag or the like can be provided on the other surface of the holding plate 50 using a sputtering method, a vapor deposition method, or the like.
  • the reflective layer 52 and the wavelength conversion layer 54 can be provided on one surface of the holding plate 50 in this order.
  • the wavelength conversion layer 54 and the reflection layer 52 can be reliably and easily bonded to the inner wall 30d of the heat conducting unit 30. For this reason, it can be set as the reflection type structure which improved heat dissipation.
  • the reflective layer 52 may be configured to use both the reflective layer 52 and the adhesive layer by using, for example, solder.
  • FIG. 3A is a schematic plan view of the first irradiation position of the second embodiment
  • FIG. 3B is a schematic cross-sectional view along the line CC
  • FIG. 3C is the second irradiation position
  • 3D is a schematic sectional view taken along the line CC
  • FIG. 3E is a schematic plan view of the third irradiation position
  • FIG. 3F is a line taken along the line CC. It is the model sectional drawing.
  • the irradiation region moving means 24 moves the irradiation unit 20b to a different position along the central axis 30c of the recess 30b. That is, FIGS. 3A and 3B show the first irradiation position that is the farthest from the first surface. 3C and 3D show the second irradiation position closer to the first surface than the first irradiation position. FIGS. 3E and 3F show the third irradiation position closest to the first surface.
  • the wavelength conversion layer 54 has an emission spectrum of the wavelength conversion light or a ratio of the optical output of the wavelength conversion light to the optical output of the excitation light emitted through the wavelength conversion layer 54 at different positions along the direction of the central axis 30c.
  • the excitation light emitted through the wavelength conversion layer 54 refers to the excitation light that is not absorbed by the wavelength conversion layer 54 and is reflected or scattered by the wavelength conversion layer 54 among the excitation light irradiated to the wavelength conversion layer 54. means.
  • the boundary between different regions of the wavelength conversion layer 54 may change continuously. For this reason, the chromaticity and color temperature of the illumination light GT in which the wavelength conversion light and the excitation light emitted through the wavelength conversion layer 54 are mixed can be changed.
  • the position of the heat conducting unit 30 may be moved along the central axis 30c by the irradiation region moving means 24.
  • the irradiation area moving means 24 has, for example, a motor, a gear, etc., and an automatic moving means device that moves mechanically by an electromagnetic method or an electronic method, or these are simplified and moved manually by an operator. It can be a manual moving device.
  • FIG. 4A is a schematic perspective view of the solid-state lighting device according to the third embodiment
  • FIG. 4B is a schematic cross-sectional view taken along the line CC.
  • the light guide 20 may be a spatial propagation optical path.
  • the excitation light G1 emitted from the semiconductor light emitting element is, for example, laser light, propagates through the space, is bent by the mirror 23, further propagates through the space, and is then emitted from the irradiation unit 20b.
  • the irradiation region moving means 24 can move the position of the irradiation region on the wavelength conversion layer 54 when at least one of the irradiation unit 20b and the heat conducting unit 30 is rotated around the central axis 30c.
  • a light guide or a light diffusing layer may be provided in any region in the optical path so that the excitation light can be scattered light. Note that at least one of the irradiation unit 20b and the heat conduction unit 30 can be moved relatively along the central axis 30c to change the irradiation position.
  • FIG. 5A is a conical irradiation unit
  • FIG. 5B is a quadrangular pyramid irradiation unit
  • FIG. 5C is a triangular pyramid irradiation unit
  • FIG. 5D is an end polishing fiber irradiation unit
  • FIG. e) is a schematic perspective view of the irradiation section of the fiber array
  • FIG. 5F is a schematic perspective view of the irradiation section of the multilayer fiber array.
  • the irradiation part 20b can be obtained by processing the tip part of the light guide part 20 into a desired shape.
  • the tip shape is a cone in FIG. 5A, a quadrangular pyramid in FIG. 5B, a triangular pyramid in FIG.
  • the excitation light G1 guided inside the light guide 20 can be totally reflected by the inclined surface of the tip, and the wavelength conversion layer 54 can be efficiently irradiated.
  • the end face obtained by obliquely polishing the tip of the optical fiber 21 is defined as an irradiation part 20b.
  • the inclination angle of the end face can be set to, for example, 45 degrees so that the surface of the wavelength conversion layer 54 is efficiently irradiated.
  • FIGS. 5 (e) and 5 (f) when the irradiation section 20b is formed by obliquely polishing the tip of the fiber array, the output of the excitation light can be increased and a large light quantity illumination device can be obtained.
  • the fiber array includes, for example, a substrate, a cover, an adhesive member, and a plurality of optical fibers.
  • the number of V-grooves corresponding to the number of optical fibers is formed on one surface of the substrate.
  • the cover is provided so as to cover the optical fibers arranged one by one in each V-groove formed in the substrate.
  • the adhesive member is a solidified liquid adhesive and is provided between the substrate and the cover to fix the optical fiber.
  • the material of the substrate and cover is a transparent member such as quartz glass, borosilicate glass, or sapphire.
  • As the adhesive member for example, an inorganic binder or a silicone resin that can withstand the high output of the semiconductor laser can be used.
  • a fiber array is shown in which an optical fiber is sandwiched and fixed between a substrate and a cover. However, a configuration in which the exit end of the optical fiber is fused and connected to the incident side surface of the substrate can also be used.
  • FIG. 6A is a schematic perspective view of a light emitting unit
  • FIG. 6B is a schematic perspective view of a spotlight which is an application example thereof.
  • the spotlight can be used for stage lighting, for example.
  • the chromaticity and color temperature of the illumination light change variously depending on requirements.
  • FIG. 7A is a schematic perspective view of a solid-state lighting device according to the fourth embodiment
  • FIG. 7B is a schematic cross-sectional view taken along the line DD.
  • the fourth embodiment is a transmissive solid-state lighting device that irradiates illumination light GT from the outer edge of the transparent tube 60 toward the outside.
  • the solid state lighting device includes the light source unit 10, the transparent tube 60, the wavelength conversion layer 54, the irradiation unit 20 b, and the irradiation region moving unit 24.
  • the light source unit 10 is configured to emit the excitation light G1, and has at least a semiconductor light emitting element or the like as a means for generating the excitation light G1.
  • the semiconductor light emitting device may be a laser device or a light emitting diode that emits excitation light G1 in the blue-violet to blue wavelength range.
  • the wavelength conversion layer 54 is provided on the inner wall 60a of the transparent tube 60, absorbs the excitation light G1, and emits wavelength conversion light having a wavelength longer than the wavelength of the excitation light G1.
  • the wavelength conversion layer 54 has at least two regions in which at least one of the emission spectrum or the ratio of the light output of the wavelength converted light to the light output of the excitation light emitted through the wavelength conversion layer 54 is different.
  • the excitation light emitted through the wavelength conversion layer 54 is excitation that is not absorbed by the wavelength conversion layer 54 but transmitted or scattered by the wavelength conversion layer 54 in the excitation mechanism irradiated to the wavelength conversion layer 54. Means light.
  • the wavelength conversion layer 54 is provided with a first region 54 a and a second region 54 b at different positions along the central axis 60 c of the transparent tube 60.
  • the irradiation unit 20b is provided in the internal space of the transparent tube 60 so as to be surrounded by the wavelength conversion layer 54, and emits the illumination light GT from the outer wall 60b in the radial direction of the transparent tube 60.
  • the irradiation region moving means 24 moves the position of the irradiation region of the excitation light emitted from the irradiation unit 20b toward the wavelength conversion layer 54.
  • the irradiation unit 20b moves in a direction parallel to the central axis 60c, so that the excitation light irradiates different regions of the wavelength conversion layer 54.
  • the irradiation position on the wavelength conversion layer 54 can be moved, but the structure is easier if the irradiation unit 20b is moved.
  • the transparent tube 60 can have an outer diameter of 9 mm, an inner diameter of 4.5 mm, and a material of YAG ceramics, alumina ceramics, quartz glass, or the like.
  • the wavelength conversion layer 54 may be a mixture of a plurality of wavelength conversion materials.
  • the first region 54a may be blended with a wavelength conversion material made of a phosphor or the like so that the color temperature of the wavelength converted light is 5000K.
  • region 54b may be mix
  • the color temperature of the mixed illumination light can be changed in the range of 3000 to 5000K. Note that it is more preferable to dispose the first region 54a and the second region 54b close to each other because the movement distance can be shortened.
  • FIG. 8A is a schematic perspective view of a transmissive solid-state lighting device according to the fifth embodiment
  • FIG. 8B is a schematic cross-sectional view taken along the line DD.
  • two irradiation units 20b and 20c are provided, and excitation light is emitted from each.
  • the first region 54a includes, for example, a green wavelength conversion layer.
  • the second region 54b includes a red wavelength conversion layer.
  • the irradiation unit 20a mainly irradiates the first region 54a.
  • the irradiation unit 20b mainly irradiates the second region 54b.
  • the dose for the first region 54a and the dose for the second region can be determined independently. For this reason, the color temperature of the illumination light GT in which scattered light of excitation light, red light, and green light is mixed can be set within a desired range.
  • the red phosphor layer having a large calorific value for example, may be provided on the side close to the heat sink.
  • the color of the illumination light GT can be varied by adjusting the light output of the excitation light G1 from the irradiation unit 20b and the light output of the excitation light from the irradiation unit 20c.
  • FIG. 9A is a partially cut schematic perspective view of a transmissive solid-state lighting device according to the sixth embodiment
  • FIG. 9B is a partially cut schematic sectional view.
  • the wavelength conversion layer 54 increases the thickness of the wavelength conversion layer 54 that emits monochromatic light as it approaches the semiconductor light emitting element 10 side. As the wavelength conversion layer 54 becomes thicker, the optical output of the wavelength converted light emitted from the wavelength conversion layer 54 increases.
  • the illumination light GT has an emission color in which the emission spectrum of the wavelength conversion layer 54 is dominant. It becomes. For this reason, when the irradiation region moving means 24 moves the position of the irradiation unit 20b in the direction in which the wavelength conversion layer 54 becomes thicker, the emission color of the illumination light GT changes from the emission color in which the emission color of the excitation light is dominant. The emission color of the layer can be changed to the dominant emission color.
  • FIG. 10A is a partially cut schematic perspective view of the solid state lighting device according to the seventh embodiment
  • FIG. 10B is a partially cut schematic cross sectional view
  • FIG. 10C is a schematic cross sectional view of a modification.
  • a first region 54c whose thickness is constant along the central axis 60c and a second region 54d whose thickness increases toward the light source are stacked in this order.
  • the second wavelength converted light from the second region 54d must pass through the first region 54c. For this reason, it is preferable that the wavelength of the second wavelength converted light is longer than the wavelength of the first wavelength converted light emitted from the first wavelength conversion layer 54c.
  • the second wavelength converted light can be red light and the first wavelength converted light can be green light.
  • the irradiation unit 20b is moved in the direction in which the thickness of the second wavelength converted light 54d is increased by the irradiation region moving unit 24, the color of the illumination light GT is changed from the color dominant to the first wavelength converted light to the second.
  • the wavelength-converted light can change to a dominant color. Note that the thickness of the wavelength conversion layer 54d may change stepwise instead of continuously.
  • the boundary between the first region 54a and the second region 54b may be V-groove cross-sectional. Since the cross-sectional area of the wavelength conversion layer changes, the chromaticity of the illumination light GT can be changed.
  • FIG. 11A is a schematic perspective view of a light conversion unit constituting the solid-state lighting device according to the eighth embodiment
  • FIG. 11B is a schematic view showing the configuration of the solid-state lighting device
  • FIG. It is a model perspective view of a light body.
  • the solid state lighting device includes a light source unit 10, a light emitting unit 92, and an irradiation region moving unit 24.
  • the light emitting unit 92 includes a transparent tube 60, a plurality of (for example, 20) optical fibers 80, a fixing member 81 that bundles and fixes the optical fibers, and a rod-shaped light guide unit 20 that is provided with an irradiation unit 20b at the tip and is made of glass or the like. And a holding member 82 of the light guide 20, a reflection pin 84 coated with barium sulfate or the like, an upper fixing cap 86, a heat sink 88, and a stopper 88.
  • the light emitting unit 92 may have a length of approximately 110 mm and a heat sink 88 having a diameter of 50 mm.
  • the light guide part 20 shall be about 24 mm in length, 2.5 mm in diameter, etc., for example.
  • the tip of the light guide 20 is provided as a cone-shaped irradiation part 20b having a height of 1 to 2 mm, for example.
  • the length of the wavelength conversion layer 54 is 6 mm or the like.
  • the transparent tube 60 includes, for example, YAG ceramics (thermal conductivity: 11.7 W / m ⁇ K), alumina ceramics (thermal conductivity: 33.5 W / m ⁇ K), quartz glass (thermal conductivity: 1.4 W / m). m ⁇ K) and the like are appropriately selected according to the heat generation amount of the wavelength conversion layer.
  • the optical fiber 80 and the light guide unit 20 are not in contact with each other, a Fresnel loss occurs between the exit surface of the optical fiber 80 and the incident part of the light guide unit 20. When antireflection treatment is performed on these end faces, Fresnel loss can be reduced.
  • the optical fiber 80 and the light guide unit 20 may be integrated by fusion or the like.
  • FIG. 12A is a schematic cross-sectional view of the light conversion unit of the solid state lighting device of the eighth embodiment
  • FIG. 12B is a schematic cross-sectional view in the vicinity of the transparent tube
  • FIG. 12C is a schematic perspective view of the application example.
  • the excitation light emitted from the optical fiber is introduced into the light guide 20 and guided as shown by a solid line, then totally reflected by the conical surface, and provided around the irradiation part 20b as shown by a broken line.
  • the wavelength conversion layer 54 is efficiently irradiated.
  • the irradiation region moving unit 24 can change the chromaticity of the illumination light GT by changing the position of the irradiation unit 20b in, for example, the direction in which the light guide unit 20 extends.
  • Excitation light from the cone-shaped irradiation part 20b to the reflection pin 84 is slight, and heat generation in the light-emitting part 92 is substantially limited to the wavelength conversion layer 54.
  • the semiconductor light emitting element 10 is provided apart from the light emitting unit 92. For this reason, the heat sink 88 may be small enough to have a size capable of radiating the heat of the light emitting portion 92.
  • FIG. 12C shows an application example of the solid state lighting device of the eighth embodiment, and it can be used for a vehicle headlamp, a street lamp, and the like by further providing and condensing a reflector 94.
  • FIG. 13A is a schematic perspective view of a solid-state lighting device according to the ninth embodiment
  • FIG. 13B is a schematic cross-sectional view along AA.
  • the solid-state lighting device includes a light source unit 10, a light conversion layer 130, a direction conversion unit 122, a solar cell 160a that is an energy conversion element, and a functional element 170.
  • the light source unit (light engine) 10 includes a semiconductor light emitting element 12.
  • the semiconductor light emitting element 12 can be a light emitting diode (LED) or a laser diode (LD).
  • LED light emitting diode
  • LD laser diode
  • the semiconductor light emitting element 12 is an LD
  • the light spreading angle can be narrowed to 40 ° ⁇ 25 ° or the like, which is more preferable because the incident efficiency to the optical fiber bundle 100 can be increased.
  • the length of the optical fiber bundle 100 may be as short as several meters.
  • the light source unit 10 may further include drive circuits 113 and 116 and a heat sink (not shown).
  • the semiconductor light emitting element 12 is an LD with an optical output of 1 W or the like, and the number thereof is 20 or the like.
  • the number of LDs is not limited to 20. In this case, it is necessary to determine the size of the heat sink according to the power consumption of the LD.
  • the light source unit 10 further includes a semiconductor light emitting element 15 that emits light IR used for controlling a signal for driving the functional element 170.
  • the emission wavelength of the light IR used for signal control may be the same as the emission wavelength of the light, but may be infrared light that does not affect illumination (emission wavelength range of 700 to 1000 nm) or the like.
  • the output of the light IR for signal control may be small.
  • the optical fiber bundle 100 can include optical fibers 101 to 120 as respective light guide paths.
  • Each optical fiber can be a plastic optical fiber or the like. Note that the emission wavelength of the semiconductor light emitting element 12 used for the illumination light GT is in the range of blue-violet (405 nm) to red light (700 nm).
  • the light conversion layer 130 has a light diffusing agent that diffuses the light beam from the semiconductor light emitting element 12 and converts it into scattered light, or a wavelength conversion material that absorbs the light beam G1 and converts it into wavelength converted light.
  • the light conversion layer 130 includes a plurality of divided regions, and light emitted from each region has a different emission spectrum.
  • light diffusing particles containing a material having a high diffusion transmittance are arranged dispersed in a resin layer or the like. For this reason, scattering by particles increases and coherence can be reduced.
  • the light scattering particles can be polymethyl methacrylate or calcium carbonate.
  • Reference numeral 130 can be a wavelength conversion layer including a green YAG (Yttrium-Aluminum-Garnet) phosphor, a yellow YAG phosphor, a red YAG phosphor, and the like.
  • green YAG Yttrium-Aluminum-Garnet
  • the solid state lighting device can have a heat conducting portion 150 made of a metal or ceramic having high thermal conductivity.
  • the first surface 150a of the heat conducting unit 150 is provided with a recess 150b.
  • the recess 150b has an inner wall 150c that recedes from the first surface 150a and whose cross-sectional width becomes narrower in the depth direction.
  • a through hole 150d continuous with the recess 150b is further provided around the central axis 150e of the recess 150b.
  • the heat conducting portion 150, the concave reflection layer 140 provided on the inner wall 150c, and the light conversion layer 130 provided on the concave reflection layer 140 constitute the lamp portion 200.
  • the upper end of the recess 150b can have a diameter of approximately 8 mm.
  • the solid state lighting device can have a diffusion plate 145 so as to cover the recess 150b.
  • the diffusing plate 145 can include a light diffusing agent and the like, and a uniform light emitting surface can be obtained without making a subtle difference in position in the lamp unit 200 having different color temperatures inconspicuous.
  • the diffusion plate 145 may include a green wavelength conversion layer.
  • the direction changing part 122 is provided so as to penetrate the through-hole 150d, and one end becomes an incident part of the light beam G1, and the other end becomes an irradiation part 122a.
  • the light conversion layer 130 can be irradiated by changing the emission direction by 90 degrees in the vertical plane while maintaining the narrow divergence angle of the guided light beam G1.
  • an irradiation direction can change 360 degree
  • the direction conversion unit 122 has a size that fits in a cylinder with an outer diameter of 2 mm.
  • the concave reflection layer 140 is made of a metal having high thermal conductivity, heat generated by wavelength conversion loss in the wavelength conversion material can be released to the outside through the heat conducting unit 150 while maintaining the light reflectance at 90% or more. It becomes easy.
  • the energy conversion element is a photoelectric conversion element such as the solar cell 160a.
  • the solar cell 160a is composed of semiconductor pn junctions arranged in an array, and generates photovoltaic power by light irradiation.
  • the optical signal IR is transmitted to the switch element 191 via the optical fiber 121 for driving signal.
  • a current flows through the photodiode 180 disposed at the far end opening of the optical fiber 121, an input signal to a TIA (Trans-Impedance Amplifier) 190 is obtained.
  • the switch element 191 is turned on using the output signal Vout of the TIA 190 as a trigger, and the photovoltaic power of the solar cell 160 a is supplied to the functional element 170.
  • the electrical energy generated by the photovoltaic power can be stored in the storage battery 193 or the like.
  • the functional element 170 can be driven, and the chromaticity and color temperature of the illumination light GT emitted from the lamp unit 200 can be changed.
  • the functional element 170 can be, for example, an electro-mechanical element such as a piezoelectric element. *
  • the solar cell 160a is not provided with the light conversion layer 130 inside the recess 150b and the through hole 150d of the lamp unit 200, and is always irradiated with a part of the scattered light of the light beam G1 and a part of the illumination light. It is good to provide in the area.
  • it is preferably provided in the region 141 where unnecessary light that does not contribute to the light extraction efficiency and is not easily reflected by the concave reflection layer 140 is irradiated. That is, as shown in FIG. 13B, it is preferably provided on the inner wall of the through hole 150d.
  • a space for moving the direction changing portion 122 is required inside the through hole 150d. That is, stray light returning to the through hole 150d through this space or the direction changing part 122 itself may be used.
  • the phosphor provided on the surface of the concave reflection layer 140 may be a mixture of a plurality of phosphors having different emission spectrum peak wavelengths.
  • the first region 131 of the light conversion layer 130 includes a first wavelength conversion material (for example, a green phosphor) and a second wavelength conversion material (for example, a red phosphor) at a first mixing ratio.
  • the second region 132 of the light conversion layer 130 is a second region in which the first wavelength conversion material (for example, green phosphor) and the second wavelength conversion material (for example, red phosphor) are different from the first mixing ratio. It is included in the mixing ratio.
  • the third region 133 of the light conversion layer 130 includes a first wavelength conversion material (for example, a green phosphor) and a second wavelength conversion material (for example, a red phosphor) in a first mixing ratio and a second mixing ratio.
  • a third mixing ratio different from the ratio is included.
  • the first region 131 is provided on the first surface 150a side, and the third region is provided on the through hole 150d side.
  • Such first to third regions 131, 132, 133 of the light conversion layer 130 can be provided concentrically.
  • the color temperature may be continuously changed so that the color temperature is high on the side close to the through-hole 150d and the color temperature is lowered as the distance is increased.
  • the chromaticity of the illumination light GT which is a combination of the wavelength converted light and the blue scattered light, can be tuned (changed).
  • FIG. 14A is a schematic perspective view for explaining the operation of the functional element in the OFF state
  • FIG. 14B is a schematic sectional view taken along the line AA
  • FIG. 14C is the operation of the functional element in the on state
  • FIG. 14D is a schematic cross-sectional view taken along the line AA.
  • the direction changing part 122 is provided so as to penetrate the through hole 150d.
  • the irradiation unit 122a of the direction conversion unit 122 includes an oblique polishing surface, and the light beam G1 irradiates the light conversion layer 130 after being reflected by the polishing surface. In the off state of the functional element 170, bluish illumination light having a high color temperature is emitted.
  • the photovoltaic device 160a turns on the functional element 170 such as a piezoelectric element to turn on the direction changing unit.
  • the irradiation unit 122a of 122 is moved upward.
  • illumination light GT having a low color temperature can be obtained.
  • 14A and 14C show a state before the diffusion plate 145 is provided.
  • speckle noise can be reduced if the direction changing unit 122 is vibrated minutely using a piezoelectric element. For this reason, the coherence property of the illumination light GT can be reduced, and the safety of the illumination light GT can be increased.
  • the piezoelectric material quartz, berlinite, tourmaline, or the like can be used.
  • the ninth embodiment it is possible to control the chromaticity, color temperature, and the like of the illumination light GT by driving the functional element 170 only by the optical transmission system without supplying electric energy to the lamp unit 200 by the electric wiring.
  • FIG. 15A is a schematic perspective view of a solid-state lighting device according to the tenth embodiment
  • FIG. 15B is a schematic cross-sectional view along the line AA.
  • the light conversion layer 130 including the wavelength conversion material includes a first region 134 and a second region that are fan-divided into different positions around the central axis 150e of the inclined recess 150b of the heat conducting unit 150. 135 and a third region 136.
  • the first region 134 of the light conversion layer 130 includes a first wavelength conversion material (for example, a green phosphor) and a second wavelength conversion material (for example, a red phosphor) at a first mixing ratio.
  • the second region 135 of the light conversion layer 130 is a second region in which the first wavelength conversion material (for example, green phosphor) and the second wavelength conversion material (for example, red phosphor) are different from the first mixing ratio. It is included in the mixing ratio.
  • the third region 136 of the light conversion layer 130 is formed by combining a first wavelength conversion material (for example, a green phosphor) and a second wavelength conversion material (for example, a red phosphor) with a first mixing ratio and a second mixing ratio. A third mixing ratio different from the ratio is included.
  • the first to third regions 134, 135, 136 of the light conversion layer can be arranged in a fan shape around the central axis 150e of the recess 150b.
  • the first to third regions 134, 135, and 136 can absorb the irradiated light beam G1 and emit the wavelength-converted light and the scattered light converted from the light beam G1 without being absorbed by the light conversion layer 130. it can.
  • illumination light having different chromaticity and color temperature can be emitted from each region.
  • the first to third regions 134, 135, and 136 are provided as a pair of positions that are substantially symmetrical with respect to the central axis 150e, but the present invention is not limited to this.
  • FIG. 16A is a schematic perspective view for explaining the operation of the tenth embodiment
  • FIG. 16B is a schematic perspective view of the irradiation state of the first region
  • FIG. 16C is a irradiation state of the second region
  • FIG. 16D is a schematic perspective view of the irradiation state of the third region.
  • the direction changing portion 122 disposed inside the through hole 150d is rotatable around the central axis 150e of the recess 150b. That is, the functional element 170 has a rotation mechanism such as a motor, and can rotate the direction changing unit 122 at a predetermined angle around the central axis 150e.
  • the emission unit 122 a of the direction conversion unit 122 emits the light beam G ⁇ b> 1 toward the first region 134 of the light conversion layer 130, and depends on the composition of the wavelength conversion material in the first region 134.
  • the illumination light GT in which the wavelength-converted light and the blue scattered light multiple-reflected by the wavelength conversion material are mixed is emitted.
  • the direction changing unit 122 When the chromaticity or color temperature of the illumination light GT is not in the desired range, for example, as shown in FIG. 16C, the direction changing unit 122 is rotated to irradiate the second region 135 with the light beam G1. . When the chromaticity and color temperature of the illumination light GT are not in the desired ranges, the direction changing unit 122 is further rotated and the light beam G1 is emitted toward the third region 136 as shown in FIG. Thus, the chromaticity and color temperature of the illumination light GT can be controlled without directly connecting the power source and the lamp unit 200 directly.
  • FIG. 17 is a schematic perspective view of the eleventh embodiment.
  • the light conversion layer 130 may be a first region 137 containing a light diffusing agent, a second region 138 containing a red wavelength conversion material, and a third region 139 containing a green wavelength conversion material.
  • blue LD light beam is irradiated toward the first region 137
  • blue scattered light by the light scattering agent can be emitted as monochromatic illumination light GT.
  • red wavelength converted light can be emitted as monochromatic illumination light GT.
  • monochromatic green wavelength converted light can be emitted as illumination light GT.
  • the emission spectra of the illumination light from the first to third regions 137, 138, 139 are different.
  • the light conversion layer 130 can be a second region 138 and a third region 139 containing a yellow wavelength conversion material.
  • the yellow light intensity of the second region 138 and the yellow light intensity of the third region 139 are made different by changing the content of the yellow phosphor, etc., white light with different chromaticities can be obtained.
  • the light conversion layer 130 may contain a light scattering agent together with a yellow wavelength conversion material.
  • FIG. 18A is a schematic cross-sectional view for explaining the action in the first state of the solid state lighting device of the eleventh embodiment
  • FIG. 18B is a schematic cross-sectional view for explaining the action in the second state.
  • the energy conversion element is the Seebeck effect element 160b.
  • the Seebeck effect is an effect in which a voltage is generated when a temperature difference is provided between different metals or semiconductors.
  • the Seebeck effect and the Peltier effect are reversible.
  • the Seebeck effect element 160b is provided between the light conversion layer 130 and the inner wall 150c of the heat conducting unit 150, for example.
  • one surface of the Seebeck effect element 160b is in contact with the light conversion layer (high temperature side) 130, and the other surface is in contact with the inner wall (low temperature side) 150c of the heat conducting unit 150.
  • the functional element 170 can be mechanically driven by an electromotive force generated by temperature.
  • the functional element 170 is, for example, a micro MEMS (Micro Electro Mechanical Systems) mirror 171a that can change the reflection angle.
  • a micro MEMS Micro Electro Mechanical Systems
  • the angle of the micromirror in the second state is changed so as to be larger than the incident angle in the first state of FIG. 18A
  • the reflected light beam is above the irradiation position of the light conversion layer in the first state. Can be irradiated. For this reason, the chromaticity and color temperature of the illumination light GT can be controlled. Since the size of the MEMS mirror 171a is very small, power consumption may be small and light energy may be small. *
  • the functional element 170 is not limited to one that performs rotational movement or linear movement.
  • an optical switch that changes the irradiation position by changing the optical path may be used.
  • a solid state lighting device that can easily dissipate heat and can easily adjust chromaticity and color temperature.
  • Such a solid state lighting device can be widely used for stage lighting, spot lighting, vehicle headlamps, and the like.
  • the chromaticity and color temperature of the illumination light GT can be controlled without connecting the lamp unit to the power source. Moreover, since the lamp part does not have a solid light emitting element, it is easy to reduce the size and weight.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

This solid-state lighting device has a light source section, which has a semiconductor light emitting element, and which outputs excitation light, a light guide section, a wavelength conversion layer, and an irradiation region moving means. The light guide section has a light input section into which the excitation light is introduced, and an irradiation section from which the excitation light is outputted. The wavelength conversion layer has: a first region, which absorbs the excitation light, and which outputs first wavelength conversion light having a wavelength longer than that of the excitation light; and a second region, which absorbs the excitation light, and which outputs second wavelength conversion light having a wavelength longer than that of the excitation light. The emission spectrum of the first wavelength conversion light and that of the second wavelength conversion light are different from each other. The ratio of the first wavelength conversion light to the light output of the excitation light outputted through the first region, and the ratio of the light output of the second wavelength conversion light to the light output of the excitation light outputted through the second region are different from each other. The irradiation region moving means changes an irradiation position of the excitation light outputted from the irradiation section, said position being on the surface of the wavelength conversion layer.

Description

固体照明装置Solid state lighting device

 本発明の実施形態は、固体照明装置に関する。 Embodiments of the present invention relate to a solid state lighting device.

 固体発光素子を用いた白色固体照明(SSL:Solid State lighting)装置は、LED(Light Emitting Diode)が主流である。 White solid-state lighting (SSL) devices using solid-state light-emitting elements are mainly LEDs (Light Emitting Diodes).

 この場合、蛍光体を有する白色発光部がLED(Light Emitting Diode)チップを覆うように設けられると、LEDチップの放熱と給電のための基板が必要である。もし、白色発光部が光学系のみで構成されれば、発熱も少なく、小型軽量化され、照明装置のデザインの自由度を高めることができる。 In this case, if the white light emitting part having the phosphor is provided so as to cover the LED (Light Emitting Diode) chip, a substrate for heat dissipation and power feeding of the LED chip is required. If the white light emitting unit is composed only of an optical system, heat generation is small, the size and weight are reduced, and the design flexibility of the lighting device can be increased.

 そのためには、たとえば、青紫色~青色の波長範囲の高輝度固体発光素子からの出力を導光体などに効率よく結合させ、固体発光素子から離間した蛍光体などの波長変換層に照射して白色発光を得る構造とすればよい。 For this purpose, for example, the output from a high-intensity solid-state light emitting device in the blue-violet to blue wavelength range is efficiently coupled to a light guide or the like, and irradiated to a wavelength conversion layer such as a phosphor separated from the solid light-emitting device. A structure that obtains white light emission may be used.

 発光色の色温度を調整するには、色温度の異なる複数の白色LEDを発光強度比を変えればよい。しかし、白色LEDの数を増やす必要がある。また、RGB各色のLEDを混色して所望の色温度を得ようとすると、白色LEDよりも発光効率が低いため消費電力が増加する。  In order to adjust the color temperature of the emission color, it is only necessary to change the emission intensity ratio of a plurality of white LEDs having different color temperatures. However, it is necessary to increase the number of white LEDs. In addition, when trying to obtain a desired color temperature by mixing LEDs of RGB colors, the power consumption increases because the light emission efficiency is lower than that of the white LED. *

特表2011-501364号公報Special table 2011-501364 gazette 国際公開第2007/099827号International Publication No. 2007/099827

 放熱が容易で、色度の調整が容易な固体照明装置を提供する。 Provide a solid-state lighting device that can easily dissipate heat and adjust chromaticity.

 実施形態の固体照明装置は、半導体発光素子を有し、励起光を放出する光源部と、前記励起光が導入される入射部と、前記入射部に導入された前記励起光を放出する照射部と、を有する導光部と、前記照射部から放出された前記励起光が照射される波長変換層であって、前記励起光を吸収し前記励起光の波長よりも長い波長を有する第1波長変換光を放出する第1領域と、前記励起光を吸収し前記励起光の波長よりも長い波長を有する第2波長変換光を放出する第2領域と、を有し、前記第1波長変換光と前記第2波長変換光とは発光スペクトルが異なるか、または前記第1領域を介して放出される前記励起光の光出力に対する前記第1波長変換光の光出力の比率と前記第2領域を介して放出される前記励起光の光出力に対する前記第2波長変換光の光出力の比率とが異なる、波長変換層と、前記照射部から放出される前記励起光の前記波長変換層の表面における照射位置を変化させる照射領域移動手段と、を備える。 The solid-state lighting device of the embodiment includes a semiconductor light emitting element, a light source unit that emits excitation light, an incident unit that introduces the excitation light, and an irradiation unit that emits the excitation light introduced into the incident unit A first wavelength having a wavelength that is longer than the wavelength of the excitation light by absorbing the excitation light. A first region that emits converted light; and a second region that absorbs the excitation light and emits second wavelength converted light having a wavelength longer than the wavelength of the excitation light, and the first wavelength converted light. And the second wavelength converted light have different emission spectra, or the ratio of the optical output of the first wavelength converted light to the optical output of the excitation light emitted through the first region and the second region The second wave with respect to the optical output of the excitation light emitted through The ratio of the light output of the converted light are different, it comprises a wavelength conversion layer, and a irradiation area moving means for changing an irradiation position on the surface of the wavelength conversion layer of the excitation light emitted from the irradiation unit.

 放熱が容易で、色度の調整が容易な固体照明装置が提供される。 A solid state lighting device that can easily dissipate heat and adjust chromaticity is provided.

図1(a)は第1の実施形態にかかる固体照明装置の模式斜視図、図1(b)はA-A線に沿った模式断面図、である。FIG. 1A is a schematic perspective view of the solid-state lighting device according to the first embodiment, and FIG. 1B is a schematic cross-sectional view along the line AA. 図2(a)は波長変換層の構造を表す模式平面図、図2(b)はB-B線に沿ったその模式断面図、図2(c)は波長変換層の変形例を表す模式平面図、図2(d)はB-B線に沿ったその模式断面図、である。2A is a schematic plan view showing the structure of the wavelength conversion layer, FIG. 2B is a schematic cross-sectional view along the line BB, and FIG. 2C is a schematic view showing a modification of the wavelength conversion layer. FIG. 2D is a schematic cross-sectional view along the line BB. 図3(a)は第2の実施形態の第1照射位置の模式平面図、図3(b)はC-C線に沿ったその模式断面図、図3(c)は第2照射位置の模式平面図、図3(d)はC-C線に沿ったその模式断面図、図3(e)は第3照射位置の模式平面図、図3(f)はC-C線に沿ったその模式断面図、である。FIG. 3A is a schematic plan view of the first irradiation position of the second embodiment, FIG. 3B is a schematic cross-sectional view along the line CC, and FIG. 3C is the second irradiation position. 3D is a schematic sectional view taken along the line CC, FIG. 3E is a schematic plan view of the third irradiation position, and FIG. 3F is a line taken along the line CC. It is the model sectional drawing. 図4(a)は第3の実施形態にかかる固体照明装置の模式斜視図、図4(b)はC-C線に沿った模式断面図、である。FIG. 4A is a schematic perspective view of the solid-state lighting device according to the third embodiment, and FIG. 4B is a schematic cross-sectional view taken along the line CC. 図5(a)は円錐形照射部、図5(b)は四角錐形照射部、図5(c)は三角錐形照射部、図5(d)は端面研磨ファイバー照射部、図5(e)はファイバーアレイの照射部、図5(f)は複層ファイバーアレイの照射部の模式斜視図、である。5A is a conical irradiation unit, FIG. 5B is a quadrangular pyramid irradiation unit, FIG. 5C is a triangular pyramid irradiation unit, FIG. 5D is an end polishing fiber irradiation unit, and FIG. FIG. 5E is a schematic perspective view of the irradiation section of the fiber array, and FIG. 5F is a schematic perspective view of the irradiation section of the multilayer fiber array. 図6(a)は発光部の模式斜視図、図6(b)はその応用例であるスポットライトの模式斜視図、である。FIG. 6A is a schematic perspective view of a light emitting unit, and FIG. 6B is a schematic perspective view of a spotlight which is an application example thereof. 図7(a)は第4の実施形態にかかる固体照明装置の模式斜視図、図7(b)はD-D線に沿った模式断面図である。FIG. 7A is a schematic perspective view of a solid-state lighting device according to the fourth embodiment, and FIG. 7B is a schematic cross-sectional view taken along the line DD. 図8(a)は第5の実施形態にかかる固体照明装置の模式斜視図、図8(b)はD-D線に沿った模式断面図、である。FIG. 8A is a schematic perspective view of a solid state lighting device according to the fifth embodiment, and FIG. 8B is a schematic cross-sectional view taken along the line DD. 図9(a)は第6の実施形態にかかる固体照明装置の部分切断模式斜視図、図9(b)は部分切断模式断面図、である。FIG. 9A is a partially cut schematic perspective view of a solid state lighting device according to the sixth embodiment, and FIG. 9B is a partially cut schematic cross-sectional view. 図10(a)は第7の実施形態にかかる固体照明装置の部分切断模式斜視図、図10(b)は部分切断模式断面図、図10(c)は変形例の模式断面図、である。FIG. 10A is a partially cut schematic perspective view of the solid state lighting device according to the seventh embodiment, FIG. 10B is a partially cut schematic cross sectional view, and FIG. 10C is a schematic cross sectional view of a modification. . 図11(a)は第8の実施形態にかかる固体照明装置を構成する光変換部の模式斜視図、図11(b)は固体照明装置の構成を表す模式図、図11(c)は導光体の模式斜視図、である。FIG. 11A is a schematic perspective view of a light conversion unit constituting the solid-state lighting device according to the eighth embodiment, FIG. 11B is a schematic view showing the configuration of the solid-state lighting device, and FIG. It is a model perspective view of a light body. 図12(a)は第8の実施形態の固体照明装置の光変換部の模式断面図、図12(b)は透明管近傍の模式断面図、図12(c)はその応用例の模式斜視図、である。12A is a schematic cross-sectional view of the light conversion unit of the solid state lighting device of the eighth embodiment, FIG. 12B is a schematic cross-sectional view in the vicinity of the transparent tube, and FIG. 12C is a schematic perspective view of the application example. Figure. 図13(a)は第9の実施形態にかかる固体照明装置の模式斜視図、図13(b)はA-Aに沿った模式断面図、である。FIG. 13A is a schematic perspective view of a solid-state lighting device according to the ninth embodiment, and FIG. 13B is a schematic cross-sectional view along AA. 図14(a)は機能素子のオフ状態の作用を説明する模式斜視図、図14(b)はA-A線に沿った模式断面図、図14(c)は機能素子のオン状態の作用を説明する模式斜視図、図14(d)はA-A線に沿った模式断面図、である。FIG. 14A is a schematic perspective view for explaining the operation of the functional element in the OFF state, FIG. 14B is a schematic sectional view taken along the line AA, and FIG. 14C is the operation of the functional element in the on state. FIG. 14D is a schematic cross-sectional view taken along the line AA. 図15(a)は第10の実施形態にかかる固体照明装置の模式斜視図、図15(b)はA-A線に沿った模式断面図、である。FIG. 15A is a schematic perspective view of a solid-state lighting device according to the tenth embodiment, and FIG. 15B is a schematic cross-sectional view along the line AA. 図16(a)は第10の実施形態の作用を説明する模式斜視図、図16(b)は第1領域の照射状態の模式斜視図、図16(c)は第2領域の照射状態の模式斜視図、図16(d)は第3領域の照射状態の模式斜視図、である。FIG. 16A is a schematic perspective view for explaining the operation of the tenth embodiment, FIG. 16B is a schematic perspective view of the irradiation state of the first region, and FIG. 16C is a irradiation state of the second region. FIG. 16D is a schematic perspective view of the irradiation state of the third region. 第11の実施形態の模式斜視図である。It is a model perspective view of 11th Embodiment. 図18(a)は第11の実施形態の固体照明装置の第1状態における作用を説明する模式断面図、図18(b)はその第2状態における作用を説明する模式断面図、である。FIG. 18A is a schematic cross-sectional view for explaining the action in the first state of the solid state lighting device of the eleventh embodiment, and FIG. 18B is a schematic cross-sectional view for explaining the action in the second state.

 以下、図面を参照しつつ本発明の実施の形態について説明する。
 図1(a)は第1の実施形態にかかる固体照明装置の模式斜視図、図1(b)はA-A線に沿った模式断面図、である。
 固体照明装置は、光源部10と、波長変換層54と、導光部20と、照射領域移動手段24と、を有する。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1A is a schematic perspective view of the solid-state lighting device according to the first embodiment, and FIG. 1B is a schematic cross-sectional view along the line AA.
The solid-state lighting device includes the light source unit 10, the wavelength conversion layer 54, the light guide unit 20, and the irradiation region moving unit 24.

 光源部10は、励起光G1を放出する構成で、励起光G1の発生手段として、半導体発光素子などを少なくとも有している。半導体発光素子は、たとえば、400~490nm波長範囲の励起光(光ビーム)G1を放出するレーザー素子や発光ダイオードなどとすることができる。励起光G1の波長範囲は、後述する波長変換層54に吸収され波長変換光を放出できればよく、波長変換層54との組み合わせにより、波長400nm以下の紫外線や、波長500nm以上とすることもできる。 The light source unit 10 is configured to emit the excitation light G1, and has at least a semiconductor light emitting element or the like as a means for generating the excitation light G1. The semiconductor light emitting element can be, for example, a laser element or a light emitting diode that emits excitation light (light beam) G1 having a wavelength range of 400 to 490 nm. The wavelength range of the excitation light G <b> 1 only needs to be absorbed by the wavelength conversion layer 54 described later and emit wavelength conversion light, and can be set to ultraviolet light with a wavelength of 400 nm or less, or with a wavelength of 500 nm or more, in combination with the wavelength conversion layer 54.

 また、光源部10は、半導体発光素子からの光を直接励起光として照射する構成でも良いし、また、光ファイバー、光学レンズ、反射部材等を介して間接的に照射する構成でも良い。また、半導体発光素子を複数個とし、光源部10からの励起光G1の出力を高める構成でも良い。また、後述する導光部20が複数導光体からなる場合は、半導体発光素子からの励起光G1を、複数導光体に分岐して励起光G1を導く構成でも良い。半導体発光素子をレーザー素子とするとビーム広がり角を狭くできるので、励起光を効率よく導光部20の入射部20aに導入し、効率よく照射部20bまで導光することができる。 The light source unit 10 may be configured to irradiate light from the semiconductor light emitting element directly as excitation light, or may be configured to indirectly irradiate via an optical fiber, an optical lens, a reflecting member, or the like. Further, a configuration in which a plurality of semiconductor light emitting elements are provided to increase the output of the excitation light G1 from the light source unit 10 may be used. Moreover, when the light guide part 20 mentioned later consists of two or more light guides, the structure which branches the excitation light G1 from a semiconductor light-emitting element to a plurality of light guides, and guides the excitation light G1 may be sufficient. If the semiconductor light emitting element is a laser element, the beam divergence angle can be narrowed, so that the excitation light can be efficiently introduced into the incident part 20a of the light guide part 20 and efficiently guided to the irradiation part 20b.

 導光部20は、光源部10からの励起光G1を、後述する波長変換層54に導き、たとえば、光ファイバーや導光体などで構成される。導光部20は、一方の端部が励起光を入射する入射部20aと、他方の端部が励起光G1を波長変換層に向かって照射する照射部20bを備えている。照射部20bは、例えば、光ファイバーや導光体の先端部をテーパー状に加工した形状であり、導光部20内を導光した励起光G1の反射方向を制御して、任意の照射方向に励起光G1を照射させている。図1(b)の構成では、後述する光ファイバーアレイを用いて4つの照射領域を有する。2つの照射領域は第1の方向へ励起光を照射し、また、残りの2つの照射領域は第1の方向と180度異なる第2の方向へ励起光を照射する構成である。導光部20は、ミラーやレンズなどにより構成される空間伝搬光路などとすることもできる。 The light guide unit 20 guides the excitation light G1 from the light source unit 10 to a wavelength conversion layer 54 described later, and is configured by, for example, an optical fiber or a light guide. The light guide unit 20 includes an incident unit 20a on which one end is incident with excitation light, and an irradiation unit 20b on which the other end irradiates the excitation light G1 toward the wavelength conversion layer. The irradiation unit 20b has, for example, a shape obtained by processing the tip of an optical fiber or a light guide into a taper shape, and controls the reflection direction of the excitation light G1 guided through the light guide unit 20 so as to be in an arbitrary irradiation direction. Excitation light G1 is irradiated. In the configuration of FIG. 1B, there are four irradiation areas using an optical fiber array described later. The two irradiation regions irradiate the excitation light in the first direction, and the remaining two irradiation regions irradiate the excitation light in a second direction 180 degrees different from the first direction. The light guide unit 20 may be a spatial propagation optical path configured by a mirror, a lens, or the like.

 波長変換層54は、励起光G1を吸収し励起光G1の波長よりも長い波長を含む発光スペクトルを有する波長変換光を放出する。波長変換層54は、たとえば、(Ca、Sr)Si:Eu、(Ca、Sr)AlSiN:Euなどの窒化物系蛍光体や、Cax(Si、Al)12(O,N)16:Eu、(Si、Al)(O、N):Eu、BaSi:Eu、BaSi:Euなどの酸窒化物系蛍光体や、LuAl12:Ce、(Y、Gd)(Al、Ga)12:Ce、(Sr、Ba)SiO:Eu、CaScSi12:Ce、SrAl1425:Euなどの酸化物系蛍光体や、(Ca、Sr)S:Eu、CaGa:Eu、ZnS:Cu、Al等の硫化物系蛍光体などの中から、単体または少なくとも1種類以上混合させた蛍光体を用いることができる。 The wavelength conversion layer 54 absorbs the excitation light G1 and emits wavelength conversion light having an emission spectrum including a wavelength longer than the wavelength of the excitation light G1. The wavelength conversion layer 54 is made of, for example, a nitride-based phosphor such as (Ca, Sr) 2 Si 5 N 8 : Eu, (Ca, Sr) AlSiN 3 : Eu, or Cax (Si, Al) 12 (O, N ) 16 : Eu, (Si, Al) 6 (O, N) 8 : Eu, BaSi 2 O 2 N 2 : Eu, BaSi 2 O 2 N 2 : Eu and other oxynitride phosphors, Lu 3 Al 5 O 12 : Ce, (Y, Gd) 3 (Al, Ga) 5 O 12 : Ce, (Sr, Ba) 2 SiO 4 : Eu, Ca 3 Sc 2 Si 3 O 12 : Ce, Sr 4 Al 14 O 25 : Eu or other oxide-based phosphors, (Ca, Sr) S: Eu, CaGa 2 S 4 : Eu, ZnS: Cu, Al or other sulfide-based phosphors, etc., or at least one kind A phosphor mixed as described above can be used.

 また、波長変換層54は、たとえば、波長変換光の発光スペクトルが異なる少なくとも2つの波長変換光を放出する少なくとも2つの領域を有する。図1において、波長変換層54は、第1領域54a、第2領域54b、第3領域54c、第4領域54d、第5領域54e、および第6領域54fを有するものとする。 The wavelength conversion layer 54 has, for example, at least two regions that emit at least two wavelength-converted lights having different emission spectra of the wavelength-converted light. In FIG. 1, the wavelength conversion layer 54 includes a first region 54a, a second region 54b, a third region 54c, a fourth region 54d, a fifth region 54e, and a sixth region 54f.

 導光部20の入射部20aは、波長変換層54a~54fで囲まれる領域の外部に設けられる。また、照射部20bは、波長変換層54a~54fに囲まれるように設けられ、導光された光源部10からの励起光G1を放出する。照射領域移動手段24は、照射部20bから波長変換層54に向けて放出される励起光G1の照射領域の位置を移動させる。このようにして、波長変換層54の上方では、励起光G1が照射された領域の波長変換層54からの波長変換光と、波長変換層54により反射された励起光G1の一部とが混合された照明光GTを得ることができる。 The incident portion 20a of the light guide portion 20 is provided outside the region surrounded by the wavelength conversion layers 54a to 54f. The irradiation unit 20b is provided so as to be surrounded by the wavelength conversion layers 54a to 54f, and emits the excitation light G1 from the light source unit 10 guided. The irradiation region moving unit 24 moves the position of the irradiation region of the excitation light G1 emitted from the irradiation unit 20b toward the wavelength conversion layer 54. Thus, above the wavelength conversion layer 54, the wavelength conversion light from the wavelength conversion layer 54 in the region irradiated with the excitation light G1 and a part of the excitation light G1 reflected by the wavelength conversion layer 54 are mixed. The illuminated illumination light GT can be obtained.

 たとえば、第1領域54aとその反対の側の第4領域54dとは、略同一となる第1の発光スペクトルを有する波長変換光を放出するものとする。また、第2領域54bとその反対の側の第5領域54eとは第1の発光スペクトルとは異なる第2の発光スペクトルを有する波長変換光を放出するものとする。さらに、第3領域54cとその反対の側の第6領域54fとは、第1および第2の発光スペクトルとは異なる第3の発光スペクトルを有する波長変換光を放出するものとする。 For example, it is assumed that the first region 54a and the fourth region 54d on the opposite side emit wavelength-converted light having a first emission spectrum that is substantially the same. In addition, the second region 54b and the fifth region 54e on the opposite side emit wavelength converted light having a second emission spectrum different from the first emission spectrum. Furthermore, it is assumed that the third region 54c and the sixth region 54f on the opposite side emit wavelength converted light having a third emission spectrum different from the first and second emission spectra.

 導光部20を、導光部20の軸方向を中心軸30cとして回転させて、照射部20bからの励起光G1の照射位置を、第1領域54aと第4領域54dとの位置、または第2領域54bと第4領域54eとの位置、または第3領域54cと第6領域54eとの位置に切り替えることで、照明光GTの色度を変えることができる。 The light guide unit 20 is rotated with the axial direction of the light guide unit 20 as the central axis 30c, and the irradiation position of the excitation light G1 from the irradiation unit 20b is set to the position of the first region 54a and the fourth region 54d, or the first The chromaticity of the illumination light GT can be changed by switching to the position of the second area 54b and the fourth area 54e or the position of the third area 54c and the sixth area 54e.

 たとえば、光源部10の励起光G1に、青紫色~青色のレーザー光を用い、また、第1の発光スペクトルが青色の波長変換層、第2の発光スペクトルが緑色の波長変換層、および第3の発光スペクトルが赤色の波長変換層に選定することにより、青、緑、赤色に可変色できる。また、青色の波長変換層の代わりに、青紫色~青色のレーザー光を反射・反射させる散乱層を設けることでも、散乱層により青色光を発生できるので、同様に可変色できる。 For example, blue-violet to blue laser light is used as the excitation light G1 of the light source unit 10, the first emission spectrum is a blue wavelength conversion layer, the second emission spectrum is a green wavelength conversion layer, and a third wavelength conversion layer. By selecting the wavelength conversion layer whose red light emission spectrum is red, the color can be changed to blue, green, and red. Also, by providing a scattering layer that reflects / reflects blue-violet to blue laser light instead of the blue wavelength conversion layer, blue light can be generated by the scattering layer, so that the color can be changed in the same manner.

 波長変換層の配置に関する他の変形例としては、発光色が異なる複数の蛍光体を混合させた波長変換層を用い、その混合比を変化させて各領域に配置した構成でも良い。たとえば、光源部10の励起光G1に、青紫色~青色のレーザー光を用い、また、第1の発光スペクトルが第1の色温度となる配合比に調整された波長変換層、第2の発光スペクトルが第2の色温度なる配合比に調整された波長変換層、および第3の発光スペクトルが第3の色温度となる配合比に調整された波長変換層に選定することにより、照明光GTの色温度を可変できる。 As another modification example regarding the arrangement of the wavelength conversion layer, a configuration in which a wavelength conversion layer in which a plurality of phosphors having different emission colors are mixed is used and the mixing ratio is changed and arranged in each region may be used. For example, a blue-violet to blue laser beam is used as the excitation light G1 of the light source unit 10, and the wavelength conversion layer in which the first emission spectrum is adjusted to the blending ratio that becomes the first color temperature, the second emission By selecting the wavelength conversion layer whose spectrum is adjusted to the mixing ratio of the second color temperature and the wavelength conversion layer whose third emission spectrum is adjusted to the mixing ratio of the third color temperature, the illumination light GT is selected. The color temperature can be varied.

 また、たとえば、第1領域54aが赤色波長変換層を含み、その反対の側の第4領域54dが緑色波長変換層を含むこともできる。照射領域の位置を60度、120度とそれぞれ移動すると、発光スペクトルの異なる赤色及び緑色波長変換光をそれぞれ放出し、色度や色温度を調整できる。同様に、色温度の異なる電球色や白色光を得ることができる。 Further, for example, the first region 54a may include a red wavelength conversion layer, and the fourth region 54d on the opposite side may include a green wavelength conversion layer. When the position of the irradiation region is moved to 60 degrees and 120 degrees, respectively, red and green wavelength converted lights having different emission spectra are emitted, and chromaticity and color temperature can be adjusted. Similarly, light bulb colors and white light having different color temperatures can be obtained.

 また、波長変換層54に照射された励起光G1のうち、波長変換層54に吸収されずに、波長変換層54より反射された励起光G1の光出力に対する、波長変換光の光出力の比率を変えせることでも可変色が可能である。 The ratio of the light output of the wavelength converted light to the light output of the excitation light G1 reflected from the wavelength conversion layer 54 without being absorbed by the wavelength conversion layer 54 in the excitation light G1 irradiated to the wavelength conversion layer 54. Variable colors are possible by changing the color.

 たとえば、光源部10の励起光G1に、青紫色~青色のレーザー光を用い、各領域54a~54fに同一スペクトルの黄色蛍光体を波長変換層54として塗布し、各領域の波長変換層54の膜厚を異なるように配置する構成とすることができる。波長変換層54の膜厚が厚く塗布される領域では、励起光の吸収が大きくすることができ、黄色の波長変換光を増加することができる。その結果、波長変換層54により吸収されない励起光は減少するので、波長変換層54で反射される青色の励起光の光出力は減少する。その結果、照明光GTは、比較的、黄色の発光が支配的な発光色とすることができる。 For example, blue-violet to blue laser light is used as the excitation light G1 of the light source unit 10, and a yellow phosphor having the same spectrum is applied as the wavelength conversion layer 54 to each of the regions 54a to 54f. It can be set as the structure arrange | positioned so that a film thickness may differ. In the region where the wavelength conversion layer 54 is thickly applied, the absorption of excitation light can be increased, and yellow wavelength conversion light can be increased. As a result, since the excitation light that is not absorbed by the wavelength conversion layer 54 decreases, the light output of the blue excitation light reflected by the wavelength conversion layer 54 decreases. As a result, the illumination light GT can be a light emission color in which yellow light emission is dominant.

 一方、波長変換層54の膜厚が薄く塗布される領域では、励起光の吸収が小さくなり、黄色の波長変換光は減少する。その結果、波長変換層54により吸収されない励起光は増加するので、波長変換層54で反射される青色の励起光の光出力は増加する。その結果、放出光GTは、膜厚が厚い領域に比べて、青色が支配的な発光色とすることができる。このようにして、たとえば、色が異なる放出光を得ることが出来る。波長変換層54の第1領域~第6領域とは、平面視にて、たとえば、それぞれ60度で分割されたものとすることができる。なお、分割数は、6つに限定されない。 On the other hand, in the region where the film thickness of the wavelength conversion layer 54 is thinly applied, the absorption of the excitation light becomes small and the yellow wavelength conversion light decreases. As a result, since the excitation light that is not absorbed by the wavelength conversion layer 54 increases, the light output of the blue excitation light reflected by the wavelength conversion layer 54 increases. As a result, the emitted light GT can be a light emission color in which blue is dominant as compared with a region where the film thickness is thick. In this way, for example, emitted light with different colors can be obtained. The first region to the sixth region of the wavelength conversion layer 54 can be divided by, for example, 60 degrees in plan view. Note that the number of divisions is not limited to six.

 固体照明装置は、金属やセラミックなどの高熱伝導材を有する熱伝導部30をさらに有することができる。熱伝導部30は、第1の面30aから後退した凹部30bを有する。凹部30bは、その中心軸30cの周囲に設けられ第1の面30aに向かって拡幅する内壁30dを有する。波長変換層54は、その複数の領域(54a、54bなど)が中心軸30cの円周方向に沿った異なる位置に並置されるように、設けられている。 The solid state lighting device may further include a heat conducting unit 30 having a high heat conducting material such as metal or ceramic. The heat conducting unit 30 has a recess 30b that is recessed from the first surface 30a. The recess 30b has an inner wall 30d that is provided around the central axis 30c and widens toward the first surface 30a. The wavelength conversion layer 54 is provided such that the plurality of regions (54a, 54b, etc.) are juxtaposed at different positions along the circumferential direction of the central axis 30c.

 熱伝導部30および照射部20bのうちの少なくともいずれかを回転することにより、励起光は、波長変換層54の異なる領域を照射することができる。 The excitation light can irradiate different regions of the wavelength conversion layer 54 by rotating at least one of the heat conduction unit 30 and the irradiation unit 20b.

 また、凹部30bの上部にカバー部57を設けることができる。カバー部57は光拡散層を含むことができる。カバー部57が光拡散層を含むと、凹部30bの内壁30dに設けられた波長変換層に吸収されずに多重反射された励起光を多重散乱して放出することができる。励起光がレーザー光である場合、レーザー光をインコーヒーレント光に変換し人間の目に対する安全性を高めることができる。なお、図1(a)は、カバー部57を図示していない。 Moreover, the cover part 57 can be provided in the upper part of the recessed part 30b. The cover part 57 can include a light diffusion layer. When the cover portion 57 includes a light diffusion layer, the excitation light that is multiply reflected without being absorbed by the wavelength conversion layer provided on the inner wall 30d of the recess 30b can be scattered and emitted. In the case where the excitation light is laser light, the laser light can be converted into incoherent light to improve safety for human eyes. Note that FIG. 1A does not illustrate the cover portion 57.

 また、カバー部57、波長変換層を含むことができる。たとえば、カバー部57が緑色波長変換層を含むものとし、凹部30bの内壁30dには、赤色波長変換層、および緑色波長変換層がそれぞれ設けられているものとする。カバー部57の緑色波長変換層は、緑色光よりも波長が長い赤色光を殆ど吸収しないで透過する。波長変換層の温度が上昇するなどにより、励起光の吸収が減少すると反射光の青色成分が増加し、照明光GTが青みを帯びる。この場合、励起光の照射領域を移動して発光スペクトルを変化して青色成分を低減し所望の色温度に近づけることができる。また、カバー部57を設けることにより、波長変換層の発熱領域が分散できる。 Moreover, the cover part 57 and the wavelength conversion layer can be included. For example, it is assumed that the cover portion 57 includes a green wavelength conversion layer, and a red wavelength conversion layer and a green wavelength conversion layer are provided on the inner wall 30d of the recess 30b. The green wavelength conversion layer of the cover part 57 transmits red light having a wavelength longer than that of green light with little absorption. When absorption of excitation light decreases due to an increase in the temperature of the wavelength conversion layer, the blue component of reflected light increases, and the illumination light GT becomes bluish. In this case, the emission spectrum can be changed by moving the excitation light irradiation region to reduce the blue component and bring it closer to the desired color temperature. Further, by providing the cover portion 57, the heat generation region of the wavelength conversion layer can be dispersed.

 照射領域移動手段24は、照射部20bと波長変換層54との相対位置を可変させる手段で、モーター、ギアなどを有し、電磁方式や電子方式などで機械的に移動させる自動移動手段や、または。これらを簡略化し、操作者により手動で移動させる手動移動装置などとすることができる。 The irradiation region moving unit 24 is a unit that changes the relative position between the irradiation unit 20b and the wavelength conversion layer 54, has a motor, a gear, and the like, and is an automatic moving unit that moves mechanically by an electromagnetic method or an electronic method, Or. These can be simplified, and it can be set as the manual movement apparatus etc. which are moved manually by the operator.

 図2(a)は波長変換層の構造を表す模式平面図、図2(b)は図2(a)のB-B線に沿ったその模式断面図、図2(c)は波長変換層の変形構造を表す模式平面図、図2(d)は図2(c)のB-B線に沿ったその模式断面図、である。
 図2(a)、(b)において、波長変換層54は、波長変換層54を保持または固定する保持板50の一方の面に塗布することができる。保持板50は、YAGやアルミナなどのセラミックスなどの絶縁板を使用できる。セラミックスは、励起光や波長変換層54からの光を透過する透明セラミックスや、これらの光を反射させる反射性のセラミックスなどを用いることができる。また、保持板50は、放熱性を高めるため、アルミニウムや銅などの金属板も用いることができる。保持板50の厚みは、例えば、0.05~3.0mmであり、放熱性や光利用効率に応じて設定される。この場合、蛍光体粒子などの波長変換材は、たとえば、アモルファス状のシリカ混合液に混合されて塗布できる。Agなどを含む反射層52は、保持板50の他方の面にスパッタリング法や蒸着法などを用いて設けることができる。
2A is a schematic plan view showing the structure of the wavelength conversion layer, FIG. 2B is a schematic cross-sectional view taken along line BB in FIG. 2A, and FIG. 2C is the wavelength conversion layer. FIG. 2D is a schematic cross-sectional view taken along the line BB in FIG. 2C.
2A and 2B, the wavelength conversion layer 54 can be applied to one surface of a holding plate 50 that holds or fixes the wavelength conversion layer 54. The holding plate 50 can be an insulating plate such as ceramics such as YAG or alumina. As the ceramics, transparent ceramics that transmit excitation light and light from the wavelength conversion layer 54, reflective ceramics that reflect these lights, and the like can be used. The holding plate 50 can also be a metal plate such as aluminum or copper in order to improve heat dissipation. The thickness of the holding plate 50 is, for example, 0.05 to 3.0 mm, and is set according to heat dissipation and light utilization efficiency. In this case, a wavelength conversion material such as phosphor particles can be applied by being mixed in an amorphous silica mixed solution, for example. The reflective layer 52 containing Ag or the like can be provided on the other surface of the holding plate 50 using a sputtering method, a vapor deposition method, or the like.

 または、図2(c)、(d)に表すように、保持板50の一方の面に、反射層52、波長変換層54の順序で設けることができる。このようにすると、熱伝導部30の内壁30dへ確実かつ容易に波長変換層54および反射層52を接着できる。このため、放熱性を高めた反射型構造とすることができる。また、反射層52と熱伝導部30との間に、シリコーンなどの放熱性の良い接着層(図示せず)を介して接合しても良い。また、反射層52は、例えば半田などを用いて、反射層52と接着層とを兼用する構成でも良い。 Alternatively, as shown in FIGS. 2C and 2D, the reflective layer 52 and the wavelength conversion layer 54 can be provided on one surface of the holding plate 50 in this order. In this way, the wavelength conversion layer 54 and the reflection layer 52 can be reliably and easily bonded to the inner wall 30d of the heat conducting unit 30. For this reason, it can be set as the reflection type structure which improved heat dissipation. Moreover, you may join between the reflection layer 52 and the heat conductive part 30 through the adhesive layer (not shown) with good heat dissipation, such as silicone. Further, the reflective layer 52 may be configured to use both the reflective layer 52 and the adhesive layer by using, for example, solder.

 図3(a)は第2の実施形態の第1照射位置の模式平面図、図3(b)はC-C線に沿ったその模式断面図、図3(c)は第2照射位置の模式平面図、図3(d)はC-C線に沿ったその模式断面図、図3(e)は第3照射位置の模式平面図、図3(f)はC-C線に沿ったその模式断面図、である。 FIG. 3A is a schematic plan view of the first irradiation position of the second embodiment, FIG. 3B is a schematic cross-sectional view along the line CC, and FIG. 3C is the second irradiation position. 3D is a schematic sectional view taken along the line CC, FIG. 3E is a schematic plan view of the third irradiation position, and FIG. 3F is a line taken along the line CC. It is the model sectional drawing.

 第2の実施形態では、照射領域移動手段24により、凹部30bの中心軸30cに沿って照射部20bを異なる位置に移動する。すなわち、図3(a)、(b)は、第1の面から最も離間した第1照射位置を表す。図3(c)、(d)は、第1照射位置よりも第1の面に近い第2照射位置を表す。図3(e)、(f)は、第1の面に最も近い第3照射位置を表す。波長変換層54は、中心軸30cの方向に沿った異なる位置に、波長変換光の発光スペクトルまたは波長変換層54を介して放出される励起光の光出力に対する波長変換光の光出力の比率のうち少なくともいずれかが異なる領域が設けられている。波長変換層54を介して放出される励起光とは、波長変換層54に照射される励起光のうち、波長変換層54に吸収されず、波長変換層54により反射または散乱される励起光を意味する。波長変換層54の異なる領域の境界は連続的に変化していてもよい。このため、波長変換光と波長変換層54を介して放出された励起光とが混合された照明光GTの色度や色温度を変化させることができる。 In the second embodiment, the irradiation region moving means 24 moves the irradiation unit 20b to a different position along the central axis 30c of the recess 30b. That is, FIGS. 3A and 3B show the first irradiation position that is the farthest from the first surface. 3C and 3D show the second irradiation position closer to the first surface than the first irradiation position. FIGS. 3E and 3F show the third irradiation position closest to the first surface. The wavelength conversion layer 54 has an emission spectrum of the wavelength conversion light or a ratio of the optical output of the wavelength conversion light to the optical output of the excitation light emitted through the wavelength conversion layer 54 at different positions along the direction of the central axis 30c. A region where at least one of them is different is provided. The excitation light emitted through the wavelength conversion layer 54 refers to the excitation light that is not absorbed by the wavelength conversion layer 54 and is reflected or scattered by the wavelength conversion layer 54 among the excitation light irradiated to the wavelength conversion layer 54. means. The boundary between different regions of the wavelength conversion layer 54 may change continuously. For this reason, the chromaticity and color temperature of the illumination light GT in which the wavelength conversion light and the excitation light emitted through the wavelength conversion layer 54 are mixed can be changed.

 また、照射領域移動手段24により、熱伝導部30の位置を、中心軸30cに沿って移動してもよい。なお、照射領域移動手段24は、たとえば、モーターやギアなどを有し、電磁方式や電子方式などで機械的に移動させる自動移動手段装置や、または、これらを簡略化し、操作者により手動で移動させる手動移動装置とすることができる。 Further, the position of the heat conducting unit 30 may be moved along the central axis 30c by the irradiation region moving means 24. The irradiation area moving means 24 has, for example, a motor, a gear, etc., and an automatic moving means device that moves mechanically by an electromagnetic method or an electronic method, or these are simplified and moved manually by an operator. It can be a manual moving device.

 図4(a)は第3の実施形態にかかる固体照明装置の模式斜視図、図4(b)はC-C線に沿った模式断面図、である。
 導光部20は、空間伝搬光路でもよい。本図において、半導体発光素子から放出された励起光G1は、たとえば、レーザー光であり、空間を伝搬し、ミラー23により折り曲げられ、さらに空間を伝搬したのち、照射部20bから放出される。照射領域移動手段24は、照射部20bおよび熱伝導部30のうちの少なくともいずれかを、中心軸30cの周りに回転すると波長変換層54への照射領域の位置を移動することができる。なお、光路中のいずれかの領域に、導光体または光拡散層を設けて、励起光を散乱光とすることができる。なお、照射部20bおよび熱伝導部30のうちの少なくともいずれかを、中心軸30cに沿って相対的に移動し照射位置を変えることもできる。
FIG. 4A is a schematic perspective view of the solid-state lighting device according to the third embodiment, and FIG. 4B is a schematic cross-sectional view taken along the line CC.
The light guide 20 may be a spatial propagation optical path. In this figure, the excitation light G1 emitted from the semiconductor light emitting element is, for example, laser light, propagates through the space, is bent by the mirror 23, further propagates through the space, and is then emitted from the irradiation unit 20b. The irradiation region moving means 24 can move the position of the irradiation region on the wavelength conversion layer 54 when at least one of the irradiation unit 20b and the heat conducting unit 30 is rotated around the central axis 30c. In addition, a light guide or a light diffusing layer may be provided in any region in the optical path so that the excitation light can be scattered light. Note that at least one of the irradiation unit 20b and the heat conduction unit 30 can be moved relatively along the central axis 30c to change the irradiation position.

 図5(a)は円錐形照射部、図5(b)は四角錐形照射部、図5(c)は三角錐形照射部、図5(d)は端面研磨ファイバー照射部、図5(e)はファイバーアレイの照射部、図5(f)は複層ファイバーアレイの照射部、の模式斜視図である。
 照射部20bは、導光部20の先端部を所望の形状に加工したものとすることができる。先端形状は、図5(a)では円錐、図5(b)では四角錐、図5(c)では三角錐などとする。たとえば、先端部の傾斜面により、導光部20の内部を導光された励起光G1が全反射し波長変換層54を効率よく照射することできる。
5A is a conical irradiation unit, FIG. 5B is a quadrangular pyramid irradiation unit, FIG. 5C is a triangular pyramid irradiation unit, FIG. 5D is an end polishing fiber irradiation unit, and FIG. e) is a schematic perspective view of the irradiation section of the fiber array, and FIG. 5F is a schematic perspective view of the irradiation section of the multilayer fiber array.
The irradiation part 20b can be obtained by processing the tip part of the light guide part 20 into a desired shape. The tip shape is a cone in FIG. 5A, a quadrangular pyramid in FIG. 5B, a triangular pyramid in FIG. For example, the excitation light G1 guided inside the light guide 20 can be totally reflected by the inclined surface of the tip, and the wavelength conversion layer 54 can be efficiently irradiated.

 また、図5(d)では、光ファイバー21の先端部を斜め研磨した端面を照射部20bとする。端面の傾斜角度は、波長変換層54の表面を効率よく照射するように、たとえば、45度とすることができる。図5(e)、(f)のように、ファイバーアレイの先端部を斜め研磨した照射部20bとすると、励起光の出力を高め、大光量照明装置とすることができる。 Further, in FIG. 5D, the end face obtained by obliquely polishing the tip of the optical fiber 21 is defined as an irradiation part 20b. The inclination angle of the end face can be set to, for example, 45 degrees so that the surface of the wavelength conversion layer 54 is efficiently irradiated. As shown in FIGS. 5 (e) and 5 (f), when the irradiation section 20b is formed by obliquely polishing the tip of the fiber array, the output of the excitation light can be increased and a large light quantity illumination device can be obtained.

 ファイバーアレイは、例えば、基板、カバー、接着部材と複数の光ファイバーにより構成される。基板は、その一面に光ファイバー本数に対応する本数のV溝が形成される。カバーは、基板に形成されたV溝のそれぞれに1本ずつ配列された光ファイバーを覆うように設けられる。接着部材は、液状の接着剤が固化したものであり、基板とカバーとの間に設けられて、光ファイバーを固定する。基板、カバーの材料は、例えば、石英ガラス、ホウケイ酸ガラス、サファイア等の透明部材である。接着部材は、例えば、半導体レーザーの高出力に耐えられる無機バインダやシリコーン樹脂などが用いることができる。本図では、基板とカバーで光ファイバーを挟み込んで固定するファイバーアレイを示しているが、基板の入射側側面に光ファイバーの出射端を融着して接続した構成とすることも出来る。 The fiber array includes, for example, a substrate, a cover, an adhesive member, and a plurality of optical fibers. The number of V-grooves corresponding to the number of optical fibers is formed on one surface of the substrate. The cover is provided so as to cover the optical fibers arranged one by one in each V-groove formed in the substrate. The adhesive member is a solidified liquid adhesive and is provided between the substrate and the cover to fix the optical fiber. The material of the substrate and cover is a transparent member such as quartz glass, borosilicate glass, or sapphire. As the adhesive member, for example, an inorganic binder or a silicone resin that can withstand the high output of the semiconductor laser can be used. In this figure, a fiber array is shown in which an optical fiber is sandwiched and fixed between a substrate and a cover. However, a configuration in which the exit end of the optical fiber is fused and connected to the incident side surface of the substrate can also be used.

 図6(a)は発光部の模式斜視図、図6(b)はその応用例であるスポットライトの模式斜視図、である。
 スポットライトは、たとえば、舞台照明などに用いることができる。この場合、照明光の色度や色温度は、要求により多様に変化する。図6(a)に表すように、第1~第3の固体照明装置において、波長変換層54と熱伝導部30とを含む発光部35のみを交換することにより、これらの要求に応じることが容易となる。
FIG. 6A is a schematic perspective view of a light emitting unit, and FIG. 6B is a schematic perspective view of a spotlight which is an application example thereof.
The spotlight can be used for stage lighting, for example. In this case, the chromaticity and color temperature of the illumination light change variously depending on requirements. As shown in FIG. 6A, in the first to third solid-state lighting devices, it is possible to meet these requirements by exchanging only the light emitting unit 35 including the wavelength conversion layer 54 and the heat conducting unit 30. It becomes easy.

 図7(a)は第4の実施形態にかかる固体照明装置の模式斜視図、図7(b)はD-D線に沿った模式断面図、である。
 第4の実施形態は、透明管60の外縁から外側に向かって照明光GTを照射する透過型の固体照明装置である。固体照明装置は、光源部10と、透明管60と、波長変換層54と、照射部20bと、照射領域移動手段24と、を有する。
FIG. 7A is a schematic perspective view of a solid-state lighting device according to the fourth embodiment, and FIG. 7B is a schematic cross-sectional view taken along the line DD.
The fourth embodiment is a transmissive solid-state lighting device that irradiates illumination light GT from the outer edge of the transparent tube 60 toward the outside. The solid state lighting device includes the light source unit 10, the transparent tube 60, the wavelength conversion layer 54, the irradiation unit 20 b, and the irradiation region moving unit 24.

 光源部10は、励起光G1を放出する構成で、励起光G1の発生手段として、半導体発光素子などを少なくとも有している。半導体発光素子は、青紫色~青色の波長範囲の励起光G1を放出するレーザー素子や発光ダイオードなどとすることができる。 The light source unit 10 is configured to emit the excitation light G1, and has at least a semiconductor light emitting element or the like as a means for generating the excitation light G1. The semiconductor light emitting device may be a laser device or a light emitting diode that emits excitation light G1 in the blue-violet to blue wavelength range.

 波長変換層54は、透明管60の内壁60aに設けられ、励起光G1を吸収し励起光G1の波長よりも長い波長である波長変換光を放出する。また、波長変換層54は、発光スペクトルまたは、波長変換層54を介して放出される励起光の光出力に対する波長変換光の光出力の比率のうち少なくともいずれかが異なる少なくとも2つの領域を有する。波長変換層54を介して放出される励起光とは、波長変換層54に照射される励起機構のうち、波長変換層54に吸収されず、波長変換層54により透過、または、散乱される励起光を意味する。図7において、波長変換層54は第1領域54aと第2領域54bとを、透明管60の中心軸60cに沿った異なる位置に設けられるものとする。 The wavelength conversion layer 54 is provided on the inner wall 60a of the transparent tube 60, absorbs the excitation light G1, and emits wavelength conversion light having a wavelength longer than the wavelength of the excitation light G1. The wavelength conversion layer 54 has at least two regions in which at least one of the emission spectrum or the ratio of the light output of the wavelength converted light to the light output of the excitation light emitted through the wavelength conversion layer 54 is different. The excitation light emitted through the wavelength conversion layer 54 is excitation that is not absorbed by the wavelength conversion layer 54 but transmitted or scattered by the wavelength conversion layer 54 in the excitation mechanism irradiated to the wavelength conversion layer 54. Means light. In FIG. 7, the wavelength conversion layer 54 is provided with a first region 54 a and a second region 54 b at different positions along the central axis 60 c of the transparent tube 60.

 照射部20bは、波長変換層54に囲まれるように透明管60の内部空間に設けられ、照明光GTを外壁60bから透明管60の径方向へ放出する。照射領域移動手段24は、照射部20bから波長変換層54に向けて放出される励起光の照射領域の位置を移動する。照射部20bは、中心軸60cと平行方向に移動することにより、励起光は波長変換層54の異なる領域を照射する。または、透明管60を移動しても、波長変換層54への照射位置を移動することができるが、照射部20bを移動する方が構造が容易である。 The irradiation unit 20b is provided in the internal space of the transparent tube 60 so as to be surrounded by the wavelength conversion layer 54, and emits the illumination light GT from the outer wall 60b in the radial direction of the transparent tube 60. The irradiation region moving means 24 moves the position of the irradiation region of the excitation light emitted from the irradiation unit 20b toward the wavelength conversion layer 54. The irradiation unit 20b moves in a direction parallel to the central axis 60c, so that the excitation light irradiates different regions of the wavelength conversion layer 54. Alternatively, even if the transparent tube 60 is moved, the irradiation position on the wavelength conversion layer 54 can be moved, but the structure is easier if the irradiation unit 20b is moved.

 透明管60は、外径が9mm、内径が4.5mm、材質がYAGセラミックス、アルミナセラミックス、石英ガラスなどとすることができる。 The transparent tube 60 can have an outer diameter of 9 mm, an inner diameter of 4.5 mm, and a material of YAG ceramics, alumina ceramics, quartz glass, or the like.

 波長変換層54は、複数の波長変換材料が混合されていてもよい。たとえば、第1領域54aは、波長変換光の色温度が5000Kとなるように蛍光体などからなる波長変換材料配合されていてもよい。また、第2領域54bは、波長変換光の色温度が3000Kとなるように配合されていてもよい。 The wavelength conversion layer 54 may be a mixture of a plurality of wavelength conversion materials. For example, the first region 54a may be blended with a wavelength conversion material made of a phosphor or the like so that the color temperature of the wavelength converted light is 5000K. Moreover, the 2nd area | region 54b may be mix | blended so that the color temperature of wavelength conversion light may be 3000K.

 照射領域移動手段24により照射部20bの位置を移動すると、混合された照明光の色温度を3000~5000Kの範囲で変化させることができる。なお、第1領域54aと第2領域54bとを近づけて配置すると、移動距離を短くできるのでより好ましい。 When the position of the irradiation unit 20b is moved by the irradiation region moving means 24, the color temperature of the mixed illumination light can be changed in the range of 3000 to 5000K. Note that it is more preferable to dispose the first region 54a and the second region 54b close to each other because the movement distance can be shortened.

 図8(a)は第5の実施形態にかかる透過型の固体照明装置の模式斜視図、図8(b)はD-D線に沿った模式断面図、である。
 第5の実施形態において、照射部20b、20cが2つ設けられ、励起光はそれぞれから放出される。
FIG. 8A is a schematic perspective view of a transmissive solid-state lighting device according to the fifth embodiment, and FIG. 8B is a schematic cross-sectional view taken along the line DD.
In the fifth embodiment, two irradiation units 20b and 20c are provided, and excitation light is emitted from each.

 第1領域54aは、たとえば、緑色波長変換層を含む。また、第2領域54bは、赤色波長変換層を含む。照射部20aは、第1領域54aを主に照射する。照射部20bは、第2領域54bを主に照射する。第1領域54aに対する照射量と第2領域に対する照射量とは、それぞれ独立に決定することができる。このため、励起光の散乱光と、赤色光と、緑色光と、が混合された照明光GTの色温度を所望の範囲内とすることができる。この場合、発熱量の大きい、たとえば、赤色蛍光体層は、放熱板に近い側に設けるとよい。また、照射部20bからの励起光G1の光出力と、照射部20cからの励起光の光出力をそれぞれ調整することでも、照明光GTの色を可変することもできる。 The first region 54a includes, for example, a green wavelength conversion layer. The second region 54b includes a red wavelength conversion layer. The irradiation unit 20a mainly irradiates the first region 54a. The irradiation unit 20b mainly irradiates the second region 54b. The dose for the first region 54a and the dose for the second region can be determined independently. For this reason, the color temperature of the illumination light GT in which scattered light of excitation light, red light, and green light is mixed can be set within a desired range. In this case, the red phosphor layer having a large calorific value, for example, may be provided on the side close to the heat sink. Also, the color of the illumination light GT can be varied by adjusting the light output of the excitation light G1 from the irradiation unit 20b and the light output of the excitation light from the irradiation unit 20c.

 図9(a)は第6の実施形態にかかる透過型の固体照明装置の部分切断模式斜視図、図9(b)は部分切断模式断面図、である。
 本実施形態において、波長変換層54は、半導体発光素子10の側に近づくにしたがって単色光を放出する波長変換層54の厚さを大きくする。波長変換層54が厚くなるにしたがって、波長変換層54から放出される波長変換光の光出力が高くなる。
FIG. 9A is a partially cut schematic perspective view of a transmissive solid-state lighting device according to the sixth embodiment, and FIG. 9B is a partially cut schematic sectional view.
In the present embodiment, the wavelength conversion layer 54 increases the thickness of the wavelength conversion layer 54 that emits monochromatic light as it approaches the semiconductor light emitting element 10 side. As the wavelength conversion layer 54 becomes thicker, the optical output of the wavelength converted light emitted from the wavelength conversion layer 54 increases.

 一方で、波長変換層54により吸収される励起光が増加して、波長変換層54を透過する励起光は減少するので、照明光GTは、波長変換層54の発光スペクトルが支配的な発光色となる。このため、照射領域移動手段24により照射部20bの位置を波長変換層54が厚くなる方向に移動すると、照明光GTの発光色は、励起光の発光色が支配的な発光色から、波長変換層の発光色が支配的な発光色に可変することが出来る。 On the other hand, since the excitation light absorbed by the wavelength conversion layer 54 increases and the excitation light transmitted through the wavelength conversion layer 54 decreases, the illumination light GT has an emission color in which the emission spectrum of the wavelength conversion layer 54 is dominant. It becomes. For this reason, when the irradiation region moving means 24 moves the position of the irradiation unit 20b in the direction in which the wavelength conversion layer 54 becomes thicker, the emission color of the illumination light GT changes from the emission color in which the emission color of the excitation light is dominant. The emission color of the layer can be changed to the dominant emission color.

 図10(a)は第7の実施形態にかかる固体照明装置の部分切断模式斜視図、図10(b)は部分切断模式断面図、図10(c)は変形例の模式断面図、である。
 透明管60の内壁60aには、中心軸60cに沿って厚さが一定である第1領域54cと、光源に向かって厚さが増加する第2領域54dとがこの順序で積層されている。第2領域54dからの第2波長変換光は、第1領域54cを透過しなければならない。このため、第2波長変換光の波長は、第1波長変換層54cから放出される第1波長変換光の波長よりも長いことが好ましい。たとえば、第2波長変換光は赤色光、第1波長変換光は緑色光とすることができる。照射領域移動手段24により、照射部20bが第2波長変換光54dの厚さが増加する方向に移動する場合、照明光GTの色を、第1波長変換光が支配的な色から、第2波長変換光が支配的な色に変化できる。なお、波長変換層54dの厚さは、連続的でなく階段状に変化してもよい。
FIG. 10A is a partially cut schematic perspective view of the solid state lighting device according to the seventh embodiment, FIG. 10B is a partially cut schematic cross sectional view, and FIG. 10C is a schematic cross sectional view of a modification. .
On the inner wall 60a of the transparent tube 60, a first region 54c whose thickness is constant along the central axis 60c and a second region 54d whose thickness increases toward the light source are stacked in this order. The second wavelength converted light from the second region 54d must pass through the first region 54c. For this reason, it is preferable that the wavelength of the second wavelength converted light is longer than the wavelength of the first wavelength converted light emitted from the first wavelength conversion layer 54c. For example, the second wavelength converted light can be red light and the first wavelength converted light can be green light. When the irradiation unit 20b is moved in the direction in which the thickness of the second wavelength converted light 54d is increased by the irradiation region moving unit 24, the color of the illumination light GT is changed from the color dominant to the first wavelength converted light to the second. The wavelength-converted light can change to a dominant color. Note that the thickness of the wavelength conversion layer 54d may change stepwise instead of continuously.

 また、図10(c)に表すように、第1領域54aと、第2領域54bと、の境界をV溝断面状にしてもよい。波長変換層の断面積が変化するので、照明光GTの色度を変えることができる。 Further, as shown in FIG. 10C, the boundary between the first region 54a and the second region 54b may be V-groove cross-sectional. Since the cross-sectional area of the wavelength conversion layer changes, the chromaticity of the illumination light GT can be changed.

 図11(a)は第8の実施形態にかかる固体照明装置を構成する光変換部の模式斜視図、図11(b)は固体照明装置の構成を表す模式図、図11(c)は導光体の模式斜視図、である。
 固体照明装置は、光源部10と、発光部92と、照射領域移動手段24と、を有している。
FIG. 11A is a schematic perspective view of a light conversion unit constituting the solid-state lighting device according to the eighth embodiment, FIG. 11B is a schematic view showing the configuration of the solid-state lighting device, and FIG. It is a model perspective view of a light body.
The solid state lighting device includes a light source unit 10, a light emitting unit 92, and an irradiation region moving unit 24.

 発光部92は、透明管60と、複数(たとえば20)の光ファイバー80と、光ファイバーを束ねて固定する固定部材81と、先端部に照射部20bが設けられガラスなどからなる棒状の導光部20と、導光部20の保持部材82と、硫酸バリウムなどが塗布された反射ピン84と、上側固定キャップ86と、ヒートシンク88と、ストッパー88と、を有する。発光部92は、たとえば、長さが略110mm、ヒートシンク88の直径が50mm、などとすることができる。また、導光部20は、たとえば、長さが略24mm、直径が2.5mm、などとする。導光部20の先端部は、たとえば、高さが1~2mmの円錐形状の照射部20bとなって設けられている。波長変換層54の長さは、6mmなどとする。 The light emitting unit 92 includes a transparent tube 60, a plurality of (for example, 20) optical fibers 80, a fixing member 81 that bundles and fixes the optical fibers, and a rod-shaped light guide unit 20 that is provided with an irradiation unit 20b at the tip and is made of glass or the like. And a holding member 82 of the light guide 20, a reflection pin 84 coated with barium sulfate or the like, an upper fixing cap 86, a heat sink 88, and a stopper 88. For example, the light emitting unit 92 may have a length of approximately 110 mm and a heat sink 88 having a diameter of 50 mm. Moreover, the light guide part 20 shall be about 24 mm in length, 2.5 mm in diameter, etc., for example. The tip of the light guide 20 is provided as a cone-shaped irradiation part 20b having a height of 1 to 2 mm, for example. The length of the wavelength conversion layer 54 is 6 mm or the like.

 透明管60は、たとえば、YAGセラミックス(熱伝導率:11.7W/m・K)、アルミナセラミックス(熱伝導率:33.5W/m・K)、石英ガラス(熱伝導率:1.4W/m・K)などのうちから、波長変換層の発熱量に応じて適正に選択する。 The transparent tube 60 includes, for example, YAG ceramics (thermal conductivity: 11.7 W / m · K), alumina ceramics (thermal conductivity: 33.5 W / m · K), quartz glass (thermal conductivity: 1.4 W / m). m · K) and the like are appropriately selected according to the heat generation amount of the wavelength conversion layer.

 また、光ファイバー80と導光部20とが接触しない場合、光ファイバー80の出射面と導光部20の入射部との間でフレネルロスを生じる。これらの端面に反射防止処理を行うと、フレネルロスを低減できる。または、融着などにより、光ファイバー80と導光部20とを一体化してもよい。 Further, when the optical fiber 80 and the light guide unit 20 are not in contact with each other, a Fresnel loss occurs between the exit surface of the optical fiber 80 and the incident part of the light guide unit 20. When antireflection treatment is performed on these end faces, Fresnel loss can be reduced. Alternatively, the optical fiber 80 and the light guide unit 20 may be integrated by fusion or the like.

 図12(a)は第8の実施形態の固体照明装置の光変換部の模式断面図、図12(b)は透明管近傍の模式断面図、図12(c)はその応用例の模式斜視図、である。
 光ファイバーから放出された励起光は、導光部20内に導入され、実線の経路のように導光されたのち、円錐面により全反射され、破線のように照射部20bの周囲に設けられた波長変換層54を効率よく照射する。この場合、照射領域移動手段24は、照射部20bの位置を、たとえば導光部20の延在する方向に変えて照明光GTの色度を変化させることができる。円錐形状の照射部20bから反射ピン84への励起光の抜けは僅かであり、発光部92に発熱は、ほぼ波長変換層54内に限定される。半導体発光素子10は、発光部92とは離間して設けられている。このため、ヒートシンク88は発光部92の熱を放熱可能なサイズでよく小型にできる。
12A is a schematic cross-sectional view of the light conversion unit of the solid state lighting device of the eighth embodiment, FIG. 12B is a schematic cross-sectional view in the vicinity of the transparent tube, and FIG. 12C is a schematic perspective view of the application example. Figure.
The excitation light emitted from the optical fiber is introduced into the light guide 20 and guided as shown by a solid line, then totally reflected by the conical surface, and provided around the irradiation part 20b as shown by a broken line. The wavelength conversion layer 54 is efficiently irradiated. In this case, the irradiation region moving unit 24 can change the chromaticity of the illumination light GT by changing the position of the irradiation unit 20b in, for example, the direction in which the light guide unit 20 extends. Excitation light from the cone-shaped irradiation part 20b to the reflection pin 84 is slight, and heat generation in the light-emitting part 92 is substantially limited to the wavelength conversion layer 54. The semiconductor light emitting element 10 is provided apart from the light emitting unit 92. For this reason, the heat sink 88 may be small enough to have a size capable of radiating the heat of the light emitting portion 92.

 図12(c)は、第8の実施形態の固体照明装置の応用例であり、リフレクタ94をさらに設け集光することにより、車両用前照灯や街路灯などに用いることができる。 FIG. 12C shows an application example of the solid state lighting device of the eighth embodiment, and it can be used for a vehicle headlamp, a street lamp, and the like by further providing and condensing a reflector 94.

 図13(a)は第9の実施形態にかかる固体照明装置の模式斜視図、図13(b)はA-Aに沿った模式断面図、である。
 固体照明装置は、光源部10、光変換層130、方向変換部122、エネルギー変換素子である太陽電池160a、および機能素子170を有する。
FIG. 13A is a schematic perspective view of a solid-state lighting device according to the ninth embodiment, and FIG. 13B is a schematic cross-sectional view along AA.
The solid-state lighting device includes a light source unit 10, a light conversion layer 130, a direction conversion unit 122, a solar cell 160a that is an energy conversion element, and a functional element 170.

 光源部(ライトエンジン)10は、半導体発光素子12を有する。半導体発光素子12は、発光ダイオード(LED)やレーザーダイオード(LD:Laser Diode)とすることができる。光源部10からの励起光である光ビームG1を光ファイバー束100などを用いて導光すると、光源部10で生じる熱が光変換層130まで伝導しない。このため、光変換層130の近傍では温度上昇を抑制できる。 The light source unit (light engine) 10 includes a semiconductor light emitting element 12. The semiconductor light emitting element 12 can be a light emitting diode (LED) or a laser diode (LD). When the light beam G1 that is excitation light from the light source unit 10 is guided using the optical fiber bundle 100 or the like, the heat generated in the light source unit 10 is not conducted to the light conversion layer 130. For this reason, a temperature rise can be suppressed in the vicinity of the light conversion layer 130.

 また、半導体発光素子12をLDとすると、光広がり角を40度×25度などと狭くできるので、光ファイバー束100への入射効率を高めることができてより好ましい。光ファイバー束100の長さは、数メートルなどと短くてよい。 Further, when the semiconductor light emitting element 12 is an LD, the light spreading angle can be narrowed to 40 ° × 25 ° or the like, which is more preferable because the incident efficiency to the optical fiber bundle 100 can be increased. The length of the optical fiber bundle 100 may be as short as several meters.

 光源部10は、駆動回路113、116とヒートシンク(図示せず)とをさらに有することができる。本図において、半導体発光素子12は、光出力が1WなどのLDとしその数を20などとする。なお、LDの数は20に限定されない。この場合、LDの消費電力に応じてヒートシンクのサイズを決める必要がある。 The light source unit 10 may further include drive circuits 113 and 116 and a heat sink (not shown). In this figure, the semiconductor light emitting element 12 is an LD with an optical output of 1 W or the like, and the number thereof is 20 or the like. The number of LDs is not limited to 20. In this case, it is necessary to determine the size of the heat sink according to the power consumption of the LD.

 また、光源部10は、機能素子170を駆動する信号の制御に用いる光IRを放出する半導体発光素子15をさらに含む。信号の制御に用いる光IRの発光波長は、光の発光波長と同じでもよいが、照明には影響を与えない赤外光(700~1000nmの発光波長範囲)などとすることができる。信号の制御用の光IRの出力は小さくてよい。 The light source unit 10 further includes a semiconductor light emitting element 15 that emits light IR used for controlling a signal for driving the functional element 170. The emission wavelength of the light IR used for signal control may be the same as the emission wavelength of the light, but may be infrared light that does not affect illumination (emission wavelength range of 700 to 1000 nm) or the like. The output of the light IR for signal control may be small.

 なお、光ファイバー束100の一方の端部と半導体発光素子12との間にレンズL1などを設けて光ビームを集光すると光ファイバー束100への入射効率をより高めることができる。LDの数が20の場合、光ファイバー束100はそれぞれの導光路として光ファイバー101~120を含むことができる。それぞれの光ファイバーは、プラスチック光ファイバーなどとすることができる。なお、照明光GTに用いる半導体発光素子12の発光波長は、青紫色(405nm)~赤色光(700nm)などの範囲とする。 In addition, if a lens L1 or the like is provided between one end of the optical fiber bundle 100 and the semiconductor light emitting element 12 to condense the light beam, the incident efficiency to the optical fiber bundle 100 can be further increased. When the number of LDs is 20, the optical fiber bundle 100 can include optical fibers 101 to 120 as respective light guide paths. Each optical fiber can be a plastic optical fiber or the like. Note that the emission wavelength of the semiconductor light emitting element 12 used for the illumination light GT is in the range of blue-violet (405 nm) to red light (700 nm).

 光変換層130は、半導体発光素子12からの光ビームを拡散して散乱光に変換する光拡散剤、または光ビームG1を吸収して波長変換光に転換する波長変換材を有する。光変換層130は、分割された複数の領域を含み、それぞれの領域から放出された光は、発光スペクトルが異なる。 The light conversion layer 130 has a light diffusing agent that diffuses the light beam from the semiconductor light emitting element 12 and converts it into scattered light, or a wavelength conversion material that absorbs the light beam G1 and converts it into wavelength converted light. The light conversion layer 130 includes a plurality of divided regions, and light emitted from each region has a different emission spectrum.

 光拡散層には、拡散透過率の高い材料を含む光拡散粒子が樹脂層などに分散して配置される。このため、粒子による散乱が増加しコヒーレンスを低下することができる。なお、光散乱粒子は、ポリメタクリル酸メチルや炭酸カルシウムなどとすることができる。 In the light diffusing layer, light diffusing particles containing a material having a high diffusion transmittance are arranged dispersed in a resin layer or the like. For this reason, scattering by particles increases and coherence can be reduced. The light scattering particles can be polymethyl methacrylate or calcium carbonate.

 また、半導体発光素子12からの青紫色光(発光波長:405nm)~青色光(発光波長:490nm)である光ビームG1を波長変換材に吸収させて波長変換光を放出させる場合、光変換層130は、緑色YAG(Yttrium-Aluminum-Garnet)蛍光体、黄色YAG蛍光体、赤色YAG蛍光体などを含む波長変換層とすることができる。 Further, when the wavelength conversion material is made to absorb the light beam G1 which is blue-violet light (emission wavelength: 405 nm) to blue light (emission wavelength: 490 nm) from the semiconductor light emitting element 12 to emit wavelength conversion light, a light conversion layer. Reference numeral 130 can be a wavelength conversion layer including a green YAG (Yttrium-Aluminum-Garnet) phosphor, a yellow YAG phosphor, a red YAG phosphor, and the like.

 また、固体照明装置は、高熱伝導率を有する金属やセラミックスからなる熱伝導部150を有することができる。熱伝導部150の第1の面150aには、たとえば、凹部150bが設けられる。凹部150bは、第1の面150aから後退し、深さ方向に向かって断面の幅が狭くなる内壁150cを有する。また、凹部150bの中心軸150eの周りには凹部150bと連続した貫通孔150dがさらに設けられる。 Also, the solid state lighting device can have a heat conducting portion 150 made of a metal or ceramic having high thermal conductivity. For example, the first surface 150a of the heat conducting unit 150 is provided with a recess 150b. The recess 150b has an inner wall 150c that recedes from the first surface 150a and whose cross-sectional width becomes narrower in the depth direction. Further, a through hole 150d continuous with the recess 150b is further provided around the central axis 150e of the recess 150b.

 図13(b)において、熱伝導部150、内壁150cに設けられた凹面反射層140および凹面反射層140に設けられた光変換層130は、ランプ部200を構成する。凹部150bの上端部は、略8mmの径などとすることができる。 13B, the heat conducting portion 150, the concave reflection layer 140 provided on the inner wall 150c, and the light conversion layer 130 provided on the concave reflection layer 140 constitute the lamp portion 200. The upper end of the recess 150b can have a diameter of approximately 8 mm.

 また、固体照明装置は、凹部150bを覆うように拡散板145を有することができる。拡散板145は光拡散剤などを含むことができ、異なる色温度のランプ部200内の微妙な位置の相違を目立たなくして、一様な発光面とすることができる。また、拡散板145は、緑色波長変換層などを含むことができる。 Also, the solid state lighting device can have a diffusion plate 145 so as to cover the recess 150b. The diffusing plate 145 can include a light diffusing agent and the like, and a uniform light emitting surface can be obtained without making a subtle difference in position in the lamp unit 200 having different color temperatures inconspicuous. Further, the diffusion plate 145 may include a green wavelength conversion layer.

 方向変換部122は、貫通孔150dを貫通するように設けられ、一方の端部が光ビームG1の入射部となり、他方の端部が照射部122aとなる。他方の端部を斜め研磨すると、導光された光ビームG1の狭い広がり角を維持しつつ、たとえば、垂直面内において90度出射方向を変え、光変換層130を照射できる。また、照射方向は水平面内で360度変化可能であることが好ましい。方向変換部122は、外径2mmの円筒におさまるサイズなどとする。 The direction changing part 122 is provided so as to penetrate the through-hole 150d, and one end becomes an incident part of the light beam G1, and the other end becomes an irradiation part 122a. When the other end is obliquely polished, for example, the light conversion layer 130 can be irradiated by changing the emission direction by 90 degrees in the vertical plane while maintaining the narrow divergence angle of the guided light beam G1. Moreover, it is preferable that an irradiation direction can change 360 degree | times within a horizontal surface. The direction conversion unit 122 has a size that fits in a cylinder with an outer diameter of 2 mm.

 また、凹面反射層140を高熱伝導率を有する金属とすると、光反射率を90%以上に保ちつつ波長変換材における波長変換ロスによって生じた熱を熱伝導部150を介して外部に逃すことが容易となる。 Further, when the concave reflection layer 140 is made of a metal having high thermal conductivity, heat generated by wavelength conversion loss in the wavelength conversion material can be released to the outside through the heat conducting unit 150 while maintaining the light reflectance at 90% or more. It becomes easy.

 第9の実施形態ではエネルギー変換素子は、太陽電池160aのような光-電気変換素子とする。太陽電池160aは、アレイ状に配列された半導体pn接合などからなり、光照射により光起電力を生じる。 In the ninth embodiment, the energy conversion element is a photoelectric conversion element such as the solar cell 160a. The solar cell 160a is composed of semiconductor pn junctions arranged in an array, and generates photovoltaic power by light irradiation.

 太陽電池160aの光起電力による電気エネルギーを機能素子170の駆動に利用する場合、光信号IRを駆動信号用の光ファイバー121を介してスイッチ素子191へ伝送する。光ファイバー121の遠端開口部に配置したフォトダイオード180に電流が流れると、TIA(Trans-Impedance Amplifier)190への入力信号となる。たとえば、TIA190の出力信号Voutをトリガーとしスイッチ素子191がオンとなり、太陽電池160aの光起電力が機能素子170へ供給される。なお、光起電力により発生した電気エネルギーは、蓄電池193などに蓄えることができる。 When the electric energy generated by the photovoltaic power of the solar cell 160 a is used for driving the functional element 170, the optical signal IR is transmitted to the switch element 191 via the optical fiber 121 for driving signal. When a current flows through the photodiode 180 disposed at the far end opening of the optical fiber 121, an input signal to a TIA (Trans-Impedance Amplifier) 190 is obtained. For example, the switch element 191 is turned on using the output signal Vout of the TIA 190 as a trigger, and the photovoltaic power of the solar cell 160 a is supplied to the functional element 170. Note that the electrical energy generated by the photovoltaic power can be stored in the storage battery 193 or the like.

 この結果、機能素子170を駆動可能となり、ランプ部200から放出された照明光GTの色度や色温度などを変化することができる。機能素子170は、たとえば、圧電素子のような電気-機械素子とすることができる。  As a result, the functional element 170 can be driven, and the chromaticity and color temperature of the illumination light GT emitted from the lamp unit 200 can be changed. The functional element 170 can be, for example, an electro-mechanical element such as a piezoelectric element. *

 なお、太陽電池160aは、ランプ部200の凹部150bおよび貫通孔150dの内部において、光変換層130が設けられておらず常に光ビームG1の散乱光の一部や照明光の一部が照射される領域に設けるとよい。特に、凹面反射層140により反射されにくく光取り出し効率に寄与しない無駄な光が照射される領域141に設けることが好ましい。すなわち、図13(b)のように、貫通孔150dの内壁などに設けることが好ましい。貫通孔150dの内部は、方向変換部122を可動させる空間が必要である。すなわち、この空間や方向変換部122自体を介して貫通孔150dに戻る迷光を利用するとよい。 Note that the solar cell 160a is not provided with the light conversion layer 130 inside the recess 150b and the through hole 150d of the lamp unit 200, and is always irradiated with a part of the scattered light of the light beam G1 and a part of the illumination light. It is good to provide in the area. In particular, it is preferably provided in the region 141 where unnecessary light that does not contribute to the light extraction efficiency and is not easily reflected by the concave reflection layer 140 is irradiated. That is, as shown in FIG. 13B, it is preferably provided on the inner wall of the through hole 150d. A space for moving the direction changing portion 122 is required inside the through hole 150d. That is, stray light returning to the through hole 150d through this space or the direction changing part 122 itself may be used.

 光変換層130が蛍光体からなる場合、凹面反射層140の表面に設けられた蛍光体は発光スペクトルのピーク波長が異なる複数の蛍光体が混合されたものとすることができる。たとえば、図13において、光変換層130の第1領域131は、第1の波長変換材(たとえば緑色蛍光体)と第2の波長変換材(たとえば赤色蛍光体)とを第1の混合比率で含む。また、光変換層130の第2領域132は、第1の波長変換材(たとえば緑色蛍光体)と第2の波長変換材(たとえば赤色蛍光体)とを第1の混合比率とは異なる第2の混合比率で含む。また、光変換層130の第3領域133は、第1の波長変換材(たとえば緑色蛍光体)と第2の波長変換材(たとえば赤色蛍光体)とを第1の混合比率および第2の混合比率とは異なる第3の混合比率で含む。第1領域131を第1の面150aの側に、第3領域を貫通孔150dの側に設ける。 When the light conversion layer 130 is made of a phosphor, the phosphor provided on the surface of the concave reflection layer 140 may be a mixture of a plurality of phosphors having different emission spectrum peak wavelengths. For example, in FIG. 13, the first region 131 of the light conversion layer 130 includes a first wavelength conversion material (for example, a green phosphor) and a second wavelength conversion material (for example, a red phosphor) at a first mixing ratio. Including. In addition, the second region 132 of the light conversion layer 130 is a second region in which the first wavelength conversion material (for example, green phosphor) and the second wavelength conversion material (for example, red phosphor) are different from the first mixing ratio. It is included in the mixing ratio. In addition, the third region 133 of the light conversion layer 130 includes a first wavelength conversion material (for example, a green phosphor) and a second wavelength conversion material (for example, a red phosphor) in a first mixing ratio and a second mixing ratio. A third mixing ratio different from the ratio is included. The first region 131 is provided on the first surface 150a side, and the third region is provided on the through hole 150d side.

 このような光変換層130の第1~第3の領域131、132、133を同心円状に設けることができる。また、たとえば、図13(a)において、貫通孔150dに近い側には色温度が高く、遠ざかるに従って色温度が低くなるように連続的に変化させてもよい。中心軸150eに沿って光ビームG1の照射位置を変えると、波長変換光と青色散乱光との合成である照明光GTの色度をチューニング(変化)することができる。 Such first to third regions 131, 132, 133 of the light conversion layer 130 can be provided concentrically. For example, in FIG. 13A, the color temperature may be continuously changed so that the color temperature is high on the side close to the through-hole 150d and the color temperature is lowered as the distance is increased. When the irradiation position of the light beam G1 is changed along the central axis 150e, the chromaticity of the illumination light GT, which is a combination of the wavelength converted light and the blue scattered light, can be tuned (changed).

 図14(a)は機能素子のオフ状態の作用を説明する模式斜視図、図14(b)はA-A線に沿った模式断面図、図14(c)は機能素子のオン状態の作用を説明する模式斜視図、図14(d)はA-A線に沿った模式断面図、である。
 方向変換部122は貫通孔150dを貫通するように設けられている。方向変換部122の照射部122aは斜め研磨面を含むものとし、光ビームG1は研磨面で反射されたのち光変換層130を照射する。機能素子170のオフ状態において、高い色温度である青みを帯びた照明光が放出される。もし照明光GTの色温度を低くする場合、図14(c)、(d)に表すように、太陽電池160aの光起電力が圧電素子のような機能素子170をオン状態とし、方向変換部122の照射部122aを上方に移動する。この結果、色温度が低い照明光GTを得ることができる。なお、図14(a)、(c)では、拡散板145を配設する前の状態を表す。
FIG. 14A is a schematic perspective view for explaining the operation of the functional element in the OFF state, FIG. 14B is a schematic sectional view taken along the line AA, and FIG. 14C is the operation of the functional element in the on state. FIG. 14D is a schematic cross-sectional view taken along the line AA.
The direction changing part 122 is provided so as to penetrate the through hole 150d. The irradiation unit 122a of the direction conversion unit 122 includes an oblique polishing surface, and the light beam G1 irradiates the light conversion layer 130 after being reflected by the polishing surface. In the off state of the functional element 170, bluish illumination light having a high color temperature is emitted. If the color temperature of the illumination light GT is lowered, as shown in FIGS. 14C and 14D, the photovoltaic device 160a turns on the functional element 170 such as a piezoelectric element to turn on the direction changing unit. The irradiation unit 122a of 122 is moved upward. As a result, illumination light GT having a low color temperature can be obtained. 14A and 14C show a state before the diffusion plate 145 is provided.

 また、圧電素子を用いて、方向変換部122を微小振動させれば、スペックルノイズを低減することができる。このために、照明光GTのコヒーレンス性を低下させ、照明光GTの安全性を高めることができる。圧電材料としては、水晶、ベルリナイト、電気石などを用いることができる。 Also, speckle noise can be reduced if the direction changing unit 122 is vibrated minutely using a piezoelectric element. For this reason, the coherence property of the illumination light GT can be reduced, and the safety of the illumination light GT can be increased. As the piezoelectric material, quartz, berlinite, tourmaline, or the like can be used.

 第9の実施形態では、電気配線によりランプ部200へ電気エネルギーを供給することなく、光伝送系のみで機能素子170を駆動し、照明光GTの色度や色温度などを制御できる。 In the ninth embodiment, it is possible to control the chromaticity, color temperature, and the like of the illumination light GT by driving the functional element 170 only by the optical transmission system without supplying electric energy to the lamp unit 200 by the electric wiring.

 図15(a)は第10の実施形態にかかる固体照明装置の模式斜視図、図15(b)はA-A線に沿った模式断面図、である。
 第10の実施形態では、波長変換材を含む光変換層130は、熱伝導部150の傾斜した凹部150bの中心軸150eの周りの異なる位置に扇状に分割された第1領域134、第2領域135、および第3領域136を有する。
FIG. 15A is a schematic perspective view of a solid-state lighting device according to the tenth embodiment, and FIG. 15B is a schematic cross-sectional view along the line AA.
In the tenth embodiment, the light conversion layer 130 including the wavelength conversion material includes a first region 134 and a second region that are fan-divided into different positions around the central axis 150e of the inclined recess 150b of the heat conducting unit 150. 135 and a third region 136.

 光変換層130の第1領域134は、第1の波長変換材(たとえば緑色蛍光体)と第2の波長変換材(たとえば赤色蛍光体)とを第1の混合比率で含む。また、光変換層130の第2領域135は、第1の波長変換材(たとえば緑色蛍光体)と第2の波長変換材(たとえば赤色蛍光体)とを第1の混合比率とは異なる第2の混合比率で含む。また、光変換層130の第3領域136は、第1の波長変換材(たとえば緑色蛍光体)と第2の波長変換材(たとえば赤色蛍光体)とを第1の混合比率および第2の混合比率とは異なる第3の混合比率で含む。 The first region 134 of the light conversion layer 130 includes a first wavelength conversion material (for example, a green phosphor) and a second wavelength conversion material (for example, a red phosphor) at a first mixing ratio. In addition, the second region 135 of the light conversion layer 130 is a second region in which the first wavelength conversion material (for example, green phosphor) and the second wavelength conversion material (for example, red phosphor) are different from the first mixing ratio. It is included in the mixing ratio. In addition, the third region 136 of the light conversion layer 130 is formed by combining a first wavelength conversion material (for example, a green phosphor) and a second wavelength conversion material (for example, a red phosphor) with a first mixing ratio and a second mixing ratio. A third mixing ratio different from the ratio is included.

 光変換層の第1~第3領域134、135、136は、凹部150bの中心軸150eの周りに扇形に配置することができる。第1~第3領域134、135、136は、照射された光ビームG1を吸収し波長変換光と、光変換層130に吸収されずに光ビームG1から変換された散乱光と放出することができる。この結果、色度や色温度が異なった照明光をそれぞれの領域から放出できる。図15(a)、(b)において、第1~第3領域134、135、136は中心軸150eに関して、略対称となる位置のペアで設けられているが、本発明はこれに限定されない。 The first to third regions 134, 135, 136 of the light conversion layer can be arranged in a fan shape around the central axis 150e of the recess 150b. The first to third regions 134, 135, and 136 can absorb the irradiated light beam G1 and emit the wavelength-converted light and the scattered light converted from the light beam G1 without being absorbed by the light conversion layer 130. it can. As a result, illumination light having different chromaticity and color temperature can be emitted from each region. 15A and 15B, the first to third regions 134, 135, and 136 are provided as a pair of positions that are substantially symmetrical with respect to the central axis 150e, but the present invention is not limited to this.

 図16(a)は第10の実施形態の作用を説明する模式斜視図、図16(b)は第1領域の照射状態の模式斜視図、図16(c)は第2領域の照射状態の模式斜視図、図16(d)は第3領域の照射状態の模式斜視図、である。
 図16(a)のように、貫通孔150dの内部に配設された方向変換部122は、凹部150bの中心軸150eの周囲に回転可能である。すなわち、機能素子170はモーターなどの回転機構を有しており、方向変換部122を中心軸150eの周囲で、所定の角度に回転させることができるものとする。
FIG. 16A is a schematic perspective view for explaining the operation of the tenth embodiment, FIG. 16B is a schematic perspective view of the irradiation state of the first region, and FIG. 16C is a irradiation state of the second region. FIG. 16D is a schematic perspective view of the irradiation state of the third region.
As shown in FIG. 16A, the direction changing portion 122 disposed inside the through hole 150d is rotatable around the central axis 150e of the recess 150b. That is, the functional element 170 has a rotation mechanism such as a motor, and can rotate the direction changing unit 122 at a predetermined angle around the central axis 150e.

 図16(b)のように、方向変換部122の出射部122aは、光変換層130の第1領域134に向けて光ビームG1を照射し、第1領域134の波長変換材の組成に応じた波長変換光と波長変換材により多重反射された青色散乱光とが混合された照明光GTを放出する。 As illustrated in FIG. 16B, the emission unit 122 a of the direction conversion unit 122 emits the light beam G <b> 1 toward the first region 134 of the light conversion layer 130, and depends on the composition of the wavelength conversion material in the first region 134. The illumination light GT in which the wavelength-converted light and the blue scattered light multiple-reflected by the wavelength conversion material are mixed is emitted.

 この照明光GTの色度または色温度が所望範囲ではない場合、たとえば、図16(c)のように、方向変換部122を回転して、光ビームG1を第2領域135に向けて照射する。この照明光GTの色度や色温度が所望範囲ではない場合、図16(d)のように、方向変換部122をさらに回転し、光ビームG1を第3領域136に向けて照射する。このように、電源とランプ部200とを電気的に直接接続することなく、照明光GTの色度や色温度を制御することができる。 When the chromaticity or color temperature of the illumination light GT is not in the desired range, for example, as shown in FIG. 16C, the direction changing unit 122 is rotated to irradiate the second region 135 with the light beam G1. . When the chromaticity and color temperature of the illumination light GT are not in the desired ranges, the direction changing unit 122 is further rotated and the light beam G1 is emitted toward the third region 136 as shown in FIG. Thus, the chromaticity and color temperature of the illumination light GT can be controlled without directly connecting the power source and the lamp unit 200 directly.

 図17は、第11の実施形態の模式斜視図である。
 光変換層130は、光拡散剤を含む第1領域137、赤色波長変換材を含む第2領域138および緑色波長変換材を含む第3領域139とすることができる。第1領域137に向けて青色LD光ビームを照射すると光散乱剤による青色散乱光を単色の照明光GTとして放出できる。第2領域138に向けて青色LD光ビームを照射すると赤色波長変換光を単色の照明光GTとして放出できる。また、第3領域139に向けて青色LD光ビームを照射すると単色の緑色波長変換光を照明光GTとして放出できる。このように、第1~第3の領域137、138、139からの照明光の発光スペクトルは異なっている。
FIG. 17 is a schematic perspective view of the eleventh embodiment.
The light conversion layer 130 may be a first region 137 containing a light diffusing agent, a second region 138 containing a red wavelength conversion material, and a third region 139 containing a green wavelength conversion material. When the blue LD light beam is irradiated toward the first region 137, blue scattered light by the light scattering agent can be emitted as monochromatic illumination light GT. When the blue LD light beam is irradiated toward the second region 138, red wavelength converted light can be emitted as monochromatic illumination light GT. Further, when the blue LD light beam is irradiated toward the third region 139, monochromatic green wavelength converted light can be emitted as illumination light GT. Thus, the emission spectra of the illumination light from the first to third regions 137, 138, 139 are different.

 また、たとえば、光変換層130は、黄色波長変換材を含む第2領域138および第3領域139とすることができる。黄色蛍光体の含有量などを変えることにより第2領域138の黄色光強度と第3領域139の黄色光強度とを異なるようにすると、色度の異なる白色光を得ることができる。また、光変換層130は、光散乱剤を黄色波長変換材と共に含んでいてもよい。 Also, for example, the light conversion layer 130 can be a second region 138 and a third region 139 containing a yellow wavelength conversion material. When the yellow light intensity of the second region 138 and the yellow light intensity of the third region 139 are made different by changing the content of the yellow phosphor, etc., white light with different chromaticities can be obtained. Further, the light conversion layer 130 may contain a light scattering agent together with a yellow wavelength conversion material.

 図18(a)は第11の実施形態の固体照明装置の第1状態における作用を説明する模式断面図、図18(b)はその第2状態における作用を説明する模式断面図、である。
 第11の実施形態では、エネルギー変換素子は、ゼーベック効果素子160bとする。ゼーベック効果は、異なる金属または半導体に温度差を設けると電圧が発生する効果である。なお、ゼーベック効果とペルチェ効果とは可逆である。ゼーベック効果素子160bは、たとえば、光変換層130と熱伝導部150の内壁150cとの間に設けられる。このようにすると、ゼーベック効果素子160bの一方の面は光変換層(高温側)130に接し、他方の面は熱伝導部150の内壁(低温側)150cに接する。温度により生じる起電力により、機能素子170を機械的に駆動することができる。
FIG. 18A is a schematic cross-sectional view for explaining the action in the first state of the solid state lighting device of the eleventh embodiment, and FIG. 18B is a schematic cross-sectional view for explaining the action in the second state.
In the eleventh embodiment, the energy conversion element is the Seebeck effect element 160b. The Seebeck effect is an effect in which a voltage is generated when a temperature difference is provided between different metals or semiconductors. The Seebeck effect and the Peltier effect are reversible. The Seebeck effect element 160b is provided between the light conversion layer 130 and the inner wall 150c of the heat conducting unit 150, for example. In this way, one surface of the Seebeck effect element 160b is in contact with the light conversion layer (high temperature side) 130, and the other surface is in contact with the inner wall (low temperature side) 150c of the heat conducting unit 150. The functional element 170 can be mechanically driven by an electromotive force generated by temperature.

 また、機能素子170は、たとえば、反射角を変化可能な微小なMEMS(Micro Electro Mechanical Systems)ミラー171aであるものとする。図18(a)の第1状態における入射角よりも大きくなるように第2状態の微小ミラーの角度を変化すると、反射された光ビームは、第1状態の光変換層の照射位置よりも上方の位置を照射できる。このため、照明光GTの色度や色温度を制御できる。MEMSミラー171aのサイズは微小なので、電力消費量は小さくてよく光エネルギーも小さくてよい。  The functional element 170 is, for example, a micro MEMS (Micro Electro Mechanical Systems) mirror 171a that can change the reflection angle. When the angle of the micromirror in the second state is changed so as to be larger than the incident angle in the first state of FIG. 18A, the reflected light beam is above the irradiation position of the light conversion layer in the first state. Can be irradiated. For this reason, the chromaticity and color temperature of the illumination light GT can be controlled. Since the size of the MEMS mirror 171a is very small, power consumption may be small and light energy may be small. *

 また、機能素子170は、回転移動や直線移動をするものに限定されない。たとえば、光路を変化して照射位置を変える光スイッチなどとしてもよい。 Further, the functional element 170 is not limited to one that performs rotational movement or linear movement. For example, an optical switch that changes the irradiation position by changing the optical path may be used.

 第1~第11の実施形態によれば、放熱が容易で、色度や色温度の調整が容易な固体照明装置が提供される。このような固体照明装置は、舞台照明、スポット照明、車両用前照灯などに広く用いることができる。 According to the first to eleventh embodiments, it is possible to provide a solid state lighting device that can easily dissipate heat and can easily adjust chromaticity and color temperature. Such a solid state lighting device can be widely used for stage lighting, spot lighting, vehicle headlamps, and the like.

 さらに、第9~第11の実施形態の固体照明装置によれば、ランプ部を電源に接続すること無しに、照明光GTの色度や色温度の制御が可能である。また、ランプ部は、固体発光素子を有していないので、小型・軽量化が容易となる。 Furthermore, according to the solid state lighting devices of the ninth to eleventh embodiments, the chromaticity and color temperature of the illumination light GT can be controlled without connecting the lamp unit to the power source. Moreover, since the lamp part does not have a solid light emitting element, it is easy to reduce the size and weight.

 本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。 Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

Claims (20)

 半導体発光素子を有し、励起光を放出する光源部と、
 前記励起光が導入される入射部と、前記入射部に導入された前記励起光を放出する照射部と、を有する導光部と、
 前記照射部から放出された前記励起光が照射される波長変換層であって、前記励起光を吸収し前記励起光の波長よりも長い波長を有する第1波長変換光を放出する第1領域と、前記励起光を吸収し前記励起光の波長よりも長い波長を有する第2波長変換光を放出する第2領域と、を有し、前記第1波長変換光と前記第2波長変換光とは発光スペクトルが異なるか、または前記第1領域を介して放出される前記励起光の光出力に対する前記第1波長変換光の光出力の比率と前記第2領域を介して放出される前記励起光の光出力に対する前記第2波長変換光の光出力の比率とが異なる、波長変換層と、
 前記照射部から放出される前記励起光の前記波長変換層の表面における照射位置を変化させる照射領域移動手段と、
 を備えた固体照明装置。
A light source unit having a semiconductor light emitting element and emitting excitation light;
A light guide unit having an incident part into which the excitation light is introduced, and an irradiation part that emits the excitation light introduced into the incident part;
A wavelength conversion layer to which the excitation light emitted from the irradiation unit is irradiated, wherein the first region absorbs the excitation light and emits first wavelength conversion light having a wavelength longer than the wavelength of the excitation light; A second region that absorbs the excitation light and emits second wavelength converted light having a wavelength longer than the wavelength of the excitation light, wherein the first wavelength converted light and the second wavelength converted light are The emission spectrum is different or the ratio of the optical output of the first wavelength converted light to the optical output of the excitation light emitted through the first region and the excitation light emitted through the second region A wavelength conversion layer having a different ratio of the light output of the second wavelength converted light to the light output;
An irradiation region moving means for changing an irradiation position on the surface of the wavelength conversion layer of the excitation light emitted from the irradiation unit;
A solid state lighting device.
 第1の面から後退した凹部を有し、前記凹部の中心軸の周囲に設けられ前記第1の面に向かって拡幅する内壁を有する熱伝導部をさらに備え、
 前記第1領域および前記第2領域は、前記中心軸の周りの円周方向に沿った前記内壁上の異なる位置にそれぞれ配置され、 
 前記熱伝導部および前記照射部のうちの少なくともいずれかは、前記中心軸の周りに回転する請求項1記載の固体照明装置。
A heat conduction portion having a recess recessed from the first surface, and having an inner wall provided around the central axis of the recess and widened toward the first surface;
The first region and the second region are respectively disposed at different positions on the inner wall along a circumferential direction around the central axis;
The solid-state lighting device according to claim 1, wherein at least one of the heat conducting unit and the irradiation unit rotates around the central axis.
 第1の面から後退した凹部を有し、前記凹部の中心軸の周囲に設けられ前記第1の面に向かって拡幅する内壁を有する熱伝導部をさらに備え、
 前記第1領域および前記第2領域は、前記中心軸に沿った異なる位置において前記内壁上にそれぞれ配置され、 
 前記熱伝導部および前記照射部のうちの少なくともいずれかは、前記中心軸に沿って移動する請求項1記載の固体照明装置。
A heat conduction portion having a recess recessed from the first surface, and having an inner wall provided around the central axis of the recess and widened toward the first surface;
The first region and the second region are respectively disposed on the inner wall at different positions along the central axis;
The solid-state lighting device according to claim 1, wherein at least one of the heat conducting unit and the irradiation unit moves along the central axis.
 前記凹部を覆い光拡散層を含むカバー部をさらに備えた請求項2記載の固体照明装置。 The solid state lighting device according to claim 2, further comprising a cover portion that covers the concave portion and includes a light diffusion layer.  前記カバー部は、波長変換層をさらに含む請求項4記載の固体照明装置。 The solid state lighting device according to claim 4, wherein the cover portion further includes a wavelength conversion layer.  前記内壁に設けられ、保持板と前記保持板の表面に設けられた反射層とを含む基板をさらに備え、
 前記波長変換層は、前記反射層を覆うように前記第1の面の側に設けられるか、または前記反射層とは反対の側の前記保持板の側かつ前記第1の面の側に設けられた請求項2記載の固体照明装置。  
A substrate provided on the inner wall, further comprising a holding plate and a reflective layer provided on a surface of the holding plate;
The wavelength conversion layer is provided on the first surface side so as to cover the reflective layer, or provided on the holding plate side opposite to the reflective layer and on the first surface side. The solid-state lighting device according to claim 2.
 中心軸を有する透明管をさらに備え、
 前記第1領域と前記第2領域とは、透明管の内壁を覆うようにかつ前記中心軸に沿ってそれぞれ設けられ、
 前記透明管および前記照射部のうちの少なくともいずれかは、前記中心軸に平行方向に移動する請求項1記載の固体照明装置。
Further comprising a transparent tube having a central axis;
The first region and the second region are respectively provided so as to cover the inner wall of the transparent tube and along the central axis,
The solid state lighting device according to claim 1, wherein at least one of the transparent tube and the irradiation unit moves in a direction parallel to the central axis.
 前記第1領域と前記第2領域とは、前記中心軸に沿った異なる位置に隣接して配置された請求項7記載の固体照明装置。 The solid state lighting device according to claim 7, wherein the first region and the second region are disposed adjacent to different positions along the central axis.  前記第1領域は、前記内壁を覆い、
 前記第2領域は、前記第1領域を覆う請求項7記載の固体照明装置。
The first region covers the inner wall,
The solid state lighting device according to claim 7, wherein the second region covers the first region.
 前記第1領域および前記第2領域のうちの少なくともいずれかは、前記中心軸に沿って厚さが漸増する請求項9記載の固体照明装置。 10. The solid state lighting device according to claim 9, wherein the thickness of at least one of the first region and the second region gradually increases along the central axis.  前記照射部は、前記励起光を導光する導光体の一方の端部であるか、または空間伝搬された前記励起光を折り曲げるミラーである請求項1記載の固体照明装置。 The solid-state lighting device according to claim 1, wherein the irradiation unit is one end of a light guide that guides the excitation light, or a mirror that bends the excitation light that has been spatially propagated.  半導体発光素子を有する光源部と、
 前記半導体発光素子からの励起光を吸収して波長変換光に変換する波長変換材を含み、発光スペクトルが異なる照明光をそれぞれ放出する2つの領域を有する光変換層と、
 前記励起光が導入される入射部と前記励起光を前記光変換層に向けて照射する照射部とを有する方向変換部と、
 光または熱を電気に変換するエネルギー変換素子と、
 前記エネルギー変換素子により発生した電気エネルギーを用いて、前記方向変換部からの照射方向を前記第1領域と前記第2領域との間で変化させる機能素子と、
 を備えた固体照明装置。
A light source unit having a semiconductor light emitting element;
A light conversion layer including a wavelength conversion material that absorbs excitation light from the semiconductor light-emitting element and converts it into wavelength-converted light, and has two regions that each emit illumination light having different emission spectra;
A direction changing portion having an incident portion into which the excitation light is introduced and an irradiation portion that irradiates the excitation light toward the light conversion layer;
An energy conversion element that converts light or heat into electricity;
A functional element that changes the irradiation direction from the direction changing portion between the first region and the second region using electrical energy generated by the energy conversion device;
A solid state lighting device.
 前記光変換層の第1領域は、第1の波長変換材と第2の波長変換材とを第1の混合比率で含み、第1の波長変換光と前記第1領域に吸収されずに前記励起光から変換された散乱光とを放出し、
 前記光変換層の第2領域は、前記第1の波長変換材と前記第2の波長変換材とを第1の混合比率とは異なる第2の混合比率で含み、第2の波長変換光と前記第2領域に吸収されずに前記励起光から変換された散乱光とを放出し、
 前記照明光の色度または色温度を変化可能な請求項12記載の固体照明装置。
The first region of the light conversion layer includes a first wavelength conversion material and a second wavelength conversion material at a first mixing ratio, and is not absorbed by the first wavelength conversion light and the first region. Emit scattered light converted from excitation light,
The second region of the light conversion layer includes the first wavelength conversion material and the second wavelength conversion material at a second mixing ratio different from the first mixing ratio, and the second wavelength conversion light and Emitting scattered light converted from the excitation light without being absorbed by the second region,
The solid-state lighting device according to claim 12, wherein the chromaticity or color temperature of the illumination light can be changed.
 前記光変換層の第1領域は、第1の波長変換材を含み、第1の波長変換光と前記第1領域に吸収されずに前記励起光から変換された散乱光とを放出し、
 前記光変換層の第2領域は、前記第1の波長変換材を含み、前記第1の波長変換光の光出力とは異なる光出力を有する第2の波長変換光と前記第2領域に吸収されずに前記励起光から変換された散乱光とを放出し、
 前記照明光の色度または色温度を変化可能な請求項12記載の固体照明装置。
The first region of the light conversion layer includes a first wavelength conversion material, and emits first wavelength converted light and scattered light converted from the excitation light without being absorbed by the first region,
The second region of the light conversion layer includes the first wavelength conversion material, and absorbs the second wavelength converted light having a light output different from the light output of the first wavelength converted light and the second region. Without being released from the scattered light converted from the excitation light,
The solid-state lighting device according to claim 12, wherein the chromaticity or color temperature of the illumination light can be changed.
 前記光変換層の第1領域は、第1の波長変換材を含み、第1の波長変換光と前記第1の波長変換材に吸収されずに前記励起光から変換された散乱光とを放出し、
 前記光変換層の第2領域は、光拡散剤を有し、前記励起光から変換された散乱光を放出し、
 前記照明光の色度を変化可能な請求項12記載の固体照明装置。 
The first region of the light conversion layer includes a first wavelength conversion material, and emits first wavelength conversion light and scattered light converted from the excitation light without being absorbed by the first wavelength conversion material. And
The second region of the light conversion layer has a light diffusing agent, emits scattered light converted from the excitation light,
The solid state lighting device according to claim 12, wherein the chromaticity of the illumination light can be changed.
 第1の面、前記第1の面から後退した凹部、および前記凹部の底部と連続し前記熱伝導部を貫通する貫通穴を有する熱伝導部と、
 前記凹部の内壁と前記光変換層との間に設けられた凹面反射層と、
をさらに備え、
 前記方向変換部は、前記貫通孔を貫通する請求項12記載の固体照明装置。
A first surface, a recess recessed from the first surface, and a heat conduction portion having a through hole that is continuous with the bottom of the recess and penetrates the heat conduction portion;
A concave reflection layer provided between the inner wall of the recess and the light conversion layer;
Further comprising
The solid-state lighting device according to claim 12, wherein the direction changing portion passes through the through hole.
 前記光変換層は、前記第1の面の側に前記前記第1領域を有し、前記底部の側に前記第2領域を有する請求項16記載の固体照明装置。 The solid-state lighting device according to claim 16, wherein the light conversion layer has the first region on the first surface side and the second region on the bottom side.  前記光変換層は、前記凹部の中心軸の周りの異なる位置に前記第1領域および前記第2領域とをそれぞれ有する請求項16記載の固体照明装置。 The solid state lighting device according to claim 16, wherein the light conversion layer has the first region and the second region at different positions around a central axis of the recess.  前記エネルギー変換素子は、前記貫通孔の内壁に設けられた太陽電池、または前記凹面反射層と前記熱伝導部との間に設けられたゼーベック効果素子である請求項16記載の固体照明装置。 The solid-state lighting device according to claim 16, wherein the energy conversion element is a solar cell provided on an inner wall of the through hole, or a Seebeck effect element provided between the concave reflection layer and the heat conducting unit.  前記機能素子は、圧電素子、MEMSミラーおよび光スイッチのいずれかを含む請求項12記載の固体照明装置。 The solid-state lighting device according to claim 12, wherein the functional element includes any one of a piezoelectric element, a MEMS mirror, and an optical switch.
PCT/JP2013/066889 2012-11-06 2013-06-19 Solid-state lighting device Ceased WO2014073237A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012-244911 2012-11-06
JP2012244911A JP2016028370A (en) 2012-11-06 2012-11-06 Solid state lighting device
JP2012249634A JP2016028371A (en) 2012-11-13 2012-11-13 Solid lighting device
JP2012-249634 2012-11-13

Publications (1)

Publication Number Publication Date
WO2014073237A1 true WO2014073237A1 (en) 2014-05-15

Family

ID=50684358

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/066889 Ceased WO2014073237A1 (en) 2012-11-06 2013-06-19 Solid-state lighting device

Country Status (1)

Country Link
WO (1) WO2014073237A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016104089A1 (en) * 2014-12-24 2016-06-30 スタンレー電気株式会社 Vehicular lighting device
US10355175B2 (en) 2016-03-10 2019-07-16 Panasonic Intellectual Property Management Co., Ltd. Light emitting device
EP3770492A4 (en) * 2018-04-19 2021-04-28 Panasonic Intellectual Property Management Co., Ltd. PHOTO-TRANSMITTER DEVICE
CN113348322A (en) * 2019-02-05 2021-09-03 松下知识产权经营株式会社 Lighting device and optical component
US11860508B2 (en) 2020-04-24 2024-01-02 Panasonic Intellectual Property Management Co., Ltd. Light-emitting system
US12191429B2 (en) 2021-04-08 2025-01-07 Nichia Corporation Light emitting device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009016058A (en) * 2007-06-29 2009-01-22 Toshiba Lighting & Technology Corp Illumination device, and illumination fixture using this
WO2011118536A1 (en) * 2010-03-25 2011-09-29 三洋電機株式会社 Projection image display device and light source device
JP2012063567A (en) * 2010-09-16 2012-03-29 Ricoh Co Ltd Light source device, and lighting system equipped with light source device and projection type display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009016058A (en) * 2007-06-29 2009-01-22 Toshiba Lighting & Technology Corp Illumination device, and illumination fixture using this
WO2011118536A1 (en) * 2010-03-25 2011-09-29 三洋電機株式会社 Projection image display device and light source device
JP2012063567A (en) * 2010-09-16 2012-03-29 Ricoh Co Ltd Light source device, and lighting system equipped with light source device and projection type display device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016104089A1 (en) * 2014-12-24 2016-06-30 スタンレー電気株式会社 Vehicular lighting device
JP2016122504A (en) * 2014-12-24 2016-07-07 スタンレー電気株式会社 Vehicle lighting
US10355175B2 (en) 2016-03-10 2019-07-16 Panasonic Intellectual Property Management Co., Ltd. Light emitting device
US10651348B2 (en) 2016-03-10 2020-05-12 Panasonic Intellectual Property Management Co., Ltd. Light emitting device
EP3770492A4 (en) * 2018-04-19 2021-04-28 Panasonic Intellectual Property Management Co., Ltd. PHOTO-TRANSMITTER DEVICE
CN113348322A (en) * 2019-02-05 2021-09-03 松下知识产权经营株式会社 Lighting device and optical component
EP3922905A4 (en) * 2019-02-05 2022-04-20 Panasonic Intellectual Property Management Co., Ltd. ILLUMINATION DEVICE AND OPTICAL ELEMENT
US11860508B2 (en) 2020-04-24 2024-01-02 Panasonic Intellectual Property Management Co., Ltd. Light-emitting system
US12191429B2 (en) 2021-04-08 2025-01-07 Nichia Corporation Light emitting device

Similar Documents

Publication Publication Date Title
EP2534411B1 (en) Lamp comprising a phosphor, radiation source, optical system and heatsink
JP6987752B2 (en) For example, lighting devices for spot lighting applications
KR102114607B1 (en) Laser Light Source
JP6804448B2 (en) Luminescent device
KR102594756B1 (en) Optical device that generates high-brightness light
US9435513B2 (en) Light source device having optical members for changing one or more characteristics of excitation light from an excitation light source
WO2009115976A1 (en) Illumination system comprising a luminescent element with a heat sink
WO2014073237A1 (en) Solid-state lighting device
JP2013026162A (en) Lighting system and headlight for vehicle
JP2013080638A (en) Collected linear lighting device and its driving method as well as lamp fitting
TW201823775A (en) Wavelength conversion device and iilluminating device
JP4689579B2 (en) Light emitting device
TW201214015A (en) Phosphor device and lighting apparatus comprising the same
US20140286037A1 (en) Solid State Lighting Device
US20140254128A1 (en) Solid State Lighting Device
JP2015019013A (en) Light emitting device and light conversion unit
WO2013081069A1 (en) Solid state illumination device
JP2016028370A (en) Solid state lighting device
JP5842041B2 (en) Light emitting device
KR102071429B1 (en) Lighting apparatus
JP2014170758A (en) Lighting device and vehicle headlight
JP6085204B2 (en) Light emitting device
JP2016028371A (en) Solid lighting device
JP2013211252A (en) Solid lighting device
CN110645541B (en) Light source device and vehicle lamp

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13853878

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13853878

Country of ref document: EP

Kind code of ref document: A1