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WO2014049920A1 - Système de propagation d'onde électromagnétique et connecteur d'interface d'onde électromagnétique - Google Patents

Système de propagation d'onde électromagnétique et connecteur d'interface d'onde électromagnétique Download PDF

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Publication number
WO2014049920A1
WO2014049920A1 PCT/JP2013/004214 JP2013004214W WO2014049920A1 WO 2014049920 A1 WO2014049920 A1 WO 2014049920A1 JP 2013004214 W JP2013004214 W JP 2013004214W WO 2014049920 A1 WO2014049920 A1 WO 2014049920A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetic wave
wave propagation
interface device
shield structure
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/004214
Other languages
English (en)
Japanese (ja)
Inventor
明 宮田
福田　浩司
聡人 野田
篠田　裕之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
University of Tokyo NUC
Original Assignee
NEC Corp
University of Tokyo NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, University of Tokyo NUC filed Critical NEC Corp
Priority to JP2014538099A priority Critical patent/JPWO2014049920A1/ja
Publication of WO2014049920A1 publication Critical patent/WO2014049920A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/05—Circuit arrangements or systems for wireless supply or distribution of electric power using capacitive coupling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/70—Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields

Definitions

  • the present invention relates to an electromagnetic wave propagation system and an electromagnetic wave interface connector comprising an electromagnetic wave propagation sheet and an electromagnetic wave interface device for inputting or outputting electromagnetic waves to or from the electromagnetic wave propagation sheet.
  • a two-dimensional communication system has been proposed as a system for performing communication between electronic devices via a sheet-like medium.
  • the two-dimensional communication system includes an electromagnetic wave propagation sheet and a proximity coupler.
  • the proximity coupler is an electromagnetic coupling device that inputs and outputs electromagnetic waves with the inside of the sheet using an electromagnetic field that oozes from the surface of the electromagnetic wave propagation sheet.
  • This technology can be applied not only to communication but also to power transmission.
  • high frequency AC power is injected into the seat from a power feeding coupler connected to a high frequency power supply.
  • the proximity coupler for receiving power absorbs the electromagnetic field that oozes from the sheet surface, converts it into direct current by the rectifier circuit, and supplies power to the electronic device.
  • Patent Document 1 and Patent Document 2 propose a clip-type electromagnetic wave interface device.
  • This clip-type electromagnetic wave interface device has a clip part that sandwiches the edge part of the electromagnetic wave propagation sheet from above and below, and a power supply part that inputs and outputs signals.
  • the electromagnetic wave interface device is attached to the side surface portion of the electromagnetic wave propagation sheet by the clip portion, and feeds electromagnetic waves to the electromagnetic wave propagation sheet from the side surface of the electromagnetic wave propagation sheet.
  • Patent Document 3 shows a configuration in which a plurality of electromagnetic wave interface devices are used for one electromagnetic wave propagation sheet, and the same number of high-frequency cables are connected to the plurality of electromagnetic wave interface devices in a one-to-one correspondence.
  • the electromagnetic wave interface device and the electromagnetic wave propagation sheet must come into contact with each other at the end of the side surface.
  • the contact on the side surface is not as elastic as the clip part. Therefore, when impact or vibration is applied by moving the electromagnetic wave propagation system, a gap is easily generated and the propagation characteristics of the electromagnetic wave fluctuate. It was.
  • An object of the present invention is to provide an electromagnetic wave propagation system and an electromagnetic wave interface connector capable of stabilizing the propagation characteristics of an electromagnetic wave even when the electromagnetic wave propagation sheet is moved while suppressing leakage of the electromagnetic wave.
  • An electromagnetic wave propagation system includes an electromagnetic wave interface device, an electromagnetic wave propagation sheet, and a shield structure that includes the electromagnetic wave interface device and has an opening into which the electromagnetic wave propagation sheet can be inserted.
  • the opening of the shield structure has a region that sandwiches the electromagnetic wave interface device and an end of the electromagnetic wave propagation sheet in the thickness direction of the electromagnetic wave propagation sheet.
  • the shield structure includes a shielding member that covers a boundary portion between the electromagnetic wave interface device and the electromagnetic wave propagation sheet and shields leakage of electromagnetic waves.
  • the electromagnetic wave interface connector includes a shield structure including an electromagnetic wave interface device and having an opening into which an electromagnetic wave propagation sheet can be inserted.
  • the opening of the shield structure has a region that sandwiches the electromagnetic wave interface device and an end of the electromagnetic wave propagation sheet in the thickness direction of the electromagnetic wave propagation sheet.
  • the shield structure includes a shielding member that covers a boundary portion between the electromagnetic wave interface device and the electromagnetic wave propagation sheet and shields leakage of electromagnetic waves.
  • an electromagnetic wave propagation system and an electromagnetic wave interface connector that can stabilize the propagation characteristics of an electromagnetic wave even when the electromagnetic wave propagation sheet is moved while suppressing leakage of the electromagnetic wave.
  • FIG. 1 is a diagram illustrating a configuration of the electromagnetic wave propagation system.
  • the electromagnetic wave propagation system includes an electromagnetic wave propagation sheet 100, a proximity coupler 200, an electromagnetic wave interface device 300, a high frequency cable 400, and a signal processing device 500.
  • the basic structure of the electromagnetic wave propagation sheet 100 is the same as that conventionally known.
  • the electromagnetic wave propagation sheet 100 includes a mesh electrode 101, a communication layer 102, and a back conductor layer 103.
  • a mesh electrode 101 is formed on the entire surface of the electromagnetic wave propagation sheet 100 over the entire surface. An electromagnetic wave leaches out from the opening of the mesh electrode 101.
  • the mesh electrode 101 refers to a state in which a plurality of openings having a regular or irregular shape are formed in addition to a regular mesh.
  • the mesh electrode 101 is typically a lattice pattern in which the shape of the opening is rectangular.
  • the shape of the opening can take various shapes such as a turtle shell shape, a rhombus, a circle, and a triangle. Since the part which is the mesh electrode 101 becomes a part which exudes electromagnetic waves outside and implement
  • the mesh electrode 101 is a conductor layer having a square mesh shape structure, for example.
  • the repeating unit of the mesh is equal to the distance between the centers of the horizontally adjacent squares.
  • the repeating unit dimension of the mesh is sufficiently shorter than the electromagnetic wave length of the communication layer 102.
  • an electromagnetic wave leaching region is formed above the mesh electrode 101.
  • the communication layer 102 is made of a dielectric.
  • the communication layer 102 is sandwiched between the mesh electrode 101 and the back conductor layer 103.
  • the material of the communication layer 102 is selected according to the purpose of use of the electromagnetic wave propagation sheet 100.
  • resin, rubber, a polymer foam, a gel material, a hollow structure, or the like can be used as the communication layer 102.
  • the back conductor layer 103 is a plane-shaped electrode provided so as to extend uniformly over the entire lower surface of the communication layer 102.
  • the back conductor layer 103 is made of, for example, a metal foil or a metal plate such as copper or aluminum.
  • the mesh electrode 101 and the back surface conductor layer 103 are arranged in a substantially parallel state, and electromagnetic waves travel through a space between the mesh electrode 101 and the back surface conductor layer 103.
  • electromagnetic waves travel in the communication layer 102.
  • an evanescent wave is leached from the mesh electrode 101 to the outside, and communication with the proximity coupler 200 is realized via the leached evanescent wave.
  • the proximity coupler 200 is a coupler-type power receiving device including a dielectric and two conductor layers (plane-shaped conductor and patch conductor) provided on both sides thereof.
  • the proximity coupler 200 is an interface device that is used by being placed on the electromagnetic wave propagation sheet 100, and transmits and receives electromagnetic waves to and from the electromagnetic wave propagation sheet 100.
  • the electromagnetic wave interface device 300 receives a high frequency signal from the signal processing device 500 via the high frequency cable 400, generates an electromagnetic wave corresponding to the high frequency signal, and supplies the electromagnetic wave to the electromagnetic wave propagation sheet 100.
  • the mesh electrode 101 and the back conductor layer 103 are insulated from the side surface of the end portion of the electromagnetic wave propagation sheet 100 at the location where the electromagnetic wave interface device 300 is connected.
  • the mesh electrode 101 and the back surface conductor layer 103 may be electrically connected to each other by a method such as through-hole, pressure bonding, and conductive paste coating except for a portion where the electromagnetic wave interface device 300 is connected.
  • FIG. 2 is a schematic view showing the electromagnetic wave propagation system according to the first embodiment of the invention
  • FIG. 3 is a perspective view including a III-III section of FIG. 4 is an exploded view of the portion shown in FIG.
  • the electromagnetic wave propagation system further includes a shield structure 600 as shown in FIG.
  • the shield structure 600 substantially includes the electromagnetic wave interface device 300. That is, the shield structure 600 surrounds and substantially houses most of the entire outer surface of the electromagnetic wave interface device 300.
  • the shield structure 600 does not completely close the electromagnetic wave interface device 300 from the outside, and the electromagnetic wave interface device 300 is provided with an opening portion 601 (see FIG. 6), and the portion is open to the outside.
  • the shield structure 600 covers the electromagnetic wave interface device 300 from the outside except for the opening 601.
  • the open part 601 is a concave part provided on one side surface parallel to the longitudinal direction, and the central part of the side surface is formed over the entire region in the longitudinal direction.
  • the electromagnetic wave propagation sheet 100 is inserted into the open part 601, and the electromagnetic wave interface device 300 and the electromagnetic wave propagation sheet 100 are arranged so that the side surfaces of the end parts face each other.
  • the open part 601 is closed by the electromagnetic wave propagation sheet 100. Therefore, the electromagnetic wave interface device 300 is substantially closed from the outside by the shield structure 600. Is done.
  • the shield structure 600 has an electromagnetic wave interface device 300 built in substantially the center thereof. More specifically, in the shield structure 600, the electromagnetic wave interface device 300 is installed on the plate-like bottom surface portion 602. The upper surface of the electromagnetic wave interface device 300 is separated from the upper surface portion 603 of the shield structure 600 and is in an electrically non-contact state.
  • the bottom surface portion 602 of the shield structure 600 holds one end region of the electromagnetic wave propagation sheet 100 in contact with the back conductor layer 103 from below.
  • the bottom surface portion 602 and the top surface portion 603 of the shield structure 600 are supported so as to be parallel to each other via the interposition portion 604.
  • One end (rear end) of the electromagnetic wave interface device 300 is in contact with the inner surface of the interposition part 604.
  • the other end (front end) of the electromagnetic wave interface device 300 is in contact with one side surface of the electromagnetic wave propagation sheet 100.
  • the upper surface portion 603 of the shield structure 600 has the same shape as the bottom surface portion 602 on the main surface.
  • a tip portion 605 is provided at the tip of the shield structure 600.
  • the front end portion 605 holds one end region of the electromagnetic wave propagation sheet 100 in contact with the mesh electrode 101 from above.
  • the side surface portion 606 of the shield structure 600 is a surface that receives the electromagnetic wave propagation sheet 100 in the open portion 601 from the surface opposite to the side where the open portion 601 is provided in the shield structure 600 (that is, the electromagnetic wave interface device 300 and the electromagnetic wave propagation).
  • the electromagnetic wave interface device 300 is covered in a region up to the contact surface with the sheet 100).
  • the bottom surface portion 602 shields the lower surface of the electromagnetic wave interface device 300 from the outside.
  • the upper surface portion 603 shields the upper surface of the electromagnetic wave interface device 300 from the outside.
  • the interposition part 604 shields the rear surface of the electromagnetic wave interface device 300 from the outside.
  • the tip 605 shields the space above the electromagnetic wave interface device 300 from the outside.
  • the side surface portion 606 shields the side surface of the electromagnetic wave interface device 300 from the outside.
  • Each of the bottom surface portion 602, the top surface portion 603, the interposition portion 604, the distal end portion 605, and the side surface portion 606 of the shield structure 600 may be integrally formed, separately formed, mechanically, adhesive, or the like. It may be fixed with.
  • the electromagnetic wave interface device 300 includes a slot resonator electrode 310 having a rectangular opening that resonates at one-half wavelength on one surface of the dielectric substrate 303 (the surface in FIG. 5), and a slot resonator coupling line. 302.
  • a ground electrode 304 is provided on the other surface (the back surface in FIG. 5) that is the surface opposite to the surface on which the slot resonator electrode 310 and the slot resonator coupling line 302 are formed.
  • the slot resonator electrode 310 is formed so that one long side thereof shares one side that is an end of the electromagnetic wave interface device 300. Further, the long-side direction of the slot resonator electrode 310 and the side of the electromagnetic wave propagation sheet 100 whose side faces the electromagnetic wave interface device 300 are disposed substantially parallel and close to each other.
  • the slot resonator coupling line 302 traverses the center of the opening 311 of the slot resonator electrode 310, and one end of the slot resonator coupling line 302 is the length of the opening 311 of the slot resonator electrode 310 on the side where the electromagnetic wave propagation sheet 100 is present. Connected to the edge.
  • a plurality of through holes 305 are provided around each of the two short sides 312 of the slot resonator electrode 310 and the opposite long side of the electromagnetic wave propagation sheet 100 excluding a region where the slot resonator coupling line 302 transmits a signal.
  • the through hole 305 electrically connects the slot resonator electrode 310 and the ground electrode 304.
  • the ground electrode 304 is in contact with the bottom surface portion 602 of the shield structure 600.
  • the other end side of the slot resonator coupling line 302 constitutes a power feeding unit 301 of the electromagnetic wave interface device 300, and the power feeding unit 301 is connected to the signal processing device 500 in a circuit.
  • the signal processing device 500 is installed inside the shield structure 600, for example, by being mounted on the substrate of the electromagnetic wave interface device 300. However, the signal processing device 500 may be provided outside the shield structure 600 and connected to the electromagnetic wave interface device 300 via the high-frequency cable 400.
  • Fig. 6 shows the appearance of the shield structure 600.
  • the shield structure 600 including the electromagnetic wave interface device 300 is entirely made of metal so as to shield leakage of high-frequency signals from the inside.
  • the shield structure 600 may be configured by forming a metal film on a resin casing. At this time, the metal film may be formed inside, outside, or inside the resin casing.
  • the shielding member which shields the leakage of electromagnetic waves may be a material which has the same effect even if it is not a metal.
  • the shielding member that shields the leakage of the electromagnetic wave is provided at a position that covers the boundary portion between the electromagnetic wave interface device 300 and the electromagnetic wave propagation sheet 100, a gap is generated at the boundary portion between the electromagnetic wave interface device 300 and the electromagnetic wave propagation sheet 100. In addition, signal transmission degradation can be suppressed.
  • the opening portion 601 is provided in a part of the shield structure 600.
  • the shield structure 600 faces the electromagnetic wave propagation sheet 100 long side of the slot resonator electrode 310 of the electromagnetic wave interface device 300 and each part of the electromagnetic wave propagation sheet 100 so as to face up and down.
  • the electromagnetic wave propagation sheet 100 is fixed.
  • the electromagnetic wave interface device 300 and the electromagnetic wave propagation sheet 100 face each other. That is, it is desirable that the end surface on the electromagnetic wave propagation sheet 100 side in the electromagnetic wave interface device 300 and the end surface on the electromagnetic wave interface device 300 side in the electromagnetic wave propagation sheet 100 are in contact with each other, but the shield structure 600 covers the contact region from above and below. If there is, there may be a gap between them.
  • the electromagnetic wave interface device 300 and the electromagnetic wave propagation sheet 100 may be fixed physically using an adhesive tape or a screw.
  • the processing operation of the electromagnetic wave propagation system having the configuration as described above will be described by taking as an example a state in which the signal processing device 500 generates a signal.
  • the high-frequency signal generated by the signal processing device 500 excites the slot resonator electrode 310 via the power feeding unit 301 and the slot resonator coupling line 302.
  • the slot resonator electrode 310 resonates under the condition that the length of the long side of the electrode opening 311 is approximately a half wavelength with respect to the wavelength of the high frequency signal.
  • a strong electric field component in the short side direction of the slot resonator electrode 310 is generated in the slot resonator electrode 310 that has entered the resonance operation.
  • the length of the long side 313 of the slot resonator electrode 310 is not necessarily exactly one half of the wavelength of the high-frequency signal, and the long side 313 is shorter due to the dielectric effect of the dielectric substrate 303.
  • the length can satisfy the condition of the resonance operation, or the condition of the resonance operation can be satisfied within the band corresponding to the Q value of the resonator.
  • the electric field component in the short side direction generated in the slot resonator electrode 310 is continuously restrained by the through holes 305 arranged around the slot resonator electrode 310 while proceeding to the inside of the dielectric substrate 303, so that the slot resonance gradually increases. It propagates to the long side where the through hole 305 of the electrode 310 does not exist, and changes to an electric field component in the thickness direction of the dielectric substrate 303.
  • the electric field component in the thickness direction of the dielectric substrate 303 is equivalent to the electric field component of the main propagation mode of the electromagnetic wave propagation sheet 100.
  • the electric field component in the thickness direction of the dielectric substrate 303 is a parallel plate mode electric field that can be generated between the upper and lower metals of the shield structure 600 that fixes the electromagnetic wave interface device 300 and the electromagnetic wave propagation sheet 100 between the upper and lower sides.
  • the ingredients are equivalent. That is, the electric field component in the cross-sectional direction of the dielectric substrate 303 generated in one side of the electromagnetic wave interface device 300 sharing one long side of the slot resonator electrode 310 is an electromagnetic wave interface device sandwiched between upper and lower metals of the shield structure 600. In the gap between 300 and the electromagnetic wave propagation sheet 100, both are combined efficiently as a parallel plate mode and further as a propagation mode in the electromagnetic wave propagation sheet 100 that is close to each other.
  • the signal generated by the signal processing device 500 propagates into the electromagnetic wave propagation sheet 100 via the power supply unit 301 and the electromagnetic wave interface device 300 in the frequency band in which the slot resonator electrode 310 generates a half-wave resonance operation. It becomes possible to do.
  • the state in which the signal processing device 500 receives a signal may be regarded as just the opposite operation due to reciprocity.
  • the high-frequency signal in the electromagnetic wave propagation sheet 100 reaches the electromagnetic wave interface device 300 to cause the slot resonator electrode 310 to resonate and is input to the signal processing device 500 from the slot resonator coupling line 302 via the power feeding unit 301.
  • FIG. 7 shows the high-frequency scattering characteristics between the two electromagnetic wave interface devices 300 when the electromagnetic wave interface device 300 having the above-described configuration is arranged at two opposite positions of the rectangular electromagnetic wave propagation sheet 100 as shown in FIG. Show.
  • the high-frequency transmission characteristic indicated by the solid line as S2, 1 in FIG. 7 is, for example, a high-frequency transmission characteristic between two electromagnetic wave interface devices 300 at a frequency of 2.463 GHz, and a connection portion between the two electromagnetic wave interface devices 300 and the electromagnetic wave propagation sheet 100. Including the propagation loss in the electromagnetic wave propagation sheet 100, it is as small as ⁇ 0.63 dB. Therefore, it can be seen that an electromagnetic wave propagation system that can satisfactorily input a high-frequency signal from the electromagnetic wave interface device 300 into the electromagnetic wave propagation sheet 100 is configured.
  • the electromagnetic wave interface device 300 and the electromagnetic wave propagation sheet 100 can be efficiently connected in a high frequency band where the slot resonator electrode 310 resonates.
  • the electromagnetic wave interface device 300 reaches the electromagnetic wave propagation sheet 100, more preferably, the signal processing device 500 reaches the electromagnetic wave propagation sheet 100. Since all the constituent elements up to are arranged inside the shield structure 600, leakage of electromagnetic waves to the outside of the electromagnetic wave propagation system can be suppressed. For example, when a slot resonator electrode as used in the present invention is used without a shield, a part of electric power is radiated from the slot resonator electrode to the space, causing a problem of greatly leaking electromagnetic waves.
  • the gap is formed between the electromagnetic wave interface device 300 and the electromagnetic wave propagation. Deterioration of signal transmission can be suppressed as long as it is inside the shield structure 600 that sandwiches the sheet 100 vertically. Moreover, the characteristic variation by the position of the connection part of the electromagnetic wave interface apparatus 300 and the electromagnetic wave propagation sheet 100 can be reduced.
  • the electromagnetic wave interface device 300 can be manufactured only by a general printed circuit board process, which contributes to cost reduction of the electromagnetic wave interface device 300. Further, if the electromagnetic wave interface device 300 is manufactured by a general printed circuit board process, the compatibility with circuit elements such as the signal processing device 500 is increased, and not only the signal processing device 500 but also a filter circuit, a power supply circuit, and a microcomputer control. A circuit and the like can be easily integrated into the electromagnetic wave interface device 300.
  • FIG. 8 is a schematic diagram illustrating an electromagnetic wave propagation system according to the second embodiment.
  • the shield structure 600 is configured only around the electromagnetic wave interface device 300, whereas in the second embodiment, as shown in FIG.
  • the shield structure 600 is configured to cover the entire periphery of the electromagnetic wave propagation sheet 100.
  • the shield structure 600 may include not only one electromagnetic wave interface device 300 but also a plurality of electromagnetic wave interface devices 300.
  • the shield structure 600 is arranged over a wide range with respect to the side surface of the end portion of the electromagnetic wave propagation sheet 100, it corresponds to the case where array element control is applied using a plurality of electromagnetic wave interface devices as shown in Patent Document 3.
  • a plurality of electromagnetic wave interface devices 300 can be included in the shield structure 600.
  • electromagnetic wave leakage is suppressed despite the increase in the number of electromagnetic wave leakage sources as the number of electromagnetic wave interface devices 300 increases.
  • the release portion 601 of the shield structure 600 includes a region that sandwiches the electromagnetic wave interface device 300 and the end portion (edge portion) of the electromagnetic wave propagation sheet 100. This region sandwiches the end portions of the electromagnetic wave interface device 300 and the electromagnetic wave propagation sheet 100 in the thickness direction of the electromagnetic wave propagation sheet 100. This region sandwiches the part that becomes the end surface of the electromagnetic wave interface device 300 and the electromagnetic wave propagation sheet 100 up and down.
  • the release part 601 may be referred to as an opening part 601.
  • Electromagnetic wave propagation sheet 101 Mesh electrode 102 Communication layer 103 Back surface conductor layer 200 Proximity coupler 300 Electromagnetic wave interface device 301 Feed part 302 Slot resonator coupling line 303 Dielectric substrate 304 Ground electrode 305 Through hole 310 Slot resonator electrode 311 Opening 312 Short side 313 Long side 400 High frequency cable 500 Signal processing device 600 Shield structure 601 Opening part

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Near-Field Transmission Systems (AREA)
PCT/JP2013/004214 2012-09-28 2013-07-08 Système de propagation d'onde électromagnétique et connecteur d'interface d'onde électromagnétique Ceased WO2014049920A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014538099A JPWO2014049920A1 (ja) 2012-09-28 2013-07-08 電磁波伝播システム及び電磁波インターフェースコネクタ

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JP2012217568 2012-09-28
JP2012-217568 2012-09-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016123013A (ja) * 2014-12-25 2016-07-07 株式会社イトーキ アンテナユニット
JP2019506825A (ja) * 2015-12-24 2019-03-07 エナージャス コーポレイション 近距離場無線電力充電用アンテナ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244718A (ja) * 2000-02-28 2001-09-07 Mitsumi Electric Co Ltd アンテナ装置
JP2011009801A (ja) * 2009-06-23 2011-01-13 Serukurosu:Kk 高効率な電磁波インターフェース装置と電磁波伝送システム
JP2013031001A (ja) * 2011-07-28 2013-02-07 Toshiba Tec Corp 無線通信システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244718A (ja) * 2000-02-28 2001-09-07 Mitsumi Electric Co Ltd アンテナ装置
JP2011009801A (ja) * 2009-06-23 2011-01-13 Serukurosu:Kk 高効率な電磁波インターフェース装置と電磁波伝送システム
JP2013031001A (ja) * 2011-07-28 2013-02-07 Toshiba Tec Corp 無線通信システム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016123013A (ja) * 2014-12-25 2016-07-07 株式会社イトーキ アンテナユニット
JP2019506825A (ja) * 2015-12-24 2019-03-07 エナージャス コーポレイション 近距離場無線電力充電用アンテナ

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