Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/1601—Process or apparatus
  • C23C18/1633—Process of electroless plating
  • C23C18/1635—Composition of the substrate
  • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
  • C23C18/1641—Organic substrates, e.g. resin, plastic
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/1601—Process or apparatus
  • C23C18/1603—Process or apparatus coating on selected surface areas
  • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
  • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/1601—Process or apparatus
  • C23C18/1603—Process or apparatus coating on selected surface areas
  • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
  • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/18—Pretreatment of the material to be coated
  • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
  • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
  • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
  • C23C18/204—Radiation, e.g. UV, laser
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/20—Conductive material dispersed in non-conductive organic material
  • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Definitions

• Resin composition capable of selectively depositing metal and preparation method and application thereof
• the present invention relates to a resin composition, and more particularly to a modified resin composition for selectively depositing a metal thin film, a preparation method thereof, and use thereof.
• Laser direct molding refers to the use of a computer to control the laser beam to illuminate the laser beam onto the workpiece.
• the area irradiated by the laser beam has an activation capability, and the activation region of the workpiece can be A metal such as copper, nickel or gold is deposited in the electroless plating solution, and a metal such as copper, nickel, or gold cannot be deposited in a region not irradiated with the laser beam, so that the resin composition is selective in depositing metal.
• Moulded Interconnect Device is faster, more streamlined, more cost-effective, and has a wider application area. Its biggest advantage is that it can reduce the number of electronic products.
• antennas made with LDS technology are widely used in mobile terminals such as smartphones, notebook computers, GPS, etc.
• Sensors manufactured by LDS technology have a minimum wire width of 150 ⁇ m and a minimum line width of 150 ⁇ m. This not only reduces the number of components, but also saves space and reduces weight.
• LDS technology is also reflected in its flexibility. If you need to change the conductive path on the component, you only need to change the circuit graphic design in the CAD, no need to redesign the mold. Because LDS technology does not require a mask, the process is simpler and the processing cost is lower.
• LDS technology uses laser beams to process parts and has great advantages in making 3D circuits.
• the copper foil patch process is used to make the three-dimensional circuit. Then, in the place where the metal pattern has curvature, especially in the corner with sharp corners, defects such as copper foil lifting are likely to occur, which affects the electrical and electronic functions of the workpiece, and the LDS technology can This difficulty is well overcome because the metal film deposited during the electroless plating process eliminates the internal stress of the metal layer.
• the base covers general-purpose plastics, engineering plastics, and specialty engineering plastics, as well as ceramic materials.
• Typical applications are high molecular materials such as polycarbonate, polycarbonate and acrylonitrile/butadiene/styrene alloys due to their excellent dimensional stability, good processability and mechanical properties. Appearance aesthetics, so LDS antennas made with them have been widely used in smartphones, tablets and laptops.
• SMT surface mount technology
• the processing temperature of the SMT process is as high as 270 ° C. Even in more severe cases, the temperature will rise to 290 ° C.
• general plastics and engineering plastics will have problems such as softening, deformation, and foaming of the substrate.
• special engineering plastics have excellent performance.
• high temperature semi-aromatic nylon, liquid crystal polymer, polyaryl ether ketone and other polymers have processing temperatures above 30CTC.
• laser sensitive additives play a key role. Under the action of the laser beam, he releases metal particles and acts as an activation center in the subsequent electroless plating to accelerate the redox reaction in the plating solution to deposit metallic copper.
• the laser-sensitive additive commonly used is a metal-copper-containing spinel and also contains heavy metal chromium, which poses a potential environmental risk during use. Summary of the invention
• a modified resin composition for selectively depositing a metal film comprising the following components:
• the metal element in the solvent in the metal oxide solid solution is derived from the elements in the third, fourth, fifth, and sixth cycles of the periodic table, and the metal element in the solute is from the third, fourth, and fifth in the periodic table.
• the element in the 6-cycle period, the weight ratio of the solute to the solvent in the metal oxide solid solution is 1:9-1:1.
• the metal element in the metal oxide solid solution solvent is preferably derived from Ti, Sn, Pb, Nb, W, Mn, Ge, Ta.
• the metal element in the solvent of the metal oxide solid solution is further preferably selected from Sn.
• the metal element in the solute of the metal oxide solid solution is preferably derived from Mg, Al, Ca, Mn, Fe, Ti, Ni, Cu, Zn, Ge, Nb, Pd, Ag, Sn, Sb.
• Chromium is not included in the metal oxide.
• the weight percentage of the resin matrix is preferably from 35 to 99% by weight; from 40 to 90% by weight ; from 45 to 80% by weight.
• the weight percentage of the metal oxide solid solution is preferably l_10 rt%; 2-9 wt% 0
• the resin matrix selected for use in the present invention is selected from the group consisting of thermoplastics, thermosets, rubbers or elastomers.
• thermoplastic resin is selected from the group consisting of: polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polycarbonate and acrylonitrile-butadiene-styrene alloy (PC/ABS), liquid crystal Polymer (LCP), polyamide (PA), polyphenylene sulfide (PPS), polyphenylene ether (PPE), polysulfone, polyarylate, polyetheretherketone (PEEK), polyetherketoneketone (PEKK), Polyetheretherketoneketone (PEEKK), thermoplastic polyimide (TPI), polyacetal, polyethylene ( ⁇ ), polypropylene ( ⁇ ), polystyrene (PS), polytetrafluoroethylene (PTFE), poly Acrylates, styrene-acrylonitrile copolymers (SA), polybutylene terephthalate (PBT), and polyethylene terephthalate (PET), polybutylene terephthalate An
• the polyamide resin selected is selected from the group consisting of an aliphatic polyamide, a semi-aromatic polyamide, or a blended composition of a semi-aromatic polyamide and an aliphatic polyamide.
• the aliphatic polyamide carbon chain selected consists of 4 to 36 carbon atoms, and a typical aliphatic polyamide includes a combination of one or more of PA6, PA66, PA610, PA612, PA1010, PA11, PA12, PA1012, But not limited to these combinations.
• the semi-aromatic polyamide consists of a dicarboxylic acid unit and a diamine unit, wherein the dicarboxylic acid unit comprises 45-100 mole percent of aromatic dicarboxylic acid units and 0-55 mole percent of 4-12
• the aliphatic dicarboxylic acid unit of a carbon atom, the diamine unit being a linear aliphatic diamine of 4 to 14 carbon atoms, a branched aliphatic diamine or an alicyclic diamine.
• the aromatic dicarboxylic acid unit includes terephthalic acid, isophthalic acid, 2-methylterephthalic acid, 2,5-dichloroterephthalic acid, 2,6-dichloroterephthalic acid, 1, 4-naphthalene dicarboxylic acid, 4, 4'-diphenyl phthalate or 2, 2 '-diphenyl phthalic acid.
• the aliphatic dicarboxylic acid unit includes 1,4-succinic acid, 1,6-hexanedioic acid, 1,8-octanedioic acid, 1,9-sebacic acid, 1, 10-sebacic acid, 1, 11 - undecanedioic acid, or 1,12-dodecanedioic acid.
• the linear aliphatic diamine includes 1,4-butanediamine, 1,6-hexanediamine, 1,8-octanediamine, 1,9-nonanediamine, 1, 10-decanediamine, 1, 11- Undecyldiamine, or 1,12-dodecanediamine.
• Branched aliphatic diamines include 2-methyl-1, 5-pentanediamine, 3-methyl-1, 5-pentanediamine, 2,4-dimethyl-1,6-hexanediamine, 2, 2, 4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1,6-hexanediamine, or 2-methyl-1, 8-octanediamine or 5-methyl-1,9-nonanediamine.
• the alicyclic diamine includes cyclohexanediamine, methylcyclohexanediamine or 4,4'-diaminodicyclohexylmethane.
• thermosetting plastic is selected from the group consisting of epoxy resins, phenolic resins, unsaturated polyesters, polyimide resins, or a combination of at least one of the foregoing polymers.
• the rubber is selected from the group consisting of natural rubber and synthetic rubber, or a combination of at least one of the foregoing polymers.
• the elastomer is selected from the group consisting of styrene elastomers, polyolefin elastomers, polyester elastomers, polyamide elastomers, and polyurethane elastomers, or a combination of at least one of the foregoing polymers.
• the resin composition of the present invention may contain one or more additives. These additives act to improve a specific property in the resin matrix, such as reinforcement, toughening, flame retardancy, processing stability, and product appearance.
• the additives are selected from the group consisting of fibers, toughening agents, flame retardants, nucleating agents, lubricants, mold release agents, antioxidants, mineral fillers, curing agents, weathering agents, and the like.
• the fiber is a combination of one or more of carbon fiber, glass fiber, boron fiber or mineral fiber.
• the mineral filler may be round, needle or flake.
• the mineral filler is selected from the group consisting of talc, wollastonite, titanium dioxide, kaolin, mica, barium sulfate, solid hollow glass microbeads, calcium carbonate, barium titanate, kaolin or copper calcium titanate.
• the toughening agent is preferably a core-shell structured silicon-based toughening agent.
• the preparation method of the modified resin composition of the invention is as follows: the material is weighed, the material is uniformly mixed, fed from the main feeding hopper of the twin-screw extruder, uniformly mixed by screw shearing, and then extruded, cooled and cut. The granules give the target product.
• the modified resin composition of the present invention can also be obtained by the following preparation method: uniformly mixing the materials, charging the obtained resin composition into a suitable mold, heat-treating, and molding the resin composition by press molding.
• the object is the target part.
• the region of the modified resin composition of the present invention which has been scanned by the laser beam has the ability to deposit metals such as copper, nickel, gold, etc. in the electroless plating process, and the region not scanned by the laser does not have the ability to deposit metal.
• the modified resin composition also includes an extreme case in which all metallization is performed on the surface of the article in order to satisfy the electromagnetic shielding effect in the electronic technology.
• the preferred laser wavelength of the modified resin composition in the laser laser engraving process includes 248 nm, 308 nm, 335 nm, 532 nm, 1064 nm, and 10600 nm.
• the laser is preferably Nd : YAG (yttrium-doped yttrium aluminum garnet laser).
• the modified resin composition of the present invention is insulative and stable in an acidic or alkaline electroless plating solution, and the laser beam scanned region can generate a metal core and promote oxidation of the electroless plating solution in contact therewith.
• the reduction reaction thereby depositing metal, achieves metallization.
• the metal oxide solid solution can withstand temperatures exceeding 40 CTC, and can form a stable system with the resin matrix without causing degradation of the resin; and the metal oxide solid solution is free of heavy metal chromium and has no potential risk of environmental pollution.
• the resin composition of the present invention can be used for making films, and can also be applied to injection molded products, which can be applied to smart phone antennas, notebook computers, automobiles, home appliances, mobile terminals and the like. detailed description
• the modified resin composition, the preparation method, the effect and the use of the present invention for depositing a metal thin film are described in further detail below with reference to the examples and comparative examples, but the embodiment of the invention is not limited thereto.
• the film thickness test is performed on the modified resin composition, and the test used The method is a Cross-Cut Test.
• the film thickness test is to test the thickness of the metal film deposited on the LDS material in the absence of electrochemical plating.
• the industry requires that the film thickness distribution within 7-12 rn is acceptable. If the metal oxide solid solution releases too little metal particles under the action of the laser, it will affect the efficiency of copper plating in the subsequent electroless electroless plating process. In the limit without adding a metal oxide solid solution, the part will completely lose the function of electroless copper plating. At this time, the film thickness is 0 mm, and nickel plating and gold plating are also lost.
• 100-gauge test that is, using a utility knife to cut 100 lmm*lmm squares on the metal film, stick it with 3M 610 tape and place it for about 2 minutes, then pull it up vertically, and the falling area of the metal film is less than 5%.
• Core-shell structured silicon-based toughening agent produced by Japan's Zhongyuan Chemical Industry Co., Ltd., grade UF-100;
• the metal oxide solid solution can be purchased or homemade.
• the metal oxide solid solution of the present invention is prepared by the following method: weighing the material according to the raw material ratio of each component, wet grinding, drying the ground material to remove moisture 5-3hrs, The target solid solution product is obtained.
• the pulverized powder is placed in a high-temperature furnace and heated to 1000-150 CTC for 0. 5-3 hrs to obtain a target solid solution product.
• Polyphenylene sulfide purchased from Sichuan Deyang Chemical Co., Ltd., grade: PPS-HB1;
• Nylon 66 from Shenma Group Plastics Technology Co., Ltd., grade: PA66 EPR27;
• Polyetheretherketone from Victrex, UK, grade: VICTREX PEEK 150P;
• Liquid crystal polymer LCP from Solvay, grade XYDAR;
• the rest of the material is from commercially available products.
• Example 1 the resin matrix was selected from 85 rt% polycarbonate, the processing temperature was controlled at 240-270 ° C, and the melt flow rate tested under the condition of 26 CTC/5KG was 21.68 g/10 min ; and 6 rt% of the core-shell structure.
• the parts were scanned by laser under the laser Nd: YAG (yttrium-doped yttrium aluminum garnet laser, 1064 nm), cleaned with ultrapure water, and immersed in an electroless copper plating bath to selectively deposit copper metal.
• Nd YAG (yttrium-doped yttrium aluminum garnet laser, 1064 nm)
• the thickness of the metal copper layer was 10.25 mm, and the metal-free copper layer was peeled off in the hundred-square test, and the film thickness test and the pass test were qualified.
• the resin matrix is selected from 90 rt% polyphenylene sulfide; and 10% by mass of a metal oxide solid solution, a mixture of a metal oxide solid solution manganese oxide and a cuprous oxide, the solvent is manganese oxide, and the solute is Cuprous oxide, solvent to solute weight ratio of 9: 1, mixed uniformly, extruded from a twin-screw extruder, cooled, pelletized. The obtained pellets were injection molded to obtain a part.
• Example 1 The test method is referred to in Example 1.
• the thickness of the metal copper layer was 11.75 mm, and the metal-free copper layer was peeled off in the 100-gauge test, and the film thickness test and the Baige test were qualified.
• the resin substrate is selected from 64 rt% nylon 66; glass fiber 35 rt%; and 1% by mass metal oxide solid solution, metal oxide solid solution lanthanum oxide and zinc oxide blend, solvent is lanthanum oxide , the solute is zinc oxide, the weight ratio of solvent to solute 4: 3, after mixing uniformly, extruding from a twin-screw extruder, cooling, and pelletizing.
• the obtained pellets were injection molded to obtain a part.
• the laser is scanned by the laser of Nd: YAG (yttrium-doped yttrium aluminum garnet laser), it is cleaned with ultrapure water and immersed in a non-electrochemical copper plating tank to selectively deposit copper metal.
• Nd yttrium-doped yttrium aluminum garnet laser
• Example 1 The test method is referred to in Example 1.
• the thickness of the metal copper layer was 7.31 mm, and the metal-free copper layer was peeled off in the test of 100 grids, and the film thickness test and the pass test were qualified.
• the resin matrix is selected from 40 rt% polyetheretherketone; carbon fiber 50 rt%; and 10% by mass metal oxide solid solution, metal oxide solid solution tungsten oxide and cerium oxide blend, solvent is tungsten oxide
• the solute is cerium oxide, and the weight ratio of solvent to solute is 5:4.
• Nd YAG (yttrium-doped yttrium aluminum garnet laser)
• the parts were cleaned with ultrapure water and immersed in an electroless copper plating bath to selectively deposit copper metal.
• Example 1 The test method is referred to in Example 1.
• the thickness of the metal copper layer was 8.78 mm, and the peeling area of the metal copper layer of the test was ⁇ 5%, and the film thickness test and the pass test were qualified.
• Example 5 the resin matrix was selected from 62 wt% polyphenylene sulfide; glass fiber 36 rt%; and 2% metal oxide solid solution, metal oxide solid solution cerium oxide and cuprous oxide blend, solvent ⁇ The oxide, the solute is cuprous oxide, and the weight ratio of the solute to the solvent is 1: 1, and the mixture is uniformly extruded, extruded from a twin-screw extruder, cooled, and pelletized. The obtained pellets were injection molded to obtain a part.
• Nd: YAG yttrium-doped yttrium aluminum garnet laser
• Example 1 The test method is referred to in Example 1.
• the thickness of the metal copper layer was 8.43 mm, and the metal-free copper layer was peeled off in the test of 100 grids, and the film thickness test and the pass test were qualified.
• Example 6 the resin substrate was selected from 60 rt% liquid crystal polymer LCP; glass fiber 21 wt%; talc powder 10 rt%, and 9 rt% metal oxide solid solution, metal oxide solid solution tin oxide and aluminum oxide blend,
• the solvent is tin oxide
• the solute is aluminum oxide
• the weight ratio of solvent to solute is 6:5.
• Nd: YAG yttrium-doped yttrium aluminum garnet laser
• Example 1 The test method is referred to in Example 1.
• the thickness of the metal copper layer was 9.86 mm, and the copper-free copper layer was peeled off, and the film thickness test and the pass test were qualified.
• Comparative Example 7 The resin matrix was selected from 41 rt% polycarbonate; carbon fiber 50 rt%; and 9 rt% titanium dioxide, which was uniformly mixed, extruded from a twin-screw extruder, cooled, and pelletized. The obtained pellets were injection molded to obtain a part. After the laser is scanned by the laser of the Nd:YAG (yttrium-doped yttrium aluminum garnet laser), it is cleaned with ultrapure water and immersed in a non-electrochemical copper plating tank. It has been found that titanium dioxide does not have the property of selectively depositing metals, and the film thickness test and the hundred-square test are unqualified.
• Nd:YAG yttrium-doped yttrium aluminum garnet laser
• Comparative Example 8 The resin matrix was selected from 80% polyamide 6; glass fiber 15 rt%; and 5 rt% copper-nickel binary alloy solid solution, which was uniformly mixed, extruded from a twin-screw extruder, cooled, and pelletized. The obtained pellets were injection molded to obtain a part. After the laser is scanned by the laser of Nd: YAG (yttrium-doped yttrium aluminum garnet laser), it is cleaned with ultrapure water and immersed in a non-electrochemical copper plating tank. It was found that the resin composition did not have the property of selectively depositing metal, and the film thickness test and the Baige test failed.
• Nd yttrium-doped yttrium aluminum garnet laser
• Example 9 The resin matrix is made of 35rt% polyethylene; glass fiber 45rt%; talc powder 10rt%, and 10% metal oxide solid solution, metal oxide solid solution tin oxide and cuprous oxide blend, solvent is tin oxide
• the solute is cuprous oxide, and the weight ratio of solvent to solute is 6:5.
• Nd yttrium-doped yttrium aluminum garnet laser
• Example 1 The test method is referred to in Example 1.
• the thickness of the metal copper layer was 9. l lmm, and the copper layer without the metal layer was peeled off, and the film thickness test and the pass test were qualified.
• Example 10 the resin matrix was selected from 99 rt% polycarbonate, the processing temperature was controlled at 240-270 ° C, and the melt flow rate tested under the condition of 26 CTC/5KG was 21.68 g/10 min; ⁇ 1% of metal oxide Solid solution, a mixture of metal oxide solid solution tin oxide and cerium oxide, the solvent is tin oxide, the solute is cerium oxide, the weight ratio of solvent to solute is 3:2, and the mixture is uniformly extruded from twin screw Extrusion in the machine, cooling, pelletizing. The obtained pellets were injection molded to obtain a part.
• the parts were scanned with a laser under the laser Nd : YAG (ytterbium-doped yttrium aluminum garnet laser, 1064 nm), cleaned with ultrapure water, and immersed in an electroless copper plating tank to selectively deposit copper metal.
• Nd YAG (ytterbium-doped yttrium aluminum garnet laser, 1064 nm)
• the thickness of the metal copper layer was 10.25 mm, and the metal-free copper layer was peeled off in the hundred-square test, and the film thickness test and the pass test were qualified. Comparative example 11
• the resin matrix is made of 99rt% polycarbonate, the processing temperature is controlled at 240-270°C, and the melt flow rate tested under the condition of 26CTC/5KG is 21.68g/10min; ⁇ 1% metal oxide solid solution, metal metal a mixture of oxide solid solution tungsten oxide and cerium oxide, the solvent is tungsten oxide, the solute is cerium oxide, the weight ratio of solvent to solute is 3:2, and the mixture is uniformly squeezed from the twin-screw extruder Out, cool, pelletize. The obtained pellets were injection molded to obtain a part.
• the parts were scanned by a laser under the laser Nd : YAG (ytterbium-doped yttrium aluminum garnet laser, 1064 nm), cleaned with ultrapure water, and immersed in an electroless copper plating tank.
• Nd YAG (ytterbium-doped yttrium aluminum garnet laser, 1064 nm)
• the thickness of the metal copper layer was 10.25 mm, and the metal-free copper layer was peeled off in the hundred-square test, and the film thickness test and the pass test were qualified.
• the region of the modified resin composition of the present invention that has been scanned by the laser beam has the ability to deposit metals such as copper, nickel, gold, etc. in the electroless plating process, and the region not scanned by the laser does not have the deposited metal.
• the modified resin composition is insulating, stable in an acidic or alkaline electroless plating solution, and the scanned area of the laser beam is capable of generating a metal core and promoting the electroless plating solution in contact therewith.
• the redox reaction thereby depositing metal, to achieve metallization;
• the selected metal oxide solid solution does not contain heavy metal chromium, has the characteristics of non-toxic and environmental protection, is also stable in the resin matrix, does not chemically react with the resin matrix and other additives
• the reaction is also stable in acidic or alkaline electroless plating water.
• the metal oxide solid solution can withstand a high temperature exceeding 40 CTC, and can form a stable system with the resin matrix without causing degradation of the resin.
• the resin composition of the present invention can be used for making films, and can also be applied to injection molded products, which can be applied to smart phone antennas, notebook computers, automobiles, home appliances, mobile terminals and the like.

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• 2012
  • 2012-09-27 WO PCT/CN2012/082193 patent/WO2014047845A1/fr not_active Ceased

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