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WO2014041470A3 - Heat sink structure and method of manufacturing the same - Google Patents

Heat sink structure and method of manufacturing the same Download PDF

Info

Publication number
WO2014041470A3
WO2014041470A3 PCT/IB2013/058346 IB2013058346W WO2014041470A3 WO 2014041470 A3 WO2014041470 A3 WO 2014041470A3 IB 2013058346 W IB2013058346 W IB 2013058346W WO 2014041470 A3 WO2014041470 A3 WO 2014041470A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
sink structure
sheet material
plastic material
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2013/058346
Other languages
French (fr)
Other versions
WO2014041470A2 (en
Inventor
Reinier Imre Anton DEN BOER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of WO2014041470A2 publication Critical patent/WO2014041470A2/en
Publication of WO2014041470A3 publication Critical patent/WO2014041470A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

A method (100) of manufacturing a heat sink structure (150), and the heat sink structure (150), wherein the method comprises the steps of providing a heat-conductive sheet material (110) and arranging (120) the sheet material in a mould (130). Further, a plastic material (140) is provided in a fluid state and injected (125) into the mould. The method further comprises the step of moulding the plastic material and the sheet material, such that the plastic material and the sheet material are formed by the mould, and wherein the plastic material and the sheet material bond to each other. The method further comprises the step of solidifying the plastic material, such that the plastic material and the sheet material form a heat sink structure (150) wherein the plastic material and the sheet material are thermally connected to each other.
PCT/IB2013/058346 2012-09-11 2013-09-06 Heat sink structure and method of manufacturing the same Ceased WO2014041470A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261699363P 2012-09-11 2012-09-11
US61/699,363 2012-09-11

Publications (2)

Publication Number Publication Date
WO2014041470A2 WO2014041470A2 (en) 2014-03-20
WO2014041470A3 true WO2014041470A3 (en) 2014-05-22

Family

ID=49709763

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2013/058346 Ceased WO2014041470A2 (en) 2012-09-11 2013-09-06 Heat sink structure and method of manufacturing the same

Country Status (1)

Country Link
WO (1) WO2014041470A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3001780A1 (en) * 2014-09-23 2016-03-30 Osram Sylvania Inc. Formable light source and method of making
JP7514137B2 (en) * 2020-07-31 2024-07-10 株式会社日本製鋼所 Molding method and molding system
IT202200002813A1 (en) * 2022-02-16 2023-08-16 Fcs Rd S R L NON ELECTROSTATIC SHEET HANDLING SYSTEM IN PRODUCTION SYSTEMS, PRODUCTION SYSTEM AND RELATED METHOD

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1051172A (en) * 1996-07-31 1998-02-20 Pfu Ltd Electronic device housing and method of manufacturing the same
US6365980B1 (en) * 1999-02-26 2002-04-02 Texas Instruments Incorporated Thermally enhanced semiconductor ball grid array device and method of fabrication
US20080180957A1 (en) * 2007-01-30 2008-07-31 Ult Technology Co., Ltd. Led lampshade injection-molded or pressure cast with an imd film
JP2009202567A (en) * 2008-02-01 2009-09-10 Techno Polymer Co Ltd Manufacturing method of composite comprising resin-made member and metallic member, substrate for mounting led and reflector for mounting led
WO2010005796A2 (en) * 2008-07-09 2010-01-14 Altair Engineering, Inc. Method of forming led-based light and resulting led-based light
JP2011134676A (en) * 2009-12-25 2011-07-07 Kobe Steel Ltd Method of manufacturing led bulb heat dissipation section and led bulb heat dissipation section
US20110170309A1 (en) * 2008-09-16 2011-07-14 Hella Kgaa Reflector in a lighting apparatus of a motor vehicle
WO2012099251A1 (en) * 2011-01-21 2012-07-26 シチズン電子株式会社 Manufacturing method for lighting device and holder
TW201250154A (en) * 2012-07-23 2012-12-16 Kenner Material & System Co Ltd Structure of plastic heat sink for LED bulb and method of making the same
JP2013049258A (en) * 2011-08-30 2013-03-14 Bespack Kk Metal-resin composition composite molded article and led lighting device
WO2013089090A1 (en) * 2011-12-16 2013-06-20 大成プラス株式会社 Heat dissipating member for led bulbs, and manufacturing method therefor
CN103244927A (en) * 2012-07-31 2013-08-14 北京艾久瓦光电科技有限公司 Lamp radiator structure and production method thereof
WO2014023700A1 (en) * 2012-08-07 2014-02-13 Osram Gmbh Lamp housing, method of manufacturing the same, and illuminating device comprising the same

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1051172A (en) * 1996-07-31 1998-02-20 Pfu Ltd Electronic device housing and method of manufacturing the same
US6365980B1 (en) * 1999-02-26 2002-04-02 Texas Instruments Incorporated Thermally enhanced semiconductor ball grid array device and method of fabrication
US20080180957A1 (en) * 2007-01-30 2008-07-31 Ult Technology Co., Ltd. Led lampshade injection-molded or pressure cast with an imd film
JP2009202567A (en) * 2008-02-01 2009-09-10 Techno Polymer Co Ltd Manufacturing method of composite comprising resin-made member and metallic member, substrate for mounting led and reflector for mounting led
WO2010005796A2 (en) * 2008-07-09 2010-01-14 Altair Engineering, Inc. Method of forming led-based light and resulting led-based light
US20110170309A1 (en) * 2008-09-16 2011-07-14 Hella Kgaa Reflector in a lighting apparatus of a motor vehicle
JP2011134676A (en) * 2009-12-25 2011-07-07 Kobe Steel Ltd Method of manufacturing led bulb heat dissipation section and led bulb heat dissipation section
WO2012099251A1 (en) * 2011-01-21 2012-07-26 シチズン電子株式会社 Manufacturing method for lighting device and holder
US20130294085A1 (en) * 2011-01-21 2013-11-07 Masashi Watanabe Lighting device and method manufacturing holder of lighting device
JP2013049258A (en) * 2011-08-30 2013-03-14 Bespack Kk Metal-resin composition composite molded article and led lighting device
WO2013089090A1 (en) * 2011-12-16 2013-06-20 大成プラス株式会社 Heat dissipating member for led bulbs, and manufacturing method therefor
TW201250154A (en) * 2012-07-23 2012-12-16 Kenner Material & System Co Ltd Structure of plastic heat sink for LED bulb and method of making the same
CN103244927A (en) * 2012-07-31 2013-08-14 北京艾久瓦光电科技有限公司 Lamp radiator structure and production method thereof
WO2014023700A1 (en) * 2012-08-07 2014-02-13 Osram Gmbh Lamp housing, method of manufacturing the same, and illuminating device comprising the same

Also Published As

Publication number Publication date
WO2014041470A2 (en) 2014-03-20

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