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WO2013117438A3 - Verbindungsanordnung eines elektrischen und/oder elektronischen bauelements - Google Patents

Verbindungsanordnung eines elektrischen und/oder elektronischen bauelements Download PDF

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Publication number
WO2013117438A3
WO2013117438A3 PCT/EP2013/051400 EP2013051400W WO2013117438A3 WO 2013117438 A3 WO2013117438 A3 WO 2013117438A3 EP 2013051400 W EP2013051400 W EP 2013051400W WO 2013117438 A3 WO2013117438 A3 WO 2013117438A3
Authority
WO
WIPO (PCT)
Prior art keywords
connection
electric
electronic component
layer
connection arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2013/051400
Other languages
English (en)
French (fr)
Other versions
WO2013117438A2 (de
Inventor
Christiane FRUEH
Andreas Fix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to US14/377,895 priority Critical patent/US9177934B2/en
Priority to CN201380008409.1A priority patent/CN104094387B/zh
Priority to EP13702765.2A priority patent/EP2812912A2/de
Publication of WO2013117438A2 publication Critical patent/WO2013117438A2/de
Publication of WO2013117438A3 publication Critical patent/WO2013117438A3/de
Anticipated expiration legal-status Critical
Priority to US14/834,569 priority patent/US20160064350A1/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Die Bonding (AREA)

Abstract

Die Verbindungsanordnung (100, 200, 300, 400) umfasst mindestens ein elektrisches und/oder elektronisches Bauelement (1). Das mindestens eine elektrische und/oder elektronische Bauelement (10) weist mindestens eine Anschlussfläche (11) auf, welche mittels einer Verbindungsschicht (20) mit einem Fügepartner (40) stoffschlüssig verbunden ist. Die Verbindungsschicht (20) kann beispielsweise eine Klebe-, Lot-, Schweiß-, Sinterverbindung oder eine andere bekannte Verbindung sein, welche Fügepartner unter Ausbildung eines Stoffschlusses verbindet. Des Weiteren ist angrenzend zur Verbindungsschicht (20) stoffschlüssig eine Verstärkungsschicht (30') angeordnet. Die Verstärkungsschicht (30') weist einen höheren Elastizitätsmodul auf, als die Verbindungsschicht (20). Eine besonders große Schutzwirkung ist dadurch gegeben, wenn die Verstärkungsschicht (30') durch eine äußere und eine innere Begrenzung (36, 35) rahmenartig ausgebildet ist und zumindest mit ihrer äußeren Begrenzung (36) die Anschlussfläche (11) des mindesten einen elektrischen und/oder elektronischen Bauelements (10) umschließt.
PCT/EP2013/051400 2012-02-09 2013-01-25 Verbindungsanordnung eines elektrischen und/oder elektronischen bauelements Ceased WO2013117438A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US14/377,895 US9177934B2 (en) 2012-02-09 2013-01-25 Connection arrangement of an electric and/or electronic component
CN201380008409.1A CN104094387B (zh) 2012-02-09 2013-01-25 电气元件和/或电子元件的连接装置
EP13702765.2A EP2812912A2 (de) 2012-02-09 2013-01-25 Verbindungsanordnung eines elektrischen und/oder elektronischen bauelements
US14/834,569 US20160064350A1 (en) 2012-02-09 2015-08-25 Connection arrangement of an electric and/or electronic component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012201935A DE102012201935A1 (de) 2012-02-09 2012-02-09 Verbindungsanordnung eines elektrischen und/oder elektronischen Bauelements
DE102012201935.9 2012-02-09

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US14/377,895 A-371-Of-International US9177934B2 (en) 2012-02-09 2013-01-25 Connection arrangement of an electric and/or electronic component
US14/834,569 Continuation US20160064350A1 (en) 2012-02-09 2015-08-25 Connection arrangement of an electric and/or electronic component

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WO2013117438A2 WO2013117438A2 (de) 2013-08-15
WO2013117438A3 true WO2013117438A3 (de) 2013-10-03

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US (2) US9177934B2 (de)
EP (1) EP2812912A2 (de)
CN (1) CN104094387B (de)
DE (1) DE102012201935A1 (de)
WO (1) WO2013117438A2 (de)

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JP2015115481A (ja) * 2013-12-12 2015-06-22 株式会社東芝 半導体部品および半導体部品の製造方法
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DE102015200989A1 (de) * 2015-01-22 2016-07-28 Robert Bosch Gmbh Verbindungsanordnung zwischen einem Trägerelement und einem elektronischen Schaltungsbauteil und Schaltungsträger
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KR20170059833A (ko) * 2015-11-23 2017-05-31 삼성전기주식회사 스트립기판 및 그 제조 방법
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US20160064350A1 (en) 2016-03-03
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US20150014865A1 (en) 2015-01-15
US9177934B2 (en) 2015-11-03

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