[go: up one dir, main page]

WO2013108842A1 - Particules conductrices, matériau conducteur et structure de connexion - Google Patents

Particules conductrices, matériau conducteur et structure de connexion Download PDF

Info

Publication number
WO2013108842A1
WO2013108842A1 PCT/JP2013/050821 JP2013050821W WO2013108842A1 WO 2013108842 A1 WO2013108842 A1 WO 2013108842A1 JP 2013050821 W JP2013050821 W JP 2013050821W WO 2013108842 A1 WO2013108842 A1 WO 2013108842A1
Authority
WO
WIPO (PCT)
Prior art keywords
particles
conductive
conductive layer
weight
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/050821
Other languages
English (en)
Japanese (ja)
Inventor
暁舸 王
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to CN201380002678.7A priority Critical patent/CN103782351B/zh
Priority to KR1020147001315A priority patent/KR101953937B1/ko
Priority to JP2013503316A priority patent/JP6165625B2/ja
Publication of WO2013108842A1 publication Critical patent/WO2013108842A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances

Definitions

  • an ICP emission spectrometer When measuring the contents of nickel, phosphorus and palladium in the first and second conductive layers, an ICP emission spectrometer may be used. Examples of commercially available ICP emission analyzers include ICP emission analyzers manufactured by HORIBA.
  • the shape of the core substance is not particularly limited.
  • the shape of the core substance is preferably a lump.
  • Examples of the core substance include a particulate lump, an agglomerate in which a plurality of fine particles are aggregated, and an irregular lump.
  • the conductive material according to the present invention includes the conductive particles described above and a binder resin.
  • the conductive particles are preferably dispersed in a binder resin and used as a conductive material.
  • the conductive material is preferably an anisotropic conductive material.
  • the anisotropic conductive material includes a conductive material for conducting between the upper and lower electrodes.
  • An initial nickel solution containing 10% by weight of nickel sulfate, 10% by weight of sodium hypophosphite, 4% by weight of sodium hydroxide and 20% by weight of sodium succinate was prepared. After heating the slurry adjusted to pH 6.5 to 80 ° C., the nickel solution is continuously added dropwise to the slurry at a flow rate of 5 mL / min for 10 minutes, and the plating reaction proceeds by stirring for 20 minutes. I let you. After confirming that hydrogen was no longer generated, the plating reaction was completed.
  • connection resistance Two substrates on which copper electrodes with L / S of 100 ⁇ m / 100 ⁇ m were formed were prepared.
  • an anisotropy containing 10 parts by weight of the obtained conductive particles, 85 parts by weight of an epoxy resin (“Mitsui Chemical Co., Ltd.“ Struct Bond XN-5A ”) as a binder resin, and 5 parts by weight of an imidazole type curing agent.
  • a conductive paste was prepared.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
PCT/JP2013/050821 2012-01-20 2013-01-17 Particules conductrices, matériau conducteur et structure de connexion Ceased WO2013108842A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201380002678.7A CN103782351B (zh) 2012-01-20 2013-01-17 导电性粒子、导电材料及连接结构体
KR1020147001315A KR101953937B1 (ko) 2012-01-20 2013-01-17 도전성 입자, 도전 재료 및 접속 구조체
JP2013503316A JP6165625B2 (ja) 2012-01-20 2013-01-17 導電性粒子、導電材料及び接続構造体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012010197 2012-01-20
JP2012-010197 2012-01-20

Publications (1)

Publication Number Publication Date
WO2013108842A1 true WO2013108842A1 (fr) 2013-07-25

Family

ID=48799265

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/050821 Ceased WO2013108842A1 (fr) 2012-01-20 2013-01-17 Particules conductrices, matériau conducteur et structure de connexion

Country Status (4)

Country Link
JP (1) JP6165625B2 (fr)
KR (1) KR101953937B1 (fr)
CN (1) CN103782351B (fr)
WO (1) WO2013108842A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013108843A1 (ja) * 2012-01-20 2015-05-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR20240033287A (ko) 2021-08-02 2024-03-12 니폰 가가쿠 고교 가부시키가이샤 도전성 입자, 그 제조 방법 및 도전성 재료

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740807B (zh) * 2014-10-29 2021-10-01 日商迪睿合股份有限公司 導電材料、連接構造體、及連接構造體之製造方法
KR102164893B1 (ko) * 2015-09-30 2020-10-13 덕산하이메탈(주) 합금도전입자, 그 제조방법 및 이를 포함하는 도전성 재료
WO2017138521A1 (fr) * 2016-02-08 2017-08-17 積水化学工業株式会社 Particules conductrices, matériau conducteur et structure connectée
KR102584161B1 (ko) * 2017-05-01 2023-10-04 세키스이가가쿠 고교가부시키가이샤 수지 입자, 접속 재료 및 접속 구조체

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006228475A (ja) * 2005-02-15 2006-08-31 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2010073578A (ja) * 2008-09-19 2010-04-02 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2011175951A (ja) * 2009-08-06 2011-09-08 Hitachi Chem Co Ltd 導電性微粒子及び異方性導電材料
WO2011111152A1 (fr) * 2010-03-08 2011-09-15 積水化学工業株式会社 Particule électroconductrice, matériau électroconducteur anisotrope et structure de connexion
JP2012004034A (ja) * 2010-06-18 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2012004033A (ja) * 2010-06-18 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2012178270A (ja) * 2011-02-25 2012-09-13 Hitachi Chem Co Ltd 導電粒子及びその製造方法、接着剤組成物、回路接続材料、接続構造体、並びに回路部材の接続方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103765527B (zh) * 2012-01-20 2017-12-19 积水化学工业株式会社 导电性粒子、导电材料及连接结构体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006228475A (ja) * 2005-02-15 2006-08-31 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2010073578A (ja) * 2008-09-19 2010-04-02 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2011175951A (ja) * 2009-08-06 2011-09-08 Hitachi Chem Co Ltd 導電性微粒子及び異方性導電材料
WO2011111152A1 (fr) * 2010-03-08 2011-09-15 積水化学工業株式会社 Particule électroconductrice, matériau électroconducteur anisotrope et structure de connexion
JP2012004034A (ja) * 2010-06-18 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2012004033A (ja) * 2010-06-18 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2012178270A (ja) * 2011-02-25 2012-09-13 Hitachi Chem Co Ltd 導電粒子及びその製造方法、接着剤組成物、回路接続材料、接続構造体、並びに回路部材の接続方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013108843A1 (ja) * 2012-01-20 2015-05-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR20240033287A (ko) 2021-08-02 2024-03-12 니폰 가가쿠 고교 가부시키가이샤 도전성 입자, 그 제조 방법 및 도전성 재료

Also Published As

Publication number Publication date
JP6165625B2 (ja) 2017-07-19
CN103782351A (zh) 2014-05-07
KR20140114806A (ko) 2014-09-29
KR101953937B1 (ko) 2019-03-04
CN103782351B (zh) 2016-07-06
JPWO2013108842A1 (ja) 2015-05-11

Similar Documents

Publication Publication Date Title
JP6165626B2 (ja) 導電性粒子、導電材料及び接続構造体
JP6475805B2 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP5114607B2 (ja) 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体
JP5054232B2 (ja) 導電性粒子、異方性導電材料及び接続構造体
JP6165625B2 (ja) 導電性粒子、導電材料及び接続構造体
JP6276351B2 (ja) 導電性粒子、導電材料及び接続構造体
JP5636118B2 (ja) 導電性粒子、導電材料及び接続構造体
JP6151990B2 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP2016154139A (ja) 導電性粒子粉体、導電性粒子粉体の製造方法、導電材料及び接続構造体
JP6066734B2 (ja) 導電性粒子、導電材料及び接続構造体

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2013503316

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13738692

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20147001315

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13738692

Country of ref document: EP

Kind code of ref document: A1