WO2013185490A1

WO2013185490A1 - Plug frame and back shielding plate thereof

Info

Publication number: WO2013185490A1
Application number: PCT/CN2013/071116
Authority: WO
Inventors: 叶玲; 戴养哩; 裴欢
Original assignee: 华为技术有限公司
Priority date: 2012-06-13
Filing date: 2013-01-30
Publication date: 2013-12-19
Also published as: CN102724858A; CN102724858B

Abstract

A back shielding plate is provided with a number of heat radiating holes, where the heat radiating holes are waveguide holes with waveguide characteristics. The heat radiating holes arranged on the back shielding plate have heat radiating function, and for they are waveguide holes with waveguide characteristics they can simultaneously make the back shielding plate installed on a plug frame possess shielding function according to the shielding attenuation characteristics of the waveguide holes to prevent electromagnetic signal interference between electronic devices. The solution of the present invention can resolve the heat radiating and the shielding problems simultaneously.

Description

Insert frame and shielding back plate

This application claims priority to Chinese Patent Application No. 201210194816.3, entitled "A Socket and Shielding Backplane" thereof, which is filed on June 13, 2012, the entire contents of which are incorporated herein by reference. In the application.

Technical field

The present invention relates to the field of shielding backplanes, and in particular, to a subrack and a shielding backplane thereof. Background technique

The subrack refers to the frame structure used to install and fix the backplane and the veneer. The board is a combination of a circuit board and a mounting member. The back board is used to connect the boards and provides physical channels for signal transmission between boards. It is usually installed in the subrack.

In order to prevent the interference of electromagnetic signals between electronic devices, the general frame needs to be shielded. At present, the backplane is usually seamlessly connected by a conductive cloth and a frame to form a shield or to realize a partitioned screen in the frame.

The prior art generally uses a back plate and a frame to form a shield for shielding. However, with the rapid development of the communication industry and the increasing demand for information services, the current power consumption of devices is increasing. Due to the requirement of heat dissipation, large holes need to be opened for heat dissipation on the backplane. However, openings are made on the backplane. The heat dissipation destroys the shield formed by the original backboard and the insert frame.

Therefore, how to solve the problem of heat dissipation and shielding at the same time becomes an important technical problem to be solved by those skilled in the art. Summary of the invention

Embodiments of the present invention provide a shield backplane to simultaneously solve the problems of heat dissipation and shielding.

To achieve the above object, the present invention provides the following technical solutions:

A shielding backplane is provided with a plurality of heat dissipation holes, and the heat dissipation holes are waveguide holes having a waveguide property.

The embodiment of the invention further provides a splicing frame, which comprises a splicing frame body and a backing plate disposed on the splicing frame body, wherein the backing plate is the shielding backing plate according to any one of the preceding claims.

It can be seen from the above technical solution that the shielding backplane provided by the embodiment of the present invention passes through the shielding A heat dissipation hole is formed on the back plate to have a heat dissipation function to meet the heat dissipation requirement; the heat dissipation hole is a waveguide hole having a waveguide characteristic, and the back plate mounted on the insertion frame is shielded according to the shielding attenuation characteristic of the waveguide hole. The effectiveness of the shield has prevented interference from electromagnetic signals between electronic devices. In the embodiment of the present invention, by designing a special shielding backboard, it is not necessary to provide a shielding accessory on the outer side of the insertion frame, and the same double effect of heat dissipation and shielding can be achieved, so that the solution is solved under the premise of ensuring heat dissipation and preventing electromagnetic signal interference between devices. There are defects in the technology that take up a lot of space.

The insertion frame provided by the embodiment of the present invention has the above-mentioned shielding backplane, and therefore has all the technical effects of the above-mentioned shielding backplane, and details are not described herein again. DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any creative work.

1 is a cross-sectional structural view of a waveguide hole according to an embodiment of the present invention;

2 is a schematic structural diagram of a waveguide hole according to an embodiment of the present invention;

3 is a schematic structural diagram of a shielding backplane according to an embodiment of the present invention;

4 is a schematic structural view of a shielded backplane having a circular waveguide hole according to an embodiment of the present invention; FIG. 5 is a schematic structural diagram of a shielded backplane having a square waveguide hole according to an embodiment of the present invention; FIG. 7 is a schematic structural diagram of a circular waveguide hole arrangement manner according to an embodiment of the present invention; FIG. 8 is a schematic structural diagram of a square waveguide hole according to an embodiment of the present invention; ;

FIG. 9 is a schematic structural diagram of a hexagonal waveguide hole arrangement manner according to an embodiment of the present invention; FIG. 10 is a schematic structural diagram of a circular waveguide hole arrangement manner according to another embodiment of the present invention; FIG. 12 is a schematic structural diagram of a circular waveguide hole arrangement manner according to still another embodiment of the present invention. detailed description

The embodiment of the invention discloses a shielding backplane to solve the problems of heat dissipation and shielding at the same time. The embodiment of the invention also discloses a insert frame having the above shielding back plate.

BRIEF DESCRIPTION OF THE DRAWINGS The technical solutions in the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without the creative work are all within the scope of the present invention.

FIG. 1 is a cross-sectional structural view of a waveguide hole according to an embodiment of the present invention; FIG. 2 is a schematic structural view of a waveguide hole according to an embodiment of the present invention, and FIG. Schematic diagram of the back plate.

The shielding backplane provided by the embodiment of the present invention is a backing board having a shielding function. The so-called backing board is used to connect the single board, and provides a physical channel for signal transmission between the boards, and is usually installed in the inserting frame. A plurality of heat dissipation holes are formed in the shielding back plate 1 to achieve the purpose of dissipating heat of the shielding back plate. In this embodiment, the number of the heat dissipation holes is not limited, and may be arbitrary, and the shape and size of the heat dissipation holes are not limited, and the size and size of the heat dissipation holes may be designed according to the actual heat dissipation. The focus of the embodiment of the present invention is that the heat dissipation holes are waveguide holes 2 having waveguide characteristics.

The shielding backplane provided by the embodiment of the invention has a heat dissipation hole formed on the shielding back plate 1 to have a heat dissipation function, and meets the heat dissipation requirement; the heat dissipation hole is a waveguide hole 2 having a waveguide characteristic, and shielding according to the waveguide hole The attenuation characteristics enable the backplane mounted on the subrack to form a shielding body with shielding effectiveness, which has prevented electromagnetic signal interference between electronic devices. In the embodiment of the present invention, by designing a special shielding backboard, it is not necessary to provide a shielding accessory on the outer side of the insertion frame, and the same double effect of heat dissipation and shielding can be achieved, so that the solution is solved under the premise of ensuring heat dissipation and preventing electromagnetic signal interference between devices. There are defects in the technology that take up a lot of space.

In an embodiment of the invention, the connection properties of the surface layer, the bottom layer and the inner wall of the waveguide hole 2 are all GND (ground, representing ground or 0 line) properties. The cutoff frequency of the circular waveguide (ie, the cross section of the waveguide hole is circular) fc=6.9 x 109/d Hz. According to the electromagnetic field theory, as long as the operating frequency is much smaller than the waveguide cutoff frequency fc, the magnetic shielding effectiveness of the circular waveguide is S= 32t/d dB, where d is the diameter of the waveguide hole and t is the length of the waveguide hole.

The cutoff frequency of the rectangular waveguide (ie, the cross section of the waveguide hole is square) is fc=5.9*109/d Hz, and accordingly, the shielding effect of the rectangular waveguide is S=27.2 t/d dB, where d is the side length of the waveguide hole, t The length of the waveguide hole. The above description only shows the shielding effect formulas of the two types of waveguides, and those skilled in the art can understand that other shape waveguides also have a shielding effect, and the corresponding shielding effects can be calculated according to the corresponding formulas in the prior art, and for other types of waveguides. The shielding effect formula is no longer - enumerated. The embodiment of the invention can select the opening and the opening size of different shapes by the cutoff frequency of different shape openings and the calculation formula of the screen effect, so as to meet the requirements of different shielding effectiveness.

As shown in FIG. 2, the surface layer GND21 of the waveguide hole 2 is connected to the surface GND plane of the shield backplane, and the bottom layer GND23 of the waveguide hole 2 is connected to the bottom GND plane of the shield backplane, and the inner wall GND22 of the waveguide hole 2 is respectively connected to the waveguide hole. The surface layer GND21 of the second layer is connected to the bottom layer GND23 of the waveguide hole 2 to ensure the continuity of the overall GND.

That is, in the embodiment, the implementation method of the PCB metallized waveguide hole having the waveguide shielding property: a) the surface layer and the bottom layer connection property of the heat dissipation hole are set to GND;

b) the inner wall of the heat dissipation hole is metallized copper plating (that is, the inner wall of the heat dissipation hole has a metallized copper plating layer) and the connection property is also set to GND;

c) The surface layer of the heat dissipation hole, the bottom layer and the GND of the inner wall of the hole are connected to the surface layer of the back plate and the GND plane of the bottom layer to ensure the continuity of the overall GND, thereby forming the waveguide hole 2 with shielding effect.

Referring to FIG. 4 and FIG. 6 , FIG. 4 is a schematic structural diagram of a shield backplane having a circular waveguide hole according to an embodiment of the present invention; FIG. 5 is a schematic structural diagram of a shield backplane having a square waveguide hole according to an embodiment of the present invention; FIG. 6 is a schematic structural diagram of a shield backplane having a hexagonal waveguide hole according to an embodiment of the present invention.

In this embodiment, the waveguide hole 2 may be a circular hole as shown in FIG. 4, a square hole as shown in FIG. 5, and a regular hexagonal hole as shown in FIG. 6, and may also be a rectangular hole, a rounded square hole, and a rounded corner. Rectangular or shaped holes. That is, the shape of the waveguide hole disclosed in this embodiment may be any polygonal hole, curved hole or other irregular shaped hole. The shape of the waveguide hole is not limited in the embodiment of the present invention.

Referring to FIG. 7 and FIG. 12, FIG. 7 is a schematic structural diagram of a circular waveguide hole arrangement according to an embodiment of the present invention; FIG. 8 is a schematic structural diagram of a square waveguide hole according to an embodiment of the present invention; FIG. 10 is a schematic structural view of a circular waveguide hole arrangement according to another embodiment of the present invention; FIG. 11 is a circular waveguide hole arrangement according to still another embodiment of the present invention. FIG. 12 is a schematic structural diagram of a circular waveguide hole arrangement manner according to still another embodiment of the present invention. In this embodiment, there are a plurality of waveguide holes 2, and the plurality of waveguide holes 2 have the same structure, and the square array or the rectangular array disclosed in FIG. 4, FIG. 5 and FIG. 6 may also be the trapezoidal array shown in FIG. The triangular array shown in Fig. 11, the diamond array shown in Figs. 7-9, the circular array, or the irregular array arrangement shown in Fig. 12 is arranged. That is, the plurality of waveguide holes 2 disclosed in the embodiments of the present invention may be arranged in an array manner or in an irregular arrangement, wherein the array mode may be any, and a plurality of array arrangements may be disposed on one shield back plate 1. The embodiment of the present invention is not limited.

In another embodiment of the present invention, there are a plurality of waveguide holes 2, and the plurality of waveguide holes 2 are different in structure, that is, two or more shapes of waveguide holes 2 may be arranged on the same shield backplane 1, as in the same Two or more of a circular hole, a square hole, a rectangular hole, a regular hexagonal hole, a rounded square hole, a rounded rectangular hole, and a shaped hole are arranged on the shield back plate 1.

In another embodiment of the present invention, the plurality of waveguide holes have the same shape and different sizes, that is, waveguide holes 2 of the same shape, such as circular waveguide holes, may be disposed on the same shield back plate 1, but the diameter of the circular waveguide holes may be different.

In this embodiment, the thickness of the shield backplane is a thickness that can be achieved by a PCB (Printed Circuit Board) production process, such as a thickness of 0.5 mm to 50 mm.

The subrack provided by the embodiment of the present invention includes a subrack and a backplane disposed on the main body of the subrack. The backplane is a shield backplane as disclosed in the foregoing embodiment. The splicing frame provided by the embodiment of the present invention is the same as the shielding backplane disclosed in the above embodiment, and therefore all the technical effects of the above-mentioned shielding backplane are referred to, and the description will be omitted herein.

The various embodiments in the present specification are described in a progressive manner, and each embodiment focuses on differences from other embodiments, and the same similar parts between the various embodiments can be referred to each other.

The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments are obvious to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded to the broadest scope of the principles and novel features disclosed herein.

Claims

Rights request

1. A shielding backplane, characterized in that, the shielding backplane (1) is provided with a number of heat dissipation holes, and the heat dissipation holes are waveguide holes (2) with waveguide characteristics.

2. The shielded backplane according to claim 1, characterized in that the connection attributes of the surface layer, bottom layer and inner wall of the waveguide hole (2) are all GND attributes.

3. The shielding backplane according to claim 2, characterized in that the surface GND (21) of the waveguide hole (2) is connected to the surface GND plane of the shielding backplane;

The bottom GND (23) of the waveguide hole (2) is connected to the bottom GND plane of the shielding backplane;

The inner wall GND (22) of the waveguide hole (2) is connected to the surface layer GND (21) of the waveguide hole (2) and the bottom layer GND (23) of the waveguide hole (2) respectively.

4. The shielding backplane according to claim 2, characterized in that the inner wall of the waveguide hole (2) has a metallized copper plating layer.

5. The shielded backplane according to any one of claims 1 to 4, characterized in that the waveguide hole (2) is a round hole, a square hole, a rectangular hole, a regular hexagonal hole, a rounded square hole, or a round hole. Corner rectangular hole or special-shaped hole.

6. The shielding backplane according to any one of claims 1 to 4, characterized in that there are a plurality of waveguide holes (2), and the plurality of waveguide holes (2) have the same structure and are arranged along a square array. Arranged in the form of rectangular array, trapezoidal array, triangular array, rhombus array, circular array or special-shaped array.

7. The shielding backplate according to any one of claims 1 to 4, characterized in that there are a plurality of waveguide holes (2), and the plurality of waveguide holes (2) have different structures.

8. The shielding backplane according to claim 7, characterized in that the plurality of waveguide holes (2) have different shapes, or have the same shape and different sizes.

9. The shielding backplane according to any one of claims 1 to 7, characterized in that, the shielding backplane

(1) The thickness is 0.5mm-50mm.

10. A plug-in frame, including a plug-in frame body and a backplane provided on the plug-in frame body, characterized by: In this case, the backplane is a shielded backplane as described in any one of claims 1-9 _.