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WO2013175682A1 - Source de lumière pour éclairage et appareil d'éclairage - Google Patents

Source de lumière pour éclairage et appareil d'éclairage Download PDF

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Publication number
WO2013175682A1
WO2013175682A1 PCT/JP2013/001440 JP2013001440W WO2013175682A1 WO 2013175682 A1 WO2013175682 A1 WO 2013175682A1 JP 2013001440 W JP2013001440 W JP 2013001440W WO 2013175682 A1 WO2013175682 A1 WO 2013175682A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead wire
circuit
light source
base
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/001440
Other languages
English (en)
Japanese (ja)
Inventor
俊明 磯貝
和繁 杉田
昭悟 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2013533028A priority Critical patent/JP5374003B1/ja
Publication of WO2013175682A1 publication Critical patent/WO2013175682A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10537—Attached components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Definitions

  • the present invention relates to an illumination light source and an illumination device, and particularly to an illumination light source including a light emitting element such as a light emitting diode (LED) and an illumination device using the illumination light source.
  • a light emitting element such as a light emitting diode (LED)
  • LED light emitting diode
  • LEDs are used in various products as highly efficient and space-saving light sources. Among them, LED lamps using LEDs are being researched and developed as alternative illumination light sources for conventionally known fluorescent lamps and incandescent bulbs.
  • a straight tube type LED lamp (straight tube type LED lamp) that replaces a straight tube type fluorescent lamp having electrode coils at both ends, or a light bulb type having an arc tube having electrode coils at both ends.
  • bulb-type LED lamps bulb-shaped LED lamps
  • Patent Document 1 discloses a straight tube LED lamp.
  • Patent Document 2 discloses a bulb-type LED lamp.
  • the LED lamp has a built-in drive circuit (lighting circuit) for lighting the LED.
  • the drive circuit converts, for example, AC power from the base into DC power and supplies it to the LED.
  • Power supply from the base to the drive circuit or power supply from the drive circuit to the LED is generally performed via a lead wire.
  • the lead wire is connected at a predetermined location on the circuit board constituting the drive circuit. For example, the core wire (metal part) of the lead wire and the metal wiring of the circuit board are soldered.
  • Such wire breakage occurs in the LED lamp assembly process.
  • the drive circuit may be inserted into the lamp housing and the lead wire may be pulled out or pushed back to a desired position.
  • the line breaks due to.
  • LED lamps have a limited space in the lamp housing, so that the lead wire is bent not only during the above process but also during other processes, and a load is applied to the root of the lead wire. There are many.
  • wire breakage may occur even after completing the LED lamp.
  • a load may be applied to the root of the lead wire due to vibration or impact when transporting the completed LED lamp, or vibration or impact when the LED lamp is attached to a lighting fixture, and the lead wire may be broken. sell.
  • the lead wire is broken.
  • this small LED lamp is difficult to assemble because the inside of the lamp housing is extremely narrow, and lead wires are frequently disconnected. Further, in this small LED lamp, since a thin lead wire is used, the lead wire is broken even with a slight load.
  • the lead wire is connected as described above. Push back to adjust the lead length.
  • the lead wire cannot be pushed back. It is conceivable to shorten the lead wire in advance so that such a problem does not occur.
  • the lead wire is simply shortened, wire breakage is likely to occur. In other words, when trying to push back the lead wire, a load is easily applied to the root of the lead wire, resulting in wire breakage.
  • This invention was made in order to solve the said subject, and it aims at providing the light source and the illuminating device for illumination which suppress the disconnection defect of a lead wire.
  • a light source for illumination includes a light emitting module having a light emitting element, a circuit board, and a circuit element connected to the circuit board.
  • Drive circuit a lead wire connected to the circuit board, and a fixing member for fixing the lead wire and the circuit element.
  • the fixing member is preferably provided so as to surround the lead wire and the circuit element.
  • the fixing member is preferably a heat shrinkable tube.
  • the fixing member is not in contact with a connection portion between the lead wire and the circuit board.
  • the circuit element includes a plurality of circuit elements, and the lead wire is located closest to a connection portion between the lead wire and the circuit board among the plurality of circuit elements. It is preferable to be fixed to the mounted circuit element.
  • the lead wire is fixed to the circuit element having a terminal having the same potential as the lead wire.
  • one end of the lead wire passes through the circuit board from the first main surface of the circuit board and is opposed to the first main surface.
  • the other end of the lead wire may be drawn out to the second main surface side.
  • the light emitting module is positioned above the second main surface of the circuit board, and the lead wire electrically connects the light emitting module and the drive circuit. It can be said that it is an electric wire for connecting to.
  • the lead wire may be an electric wire coated with a resin material of a copper alloy.
  • a case for accommodating the drive circuit may be further provided.
  • the light source further includes a globe that covers the light emitting module, and a base that receives power for causing the light emitting module to emit light. It can be configured to be supplied to a circuit.
  • the base may be an E26 base, and the size of the circuit board may be ⁇ 40 mm or less.
  • the base may be an E17 base, and the size of the circuit board may be ⁇ 25 mm or less.
  • the contact surface of the circuit element to which the lead wire is fixed with the fixing member is a curved surface.
  • the circuit element to which the lead wire is fixed may be a ceramic capacitor.
  • the lead wire is two electric wires for electrically connecting the light emitting module and the drive circuit, and the circuit element is the light emitting element. It is preferable that the two electric wires are fixed to the output-side smoothing capacitor.
  • an aspect of the illumination device according to the present invention includes any one aspect of the illumination light source.
  • the disconnection failure of the lead wire can be suppressed. Thereby, it is possible to suppress the occurrence of unsafe operation of the illumination light source.
  • FIG. 1 is a cross-sectional view of a light bulb shaped lamp according to Embodiment 1 of the present invention.
  • FIG. 2 is a diagram showing a configuration of a drive circuit and lead wires in the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • 3A and 3B are diagrams showing the relationship between circuit elements and lead wires in the driving circuit for the light bulb shaped lamp according to Embodiment 1 of the present invention, wherein FIG. 3A is a top view thereof, and FIG. 3B is a left side view thereof.
  • FIG. 2C is a front view thereof.
  • FIG. 4 is a diagram for explaining a method of fixing circuit elements and lead wires in the driving circuit for the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • FIG. 5A is a diagram showing a configuration of a drive circuit and lead wires in a light bulb shaped lamp according to a modification of the first embodiment of the present invention.
  • FIG. 5B is a circuit diagram of a drive circuit in a light bulb shaped lamp according to a modification of Embodiment 1 of the present invention.
  • FIG. 6 is a cross-sectional view of a light bulb shaped lamp according to Embodiment 2 of the present invention.
  • FIG. 7 is a cross-sectional view of a light bulb shaped lamp according to Embodiment 3 of the present invention.
  • FIG. 8 is a cross-sectional view of a light bulb shaped lamp according to Embodiment 4 of the present invention.
  • FIG. 9 is a schematic cross-sectional view of an illumination apparatus according to Embodiment 5 of the present invention.
  • a bulb-type LED lamp will be described as an example of an illumination light source.
  • FIG. 1 is a cross-sectional view of a light bulb shaped lamp according to Embodiment 1 of the present invention.
  • the drive circuit 120 is not a sectional view but a side view.
  • the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J (center axis) of the bulb-type LED lamp.
  • the lamp axis J and the globe axis are one. I'm doing it.
  • the lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 100 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base 180.
  • a light bulb shaped lamp 100 is a light bulb shaped LED lamp that is a substitute for a light bulb shaped fluorescent lamp or an incandescent light bulb, and includes a light emitting module 110 as a light source, and a light emitting module 110.
  • a driving circuit 120 for supplying predetermined power to the driving circuit 120 and a lead wire 130 connected to the circuit board 121 of the driving circuit 120 are provided.
  • the light bulb shaped lamp 100 further covers a globe 140 that covers the light emitting module 110, a base 150 on which the light emitting module 110 is mounted, a circuit case 160 that houses the drive circuit 120, and the circuit case 160.
  • a housing 170 and a base 180 that receives power from the outside are provided.
  • an envelope is configured by the globe 140, the housing 170, and the base 180.
  • the light emitting module 110 is an LED module having a light emitting element, and is disposed inside the globe 140.
  • the light emitting module 110 includes a mounting substrate 111, a semiconductor light emitting element 112 mounted on the mounting substrate 111, and a sealing body 113 formed on the mounting substrate 111.
  • the mounting substrate 111 is a base for mounting the semiconductor light emitting element 112.
  • the mounting substrate 111 is attached on the base 150.
  • a ceramic substrate made of alumina or the like which is a substantially square plate-like substrate in plan view can be used.
  • a plurality of semiconductor light emitting elements 112 are mounted on one surface of the mounting substrate 111.
  • the semiconductor light emitting element 112 is, for example, an LED (LED chip).
  • the number of semiconductor light emitting elements 112 is not limited to a plurality, and may be one.
  • the light emitting module 110 is provided with a pair of electrodes (not shown) electrically connected to a pair of lead wires 130a and 130b led out from the power output unit of the drive circuit 120. When the DC power is supplied to the semiconductor light emitting device 112, the semiconductor light emitting device 112 emits light.
  • the sealing body 113 is a sealing member that seals the semiconductor light emitting element 112. In the present embodiment, all the semiconductor light emitting elements 112 are collectively sealed.
  • the sealing body 113 is mainly made of a light-transmitting material, but when it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element 112 to a predetermined wavelength, the wavelength for converting the wavelength of light.
  • a conversion material is mixed into the translucent material.
  • the translucent material for example, a resin such as a silicone resin can be used.
  • the wavelength conversion material for example, phosphor particles can be used.
  • the sealing body 113 can be comprised as fluorescent substance containing resin.
  • a blue LED chip that emits blue light is used as the semiconductor light emitting element 112, and phosphor particles (for example, YAG-based ones) that convert the wavelength of blue light into yellow light are used as the sealing body 113. Phosphor particles) and a translucent resin material into which the phosphor particles are mixed.
  • Phosphor particles and a translucent resin material into which the phosphor particles are mixed.
  • the driving circuit (circuit unit) 120 is a lighting circuit for lighting (emitting) the semiconductor light emitting element 112 of the light emitting module 110 and supplies predetermined power to the light emitting module 110.
  • the drive circuit 120 converts AC power supplied from the base 180 via the pair of lead wires 130c and 130d into DC power, and the DC power is supplied to the light emitting module 110 via the pair of lead wires 130a and 130b. Supply.
  • the drive circuit 120 includes a circuit board 121 and a plurality of circuit elements (electronic components) 122 connected to the circuit board 121.
  • the circuit board 121 is a printed board on which metal wiring is patterned, and electrically connects the plurality of circuit elements 122 mounted on the circuit board 121 and also connects the plurality of circuit elements 122 and the lead wires 130a to 130b. And electrically connect.
  • the circuit board 121 is arranged such that the first main surface 121a and the second main surface 121b are parallel to the lamp axis J.
  • the circuit element 122 is, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, integrated circuit elements, or the like.
  • Each of the circuit elements 122 is mounted on the first main surface 121a of the circuit board 121 or the second main surface 121b opposite to the first main surface 121a.
  • a ceramic capacitor, an electrolytic capacitor, or the like is used.
  • the relatively tall circuit element 122 is mounted on the first main surface 121a, and the relatively short and small circuit element 122 such as a resistance element is mounted on the second main surface 121b.
  • all the circuit elements 122 mounted on the circuit board 121 and all the lead wires 130 are soldered only on the second main surface 121b of the circuit board 121. That is, the soldering in the drive circuit 120 is performed only on one side of the circuit board 121. Thereby, all the lead wires 130 and all the circuit elements 122 can be soldered by one flow soldering process. Therefore, the circuit element 122 mounted on the first main surface 121a has the second main surface passing through the lead terminal wire of the circuit element 122 from the first main surface 121a side through the through hole provided in the circuit board 121. It is connected to the metal wiring of the circuit board 121 by soldering at 121b.
  • the drive circuit 120 and the light emitting module 110 are electrically connected by a pair of lead wires 130a and 130b.
  • the drive circuit 120 and the base 180 are electrically connected by a pair of lead wires 130c and 130d.
  • the drive circuit 120 is accommodated in the circuit case 160 and is fixed to the circuit case 160 by, for example, screwing, adhesion, or engagement.
  • the circuit board 121 is fixed to the circuit case 160.
  • the lead wire 130 includes four lead wires 130a to 130d.
  • Each of the lead wires 130a to 130d in the present embodiment is an alloy copper lead wire, and is composed of a core wire (for example, 0.5 mm ⁇ ) made of alloy copper and an insulating resin film that covers the core wire. Note that both ends of each of the lead wires 130a to 130d are configured such that the core wire is exposed from the resin film.
  • the lead wires 130a and 130b are electric wires for supplying (transmitting) DC power for lighting the light emitting module 110 from the drive circuit 120 to the light emitting module 110.
  • One end portion (core wire) of each of the lead wires 130a and 130b is electrically connected to the power output portion (metal wiring) of the circuit board 121 by solder or the like, and each other end portion (core wire).
  • the power input portion (electrode terminal) of the light emitting module 110 by solder or the like.
  • the lead wire (first lead wire) 130a is a lead wire (plus output terminal wire) for supplying a positive voltage from the drive circuit 120 to the light emitting module 110
  • 130b is a conducting wire (minus output terminal wire) for supplying a negative voltage from the driving circuit 120 to the light emitting module 110.
  • the lead wires 130a and 130b are inserted through a through hole 150a provided in the base 150 and drawn out to the light emitting module side (inside the globe 140).
  • the lead wires 130a and 130b are fixed to the circuit element 122 by a fixing member 123.
  • the lead wires 130a and 130b are formed by penetrating one end (core wire) of the lead wires 130a and 130b from the first main surface 121a side of the circuit board 121 through a through hole provided in the circuit board 121. It is connected to the metal wiring of the circuit board 121 by soldering at 121b. The other end of the lead wire 130b is drawn out to the second main surface 121b side through a notch provided in the side portion of the circuit board 121.
  • the lead wires 130c and 130d are wires for supplying (transmitting) power for lighting the light emitting module 110 (for example, commercial 100V AC power) from the base 180 to the drive circuit 120.
  • One end (core wire) of each of the lead wires 130c and 130d is electrically connected to the base 180 (shell portion 181 or eyelet portion 183), and the other end (core wire) of each of the lead wires 130c and 130d is a circuit board.
  • the power input unit 121 (metal wiring) 121 is electrically connected by solder or the like.
  • the lead wire (third lead wire) 130 c is electrically connected to the shell portion 181 of the base 180 through the through hole 160 a provided in the circuit case 160.
  • the lead wire (fourth lead wire) 130 d is electrically connected to the eyelet portion 183 of the base 180 through the opening on the base side of the circuit case 160.
  • the lead wires 130c and 130d penetrate through one end (core wire) of the lead wires 130c and 130d provided in the circuit board 121 from the first main surface 121a side of the circuit board 121, similarly to the lead wires 130a and 130b. It is connected to the metal wiring of the circuit board 121 by passing through the hole and soldering on the second main surface 121b.
  • the globe 140 is a hemispherical light-transmitting cover for taking out the light emitted from the light emitting module 110 to the outside of the lamp, and has a shape in which the opening side (the base side) is narrowed in this embodiment.
  • the light emitting module 110 is covered with the globe 140. Thereby, the light of the light emitting module 110 incident on the inner surface of the globe 140 passes through the globe 140 and is extracted to the outside of the globe 140.
  • the globe 140 is arranged such that the opening side end portion is sandwiched between the base 150 and the housing 170.
  • the globe 140 is attached to the first opening of the housing 170 in a state of covering the light emitting module 110 by press-fitting the opening-side end portion into the first opening of the housing 170.
  • the globe 140 is subjected to a diffusion treatment for diffusing the light emitted from the light emitting module 110.
  • the light diffusion function can be imparted to the globe 140 by forming a light diffusion film (light diffusion layer) on the inner or outer surface of the globe 140.
  • the shape of the globe 140 is hemispherical, but is not limited thereto.
  • the shape of the globe 140 may be a spheroid or oblate sphere.
  • a glass material or a resin material such as polycarbonate can be used as a material of the globe 140.
  • the base 150 is a light source mounting member on which the light emitting module 110 is placed, and is a substantially disk-shaped substrate having a plane orthogonal to the lamp axis J, for example. On one surface of the base 150, a recess for arranging the light emitting module 110 in a plane is formed. The light emitting module 110 disposed in the recess is fixed to the base 150 by, for example, a fastener, a screw, or an adhesive.
  • the base 150 is attached to a first opening which is an opening on the glove side of the cylindrical casing 170, and the side wall of the base 150 abuts on the upper inner surface of the first opening of the casing 170. ing. That is, the base 150 is fixed in a state of being fitted to the first opening side of the housing 170.
  • the base 150 is provided with two through-holes 150a so that the main surface on the globe side and the main surface on the housing side communicate with each other, and a pair of leads of the drive circuit 120 is provided through these through-holes 150a. Lines 130 a and 130 b are led out to the light emitting module side of the base 150.
  • the base 150 in the present embodiment is made of, for example, a metal material.
  • a metal material for example, Al, Ag, Au, Ni, Rh, Pd, an alloy composed of two or more of these, or an alloy of Cu and Ag can be considered.
  • the base 150 can be a substantially disc-shaped metal substrate molded by aluminum die casting.
  • the circuit case 160 is an insulating resin case (circuit holder) for housing the drive circuit 120, and is housed in the housing 170 and the base 180.
  • the circuit case 160 is, for example, a substantially cylindrical case that is open on both sides, and is connected to the first case portion (large diameter portion) 161 having a large diameter cylindrical shape that is substantially the same shape as the housing 170, and the first case portion 161.
  • the second case portion (small-diameter portion) 162 has a small-diameter cylindrical shape that is substantially the same shape as the base 180.
  • the 1st case part 161 located in the glove side is accommodated in the housing
  • the second case part 162 located on the base side is accommodated in the base 180, and the base 180 is fitted on the second case part 162.
  • the opening on the base side of the circuit case 160 is closed.
  • a screwing portion for screwing with the base 180 is formed on the outer peripheral surface of the second case portion 162, and the base 180 is screwed into the second case portion 162 to be attached to the circuit case 160. It is fixed.
  • the circuit case 160 can be integrally formed using, for example, an insulating resin material such as polybutylene terephthalate (PBT).
  • the casing 170 is an outer case exposed to the outside, and is disposed between the globe 140 and the base 180.
  • the housing 170 is configured by a substantially truncated cone member having a substantially cylindrical shape having both ends opened in the lamp axis J direction and having a diameter reduced from the globe side toward the base side.
  • the base 150 and the opening-side end of the globe 140 are accommodated in an opening (first opening) on the globe side of the housing 170.
  • the housing 170 is fixed to the base 150 by caulking. Yes.
  • the housing 170 may be fixed to the base 150 by pouring an adhesive into a space 170 a surrounded by the housing 170, the base 150, and the globe 140.
  • the casing 170 is a metal casing made of metal. Accordingly, the housing 170 functions as a heat sink, and the heat generated from the light emitting module 110 and the drive circuit 120 can be efficiently radiated to the outside of the light bulb shaped lamp 100 via the housing 170.
  • a metal material constituting the casing 170 for example, Al, Ag, Au, Ni, Rh, Pd, an alloy composed of two or more of these, or an alloy of Cu and Ag can be considered. Since such a metal material has good thermal conductivity, the heat transmitted to the housing 170 can be efficiently transmitted to the base side. Therefore, the heat generated from the light emitting module 110 and the drive circuit 120 can be dissipated also to the lighting fixture side through the base 180.
  • casing 170 is made of an aluminum alloy material.
  • the surface of the housing 170 may be anodized.
  • the material of the housing 170 is not limited to metal, and may be resin.
  • the housing 170 can be made of a resin having high thermal conductivity.
  • the base 180 is a power receiving unit for receiving AC power for causing the light emitting module 110 to emit light from the outside through two contact points, and is attached to a socket of a lighting fixture, for example. In this case, when the light bulb shaped lamp 100 is turned on, the base 180 receives power from the socket of the lighting fixture. Further, the power received by the base 180 is input to the power input unit of the drive circuit 120 via the lead wires 130c and 130d.
  • the base 180 includes a shell portion 181 having a substantially cylindrical shape and an outer peripheral surface being a male screw, and an eyelet portion 183 attached to the shell portion 181 via an insulating portion 182.
  • An insulating ring 190 is provided between the shell portion 181 and the casing 170 to ensure insulation between the casing 170 and the base 180.
  • On the inner peripheral surface of the base 180 a screwing portion for screwing into the circuit case 160 is formed.
  • the base 180 has a bottomed cylindrical shape made of metal.
  • the type of the base 180 is not particularly limited.
  • a screw-type Edison type (E type) base can be used, and examples thereof include an E26 base, an E17 base, and an E16 base.
  • FIG. 2 is a diagram showing a configuration of a drive circuit and lead wires in the light bulb shaped lamp according to the present embodiment.
  • 3A and 3B are diagrams showing a relationship between circuit elements and lead wires in the driving circuit for the light bulb shaped lamp according to the present embodiment, wherein FIG. 3A is a top view thereof, FIG. 3B is a left side view thereof, c) is a front view thereof.
  • the lead wire 130a and the ceramic capacitor 122a are illustrated, but the same applies to the lead wire 130b and the ceramic capacitor 122b.
  • a ceramic capacitor 122a that is an output-side smoothing capacitor, a ceramic capacitor 122b that is a filter capacitor, and an electrolytic capacitor 122c are formed on a first main surface 121a of a circuit board 121.
  • a choke coil 122d, a noise filter 122e, and an integrated circuit element 122f are mounted.
  • a resistance element, a rectifier circuit element, and the like are mounted on the second main surface 121b of the circuit board 121.
  • the circuit board 121 has a rectangular shape in plan view, but may be circular or elliptical in plan view.
  • each of the four lead wires 130a to 130d is electrically connected to the first main surface 121a of the circuit board 121.
  • Each of the lead wires 130a and 130b is disposed so as to be located around the circuit element 122 mounted at a position closest to each of the lead wires 130a and 130b among the plurality of circuit elements 122.
  • lead wire 130a and ceramic capacitor 122a are arranged adjacent to each other. Further, the lead wire 130b and the ceramic capacitor 122b are disposed adjacent to each other.
  • each of the lead wires 130a and 130b is fixed to the circuit element 122 mounted at a position closest to the lead wires 130a and 130b. That is, each of the lead wires 130a and 130b is fixed to the circuit element 122 mounted at a position closest to each connection portion (the lead wire root portion) between each of the lead wires 130a and 130b and the circuit board 121. Yes.
  • the lead wire (plus-side output terminal wire) 130a is disposed adjacent to the ceramic capacitor (output-side smoothing capacitor) 122a, and is thus fixed to the ceramic capacitor 122a.
  • the lead wire (minus output terminal wire) 130b is disposed adjacent to the ceramic capacitor (filter capacitor) 122b, and is thus fixed to the ceramic capacitor 122b.
  • the lead wire 130a and the ceramic capacitor 122a are fixed by a fixing member 123.
  • the lead wire 130b and the ceramic capacitor 122b are fixed by a fixing member 123.
  • the fixing member 123 is provided so as to contact and surround the lead wire 130a (or lead wire 130b) and the ceramic capacitor 122a (or ceramic capacitor 122b).
  • the fixing member 123 is a strip-shaped resin member having an insulating property.
  • a heat-shrinkable tube that shrinks in the radial direction when the heat is applied (the diameter decreases) is used as the fixing member 123.
  • the material is cross-linked polyethylene
  • the shrinkage temperature is 90 ° C.
  • the operating temperature range is ⁇ 40 ° C. to 125 ° C.
  • the radial shrinkage is 50% or more
  • the axial shrinkage is A material having a tensile strength of 10.4 MPa or more and a tear elongation of 200% or more can be used.
  • the lead wire 130a and the ceramic capacitor 122a can be firmly fixed as shown in FIG. 3 without using an adhesive.
  • the movable member of the lead wire 130a when the stress is applied to the lead wire 130a by the fixing member 123 is changed from the root portion (core wire) of the lead wire 130a to the fixing member 123 (or ceramic capacitor 122a) in the lead wire 130a.
  • the contact portion (resin coating) can be changed. Therefore, for example, even if the lead wire 130a is pulled out in the lamp assembling process, no load is applied to the root portion of the lead wire 130a, so that the lead wire 130a is not cut at the root. In this case, a load is applied to the contact portion of the lead wire 130a with the fixing member 123. However, since the contact portion is a portion where the core wire of the lead wire 130a is covered with the resin film, the wire breakage may occur. Does not occur.
  • the lead wire 130a that is the plus-side output terminal line in the drive circuit 120 has the same potential as the positive electrode of the ceramic capacitor 122a that is the output-side smoothing capacitor. Therefore, as shown in FIG. 3, the lead wire 130a is preferably disposed adjacent to the lead terminal wire on the positive electrode side of the ceramic capacitor 122a and fixed to the ceramic capacitor 122a.
  • the lead wire 130 can be fixed to the circuit element 122 having a lead terminal line having a potential different from that of the lead wire 130. In this case, however, the lead terminal wire and the lead wire 130 having different potentials are connected to each other. Since it approaches, there is a possibility that a short circuit failure may occur in the soldering process or the like.
  • the lead wire 130 and the circuit element 122 are brought closer to each other by fixing the lead wire 130 to the circuit element 122 having the lead terminal line having the same potential as the lead wire 130.
  • no short circuit occurs. Thereby, a highly reliable light bulb shaped lamp can be realized.
  • the outer peripheral shape of the cross section of the ceramic capacitor 122a has no corners, and the side surface of the ceramic capacitor 122a is a curved surface.
  • the circuit element 122 that fixes the lead wire 130 has a round cross-sectional shape, and a surface that contacts the fixing member 123 is a curved surface.
  • the play can be reduced and fixed.
  • the contact area between the member (heat-shrinkable tube) 123 and the circuit element 122 can be increased, and the tightening force by the heat-shrinkable tube can be improved.
  • by eliminating the corners (edges) on the outer periphery of the circuit element 122 it is possible to prevent the fixing member (heat-shrinkable tube) 123 from cracking or the fixing member (heat-shrinkable tube) 123 from being broken. Can do.
  • the fixing member 123 does not cover the connection portion between the lead wire 130a and the circuit board 121 and does not contact the connection portion. That is, the fixing member 123 is configured not to contact a core wire (metal portion) that is a connection portion (a root portion of the lead wire 130a) with the circuit board 121 in the lead wire 130a, and the core wire at the base of the lead wire 130a is exposed. It is preferable to keep it.
  • the core wire at the base of the lead wire 130a is brought into contact with the fixing member 123, heat from the core wire is transmitted to the fixing member 123, and the fixing member 123 deteriorates.
  • the fastening force of the fixing member 123 decreases with the deterioration of the fixing member 123
  • the lead wire 130b moves away from the ceramic capacitor 122b, and the root portion (core wire) of the lead wire 130a becomes movable.
  • the root portion of the lead wire 130b may be cut off.
  • thermal deterioration of the fixing member 123 can be suppressed by making the fixing member 123 and the root portion of the lead wire 130a non-contact.
  • the fixing member 123 is made of an adhesive resin such as a silicone resin, the adhesive resin is likely to be peeled off due to the influence of heat from the core wire of the lead wire 130a.
  • 123 and the base portion of the lead wire 130a are preferably not in contact with each other.
  • connection portion between the lead wire 130a and the circuit board 121 is configured not to be covered with the fixing member 123, and the core wire at the base of the lead wire 130a is exposed.
  • the lower end of the fixing member 123 may be in contact with the surface of the circuit board 121, and the connection portion between the lead wire 130a and the circuit board 121 may be covered with the fixing member 123 (heat shrinkable tube).
  • FIG. 4 is a diagram for explaining a method of fixing circuit elements and lead wires in the driving circuit for a light bulb shaped lamp according to the present embodiment.
  • the left diagram is a front view thereof, and the right diagram is a diagram thereof. It is a top view.
  • a method of fixing the lead wire 130a and the ceramic capacitor 122a will be described.
  • the method of fixing other lead wires 130 such as the lead wire 130b and other circuit elements 122 such as the ceramic capacitor 122b is the same. is there.
  • a circuit element 122 such as a ceramic capacitor 122a is mounted on a circuit board 121 and soldered, and a lead wire 130 such as a lead wire 130a is soldered.
  • a fixing member 123 which is a heat shrinkable tube, is inserted so as to surround the ceramic capacitor 122a and the lead wire 130a, and the ceramic capacitor 122a and the lead wire 130a are inserted by the fixing member 123. And temporarily fix.
  • the fixing member 123 heat shrinkable tube
  • the lead wire 130a is attracted to the ceramic capacitor 122a by contraction of the fixing member 123, and the resin coating portion of the lead wire 130a and the side surface of the ceramic capacitor 122a come into contact with each other.
  • the lead wire 130a can be fixed to the ceramic capacitor 122a.
  • an electric furnace can be used as the heating means.
  • the lead wire 130 is fixed to the circuit element 122 of the circuit board 121, the lead wire 130 is connected to the circuit board 121 (lead).
  • the base portion of the line 130) can be configured not to move. Thereby, even if the lead wire 130 is bent and stress is applied to the lead wire 130, it is possible to suppress an excessive load from being applied to the root portion of the lead wire 130. As a result, disconnection of the lead wire 130 can be avoided, and disconnection failure of the lead wire 130 can be reduced. Therefore, in the light bulb shaped lamp 100, occurrence of unsafe operation can be suppressed.
  • the bending characteristic of the lead wire 130 can be improved and the durability of the lead wire 130 can be improved.
  • a heat shrinkable tube as the fixing member 123 for fixing the lead wire 130 and the circuit element 122 as in the present embodiment.
  • an adhesive tape as a means for fixing the lead wire 130 and the circuit element 122, but in this case, the drive circuit 120 becomes high temperature due to heat from the light emitting module 110 or heat from the circuit element 122, The adhesive force of the adhesive tape may be reduced by heat, and the lead wire 130 may be separated from the circuit element 122. In this case, there is a possibility that the root portion (core wire) of the lead wire 130 becomes movable and a load is applied to the root portion, causing the lead wire 130b to break.
  • the lead wire 130 and the circuit element 122 are tightened by the elastic force of the heat shrinkable tube without using an adhesive tape or an adhesive. Can be firmly fixed.
  • the heat shrinkable tube is an elastic member and has a high degree of freedom in shape, it can be deformed into a desired shape along the outer peripheral shape of the circuit element 122. Thereby, a sufficient contact area between the circuit element 122 and the heat-shrinkable tube can be secured, so that the lead wire 130 and the circuit element 122 can be firmly fixed.
  • the two lead wires 130a and 130b that connect the light emitting module 110 and the drive circuit 120 are connected to the circuit element 122 (ceramic capacitors 122a and 122b).
  • the lead wires 130c and 130d may be fixed to the circuit element 122 such as the ceramic capacitors 122a and 122b.
  • one lead wire 130 may be fixed to the circuit element 122, or all three or all four lead wires 130 may be fixed to the circuit element 122. .
  • the lead wires 130a and 130b are fixed to the ceramic capacitors 122a and 122b.
  • the circuit element 122 to which the lead wires 130a and 130b are fixed is not limited to this.
  • the lead wires 130a and 130b may be fixed to the circuit element 122 such as the electrolytic capacitor 122c, the choke coil 122d, the noise filter 122e, or the integrated circuit element 122f.
  • the circuit element 122 to be fixed to the lead wire 130 is preferably a tall circuit element such as the ceramic capacitors 122a and 122b. By fixing to the tall circuit element 122, the lead wire 130 and the circuit element 122 can be easily fixed using a heat-shrinkable tube.
  • FIG. 5A is a diagram showing a configuration of a drive circuit and lead wires in a light bulb shaped lamp according to this modification.
  • FIG. 5B is a circuit diagram of a drive circuit in a light bulb shaped lamp according to this modification.
  • one lead wire 130 is fixed to one circuit element 122, whereas in the present modification, a plurality of lead wires 130 are fixed to one circuit element 122. .
  • both the lead wire 130a and the lead wire 130b are disposed adjacent to the ceramic capacitor 122a, and both the lead wires 130a and 130b are fixed members 123. Is fixed to the ceramic capacitor 122a.
  • a plurality of lead wires 130 can be fixed to one circuit element 122. Accordingly, when the lead wire 130 and the circuit element 122 are fixed by the fixing member 123, the plurality of lead wires 130 can be fixed together to the circuit element 122, so that the lead wire 130 and the circuit element 122 are fixed. Work can be simplified. In particular, when a heat-shrinkable tube is used as the fixing member 123, the plurality of lead wires 130 and one circuit element 122 can be surrounded together, so that these can be easily fixed.
  • the two lead wires 130a and 130b are preferably fixed to a ceramic capacitor 122a that is an output-side smoothing capacitor.
  • the ceramic capacitor (output-side smoothing capacitor) 122a is a capacitor for suppressing the flickering of the semiconductor light emitting device 112, and is connected in parallel with the semiconductor light emitting device (LED) 112 of the light emitting module 110 as shown in FIG. 5B.
  • the Accordingly, one terminal (positive electrode) 122a1 of the ceramic capacitor 122a is at the same potential as the lead wire 130a connected to the plus-side output terminal 120a, while the other terminal (negative electrode) 122a2 of the ceramic capacitor 122a is The same potential as the lead wire 130b connected to the negative output terminal 120b.
  • one lead terminal wire 122a1 and lead wire 130a of ceramic capacitor 122a are disposed adjacent to each other, and the other lead terminal wire 122a2 and lead wire 130b of ceramic capacitor 122a are disposed adjacent to each other.
  • the lead terminal wire of the circuit element 122 closest to each of the two lead wires 130a and 130b is the lead wire 130a.
  • 130b it is possible to reduce the occurrence of short-circuit defects in the soldering process or the like.
  • FIG. 6 is a cross-sectional view of a light bulb shaped lamp according to Embodiment 2 of the present invention.
  • the same components as those shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted or simplified.
  • the drive circuit 120 is not a sectional view but a side view.
  • the circuit board 121 in the first embodiment is arranged in a posture in which the first main surface 121a and the second main surface 121b are parallel to the lamp axis J
  • the circuit board 121 in the second embodiment is The first main surface 121a and the second main surface 121b are arranged in a posture orthogonal to the lamp axis J.
  • the circuit board 121 has a first main surface 121 a on which the circuit element 122 is mounted facing the base side, and a second main surface opposite to the first main surface 121 a. 121b is arranged to face the light emitting module side. That is, in the present embodiment, the light emitting module 110 is positioned above the second main surface 121b of the circuit board 121.
  • the lead wire 130 is soldered only on the second main surface 121b of the circuit board 121.
  • both of the lead wires 130a and 130b are fixed to the ceramic capacitor (output-side smoothing capacitor) 122a by the fixing member 123. Further, as the fixing member 123, a heat shrinkable tube is used.
  • the lead wires 130a to 130d are connected to one end (core wire) of the lead wires 130a to 130d from the first main surface 121a side of the circuit board 121 to the circuit board 121.
  • the second main surface 121b is soldered by penetrating through holes provided in the circuit board 121 so that they are connected to the metal wiring of the circuit board 121.
  • the circuit board 121 since the circuit board 121 has a horizontal arrangement, the two lead wires 130a and 130b connected to the light emitting module 110 are not only the lead wires 130b, The other end of each of the two is drawn to the second main surface 121b side and extends into the globe 140.
  • the two lead wires 130a and 130b are drawn from the first main surface 121a of the circuit board 121 to the second main surface 121b.
  • disconnection failure of the lead wire 130 is likely to occur. That is, in this embodiment, when the lead wire 130 is not fixed to the circuit element 122, for example, when the lead wires 130a and 130b are bent and pulled out to the second main surface 121b side (light emitting module 110 side), the lead wire 130a and Stress concentrates on the connection portion (the lead wire root portion) with the circuit board 121 at 130b, and the lead wires 130a and 130b are cut off at the root portion.
  • the light bulb shaped lamp 200 since the lead wires 130a and 130b are fixed to the ceramic capacitor 122a, the same effect as in the first embodiment can be obtained. That is, even if stress is applied to the lead wires 130a and 130b, the disconnection failure of the lead wires 130a and 130b does not occur. Thereby, in the light bulb shaped lamp 200, occurrence of unsafe operation can be suppressed.
  • the circuit board 121 of the driving circuit 120 has a circular shape in plan view corresponding to the shape of the circuit case 160.
  • the circuit board The size of 121 (substrate size) is ⁇ 40 mm or less.
  • the size of the circuit board 121 is ⁇ 25 mm or less. Since the disconnection failure of the lead wire 130 is likely to occur when the size of the circuit board 121 is related to the base 180 as described above, the lead wire 130 is fixed to the circuit element 122 particularly in such a case. Thereby, the disconnection defect of the lead wire 130 can be reduced effectively.
  • FIG. 7 is a cross-sectional view of a light bulb shaped lamp according to Embodiment 3 of the present invention.
  • the same components as those shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted or simplified.
  • the drive circuit 120 is not a sectional view but a side view.
  • the light bulb shaped lamp 300 according to the present embodiment is similar to the first embodiment in that the light emitting module 110, the drive circuit 120, the lead wire 130, the globe 340, the circuit case 360, And a base 180.
  • the posture of the drive circuit 120 (circuit board 121) is the same as that in the second embodiment.
  • the light bulb shaped lamp 300 according to the present embodiment includes a support column 351 and a support base 352. Note that, unlike the first and second embodiments, the light bulb shaped lamp 300 in the present embodiment includes an envelope made up of a globe 340, a circuit case 360 (first case portion 361), and a base 180.
  • constituent members of the light bulb shaped lamp 300 in the present embodiment will be described focusing on members different from those in the first embodiment.
  • the globe 340 houses the light emitting module 110 and transmits light from the light emitting module 110 to the outside of the lamp.
  • globe 340 is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the light emitting module 110 housed in the globe 340 can be viewed from the outside of the globe 340.
  • the shape of the globe 340 is a shape in which one end is closed in a spherical shape and an opening 341 is provided at the other end.
  • the shape of the globe 340 is such that a part of the hollow sphere narrows while extending away from the center of the sphere, and the opening 341 is formed at a position away from the center of the sphere.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as an A shape, a G shape, or an E shape can be used.
  • the globe 340 is not necessarily transparent to visible light, and the globe 340 may have a light diffusion function. Further, the globe 340 is not necessarily made of silica glass, and may be made of a resin such as acrylic.
  • the support column 351 is a metal stem provided so as to extend from the vicinity of the opening 341 of the globe 340 toward the inside of the globe 340.
  • the support column 351 functions as a holding member that holds the light emitting module 110, one end of the support column 351 is connected to the light emitting module 110, and the other end of the support column 351 is connected to the support base 352.
  • the light emitting module 110 is held in the hollow in the globe 340 by the support column 351.
  • the light emitting module 110 is disposed by a support column 351 at a spherical central position formed by the globe 340 (for example, inside the large diameter portion where the inner diameter of the globe 340 is large).
  • the light distribution characteristic of the light bulb shaped lamp 300 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil.
  • the support column 351 is made of a metal material, and also functions as a heat radiating member for radiating heat generated in the light emitting module 110.
  • the support column 351 is made of aluminum having a thermal conductivity of 237 [W / m ⁇ K]. As described above, since the support 351 is made of a metal material, the heat of the light emitting module 110 is efficiently conducted to the support 351 through the mounting substrate 111. Thereby, the heat of the light emitting module 110 can be released to the base 180 side. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LED due to temperature rise.
  • the support base (support plate) 352 is a support member that supports the support column 351 and is connected to the opening end of the opening 341 of the globe 340. In addition, the support base 352 is configured to close the opening 341 of the globe 340. In the present embodiment, the support base 352 is fixed to the circuit case 360.
  • the support base 352 is made of a metal material, and is made of aluminum in the present embodiment, like the support column 351. Thereby, the heat of the light emitting module 110 thermally conducted to the support column 351 is efficiently conducted to the support base 352. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LED due to temperature rise.
  • the support base 352 is composed of a disk-shaped member having a stepped portion.
  • the opening end of the opening 341 of the globe 340 is in contact with the stepped portion, thereby closing the opening 341 of the globe 340.
  • the support base 352, the circuit case 360, and the opening end of the opening 341 of the globe 340 are fixed by an adhesive.
  • the circuit case 360 is an insulating resin case (circuit holder) for insulating the support column 351 and the base 180 and accommodating the drive circuit 120.
  • the circuit case 360 includes a first case portion 361 having a large diameter cylindrical shape and a second case portion 362 having a small diameter cylindrical shape. Since the outer surface of the first case part 361 is exposed to the outside, the heat conducted to the circuit case 360 is mainly dissipated from the first case part 361.
  • the second case portion 362 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 180, and in the present embodiment, the second case portion 362 is screwed into the base 180 with the outer peripheral surface of the second case portion 362. A threaded portion is formed.
  • the circuit case 360 can be formed by, for example, polybutylene terephthalate (PBT).
  • the light bulb shaped lamp 300 As described above, according to the light bulb shaped lamp 300 according to the present embodiment, light distribution characteristics with a wide light distribution angle can be realized as in the case of a conventional incandescent light bulb.
  • the globe 340 is larger than the globe 140 in the first and second embodiments, and the ratio of the globe 340 to the entire lamp is large.
  • the lamp housing (circuit case 360) for housing the drive circuit 120 is smaller than in the first and second embodiments, and the storage space for the drive circuit 120 is narrow. In such a configuration, disconnection failure of the lead wire 130 is likely to occur.
  • the lead wire 130 is not fixed to the circuit element 122 in the present embodiment, for example, when the lead wires 130a and 130b are bent and pulled out to the second main surface 121b side (light emitting module 110 side), the lead wire Stress concentrates on a connection portion (lead wire root portion) with the circuit board 121 in 130a and 130b, and the lead wires 130a and 130b are cut at the root.
  • the light bulb shaped lamp 300 since the lead wires 130a and 130b are fixed to the ceramic capacitor 122a, the same effect as in the first embodiment can be obtained. That is, even if stress is applied to the lead wires 130a and 130b, the disconnection failure of the lead wires 130a and 130b does not occur. Thereby, generation
  • FIG. 1
  • the circuit board 121 has a circular shape in plan view corresponding to the shape of the circuit case 160.
  • the size of the circuit board 121 is used. (Substrate size) is ⁇ 40 mm or less.
  • the size of the circuit board 121 is ⁇ 25 mm or less.
  • FIG. 8 is a cross-sectional view of a light bulb shaped lamp according to Embodiment 4 of the present invention.
  • the same components as those shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted or simplified.
  • the drive circuit 120 is not a sectional view but a side view.
  • the light bulb shaped lamp 400 is similar to the first embodiment in that the light emitting module 110, the drive circuit 120, the lead wire 130, the globe 140, the base 450, A circuit case 460, a housing 470, a base 180, and an insulating ring 190.
  • the globe 140, the base 450, and the housing 470 are collectively referred to as a “lamp body (body)”.
  • the circuit case 460, the base 180, and the insulating ring 190 are collectively referred to as a “base part”.
  • the light bulb shaped lamp 400 in the present embodiment has a rotation mechanism capable of changing the illumination direction, and the lamp main body portion can be rotated relative to the base portion. It is configured as follows. Further, in the light bulb shaped lamp 400, the mounting substrate 111 of the light emitting module 110 is disposed so as to be inclined with respect to the axis of the base 180. Such a light bulb shaped lamp 400 is attached to a lighting fixture so that the irradiation direction is directly below. Such a lighting fixture has a hemispherical fixture body attached to the ceiling and a socket to which a light bulb shaped lamp is attached. The socket is provided in a state slightly inclined with respect to the horizontal line so that the insertion slot into which the cap of the light bulb shaped lamp is inserted faces downward.
  • constituent members of the light bulb shaped lamp 400 in the present embodiment will be described focusing on members different from those in the first embodiment.
  • the base (module plate) 450 is a light source mounting member for mounting the light emitting module 110, and has, for example, an inclined surface (mounting surface) having an angle of 60 ° with the lamp shaft (base shaft). It is a member.
  • the light emitting module 110 is placed and fixed on the inclined surface of the base 450.
  • the base 450 is also a cap member that covers the globe 140 side of the circuit case 460.
  • the drive circuit 120 (circuit board 121) is fixed to the base 450. That is, the circuit board 121 rotates as a part of the lamp main body.
  • the base 450 configured as described above is housed in the first housing portion 471 of the housing 470.
  • the base 450 is provided with two through holes 463a through which the lead wires 130a and 130b pass.
  • the base 450 can be formed using, for example, an insulating resin material such as polybutylene terephthalate (PBT).
  • the circuit case 460 is an insulating resin case (circuit holder) for housing a part of the drive circuit 120, and is housed in the second housing portion 472 and the base 180 of the housing 470.
  • the circuit case 460 in the present embodiment is connected to the first case portion 461 having a large diameter cylindrical shape that is substantially the same shape as the second housing portion 472, and a small diameter cylindrical shape that is substantially the same shape as the base 180.
  • the first case portion 461 located on the globe 140 side is housed in the second housing portion 472, and the second case portion 462 located on the base 180 side. Is accommodated in the base 180.
  • a base 180 is externally fitted to the second case portion 462, and in this embodiment, a screwing portion for screwing with the base 180 is formed on the outer peripheral surface of the second case portion 462. Yes.
  • the circuit case 460 is provided with a stopper (protruding portion) 460a that protrudes toward the housing 470 in order to stop the movement of the lamp main body portion and the base portion in the rotation direction.
  • the stopper 460a is formed at one place in the circumferential direction of the surface of the circuit case 460 that faces the housing 470.
  • the stopper 460 a is provided at the base side end of the second case portion 462.
  • the first case portion 461 and the second case portion 462 thus configured can be molded using an insulating resin material such as polybutylene terephthalate (PBT), for example. Further, the first case portion 461 and the second case portion 462 can be integrally formed.
  • PBT polybutylene terephthalate
  • the housing 470 is an outer case exposed to the outside, and is disposed between the globe 140 and the base 180.
  • the housing 470 includes a first housing portion 471 and a second housing portion 472.
  • the first housing 471 houses the base 450 as described above.
  • the second housing part 472 houses the first case part 461 of the circuit case 460.
  • the housing 470 is provided with a stopper (protruding portion) 470a that protrudes toward the circuit case 460 in order to stop the movement of the lamp main body portion and the base portion in the rotation direction.
  • the stopper 470 a is formed at one place in the circumferential direction of the surface of the housing 470 that faces the circuit case 460.
  • the stopper 470 a is provided at the base end of the second housing part 472.
  • the housing 470 is a heat sink made of metal, and dissipates heat generated from the light emitting module 110 and the drive circuit 120 to the outside of the light bulb shaped lamp 400 through the housing 470.
  • casing 470 can be comprised with an aluminum alloy material, for example.
  • the core wires of the lead wires 130c and 130d connected to the base 180 are constituted by stranded wires.
  • the lamp main body portion is configured to be rotatable with respect to the base portion, so that the illumination direction is within a certain angle range by rotating the lamp main body portion. Can be adjusted. Specifically, when the lamp main body (the globe 140, the base, 450, and the housing 470) is rotated, the stopper 460a of the circuit case 460 and the stopper 470a of the housing 470 come into contact with each other, so that the lamp main body. It is configured so that the movement of rotation stops. That is, the light bulb shaped lamp 400 is configured such that the lamp main body can rotate within a predetermined angle range.
  • the lead wire 130 is twisted with the rotation, and the lead There is a possibility that stress concentrates on the connection portion of the wire 130 with the circuit board 121 (the lead wire root portion), and the lead wire 130 is cut at the root.
  • the light bulb shaped lamp configured such that the light emitting module 110 (mounting substrate 111) is inclined with respect to the axis of the base 180 is attached in an oblique direction within the lighting fixture, and thus is compact.
  • the space for housing the drive circuit 120 is small.
  • the lead wire 130 is not fixed to the circuit element 122, when the drive circuit 120 is inserted into the circuit case 460 and the lead wire 130 is pulled out or pushed back to a desired position, the root of the lead wire 130 is obtained. In many cases, wire breaks occur due to load on the part.
  • Embodiment 1 since the lead wire 130 (lead wires 130a and 130b) is fixed to the circuit element 122 (for example, the ceramic capacitor 122a), Embodiment 1 The same effect can be achieved. That is, even if stress is applied to the lead wire 130, the disconnection failure of the lead wire 130 does not occur. Thereby, in the light bulb shaped lamp 400, it is possible to suppress the occurrence of unsafe operation.
  • the circuit board 121 of the drive circuit 120 can be circular or elliptical in plan view.
  • FIG. 9 is a schematic cross-sectional view of an illumination apparatus according to Embodiment 5 of the present invention.
  • a lighting device 500 according to Embodiment 5 of the present invention is used by being mounted on an indoor ceiling 600, for example, and the light bulb shaped lamp 100 according to Embodiment 1 of the present invention described above, And a lighting fixture 520.
  • the lighting fixture (lighting fixture) 520 turns off and turns on the light bulb shaped lamp 100 and includes a fixture main body 521 attached to the ceiling 600 and a translucent lamp cover 522 that covers the light bulb shaped lamp 100.
  • the instrument body 521 has a socket 521a.
  • the socket 521a is an attachment member for attaching a lamp such as a conventional incandescent bulb or bulb-type lamp 100, and a power supply member for feeding power to the bulb-type lamp 100.
  • the bulb-type lamp 100 is attached to the socket 521a by screwing the base of the bulb-type lamp 100 into the socket 521a.
  • commercial AC power of 100 V is supplied from the socket 521a to the light bulb shaped lamp 100.
  • the light bulb shaped lamp 100 according to the first embodiment can also be realized as the lighting device 500.
  • the socket 521a is not limited to the configuration in which the base of the light bulb shaped lamp is screwed, but may be configured to simply insert the base.
  • the light bulb shaped lamp 100 according to the first embodiment is used.
  • lamps according to other embodiments and modifications may be used.
  • a heat-shrinkable tube is used as the fixing member 123, but is not limited thereto.
  • a silicone resin or the like can also be used as the fixing member 123.
  • the lead wire 130 is brought into contact with the circuit element 122 so that the contact portion between the lead wire 130 and the circuit element 122 is potted and cured, and the lead wire 130 is connected to the circuit element 122.
  • the fixing member 123 (silicone resin) is preferably not brought into contact with the root portion of the lead wire 130b.
  • the drive circuit 120 is configured as a non-dimming circuit, but may be configured as a dimming circuit.
  • a dimming control integrated circuit element is mounted on the second main surface 121 b of the circuit board 121 as the circuit element 122.
  • the ceramic capacitors 122a and 122b are used as the circuit element 122 to which the lead wire 130 is fixed.
  • the film The lead wire 130 may be fixed to the capacitor.
  • the light emitting module 110 is configured to emit white light by the blue LED chip and the yellow phosphor, but is not limited thereto.
  • a phosphor-containing resin containing a red phosphor and a green phosphor may be used so as to emit white light by combining this with a blue LED chip.
  • the semiconductor light emitting element (LED chip) 12 may be an LED chip that emits a color other than blue.
  • the phosphor particles in the sealing body 113 are a combination of phosphor particles that emit light of three primary colors (red, green, and blue). Can do.
  • a wavelength conversion material other than the phosphor particles may be used.
  • the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light.
  • a material containing a substance that emits light may be used.
  • the LED is exemplified as the light emitting element.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, or other solid state light emitting element. May be used.
  • the light emitting module 110 is a COB (Chip On Board) type LED module in which an LED chip (bare chip) is directly mounted on a mounting substrate.
  • COB Chip On Board
  • SMD Surface Mount Device
  • a light bulb shaped lamp has been described as an example of a light source for illumination.
  • the present invention is not limited to this.
  • the present invention can also be applied to a straight tube lamp having a light emitting module and a drive circuit in a long cylindrical straight tube, or a round tube lamp having a light emitting module and a drive circuit in an annular round tube.
  • the present invention can also be applied to an illumination light source such as an LED unit incorporating a drive circuit, or an illumination system including a drive circuit.
  • the present invention can be widely used in illumination light sources such as light bulb shaped lamps and illumination devices.

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
PCT/JP2013/001440 2012-05-21 2013-03-07 Source de lumière pour éclairage et appareil d'éclairage Ceased WO2013175682A1 (fr)

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JP2015106485A (ja) * 2013-11-29 2015-06-08 パナソニックＩｐマネジメント株式会社 照明用光源及び照明装置
JP2015225789A (ja) * 2014-05-28 2015-12-14 浜井電球工業株式会社 Ｌｅｄ素子固定装置、それ用のｃｏｂシートカバー、リフレクター装置、および、ｌｅｄ光源モジュール
JP2016510495A (ja) * 2013-02-27 2016-04-07 アール．エフ．テック カンパニー リミテッド 放熱ｌｅｄドライバーを使用したｌｅｄ電球
CN112303531A (zh) * 2020-11-02 2021-02-02 王兰娣 一种可以自动调节聚光度的货架照明灯

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CN108426209B (zh) * 2018-03-07 2023-07-28 欧普照明股份有限公司 发光模组、照明模组、照明装置以及吊灯
KR20220119119A (ko) * 2019-12-25 2022-08-26 덴카 주식회사 램프

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WO2009044716A1 (fr) * 2007-10-01 2009-04-09 Koha Co., Ltd. Dispositif d'émission de lumière
JP2012009285A (ja) * 2010-06-25 2012-01-12 Sanyo Electric Co Ltd Ｌｅｄ照明装置
JP2012146574A (ja) * 2011-01-13 2012-08-02 Sharp Corp 照明装置

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WO2009044716A1 (fr) * 2007-10-01 2009-04-09 Koha Co., Ltd. Dispositif d'émission de lumière
JP2012009285A (ja) * 2010-06-25 2012-01-12 Sanyo Electric Co Ltd Ｌｅｄ照明装置
JP2012146574A (ja) * 2011-01-13 2012-08-02 Sharp Corp 照明装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016510495A (ja) * 2013-02-27 2016-04-07 アール．エフ．テック カンパニー リミテッド 放熱ｌｅｄドライバーを使用したｌｅｄ電球
JP2015106485A (ja) * 2013-11-29 2015-06-08 パナソニックＩｐマネジメント株式会社 照明用光源及び照明装置
JP2015225789A (ja) * 2014-05-28 2015-12-14 浜井電球工業株式会社 Ｌｅｄ素子固定装置、それ用のｃｏｂシートカバー、リフレクター装置、および、ｌｅｄ光源モジュール
CN112303531A (zh) * 2020-11-02 2021-02-02 王兰娣 一种可以自动调节聚光度的货架照明灯
CN112303531B (zh) * 2020-11-02 2022-06-24 杭州优博光电有限公司 一种可以自动调节聚光度的货架照明灯

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