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WO2013161844A1 - Composition de résine ayant une conductivité thermique élevée - Google Patents

Composition de résine ayant une conductivité thermique élevée Download PDF

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Publication number
WO2013161844A1
WO2013161844A1 PCT/JP2013/061977 JP2013061977W WO2013161844A1 WO 2013161844 A1 WO2013161844 A1 WO 2013161844A1 JP 2013061977 W JP2013061977 W JP 2013061977W WO 2013161844 A1 WO2013161844 A1 WO 2013161844A1
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Prior art keywords
magnesium oxide
resin composition
mass
parts
examples
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PCT/JP2013/061977
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English (en)
Japanese (ja)
Inventor
紫野 堀尾
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Polyplastics Co Ltd
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Polyplastics Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond

Definitions

  • the present invention relates to a highly thermally conductive resin composition using a polyarylene sulfide resin.
  • Polyarylene sulfide resin represented by polyphenylene sulfide resin (hereinafter sometimes referred to as “PPS resin”) has high heat resistance, mechanical properties, chemical resistance, Since it has dimensional stability and flame retardancy, it is widely used in electrical and electronic equipment component materials, automotive equipment component materials, chemical equipment component materials, and the like.
  • a highly thermally conductive resin composition in which a PAS resin and a thermally conductive filler are blended is known by taking advantage of the heat resistance of such a PAS resin and the thermal conductivity of the thermally conductive filler.
  • thermally conductive filler examples include metal fillers made of metals such as copper, silver, iron, aluminum or alloys thereof, carbon fillers such as carbon and graphite, alumina, magnesium oxide, beryllium oxide, and zinc oxide.
  • a filler made of a metal oxide such as titanium oxide is used.
  • magnesium oxide is useful because it has a relatively high thermal conductivity and appropriate hardness and insulation, and the present applicant consists of surface-treated magnesium oxide, that is, a magnesium phosphate compound.
  • Patent Document 1 A highly thermally conductive resin composition containing magnesium oxide having a coating layer and the like, and a PAS resin has been proposed (Patent Document 1). This high heat conductive resin composition solved the problem of improving moldability and heat and humidity resistance.
  • examples of the resin composition using the PAS resin and the surface-treated magnesium oxide include the resin compositions described in Patent Document 2 and Patent Document 3.
  • Patent Document 2 describes a resin composition containing a PAS resin and magnesium oxide surface-treated with an alkoxysilane compound.
  • the purpose of using the surface-treated magnesium oxide is to impart corrosion resistance.
  • the compounding quantity of the said magnesium oxide is a small quantity, and is not the quantity which can exhibit high thermal conductivity by the resin composition. That is, the resin composition is not a resin composition having high thermal conductivity.
  • Patent Document 3 describes a resin composition (molding material for electrical insulation / heat radiation component) containing a PAS resin and magnesium oxide obtained by surface treatment after baking at 800 ° C. or higher.
  • the purpose of using the surface-treated magnesium oxide is to impart high thermal conductivity and wet heat resistance.
  • the feature of the said surface-treated magnesium oxide is in performing surface treatment after baking at 800 degreeC or more.
  • the surface treatment agent used for the surface treatment include silane coupling agents and titanate coupling agents.
  • the present invention is to provide a highly heat conductive resin composition having excellent thin wall fluidity while maintaining high heat conductivity.
  • the present invention for solving the above problems is as follows. (1) (A) 100 parts by mass of polyarylene sulfide resin; (B) 80 to 600 parts by mass of magnesium oxide surface-treated in advance with a vinylalkoxysilane compound; A highly thermally conductive resin composition comprising:
  • 4 is a graph showing the relationship between the blending amount of magnesium oxide (AC) with respect to 100 parts by mass of PPS resin and 0.5 mmtBF. 4 is a graph showing the relationship between the blending amount of magnesium oxide (F to H) with respect to 100 parts by mass of PPS resin and 0.5 mmtBF. It is a graph which shows the relationship between the compounding quantity of magnesium oxide (D and E) with respect to 100 mass parts of PPS resins, and 0.5 mmtBF.
  • the highly thermally conductive resin composition of the present invention comprises (A) 100 parts by mass of a polyarylene sulfide resin and (B) 80 to 600 parts by mass of magnesium oxide that has been surface-treated with a vinylalkoxysilane compound in advance. It is characterized by that.
  • each component of the highly heat conductive resin composition of this invention is explained in full detail.
  • the polyarylene sulfide resin as the component (A) is a polymer compound mainly composed of — (Ar—S) — (wherein Ar is an arylene group) as a repeating unit, and is generally known in the present invention.
  • PAS resins having the molecular structure shown can be used.
  • arylene group examples include p-phenylene group, m-phenylene group, o-phenylene group, substituted phenylene group, p, p′-diphenylene sulfone group, p, p′-biphenylene group, p, p′-.
  • a diphenylene ether group, p, p'-diphenylenecarbonyl group, naphthalene group and the like can be mentioned.
  • the PAS resin may be a homopolymer consisting only of the above repeating units, or a copolymer containing the following different types of repeating units may be preferable from the viewpoint of processability and the like.
  • PPS using a p-phenylene sulfide group as an arylene group and a p-phenylene sulfide group as a repeating unit is preferably used.
  • the copolymer among the arylene sulfide groups comprising the above-mentioned arylene groups, two or more different combinations can be used, and among them, a combination containing a p-phenylene sulfide group and an m-phenylene sulfide group is particularly preferably used. It is done.
  • PAS resins those containing p-phenylene sulfide groups of 70 mol% or more, preferably 80 mol% or more are suitable from the viewpoint of physical properties such as heat resistance, moldability and mechanical properties.
  • PAS resins a high molecular weight polymer having a substantially linear structure obtained by condensation polymerization from a monomer mainly composed of a bifunctional halogen aromatic compound can be particularly preferably used.
  • the (A) PAS resin used in the present invention may be a mixture of two or more different molecular weight PAS resins.
  • a partially branched or crosslinked structure is formed by using a small amount of a monomer such as a polyhaloaromatic compound having 3 or more halogen substituents when performing condensation polymerization.
  • a monomer such as a polyhaloaromatic compound having 3 or more halogen substituents
  • examples thereof include polymers obtained by heating a polymer having a low molecular weight and a linear structure polymer having a low molecular weight at a high temperature in the presence of oxygen or the like to increase the melt viscosity by oxidative crosslinking or thermal crosslinking, thereby improving molding processability.
  • a polymer having a branched structure or a crosslinked structure has a decreased fluidity as the amount of the branched structure or the crosslinked structure is increased, it needs to be used with care.
  • the melt viscosity (310 ° C., shear rate 1216 sec ⁇ 1 ) of the PAS resin as the base resin used in the present invention is preferably 200 Pa ⁇ s or less, including the above mixed system, and more preferably in the range of 8 to 150 Pa ⁇ s. Those having a good balance between mechanical properties and fluidity are particularly preferred. When the melt viscosity exceeds 200 Pa ⁇ s, it becomes difficult to improve fluidity, and problems may occur.
  • (B) magnesium oxide pre-treated with a vinylalkoxysilane compound provides high thermal conductivity and high thin-wall fluidity. Blended.
  • a vinyl alkoxysilane compound is used as a surface treatment agent of magnesium oxide, only when a vinyl alkoxysilane compound is used among alkoxysilane compounds, remarkable thin-walled fluidity is exhibited.
  • magnesium oxide pre-treated with an alkoxysilane compound other than a vinylalkoxysilane compound is used, no remarkable thin-walled fluidity is exhibited. Processing is essential.
  • the vinyl alkoxysilane compound used for the surface treatment is preferably a silane compound having one or more vinyl groups and two or three alkoxy groups in one molecule.
  • a methoxysilane hydrolyzate, a vinyltriethoxysilane hydrolyzate, a vinyltris ( ⁇ -methoxyethoxy) silane hydrolyzate and the like can be mentioned. Among them, a vinyltrimethoxysilane hydrolyzate is preferable.
  • the adhesion amount of the vinylalkoxysilane compound to magnesium oxide on the surface of the (B) surface-treated magnesium oxide is preferably 0.3 to 1.5% by mass, and preferably 0.5 to 1% by mass. Is more preferable.
  • the adhesion amount of the vinyl alkoxysilane compound is 0.3 to 1.5% by mass, remarkable thin-wall fluidity is exhibited.
  • the average particle diameter (hereinafter, simply referred to as “average particle diameter”) of the surface-treated magnesium oxide measured by the laser diffraction / scattering method is more than 10 ⁇ m and not more than 100 ⁇ m from the viewpoint of further improving the thin-wall fluidity.
  • the thickness is 15 ⁇ m or more and 60 ⁇ m or less, and more preferably 25 ⁇ m or more and 50 ⁇ m or less.
  • the “average particle diameter measured by the laser diffraction / scattering method” means a particle diameter having an integrated value of 50% in the particle size distribution measured by the laser diffraction / scattering method.
  • (B) surface-treated magnesium oxide is blended in an amount of 80 to 600 parts by mass with respect to 100 parts by mass of (A) PAS resin.
  • the blending amount is less than 80 parts by mass, the thermal conductivity decreases, and when it exceeds 600 parts by mass, the fluidity decreases and the moldability deteriorates.
  • the amount of surface-treated magnesium oxide is preferably 110 to 450 parts by mass, more preferably 120 to 450 parts by mass.
  • (C) alkoxysilane compound in order to improve mechanical properties, (C) an alkoxysilane compound may be blended. However, when the (C) alkoxysilane compound is blended, the fluidity is lowered, so that the fluidity is sacrificed when attempting to obtain mechanical properties. Therefore, as will be described later, the amount when blended is small.
  • the alkoxysilane compound is not particularly limited, and examples thereof include alkoxysilanes such as epoxyalkoxysilanes, aminoalkoxysilanes, vinylalkoxysilanes, mercaptoalkoxysilanes, and one or more of these. Is used.
  • the alkoxy group preferably has 1 to 10 carbon atoms, particularly preferably 1 to 4 carbon atoms.
  • epoxyalkoxysilane examples include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysilane, and the like.
  • aminoalkoxysilanes include ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -aminopropylmethyldimethoxysilane, ⁇ -aminopropylmethyldiethoxysilane, N- ( ⁇ -aminoethyl)- Examples thereof include ⁇ -aminopropyltrimethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane, ⁇ -diallylaminopropyltrimethoxysilane, and ⁇ -diallylaminopropyltriethoxysilane.
  • vinylalkoxysilane examples include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxyethoxy) silane, and the like.
  • mercaptoalkoxysilanes examples include ⁇ -mercaptopropyltrimethoxysilane, ⁇ -mercaptopropyltriethoxysilane, and the like.
  • epoxyalkoxysilane and aminoalkoxysilane are preferable, and ⁇ -aminopropyltriethoxysilane is particularly preferable.
  • the (C) alkoxysilane compound is preferably blended in an amount of 0.1 to 2 parts by weight, more preferably 0.2 to 0.8 parts by weight, based on 100 parts by weight of the (A) PAS resin. preferable.
  • the production of the high thermal conductive resin composition of the present invention includes (1) a method in which all raw materials are mixed and kneaded, and (2) an alkoxysilane compound is blended with the PAS resin, and after melt-kneading, surface-treated magnesium oxide is blended.
  • the effect of the present invention is exhibited by any method such as a method of adding a filler in which an alkoxysilane compound is blended with surface-treated magnesium oxide, but the PAS resin and the alkoxysilane Since the mechanical strength is improved by the reaction of the compound, the alkoxysilane compound of (2) is blended with the PAS resin so that the PAS resin and the alkoxysilane compound react more efficiently, and after melt kneading, surface treatment oxidation is performed. It is preferable to manufacture by the method of mix
  • the high thermal conductive resin composition of the present invention is filled with an inorganic or organic filler within the object range of the present invention to improve performance such as mechanical strength, heat resistance, dimensional stability (deformation resistance, warpage), and electrical properties.
  • an inorganic or organic filler within the object range of the present invention to improve performance such as mechanical strength, heat resistance, dimensional stability (deformation resistance, warpage), and electrical properties.
  • a fibrous, powdery, or plate-like filler is used depending on the purpose.
  • fibrous filler examples include inorganic fibrous materials such as glass fiber, boron fiber, and potassium titanate fiber.
  • a particularly typical fibrous filler is glass fiber.
  • High melting point organic fiber materials such as polyamide, fluororesin, and acrylic resin can also be used.
  • the granular fillers include quartz powder, glass beads, glass powder, calcium silicate, aluminum silicate, kaolin, talc, clay, diatomaceous earth, silicates such as wollastonite, iron oxide, titanium oxide, and zinc oxide.
  • silicates such as wollastonite, iron oxide, titanium oxide, and zinc oxide.
  • metal carbonates such as oxides, calcium carbonate, and magnesium carbonate
  • metal sulfates such as calcium sulfate and barium sulfate.
  • the plate-like filler include mica and glass flakes.
  • the above inorganic fillers can be used alone or in combination of two or more.
  • the highly thermally conductive resin composition of the present invention is a known substance generally added to a thermoplastic resin, that is, a colorant such as a flame retardant, a dye or a pigment, an antioxidant or an ultraviolet ray, as long as the effects of the present invention are not hindered.
  • Stabilizers such as absorbents, lubricants, crystallization accelerators, crystal nucleating agents, other polymers such as resins, additives, and the like can be appropriately added according to the required performance.
  • the high thermal conductivity resin composition of the present invention obtained as described above is excellent in thin-wall fluidity, and thus maintains high thermal conductivity even if it is a small and complicated part or a thin-walled part. However, it can be molded easily.
  • molded products obtained by injection molding, extrusion molding, blow molding, etc. using the high thermal conductive resin composition of the present invention have high wet heat resistance, chemical resistance, dimensional stability, flame resistance, and excellent Shows heat dissipation. Taking advantage of this advantage, it can be suitably used for components that radiate internally generated heat, such as heat exchangers, heat sinks, and optical pickups.
  • LEDs for example, LEDs, sensors, connectors, sockets, terminal blocks, printed circuit boards, motor parts, ECU cases and other electrical / electronic parts, lighting parts, TV parts, rice cooker parts, microwave oven parts, iron parts, etc. It can be used for household and office electrical product parts such as copier-related parts, printer-related parts, facsimile-related parts, heaters, and air conditioner parts.
  • Tables 1 to 4 Each raw material component shown in Tables 1 to 4 was dry-blended and then charged into a twin-screw extruder having a cylinder temperature of 320 ° C. (magnesium oxide was added separately from the side feed portion of the extruder), melt-kneaded, and pelletized. Various test pieces (depending on the evaluation items) were produced from the pellets by an injection molding machine and evaluated. The results are shown in Tables 1 to 4. Examples 1 to 10 and Comparative Examples 1 to 8 shown in Tables 1 and 2 are examples in which the component (B) has an average particle diameter of 50 ⁇ m, and Examples 11 to 16 and Tables 3 and 4 shown in Table 3 are used.
  • Comparative Examples 9 to 11 are examples using the component (B) having an average particle size of 10 ⁇ m, and Examples 17 to 19 and Comparative Examples 12 to 14 shown in Table 4 are average particles as the component (B). In this example, a diameter of 30 ⁇ m is used. Moreover, the detail of each raw material component used is shown below.
  • PPS resin (A) component (PAS resin)
  • PPS resin 1 manufactured by Kureha Co., Ltd., Fortron KPS W202A (melt viscosity: 20 Pa ⁇ s (shear rate: 1216 sec ⁇ 1 , 310 ° C.))
  • PPS resin 2 manufactured by Kureha Co., Ltd., Fortron KPS W214A (melt viscosity: 130 Pa ⁇ s (shear rate: 1216 sec ⁇ 1 , 310 ° C.))
  • PPS resin 3 manufactured by Kureha Co., Ltd., Fortron KPS W220A (melt viscosity: 220 Pa ⁇ s (shear rate: 1216 sec ⁇ 1 , 310 ° C.))
  • (B) component surface-treated magnesium oxide
  • Magnesium oxide A RF-50-SC (surface treatment: 0.5% by mass of vinylalkoxysilane) manufactured by Ube Materials Co., Ltd. (average particle size 50 ⁇ m)
  • Magnesium oxide B RF-50-AC (surface treatment: aminoalkoxysilane 0.5% by mass) (average particle size 50 ⁇ m) manufactured by Ube Materials Co., Ltd.
  • Magnesium oxide C RF-98 manufactured by Ube Materials Co., Ltd. (non-surface treatment) (average particle size 50 ⁇ m)
  • Magnesium oxide D RF-50-SC improved product (surface treatment: vinylalkoxysilane 0.5% by mass) manufactured by Ube Materials Co., Ltd.
  • Magnesium oxide E CF2-100B (phosphorus-containing coated magnesium oxide) manufactured by Tateho Chemical Industry Co., Ltd. (average particle size 27 ⁇ m)
  • Magnesium oxide F RF-10C-SC (surface treatment: vinylalkoxysilane 0.5% by mass) (average particle size 10 ⁇ m) manufactured by Ube Materials Co., Ltd.
  • Magnesium oxide G RF-10C-SC (surface treatment: vinylalkoxysilane 1.5% by mass) manufactured by Ube Materials Co., Ltd. (average particle diameter 10 ⁇ m)
  • Magnesium oxide H RF-10C-EC (surface treatment: epoxy 0.5 mass%) manufactured by Ube Materials Co., Ltd. (average particle size 10 ⁇ m)
  • Component (C) (alkoxysilane compound) Alkoxysilane compound: ⁇ -aminopropyltriethoxysilane: Shin-Etsu Chemical Co., Ltd., KBE-903P
  • test pieces were prepared and evaluated.
  • (1) Thermal conductivity A disk-shaped molded product having a cylinder temperature of 320 ° C. and a mold temperature of 150 ° C. and a diameter of 30 mm and a thickness of 2 mm was produced by injection molding. Using a sample in which four test pieces were stacked, the thermal conductivity was measured with a hot disk method thermophysical property measuring apparatus (TPA-501, manufactured by Kyoto Electronics Industry Co., Ltd.).
  • TPA-501 hot disk method thermophysical property measuring apparatus
  • FIGS. 1 to 3 are graphs showing the relationship between the blending amount of magnesium oxide (A to H) and 0.5 mmtBF with respect to 100 parts by mass of the PPS resin. Each plot of magnesium oxides A to H in the graphs of FIGS. 1 to 3 is based on data of the following examples and comparative examples. i) Graph of FIG. 1 Magnesium oxide A: Examples 4, 7, 5, 9, 6 Magnesium oxide B: Comparative examples 1, 2, 3 Magnesium oxide C: Comparative examples 4, 5, 6, 7 ii) Graph of FIG.
  • Magnesium oxide F Examples 11, 12, and 15 Magnesium oxide G: Examples 13, 14, and 16 Magnesium oxide H: Comparative examples 9, 10, and 11 iii) Graph of FIG. 3 Magnesium oxide D: Examples 17, 18, and 19 Magnesium oxide E: Comparative examples 12, 13, and 14
  • Tables 1 and 2 are examples in which those having an average particle size of 50 ⁇ m are used as the component (B).
  • Table 1 and Table 2 show the following. That is, Example 5, Comparative Example 3, and Comparative Example 6 are all examples using 236 parts by mass of the component (B), but the surface-treated magnesium oxide according to the present invention was used as the component (B). In Example 5, all the evaluation results were good, whereas Comparative Example 3 using magnesium oxide surface-treated with aminoalkoxysilane and Comparative Example 6 using unsurface-treated magnesium oxide were: It was inferior at 0.5 mm tBF. In other words, it can be seen that excellent thin-wall fluidity was not exhibited.
  • Example 8 the thermal conductivity decreased, whereas in Example 6, the thermal conductivity and 0.5 mmtBF had good results.
  • Table 3 is an example in which the average particle size is 10 ⁇ m as the component (B) as described above. Table 3 shows the following. That is, Examples 11 and 13 and Comparative Example 9 are examples in which the blending amount of component (B) was 101 parts by mass, but Examples 11 and 13 were vinyl alkoxy of surface-treated magnesium oxide as component (B). In this example, the adhesion amount of silane was varied, and all the evaluation results were good. On the other hand, Comparative Example 9 using magnesium oxide surface-treated with epoxy as component (B) was inferior in 0.5 mm tBF. It can be seen that the thin-wall fluidity has decreased. Further, from FIG.
  • the example in which the adhesion amount of vinyl alkoxysilane of the surface-treated magnesium oxide as the component (B) is 0.5 mass% is significantly longer than the example in which the mass is 1.5 mass%. It can be seen that better results were obtained in thin-wall fluidity.
  • Example 18 and Comparative Example 13 are examples in which 236 parts by mass of Component (B) were blended.
  • Component (B) used the surface-treated magnesium oxide according to the present invention
  • Comparative Example 13 Is an example using phosphorus-containing coated magnesium oxide.
  • Example 18 shows that 0.5 mmtBF is remarkably long and has excellent thin-wall fluidity.
  • Example 19 and Comparative Example 14 differ from Example 18 and Comparative Example 13 in that the blending amount of component (B) was 305 parts by mass, respectively. Also in these examples, Example 19 shows that 0.5 mmtBF is much longer than Comparative Example 14 and is excellent in thin-wall fluidity.

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PCT/JP2013/061977 2012-04-27 2013-04-24 Composition de résine ayant une conductivité thermique élevée Ceased WO2013161844A1 (fr)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
JP2015083632A (ja) * 2013-10-25 2015-04-30 ポリプラスチックス株式会社 電気絶縁性高熱伝導性樹脂組成物
JP2015209473A (ja) * 2014-04-25 2015-11-24 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体

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JP2012136684A (ja) * 2010-05-17 2012-07-19 Shin Kobe Electric Mach Co Ltd 熱可塑性樹脂組成物及び樹脂成形品
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JPH06171928A (ja) * 1992-12-01 1994-06-21 Kyowa Chem Ind Co Ltd 高耐水和性、高流動性酸化マグネシウムの製造方法
JPH07292251A (ja) * 1994-03-03 1995-11-07 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物
JPH0812886A (ja) * 1994-07-04 1996-01-16 Polyplastics Co ポリアリーレンサルファイド樹脂組成物
JP2001214065A (ja) * 1999-11-22 2001-08-07 Kyowa Chem Ind Co Ltd 半導体封止用材料およびその樹脂組成物およびその成型品
JP2002038010A (ja) * 2000-07-26 2002-02-06 Idemitsu Petrochem Co Ltd 電気絶縁・放熱部品用成形材料及びそれを用いた画像形成装置用部品
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JP2013035950A (ja) * 2011-08-09 2013-02-21 Tosoh Corp ポリアリーレンスルフィド樹脂組成物及びそれよりなる複合体

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JP2015083632A (ja) * 2013-10-25 2015-04-30 ポリプラスチックス株式会社 電気絶縁性高熱伝導性樹脂組成物
JP2015209473A (ja) * 2014-04-25 2015-11-24 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体

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