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WO2013161781A1 - Support d'informations sans contact et livret comportant un support d'informations sans contact - Google Patents

Support d'informations sans contact et livret comportant un support d'informations sans contact Download PDF

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Publication number
WO2013161781A1
WO2013161781A1 PCT/JP2013/061823 JP2013061823W WO2013161781A1 WO 2013161781 A1 WO2013161781 A1 WO 2013161781A1 JP 2013061823 W JP2013061823 W JP 2013061823W WO 2013161781 A1 WO2013161781 A1 WO 2013161781A1
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WO
WIPO (PCT)
Prior art keywords
information medium
type information
contact type
chip
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/061823
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English (en)
Japanese (ja)
Inventor
誠 前平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Publication of WO2013161781A1 publication Critical patent/WO2013161781A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets

Definitions

  • the present invention relates to a non-contact type information medium that includes an antenna and an IC (integrated circuit) chip and can record information on the IC chip in a non-contact manner, and a booklet including the non-contact type information medium.
  • a non-contact type information medium that includes an antenna and an IC (integrated circuit) chip and can record information on the IC chip in a non-contact manner, and a booklet including the non-contact type information medium.
  • a booklet attached to a non-contact type information medium in which a non-contact type information medium is added to a booklet-shaped information medium such as a passport or a savings passbook has been developed.
  • the non-contact type information medium used for such a non-contact type information medium-attached booklet has a configuration in which an IC inlet including an antenna and a non-contact IC chip connected to the antenna is sandwiched between outer packaging substrates.
  • the booklet attached to the non-contact type information medium is bound by sticking the non-contact type information medium to a cover member called a cover cloth or the like, and further attaching a booklet such as an inner sheet or a body sheet.
  • Such a booklet attached to a non-contact type information medium has a feature that data can be printed or a VISA stamp can be added like an ordinary booklet, and electronic data can be recorded.
  • a booklet having a non-contact type information medium inside the back cover as described above is disclosed in, for example, Document 1 (Japanese Patent Laid-Open No. 2002-04068).
  • the non-contact information medium described in Document 1 includes a first base material, a second base material, an antenna coil, an IC chip, and an adhesive layer.
  • the second base is provided with an opening having a predetermined width. By bonding the second base material to the first base material, the opening becomes a recess.
  • An antenna coil and an IC chip connected to the antenna coil are disposed in the recess.
  • An adhesive layer is formed on the first substrate.
  • the non-contact type information medium of Document 1 is attached to the inner surface of the back cover of a booklet with an adhesive layer.
  • a non-contact type information medium is provided in a distributed credit card or IC card.
  • a non-contact type information medium is smoothed by sandwiching an IC and an antenna between thermoplastic substrates such as sheets of PVC or PET-G, applying a strong heat pressure, and flowing the substrate. It is produced by.
  • a non-contact type information medium attached booklet is produced by adhering the non-contact type information medium between the front or back cover of the booklet and the inner sheet.
  • Such a non-contact type information medium has high durability against moisture or chemicals because the IC chip and the antenna are sealed with a sheet of PVC or PET-G.
  • the rigidity may be increased and the cover may be difficult to open, and it may be difficult to bond the base material to the inner sheet.
  • a porous sheet having a void in the substrate may be used instead of the sheet such as PVC or PET-G.
  • This porous thermoplastic sheet is produced by foaming a resin and generally has a soft material and low rigidity.
  • the porous thermoplastic sheet has voids, various adhesives can easily permeate and have high adhesiveness with the inner sheet.
  • the porous thermoplastic sheet can absorb irregularities by applying an appropriate pressure.
  • the porous thermoplastic sheet itself is bonded by thermal fusion, and after the thermoplastic adhesive is applied to the porous thermoplastic sheet, thermal lamination is performed. It is possible to adhere by a method, or to apply and adhere a commonly used water-based or solvent-based dry-solidified adhesive to a porous thermoplastic sheet.
  • the thickness of the antenna is about 20 ⁇ m to 50 ⁇ m. If the thickness is about this, it can be absorbed by the thickness of the base material. However, the thickness of the IC chip may be 300 ⁇ m or more, and at least the substrate needs to be thicker than the IC chip. In order to reduce the thickness of the entire non-contact information medium, an opening having the same size as the IC chip is provided on the base material, and a non-contact information medium in which the IC chip and the antenna are sandwiched may be manufactured. .
  • the non-contact type information medium and the non-contact type information medium-attached booklet formed using the porous thermoplastic base material are easy to manufacture, rich in flexibility, and have good adhesion to other materials. However, the durability against moisture or chemicals is poor.
  • the present invention has been made in view of the above circumstances, has water resistance or chemical resistance, and has a non-contact type information medium having an IC chip opening and a non-contact type medium having the non-contact type information medium.
  • the purpose is to provide an information media booklet.
  • the non-contact information medium includes an IC chip, an antenna connected to the IC chip, and a plurality of porous thermoplastic substrates that sandwich the IC chip and the antenna. An opening for exposing the IC chip is formed in each of the plurality of porous thermoplastic substrates.
  • the non-contact type information medium further includes a sealing resin layer that closes at least the opening on the lead frame side of the IC chip.
  • the sealing resin layer may have a barrier property against the electrolytic solution or various ions.
  • the sealing resin layer may be a reactive hot melt adhesive.
  • a layer having a barrier property against the electrolytic solution or various ions may be further provided on at least one of the plurality of porous thermoplastic substrates.
  • the antenna may be an aluminum antenna formed by an etching method.
  • the non-contact information medium attached booklet according to the second aspect includes the non-contact information medium according to the first aspect.
  • the non-contact type information medium is provided with a non-contact type information medium in a booklet by adhering the non-contact type information medium to the cover member with an adhesive layer made of the same material as the sealing resin layer.
  • a non-contact type information medium having water resistance or chemical resistance and having an IC chip opening, and a non-contact type information medium accessory booklet provided with this non-contact type information medium. Can do.
  • FIG. 1 is a cross-sectional view showing an example of a non-contact information medium according to the present embodiment.
  • FIG. 2 is a plan view showing an example of an IC inlet of the non-contact type information medium according to the present embodiment.
  • FIG. 3 is a cross-sectional view showing an example of an IC chip of a non-contact information medium according to the present embodiment.
  • FIG. 4 is a cross-sectional view showing an example of an exploded state of the porous thermoplastic base material and the IC inlet according to the present embodiment.
  • FIG. 5 is a cross-sectional view showing an example of an assembled state of the porous thermoplastic base material, the IC inlet, and the sealing resin layer according to the present embodiment.
  • FIG. 1 is a cross-sectional view showing an example of a non-contact information medium according to the present embodiment.
  • FIG. 2 is a plan view showing an example of an IC inlet of the non-contact type information medium according to the present embodiment.
  • FIG. 3 is a
  • FIG. 6 is a cross-sectional view showing an example of a booklet attached to a non-contact type information medium according to the present embodiment.
  • FIG. 7 is a cross-sectional view showing an example of a conventional non-contact type information medium provided in a cover member.
  • FIG. 8 is a cross-sectional view showing an example of a non-contact type information medium according to the present embodiment provided in the cover member.
  • FIG. 1 is a cross-sectional view showing an example of a non-contact type information medium 1 according to the present embodiment.
  • FIG. 2 is a plan view showing an example of the IC inlet 10 of the non-contact information medium 1 according to the present embodiment.
  • FIG. 3 is a cross-sectional view showing an example of the IC chip 9 of the non-contact information medium 1 according to the present embodiment.
  • the non-contact type information medium 1 includes a plurality of porous thermoplastic base materials 21 and 22 and an IC inlet 10.
  • the plurality of porous thermoplastic base materials 21 and 22 are used as exterior base materials.
  • the porous thermoplastic base materials 21 and 22 are sheet-like.
  • An opening 25 is formed in the porous thermoplastic substrate 21.
  • An opening 26 is formed in the porous thermoplastic substrate 22.
  • the IC inlet 10 is disposed in the openings 25 and 26 of the porous thermoplastic substrates 21 and 22 and is sandwiched between the porous thermoplastic substrates 21 and 22.
  • the IC inlet 10 includes an IC chip 9 and an antenna coil 12 connected to the IC chip 9.
  • the IC chip 9 includes a module unit 14 and a lead frame unit 15.
  • the antenna type is the antenna coil 12 will be described, but other types of antennas are also applicable.
  • the antenna coil 12 is formed on one surface of the antenna sheet base 11. On the other surface of the antenna sheet substrate 11, a wiring shape including the antenna jumper 13 and the like is provided. One end of the antenna coil 12 is connected to one of the lead frame portions 15 of the IC chip 9 via a welded portion 16. The other end of the antenna coil 12 is connected to the other end of the lead frame portion 15 via the antenna jumper 13 via the welded portion 16. Based on the antenna coil 12 and the IC chip 9, the IC inlet 10 is formed.
  • the antenna coil 12 is not limited to a sheet structure, and a wound antenna structure may be used.
  • the antenna coil 12 As a method of forming the antenna coil 12 on the antenna sheet substrate 11, for example, an etching method or a printed antenna method is used. In the present embodiment, it is assumed that the antenna coil 12 is manufactured using an etching method that can increase durability and reliability.
  • a material of the antenna coil 12 and the antenna jumper 13 formed by the etching method for example, aluminum or copper is used.
  • Aluminum is advantageous in that it is inexpensive, easy to process, and resistant to oxidation, but corrosion or dissolution may occur due to contact with the electrolyte. Copper is highly resistant to chemicals but is expensive and tends to corrode due to oxidation.
  • the antenna coil 12 is manufactured by the printed antenna method, the antenna is formed by printing ink containing silver or carbon.
  • a plastic film such as PET or PEN may be used as the antenna sheet substrate 11.
  • a metal thin film is formed on the antenna sheet substrate 11 by plating, vapor deposition, bonding, or the like.
  • Resin is printed on the antenna sheet base material 11 with metal foil obtained in this way, and an antenna coil pattern is formed.
  • the antenna sheet base material 11 on which the antenna coil pattern is formed is immersed in a corrosive solution, an etching process is performed, and portions other than the antenna coil pattern on which the resin is printed are melted and removed to form an etched antenna coil. Is done.
  • An antenna jumper 13 is provided on the surface opposite to the surface on which the antenna coil 12 is formed.
  • the antenna jumper 13 is formed by, for example, forming a metal foil on both surfaces of the antenna sheet base material 11 in advance and providing a resin pattern on both surfaces, and performing an etching process simultaneously with the antenna coil 12, or on one side. After the antenna coil pattern is formed on the antenna jumper 13, only the antenna jumper 13 is attached.
  • the IC inlet 10 may not be applied, and a method in which an antenna is directly formed on the exterior base material by winding or the like may be applied.
  • an antenna is formed by heating a coated copper wire or the like while being embedded in one exterior base material, and this antenna is connected to the IC chip 9, and then the one exterior base material and the other exterior base material are connected.
  • An exterior base material is bonded together.
  • the antenna can be formed more easily than in the etching method, but the stability such as frequency characteristics may be inferior to the etching method, and can be used properly depending on the application.
  • thermoplastic resin sheet such as PVC or PET-G
  • the porous thermoplastic substrates 21 and 22 are used as the exterior substrate of the non-contact type information medium 1.
  • the porous thermoplastic base materials 21 and 22 are generally marketed as resin sheets or synthetic paper imparted with printability for inkjet or offset.
  • FIG. 4 is a cross-sectional view showing an example of an exploded state of the porous thermoplastic base materials 21 and 22 and the IC inlet 10 according to the present embodiment.
  • thermoplastic adhesive layers 23 and 24 are previously applied to the inner portions of the two porous thermoplastic base materials 21 and 22, respectively.
  • the two porous thermoplastic base materials 21 and 22 are laminated with the IC inlet 10 interposed therebetween, and are bonded by applying hot pressure.
  • FIG. 5 is a cross-sectional view showing an example of an assembled state of the porous thermoplastic substrates 21 and 22, the IC inlet 10, and the sealing resin layer 30 according to the present embodiment.
  • the thickness of the IC chip 9 is generally about 100 ⁇ m or more and 300 ⁇ m or less on the module part 14 side and about 100 ⁇ m or more and 300 ⁇ m or less on the lead frame part 15 side. Accordingly, when an assembled general non-contact type information medium is made to have a shape without unevenness without making a hole in the base material, the entire thickness increases, and it is necessary to mold at a high temperature and high pressure.
  • the module part 14 and the lead frame part 15 of the IC chip 9 are exposed through the openings 25 and 26 of the porous thermoplastic substrates 21 and 22.
  • the thickness of the antenna sheet substrate 11 is generally about 20 ⁇ m or more and 40 ⁇ m or less, and the thickness of the antenna coil 12 is about 20 ⁇ m or more and 40 ⁇ m or less. Therefore, the antenna sheet 12 is sandwiched between the porous thermoplastic substrates 21 and 22. By applying, irregularities such as antennas can be absorbed.
  • thermoplastic adhesive ethylene-vinyl acetate copolymer system, ethylene-methacrylic acid copolymer system, polyester system, acrylic resin, nylon system, polyamide system, polyurethane system, polyolefin system, etc.
  • thermoplastic resins can be used.
  • the adhesive layers 23 and 24 have barrier performance.
  • the antenna coil 12 may be protected by this barrier performance.
  • a resin that forms a coating film that is particularly resistant to moisture and suppresses permeation of oxygen or chloride ions is preferably used as the thermoplastic adhesive.
  • thermoplastic adhesive a resin that does not deteriorate due to heat and humidity and hardly peels off at the bonded portion is preferable.
  • two or more types of resins may be mixed as an adhesive, or two or more layers of resins may be applied.
  • a resin that is easy to apply, hardly blocks after drying, and has high durability is suitable.
  • a suitable adhesive by applying a gravure coater with a resin obtained by adding an epoxy crosslinking agent to an ethylene-methacrylic acid copolymer aqueous emulsion adhesive, or a polyolefin or acrylic adhesive. Performance can be obtained.
  • polyester-based adhesives may cause hydrolysis due to humidity, and ethylene-vinyl acetate copolymer adhesives are likely to deteriorate over time, so care must be taken.
  • the module part 14 and the lead frame part 15 of the IC chip 9 are exposed through the openings 25 and 26. ing. In this state, there is a concern that moisture or the like may enter from the gap between the porous thermoplastic base material 22 and the lead frame portion 15.
  • the lead frame portion 15 of the IC chip 9 is often made of copper.
  • the antenna coil 12 is made of aluminum, the electrolyte penetrates to the junction between the IC chip 9 and the antenna coil 12, and the antenna coil 12 is corroded. It is likely to occur. Specifically, aluminum may be dissolved in the electrolyte due to a potential difference generated between aluminum and copper.
  • the electrolyte may pass through the porous thermoplastic base material 22 and contact the antenna coil 12.
  • the antenna coil is the same as when the electrolyte enters from the gap between the lead frame portion 15 and the porous thermoplastic substrate 22. 12 may corrode. Therefore, in this embodiment, as shown in FIG. 5, not only is the gap between the lead frame portion 15 and the porous thermoplastic base material 22 filled with the sealing resin layer 30, but also the exposed portion of the lead frame portion 15. The whole is covered with the sealing resin layer 30 to prevent moisture from entering.
  • FIG. 6 is a cross-sectional view showing an example of the non-contact information medium attached booklet 2 according to the present embodiment.
  • the non-contact type information medium 1 is provided in a booklet by being sandwiched and bonded between a cover member 42 of the booklet and the inner paste paper 41.
  • the inner-attached paper 41 is bonded using an adhesive layer 43 having a barrier performance.
  • an aqueous emulsion adhesive is frequently used from the viewpoint of workability and environment. The reason for this is that equipment for producing a general booklet often bonds paper and paper or cloth and paper.
  • the non-contact type information medium provided in the non-contact type information medium accessory booklet 2 is made using an exterior base material such as PVC or PET-G used for a general IC card, It is difficult to bond the inner sheet 41 with existing equipment and an adhesive, and there arises a problem that the rigidity is increased.
  • the porous thermoplastic base materials 21 and 22 are used as exterior base materials.
  • the porous thermoplastic substrates 21 and 22 have good adhesion to various types of adhesives and have few irregularities.
  • a flexible non-contact information medium-attached booklet 2 can be produced. Furthermore, by mixing a curing agent with the adhesive layer 43 or selecting an appropriate resin system as the adhesive layer 43, moisture, electrolyte, oxygen, and the like are transferred to the non-contact information medium 1 side. Intrusion can be prevented.
  • the porous thermoplastic substrate 22 and the cover member 42 are bonded using an adhesive layer 44 having a barrier performance.
  • an adhesive layer 44 a water-based emulsion adhesive may be used in the same manner as the adhesion of the inner sheet 41.
  • the adhesive layer 44 is formed, for example, together with the sealing resin layer 30 provided on the lead frame portion 15 of the IC chip 9.
  • the adhesive layer 44 is formed as an adhesive layer / sealing resin layer
  • the adhesive layer 44 and the sealing resin layer 30 are manufactured in one step.
  • a dry-curing adhesive such as a water-based emulsion adhesive may not be suitable.
  • the amount of the adhesive used is increased.
  • the volume of the sheet becomes large, a dent is formed on the outside of the cover member 42, and the appearance is deteriorated.
  • an adhesive having a small volume change is used for the adhesive layer 44 and the sealing resin layer 30.
  • the adhesive layer 44 for example, a two-component mixed epoxy adhesive, a moisture curable silicone adhesive, a one-component curable urethane adhesive, or the like can be used.
  • various hot melt adhesives such as an ethylene-vinyl acetate copolymer system, an ethylene-methacrylic acid copolymer, a polyester system, a polyamide system, a polyurethane system, and a polyolefin system can be used.
  • various hot melt adhesives may be used as the adhesive layer 44 with a small volume change.
  • a reactive curing type hot-melt adhesive is effective in terms of durability and anti-deformation property, barrier performance against moisture and various ions.
  • the non-contact type information medium 1 according to the present embodiment configured as described above can obtain high durability by covering the exposed lead frame portion 15 of the IC chip 9 with the sealing resin layer 30.
  • the non-contact information medium 1 according to the present embodiment and the non-contact information medium accessory booklet 2 provided with the non-contact information medium 1 have improved durability and can suppress corrosion of the antenna due to moisture.
  • the non-contact type information medium 1 and the non-contact type information medium attached booklet 2 are smooth and thin in appearance, and have excellent durability, such as an ID card, a driver's license, an electronic passport, a savings passbook, an annuity notebook, or Realize a sailor's notebook.
  • the IC chip 9 and the antenna coil 12 connected to the IC chip 9 are sandwiched between at least two porous thermoplastic substrates 21 and 22. Openings 25 and 26 through which the IC chip 9 is exposed are formed in the porous thermoplastic base materials 21 and 22, respectively.
  • a sealing resin layer 30 that closes the opening 26 is formed on at least the porous thermoplastic substrate 22 on the lead frame 15 side of the IC chip 9. Therefore, in the present embodiment, the sealing resin layer 30 formed in the opening 26 suppresses the intrusion of water or the electrolytic solution and prevents the IC chip 9 or the antenna coil 12 from being corroded.
  • the non-contact type information medium 1 having high flexibility and good compatibility with the adhesive is produced. This feature is particularly important when the non-contact information medium accessory booklet 2 is produced.
  • the sealing resin layer 30 may have a barrier property against the electrolytic solution or various ions.
  • the sealing resin layer 30 may have a barrier property against the electrolytic solution or various ions.
  • a layer having a barrier property against the electrolytic solution and various ions may be formed on the porous thermoplastic base materials 22 and 23. Thereby, the antenna coil 12 can be protected.
  • the antenna coil 12 may be an aluminum antenna formed by an etching method. Thereby, it is possible to obtain superior radio wave characteristics, frequency stability, and oxidation resistance, for example, compared to a copper wound antenna, and durability against corrosion when the electrolytic solution penetrates due to the action of the sealing resin layer 30. Can be secured.
  • the non-contact type information medium 1 may be bonded to the cover member 42 of the non-contact type information medium attached booklet 2 with the same material as the sealing resin layer 30. In this way, by using the adhesive layer 44 for bonding to the cover member 42 also as the sealing resin layer 30, the non-contact information medium accessory booklet 2 having excellent durability can be easily produced. .
  • the sealing resin layer 30 may be a reactive hot melt adhesive.
  • the sealing resin layer 30 may be formed so as to cover the opening 25 on the module unit 14 side.
  • the sealing resin layer 30 formed on the module unit 14 side may be formed integrally with the adhesive layer 43.
  • FIG. 7 is a cross-sectional view showing an example of a conventional non-contact information medium described in International Publication Number WO2011 / 024844.
  • the conventional non-contact information medium 3 includes an aluminum antenna 4.
  • an electrolyte such as salt water
  • corrosion may occur due to a battery effect between the copper of the lead frame portion 15 and the aluminum antenna 4. Therefore, in the conventional non-contact type information medium 3, liquid is prevented from entering by providing a barrier layer on the exterior base material 5 in contact with the aluminum antenna 4.
  • the IC inlet 8 including the IC chip 7 and the aluminum antenna 4 is exposed.
  • the IC inlet 8 and the cover member (cover cloth) 51 are bonded together with an adhesive.
  • the adhesive does not form a smooth film, and the liquid easily penetrates into the non-contact type information medium 3.
  • a protective film 31 or a protective tape is affixed on the module part 14 in order to protect the IC chip 9 from external impacts.
  • the physical loads required for protecting the IC chip 9 are mainly a stamp test and a scratch test using a ballpoint pen. Since the protective film 31 disperses the pressure, the impact resistance performance is improved.
  • the flexibility of the IC chip 9 is reduced by attaching the protective film 31 to the IC chip 9. Moreover, the load at the time of bending may concentrate on the IC chip 9, and the non-contact information medium 3 may be damaged.
  • the protective film 31 is made substantially the same size as the IC chip 9 and is pasted on the IC chip 9 with high accuracy, thereby maintaining the flexibility and ensuring the protection function. ing.
  • FIG. 8 is a cross-sectional view showing an example of the non-contact type information medium 1 according to the present embodiment provided in the cover member 42.
  • the lead frame portion 15 of the IC chip 9 that is not covered (ie, exposed) with the porous thermoplastic base material 22 is sealed with the sealing resin. Sealing with layer 30 prevents the antenna coil 12 from corroding.
  • the opening resin 26 on the lead frame 15 side is filled with the sealing resin layer 30.
  • the sealing resin layer 30 is formed between the lead frame portion 15 and the adhesive layer 44. Thereby, it is possible to prevent the liquid from entering the inside of the non-contact type information medium 1.
  • the adhesive layer 44 a hot melt adhesive resistant to moisture may be used. Therefore, the hot melt adhesive can also be used as the sealing resin layer 30.
  • the adhesive layer 44 is also used as the sealing resin layer 30, the adhesive layer 44 having an increased film thickness is formed on the lead frame portion 15 side of the non-contact type information medium 1, and the cover layer is used thereon.
  • the lead frame 15 is sealed by attaching the member 42 and applying pressure.
  • the adhesive used to bond the cloth is an aqueous emulsion adhesive (for example, vinyl acetate).
  • a water-based emulsion adhesive has low water resistance and a low function as a sealing resin. Therefore, as in this embodiment, the significance of using a hot melt adhesive is great.
  • the sealing resin layer 30 is formed on the lower side (lead frame portion 15 side) of the module portion 14 of the IC chip 9, the cushion effect can be enhanced and the impact resistance can be improved. Can do. As the sealing resin layer 30 and the adhesive layer 44 are softer, cushioning properties can be improved. By selecting a resin having both water resistance and flexibility as the sealing resin layer 30 and the adhesive layer 44, barrier performance and impact resistance performance can be improved.
  • the barrier layer of the base material and the protective film 31 can be deleted, the base material coating process can be simplified, and the production cost can be reduced.
  • the thickness of the sealing resin layer 30 is set to be a porous heat. It corresponds to a step between the plastic substrate 22 and the lead frame portion 15 and is, for example, approximately 1 ⁇ m or more and 20 ⁇ m or less.
  • barrier performance can be obtained if the thickness of the adhesive layer 44 is about 10 ⁇ m or more, while the thickness of the adhesive layer 44 is about 100 ⁇ m. Exceeding this is undesirable because the flexibility of the entire product is reduced.
  • the coating amount of the adhesive layer 44 is appropriately determined in accordance with the thickness standard of the entire product.
  • the sealing resin layer 30 has physical properties that it can be bonded to, for example, the lead frame portion 15 and the porous thermoplastic base material 22, does not transmit moisture, is resistant to chemicals, and has high shock absorption and flexibility for bending.
  • a hot melt adhesive is preferable.
  • thermoplastic adhesive a solvent-based adhesive mainly composed of EVA is used.
  • the antenna coil 12 and the antenna jumper 13 are joined by laser welding, and both ends of the antenna coil 12 are welded to the lead frame portion 15 of the IC chip 9.
  • the outer periphery of the antenna coil 12 is 80 mm ⁇ 48 mm, and the inner periphery is 67 mm ⁇ 37 mm.
  • the inside of the antenna coil 12 is removed by punching with a size of 65 mm ⁇ 35 mm.
  • an outline 2 mm away from the outer periphery of the antenna coil 12 and the IC chip 9 is secured, and the antenna sheet substrate 11 outside the outline is punched and removed to produce the IC inlet 10.
  • the thickness of the module portion 14 of the IC chip 9 is approximately 200 ⁇ m, and the thickness of the lead frame portion 15 is approximately 200 ⁇ m.
  • a porous polyolefin sheet having a thickness of approximately 220 ⁇ m is prepared as the porous thermoplastic substrates 21 and 22, and a polyolefin adhesive is applied to approximately 10 ⁇ m on one side of each of the porous thermoplastic substrates 21 and 22. After these sheets are dried, the sheets are cut into approximately 150 mm ⁇ 200 mm sheets, and openings 25 and 26 are formed in portions overlapping the IC chip 9, respectively.
  • the IC inlet 10 is overlaid on the adhesive surface side of one porous thermoplastic base material 22 prepared as described above, and the other porous thermoplastic base material 21 also has an adhesive surface on the IC inlet 10. They are stacked by being stacked inside.
  • the laminated sheets are bonded by being sandwiched between two SUS plates and heated and pressurized.
  • the bonded laminated sheet is appropriately processed between a heating part temperature of 100 ° C. to 200 ° C., a pressure of 10 Kgf / cm 2 to 50 Kgf / cm 2 , and a processing time of 10 seconds to 60 seconds.
  • a contact information medium 1 is produced.
  • a high quality paper is pasted on the surface of the IC chip 9 of the manufactured non-contact type information medium 1 on the module part 14 side using a vinyl acetate aqueous adhesive mixed with an epoxy curing agent. Further, a cover member 42 is bonded to the surface on the lead frame side of the IC chip 9 of the non-contact type information medium using a reactive urethane hot melt adhesive. Thereby, the non-contact information medium attached booklet 2 is produced.
  • the reactive urethane hot melt adhesive is appropriately applied at a coating amount between approximately 10 ⁇ m and 100 ⁇ m. Thereby, the reactive urethane hot melt adhesive completely covers the lead frame portion 15 of the IC chip 9, and the adhesive layer 44 and the sealing resin layer 30 are formed.
  • the antenna did not dissolve.
  • the sealing resin layer 30 provided in the lead frame portion 15 prevents salt water from entering, and confirms the effectiveness of the contactless information 1 according to the present embodiment and examples.
  • the present invention is applicable to a non-contact type information medium that includes an antenna coil and an IC chip and can record information on the IC chip in a non-contact manner, and a booklet including the non-contact type information medium.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
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PCT/JP2013/061823 2012-04-24 2013-04-23 Support d'informations sans contact et livret comportant un support d'informations sans contact Ceased WO2013161781A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021049245A (ja) * 2019-09-26 2021-04-01 大王製紙株式会社 使い捨ておむつ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009035094A1 (fr) * 2007-09-14 2009-03-19 Toppan Printing Co., Ltd. Feuille d'antenne, transpondeur et forme de livre
JP2009140027A (ja) * 2007-12-03 2009-06-25 Toppan Printing Co Ltd 非接触ｉｃインレット、カバー付き非接触ｉｃインレット、非接触ｉｃインレット付き冊子、及びこれらの製造方法
WO2009104303A1 (fr) * 2008-02-22 2009-08-27 凸版印刷株式会社 Transpondeur et forme de livre
JP2010257416A (ja) * 2009-04-28 2010-11-11 Toppan Printing Co Ltd 情報記録媒体、非接触型ｉｃ付データキャリア、および情報記録媒体の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009035094A1 (fr) * 2007-09-14 2009-03-19 Toppan Printing Co., Ltd. Feuille d'antenne, transpondeur et forme de livre
JP2009140027A (ja) * 2007-12-03 2009-06-25 Toppan Printing Co Ltd 非接触ｉｃインレット、カバー付き非接触ｉｃインレット、非接触ｉｃインレット付き冊子、及びこれらの製造方法
WO2009104303A1 (fr) * 2008-02-22 2009-08-27 凸版印刷株式会社 Transpondeur et forme de livre
JP2010257416A (ja) * 2009-04-28 2010-11-11 Toppan Printing Co Ltd 情報記録媒体、非接触型ｉｃ付データキャリア、および情報記録媒体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021049245A (ja) * 2019-09-26 2021-04-01 大王製紙株式会社 使い捨ておむつ

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