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WO2013160250A1 - Source lumineuse à led - Google Patents

Source lumineuse à led Download PDF

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Publication number
WO2013160250A1
WO2013160250A1 PCT/EP2013/058296 EP2013058296W WO2013160250A1 WO 2013160250 A1 WO2013160250 A1 WO 2013160250A1 EP 2013058296 W EP2013058296 W EP 2013058296W WO 2013160250 A1 WO2013160250 A1 WO 2013160250A1
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WO
WIPO (PCT)
Prior art keywords
led
light source
chip
based light
white
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2013/058296
Other languages
German (de)
English (en)
Inventor
Jörg FRISCHEISEN
Stefan Lange
Frank Jermann
Vera STÖPPELKAMP
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of WO2013160250A1 publication Critical patent/WO2013160250A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Definitions

  • the invention is based on an LED-based light source according to the preamble of claim 1.
  • this is a so-called LED light engine, luminaire or LED.
  • US 2010/025700 and 2007/274093 discloses an LED-based light source for backlighting, which produces in a complex manner by means of two LED groups warm white light colors in the range 2500 to 4500 K.
  • JP2009026672 uses two white LEDs with different color temperature.
  • a formerlygünsti ⁇ ge solution for high-quality LED-based light source be ⁇ riding determine.
  • the novel solution relates to LED-based Lichtquel ⁇ len, especially LED-based lamps or lights or modules or so-called.
  • Light Engines which are based on the partial conversion of light from LEDs through a phosphor layer, so that overall a certain, eg warm white, color impression is created.
  • the conversion can be done close to the chip in a first embodiment.
  • all established conversion techniques are suitable, for example, volume casting, ceramic converter, electrophoretic deposition (EPD), sedimentation, or use by screen printing, knife coating or by spraying produced luminescent plates and a matrix material (CLC / layer transfer).
  • LED chip remote phosphor concept can (s) and phosphor be ge ⁇ spatially separated, so the so-called.
  • the phosphor can be embedded in a matrix, for example plastic, polymer, glass, silicone or the like, which is attached, for example, as a kind of dome or plate over the LED or the LEDs.
  • the basic conversion concepts of a near-chip attachment of the phosphor or remote phosphor concept have various advantages and disadvantages.
  • the Remote Phosphor concept often has efficiency benefits because the LED chips are not directly heated by a near-line phosphor, which keeps the chips cooler and more efficient.
  • an efficiency advantage may be present if the Area within the remote phosphor element has a higher reflectivity than the chip.
  • a serious disadvantage of the remote phosphor concept is the lack of cooling ability of the phosphor with the help of the chip. As a result, depending on the power of the LED-based
  • the light source places special demands on the matrix material of the Remote Phosphor element, since the conversion of light in the Remote Phosphor element produces more or less waste heat. Furthermore, the remote phosphor concept has a significantly higher phosphor demand. From an aesthetic point of view, a remote phosphor element is often a disadvantage. For example, its yellow or orange color leads to an undesirable color impression of the LED-based light source. This is often reduced by an additional scattering element. However, to increase efficiency is graced redu ⁇ .
  • the solution according to the invention provides for a combination of on-chip conversion and remote phosphor, ie it is based on a partial-remote phosphor concept.
  • the light from the blue LEDs is partially converted close to the chip, so that the target color location is not hit by the near-chip conversion alone.
  • the second step of the conversion takes place via one (or more) remote phosphor element (s), which may contain one or more phosphors and additional spreaders.
  • the red portion of the spectrum can be generated either partially close to the chip or partly via the remote phosphor element.
  • the Partial Remote Phosphor concept can also be combined with the Brilliant Mix concept or with the Hybrid Remote concept.
  • LEDs or LEDs with a color locus in the range between the color location of a blue LED and a cold white color locus there is sometimes a larger offer and the price may be lower than for corresponding blue LEDs (without chipna ⁇ he conversion).
  • Partial Remote Phosphor (and also Remote Phosphor itself) is ideal for a platform strategy (ie as many components of the lamp as possible should be the same for many lamp types).
  • the LEDs or LED light engines / chips on
  • the total phosphor demand in the Remote Phosphor element may also be lower. On the one hand, this can lower the cost of the phosphor, and on the other hand, it can be aesthetically pleasing because the remote phosphor element gives a less colorful (for example yellow or orange) impression.
  • LED-based light source with at least one chip or LED and a phosphor, which is connected upstream of the chip or the LED, wherein the phosphor is disposed in the immediate vicinity of the chip ⁇ in thermal contact, so that a LUKOLED system is present, characterized in that at least one further phosphor spaced upstream of the chip without thermal coupling to the LUKOLED system, wherein the LUKOLED knows a certain color tempera ture ⁇ radiates and wherein the light source white of a different color temperature or radiates with other CRI ,
  • LED-based light source according to proposal 1, characterized marked ⁇ records that the LUKOLED ready-made goods.
  • LED-based light source according to proposal 1, characterized marked ⁇ characterized in that the thermal bridge is additionally equipped with a means for heat spreading.
  • LED module according to proposal 3 characterized in that the means for heat spreading is a vapor-containing cavity, in particular a cavity in a metal tube.
  • the heat exchanger is a body made of open-pored Graphitschaum having at least one side surface.
  • LED module characterized in that the body is a cuboid with side surfaces, in particular with narrow sides and broad sides.
  • LED module according to proposal 5 characterized in that at least one side surface are in thermal contact with the thermal bridge ⁇ .
  • LED module according to proposal 1 characterized in that the LED module is a light engine.
  • LED module according to proposal 8 characterized in that the body has two opposing second side ⁇ surfaces with slots, wherein the slots on the two second side surfaces are offset from each other.
  • Fig. 1 is a schematic diagram of an LED-based light source
  • FIG 16 shows the basic principle of the invention
  • FIGS. 17 to 26 each show in pairs the emission spectrum of a white LED and the color locus of the light engine without and with a remote phosphor element for four different exemplary embodiments. 0
  • FIG. 1 shows an LED-based light source 1 with an LED module, in particular a light engine, the concrete structure of which does not play a role for the invention. It uses the partial remote phosphor concept.
  • a chip 2 is seated on a substrate 3, wherein is is introduced ⁇ directly on the chip a layer of phosphor. 4
  • a layer of phosphor 4
  • near-chip partial conversion takes place.
  • the phosphor is, for example, emitting green or yellow. It converts some of the blue radiation of the chip.
  • the partially converted light (black arrow) of the chip reaches the dome 5, at which a remote phosphor element 6 is underge ⁇ introduced .
  • the dome itself or a separate remote phosphor element 6 attached thereto may contain an additional scattering agent such as TiO 2.
  • a portion of the teilkonvert striving light is converted by the remote phosphor element 6, so that the entire radiation (white arrow) results in, for example, white or causes a specially ⁇ len color impression.
  • Figure 2 shows a prior art for an LED-based light source 1 with chip-near conversion.
  • white light is generated close to the chip by the fact that a chip 2 is seated on a substrate 3, to which one or more phosphors 4 are connected in front of the surface directly or by means of an attached matrix.
  • the chip is emitting blue and part of the light is emitted through a yellow or through two phosphors that emit green and red, shifted to longer wavelengths.
  • Figure 3 shows a similar concept of an LED-based light source ⁇ 1, wherein the chip 2 is seated with the near-surface light-emitting material in layer 4 in a housing 7 and wherein the housing includes a diffusion plate 8 is connected upstream as a cover plate.
  • Figure 4 shows a pure on the remote phosphor concept ba ⁇ sierende LED 10 with dome 11. In this case, all the phosphors of the chip, which emits blue, spatially spaced. They sit in particular on the dome 11 as the inner layer 12, together with another layer 13, the scattering means ent ⁇ holds.
  • the so-called BY concept ie the partial conversion of the blue primary radiation of the chip into yellow (blue-yellow).
  • FIG. 5 shows the same principle, wherein the layers of the phosphors 12 and scattering means 13 on a cover plate 8, which is spaced from the chip 2, are mounted or incorporated.
  • FIG. 6 shows an LED-based light source 1 which uses the so-called Brilliant Mix concept. While sitting on a sub ⁇ strate both a blue-emitting LED 2a 2b and a red-emitting LED. Only the light of the blue LED is partially converted directly near the chip through a phosphor layer 4.
  • Useful is a yellow conversion to green conversion.
  • the mixture of the radiation of both LEDs gives again white light (white arrow).
  • FIG. 7 shows schematically an LED-based light source 1, which uses the so-called Brilliant Mix concept, with remote phosphor solution.
  • a common dome 11 bulges over a blue and a red emitting LED 2a and 2b.
  • the dome 11 sitting phosphors 15 and scattering means 16th (shown schematically), the blue light partially kon ⁇ vertieren, but the red light, except for the scattering, can pass unhindered.
  • FIG. 8 schematically shows the magenta concept.
  • a pair of blue-emitting LEDs 2a, 2c are used, which need not necessarily have the same peak wavelength.
  • the radiation of the first LED 2a is passed freely to a dome 11, which is mounted at a distance.
  • the radiation of the second LED 2 c is converted close to the chip by a suitable layer 4 long-wave, in particular to red or magenta.
  • a luminescent ⁇ fabric 15 is attached, possibly also scattering means 16, where ⁇ in the phosphor, the blue light partially converted into yellow or green light. Overall, white light is generated here as well.
  • FIG. 9 shows an exemplary embodiment of an LED-based light source 1 according to the invention, which uses the partial remote phosphor concept.
  • a LUKOLED in which the chip 2 of a near-chip conversion is subjected to know already. This is done by means of a near-chip layer 4 of luminescent ⁇ material or phosphors.
  • This LUKOLED emits in particular ⁇ cold white or it is an LED, which was intended for backlighting and therefore was inexpensive.
  • the housing 7 is provided with a cover disk 8, on or in which further phosphors 15 and possibly scattering means 16 are brought under ⁇ . These other phosphors are used to change the light color of the primary white.
  • the light color warm white or neutral white or daylight-like white up to skywhite is produced secondarily.
  • One concept of the invention is therefore the modification of the color temperature, in particular specifically towards lower color temperatures, with a delta of at least 100 K, preferably 200 K up to 1500 K.
  • the color temperature can be temperature from neutral white or cool white (here 4000 to 4800 K) to warm white (typically 2600 to 3200 K).
  • Typical representatives of primary white are LEDs for backlighting units (BLU) with a light color from daylight white to skywhite or even higher.
  • Figure 10 shows the partial remote phosphor concept applied to an LED based light source 1 using the Brilliant Mix concept.
  • a first LED or a chip 2a is used, whose primary radiation is blue and whose radiation is partially converted by a phosphor 4 arranged close to the chip.
  • the phosphor emits yellow or green.
  • the LED 2a is overall again, for example, cold white emitting or originally intended for use in backlighting units.
  • a second LED 2b is arranged on the same substrate 3, which emits red. The light of both
  • LEDs impinge on a dome 5 bulging over both LEDs.
  • further phosphors 15 and possibly scattering means 16 are accommodated, which mix the light from both LEDs or convert it to a white, which differs from the original one first LED is different.
  • FIG. 11 shows the partial remote phosphor concept applied to an LED-based light source 1 in a similar From ⁇ operation example, however, the dome is replaced by a front ⁇ disc. 8
  • the two chips 2a and 2b sit in a housing 7, the cover 8 is the windscreen.
  • Figure 12 and 13 show in an analogous manner two LEDs 1, each as a co-variant ( Figure 12) and front window variant is used in de ⁇ NEN the partial remote phosphorus-concept on the hybrid or magenta concept ( FIG. 13).
  • the first chip on the substrate is a cool-white emitting or neutral-white emitting LED 2a intended for backlighting units.
  • Your blue-emitting chip is for the production of the first white light color, for example, cold white, chipnah a phosphor 4a for a partial conversion from yellow to green upstream, as known.
  • the second chip 2b is likewise emitting blue, wherein the chip is preceded by a suitable red emitting phosphor 4b for conversion from magenta to red.
  • a dome 5 or disk 8 which overhangs the two chips, is spaced again upstream.
  • a ceramic plate is used as a disc 8 or part of the disc 8.
  • This remote phosphor element has at least one phosphor 15 and possibly scattering agent 16. This allows white light of any requirement to be realized.
  • Figure 14 shows a retrofit LED lamp 18 employing the partial remote phosphor concept. It has a So ⁇ ckel 19, a housing 21 containing electronics, and a dome 17 on the housing. In this case, the primary radiation and near-chip partial conversion is generated in the LEDs 20 mounted on the housing. The partial downstream conversion and scattering is generated in the area of the dome 17.
  • FIG. 15 shows a similar concept for an LED module 25.
  • the primary radiation and partial conversion close to the chip are generated in the case of the LEDs 20.
  • the partial downstream convergence ⁇ sion is generated in the area of the dome 17th Finally, the scattering in the area of the outer dome-shaped cover 48.
  • Figure 16 shows the basic principle of the present invention. Shown is the CIE diagram, wherein the first color locus (1) represents the color locus of the LED with chip-near conversion, for example according to FIG. 1 or FIG.
  • the partially Konversi ⁇ one according remote phosphor concept then shifts the color coordinates for a second color location (2). For example, this second color locus (2) lies exactly on the Planck curve P.
  • color locus 1 can be achieved by various combinations of LED (s) with one or more phosphors and optionally additional scatterers.
  • the wavelength of the LED (s) plays a major role. It is advantageous as Peak wavelength of the LED 420 nm to 480 nm, in particular 430 to 460 nm used.
  • the remote phosphor element may be one or more light emitting materials, and optionally additional ⁇ spreader included to pass from locus to locus 1 2 mediated using the rate ⁇ cheap LED, the color locus.
  • phosphors which are suitable for use in the remote phosphorus element, in particular garnets, orthosilicates, chlorosilicates, nitridosilicates and derivatives thereof are proposed, in particular:
  • Figure 16 refers to a light engine that makes the right ⁇ geous the following concept to Use.
  • white LEDs such as cool white emitting LEDs.
  • a remote phosphor element such an LED can be used as a light source of a light engine, wherein the color location changing phosphor is housed in the remote phosphor element. In this way, it is possible to Use of considerably more expensive blue LEDs as a light source for the light engine can be dispensed with.
  • two concrete embodiments will be explained in more detail.
  • the primary light source has a single phosphor upstream of the chip.
  • the ⁇ se LED is originally intended for display backlighting.
  • the original first and only chip-near phosphor is a conventional YAG: Ce with Al / Ga content (YaGaG: Ce), specifically, it is in particular
  • the primary light source is a blue LED with Peakwellenlän- ge 444 nm, the light from the YAG: Ce yellow Conver ⁇ advantage in part, so that overall, a white color impression is corresponds.
  • the remote phosphor element is a mixture of two phosphors, a simplified YAG: Ce and a CaAlSiN. Specifically, the phosphors (YO .96 CeO .04) 3A15012 and CaO .996EuO .004AlSiN3 are used together in the remote phosphor element.
  • FIG. 17 shows the emission of the light engine without a remote phosphor element (curve 1) and with a remote phosphor element (curve 2).
  • FIG. 18 shows the color locus of a light engine without a remote phosphor element (circle) and with a remote phosphor element (triangle).
  • the color temperature here is new 2700 K and the color rendering index CRI is 80.
  • the visual efficiency is 300 lm / W_vis.
  • the light engine is based on a BLU LED with a high color temperature as the primary white.
  • FIG. 19 shows the emission of a light engine with / without a remote phosphor element in a second exemplary embodiment.
  • the primary light source is the same as in the first exemplary embodiment.
  • the remote phosphor element is selected on ⁇ ders.
  • a remote phosphor element a mixture of two phosphors is used, one of them same YAG: Ce as it is also used close to the chip as well as a nitridosilicate.
  • the phosphors a mixture of two phosphors is used, one of them same YAG: Ce as it is also used close to the chip as well as a nitridosilicate. Specifically, the phosphors
  • FIG. 19 shows the emission of the light engine without a remote phosphor element (curve 1) and with a remote phosphor element (curve 2).
  • the color temperature here is 3000 K and the color rendering index CRI is 72.
  • the visual efficiency is 338 lm / W_vis. With color temperature here possibly the closest color temperature is meant.
  • FIGS. 21 and 22 show a further embodiment with the same original light engine.
  • the same phosphor is used in the remote phosphor element as in the primary light source, ie
  • the 22 shows the color locus of a light engine without a remote phosphor element (circle) and with a remote phosphor element (triangle).
  • the color temperature here is new 6500 K and the color rendering index CRI is 73.
  • the visual efficiency is 306 lm / W_vis.
  • the primary light source has two phosphors connected upstream of the chip.
  • This LED was originally intended for display backlighting.
  • the originally sprünön first and second chip near phosphors are a üb ⁇ Licher LuAG: Ce with Al content, specifically, it is in particular ⁇ sondere to (LuO .99CeO .01) 3A15012.
  • the second phosphor is a common calsine, in particular CaO .996EuO .004AlSiN3.
  • the primary light source is a blue LED with Peakwellenlän- ge 442 nm, the light from the LuAG: Ce and the calsin is partially converted to green and red, so that overall a white ⁇ SSER color impression.
  • the remote phosphor element used is a mixture of two phosphors, a YAG: Ce and a CaAlSiN. Specifically, the phosphors (YO .96CeO .04) 3A13.75Gal .25012 and CaO .996EuO .004AlSiN3 be ge ⁇ jointly used in the remote phosphor element.
  • FIG. 23 shows the emission of the light engine without a remote phosphor element (curve 1) and with a remote phosphor element
  • FIG. 24 shows the color locus of a light engine without a remote phosphor element (circle) and with a remote phosphor element (triangle).
  • the color temperature here is now 2700 K and the color rendering index CRI is 91.
  • the visual effect is 275 lm / W_vis.
  • Color loci for BLU LEDs are inside a rectangle in the CIE xy diagram with the following vertex coordinates, respectively
  • FIG. 25 shows the emission of a light engine without a remote phosphor element (curve 1) and with a remote phosphor element (curve 2).
  • FIG. 26 shows the color locus of this light engine without a remote phosphor element (circle) and with a remote phosphor element (triangle).
  • This is an execution ⁇ example based on the Brilliant Mix concept, ie to ⁇ sharmaji red LED.
  • the same BLU LED was used as in the previous embodiments.
  • the original the color locus is 0.26 / 0.22 as x / y coordinates in the CIE color chart.
  • the color temperature here is new 2700 K and the color rendering index CRI is 91.
  • the visual efficiency is 354 lm / W_vis.
  • the primary light source is a blue LED with a peak wavelength of 444 nm, whose light is primarily converted by YaGaG: Ce, so that first of all a first white color impression is produced.
  • the same phosphor is used as the remote phosphor element. Specifically, the phosphor is

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Abstract

L'invention concerne une source lumineuse à LED (1), qui comporte en tant que source lumineuse primaire au moins une LED émettant de la lumière blanche par conversion proche de la puce au moyen d'au moins un matériau luminescent. Son rayonnement peut encore être modifié par au moins un autre matériau luminescent (15) d'un moyen d'écartement.
PCT/EP2013/058296 2012-04-26 2013-04-22 Source lumineuse à led Ceased WO2013160250A1 (fr)

Applications Claiming Priority (2)

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DE102012206966A DE102012206966A1 (de) 2012-04-26 2012-04-26 LED-basierte Lichtquelle
DE102012206966.6 2012-04-26

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WO2013160250A1 true WO2013160250A1 (fr) 2013-10-31

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DE102014117423A1 (de) * 2014-11-27 2016-06-02 Seaborough IP IV BV Lichtemittierende Remote-Phosphor-Vorrichtung
US10276762B2 (en) 2014-09-08 2019-04-30 Osram Opto Semiconductors Gmbh Optoelectronic component

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DE102014207664A1 (de) * 2014-04-23 2015-10-29 Osram Gmbh Leuchtvorrichtung mit Lichterzeugungseinrichtung und Leuchtstoffkörper
DE102014112973A1 (de) 2014-09-09 2016-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil

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Publication number Priority date Publication date Assignee Title
US10276762B2 (en) 2014-09-08 2019-04-30 Osram Opto Semiconductors Gmbh Optoelectronic component
DE102014117423A1 (de) * 2014-11-27 2016-06-02 Seaborough IP IV BV Lichtemittierende Remote-Phosphor-Vorrichtung
CN105295903A (zh) * 2015-11-03 2016-02-03 江苏罗化新材料有限公司 一种高显指白光和背光源led用氮化物红色荧光粉的制备方法

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