Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V31/00—Gas-tight or water-tight arrangements
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V19/00—Fastening of light sources or lamp holders
  • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
  • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
  • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V5/00—Refractors for light sources
  • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
  • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
  • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
  • F21W2131/10—Outdoor lighting
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2105/00—Planar light sources
  • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2115/00—Light-generating elements of semiconductor light sources
  • F21Y2115/10—Light-emitting diodes [LED]

Definitions

• a method of assembling a node of radiation sources and an LED lighting device containing such a node is a method of assembling a node of radiation sources and an LED lighting device containing such a node. "Field of technology.
• the invention relates to lighting engineering and can be used in the manufacture of high-intensity LED lighting equipment for general, outdoor and indoor lighting.
• the process of conversion of electric energy by light emitting diodes into light radiation is accompanied by significant heat generation.
• heat-conducting paste is used or to minimize air gaps by pressing the board to the surface of the radiator through a heat-conducting paste.
• Distant analogues are known containing a case, transparent glass covering a printed circuit board with LEDs and resting on a radiator case
• radiator screw (EP2306035 (A1), IPC EP2306035 (A1), published on 04/06/2011).
• a known LED module in which a board with LEDs is mounted on the surface of the radiator with the possibility of thermal contact, optically
• a transparent panel covers the board and is tightly attached to the surface of the radiator.
• a transparent sealant is pumped into the cavity between the optical panel and the board through a special fitting, which, expanding when heated, creates the force required to press the board (CN101776256 (A), IPC F21V31 / 04, published July 14, 2010).
• the technical result of the claimed solution is to reduce the thermal deformation of the optical panel, improving manufacturability, ensuring tightness and improving heat dissipation from the LED board.
• LED lighting device including the placement of the board of light sources on the surface of the radiator; placement and sealing of the optical panel; and the creation of efforts to clamp the board to the radiator, characterized in that the optical panel is connected to the first surface of the elastic insulating layer, the second surface of which is connected to the surface of the LED board, and the connection of the said elastic surfaces
• the claimed solution characterizing the site of the radiation sources made by the specified method includes the following set of essential features:
• a source of radiation containing an optical panel; radiator; a board with LEDs placed on the radiator with the possibility of heat transfer; means for clamping the board to the radiator, characterized in that between the LED board and the optically transparent panel there is an elastic electrical insulating layer connected by the first surface to the surface optically
• the elastic layer can be formed by a silicone compound, which is applied through a stencil, for example, in the form of a mesh, on
• figure 1 shows a fragment of a cross section of a lighting device containing a node of radiation sources
• figure 2 shows an enlarged image of a fragment of the node of the radiation sources shown in Fig. 1, illustrating an embodiment of the means of clamping the board to the radiator;
• Fig. 3 shows an isometric image of a board with an elastic electrical insulating layer and an optical panel in a parsing.
• the source of radiation sources (Fig. 1) contains a radiator 1, a board 2 of LEDs, an elastic insulating layer 3, an optical panel 4, and elastic elements 5 of the clip.
• a gap b is provided between the radiator 1 and the board 2, a gap b is provided to compensate for the possible thermal linear expansion of the board 2 (figure 2).
• the optical panel 4 with all adjacent structural parts has connections that allow free mutual displacement within the limits of thermal expansion.
• the elastic elements 5 of the clamp are installed in the profiled groove 10 of the radiator 1 so that the elastic forces of the elements 5 create pressure on the surface of the optical panel 4, which is transmitted through the elastic insulating layer 3 to the board 2, pressing it to the surface of the radiator 1.
• the circuit board 2 (FIG. 3) has LEDs 7, on which an elastic insulating layer 3 is placed, equipped with holes 8 made with the possibility of placing LEDs 7 on them.
• lenses 9 are formed, the optical properties of which are selected depending on the problem being solved.
• the heat generated by the LEDs 7 is mainly dissipated through the thermal contact of the board 2 with the surface of the radiator 1.
• the quality of heat exchange between the contacting surfaces of the board 2 and the radiator 1 depends on the surface area of their contact. To ensure the constancy of the heat exchange area, the board 2 is pressed against the radiator 1 using elastic elements 5.
• a street high-power LED lighting device As a specific example of the implementation of the claimed solution, it is possible to indicate a street high-power LED lighting device, a fragment of which is shown in Fig. 1.
• a polycarbonate optical panel 4 is located on one of the surfaces of the formation 3.
• the heat generated by the LEDs 7 causes the thermal expansion of the board 2. Due to the difference in the linear expansion coefficients of the materials, a mechanical shift occurs.

Landscapes

• Engineering & Computer Science (AREA)
• General Engineering & Computer Science (AREA)
• Led Device Packages (AREA)
• Fastening Of Light Sources Or Lamp Holders (AREA)
• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Priority Applications (3)

Applications Claiming Priority (1)

Publications (1)

Family

ID=49327919

Family Applications (1)

Country Status (3)

Families Citing this family (1)

Citations (8)

Family Cites Families (6)

• 2012
  • 2012-04-13 EP EP12874074.3A patent/EP2837875A4/fr not_active Withdrawn
  • 2012-04-13 WO PCT/RU2012/000284 patent/WO2013154452A1/fr not_active Ceased
  • 2012-04-13 EA EA201400360A patent/EA025099B1/ru not_active IP Right Cessation

Patent Citations (8)

Non-Patent Citations (1)

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