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WO2013151265A1 - Appareil d'éclairage à diodes électroluminescentes - Google Patents

Appareil d'éclairage à diodes électroluminescentes Download PDF

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Publication number
WO2013151265A1
WO2013151265A1 PCT/KR2013/002513 KR2013002513W WO2013151265A1 WO 2013151265 A1 WO2013151265 A1 WO 2013151265A1 KR 2013002513 W KR2013002513 W KR 2013002513W WO 2013151265 A1 WO2013151265 A1 WO 2013151265A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
light
wavelength conversion
conversion material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2013/002513
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English (en)
Korean (ko)
Inventor
정정화
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seoul Semiconductor Co Ltd
Original Assignee
Seoul Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Semiconductor Co Ltd filed Critical Seoul Semiconductor Co Ltd
Publication of WO2013151265A1 publication Critical patent/WO2013151265A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0025—Combination of two or more reflectors for a single light source
    • F21V7/0033—Combination of two or more reflectors for a single light source with successive reflections from one reflector to the next or following
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light emitting diode lighting apparatus using a light emitting diode as a light source, and more particularly to a light emitting diode lighting apparatus employing a remote phosphor.
  • Semiconductor light emitting diodes have been used in various applications due to various advantages such as excellent response, high energy efficiency, and long lifespan, and have recently been spotlighted as light sources of lighting light emitting devices.
  • Lighting devices employing semiconductor light emitting diodes typically include white light emitting diodes and phosphors to realize white light by light mixing.
  • white light may be realized by a combination of a blue light emitting diode and a yellow phosphor.
  • the lighting device includes a secondary lens, and the white light is emitted to the outside over a large area through the secondary lens.
  • a direct lighting device In such a general white lighting device, light emitted from a light emitting diode and light converted in wavelength from a phosphor are used as direct illumination light.
  • Such a direct lighting device may be harmful to the human body because relatively strong light emitted from the light emitting diode is directly incident to the naked eye.
  • the phosphor is disposed on the light emitting diode chip or contained in a resin covering the light emitting diode chip and disposed near the light emitting diode chip in the light emitting diode package.
  • the heat generated by the light emitting diode reduces the conversion efficiency of the phosphor and tends to discolor the binder material containing the phosphor, such as silicon or epoxy.
  • the binder material containing the phosphor such as silicon or epoxy.
  • the higher the output light emitting diode is used the more the efficiency of the phosphor is further reduced and the reliability is also worsened. Further, the light converted in the phosphor is incident again to the light emitting diode and is likely to be lost.
  • remote phosphor technology in which the phosphor is disposed away from the light emitting diode chip in order to reduce the conversion efficiency of the phosphor and discoloration of the binder material, has been studied.
  • part of the light converted from the phosphor is incident again into the lighting device and lost.
  • the light emitted through the secondary lens is concentrated on the central axis of the secondary lens, hot spots where the light flux is concentrated at the center are likely to occur.
  • unconverted light is concentrated along the lens center axis, it is difficult to emit uniform white light.
  • the technical problem of the present invention is to provide a lighting device that can protect the human body, in particular the eyes of the user.
  • Another technical problem of the present invention is to provide a lighting device capable of reducing the conversion efficiency of the phosphor and discoloration of the binder material.
  • Another technical problem of the present invention is to provide an illumination device capable of removing a hot spot where light is concentrated along a central axis of a secondary lens.
  • Another technical problem of the present invention is to provide an illumination device capable of preventing the loss of light converted by a phosphor.
  • Illumination apparatus a printed circuit board; A light emitting diode mounted on the printed circuit board; A lens having an incident surface on which light emitted from the light emitting diode is incident, an inner reflection surface, a bottom reflection surface, and an emission surface on which light is emitted; A wavelength conversion material disposed on the lens opposite the light emitting diode and containing a phosphor; And a reflector positioned on the wavelength conversion material.
  • the wavelength conversion material and the reflector are located on the central axis of the lens.
  • the wavelength conversion material may be located on the lens surface region surrounded by the emission surface.
  • the lower reflecting surface reflects the light reflected by the reflector to the exit surface.
  • a reflective coating layer may be formed on the lower reflective surface to reflect light.
  • the light emitting diode may be mounted in a light emitting diode package and mounted on the substrate.
  • the wavelength conversion material and the reflector may be disposed to cover a range of the directivity angle of the light emitting diode package.
  • the light emitting diode may be directly mounted on the printed circuit board.
  • the printed circuit board may include a heat sink, and the light emitting diode may be mounted on the heat sink.
  • the wavelength conversion material may include at least one of blue, green, yellow, and red phosphors.
  • a plurality of light emitting diodes may be mounted on the printed circuit board, and the plurality of light emitting diodes may be ultraviolet light emitting diodes emitting ultraviolet light, blue light emitting diodes emitting blue light, and red light emitting red light. It may include a light emitting diode. Furthermore, the lens may cover these light emitting diodes such that light emitted from the ultraviolet light emitting diode, the blue light emitting diode, and the red light emitting diode is incident.
  • the reflector may have a wider width than the wavelength converting material, and at least some of the light emitted from the blue light emitting diode and the red light emitting diode may directly enter the reflector without passing through the wavelength converting material. Accordingly, the blue light of the blue light emitting diode and the red light of the red light emitting diode may be emitted to the outside, thereby controlling the color of light emitted from the lighting device.
  • the wavelength converting material may cover a range of the directivity angle of the ultraviolet light emitting diode.
  • a lighting device that can protect the eyes of the user by preventing the light emitted from the light emitting diode is directly incident on the eyes of the user.
  • the phosphor is disposed on the lens away from the light emitting diode, reduction in conversion efficiency and discoloration of the phosphor can be prevented.
  • the reflector on the central axis of the lens, hot spots where light is concentrated along the central axis of the lens can be eliminated.
  • the wavelength-changed light from the wavelength conversion material is incident on the lens and then reflected back from the lower reflecting surface to be emitted to the outside, the light converted by the phosphor can be prevented from being incident and lost inside the light emitting diode or the lens.
  • a lighting device can be provided.
  • FIG. 1 is a schematic cross-sectional view for describing a lighting apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view for describing a lighting apparatus according to an embodiment of the present invention.
  • 3 is a cross-sectional view illustrating a wavelength conversion material and a reflector.
  • FIG. 4 is a schematic cross-sectional view for describing a lighting apparatus according to still another embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view for describing a lighting apparatus according to still another embodiment of the present invention.
  • FIG. 1 and 2 are schematic cross-sectional views and plan views for explaining a lighting apparatus according to an embodiment of the present invention.
  • the lighting apparatus includes a printed circuit board 10, a light emitting diode package 20, a lens 30, a wavelength converting material 31, and a reflector 33.
  • the lighting device may include a reflective coating 35.
  • the printed circuit board 10 is not particularly limited as long as it has a circuit for supplying power to the LED package 20, and may be, for example, FR4-PCB, M-PCB, or MC-PCB.
  • the light emitting diode package 20 may include a light emitting diode 20a, and may include a sealing resin (not shown) for sealing the light emitting diode 20a.
  • the sealing resin may have a lens shape.
  • the light emitting diode package 20 emits light emitted from the light emitting diode 20a within a predetermined direction angle range.
  • the light emitting diode package 20 emits light onto the printed circuit board 10 and is not particularly limited thereto.
  • the light emitting diode 20a is mounted on a package and mounted on the printed circuit board 10.
  • the light emitting diode 20a may be, for example, a light emitting diode emitting ultraviolet or blue light.
  • the lens 30 has an incident surface 30a through which light emitted from the light emitting diode 20a is incident, the lower reflective surface 30c, and an exit surface 30d through which light is emitted.
  • the lens 30 includes a surface area 30b in which the wavelength conversion material is located on the central axis thereof.
  • the incident surface 30a is positioned above the light emitting diode package 20. As illustrated, the incident surface 30a may be concave inside the lens 30, and the light emitting surface of the LED package 20 may be surrounded by the incident surface 30a. Light emitted from the light emitting diode package 20 is incident into the lens 30 through the incident surface 30a and mostly travels to the surface area 30b.
  • the wavelength conversion material 31 is located on the surface area 30b.
  • the wavelength conversion material 31 includes a phosphor.
  • the wavelength conversion material 31 may include at least one of blue, green, yellow, and red phosphors.
  • Various colors of light may be realized by the combination of the light emitting diode 20a and the phosphor.
  • the light emitting diode 20a emits blue light
  • the wavelength converting material 31 includes a yellow phosphor, so that white light may be realized
  • the light emitting diode 20a emits ultraviolet light
  • the wavelength conversion The ash 31 may include blue, green and red phosphors, so that white light may be realized.
  • light of a color other than white light may be implemented.
  • the wavelength converting material 31 may be formed by directly depositing a phosphor on the surface of the lens 30 locally, or may be formed by coating a resin surface containing a phosphor on the lens surface by spraying or the like. Alternatively, the wavelength conversion material 31 may be prepared by sintering the phosphor or by incorporating the phosphor in glass or plastic, and then attaching the phosphor to the surface of the lens 30.
  • the wavelength converting material 31 converts the light incident on the surface region 30b.
  • the wavelength conversion material 31 may have a size covering a range of a directivity angle of light emitted from the light emitting diode package 20.
  • the wavelength conversion material 31 has a width wider than that of the light emitting diode package 20. Since the wavelength conversion material 31 is positioned away from the light emitting diode 20a by the lens 30, conversion efficiency reduction and discoloration due to heat of the light emitting diode 20a are prevented.
  • the reflector 33 is located on the wavelength conversion material 31.
  • the reflector 33 may include an insulating reflecting layer, such as a metal reflecting layer or a distributed Bragg reflector. Part of the light emitted by the wavelength converting material 31 or the light emitted from the light emitting diode 20a and not converted is passed through the wavelength converting material 31 to the reflector 31, and the reflector 31 Reflected to proceed to the wavelength conversion material 31 again. Therefore, the unconverted light can be converted again by the wavelength converting material 31.
  • the lower reflective surface 30c is positioned below the lens 30.
  • the light reflected by the reflector 33 proceeds to the lower reflecting surface 30c, is reflected by the lower reflecting surface 30c, and is emitted to the outside through the emission surface 30d.
  • the lower reflective surface 30c may reflect light by using total internal reflection due to the refractive index, or may reflect light by the reflective coating layer 35 for reflecting light.
  • the reflective coating layer 35 may be formed of a metal layer that reflects light, for example, Al.
  • the emission surface 30d is a surface in which the light L1 incident inside the lens 30 is emitted to the outside, and in particular, the light reflected from the lower reflection surface 30c is emitted to the outside through the emission surface 30d. do.
  • the emission surface 30d may have a convex shape upward as shown, but the shape may be variously modified.
  • the wavelength conversion material 31 is positioned on the central axis of the lens 30, and the emission surface 30d may surround the wavelength conversion material 31. Therefore, surface light axially symmetric with respect to the central axis can be realized.
  • the light L1 is emitted using the reflector 33 and the lower reflecting surface 30c, the light from the light emitting diode 20a can be prevented from directly entering the user's eyes.
  • the reflector 33 and the wavelength conversion material 31 are positioned on the central axis of the lens, hot spots where light is concentrated along the central axis can be eliminated.
  • FIG. 3 are cross-sectional views illustrating various examples of reflectors and wavelength converting materials that may be used in an embodiment of the present invention.
  • the wavelength conversion material 31 is formed of glass or plastic containing ceramic or phosphor sintered phosphor, and a reflector 33 is formed on the wavelength conversion material 31.
  • the reflector 33 may be a metal reflective layer or an insulating reflective layer, and may be formed on the wavelength conversion material 31.
  • the wavelength converting material 31 and the reflector 33 may be integrally mounted on the surface area 30b of the lens 30 of FIG.
  • the wavelength converting material 31 and the reflector 33 are substantially similar to those described with reference to FIG. 3A, but in this example, the wavelength converting material 31 is the lens 30. It is formed to be bent along the shape of the surface area 30b, and a reflector 33 is formed thereon.
  • the wavelength conversion material 31 according to the present example may be in close contact with the surface region 30b when the surface region 30b of the lens 30 is bent.
  • the wavelength conversion material according to the present example is divided into at least three regions.
  • the red wavelength conversion material 31r, the green wavelength conversion material 31g, and the blue wavelength conversion material 31b may be formed.
  • the wavelength converting material of FIGS. 3A and 3B may contain a single phosphor or may contain a plurality of phosphors mixed with each other. In this example, the phosphors may be separated from each other.
  • these wavelength converting members 31r, 31g, and 31b may be positioned on the substrate 35, and the reflector 33 is positioned between the substrate 35 and the wavelength converting members.
  • the reflectors 33 may be separated from each other in correspondence to the wavelength converting materials 31r, 31g, and 31b, or may be formed as a single reflector.
  • the wavelength conversion material 31 according to the present examples may be manufactured separately from the lens 30 and then attached to the lens 30.
  • Various kinds of wavelength conversion materials 31 including different phosphors may be manufactured separately from the lens 30. Therefore, by mounting the required wavelength conversion material 31 to the lens 30, it is possible to easily implement the color of the desired lighting device without replacing the light emitting diode package 20, it is possible to easily change the color of the lighting device as needed have.
  • FIG. 4 is a schematic cross-sectional view for describing a lighting apparatus according to still another embodiment of the present invention.
  • the lighting apparatus according to the present exemplary embodiment is generally similar to the lighting apparatus described with reference to FIG. 1, except that a plurality of light emitting diode packages are mounted on the printed circuit board 10.
  • the plurality of light emitting diode packages may include an ultraviolet light emitting diode package 40a, a blue light emitting diode package 40b, and a red light emitting diode package 40c mounted with light emitting diodes emitting ultraviolet, blue, and red light, respectively.
  • the lens 30 has an incident surface 30a on which light emitted from the light emitting diode packages 40a, 40b, and 40c is incident.
  • These incidence surfaces 30a may be concave, respectively, as shown in correspondence with each light emitting diode package.
  • the wavelength conversion material 41 is located on the surface area 30b. As described with reference to FIG. 1, the wavelength conversion material 41 may be disposed to cover a range of the directivity angles of the light L1 emitted from the ultraviolet light emitting diode package 40a.
  • the reflector 43 has a wider width than the wavelength conversion material 41. As shown, the reflector 43 may extend to the side of the wavelength conversion material 41, the wavelength conversion material 41 may be disposed in the center of the reflector 43. Therefore, a part of the reflector 43, i.e., the part of the reflector 43 extending to the side of the wavelength conversion material 41, may directly contact the surface region 30b.
  • the light L1 emitted from the ultraviolet light emitting diode package 40a is mostly incident on the wavelength converting material 41 and is converted into wavelengths.
  • the light L1 is reflected on the lower reflecting surface 30c and finally the lens 30 through the emission surface 30d.
  • the light (L2, L3) emitted from the blue light emitting diode package 40b and the red light emitting diode package 40c is mostly reflected by the reflector 41 located on the side of the wavelength conversion member 43, The light is reflected by the lower reflective surface 30c and finally emitted to the outside of the lens 30 through the emission surface 30d.
  • the blue light L2 and the red light L3 emitted from the blue light emitting diode package 40b and the red light emitting diode package 40c may be emitted to the outside of the lens without converting the wavelength. Therefore, by driving the blue light emitting diode package 40b and / or the red light emitting diode package 40c independently of the ultraviolet light emitting diode package 40c, various light colors of the lighting device may be realized.
  • FIG. 5 is a schematic cross-sectional view for describing a lighting apparatus according to still another embodiment of the present invention.
  • the lighting apparatus is generally similar to the lighting apparatus described with reference to FIG. 1, but the printed circuit board 50 is formed as a heat sink, and the light emitting diode 20a is directly connected to the heat sink 50. Is mounted on the printed circuit board 50.
  • an aluminum oxide film is formed on the aluminum heat sink and a circuit is formed thereon, while the aluminum oxide film is partially removed to remove the aluminum oxide film. 20a) can be mounted directly.
  • the light emitting diode 20a is directly mounted on the heat sink 50 instead of the light emitting diode package, the heat generated by the light emitting diode 20a can be effectively released and light loss caused by the package can be prevented. Therefore, the light efficiency of the light emitting diode 20a can be improved.
  • a lighting device capable of realizing various colors of light by directly mounting a plurality of light emitting diodes including an ultraviolet light emitting diode, a blue light emitting diode, and a red light emitting diode on the heat sink 50. May be provided.
  • the present invention is not limited to these embodiments.
  • the lighting apparatus including a light emitting diode 20a, a lens 30, a wavelength converting material 31 or 41 and a reflector 33 or 43, for example, bulb type, fluorescent lamp type And other types of lighting devices.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
PCT/KR2013/002513 2012-04-04 2013-03-27 Appareil d'éclairage à diodes électroluminescentes Ceased WO2013151265A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120035064A KR20130112577A (ko) 2012-04-04 2012-04-04 발광 다이오드 조명 장치
KR10-2012-0035064 2012-04-04

Publications (1)

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WO2013151265A1 true WO2013151265A1 (fr) 2013-10-10

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WO (1) WO2013151265A1 (fr)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN114447198A (zh) * 2016-08-18 2022-05-06 首尔半导体株式会社 一种透镜

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KR102310805B1 (ko) * 2014-08-07 2021-10-08 엘지이노텍 주식회사 형광체 플레이트 및 이를 포함하는 조명장치
KR102185235B1 (ko) 2014-10-10 2020-12-02 삼성디스플레이 주식회사 표시 장치
KR101675907B1 (ko) * 2014-12-23 2016-11-14 주식회사 루멘스 광변환 패널과, 발광 소자 패키지 모듈 및 백라이트 유닛
KR101892045B1 (ko) 2016-11-17 2018-08-24 엘지전자 주식회사 차량용 램프
KR101891601B1 (ko) 2016-11-17 2018-08-24 엘지전자 주식회사 차량용 램프
KR101888083B1 (ko) 2016-11-17 2018-08-13 엘지전자 주식회사 차량용 램프
KR102412984B1 (ko) * 2019-03-11 2022-06-24 루미레즈 엘엘씨 컵들 내의 광 추출 브리지
US11835225B2 (en) * 2020-03-31 2023-12-05 Kyocera Corporation Photoconversion device and illumination system
JP2025094754A (ja) * 2023-12-13 2025-06-25 日亜化学工業株式会社 発光装置及び照明装置

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JP2004111909A (ja) * 2002-07-25 2004-04-08 Toyoda Gosei Co Ltd 発光装置
JP2004327361A (ja) * 2003-04-28 2004-11-18 Seiko Epson Corp 照明装置および投射型表示装置
JP2005150041A (ja) * 2003-11-19 2005-06-09 Koito Mfg Co Ltd 灯具
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Publication number Priority date Publication date Assignee Title
CN114447198A (zh) * 2016-08-18 2022-05-06 首尔半导体株式会社 一种透镜

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