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WO2013151052A1 - Procédé de formation de motif électroconducteur, et substrat de motif électroconducteur - Google Patents

Procédé de formation de motif électroconducteur, et substrat de motif électroconducteur Download PDF

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Publication number
WO2013151052A1
WO2013151052A1 PCT/JP2013/060100 JP2013060100W WO2013151052A1 WO 2013151052 A1 WO2013151052 A1 WO 2013151052A1 JP 2013060100 W JP2013060100 W JP 2013060100W WO 2013151052 A1 WO2013151052 A1 WO 2013151052A1
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WIPO (PCT)
Prior art keywords
conductive
conductive pattern
film
substrate
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/060100
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English (en)
Japanese (ja)
Inventor
田仲　裕之
山崎　宏
五十嵐　由三
豊樹 伊藤
絵美子 太田
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Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201380014556.XA priority Critical patent/CN104170029B/zh
Priority to JP2014509171A priority patent/JP5940648B2/ja
Priority to KR1020147022042A priority patent/KR101751588B1/ko
Priority to KR1020177016459A priority patent/KR20170072956A/ko
Publication of WO2013151052A1 publication Critical patent/WO2013151052A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/0009—Details relating to the conductive cores
    • H01B7/0027—Liquid conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a method for forming a conductive pattern and a conductive pattern substrate, and more particularly to a method for forming a conductive pattern used as an electrode wiring of a flat panel display such as a liquid crystal display element, a touch panel (touch screen), a solar cell, and lighting.
  • the present invention relates to a conductive pattern substrate.
  • a transparent conductive film is used for part of wiring, pixel electrodes, or terminals that are required to be transparent.
  • Transparent conductive films are also used in devices such as solar cells and lighting.
  • indium tin oxide Indium-Tin-Oxide: ITO
  • indium oxide Indium-Tin-Oxide: ITO
  • indium oxide Indium-Tin-Oxide
  • tin oxide tin oxide
  • electrodes provided on a substrate for a liquid crystal display element or the like a pattern obtained by patterning a transparent conductive film made of the above-described material is mainly used.
  • a patterning method for the transparent conductive film after forming a transparent conductive film on a substrate such as a substrate, a resist pattern is formed by photolithography, and a conductive pattern is formed by removing a predetermined portion of the conductive film by wet etching.
  • the method to do is common.
  • a mixed liquid composed of two liquids of hydrochloric acid and ferric chloride is often used as an etching liquid.
  • ITO films, tin oxide films, and the like are generally formed by sputtering, but the properties of the transparent conductive film are likely to change depending on the sputtering method, sputtering power, gas pressure, substrate temperature, type of atmospheric gas, and the like. Differences in the film quality of the transparent conductive film due to variations in sputtering conditions cause variations in the etching rate when the transparent conductive film is wet-etched, which tends to reduce the product yield due to patterning defects.
  • the above-described method for forming a conductive pattern includes a sputtering process, a resist formation process, and an etching process, and the process is long and a great burden is imposed on the cost.
  • Patent Document 1 After a conductive layer containing conductive fibers such as silver fibers is formed on a substrate, a photosensitive resin layer is formed on the conductive layer, and then exposed through a pattern mask. A method of forming a conductive pattern to be developed is disclosed.
  • a conductive film for transfer including at least a peelable conductive layer on a support and an adhesive layer on the conductive layer is used, and the conductive layer is attached to the substrate via the adhesive layer.
  • a method is disclosed, and it is disclosed that the conductive layer after transfer may be patterned.
  • Patent Document 3 a photosensitive conductive film including a conductive layer provided on a support film and a photosensitive resin layer provided on the conductive layer is used so that the photosensitive resin layer is in close contact with the substrate.
  • a method of forming a conductive pattern that can form a conductive pattern by using a laminating method is disclosed.
  • Patent Documents 1 and 2 have a problem that the process of forming a conductive pattern becomes complicated.
  • Patent Document 3 is a method by which a conductive pattern can be formed more easily.
  • a photosensitive resin layer is interposed between the substrate and the conductive layer, a connection provided on the surface of the substrate. A terminal etc. and a conductive pattern cannot be connected easily. The above problem also occurs in the method described in Patent Document 2.
  • An object of the present invention is to provide a conductive pattern forming method and a conductive pattern substrate capable of easily forming a conductive pattern having a sufficiently small surface resistivity on a substrate with sufficient resolution.
  • the present invention provides a photosensitive conductive film comprising a support film, a conductive layer containing conductive fibers, and a photosensitive resin layer containing a photosensitive resin in this order, and a base material
  • a method for forming a conductive pattern is provided.
  • a conductive pattern having a sufficiently small surface resistivity can be easily formed on a substrate with sufficient resolution.
  • the photosensitive resin layer preferably contains a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator.
  • a binder polymer e.g., polyethylene glycol dimethacrylate copolymer
  • a photopolymerizable compound having an ethylenically unsaturated bond e.g., polyethylene glycol dimethylenically unsaturated bond
  • a photopolymerization initiator e.g., a photopolymerization initiator
  • the binder polymer preferably has a carboxyl group.
  • a binder polymer having a carboxyl group By containing a binder polymer having a carboxyl group, the developability of the photosensitive resin layer can be improved.
  • the laminate of the conductive layer and the photosensitive resin layer can have a minimum light transmittance of 80% or more in a wavelength region of 450 to 650 nm.
  • the conductive layer and the photosensitive resin layer satisfy such conditions, it is easy to increase the brightness in a display panel or the like.
  • the conductive fiber may be a silver fiber. By being a silver fiber, adjustment of the electroconductivity of the conductive pattern formed becomes easier.
  • the present invention also provides a conductive pattern substrate comprising a substrate and a conductive pattern formed on the substrate by the conductive pattern forming method of the present invention.
  • the conductive pattern substrate can have a conductive pattern formed with a sufficiently small surface resistivity and sufficient resolution. Further, the formed conductive pattern can be electrically connected to a connection terminal or the like provided on the substrate surface.
  • the surface resistivity of the conductive pattern is preferably 2000 ⁇ / ⁇ or less. By setting the surface resistivity of the conductive pattern in such a range, it can function more effectively as a wiring or an electrode.
  • the present invention it is possible to provide a conductive pattern forming method and a conductive pattern substrate capable of easily forming a conductive pattern having a sufficiently small surface resistivity on a substrate with sufficient resolution. Moreover, according to this invention, it becomes possible to connect easily the connection terminal etc. which are provided in the base-material surface, and a conductive pattern. Furthermore, according to the method for forming a conductive pattern of the present invention, the adhesion between the base material and the conductive layer can be sufficient, and the adhesion of the resulting conductive pattern to the substrate must be sufficient. Can do.
  • a conductive pattern can be directly formed on an object, a three-dimensional conductive wiring can be easily formed.
  • the photosensitive conductive film is laminated, and the conductive pattern is formed.
  • a conductive pattern crossing portion can be provided in the insulating film portion while conducting conduction between the already formed conductive pattern not covered with the film and the newly formed conductive pattern.
  • an oxide conductor such as ITO, a metal such as Cu, or the like can be used for the already produced conductive pattern, and conduction with these conductive patterns can be easily achieved.
  • FIG. 6 is a partial cross-sectional view taken along line VI-VI in FIG. 5. It is a figure for demonstrating an example of the manufacturing method of the capacitive touch panel in which a transparent electrode exists in the same plane, (a) is a partially notched perspective view which shows the board
  • FIG. 8 is a diagram for explaining an example of a method of manufacturing a capacitive touch panel in which transparent electrodes are present on the same plane, (a) is a partial cross-sectional view taken along line VIIIa-VIIIa in FIG. ) Is a partial cross-sectional view showing a step of providing an insulating film, and (c) is a partial cross-sectional view taken along line VIIIc-VIIIc in FIG.
  • (meth) acrylate in the present specification means “acrylate” and “methacrylate”.
  • (meth) acryl means “acryl” and “methacryl”, and “(meth) acryloyl” means “acryloyl” and “methacryloyl”.
  • the method for forming a conductive pattern prepares a photosensitive conductive film including a support film, a conductive layer containing conductive fibers, and a photosensitive resin layer containing a photosensitive resin in this order, A laminating step of laminating the conductive layer and the photosensitive resin layer so that the conductive layer is in close contact with the substrate, a patterning step of forming a conductive pattern by exposing and developing the photosensitive resin layer on the substrate, Is provided.
  • the boundary between the conductive layer and the photosensitive resin layer is not necessarily clear.
  • the conductive layer only needs to have conductivity in the surface direction of the photosensitive layer, and the conductive layer may be mixed with the photosensitive resin layer.
  • the conductive layer may be impregnated with a composition constituting the photosensitive resin layer, or the composition constituting the photosensitive resin layer may be present on the surface of the conductive layer.
  • FIG. 1 is a schematic cross-sectional view showing an example of a photosensitive conductive film.
  • a photosensitive conductive film 10 shown in FIG. 1 includes a first film (support film) 1, a photosensitive layer 4 provided on the first film 1, and a second film provided on the photosensitive layer 4 ( Cover film) 5.
  • the photosensitive layer 4 includes a conductive layer 2 containing conductive fibers provided on the support film 1 and a photosensitive resin layer 3 provided on the conductive layer 2.
  • each of the support film 1 constituting the photosensitive conductive film 10, the conductive layer 2 containing conductive fibers, the photosensitive resin layer 3, and the cover film 5 will be described in detail.
  • the support film 1 examples include polymer films having heat resistance and solvent resistance, such as polyethylene terephthalate film, polyethylene film, polypropylene film, and polycarbonate film. Among these, a polyethylene terephthalate film and a polypropylene film are preferable from the viewpoints of transparency and heat resistance.
  • the above polymer film has been subjected to a release treatment so that it can be easily peeled off from the conductive layer 2 later.
  • the support film 1 can be separated from the cover film 5 with priority.
  • the adhesive strength between the cover film 5 and the photosensitive resin layer 3 is preferably larger than the adhesive strength between the conductive layer 2 and the support film 1.
  • These polymer films are preferably subjected to thickness adjustment, material selection, and surface treatment so that they are more easily peeled off than the cover film 5.
  • the ratio of the thickness of the support film 1 to the thickness of the cover film 5 is preferably 1: 1 to 1:10, and preferably 1: 1.5 to 1: 5.
  • it is 1: 2 to 1: 5.
  • the thickness of the support film 1 is preferably 5 to 100 ⁇ m, more preferably 10 to 50 ⁇ m, and particularly preferably 15 to 25 ⁇ m.
  • the thickness of the support film 1 is preferably 5 to 100 ⁇ m, more preferably 10 to 50 ⁇ m, and particularly preferably 15 to 25 ⁇ m.
  • Examples of the conductive fibers contained in the conductive layer 2 include metal fibers such as gold, silver and platinum, and carbon fibers such as carbon nanotubes. These can be used alone or in combination of two or more. From the viewpoint of conductivity, it is preferable to use gold fiber and / or silver fiber, and from the viewpoint of easily adjusting the conductivity of the formed conductive pattern, it is more preferable to use silver fiber. Gold fiber and silver fiber can be used individually by 1 type or in combination of 2 or more types.
  • the metal fiber can be prepared by, for example, a method of reducing metal ions with a reducing agent such as NaBH 4 or a polyol method.
  • a reducing agent such as NaBH 4 or a polyol method.
  • Commercially available products such as Unipym's Hipco single-walled carbon nanotubes can be used as the carbon nanotubes.
  • the fiber diameter of the conductive fiber is preferably 1 to 50 nm, more preferably 2 to 20 nm, and particularly preferably 3 to 10 nm.
  • the fiber length of the conductive fiber is preferably 1 to 100 ⁇ m, more preferably 2 to 50 ⁇ m, and particularly preferably 3 to 10 ⁇ m.
  • the fiber diameter and fiber length can be measured with a scanning electron microscope.
  • the thickness of the conductive layer 2 varies depending on the conductive pattern formed using the photosensitive conductive film of the present invention, its use, required conductivity, etc., but is preferably 1 ⁇ m or less, preferably 1 nm to 0.5 ⁇ m. More preferably, the thickness is 5 nm to 0.1 ⁇ m.
  • the thickness of the conductive layer 2 is 1 ⁇ m or less, the light transmittance in the wavelength region of 450 to 650 nm is high, the pattern forming property is excellent, and it is particularly suitable for the production of a transparent electrode.
  • the thickness of the conductive layer 2 refers to a value measured by a scanning electron micrograph.
  • the conductive layer 2 preferably has a network structure in which conductive fibers are in contact with each other.
  • the conductive layer 2 having such a network structure may be formed on the surface of the photosensitive resin layer 3 on the support film side, but conductivity is obtained in the surface direction on the surface exposed when the support film is peeled off. If it is, it may be formed in the form included in the support film side surface layer of the photosensitive resin layer 3.
  • the conductive layer 2 containing conductive fibers is, for example, a conductive fiber dispersion obtained by adding the above-described conductive fibers to water and / or an organic solvent and, if necessary, a dispersion stabilizer such as a surfactant. After coating on the support film 1, it can be formed by drying. Further, after drying, the formed conductive layer 2 may be further pressurized. By forming the conductive layer under pressure, the number of contacts between the conductive fibers increases, and the conductivity can be improved.
  • the linear pressure at this time is preferably 0.6 to 2.0 MPa, and more preferably 1.0 to 1.5 MPa.
  • the conductive fiber may coexist with a surfactant, a dispersion stabilizer and the like.
  • Coating can be performed by a known method such as a roll coating method, a comma coating method, a gravure coating method, an air knife coating method, a die coating method, a bar coating method, or a spray coating method.
  • the drying can be performed at 30 to 150 ° C. for about 1 to 30 minutes with a hot air convection dryer or the like.
  • the photosensitive resin layer 3 is formed from a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator. Can be mentioned.
  • binder polymer examples include acrylic resins, styrene resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins, and phenol resins. These can be used alone or in combination of two or more.
  • the binder polymer can be produced by radical polymerization of a polymerizable monomer.
  • polymerizable monomer examples include polymerizable styrene derivatives substituted at the ⁇ -position or aromatic ring such as styrene, vinyl toluene, ⁇ -methylstyrene; acrylamide such as diacetone acrylamide; acrylonitrile; vinyl-n -Ethers of vinyl alcohol such as butyl ether; (meth) acrylic acid alkyl ester, (meth) acrylic acid aryl ester, (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, (meth) acrylic Acid diethylaminoethyl ester, (meth) acrylic acid glycidyl ester, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, (meth) acrylic acid, ⁇ -Bromoacryl Maleic acid monoesters such
  • Examples of the (meth) acrylic acid alkyl ester include (meth) acrylic acid methyl ester, (meth) acrylic acid ethyl ester, (meth) acrylic acid propyl ester, (meth) acrylic acid butyl ester, (meth) acrylic acid pentyl ester.
  • Examples of the (meth) acrylic acid aryl ester include benzyl (meth) acrylate.
  • polymerizable monomer examples include bifunctional (meth) acrylic acid esters. Specifically, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (Meth) acrylate is mentioned. These can be used alone or in combination of two or more.
  • the (A) binder polymer is preferably a copolymer containing structural units derived from (a) (meth) acrylic acid and (b) (meth) acrylic acid alkyl ester.
  • the binder polymer preferably has a carboxyl group from the viewpoint of improving alkali developability.
  • Examples of the polymerizable monomer having a carboxyl group for obtaining such a binder polymer include (meth) acrylic acid as described above.
  • the ratio of the carboxyl group in the binder polymer is 10 to 50% by mass as the ratio of the polymerizable monomer having a carboxyl group to the total polymerizable monomer used for obtaining the binder polymer. Preferably, it is 12 to 40% by mass, more preferably 15 to 30% by mass, and particularly preferably 15 to 25% by mass. In terms of excellent alkali developability, the content is preferably 10% by mass or more, and in terms of excellent alkali resistance, it is preferably 50% by mass or less.
  • the weight average molecular weight of the (A) binder polymer is preferably 10,000 to 200,000, but is preferably 15,000 to 150,000, more preferably 30,000 to 150,000, and more preferably 30,000 to 100,000 from the viewpoint of resolution. More preferably.
  • the measurement conditions of a weight average molecular weight shall be the same measurement conditions as the Example of this-application specification.
  • a photopolymerizable compound having an ethylenically unsaturated bond can be used as the photopolymerizable compound as component (B).
  • Examples of the photopolymerizable compound having an ethylenically unsaturated bond include a monofunctional vinyl monomer, a bifunctional vinyl monomer, and a polyfunctional vinyl monomer having at least three polymerizable ethylenically unsaturated bonds.
  • Examples of the monofunctional vinyl monomer include (meth) acrylic acid, (meth) acrylic acid alkyl ester, and those co-polymerized as monomers used for the synthesis of a copolymer which is a preferred example of the component (A). Examples thereof include polymerizable monomers.
  • bifunctional vinyl monomer examples include polyethylene glycol di (meth) acrylate (having 2 to 14 ethoxy groups), trimethylolpropane di (meth) acrylate, and polypropylene glycol di (meth) acrylate (having the number of propylene groups).
  • bisphenol A polyoxyethylene di (meth) acrylate (2,2-bis (4- (meth) acryloxypolyethoxyphenyl) propane), bisphenol A diglycidyl ether di (meth) acrylate
  • esterified products of a polyvalent carboxylic acid such as phthalic anhydride
  • a substance having a hydroxyl group and an ethylenically unsaturated bond such as ⁇ -hydroxyethyl acrylate and ⁇ -hydroxyethyl methacrylate.
  • bisphenol A polyoxyethylene dimethacrylate examples include bisphenol A dioxyethylene diacrylate, bisphenol A dioxyethylene dimethacrylate, bisphenol A trioxyethylene diacrylate, bisphenol A trioxyethylene dimethacrylate, and bisphenol A pentaoxyethylene dimethacrylate.
  • bisphenol A pentaoxyethylene dimethacrylate examples include acrylate, bisphenol A pentaoxyethylene dimethacrylate, bisphenol A deoxyoxyethylene diacrylate, and bisphenol A deoxyoxyethylene dimethacrylate.
  • Examples of the polyfunctional vinyl monomer having at least three polymerizable ethylenically unsaturated bonds include trimethylolpropane tri (meth) acrylate, tetramethylolmethanetri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, dipenta Compounds obtained by reacting polyhydric alcohols such as erythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate with ⁇ , ⁇ -unsaturated carboxylic acids; containing glycidyl groups such as trimethylolpropane triglycidyl ether triacrylate And compounds obtained by adding an ⁇ , ⁇ -unsaturated carboxylic acid to the compound.
  • polyhydric alcohols such as erythritol penta (meth) acrylate and dipentaerythritol hexa (meth)
  • Photopolymerization initiators include benzophenone, N, N, N ′, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N, N ′, N′-tetraethyl-4, 4′-diaminobenzophenone, 4-methoxy-4′-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-methyl-1- [4- ( Aromatic ketones such as methylthio) phenyl] -2-morpholino-propanone-1; 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone 2-phenylanthraquinone, 2,3-
  • Phosphine oxide compounds Phosphine oxide compounds; benzyl derivatives such as benzyldimethyl ketal; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4 2,4,5-triarylimidazole dimers such as 1,5-diphenylimidazole dimer; acridine derivatives such as 9-phenylacridine, 1,7-bis (9,9′-acridinyl) heptane; N-phenyl Examples thereof include glycine, N-phenylglycine derivatives, coumarin compounds, and oxazole
  • substituents of the aryl groups of two 2,4,5-triarylimidazoles may give the same and symmetric compounds, or differently give asymmetric compounds.
  • an oxime ester compound or a phosphine oxide compound is preferable because of the transparency of the photosensitive resin layer to be formed and the pattern forming ability when a thin film is formed.
  • the blending amount of the (A) binder polymer is preferably 40 to 80 parts by mass with respect to 100 parts by mass as a total of (A) the binder polymer and (B) the photopolymerizable compound having an ethylenically unsaturated bond. 50 to 70 parts by mass is more preferable.
  • the coating property coating property
  • the phenomenon that the resin oozes out from the end of the photosensitive conductive film (photosensitive element) also called edge fusion
  • this compounding quantity 80 mass parts or less a sensitivity can be improved and sufficient mechanical strength can be obtained.
  • the blending amount of the (B) photopolymerizable compound having an ethylenically unsaturated bond is 20 with respect to 100 parts by mass of the total amount of (A) the binder polymer and (B) the photopolymerizable compound having an ethylenically unsaturated bond.
  • the amount is preferably ⁇ 60 parts by mass, and more preferably 30 to 50 parts by mass.
  • the blending amount of the (C) photopolymerization initiator is 0.1 to 20 parts by mass with respect to 100 parts by mass of the total amount of (A) the binder polymer and (B) the photopolymerizable compound having an ethylenically unsaturated bond.
  • the amount is 0.2 to 10 parts by mass.
  • the blending amount is 0.1 parts by mass or more, the sensitivity can be improved.
  • the photosensitive resin layer can be more uniformly cured by exposure.
  • a dye such as malachite green, a photochromic agent such as tribromomethylphenylsulfone or leucocrystal violet, a thermochromic inhibitor, or a plastic such as p-toluenesulfonamide.
  • Agents, pigments, fillers, antifoaming agents, flame retardants, stabilizers, adhesion-imparting agents, leveling agents, peeling accelerators, antioxidants, fragrances, imaging agents, thermal crosslinking agents and the like can be added. These additives may be added in an amount of about 0.01 to 20 parts by mass per 100 parts by mass of the total amount of (A) binder polymer and (B) photopolymerizable compound. These are used alone or in combination of two or more.
  • the photosensitive resin layer 3 is formed on the conductive layer 2 formed on the support film 1, as required, with methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, propylene. It can be formed by applying a solution of a photosensitive resin composition having a solid content of about 10 to 60% by mass dissolved in a solvent such as glycol monomethyl ether or a mixed solvent thereof and then drying. However, in this case, the amount of the remaining organic solvent in the photosensitive resin layer after drying is preferably 2% by mass or less in order to prevent the organic solvent from diffusing in the subsequent step.
  • Coating can be performed by a known method such as a roll coating method, a comma coating method, a gravure coating method, an air knife coating method, a die coating method, a bar coating method, or a spray coating method. After coating, drying to remove the organic solvent and the like can be performed at 70 to 150 ° C. for about 5 to 30 minutes with a hot air convection dryer or the like.
  • the thickness of the photosensitive resin layer 3 varies depending on the application, but the thickness after drying is preferably 0.05 to 50 ⁇ m, more preferably 0.05 to 15 ⁇ m, and preferably 0.1 to 10 ⁇ m. More preferably, it is 0.1 to 8 ⁇ m, particularly preferably 0.1 to 5 ⁇ m.
  • this thickness 0.05 ⁇ m or more formation of the photosensitive resin layer 3 by coating becomes easy.
  • the thickness is 50 ⁇ m or less, the light transmittance is good, sufficient sensitivity can be obtained, and the photocuring property of the photosensitive layer after transfer can be made excellent.
  • cover film 5 examples include those exemplified as a polymer film that can be used as the support film 1.
  • the support film 1 is preferably adjusted by film thickness control, surface treatment, etc. of the support film and the cover film so that the support film 1 is peeled off with priority over the cover film 5.
  • the thickness of the cover film 5 is preferably 10 to 200 ⁇ m, more preferably 15 to 150 ⁇ m, and particularly preferably 15 to 100 ⁇ m.
  • the haze value of the cover film 5 is preferably 0.01 to 5.0%, more preferably 0.01 to 3.0%, from the viewpoint of improving sensitivity and resolution. It is more preferably from 2.0% to 2.0%, particularly preferably from 0.01% to 1.0%.
  • the haze value can be measured according to JIS K 7105, and can be measured with a commercially available turbidimeter such as NDH-1001DP (trade name, manufactured by Nippon Denshoku Industries Co., Ltd.).
  • FIG. 2 is a schematic cross-sectional view showing an example of a method for producing a photosensitive conductive film.
  • the conductive layer 2 is formed on the first film (support film) 1 and the photosensitive resin layer 3 is separately formed on the second film (cover film) 5.
  • a photosensitive conductive film is manufactured by laminating the two films obtained in this manner with a roller 50 so that the conductive layer 2 and the photosensitive resin layer 3 are laminated.
  • the structure in each layer (for example, the network structure of the conductive layer) is controlled as compared with the manufacturing method in which the solution is applied in layers. Becomes easier. At this time, it is preferable to laminate the film on which the conductive layer is formed and / or the film on which the photosensitive resin layer is formed at 60 to 130 ° C., and the pressure is about 0.2 to 0.8 MPa. Is preferred.
  • the laminate (photosensitive layer 4) of the conductive layer 2 and the photosensitive resin layer 3 preferably has a minimum light transmittance of 80% or more in a wavelength region of 450 to 650 nm, and 85% or more. It is more preferable that When the photosensitive layer 4 satisfies such a condition, it is easy to increase the brightness in a display panel or the like. Further, when the total film thickness of both the conductive layer 2 and the photosensitive resin layer 3 constituting the photosensitive layer 4 is 1 to 10 ⁇ m, the minimum light transmittance in the wavelength region of 450 to 650 nm is 80% or more. It is preferable that it is 85% or more. When the conductive layer and the photosensitive resin layer satisfy such conditions, it is easy to increase the brightness in a display panel or the like.
  • the photosensitive conductive film may further have layers such as an adhesive layer and a gas barrier layer on the support film or the cover film, or on both films.
  • the photosensitive conductive film can be stored, for example, in the form of a flat plate as it is or in the form of a roll wound around a cylindrical core.
  • the core is not particularly limited as long as it is conventionally used.
  • plastic such as polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, ABS resin (acrylonitrile-butadiene-styrene copolymer), etc. Is mentioned.
  • an end face separator on the end face of the photosensitive conductive film wound up in a roll shape from the viewpoint of end face protection, and in addition, it is preferable to install a moisture-proof end face separator from the viewpoint of edge fusion resistance.
  • FIG. 3 is a schematic cross-sectional view for explaining a method for forming a conductive pattern according to this embodiment.
  • the above-described photosensitive conductive film 10 is laminated so that the support film 1 is peeled off and the conductive layer 2 is in close contact with the base material 20 (FIGS. 3A and 3B).
  • a patterning step of forming a conductive pattern by exposing and developing the photosensitive layer on the substrate (FIGS. 3C and 3D).
  • the patterning step includes an exposure step (FIG.
  • a substrate such as a glass substrate or a plastic substrate such as polycarbonate can be used.
  • the thickness of the base material 20 can be appropriately selected according to the purpose of use, and a film-like base material may be used.
  • the film-like substrate include a polyethylene terephthalate film, a polycarbonate film, and a cycloolefin polymer film.
  • a substrate on which a transparent electrode or the like is already formed by ITO or the like can be used.
  • the substrate 20 preferably has a minimum light transmittance of 80% or more in a wavelength region of 450 to 650 nm. When the base material 20 satisfies such a condition, it is easy to increase the brightness in a display panel or the like.
  • the laminating step is performed, for example, by removing the support film 1 of the photosensitive conductive film 10 and then laminating the conductive layer 2 side against a base material 20 such as a glass substrate while heating. In addition, it is preferable to laminate
  • the lamination of the photosensitive conductive film 10 is preferably performed by heating the conductive layer 2 and the photosensitive resin layer 3 and / or the substrate 20 to 70 to 130 ° C., and these conditions are not particularly limited. In addition, if the conductive layer 2 and the photosensitive resin layer 3 are heated to 70 to 130 ° C. as described above, it is not necessary to pre-heat the base material 20 in advance. Twenty pre-heat treatments can also be performed.
  • the pressure is preferably about 0.1 to 1.0 MPa (about 1 to 10 kgf / cm 2 ), more preferably 0.2 to 0.8 MPa. .
  • the photosensitive resin layer is cured by irradiating actinic rays, and the conductive layer is fixed by the cured product, whereby a conductive pattern is formed on the substrate.
  • the exposure method in the exposure step include a method of irradiating actinic rays L in an image form through a negative or positive mask pattern called an artwork (mask exposure method).
  • an artwork mask exposure method.
  • the active light source a known light source, for example, a carbon arc lamp, a mercury vapor arc lamp, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a xenon lamp, or the like that effectively emits ultraviolet light, visible light, or the like is used.
  • an Ar ion laser, a semiconductor laser, or the like that effectively emits ultraviolet light, visible light, or the like is also used. Furthermore, what effectively radiates
  • a method of irradiating actinic rays in an image form by a direct drawing method using a laser exposure method or the like may be employed.
  • the exposure amount of the actinic ray L at this time varies depending on the apparatus used, the composition of the photosensitive resin composition, etc., but is preferably 5 to 1000 mJ / cm 2 , more preferably 10 to 200 mJ / cm 2 . . In terms of excellent photocurability, it is preferably 10 mJ / cm 2 or more, and in terms of resolution, it is preferably 200 mJ / cm 2 or less. By setting it to 1000 mJ / cm 2 or less, discoloration of the photosensitive layer can be suppressed.
  • the active light L can be irradiated through the cover film 5, and when the cover film 5 is light-shielding, After removing the film 5, the photosensitive resin layer is irradiated with actinic rays.
  • the photosensitive conductive film used in the present invention is selected from the film thickness and material of the support film 1 and the cover film 5 and the surface treatment so that the support film is separated before the cover film. What is necessary is just to adjust the adhesive strength of both films by such as.
  • the base material 20 is transparent with respect to the actinic ray L, it is possible to irradiate actinic rays from the base material side through the base material, but in terms of resolution, the photosensitive resin layer from the photosensitive resin layer side. It is preferable to irradiate actinic rays.
  • the photosensitive layer 4 is provided on the substrate 20 more simply by providing the photosensitive layer 4 by laminating the separately prepared photosensitive conductive film 10 to the substrate 20. Therefore, productivity can be improved. Moreover, according to the method for forming a conductive pattern of the present invention, a transparent conductive pattern can be easily formed on a base material such as a glass substrate or a plastic substrate.
  • the unexposed portion (portion other than the exposed portion) of the photosensitive layer is removed. Specifically, when the transparent cover film 5 is present on the photosensitive layer, the cover film 5 is first removed, and then the unexposed portion of the photosensitive layer is removed by wet development. Thereby, the conductive layer 2a containing a conductive fiber remains under the resin cured layer 3b having a predetermined pattern, and a conductive pattern is formed. In this way, as shown in FIG. 3D, a conductive pattern substrate 40 having a conductive pattern is obtained.
  • the wet development is performed by a known method such as spraying, rocking dipping, brushing or scraping using a developer corresponding to a photosensitive resin such as an alkaline aqueous solution, an aqueous developer, or an organic solvent developer.
  • a photosensitive resin such as an alkaline aqueous solution, an aqueous developer, or an organic solvent developer.
  • an alkaline aqueous solution or the like that is safe and stable and has good operability is used.
  • the base of the alkaline aqueous solution include hydroxides of alkali metals such as lithium, sodium and potassium (alkali hydroxide); carbonates or bicarbonates such as lithium, sodium, potassium and ammonium (alkali carbonate); lithium and sodium Borate or polyborate such as potassium and ammonium; alkali metal phosphates such as potassium phosphate and sodium phosphate; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate.
  • Examples of the alkaline aqueous solution used for development include 0.1 to 5% by weight sodium carbonate aqueous solution, 0.1 to 5% by weight potassium carbonate aqueous solution, 0.1 to 5% by weight sodium hydroxide aqueous solution, and 0.1 to 5% by weight four.
  • a sodium borate aqueous solution or the like is preferable.
  • the pH of the alkaline aqueous solution used for development is preferably in the range of 9 to 11, and the temperature is adjusted according to the developability of the photosensitive resin layer.
  • a surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating development, and the like may be mixed.
  • an aqueous developer composed of water or an alkaline aqueous solution and one or more organic solvents
  • the base contained in the alkaline aqueous solution in addition to the above-mentioned bases, borax, sodium metasilicate, tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethylenetriamine, 2-amino-2-hydroxymethyl-1, 3 -Propanediol, 1,3-diaminopropanol-2, morpholine and the like.
  • organic solvent examples include methyl ethyl ketone, acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether. It is done. These are used individually by 1 type or in combination of 2 or more types.
  • the aqueous developer preferably has an organic solvent concentration of 2 to 90% by mass, and the temperature can be adjusted according to the developability. Further, the pH of the aqueous developer is preferably as low as possible within a range where the development of the photosensitive resin layer can be sufficiently performed, preferably pH 8 to 12, and more preferably pH 9 to 10. In addition, a small amount of a surfactant, an antifoaming agent, or the like can be added to the aqueous developer.
  • organic solvent developer examples include 1,1,1-trichloroethane, N-methylpyrrolidone, N, N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, and ⁇ -butyrolactone. These organic solvents are preferably added with water in the range of 1 to 20% by mass in order to prevent ignition.
  • the above developing solutions may be used in combination of two or more as required.
  • Developing methods include dip method, battle method, high pressure spray method, spray method, brushing, slapping and the like. Among these, it is preferable to use a high-pressure spray system from the viewpoint of improving the resolution.
  • the conductive pattern may be further cured by performing heating at about 60 to 250 ° C. or exposure at about 0.2 to 10 J / cm 2 as necessary after development. Good.
  • a transparent conductive pattern can be easily formed on a substrate such as a glass substrate or a plastic substrate without forming an etching resist like an inorganic film such as ITO. Can be formed.
  • the conductive pattern substrate of the present invention is obtained by the conductive pattern forming method described above.
  • the surface resistivity of the conductive pattern is preferably 2000 ⁇ / ⁇ or less, more preferably 1000 ⁇ / ⁇ or less, and particularly preferably 500 ⁇ / ⁇ or less from the viewpoint that it can be effectively used as a transparent electrode or the like.
  • the surface resistivity can be adjusted by, for example, the concentration of the conductive fiber dispersion, the coating amount, and the like.
  • the minimum light transmittance in the wavelength region of 450 to 650 nm is preferably 80% or more, and more preferably 85% or more.
  • FIG. 4 is a plan view showing an example of a capacitive touch panel in which the transparent electrode (X position coordinate) 103 and the transparent electrode (Y position coordinate) 104 exist on the same plane
  • FIG. FIG. 6 is a partial cross-sectional view taken along the line VI-VI in FIG.
  • the capacitive touch panel includes a transparent electrode 103 that detects a change in capacitance and uses X position coordinates, and a transparent electrode 104 uses Y position coordinates on a transparent substrate 101.
  • Each of the transparent electrodes 103 and 104 having the X and Y position coordinates has lead-out wirings 105a and 105b for connecting to a control circuit of a driver element circuit (not shown) that controls an electrical signal as a touch panel. .
  • An insulating film 106 is provided at a portion where the transparent electrode (X position coordinate) 103 and the transparent electrode (Y position coordinate) 104 intersect.
  • the insulating film is selected from materials having electrical insulating properties, transparency, and development resistance. Examples of such a material include a thin and transparent photosensitive film.
  • a transparent electrode (X position coordinate) 103 is formed on the transparent substrate 101.
  • the photosensitive conductive film is laminated so that the conductive layer is in contact with the transparent substrate 101 (lamination process).
  • the transferred photosensitive layer (conductive layer and photosensitive resin layer) is irradiated with actinic rays in a desired shape through a light-shielding mask (exposure process). Thereafter, the light-shielding mask is removed, the support film is further peeled off, and development is performed, whereby the unexposed portion of the photosensitive layer is removed and a conductive pattern is formed (development process).
  • a transparent electrode 103 for detecting the X position coordinate is formed by this conductive pattern.
  • a transparent electrode (Y position coordinate) 104 is formed.
  • An insulating film 106 is provided on a part of the transparent electrode 103 formed by the above process (for example, a part where the transparent electrode 103 and the transparent electrode 104 are to intersect), and a new photosensitive conductive film is formed on the transparent substrate 101.
  • the transparent electrode 104 for detecting the Y position coordinate is formed by the same operation as described above.
  • lead wires 105a and 105b for connecting to an external circuit are formed on the surface of the transparent substrate 101.
  • the lead-out wiring can be formed by screen printing using a conductive paste material containing, for example, flaky silver or the like.
  • one transparent electrode for example, the transparent electrode (X position coordinate) 103 and the lead-out wirings 105a and 105b are formed by a known method using a transparent conductive material. It can be formed in advance on 101. Even in this case, the transparent electrode (X position coordinate) 103 and the transparent electrode (Y position coordinate) 104 can be formed in the same plane, and an excellent conductive pattern can be obtained by adhesion and resolution. Can do. In addition, by performing patterning by the above-described process, it is possible to form a conductive pattern of the bridged transparent electrode (Y position coordinate) 104.
  • the manufacturing method of the capacitive touch panel by the conductive pattern forming method according to the present invention is not limited to the above method.
  • a substrate in which a transparent electrode (X position coordinate) 103 and a part of a transparent electrode that later becomes a transparent electrode 104 for detecting a Y position coordinate are formed on the transparent substrate 101 by a known method using a transparent conductive material.
  • FIG. 7 is a diagram for explaining an example of a method for manufacturing a capacitive touch panel in which transparent electrodes are present on the same plane, and (a) is a partially cutaway perspective view showing a substrate provided with transparent electrodes. (B) is a partially cutaway perspective view showing the obtained capacitive touch panel.
  • FIG. 8 is a diagram for explaining an example of a method for manufacturing a capacitive touch panel in which transparent electrodes exist on the same plane.
  • a substrate on which a transparent electrode (X position coordinate) 103 and a part 104a of the transparent electrode are formed in advance is prepared.
  • An insulating film 106 is provided on a part (a part sandwiched by part 104a of the transparent electrode) (FIG. 8B).
  • a photosensitive conductive film is laminated on the substrate, and a conductive pattern is formed by the same method as the exposure step and the development step described above. With this conductive pattern, the bridge portion 104b of the transparent electrode can be formed (FIG. 8C).
  • a transparent electrode bridge portion 104 b a part of the transparent electrodes 104 a formed in advance can be connected to each other, and a transparent electrode (Y position coordinate) 104 is formed.
  • the previously formed transparent electrode may be formed by a known method using ITO or the like, for example.
  • the lead wires 105a and 105b can be formed by a known method using a metal such as Cu or Ag in addition to the transparent conductive material.
  • a substrate on which lead-out wirings 105a and 105b are previously formed may be used.
  • the transparent electrode (Y position coordinate) is insulated from the transparent electrode (X position coordinate) while being directly connected to the lead wiring. It is possible to form the conductive pattern substrate more easily.
  • the reaction solution was allowed to stand at 30 ° C. or less, diluted 10-fold with acetone, centrifuged at 2000 rpm for 20 minutes with a centrifuge, and the supernatant was decanted.
  • Acetone was added to the precipitate, stirred, and then centrifuged under the same conditions as described above, and acetone was decanted. Then, it centrifuged twice similarly using distilled water, and obtained the silver fiber.
  • the fiber diameter (diameter) was about 5 nm
  • the fiber length was about 5 ⁇ m.
  • solution a a solution in which 100 g of methacrylic acid, 250 g of methyl methacrylate, 100 g of ethyl acrylate and 50 g of styrene are mixed with 0.8 g of azobisisobutyronitrile as an initiator (hereinafter referred to as “solution a”).
  • solution a a solution in which 100 g of methacrylic acid, 250 g of methyl methacrylate, 100 g of ethyl acrylate and 50 g of styrene are mixed with 0.8 g of azobisisobutyronitrile as an initiator.
  • solution a was added dropwise to the solution s heated to 80 ° C. over 4 hours, and then kept at 80 ° C. with stirring for 2 hours.
  • the solution after dripping was heat-retained at 80 degreeC for 3 hours, stirring, Then, it heated at 90 degreeC over 30 minutes. The mixture was kept at 90 ° C. for 2 hours and then cooled to obtain a binder polymer solution.
  • Acetone was added to this binder polymer solution to prepare a non-volatile component (solid content) of 50% by mass to obtain a binder polymer solution as component (A).
  • the weight average molecular weight of the obtained binder polymer was 80000 in terms of standard polystyrene conversion by GPC. This was designated as acrylic polymer A.
  • the measurement conditions of GPC which measured the weight average molecular weight are as follows.
  • Example 1 The conductive fiber dispersion 1 is uniformly applied at 25 g / m 2 on a 16 ⁇ m-thick polyethylene terephthalate film (PET film, manufactured by Teijin Ltd., trade name: G2-16), which is a support film, at 100 ° C.
  • PET film polyethylene terephthalate film
  • the hot air convection dryer was dried for 10 minutes, and a conductive layer containing conductive fibers was formed on the support film by pressurizing at a linear pressure of 1 MPa at room temperature (25 ° C.).
  • the film thickness after drying of the conductive layer was about 0.1 ⁇ m.
  • the solution of the photosensitive resin composition was uniformly applied onto a separately prepared polyethylene terephthalate film (PET film, manufactured by Teijin Ltd., trade name: G2-50) having a thickness of 50 ⁇ m, and hot air at 100 ° C.
  • PET film manufactured by Teijin Ltd., trade name: G2-50
  • the photosensitive resin layer was formed by drying for 10 minutes with a convection dryer.
  • the film thickness after drying of the photosensitive resin layer was 5 ⁇ m.
  • the PET film formed with the conductive layer and the PET film formed with the photosensitive resin layer obtained as described above are arranged so that the conductive layer and the photosensitive resin layer face each other at 120 ° C. and 0.4 MPa.
  • the objective photosensitive conductive film was produced by laminating under the conditions described above.
  • a polycarbonate substrate having a thickness of 1 mm was heated to 80 ° C., and the support layer (PET film having a thickness of 16 ⁇ m) of the photosensitive conductive film obtained in Example 1 was peeled off from the surface of the polycarbonate substrate. Were laminated under the conditions of 120 ° C. and 0.4 MPa. After lamination, when the substrate is cooled and the temperature of the substrate reaches 23 ° C., an exposure machine (trade name: EXM-, manufactured by Oak Manufacturing Co., Ltd.) having an ultrahigh pressure mercury lamp from the cover film (PET film having a thickness of 50 ⁇ m) side.
  • EXM- manufactured by Oak Manufacturing Co., Ltd.
  • the photosensitive layer (conductive layer and photosensitive resin layer) was irradiated with light at an exposure amount of 1000 mJ / cm 2 . After exposure, the film was allowed to stand at room temperature (25 ° C.) for 15 minutes, and then the PET film as the cover film was peeled off to form a conductive film containing silver fibers on the polycarbonate substrate to obtain a conductive film substrate. .
  • the obtained conductive film substrate was evaluated for surface resistivity and minimum light transmittance in a wavelength range of 450 to 650 nm.
  • the surface resistivity of the conductive film measured using the following measuring apparatus was 100 ⁇ / ⁇ , and the minimum light transmittance (including the substrate) in the wavelength region of 450 to 650 nm was 90%.
  • Measurement of surface resistivity was performed using a non-contact type surface resistance meter (EC-80P, manufactured by Napson Corporation).
  • a polycarbonate substrate having a thickness of 1 mm is heated to 80 ° C., and the photosensitive conductive film obtained in Example 1 is placed on the surface of the polycarbonate substrate with the conductive layer and the polycarbonate substrate facing each other while peeling the support film.
  • Lamination was performed at a temperature of 0.4 MPa. After lamination, when the substrate is cooled and the temperature of the substrate reaches 23 ° C., a photomask having a wiring pattern with a line width / space width of 200/200 ⁇ m and a length of 100 mm is formed on the surface of the PET film as the cover film. Adhered.
  • the photosensitive layer (conductive layer and photosensitive resin layer) was irradiated with light at an exposure amount of 30 mJ / cm 2 using an exposure machine (trade name: EXM-1201, manufactured by Oak Manufacturing Co., Ltd.) having an ultra-high pressure mercury lamp. .
  • the film was allowed to stand at room temperature (25 ° C.) for 15 minutes, and then the PET film as a cover film was peeled off, followed by development by spraying a 1% by mass aqueous sodium carbonate solution at 30 ° C. for 30 seconds. After development, a conductive pattern containing silver fibers having a line width / space width of about 200/200 ⁇ m was formed on a polycarbonate substrate. It was confirmed that each conductive pattern was well formed.
  • connection terminals provided on the substrate surface and the conductive pattern can be easily connected.

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JP2016133937A (ja) * 2015-01-16 2016-07-25 アルプス電気株式会社 静電容量式センサの製造方法、静電容量式センサ、感光型導電性シート、タッチパネル及び電子機器
JP2017059171A (ja) * 2015-09-18 2017-03-23 日立化成株式会社 静電容量方式タッチパネル
JP2017207906A (ja) * 2016-05-18 2017-11-24 日立化成株式会社 静電容量方式タッチパネル及びその製造方法
WO2020194948A1 (fr) * 2019-03-28 2020-10-01 富士フイルム株式会社 Matériau de transfert conducteur, procédé de production d'un motif conducteur, corps multicouche, panneau tactile et dispositif d'affichage à cristaux liquides
WO2022071422A1 (fr) * 2020-09-30 2022-04-07 大日本印刷株式会社 Capteur, marchandises, procédé de fabrication d'un capteur et conducteur

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CN107093494B (zh) * 2017-03-22 2021-07-13 中山大学 一种可转移图案化的导电薄膜及其制备与图案化的方法
WO2019022090A1 (fr) * 2017-07-28 2019-01-31 富士フイルム株式会社 Procédé de formation de motifs, corps stratifié et procédé de fabrication de panneau tactile
CN111279804B (zh) * 2017-12-20 2023-10-24 住友电气工业株式会社 制造印刷电路板和层压结构的方法
CN113921622B (zh) * 2021-09-30 2024-04-05 中国科学院苏州纳米技术与纳米仿生研究所 电池片基板、光伏电池、光伏电池组件及其组装方法

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CN104170029B (zh) 2018-02-16
KR20170072956A (ko) 2017-06-27
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TWI630536B (zh) 2018-07-21
JP2017224309A (ja) 2017-12-21

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