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WO2013018195A1 - Dispositif d'éclairage et procédé associé d'ajustement de l'émission lumineuse - Google Patents

Dispositif d'éclairage et procédé associé d'ajustement de l'émission lumineuse Download PDF

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Publication number
WO2013018195A1
WO2013018195A1 PCT/JP2011/067674 JP2011067674W WO2013018195A1 WO 2013018195 A1 WO2013018195 A1 WO 2013018195A1 JP 2011067674 W JP2011067674 W JP 2011067674W WO 2013018195 A1 WO2013018195 A1 WO 2013018195A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
light emission
heat
temperature
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/067674
Other languages
English (en)
Japanese (ja)
Inventor
佑生 寺尾
直井　太郎
賢一 奥山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku Pioneer Corp
Pioneer Corp
Original Assignee
Tohoku Pioneer Corp
Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Pioneer Corp, Pioneer Corp filed Critical Tohoku Pioneer Corp
Priority to PCT/JP2011/067674 priority Critical patent/WO2013018195A1/fr
Priority to JP2012510832A priority patent/JP5002741B1/ja
Publication of WO2013018195A1 publication Critical patent/WO2013018195A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F21V29/81—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires with pins or wires having different shapes, lengths or spacing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]

Definitions

  • the present invention relates to an illuminating device including a light emitting element and capable of adjusting light emission luminance or light emission color, and a method for adjusting the light emission thereof.
  • An illuminating device using an organic EL (Electro Luminescence) element as a light source has been proposed.
  • An organic EL element illumination device (organic EL illumination device) has a feature that there is no restriction in shape due to surface emission, and such a feature cannot be obtained by other illumination devices such as an LED (light emitting diode) illumination device. Therefore, further development for future practical use is expected.
  • an organic EL element In an organic EL lighting device, an organic EL element is often left to emit light for a long period of time for illumination, so that the element itself generates a high temperature due to heat generation.
  • the high temperature state of the organic EL element is continued for a long time, the deterioration of the organic EL element is accelerated and the luminance is lowered, and as a result, the lifetime as the element is shortened.
  • the operation of the light emitting element is corrected so that the measured temperature becomes a desired temperature by measuring the temperature of the light emitting element.
  • the method of performing is proposed (for example, refer to Patent Document 1). Therefore, the service life of the organic EL element can be extended by applying this method to the organic EL lighting device.
  • the problem to be solved by the present invention is, for example, the above-described drawbacks, and when a plurality of lighting devices are installed side by side, the light emission luminance or the light emission color of each of the lighting devices can be substantially matched, and It is an object of the present invention to provide an illuminating device and a light emission adjusting method that do not cause a difference in lifetime.
  • the illumination device of the invention according to claim 1 is a heat radiating part that radiates heat generated by the light emitting element, a light emission adjusting unit that adjusts light emission luminance or light emission color of the light emitting part according to an input operation, the light emitting part, and the light emitting part. And a heat dissipation adjusting means for adjusting a thermal coupling state with the heat dissipation portion.
  • the light emission adjustment method of the illuminating device of the invention which concerns on Claim 8 is a light emission adjustment method of the illuminating device provided with the light emission part which has a light emitting element, and the thermal radiation part which thermally radiates the heat_generation
  • the light emission brightness or color of the light emitting element is adjusted by the light emission adjusting means, and light is emitted by the heat dissipation adjusting means so that the temperature of the light emitting unit becomes a predetermined heat generation temperature after the adjustment.
  • the thermal coupling state between the part and the heat radiating part can be adjusted. Therefore, even if there are variations in the characteristics of the light emitting elements of the lighting devices mounted side by side on the ceiling of the room, it is possible to make the light emission luminance or light emission color of each lighting device almost the same and the temperature of the light emitting part almost the same.
  • the progress of deterioration of the light emitting elements of each lighting device can be made substantially the same. As a result, it is possible to prevent the light emission luminances and light emission colors of the lighting devices mounted side by side from being different from each other over time, and there is almost no difference in the lifetime of the light emitting elements of the lighting devices.
  • the light emission adjusting method of the lighting device of the invention according to claim 8, the light emission luminance or the light emission color of the light emitting element is adjusted, and after the adjustment, the light emitting portion is set so that the temperature of the light emitting portion becomes a predetermined heat generation temperature. And adjusting the thermal coupling state between the heat dissipating part. Therefore, even if there are variations in the characteristics of the light emitting elements of the lighting devices mounted side by side on the ceiling of the room, the light emission luminance or light emission color of each lighting device is almost the same, and the temperature of the light emitting unit is almost the same. The progress of deterioration of each light emitting element can be made substantially the same. As a result, it is possible to prevent the light emission luminances and light emission colors of the lighting devices mounted side by side from being different from each other over time, and there is almost no difference in the lifetime of the light emitting elements of the lighting devices.
  • FIG. 8 is a cross-sectional view illustrating a state in which more contact portions of the lighting device of FIG. 7 are separated from the sealing container to further reduce heat dissipation efficiency. It is sectional drawing which shows the structure of the illuminating device relevant to this invention.
  • FIG. 1 shows a configuration of a lighting device according to an embodiment of the present invention.
  • an organic EL element 12 is formed as a light emitting element on a transparent substrate 11. Since the organic EL element 12 is a known element, although not specifically illustrated, two electrodes (anode and cathode) are configured to sandwich the light emitting functional layer.
  • the anode is made of a light transmissive material such as ITO or IZO, and is formed on the transparent substrate 11.
  • the light emitting functional layer is made of an organic material, and has a structure in which, for example, a hole injection / transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are stacked in this order from the anode side.
  • the light emitting functional layer can be laminated by using, for example, a vacuum deposition method or an ink jet method.
  • the cathode is made of a metal material such as Al or Ag.
  • the surface of the transparent substrate 11 opposite to the surface on which the organic EL element 12 is formed is a light emission surface 11a. That is, when the organic EL element 12 is driven, light generated in the light emitting functional layer is emitted through the anode and the transparent substrate 11.
  • the transparent substrate 11 including the organic EL element 12 is covered with a sealing layer 13 made of a thermosetting resin, for example. Further, a sealing container 14 is bonded so as to cover the periphery of the sealing layer 13 on the transparent substrate 11.
  • the sealing container 14 is made of, for example, metal and is a rectangular parallelepiped box-shaped cover having an opening on one surface thereof.
  • the sealing container 14 may be not only metal but also resin or glass, and the shape may be not only a box shape but also a sheet shape or a plate shape. Moreover, you may form so that the organic EL element 12 whole may be coat
  • the portions of the organic EL element 12 and the sealing layer 13 are disposed in the sealing container 14 from the opening side of the sealing container 14, and the end portion around the opening of the sealing container 14 is bonded onto the transparent substrate 11. As a result, the moisture resistance of the organic EL element 12 is improved.
  • the transparent substrate 11, the organic EL element 12, the sealing layer 13, and the sealing container 14 constitute a light emitting unit of the lighting device.
  • a heat sink 15 is disposed on the outer main surface of the sealing container 14 as a heat radiating portion.
  • the heat sink 15 constitutes a heat radiating mechanism together with the screws 16 and is provided to radiate the heat generated by the organic EL element 12 to the outside.
  • the heat sink 15 is made of a highly heat conductive metal such as aluminum or copper, and has a plurality of heat radiation fins 15b with respect to the flat plate portion 15a. Although the radiation fins 15b may be arranged at equal intervals, the arrangement position and the shape may be different according to the temperature unevenness inside the lighting device.
  • the flat plate portion 15 a of the heat sink 15 has substantially the same size as the plane of the transparent substrate 11, and the transparent substrate 11 and the flat plate portion 15 a of the heat sink 15 include the sealing container 14 including the organic EL element 12 and the sealing layer 13. It has a sandwiched structure. Therefore, the heat generated by the organic EL element 12 is transferred to the heat sink 15 via the sealing layer 13 and the sealing container 14 and is radiated.
  • a plurality of through holes are formed at the end of the transparent substrate 11, and screw holes (not shown) are formed at the positions of the ends of the flat plate portion 15a of the heat sink 15 corresponding to the positions of the through holes. ) Is formed. Screws 16 are inserted into the through holes of the transparent substrate 11 as heat radiation adjusting means from the light emitting surface 11a side and are rotatably attached. The head of the screw 16 is positioned on the light emission surface 11 a of the transparent substrate 11, and the screw 16 is supported so as not to move in a direction perpendicular to the transparent substrate 11. The screw 16 accumulates with the screw hole of the heat sink 15 so that the transparent substrate 11 and the heat sink 15 are positioned in parallel.
  • the heat sink 15 When the tip of a Phillips screwdriver is inserted into a Phillips groove (not shown) formed in the head of the screw 16 and the screw 16 is rotated together with the Phillips screwdriver, the heat sink 15 is moved and thereby sealed.
  • the distance from the stop container 14 to the heat sink 15, that is, the thermal coupling state can be adjusted.
  • the thermal coupling state is the degree of heat conduction from the sealed container 14 to the heat sink 15, and the heat dissipation efficiency by the heat sink 15 changes according to the thermal coupling state.
  • the distance between the sealed container 14 and the heat sink 15 can be adjusted by tightening or loosening the screws 16 in this way, and thereby the heat radiation efficiency can be set.
  • the heat dissipation efficiency for each lighting device the light emission luminance of each lighting device and the temperature of the light emitting unit can be made the same, as will be described later.
  • the temperature of the light emitting portion is the temperature of the organic EL element 12, the temperature of the light emitting surface 11a of the transparent substrate 11, or the temperature of the sealing container 14.
  • a temperature sensor is built in the sealed container 14.
  • the illumination device is provided with a control circuit 17 and an operation unit 18 as light emission adjusting means in addition to the above configuration.
  • the control circuit 17 applies a driving voltage to the anode and the cathode of the organic EL element 12 when the power is turned on to the lighting device, and generates a driving current or a driving voltage flowing between the anode and the cathode of the organic EL element 12.
  • the light emission luminance of the organic EL element 12 can be controlled to a luminance corresponding to the input operation by adjusting according to the input operation of a user such as an installer in the operation unit 18.
  • the thermal coupling state between the sealing container 14 and the heat sink 15 is adjusted at the time of factory shipment or at the installation location.
  • the adjustment process when adjusting the thermal coupling state at the time of factory shipment and when adjusting at the installation location will be described using a flowchart.
  • step S11 power supply to the lighting device is started (step S11), and the light emission luminance is adjusted according to the input operation of the operation unit 18 (step S12).
  • step S ⁇ b> 11 a drive voltage is applied from the control circuit 17 between the anode and the cathode of the organic EL element 12.
  • step S12 of the light emission adjustment step the light emission luminance of the organic EL element 12 is adjusted to the luminance corresponding to the input operation by adjusting the drive current or applied voltage flowing through the organic EL element 12.
  • the light emission luminance can be adjusted to a predetermined light emission luminance by using a luminance meter.
  • step S13 After execution of step S12, it is determined whether or not a predetermined equilibration time has elapsed (step S13).
  • the predetermined equilibration time is a time required for the temperature of the organic EL element 12 to be stabilized.
  • the temperature of the light emitting unit is detected by, for example, a temperature sensor (not shown) (step S14), and it is determined whether or not the detected temperature is equal to a predetermined heat generation temperature (step S14).
  • Step S14 is a temperature detection step.
  • the predetermined heat generation temperature is, for example, a temperature determined according to the drive current-temperature characteristics of the light emitting unit. If the detected temperature is not equal to the predetermined heat generation temperature, the thermal coupling state is adjusted (step S16). Step S16 is a thermal coupling adjustment step.
  • the screw 16 when the detected temperature is higher than a predetermined heat generation temperature, the screw 16 is tightened according to the user's driver operation so that the thermal coupling state becomes dense, and the space between the sealing container 14 and the heat sink 15 is increased. The distance is reduced, thereby increasing the heat dissipation efficiency.
  • the screw 16 when the detected temperature is lower than the predetermined heat generation temperature, the screw 16 is loosened so that the thermal coupling state becomes sparse, and the distance between the sealing container 14 and the heat sink 15 is widened. Heat dissipation efficiency is lowered.
  • Step S17 After adjusting the thermal coupling state, it is determined whether or not a predetermined equilibration time has elapsed (step S17). Step S14 is re-executed after the predetermined equilibration time has elapsed. That is, the temperature of the light emitting unit is detected, and execution of steps S14 to S17 is repeated until the detected temperature becomes equal to a predetermined heat generation temperature. When the detected temperature becomes equal to a predetermined heat generation temperature, the thermal coupling state adjustment process ends.
  • step S ⁇ b> 21 power supply to each of the plurality of installed lighting devices is started (step S ⁇ b> 21), and the light emission luminance of each of the plurality of lighting devices is adjusted according to the input operation. (Step S22).
  • step S21 a power supply voltage is applied between the anode and cathode of the organic EL element 12 of each of the plurality of lighting devices.
  • step S24 the temperature of the light emitting unit of each of the plurality of lighting devices is detected by, for example, a temperature sensor (not shown) (step S24).
  • the lighting device having the highest temperature among the plurality of lighting devices is selected as the lighting device A, and the thermal coupling state between the sealing container 14 and the heat sink 15 is set by the user so that the heat radiation efficiency of the lighting device A is maximized. It is adjusted according to the driver operation (step S25).
  • step S25 which is a thermal coupling adjustment step, for example, as shown in FIG. 1, the sealing container 14 and the heat sink 15 are brought into close contact with the lighting device A so that the heat radiation efficiency by the heat radiation mechanism is maximized.
  • Step S26 After adjusting the thermal coupling state of the lighting device A, it is determined whether or not a predetermined equilibration time has elapsed (step S26). After the elapse of a predetermined equilibration time, the temperature of the light emitting unit of the illumination device A is detected (step S27). Step S27 is a temperature detection step. By increasing the heat dissipation efficiency of the lighting device A, the temperature of the light emitting unit of the lighting device A detected in step S27 is lower than the temperature detected in step S24.
  • step S28 which is a thermal coupling adjustment step, if the temperature detected in step S24 for lighting devices other than lighting device A is higher than the temperature of lighting device A detected in step S27, the lighting device is heated.
  • the screw 16 is tightened in accordance with the driver operation so that the mechanical coupling state becomes dense, and the distance between the sealing container 14 and the heat sink 15 is narrowed, thereby improving the heat radiation efficiency.
  • step S24 when the temperature detected in step S24 is lower than the temperature of the lighting device A detected in step S27 for the lighting devices other than the lighting device A, the screw is set so that the thermal coupling state is sparse for the lighting device. 16 is loosened, and the distance between the sealing container 14 and the heat sink 15 is widened, thereby reducing the heat dissipation efficiency.
  • step S32 steps S29 to S31 are executed again.
  • the thermal coupling state adjustment process ends.
  • the light emission luminance of each lighting device and the temperature of the light emitting unit can be matched with each other. Therefore, it is possible to prevent variations in light emission luminance among the lighting devices that occur with the deterioration of the organic EL element due to the temperature difference of the light emitting unit. In other words, the deterioration of the organic EL elements of each lighting device progresses in substantially the same manner by matching the temperatures of the light emitting portions of the lighting devices, so that the lifetimes of the lighting devices can be made to substantially match.
  • the heat sink 21 constitutes a heat dissipation mechanism together with a screw 23 and a contact portion 23a as light emission adjusting means.
  • the heat sink 21 includes a flat plate portion 21a and a plurality of fins 21b, and has the same shape as the heat sink 15 of the lighting device shown in FIG.
  • the heat sink 21 is fixed to the transparent substrate 11 by columnar columns 22.
  • the support column 22 is disposed between the end portion of the transparent substrate 11 and the end portion of the flat plate portion 21a of the heat sink 21, and the transparent substrate 11 and the flat plate portion 21a of the heat sink 21 are parallel to each other.
  • a space is provided between the flat plate portion 21 a and the sealing container 14.
  • screws 23 are rotatably accumulated in the screw holes.
  • the screw 23 has, for example, a head portion in which a plus groove is formed on the fin 21b side, and a contact portion 23a having a nut shape at the end of a spiral screw extending from the head portion.
  • the contact portion 23 a is fixed to the end portion of the screw 23.
  • the screw 23 and the contact portion 23a are made of a highly heat conductive metal such as copper or iron. In a state where the screw 23 is fastened to the flat plate portion 21a according to a driver operation using a plus driver (not shown), the contact portion 23a contacts the sealing container 14.
  • the portion where the contact portion 23 a contacts the sealing container 14 performs heat transfer between the sealing container 14 and the heat sink 21. That is, the heat of the organic EL element 12 is transferred to the heat sink 21 through the sealing layer 13, the sealing container 14, the contact portion 23 a, and the screw 23 to be dissipated.
  • the screw 23 is loosened from the flat plate portion 21a in accordance with the driver operation, the contact portion 23a is separated from the sealing container 14.
  • a portion where the contact portion 23 a is separated from the sealing container 14 hardly performs heat transfer between the sealing container 14 and the heat sink 21.
  • the thermal coupling state between the sealing container 14 and the heat sink 21 can be adjusted according to whether or not each screw 23 is rotated and the contact part 23a comes into contact with the sealing container 14, and the contact part 23a The more the portion that is in contact with the sealing container 14, that is, the larger the contact area, the higher the heat radiation efficiency.
  • the thermal coupling state between the sealing container 14 and the heat sink 21, that is, the heat radiation efficiency can be set.
  • the heat dissipation efficiency for each lighting device the light emission luminance of each lighting device and the temperature of the light emitting section can be made substantially the same.
  • the lighting device of FIG. 7 can also adjust the thermal coupling state between the sealing container 14 and the heat sink 23, or the installation location thereof is shown in FIG. Thus, the thermal coupling state of the sealing container 14 and the heat sink 23 can be adjusted.
  • the detected temperature of the light emitting unit is higher than a predetermined heat generation temperature. If it is high, several screws 23 are tightened so that the thermal coupling state becomes dense, and the number of contact portions 23a that come into contact with the sealed container 14 is increased, thereby improving the heat radiation efficiency. On the other hand, when the detected temperature of the light emitting part is lower than a predetermined heat generation temperature, some screws 23 are loosened so that the thermal coupling state becomes sparse, and the number of contact parts 23a separated from the sealing container 14 This increases the heat dissipation efficiency.
  • step S25 in FIG. 6 the thermal coupling state of the lighting device A is, for example, As shown in FIG. 7, all the screws 23 are tightened to bring all the contact portions 23a into contact with the sealing container 14, thereby increasing the heat radiation efficiency.
  • steps S28 and S32 of FIG. 6 when the temperature detected in step S24 is higher than the temperature of lighting device A detected in step S27 for the lighting devices other than lighting device A, the lighting device is thermally treated. Several screws 23 are tightened so that the coupled state is dense, and the number of contact portions 23a that come into contact with the sealing container 14 is increased, thereby improving the heat dissipation efficiency.
  • step S24 when the temperature detected in step S24 is lower than the temperature of the lighting device A detected in step S27 for the lighting devices other than the lighting device A, the number of the lighting devices is set so that the thermal coupling state becomes sparse.
  • the screw 236 is loosened, and the number of the contact portions 23a away from the sealing container 14 is increased, thereby reducing the heat dissipation efficiency.
  • the light emission luminance of the organic EL element is adjusted according to the input operation.
  • the present invention is an illuminating device including a color light emitting unit having red, blue and green organic EL elements.
  • the light emission color of the light emitting unit may be adjusted by controlling the drive current or drive voltage of each organic EL element according to the input operation.
  • the heat sink is shown as the heat radiating section, but other heat radiating means such as a heat pipe may be used.
  • an organic EL element is used as the light emitting element of the light emitting unit, but the present invention is not limited to this, and other light emitting elements such as LEDs (light emitting diodes) can be used.
  • the method of controlling the distance and contact area between the heat sink and the light emitting part in addition to the method of turning the screw with a screwdriver, the method of adjusting the distance by combining a stepping motor and gears, the solenoid actuator using an electromagnet, etc. good. Further, a piezoelectric actuator may be combined with these for fine adjustment of the distance. Since these adjustment methods can be electrically controlled, it is possible to control not only during shipment and installation, but also during use of the lighting device. Thereby, even when there is an environmental change that affects the heat radiation around the lighting device, it is possible to prevent the occurrence of temperature unevenness for each lighting device.
  • FIG. 10 further shows a configuration of a lighting device related to the present invention.
  • the transparent substrate 11, the organic EL element 12, the sealing layer 13, the sealing container 14, the heat sink 15, and the screw 16 are the same as those of the lighting device shown in FIG. The same symbols are used for.
  • the lighting device of FIG. 10 further includes a plurality of bimetals 31.
  • Each bimetal 31 has a longitudinal plate shape, and one end portion thereof is fixed to the outside of the sealing container 14.
  • Each bimetal 31 is curved toward the heat sink 15 as the temperature rises.
  • the screw 16 adjusts the distance between the sealing container 14 and the heat sink 15, and the temperature at which the bimetal 31 contacts the heat sink 15 can be set to a predetermined temperature T.
  • the heat of the organic EL element 12 heats the bimetal 31 through the sealing layer 13 and the sealing container 14.
  • the bimetal 31 comes into contact with the heat sink 15, whereby the heat of the organic EL element 12 is transferred to the heat sink 15 through the sealing layer 13, the sealing container 14, and the bimetal 31.
  • Heat is dissipated. Therefore, by adjusting the distance between the sealing container 14 and the heat sink 15 individually by the screw 16 for each lighting device, the bimetal 31 when the temperature of the bimetal 31 reaches a predetermined temperature T for all the lighting devices. Can be brought into contact with the heat sink 15 and the thermal coupling between the sealed container 14 and the heat sink 15 can be made dense.
  • the number of the bimetals 31 is not specifically limited, It may be more or less than three. Further, even if a shape memory alloy is used instead of the bimetal, the same operation as in the case of the bimetal can be performed.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un dispositif d'éclairage comprenant : une partie émettrice de lumière comportant un élément émetteur de lumière, une partie dissipant la chaleur qui dissipe la chaleur engendrée par l'élément émetteur de lumière ; un moyen d'ajustement de l'émission lumineuse qui ajuste la luminosité de l'émission lumineuse ou la couleur de l'émission lumineuse de la partie émettrice de lumière conformément à une opération d'entrée ; et un moyen d'ajustement de la dissipation thermique qui ajuste l'état de lien thermique entre la partie émettrice de lumière et la partie dissipant la chaleur.
PCT/JP2011/067674 2011-08-02 2011-08-02 Dispositif d'éclairage et procédé associé d'ajustement de l'émission lumineuse Ceased WO2013018195A1 (fr)

Priority Applications (2)

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PCT/JP2011/067674 WO2013018195A1 (fr) 2011-08-02 2011-08-02 Dispositif d'éclairage et procédé associé d'ajustement de l'émission lumineuse
JP2012510832A JP5002741B1 (ja) 2011-08-02 2011-08-02 照明装置

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Application Number Priority Date Filing Date Title
PCT/JP2011/067674 WO2013018195A1 (fr) 2011-08-02 2011-08-02 Dispositif d'éclairage et procédé associé d'ajustement de l'émission lumineuse

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WO2013018195A1 true WO2013018195A1 (fr) 2013-02-07

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2886936A1 (fr) * 2013-12-23 2015-06-24 odelo GmbH Agent lumineux et lampe de véhicule automobile équipée de celui-ci
US20170226277A1 (en) * 2014-07-01 2017-08-10 Blue Cube Ip Llc Hardener composition

Citations (4)

* Cited by examiner, † Cited by third party
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